High-current contact devices for transmitting electrical energy

Abstract

To provide a high-current contact device with improved measurement of the temperature of an electrical contact element.SOLUTION: A high-current contact device 1 for transmitting electrical energy, particularly for a vehicle, includes a contact housing 2, at least one contact element 3 fixed to the contact housing 2, at least one temperature sensor 10, and a support plate 6, the support plate 6 has an upper surface 7 and a lower surface 8, the upper surface 7 transitions over a side wall 9 to the lower surface 8, the side wall 9 of the support plate 6 faces the contact element 3, the temperature sensor 10 is arranged on the side wall 9 of the support plate 6, the temperature sensor 10 is designed to detect a temperature of the contact element 3.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates in particular to a high-current contact device for transmitting electrical energy for vehicles, and a method for manufacturing a high-current contact device.

Background Art

[0002] German Patent Application Publication No. 10 2020 116 533 A1 discloses a high-current contact device, which has an electrical contact element and a temperature sensor. The temperature sensor is arranged on the upper surface of the support plate at a distance from the electrical contact element. The support plate is arranged perpendicular to the longitudinal axis of the contact element.

Summary of the Invention

Problems to be Solved by the Invention

[0003] The object of the present invention is to provide a high-current contact device with improved measurement of the temperature of the electrical contact element. In addition, the object of the present invention is to provide an improved method for manufacturing a high-current contact device.

Means for Solving the Problems

[0004] The object of the present invention is achieved by the independent patent claims.

[0005] Advantageous developments are described in the dependent claims.

[0006] A high-current contact device for transmitting electrical energy, particularly for vehicles, is proposed. The high-current contact device comprises a contact housing and at least one contact element fixed to the contact housing. A temperature sensor fixed to a support plate is also provided. The support plate has an upper and a lower surface, the upper surface of the support plate transitioning over the side wall to the lower surface of the support plate. The side wall of the support plate faces the contact element. The temperature sensor is fixed to the side wall of the support plate. The temperature sensor is designed to detect the temperature of the contact element. The placement of the temperature sensor on the side wall of the support plate, with its front surface facing the contact element, means that the temperature sensor is positioned closer to the contact element. In addition, this placement means that a larger surface area of ​​the temperature sensor is positioned closer to the electrical contact element. This improves temperature transfer from the contact element to the temperature sensor. In addition, the support plate does not obstruct temperature radiation. Furthermore, this arrangement of the contact element means that the support plate with the contact element can have a low grounding height and can therefore be positioned near the contact element in a space-saving manner in high-current contact devices. This improves temperature transfer between the contact element and the temperature sensor. It is preferable that the longitudinal axis of the contact element is positioned parallel to the outer surface of at least a portion of the contact element.

[0007] In one embodiment, the side walls of the support plate are oriented at an angle between 0 and 45 degrees with respect to the longitudinal axis of the contact element. Preferably, the side walls are positioned parallel to the longitudinal axis of the contact element. Preferably, the upper and lower surfaces of the support plate are positioned parallel to each other, and the side walls are oriented perpendicular to the upper and lower surfaces of the support plate. Depending on the selected embodiment, the side walls may be oriented at different angles with respect to the upper and / or lower surfaces. Depending on the selected embodiment, the support plate may be positioned at different angles with respect to the longitudinal axis of the contact element. In this embodiment, the side walls may be positioned perpendicular to the upper and lower surfaces of the support plate, but not parallel to the longitudinal axis of the contact element. However, due to the placement of the temperature sensor on the front surface of the side wall of the support plate, these arrangements also have improved heat transfer between the contact element and the temperature sensor compared to the placement of the temperature sensor on the upper or lower surface of the support plate.

[0008] In a further embodiment, the support plate has a first electrical contact in its side wall. The first electrical contact may be designed in the form of a conductive coating. Depending on the selected embodiment, the first electrical contact may be located in a recess in the side wall. For example, the recess may be formed in a circular segment shape perpendicular to the plane of the side wall in cross-section. In addition, the coating constituting the first electrical contact may be formed as a sleeve-segment shaped coating. The temperature sensor has further electrical contacts, and these second electrical contacts are conductively connected to the first electrical contact of the support plate. For example, a conductive connecting material, particularly solder, is used for the conductive connection between the first and second electrical contacts.

