Semiconductor chip mounting equipment

Abstract

This device (100) for mounting a semiconductor chip is equipped with: a push-up part (6) including a push-up head (62) to which a given push-up pin (632, 633) is exchangeably attached; and a wafer suction part (7) including a suction head (73) which suction-holds a given chip (Cb) from above. The device (100) for mounting a semiconductor chip is equipped with a control unit (10) configured to perform control so that a push-up movement amount (Ml, Ms) is acquired on the basis of that the given push-up pin (632, 633) has acted to push up the given chip (Cb), on the basis of the height position of the lower end of the suction head (73) spaced from the given chip (Cb) thereover, and thereby caused the given chip (Cb) to be suction-held on the suction head (73).

Description

Technical Field

[0005] ,

[0004] ,

[0001] The present invention relates to a semiconductor chip mounting apparatus, and more particularly to a semiconductor chip mounting apparatus provided with a pushing-up portion configured to push up a semiconductor chip from below.

Background Art

[0002] Conventionally, a semiconductor chip mounting apparatus provided with a pushing-up portion configured to push up a semiconductor chip from below is known. Such a semiconductor chip mounting apparatus is disclosed in, for example, Japanese Patent Application Laid-Open No. 2012-64752.

[0003] Japanese Patent Application Laid-Open No. 2012-64752 discloses a die supply apparatus (semiconductor chip mounting apparatus) including a pushing-up unit (pushing-up portion), a sub-robot (wafer suction portion), and a control device (control portion).

[0004] The pushing-up unit in Japanese Patent Application Laid-Open No. 2012-64752 includes a pushing-up head and a pushing-up pin. The pushing-up pin is housed in the pushing-up head. The pushing-up head is configured to contact the lower surface of a dicing sheet to which a plurality of dies (semiconductor chips) are attached when it rises. The pushing-up pin is configured to push up the die to be adsorbed among the plurality of dies by rising from the pushing-up head after the pushing-up head contacts the lower surface of the dicing sheet. The sub-robot is configured to adsorb the die pushed up by the pushing-up head and moved to the pickup position (adsorption position).

[0005] The control device described in Japanese Patent Publication No. 2012-64752 is configured to adjust the push-up height of the push-up pins in order to ensure that the suction nozzle reliably picks up the die at the pickup position. The control device is configured to adjust the push-up height of the push-up pins each time the dicing sheet is replaced, for example, before the start of production or during die mounting to the substrate. Specifically, the control device is configured to raise the push-up pins to a preset initial push-up height position, and then repeatedly execute the pickup operation by the suction nozzle by gradually increasing the push-up height of the push-up pins from the initial push-up height position until it is determined that the die has been picked up by the suction nozzle. The control device is configured to determine that the push-up height of the push-up pins at the point in time when it is determined that the die has been picked up by the suction nozzle is the appropriate push-up height. As a result, the appropriate push-up height is obtained, and the amount of push-up movement of the push-up pins when the die is picked up (adsorbed) by the suction nozzle is obtained. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2012-64752 [Overview of the Initiative] [Problems that the invention aims to solve]

[0007] However, in the die supply device described in Japanese Patent Publication No. 2012-64752, when controlling the push-up height of the push-up pin, the pickup operation by the suction nozzle (pushing-up movement amount acquisition operation) is repeatedly performed each time the push-up height of the push-up pin is gradually increased from the initial push-up height position. As a result, in the die supply device described in Japanese Patent Publication No. 2012-64752, the time required to adjust the push-up height of the push-up pin tends to be long, and therefore the time required to acquire the above-mentioned pushing-up movement amount of the push-up pin also tends to be long. Therefore, in the die supply device (semiconductor chip mounting device) described in Japanese Patent Publication No. 2012-64752, it is desirable to shorten the time required to acquire the pushing-up movement amount of the push-up pin (predetermined push-up pin).

[0008] This invention was made to solve the above-mentioned problems, and one of its objectives is to provide a semiconductor chip mounting apparatus that can shorten the time required to obtain the amount of upward movement of a predetermined push-up pin. [Means for solving the problem]

[0009] A semiconductor chip mounting apparatus according to one aspect of this invention includes a push-up head to which predetermined push-up pins corresponding to the types of semiconductor chips formed by dividing a wafer attached to a sheet member are interchangeably attached, a push-up section configured to move the predetermined push-up pins from below to push up a predetermined chip among the plurality of semiconductor chips from below, and a suction head for adsorbing the predetermined chip from above, a wafer suction section configured to move the suction head from below to peel the predetermined chip from the sheet member, and a predetermined chip against The lower end of the suction head that is separated upward prescribed Based on height position With the lower end of the suction head maintained at a predetermined height position, A predetermined tip is pushed up by a predetermined push-up pin. Until the designated chip is attached to the suction head thrust upward Along with, The system includes a control unit configured to perform control to acquire the amount of upward movement of a predetermined push-up pin when a predetermined chip is picked up by the suction head, based on the fact that a predetermined chip has been picked up by the suction head.

[0010] In a semiconductor chip mounting apparatus according to one aspect of this invention, as described above, a control unit is provided that performs control to acquire the amount of upward movement of a predetermined upward-pushing pin when the predetermined chip is attached to the suction head, based on the fact that the predetermined chip is attached to the suction head by a predetermined upward-pushing pin based on the height position of the lower end of the suction head spaced above the predetermined chip. As a result, the amount of upward movement of the predetermined upward-pushing pin can be acquired in a single upward-pushing-to-attachment operation, thus reducing the time required to acquire the amount of upward-pushing pin's movement compared to repeatedly performing an upward-pushing-to-attachment operation to acquire the amount of upward-pushing pin's movement when the predetermined chip, which has been pushed up by the predetermined upward-pushing pin, is attached to the suction head.

