Vacuum seal for electrostatic chuck
JP7844746B2Active Publication Date: 2026-04-13APPLIED MATERIALS INC
-1 Cites 0 Cited by
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- APPLIED MATERIALS INC
- Filing Date
- 2023-08-02
- Publication Date
- 2026-04-13
Smart Images

Figure 0007844746000001 
Figure 0007844746000002 
Figure 0007844746000003
Abstract
An exemplary substrate support assembly may include an electrostatic chuck body. The body may include a support plate defining a substrate support surface. The body may include a base plate coupled to the support plate. A bottom surface of the base plate may define an annular recess. The body may include a cooling plate coupled to the base plate. The assembly may include a support stem coupled to the body. The assembly may include a heater embedded within the body. The assembly may include one or more electrodes embedded within the body. The assembly may include an annular plate disposed within the annular recess. The annular plate may have a thermal conductivity of less than about 20 W / mK. The assembly may include a vacuum seal element disposed between the annular plate and the cooling plate. The assembly may include a thermal gasket disposed radially inward of the vacuum seal element.
Need to check novelty before this filing date? Find Prior Art