[0009] In a further embodiment, the support plate has at least one recess in its side wall, and a first electrical contact is positioned in the recess. The first electrical contact may have a conductive coating applied to its side wall. The conductive coating is connected to the wires of the support plate. Solder material may be provided to form a conductive connection between the conductive coating of the support plate and a second electrical contact of the temperature sensor.

[0010] The first and second recesses may be arranged parallel to each other and preferably have the same or identical shape.

[0011] In a further embodiment, the support plate has at least two recesses in its side wall that are spaced apart from each other. These recesses are arranged at a predetermined distance apart in the lateral direction. A first electrical contact of the support plate is formed in the first recess. A further first electrical contact of the support plate is formed in the second recess. Depending on the selected embodiment, the two recesses may be formed in the base region of further recesses located in the side wall of the support plate.

[0012] In a further embodiment, the recess is guided from the upper and / or lower surface of the support plate along the thickness of the support plate for at least a predetermined distance. Preferably, the recess is formed from the upper surface to the lower surface of the support plate. The wires of the support plate may be positioned on the upper surface of the support plate and extend to or into the recess, in particular to form a conductive connection with the conductive coating of the first electrical contact of the support plate.

[0013] In a further embodiment, solder material is arranged on the side wall of the support plate, and the solder material forms a conductive connection between the first electrical contact of the support plate and the second electrical contact of the temperature sensor. Depending on the selected embodiment, the solder material may be arranged in a recess in particular.

[0014] In a further embodiment, the side wall of the support plate has a further recess, the temperature sensor is at least partially located in the further recess, and the first electrical contact of the support plate is located in the further recess. Depending on the selected embodiment, the temperature sensor may be located entirely in the further recess. In addition, two recesses may be located in the further recess for the formation of the first electrical contact of the support plate. In particular, the two recesses for the first electrical contact are located in the base region of the further recess. The base region is set back from the side wall and is preferably located parallel to the side wall.

[0015] In a further embodiment, the support plate has a portion having a predetermined width that protrudes from the side wall. The thickness of this portion corresponds to the thickness of the carrier plate, and this portion is part of the carrier plate.

[0016] The temperature sensor is positioned on the side wall of the protrusion. Due to the protrusion, the temperature sensor makes weaker thermal contact with the material further away from the support plate. This improves the temperature sensitivity of the temperature sensor for detecting the temperature of the contact element.

[0017] In a further embodiment, a heat conduction element is placed between an electrical contact element and a temperature sensor. The heat conduction element is designed to conduct heat from the contact element towards the temperature sensor. The heat conduction element may be specifically designed for electrical insulation. In addition, the heat conduction element is made from a heat conduction material. In a further embodiment, the heat conduction element is thermally coupled to the contact element, for example, in direct contact with the contact element. In addition, in one embodiment, the heat conduction element is thermally coupled to the temperature sensor, for example, in direct contact with the temperature sensor. By providing a heat conduction element, heat conduction between the contact element and the temperature sensor is improved.

[0018] In one embodiment, the heat conduction element has a recess, and the temperature sensor is positioned at least partially in the recess. Depending on the selected embodiment, the temperature sensor may be positioned entirely in the recess of the heat conduction element. In particular, the temperature sensor may be in direct contact with the heat conduction element by at least one side, and especially by multiple sides. This positioning of the temperature sensor in the heat conduction element improves the thermal coupling between the contact element and the temperature sensor. Depending on the selected embodiment, a portion of the carrier plate may be positioned in the recess of the heat conduction element. This further improves the thermal coupling between the contact element and the temperature sensor.

[0019] In a further embodiment, the electrical contact is positioned in a recess of the side wall, and the recess is formed in a curved shape perpendicular to the plane of the side wall in cross-section.

[0020] In a further embodiment, one embodiment of the circuit for a temperature sensor is provided on a support plate, and the completed circuit is connected to the temperature sensor via wires.

[0021] The support plate may be designed, for example, as a printed circuit board.

[0022] An improved method for manufacturing a contact device is proposed. A temperature sensor is first fixed to the side wall of a support plate, and two solder depots are placed on the upper surface of the support plate adjacent to the temperature sensor. The solder depots are spaced laterally apart from each other. The solder depots are melted by heat treatment, and as a result, the liquid solder of the solder depots on the upper surface of the support plate flows to the side wall of the support plate as two separate solder flows. Thus, the liquid solder is introduced between the first electrical contact of the support plate and the second electrical contact of the temperature sensor. After cooling, the hardened solder forms a conductive connection between the first electrical contact of the support plate and the second electrical contact of the temperature sensor.