[0011] In the semiconductor chip mounting apparatus according to the first aspect described above, preferably, the control unit is configured to perform control to acquire the amount of upward movement of a predetermined push-up pin based on the negative pressure of the suction head exceeding a threshold value. With this configuration, the position where the predetermined chip is adsorbed onto the suction head can be accurately acquired, so the amount of upward movement of the predetermined push-up pin can be accurately acquired in one step without having to repeatedly perform the operation to acquire the amount of upward movement.

[0012] In this case, preferably, the wafer adsorption unit further includes a negative pressure measuring unit that measures the negative pressure of the adsorption head both when pushing up a predetermined chip with a predetermined push-up pin based on the height position of the lower end of the adsorption head, and when mounting each of the multiple semiconductor chips onto the substrate. With this configuration, it is possible to suppress an increase in the number of sensors that measure the negative pressure of the adsorption head.

[0013] In the semiconductor chip mounting apparatus according to the first aspect described above, preferably, the control unit is configured to perform control to acquire a correction value that corrects the reference movement amount when a predetermined chip is picked up by a predetermined chip on a suction head using a reference length pin housed in the push-up head with its upper end positioned substantially flush with the upper end of the push-up head, to the push-up movement amount of a predetermined push-up pin that is of a different length than the reference length pin. With this configuration, the reference movement amount is corrected based on the correction value, so that the predetermined push-up pin can be raised to the same height as the reference length pin. As a result, the height position of the upper end of the reference length pin and the height position of the upper end of the predetermined push-up pin can be aligned when the semiconductor chip picked up on the suction head peels off from the sheet member.

[0014] In this case, preferably, the control unit is configured to perform control to acquire a correction value based on the difference between the upward movement amount of a predetermined push-up pin and the reference movement amount of a reference length pin. With this configuration, the correction value can be acquired simply by calculating the difference between the upward movement amount of the predetermined push-up pin and the reference movement amount of the reference length pin, thus simplifying the process for acquiring the correction value.

[0015] In a semiconductor chip mounting apparatus configured such that the control unit performs control to acquire a correction value based on the difference between the upward movement amount and the reference movement amount, preferably the control unit is configured to perform control to acquire a correction value based on the difference between the upward movement amount of a short-pull-up pin, which is a predetermined push-up pin shorter than the reference length pin, and the reference movement amount. With this configuration, the reference movement amount is corrected based on the correction value, so that the short-pull-up pin can be raised to the same height position as the reference length pin. This makes it possible to align the height position of the upper end of the reference length pin and the height position of the short-pull-up pin when the semiconductor chip adsorbed on the suction head peels off from the sheet member. As a result, it is possible to suppress the occurrence of errors in which the semiconductor chip does not rise even though the short-pull-up pin has been raised, due to the difference in length with the reference length pin.

[0016] In a semiconductor chip mounting apparatus configured such that the control unit performs control to acquire a correction value based on the difference between the upward movement amount and the reference movement amount, preferably the control unit is configured to perform control to acquire a correction value based on the difference between the upward movement amount of a predetermined upward-extending pin, which is longer than the reference-length pin, and the reference movement amount. With this configuration, the reference movement amount is corrected based on the correction value, so that the upward-extending pin can be raised to the same height as the reference-length pin. This makes it possible to align the height position of the upper end of the reference-length pin with the height position of the upper end of the upward-extending pin when the semiconductor chip adsorbed on the suction head peels off from the sheet member. As a result, it is possible to suppress the occurrence of errors in which the upward-extending pin rises to a higher position than the reference-length pin when the upward-extending pin is raised due to the difference in length with the reference-length pin.

[0017] In a semiconductor chip mounting apparatus configured such that the control unit performs control to acquire a correction value that corrects the reference movement amount to the upward movement amount of a predetermined push-up pin, preferably the control unit is configured to perform control to acquire a correction value based on the fact that the lower end of the suction head is moved to a predetermined height position which is the height position of the lower end of the suction head spaced above the surface of the predetermined chip, and then the predetermined push-up pin is moved upward to suction the predetermined chip onto the suction head. With this configuration, the reference movement amount is corrected based on the correction value, so that the height position of the upper end of the reference length pin and the height position of the upper end of the predetermined push-up pin can be aligned to the predetermined height position when the semiconductor chip suctioned onto the suction head is peeled off from the sheet member, thereby suppressing the occurrence of errors when peeling off the semiconductor chip caused by the difference in length with the reference length pin.

[0018] In the semiconductor chip mounting apparatus having the above-described predetermined height position, preferably, the predetermined height position is a height position above a preset reference upward end position of the lower end of the suction head when it moves upward while holding the predetermined chip with the reference length pin and the suction head. With this configuration, the correction value for correcting the reference movement amount can be increased by the difference between the reference upward end position and the predetermined height position. As a result, if the amount of upward movement becomes smaller than the reference movement amount by the correction value, the height position of the upper end of the predetermined push-up pin when the semiconductor chip adsorbed on the suction head peels off from the sheet member can be lowered, thereby suppressing interference between the relatively long predetermined push-up pin and the suction head. Also, if the amount of upward movement becomes larger than the reference movement amount by the correction value, the height position of the upper end of the predetermined push-up pin when the semiconductor chip adsorbed on the suction head peels off from the sheet member can be raised, so that the semiconductor chip can be reliably raised to the reference upward end position with a relatively short predetermined push-up pin.