[0023] The temperature sensor may be fixed to the support surface of the side wall, for example, using an adhesive. The support surface is preferably located between two first contacts of the support plate.

[0024] In a further embodiment, at least one recess is introduced into the side wall of the support plate before the temperature sensor is fixed to the side wall of the support plate. Preferably, two recesses are introduced into the side wall, and each of the recesses is provided for forming a first electrical contact of the support plate. The recess may be formed, for example, in an arcuate shape in a cross-section perpendicular to the side wall.

[0025] The recess may extend a predetermined distance, particularly to the lower surface, starting from the upper surface of the support plate towards the lower surface.

[0026] In addition, preferably, further recesses may be formed in the side wall of the support plate. The recesses for the first electrical contact may be introduced into the base region of the further recesses. The base region is recessed from the plane of the side wall. The further recesses are at least partially, particularly completely, used for receiving the temperature sensor.

[0027] Hereinafter, the present invention will be described in more detail with reference to the drawings. The drawings are as follows.

Brief Description of the Drawings

[0028] [Figure 1] It is a schematic diagram of a high-current contact device having a contact housing, an electrical contact element, and a support plate having a temperature sensor. [Figure 2] It is a schematic cross-sectional view of the support plate and the temperature sensor disposed on the front side wall of the support plate. [Figure 3] It is a perspective view of the support plate and the temperature sensor according to FIG. 1. [Figure 4] It is a view showing another embodiment of the support plate in which two depressions are provided in the side wall of the support plate for forming the first electrical contact. [Figure 5]This is a schematic diagram of a temperature sensor that is electrically connected to the support plate shown in Figure 4 by a first electrical contact. [Figure 6] This is a schematic diagram of a further embodiment of a support plate having two recesses for forming a further recess and a first electrical contact. [Figure 7] This is a schematic perspective view of a further embodiment of the support plate with the arrangement of a temperature sensor in a further recess. [Figure 8] This figure shows a further embodiment of a support plate having a further recess, in which a temperature sensor is positioned in a further recess. [Figure 9] This figure shows a further embodiment of a support plate having a further recess, in which a temperature sensor is positioned in a further recess. [Figure 10] This figure shows a further embodiment of a support plate, in which the support plate has a protrusion and a temperature sensor is positioned on the side wall of the protrusion. [Figure 11] This is a schematic diagram of the arrangement shown in Figure 1, in which a heat conduction element is provided between the contact element and the temperature sensor. [Figure 12] This is a top view of the arrangement shown in Figure 11. [Figure 13] Figure 10 is a schematic diagram of a further embodiment of a heat conduction element having a support plate. [Figure 14] This is a schematic diagram of a method for manufacturing high-current contact devices. [Modes for carrying out the invention]

[0029] Figure 1 shows a schematic diagram of a high-current contact device 1 having a contact housing 2, in which a conductive contact element 3 is fixed to the contact housing 2. In the illustrated embodiment, the contact element is in the form of a contact pin, the first end of which has an electrical connection area for an electrical cable. The contact element 3 has a longitudinal axis 5, shown as a dashed line. For example, the contact element 3 has a cylindrical shape that is at least partially aligned along the longitudinal axis 5. Similarly, a support plate 6, which is mechanically connected to the contact housing 2, is provided laterally separated from the contact element 3. The support plate 6 has an upper surface 7 and a lower surface 8. The upper surface 7 of the support plate 6 transitions over the side wall 9 to the lower surface 8 of the support plate 7. The side wall 9 faces the contact element 3. The temperature sensor 10 is positioned on the side wall 9. Placing the temperature sensor 10 on the side wall 9 rather than the top surface 7 or bottom surface 8 means that the temperature sensor 10 is positioned closer to the contact element 3. In addition, heat transfer from the contact element 3 to the temperature sensor 10 is not obstructed by the support plate 6.

[0030] In the illustrated exemplary embodiment, the support plate 6 is designed in the shape of a plate. Depending on the selected embodiment, the support plate 6 may be designed in the shape of a bar or a block. In addition, in the illustrated embodiment, the upper surface 7 and the lower surface 8 are arranged parallel to each other. Depending on the selected embodiment, the upper surface 7 and the lower surface 8 may be arranged at different angles to each other. In addition, in the illustrated embodiment, the plane of the side wall 9 is arranged perpendicular to the plane of the upper surface 7 and perpendicular to the plane of the lower surface 8. Depending on the selected embodiment, the plane of the side wall 9 may be arranged at different angles to the upper and lower surfaces. The advantages of the proposed arrangement of the temperature sensor 10 on the front side wall 9 of the support plate 6 are also realized when the side wall 9 is not arranged parallel to the longitudinal axis 5 of the contact element 3. For example, the longitudinal axes 5 of the side wall 9 and the contact element 3 may be positioned at angles between 0 and 45 degrees. An angle of 0 degrees means that the side wall 9 is positioned parallel to the longitudinal axis 5.

[0031] Figure 2 shows a schematic enlarged view of the arrangement of the first electrical contact 11 on the side wall 9 of the support plate 6. The first electrical contact 11 is connected to the evaluation circuit, for example, via wires (not shown) arranged on or within the support plate 6. In addition, the temperature sensor 10 has a second electrical contact 12 facing the first electrical contact 11 and connected to the first electrical contact 11 directly or via a conductive connecting material.

[0032] Figure 3 shows the arrangement of the first electrical contact 11 on the side wall 9 in a schematic perspective view of the support plate 6. In this figure, the temperature sensor 10 is shown as transparent to make the arrangement of the first electrical contact 11 more visible. The first electrical contact 11 is led to the upper surface 7 of the support plate 6, extends beyond the central part of the side wall 9, and in particular to the lower surface 8 of the support plate 6. The first electrical contact 11 is made of a conductive material and is specifically designed as a coated surface.

[0033] Figure 4 shows a schematic perspective view of one embodiment of a support plate 6, in which the support plate 6 has a first recess 14 and a second recess 15 in the side wall 9. In the illustrated embodiment, the recesses 14 and 15 are formed from the upper surface 7 to the lower surface 8. The recesses have, for example, a cylindrical segment shape. Therefore, it is preferable that the recesses 14 and 15 have a cylindrical segment shape in a cross section perpendicular to the side wall 9. Conductive coatings 16 and 17 are provided in the recesses 14 and 15 and, in the illustrated embodiment, are led to the upper surface 7 of the support plate 6 and electrically connected to the electric wire 13. A support surface 18 represented by the side wall 9 is formed between the two recesses 14 and 15. In the illustrated exemplary embodiment, the support surface 18 is located in the same plane as the side wall 9.

[0034] Figure 5 shows a schematic diagram of the support plate 6 of Figure 4, in which the temperature sensor 10 is attached to the support surface 18 via a connecting layer 19. In addition, the temperature sensor 10 has two electrical contacts 12, each facing one of the recesses 14, 15 and connected to the conductive coatings 16, 17 of the first electrical contact 11 via a conductive material. For example, the second electrical contact 12 of the temperature sensor 10 may be connected to the first electrical contact 11 of the support plate 6 via a solder material as a conductive connecting material 20. The connecting layer 19 may be formed from, for example, an adhesive material. Depending on the selected embodiment, a different connecting material may be used to form the connecting layer 19.

[0035] Figure 6 shows a schematic perspective view of a further embodiment of the support plate 6 in which a further recess 21 is introduced in the side wall 9. In the illustrated embodiment, the further recess 21 extends from the upper surface 7 to the lower surface 8 of the support plate 6. Depending on the selected embodiment, the further recess 21 may be introduced only in the side wall 9 without reaching the upper and / or lower surfaces of the support plate.

[0036] Further recesses 21 have base regions 22 that are set back from adjacent areas of the side wall 9. The base regions 22 may be positioned perpendicular to the upper and lower surfaces 7 and 8 of the support plate. The first electrical contacts 11 are positioned in the base regions 22. Depending on a selected embodiment, the first electrical contacts 11 may be formed in recesses 14, 15, as illustrated and outlined in Figure 4. For this purpose, conductive coatings 16, 17 that connect to the wires 13 are positioned in recesses 14, 15.

[0037] The further recess 21 is preferably sized such that the temperature sensor 10 can be at least partially, and especially completely, positioned in the further recess 21. Depending on the selected embodiment, the temperature sensor 10 may protrude laterally beyond the front surface of the side wall 9 when positioned in the further recess 21. Electrical contact of the temperature sensor 10 positioned in the further recess 21 may be achieved, for example, as shown in Figure 5.