[0019] In a semiconductor chip mounting apparatus configured such that the control unit performs control to obtain a correction value based on the difference between the upward movement amount and the reference movement amount, preferably, after moving the lower end of the suction head to a preset reference surface height position on the surface of the wafer, the control unit is configured to perform control to move the lower end of the suction head to a predetermined height position. With this configuration, when holding the semiconductor chip by pushing up from below the push-up pin and sucking from above the suction head and peeling it from the sheet member, the same movement as the movement of the suction head when obtaining the correction value is performed. Therefore, the control process for causing the suction head to move when holding the semiconductor chip and peeling it from the sheet member can be directly applied to the movement of the suction head when obtaining the correction value. As a result, the control process can be easily changed, so the work burden on the user can be reduced.

[0020] In a semiconductor chip mounting apparatus configured such that the control unit performs control to obtain a correction value based on the difference between the upward movement amount and the reference movement amount, preferably, the predetermined chip includes non-mountable chips that do not satisfy the conditions for being mounted on the substrate among the plurality of semiconductor chips, and the control unit is configured to perform control to obtain a correction value based on the upward push of the predetermined chip by a predetermined push-up pin based on the height position of the lower end of the suction head. With this configuration, even if a part of the non-mountable chip is chipped due to the unexpected upward push of the predetermined push-up pin when obtaining the correction value, since the non-mountable chip is not mounted on the substrate, the semiconductor chip mounting operation on the substrate can be performed without replenishing the semiconductor chips required for mounting on the substrate. As a result, it is possible to prevent a delay in the start of the semiconductor chip mounting operation on the substrate due to the replenishment of the semiconductor chips.

Advantages of the Invention

[0021] According to the present invention, as described above, the time required to obtain the upward movement amount of the predetermined push-up pin can be shortened.

Brief Description of the Drawings

[0022] [Figure 1] The plan view of the semiconductor chip mounting apparatus of one embodiment. [Figure 2] The perspective view which showed the main components of the semiconductor chip mounting apparatus of one embodiment. [Figure 3] The schematic diagram which showed the example where the reference length pin was attached to the suction head of the semiconductor chip mounting apparatus of one embodiment. [Figure 4] The schematic diagram which showed the example where the push-up long pin was attached to the suction head of the semiconductor chip mounting apparatus of one embodiment. [Figure 5] The schematic diagram which showed the example where the push-up short pin was attached to the suction head of the semiconductor chip mounting apparatus of one embodiment. [Figure 6] The schematic diagram which showed the state where the semiconductor chip held by the reference length pin and the suction head of the semiconductor chip mounting apparatus of one embodiment rose and the lower end part of the suction head moved to the reference rising end position. [Figure 7] The schematic diagram which showed the state where the semiconductor chip held by the reference length pin and the suction head of the semiconductor chip mounting apparatus of one embodiment rose and was peeled from the sheet member. [Figure 8] The schematic diagram which showed the state where the push-up head with the acquisition reference length pin attached to the semiconductor chip mounting apparatus of one embodiment was moved to the upper end position. [Figure 9] The schematic diagram which showed the state where after the push-up head with the acquisition reference length pin attached to the semiconductor chip mounting apparatus of one embodiment was moved to the upper end position, the suction head was moved to the predetermined height position. [Figure 10] The schematic diagram which showed the state where the acquisition reference length pin of the semiconductor chip mounting apparatus of one embodiment was moved upward and the semiconductor chip was adsorbed to the suction head at the predetermined height position. [Figure 11] The schematic view which showed the arrangement position of the non-mountable chip of the wafer of the semiconductor chip mounting apparatus of one embodiment. [Figure 12] The schematic diagram which showed the state where the push-up head with the correction push-up long pin attached to the semiconductor chip mounting apparatus of one embodiment was moved to the upper end position. [Figure 13] This is a schematic diagram showing the state in which the push-up head, to which the corrective push-up long pins of one embodiment of a semiconductor chip mounting apparatus are attached, has been moved to the upper end position, and then the suction head has been moved to a predetermined height position. [Figure 14] This is a schematic diagram showing a state in which a non-mountable chip is picked up by a suction head at a predetermined height position by moving the corrective push-up pin of a semiconductor chip mounting apparatus of one embodiment upward. [Figure 15] This is a schematic diagram showing the state in which the push-up head, to which the corrective push-up short pins are attached, of a semiconductor chip mounting apparatus according to one embodiment has been moved to the upper end position. [Figure 16] This is a schematic diagram showing the state in which the push-up head, to which the corrective push-up short pins of one embodiment of a semiconductor chip mounting apparatus are attached, has been moved to the upper end position, and then the suction head has been moved to a predetermined height position. [Figure 17] This is a schematic diagram showing a state in which a corrective push-up short pin of a semiconductor chip mounting apparatus of one embodiment is moved upward, and an unmountable chip is picked up by a suction head at a predetermined height position. [Figure 18] This is a flowchart showing the process for acquiring the amount of upward movement of a semiconductor chip mounting device according to one embodiment. [Modes for carrying out the invention]

[0023] The following describes embodiments of the present invention based on the drawings.

[0024] The configuration of the semiconductor chip mounting apparatus 100 according to an embodiment of the present invention will be described with reference to Figures 1 to 18.

[0025] (Semiconductor chip mounting equipment) As shown in Figures 1 and 2, the semiconductor chip mounting apparatus 100 is configured to peel off each of the multiple semiconductor chips Ch attached to the sheet member Ws (see Figure 3) from the sheet member Ws and mount them onto the substrate Sb. The semiconductor chip mounting apparatus 100 is also configured to mount components (so-called package components) supplied by the tape feeder 31 onto the substrate Sb. Thus, the semiconductor chip mounting apparatus 100 is a composite apparatus.