[0038] Figure 7 shows a schematic perspective view of a further embodiment of the support plate having a further recess 21. In this embodiment, the further recess 21 also extends from the upper surface 7 to the lower surface 8 of the support plate 6. The recess 8 is formed as two cylindrical segment-shaped recesses 23, 24 connected to each other via a contact surface 18. The support surface 18 is recessed inward from the side wall 9. Thus, as schematically shown in Figure 7, at least a portion of the temperature sensor 10 can be received in the further recess 21. Conductive coatings 16, 17 are provided in the first recess 23 and the second recess 24.

[0039] The support surface 18 does not have a conductive coating, and therefore the two coatings 16 and 17 are electrically insulated from each other. In the illustrated embodiment, the coatings 16 and 17 are led up to the upper surface 7, and the wires 13 connected to the coatings 16 and 17 are located on the upper surface 7. The temperature sensor 10 is in contact with the support surface 18 by its lower surface and is connected to the support surface, for example, via a connecting layer 19. In addition, a second electrical contact 12 of the temperature sensor 10, similarly formed on the lower surface of the temperature sensor 10, is connected to the coatings 16 and 17 via a conductive material, particularly a solder material.

[0040] Figure 8 shows a further embodiment of the support plate 6, which is substantially formed according to the embodiment of Figure 7. However, the further recess 21 is formed deeper so that the temperature sensor 10 can be fully positioned in the further recess 21 without protruding beyond the side wall 9 on the front surface.

[0041] Figure 9 shows another embodiment of the support plate 6, similarly formed substantially according to the embodiment of Figure 7. However, the support surface 18 along the side wall 9 is designed to be longer than in the embodiments of Figures 7 and 8. Otherwise, the arrangement and fixing of the temperature sensor 10 are formed similarly to the embodiments of Figures 7 and 8.

[0042] Figure 10 shows a further embodiment of the support plate 6, in which the support plate 6 has a projection 25. The projection 25 may be realized, for example, by two recesses 26, 27. In this embodiment as well, the temperature sensor 10 is positioned on the front surface of the side wall 9 of the support plate 6. Improved heat insulation of the temperature sensor 10 relative to the support plate 6 is achieved by the projection 25. Electrical contact between the temperature sensor 10 and the first electrical contact 11 of the support plate 6 may be realized according to the aforementioned embodiments of electrical contact. In the illustrated embodiment, two recesses 14, 15 are introduced into the side wall 9. Coatings 16, 17 connected to the wires 13 of the support plate 6 are provided in the recesses 14, 15. A non-conductive support surface 18 to which the temperature sensor 10 is mechanically connected, for example by a connecting layer 19, is formed between the coatings 16, 17. In addition, two electrical contacts 12 formed on the lower surface of the temperature sensor 10 are connected to the coatings 16, 17, for example, via a connecting material 20, particularly a soldering material.

[0043] Figure 11 shows a schematic diagram of the arrangement in Figure 1, in which a heat conduction element 28 is further provided between the contact element 3 and the temperature sensor 10. The heat conduction element 28 is preferably formed from a thermally conductive material and is electrically insulating. In a selected embodiment, the heat conduction element is thermally coupled to the contact element 3, and in particular, the heat conduction element 28 is in direct contact with the contact element 3. In addition, the heat conduction element 28 is thermally coupled to the temperature sensor, and in particular, the heat conduction element 28 is in direct contact with the temperature sensor. In a selected embodiment, the heat conduction element 28 may be in contact with the support plate 6. In a selected embodiment, the heat conduction element has a recess 29, and the temperature sensor is at least partially located in the recess 29. In a selected embodiment, the temperature sensor may be entirely located in the recess 29. In addition, at least a portion of the support plate may be located in the recess 29 of the heat conduction element 28.

[0044] Figure 12 shows a schematic cross-section through the arrangement in Figure 11. It can be seen that the temperature sensor 10 and a portion of the support plate 6 are positioned in the recess 29 of the heat conduction element 28. Similarly, all of the described embodiments of the support plate may be thermally coupled to the heat conduction element and may at least partially abut the heat conduction element, and in particular may be positioned in the recess 29 of the heat conduction element. As already described, the recess 29 may be omitted if the heat element is not only partially abutting the temperature sensor or positioned further away from the temperature sensor 10.

[0045] Figure 13 shows a schematic cross-section of a high-current contact device 1 designed substantially according to Figure 1. However, the support plate 6 is designed according to Figure 10, and the protrusion 25 is located in the recess 29 of the heat conduction element 28 together with the temperature sensor 10.