[0026] Multiple semiconductor chips Ch are formed by dividing a wafer Wf attached to a sheet member Ws. A wafer Wf is a thin, circular plate made of a semiconductor crystal, which is the material for semiconductor integrated circuits. Semiconductor chips Ch contain semiconductor integrated circuits (ICs). Types of semiconductor chips Ch include MPUs (Micro-Processing Units), memory, GPUs (Graphics Processing Units), DSPs (Digital Signal Processors), and FPGAs (Field-Programmable Arrays). It includes components such as a cellular gate array. The sheet member Ws is an adhesive tape with elasticity. Multiple semiconductor chips Ch are attached to the adhesive layer on the upper surface of the sheet member Ws.

[0027] Here, in the semiconductor chip mounting apparatus 100, the transport direction for transporting the substrate Sb is defined as the X1 direction, the direction opposite to the transport direction for transporting the substrate Sb is defined as the X2 direction, and the direction formed by combining the X1 and X2 directions is defined as the X direction. Furthermore, the horizontal direction perpendicular to the X direction is defined as the Y direction, one side of the Y direction is defined as the Y1 direction, and the other side of the Y direction is defined as the Y2 direction. Furthermore, the vertical direction perpendicular to the X and Y directions is defined as the Z direction (up and down direction), one side of the Z direction is defined as the Z1 direction (up direction), and the other side of the Z direction is defined as the Z2 direction (down direction).

[0028] The semiconductor chip mounting apparatus 100 includes a base 1, a substrate transport unit 2, a feeder placement unit 3, a head unit 4, a wafer holding table 5, a push-up unit 6, a wafer suction unit 7, a wafer storage unit 8, a component imaging unit 9, a control unit 10, and a display unit 11.

[0029] Base 1 is a base that serves as the foundation for arranging each component in the semiconductor chip mounting apparatus 100.

[0030] The substrate transport unit 2 is configured to receive a substrate Sb from outside the semiconductor chip mounting apparatus 100 and transport the substrate Sb in the transport direction (X1 direction). Here, the substrate transport unit 2 is configured to transport the substrate Sb to a mounting work position Pw where components are mounted on the substrate Sb. The substrate transport unit 2 has a pair of conveyors 21 and a drive unit (not shown). The substrate transport unit 2 is also configured to fix the position of the substrate Sb transported to the mounting work position Pw by gripping the substrate Sb in the Z direction. The mounting work position Pw has a mounting work position Pw1 on the X1 direction side and a mounting work position Pw2 on the X2 direction side.

[0031] The base 1 is provided with two feeder placement sections 3 on the Y2 direction side. Note that the base 1 may have one or three or more feeder placement sections 3.

[0032] Multiple tape feeders 31 can be arranged in the feeder placement section 3. The tape feeders 31 are configured to supply components to the substrate Sb that has been transported to the mounting work position Pw. The tape feeders 31 hold a reel (not shown) around which a component supply tape is wound, holding multiple components at predetermined intervals. The components are electronic components such as chip resistors.

[0033] The head unit 4 is a mounting head unit for mounting components and semiconductor chips Ch onto the substrate Sb. Two head units 4 are provided. There may be one or more head units 4. Here, since the structure of the two head units 4 is the same, only one head unit 4 will be described below.

[0034] The head unit 4 is configured to move horizontally in the Z1 direction (upward) of the substrate Sb. The head unit 4 is configured to move horizontally by an X-direction movement mechanism 4a and a Y-direction movement mechanism (not shown). The two head units 4 are configured to move independently in the XY direction.

[0035] The head unit 4 is configured to pick up components using a suction head 41 and mount them onto a substrate Sb that is fixed in position at the mounting work position Pw. The head unit 4 is also configured to pick up semiconductor chips Ch using the suction head 41 and mount the semiconductor chips Ch onto the substrate Sb that is fixed in position at the mounting work position Pw.

[0036] Specifically, the head unit 4 includes a suction head 41, a substrate imaging unit 42, a servo motor 43, and an encoder 44.

[0037] Multiple (two) suction heads 41 are arranged in a line in the X direction. Negative pressure is generated in each of the multiple suction heads 41, causing the component or semiconductor chip Ch to be attracted to each of the multiple suction heads 41. Positive pressure is generated in each of the multiple suction heads 41, causing the component or semiconductor chip Ch to be released from each of the multiple suction heads 41. Note that there may be one or three or more suction heads 41.

[0038] The substrate imaging unit 42 is attached to the head unit 4 and, prior to mounting components or semiconductor chips Ch onto the substrate Sb, the FI mark (Fiducial) affixed to the upper surface of the substrate Sb is scanned. This is a camera for capturing marks (fiducial marks: not shown). The FI mark is used to confirm the position of the Sb on the substrate.

[0039] The servo motor 43 is a drive source for moving the suction head 41 in the Z direction (up and down direction). The encoder 44 is configured to acquire the height position of the suction head 41 as it moves in the Z direction by the servo motor 43.

[0040] The wafer holding table 5 is configured to support the wafer Wf, which has been pulled out from the wafer storage section 8 by an insertion / removal mechanism (not shown), in a predetermined position. The wafer holding table 5 is also configured to be movable in the Y direction. Specifically, the wafer holding table 5 includes a holding section 51, a servo motor 52, a ball screw 53, and a pair of guide rails 54.

[0041] The holding portion 51 is configured to hold a ring-shaped member (not shown) to which the sheet member Ws is attached, such that the lower end of the sheet member Ws is positioned at a predetermined height. The servo motor 52 is a drive source for moving the holding portion 51 in the Y direction. The ball screw 53 is configured to move the holding portion 51 in the Y direction by rotating in conjunction with the drive of the servo motor 52. A pair of guide rails 54 are configured to guide the movement of the holding portion 51 in the Y direction.

[0042] The push-up section 6 is configured to push up from below the semiconductor chip Ch to be peeled off from among a plurality of semiconductor chips Ch held on the wafer holding table 5. Specifically, the push-up section 6 includes a head unit 61, a push-up head 62, a push-up pin 63, an X-direction movement mechanism 64, a cylinder 65, and a Z-direction movement mechanism 66.

[0043] The head unit 61 is configured to move in the X direction by an X-direction movement mechanism 64.

[0044] The thrusting head 62 is configured to move up and down to the upper or lower end position by the cylinder 65. Multiple (two) thrusting heads 62 are arranged in a line in the X direction. There may be one or three or more thrusting heads 62. Since each of the multiple thrusting heads 62 has the same structure, the thrusting head 62 arranged on the X1 direction side will be described.

[0045] Here, the upper end position of the push-up head 62 is the height position at which the holding portion 51 and the ring-shaped member come into contact. In other words, the upper end position of the push-up head 62 is the upper end position of the holding portion 51. As a result, when the push-up head 62 moves to the upper end position, the upper end portion 62a of the push-up head 62 comes into contact with the lower end portion of the sheet member Ws to which the ring-shaped member held by the holding portion 51 is attached. Furthermore, the lower end position of the push-up head 62 is lower than the upper end position of the push-up head 62 and is a position that avoids interference with the wafer holding table 5 which moves in the Y direction.

[0046] The push-up head 62 is equipped with interchangeable push-up pins 63 that correspond to multiple types of semiconductor chips Ch. The push-up pins 63 move from bottom to top by a Z-direction movement mechanism 66 to push up the semiconductor chip Ch from below. The push-up pins 63 also return to the push-up head 62 by moving from top to bottom by the Z-direction movement mechanism 66.

[0047] Here, with reference to Figures 3 to 5, we will describe the push-up pins 63 that correspond to multiple types of semiconductor chips Ch.

[0048] As shown in Figure 3, the push-up pin 63 has a reference length pin 631 housed inside the push-up head 62 with the upper end 63a of the push-up pin 63 positioned substantially flush with the upper end 62a of the push-up head 62. The reference length pin 631 comes into contact with the lower end of the sheet member Ws together with the upper end 62a of the push-up head 62 when the push-up head 62 rises to its upper end position. The reference length pin 631 has two types: a mounting reference length pin 631a used when mounting a semiconductor chip Ch onto a substrate Sb, and an acquisition reference length pin 631b (see Figure 8) used when acquiring a reference displacement Mc for pushing up the semiconductor chip Ch from below.

[0049] As shown in Figure 4, the push-up pin 63 has a push-up long pin 632 that is longer vertically than the reference length pin 631. The upper end 63a of the push-up long pin 632 protrudes above the upper end 62a of the push-up head 62, while the lower part is housed inside the push-up head 62. When the push-up head 62 rises to its upper end position, the push-up long pin 632 raises the semiconductor chip Ch together with the sheet member Ws by the amount that it protrudes upward. At this time, at least a part of the semiconductor chip Ch is separated from the sheet member Ws. There are two types of push-up long pins 632: a mounting push-up long pin 632a used when mounting the semiconductor chip Ch to the substrate Sb, and a correction push-up long pin 632b (see Figure 12) used when correcting the reference movement amount Mc for pushing up the semiconductor chip Ch from below to match the push-up long pin 632. Note that the push-up long pin 632 is an example of a "predetermined push-up pin" in the claims.

[0050] One possible type of semiconductor chip Ch that corresponds to the push-up long pin 632 is a small chip. In this case, since a large number of semiconductor chips Ch are provided by dividing the wafer Wf, the mounting time of the semiconductor chips Ch to the substrate Sb becomes relatively long. For this reason, in order to detach the semiconductor chips Ch from the sheet member Ws as quickly as possible, it is conceivable to use a push-up long pin 632 in which at least a portion of the semiconductor chips Ch is detached from the sheet member Ws simply by the push-up head 62 rising to the upper end position.

[0051] As shown in Figure 5, the push-up pin 63 has a push-up short pin 633 that is shorter in the vertical direction than the reference length pin 631. The push-up short pin 633 is housed inside the push-up head 62 with its upper end 63a positioned below the upper end 62a of the push-up head 62. The push-up short pin 633 does not come into contact with the lower end of the sheet member Ws when the push-up head 62 rises to its upper end position. There are two types of push-up short pins 633: a mounting push-up short pin 633a used when mounting a semiconductor chip Ch onto a substrate Sb, and a correction push-up short pin 633b (see Figure 15) used when correcting the reference movement amount Mc for pushing up the semiconductor chip Ch from below to match the push-up short pin 633. Note that the push-up short pin 633 is an example of a "specified push-up pin" within the scope of the claim.

[0052] One possible type of semiconductor chip Ch that corresponds to the push-up short pin 633 is, for example, an expensive semiconductor chip Ch. In this case, we want to avoid putting as much load on the semiconductor chip Ch as possible, so we do not want the semiconductor chip Ch to be pushed up when the push-up head 62 rises to the upper end position. For this reason, it is conceivable that a push-up short pin 633 that does not come into contact with the lower end of the sheet member Ws when the push-up head 62 rises to the upper end position is used.