[0046] The thermal conduction element may be of an elastic design. For example, the thermal conduction element has at least one matrix material comprising at least silicone and / or polyethylene and / or polyurethane and / or temperature-stable plastic. For example, non-conductive and thermally conductive metal compounds based on the following granular fillers, namely copper, aluminum, silver, aluminum oxide, aluminum nitride, silicon oxide, silicon nitride, boron, boron nitride, conductive metals, preferably iron or non-ferrous metals, may be embedded in the matrix material. The thermal conduction element may have an elastic deformability of at least 1%, preferably 10%, or up to 40%. The thermal conductivity of the thermal conduction element may be in the range of 0.9 watts per meter per Kelvin to 2 watts per meter per Kelvin. Ideally, the heat conduction element should be designed to be electrically insulating so that, even when it comes into contact with an electrical contact element and a temperature sensor or support plate, no conductive connection is formed between the electrical contact element and the temperature sensor or support plate.

[0047] The temperature sensor may be, for example, in the form of an SMD component, particularly an NTC element. For example, a high-current contact device may be provided to transmit electrical energy in the range of, for example, 10kW to 300kW with a high current between 3 amperes and 500 amperes. The electrical contact element is heated in this process. The temperature sensor is used to monitor the heating of the electrical contact element. The temperature sensor may be connected to an evaluation circuit that outputs a warning signal or a shut-off signal to shut off the power line via the high-current contact device when the maximum temperature of the contact element is reached.

[0048] The contact housing is formed from an electrically insulating material, at least partially, so that the contact elements are electrically insulated.

[0049] Figure 14 shows a schematic method sequence for manufacturing a support plate for a high-current contact device. At program point 100, a first electrical contact is provided on the side wall of the support plate. Then, at program point 110, a temperature sensor is fixed to the support surface 18 between the two electrical contact elements, for example, by a connecting layer 19. On the upper surface of the support plate, two solder depots are positioned adjacent to a first recess 14 and a second recess 15. At the subsequent program point 120, the solder depots are melted, and liquid solder flows into the recesses 14 and 15, positioned between the coatings 16 and 17 and the second electrical contact 12 of the temperature sensor 10. After the liquid solder has cooled, the solder forms a conductive connection between the second electrical contact 12 of the temperature sensor 10 and the coatings 16 and 17, i.e., the first electrical contact 11 of the support plate 6.

[0050] Next, as shown in Figure 1 or Figure 11, for example, the support plate 6 having a temperature sensor may be fixed to one of the high-current contact devices described.

[0051] The method described is applicable to all illustrated exemplary embodiments of the support plate. [Explanation of symbols]

[0052] 1. High-current contact devices 2 Contact Housing 3 Contact Elements 4. First connection area 5 Longitudinal axis 6. Support plate 7 Top side 8 Bottom side 9 side wall 10 Temperature Sensor 11. First electrical contact 12. Second electrical contact 13 Electric wire 14. First depression 15. Second depression 16. First coating 17. Second coating 18 Support surface 19. Connectivity Layer 20 Conductive connection materials 21 Further depressions 22 Base area 23 First cylindrical segment-shaped recess 24 Second cylindrical segment-shaped recess 25 portions 26 First recess 27 Second recess 28 Heat Conduction Elements 29 Recess 30 Evaluation Circuit

Claims

1. A high-current contact device (1) for transmitting electrical energy, comprising a contact housing (2), at least one contact element (3) fixed to the contact housing (2), at least one temperature sensor (10), and a support plate (6), The support plate (6) has a first surface (7) and a second surface (8), The first surface (7) extends beyond the side wall (9) that runs along the thickness direction of the support plate (6) and transitions to the second surface (8). The side wall (9) of the support plate (6) faces the contact element (3), The temperature sensor (10) is positioned on the side wall (9) of the support plate (6). The temperature sensor (10) is designed to detect the temperature of the contact element (3), The support plate (6) has a first recess (14) and a second recess (15) in the side wall (9), The first recess (14) and the second recess (15) extend along the thickness direction of the support plate (6) and are spaced apart from each other in the lateral direction. The support plate (6) has first electrical contacts (11) positioned in the first recess (14) and the second recess (15), respectively. The temperature sensor (10) has a second electrical contact (12) which is electrically connected to the first electrical contact (11). The temperature sensor (10) is positioned on a support surface (18) formed between the first recess (14) and the second recess (15) of the side wall (9). High-current contact device (1).

2. An angle of 0° to 45° is formed between the side wall (9) and the longitudinal axis (5) of the contact element (3). The high-current contact device (1) according to claim 1.

3. The side wall is arranged parallel to the longitudinal axis (5) of the contact element (3). The high-current contact device (1) according to claim 1.

4. The first recess (14) and the second recess (15) are formed in a curved shape perpendicular to the plane of the side wall (9) in cross-section. The high-current contact device (1) according to claim 1.

5. The support plate (6) further has a third recess (21) in the side wall (9), The first electrical contact (11) is positioned in the third recess (21), The first electrical contact has a conductive coating (16, 17) on the side wall (9), The conductive coatings (16, 17) are connected to the wires (13) of the support plate (6). The conductive connecting material (20) is positioned between the conductive coating (16, 17) and the second electrical contact of the temperature sensor (10) in order to form a conductive connection. The high-current contact device (1) according to claim 1.

6. The first recess (14) and the second recess (15) are formed in the base region of the third recess (21) in the side wall (9), The high-current contact device (1) according to claim 1.

7. Starting from the first surface (7) and / or the second surface (8) of the support plate (6), the first recess (14) and the second recess (15) extend at least a predetermined distance along the thickness direction of the support plate (6), The electric wire (13) is placed on the support plate (6), The electric wire (13) extends to or into the first recess (14) and the second recess (15) and is connected to the first electrical contact (11). The high-current contact device (1) according to claim 5.

8. The first recess (14) and the second recess (15) extend from the first surface (7) to the second surface (8) of the support plate (6). The high-current contact device (1) according to claim 7.

9. Solder material (20) is placed on the side wall (9) of the support plate (6) to form a conductive connection between the first electrical contact (11) of the support plate (6) and the second electrical contact (12) of the temperature sensor (10). The solder material is placed in the first recess (14) and the second recess (15). The high-current contact device (1) according to claim 4.

10. The side wall (9) of the support plate (6) further has a third recess (21), The temperature sensor (10) is positioned in the third recess (21), The first electrical contact (11) of the support plate (6) is positioned in the third recess (21). The high-current contact device (1) according to claim 1.

11. The support plate (6) has a lateral projection (25) having a predetermined width, The temperature sensor (10) is positioned on the side wall (9) of the lateral projection (25). The high-current contact device (1) according to claim 1.

12. The heat conduction element (28) is positioned between the contact element (3) and the temperature sensor (10). The heat conduction element (28) conducts heat from the contact element (3) towards the temperature sensor (10), The aforementioned heat conduction element (28) is designed to be electrically insulating. The heat conduction element (28) is thermally bonded to the contact element (3) and is in contact with the contact element (3), The heat conduction element (28) is thermally coupled to the temperature sensor (10) and in contact with the temperature sensor (10). The high-current contact device (1) according to claim 1.

13. The heat conduction element (28) has a recess (29), The temperature sensor (10) is positioned in the recess (29), The heat conduction element (28) is in direct contact with the surface of the temperature sensor (10). The high-current contact device (1) according to claim 12.

14. A portion of the support plate is positioned in the recess of the heat conduction element. The high-current contact device according to claim 13.

15. The first recess (14) and the second recess (15) are formed in a curved shape perpendicular to the plane of the side wall (9) in cross-section, The support plate (6) has an evaluation circuit (30) for the temperature sensor (10), The evaluation circuit (30) is connected to the temperature sensor (10) via an electric wire (13). The high-current contact device (1) according to claim 1.

16. A method for manufacturing a high-current contact device according to any one of claims 1 to 15, The temperature sensor is first fixed to the side wall of the support plate, Two solder depots are positioned adjacent to the temperature sensor on the first surface of the support plate. The aforementioned solder deposit is melted by heat treatment, The liquid solder of the solder depot flows from the first surface of the support plate to the side wall of the support plate in two separate solder flows. After the solder flowing between the side wall of the support plate and the electrical contact of the temperature sensor has cooled, the cooled solder forms a conductive connection between the first electrical contact of the support plate and the second electrical contact of the temperature sensor. method.

17. Before the temperature sensor is fixed to the side wall of the support plate, at least one recess corresponding to the first recess or the second recess is inserted into the side wall starting from the first surface. The recess is provided for receiving at least a portion of at least one electrical contact of the support plate and / or the temperature sensor. The method according to claim 16.

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