[0053] Here, since the types of semiconductor chips Ch on the wafer Wf are registered in advance, the association of the push-up pins 63 corresponding to the types of semiconductor chips Ch on the wafer Wf is performed before the semiconductor chip mounting apparatus 100 starts mounting the multiple semiconductor chips Ch onto the substrate Sb. The above association is performed before the start of mounting by an external control device or the like, which is provided separately from the semiconductor chip mounting apparatus 100, but it may also be performed before the start of mounting by the control unit 10.

[0054] The X-direction movement mechanism 64, although not shown in the figures, is a drive mechanism having, for example, a servo motor and a ball screw. This makes it possible to obtain the position of the head unit 61 in the X direction. The cylinder 65 is, for example, an air cylinder that raises or lowers the thrusting head 62 using air pressure. The Z-direction movement mechanism 66 is a drive mechanism driven by a servo motor. This makes it possible to obtain the height position in the Z direction of the upper end 63a of the thrusting pin 63.

[0055] Furthermore, as shown in Figures 6 and 7, the wafer adsorption unit 7 is configured to detach the semiconductor chip Ch, held together with the push-up pins 63, from the sheet member Ws and transfer it to the adsorption head 41 of the head unit 4. Note that, for convenience, the state of the semiconductor chip Ch being pushed up by the push-up pins 63 shown in Figures 6 and 7 is slightly exaggerated. Similarly, the state of the semiconductor chip Ch being pushed up by the push-up pins 63 shown in Figures 10, 14, and 17 is also slightly exaggerated. Figures 1 and 2 will be referenced to explain the wafer adsorption unit 7.

[0056] As shown in Figures 1 and 2, specifically, the wafer adsorption unit 7 includes a head unit 71, a rotation mechanism 72, an adsorption head 73, an X-direction movement mechanism 74, a chip imaging unit 75, a Y-direction movement mechanism 76, and a negative pressure measurement unit 77.

[0057] The head unit 71 is configured to move horizontally (XY direction) above the wafer holding table 5 by means of an X-direction movement mechanism 74 and a Y-direction movement mechanism 76. The head unit 71 is movably mounted on the X-direction movement mechanism 74. A rotation mechanism 72 is mounted on the head unit 71 so as to be movable in the Z direction by a Z-direction movement mechanism 71a. The Z-direction movement mechanism 71a is provided on the head unit 71. Here, the Z-direction movement mechanism 71a is a drive mechanism driven by a servo motor. This makes it possible to obtain the height position of the rotation mechanism 72 in the Z direction.

[0058] The rotating mechanism 72 is configured to rotate the suction head 73 about a rotation axis extending in the X direction. Multiple (two) rotating mechanisms 72 are arranged side by side in the X direction. A suction head 73 is rotatably mounted to each of the multiple rotating mechanisms 72. Note that one or more rotating mechanisms 72 may be arranged.

[0059] The suction head 73 is configured to adsorb the semiconductor chip Ch from above. Since the configuration of the suction head 73 attached to each of the multiple rotating mechanisms 72 is the same, only the configuration of the suction head 73 attached to the rotating mechanism 72 located on the X1 side will be described.

[0060] The suction head 73 has a one-sided suction head 73a, a other-sided suction head 73b, and a mounting portion 73c. ​​The one-sided suction head 73a is located on the Z1 side of the mounting portion 73c in Figure 2. The other-sided suction head 73b is located on the Z2 side of the mounting portion 73c in Figure 2. The mounting portion 73c is attached to the rotating mechanism 72. The mounting portion 73c rotates around a rotation axis extending in the X direction by the rotating mechanism 72.

[0061] The suction head 73 attracts the semiconductor chip Ch using the negative pressure generated by a negative pressure generator (not shown). That is, the semiconductor chip Ch can be attracted by generating negative pressure in both the one-sided suction head 73a and the other-sided suction head 73b. The suction head 73 also releases the semiconductor chip Ch when positive pressure is generated. The semiconductor chip Ch can be separated by generating positive pressure in both the one-sided suction head 73a and the other-sided suction head 73b.

[0062] As a result, in the wafer adsorption section 7, the semiconductor chip Ch, which has been pushed up by the push-up pin 63, is adsorbed by the other adsorption head 73b and detached from the sheet member Ws. Then, the mounting section 73c is rotated by the rotation mechanism 72, so that the positions of the one adsorption head 73a and the other adsorption head 73b are swapped. That is, the other adsorption head 73b is positioned on the Z1 side. Then, the semiconductor chip Ch that has been adsorbed by the other adsorption head 73b is adsorbed by the adsorption head 41, thereby transferring the semiconductor chip Ch from the other adsorption head 73b to the adsorption head 41. The semiconductor chip Ch that has been adsorbed by the adsorption head 41 is mounted on the substrate Sb. The above method of mounting the semiconductor chip Ch on the substrate Sb is just one example.

[0063] The X-direction movement mechanism 74 is a mechanism for moving the head unit 71 in the X direction. The X-direction movement mechanism 74 includes a servo motor 74a and a drive transmission mechanism (not shown). The drive transmission mechanism is, for example, a ball screw. This makes it possible to obtain the position of the head unit 71 in the X direction. The X-direction movement mechanism 74 is also a mechanism for moving the chip imaging unit 75 in the X direction. The X-direction movement mechanism 74 includes a servo motor 74b and a drive transmission mechanism (not shown). The drive transmission mechanism is, for example, a ball screw. This makes it possible to obtain the position of the chip imaging unit 75 in the X direction.

[0064] The chip imaging unit 75 is configured to image the semiconductor chip Ch to be peeled off when peeling the semiconductor chip Ch from the sheet member Ws. The chip imaging unit 75 is a camera for imaging the semiconductor chip Ch on the sheet member Ws attached to a ring-shaped member held by the holding unit 51. The image of the semiconductor chip Ch captured by the chip imaging unit 75 is an image for obtaining the protrusion position of the push-up pins 63 on the semiconductor chip Ch and the adsorption position of the adsorption head 73.

[0065] The Y-direction movement mechanism 76 is a mechanism that moves the X-direction movement mechanism 74 in the Y direction. Multiple (two) Y-direction movement mechanisms 76 are attached to the base 1. One Y-direction movement mechanism 76 is located on the X1 direction side. One Y-direction movement mechanism 76 is located on the X2 direction side. Since the multiple Y-direction movement mechanisms 76 have the same structure, only the Y-direction movement mechanism 76 on the X1 direction side will be described.

[0066] The Y-direction movement mechanism 76 includes a servo motor 76a, a ball screw 76b, and a guide rail 76c. The servo motor 76a is the drive source for moving the X-direction movement mechanism 74 in the Y-direction. The ball screw 76b is configured to move the X-direction movement mechanism 74 in the Y-direction by rotating in conjunction with the drive of the servo motor 76a. The guide rail 76c is configured to guide the movement of the X-direction movement mechanism 74 in the Y-direction.

[0067] In this manner, the wafer suction unit 7 moves horizontally (XY direction) above the wafer holding table 5 by the X-direction movement mechanism 74 and the Y-direction movement mechanism 76. Furthermore, since the horizontal movable range of the wafer suction unit 7 and the horizontal movable range of the head unit 4 partially overlap in a plan view, the head unit 4 and the wafer suction unit 7 are arranged to be vertically aligned. This enables the transfer of semiconductor chips Ch from the wafer suction unit 7 to the head unit 4.

[0068] The negative pressure measuring unit 77 is configured to measure the negative pressure of the suction head 73 both when pushing up the non-mountable chip Cb (described later) using the push-up long pin 632 or push-up short pin 633 based on the height position of the lower end of the suction head 73 (during the operation to acquire the amount of push-up movement), and when mounting each of the multiple semiconductor chips Ch onto the substrate Sb. Multiple negative pressure measuring units 77 are provided in the head unit 71, corresponding to the suction head 73 on the X1 direction side and the suction head 73 on the X2 direction side. Of the multiple negative pressure measuring units 77, the negative pressure measuring unit 77 on the X1 direction side is a sensor that measures the negative pressure of the suction head 73 on the X1 direction side. Of the multiple negative pressure measuring units 77, the negative pressure measuring unit 77 on the X2 direction side is a sensor that measures the negative pressure of the suction head 73 on the X2 direction side.

[0069] Furthermore, the wafer storage section 8 is configured to accommodate wafers Wf that have been divided (diced) into multiple semiconductor chips Ch. Here, the wafers Wf are attached to a sheet member Ws. The sheet member Ws is attached to a ring-shaped member.

[0070] The component imaging unit 9 is configured to image the component or semiconductor chip Ch to be mounted on the substrate Sb from below (in the Z2 direction) prior to mounting the component or semiconductor chip Ch onto the substrate Sb. In other words, the component imaging unit 9 is fixed on the base 1 and is configured to image the component or semiconductor chip Ch that is adsorbed by the adsorption head 41 from below the component or semiconductor chip Ch.

[0071] The control unit 10 is configured to control the semiconductor chip mounting device 100. The control unit 10 includes a CPU (Central Processing Unit) and a storage unit 10b having an HDD (Hard Disk Drive), ROM (Read Only Memory) 10a, and RAM (Random Access Memory).

[0072] The memory unit 10b stores a program for acquiring the upward movement amount, which is the amount of movement Mc when the upward-pushing pins 63 push up the semiconductor chip Ch from below. The memory unit 10b also stores the following: the lowered position of the reference pin Hcd, the raised position of the reference pin Hcu, the lowered position of the short pin Hsd, the raised position of the short pin Hsu, the lowered position of the long pin Hld, the raised position of the long pin Hlu, the reference surface height position Hw, the reference raised end position Hvu, the predetermined height position Hvp, the reference movement amount Mc, the upward-pushing movement amount Ml, the upward-pushing movement amount Ms, and the correction value Vc. The memory unit 10b also stores which of the following is used as the upward-pushing pin 63, corresponding to multiple types of semiconductor chips Ch on the wafer Wf: the reference length pin 631, the upward-pushing long pin 632, and the upward-pushing short pin 633.

[0073] The program for acquiring the amount of thrust movement, the reference pin lowering position Hcd, the reference pin raising position Hcu, the short pin lowering position Hsd, the short pin raising position Hsu, the long pin lowering position Hld, the long pin raising position Hlu, the reference surface height position Hw, the reference upper end position Hvu, the predetermined height position Hvp, the reference movement amount Mc, the thrust movement amount Ml, the thrust movement amount Ms, and the correction value Vc will be explained in detail later.

[0074] The display unit 11 is composed of a liquid crystal display or the like. The display unit 11 is configured to display information transmitted from the control unit 10 on its screen. The display unit 11 is mounted on the semiconductor chip mounting apparatus 100.

[0075] (Program for acquiring upward movement amount) The above-mentioned program for acquiring the amount of upward movement will be explained with reference to Figures 8 to 17. The program for acquiring the amount of upward movement is processed in the control unit 10.

[0076] Here, as shown in Figures 8 to 10, the semiconductor chip mounting apparatus 100 acquires the reference movement amount Mc of the reference length pin 631 when the semiconductor chip Ch is held together with the suction head 73 and peeled off from the sheet member Ws. The push-up movement amount acquisition program in this embodiment is a program that acquires a correction value Vc that corrects the reference movement amount Mc, which is set to match the reference length pin 631, to match the respective push-up long pin 632 and push-up short pin 633, which have different lengths from the reference length pin 631. In the semiconductor chip mounting apparatus 100, the reference movement amount Mc is corrected by correcting the reference pin lowering position Hcd with the acquired correction value Vc.

[0077] This program for acquiring the amount of upward movement is executed when the first substrate Sb is loaded into the semiconductor chip mounting device 100 after the upward pin 63 attached to the upward head 62 has been replaced with either the long upward pin 632 or the short upward pin 633.

[0078] First, let's explain how to obtain the reference displacement Mc. When obtaining the reference displacement Mc, a reference length pin 631b for acquisition is attached to the push-up head 62. The following explanation will describe the case where the reference length pin 631b for acquisition is attached to the push-up head 62 located on the X1 side among the multiple push-up heads 62.

[0079] Here, before obtaining the reference displacement Mc, the user pre-sets a predetermined height position Hvp. The predetermined height position Hvp is a height position above the reference upward end position Hvu (see Figure 6). The predetermined height position Hvp is also a pre-set height position of the lower end of the suction head 73 that is spaced above the surface of the semiconductor chip Ch (reference surface height position Hw).

[0080] Here, the reference upward end position Hvu is the height position of the lower end of the suction head 73 when the semiconductor chip Ch is held by the reference length pin 631 and the suction head 73 and moved upward by a reference amount Mc. In other words, the reference upward end position Hvu is the height position at which the semiconductor chip Ch can be held by the reference length pin 631 and the suction head 73 and detached from the sheet member Ws. The reference upward end position Hvu is preset.

[0081] As a result, the predetermined height position Hvp is a height position above the reference upward end position Hvu. Therefore, the predetermined height position Hvp is a height position that prevents interference between the suction head 73, which has moved to the reference upward end position Hvu, and the upward-extending pin 632, which is longer than the reference length pin 631, when the upward-extending pin 632 is raised by a reference movement amount Mc.

[0082] (Acquisition of reference movement) As shown in Figure 8, the control unit 10 is configured to raise the push-up head 62 to its upper end position and then control the movement of the lower end of the suction head 73 to a preset reference surface height position Hw on the surface of the wafer Wf. When the lower end of the suction head 73 is moved toward the surface of the wafer Wf, the suction head 73 pushes the semiconductor chip Ch downwards by a predetermined amount in the Z2 direction. As a result, although the surface height position of the wafer Wf changes depending on the thickness of the wafer Wf, it is possible to set a constant reference surface height position Hw regardless of the thickness of the wafer Wf by subtracting or adding the amount of change in the surface height position of the wafer Wf due to the thickness to the predetermined amount of downward pushing of the semiconductor chip Ch.

[0083] Next, as shown in Figures 8 and 9, the control unit 10 is configured to move the lower end of the suction head 73 to a reference surface height position Hw, and then to a predetermined height position Hvp.

[0084] As shown in Figure 10, the control unit 10 is configured to perform control to acquire the reference movement amount Mc of the reference length pin 631b when the semiconductor chip Ch is attracted to the adsorption head 73, which is spaced apart above the semiconductor chip Ch, based on the fact that the semiconductor chip Ch is attracted to the adsorption head 73 by the upward thrust of the semiconductor chip Ch by the reference length pin 631b.

[0085] Specifically, the control unit 10 is configured to perform control to acquire the reference pin lowering position Hcd, which is the height position of the upper end 63a of the acquisition reference length pin 631b before it rises. The control unit 10 is configured to perform control to acquire the reference pin rising position Hcu, which is the height position of the upper end 63a of the acquisition reference length pin 631b, based on the fact that the negative pressure of the suction head 73 has exceeded a threshold value by moving the acquisition reference length pin 631b in the Z1 direction (upwards). The control unit 10 is configured to perform control to acquire the reference movement amount Mc based on the difference between the reference pin lowering position Hcd and the reference pin rising position Hcu. Here, the reference pin lowering position Hcd is the upper end position of the holding part 51. The reference pin rising position Hcu is acquired based on the reference pin lowering position Hcd and the output signal of the drive source (servo motor) of the Z-direction movement mechanism 66 of the push-up part 6.

[0086] (Obtaining correction values) Next, the acquisition of the correction value Vc will be explained with reference to Figures 11 to 17. When acquiring the correction value Vc, either the long correction pin 632b or the short correction pin 633b is attached to the push-up head 62, depending on the type of semiconductor chip Ch mounted on the substrate Sb.

[0087] Furthermore, as illustrated in Figure 11, the semiconductor chip Ch that is pushed up by the correction push-up long pin 632b or the correction push-up short pin 633b when acquiring the correction value Vc is an unmountable chip Cb among multiple semiconductor chips Ch that does not meet the conditions for being mountable on the substrate Sb. Note that the unmountable chip Cb is an example of the "specified chip" in the claims.

[0088] An unmountable chip Cb is, for example, a semiconductor chip Ch whose X-direction dimension is not approximately the standard horizontal dimension and whose Y-direction dimension is not approximately the standard vertical dimension. An unmountable chip Cb is, for example, a semiconductor chip Ch in which a crack has been detected. An unmountable chip Cb is, for example, a semiconductor chip Ch in which the measured value of electrical characteristics (resistance, current value, etc.) is outside a predetermined error relative to the standard value. An unmountable chip Cb is, for example, a semiconductor chip Ch in which the wiring pattern of the internal electrical circuit does not match the standard wiring pattern.

[0089] The location information of the unmountable chip Cb among the multiple semiconductor chips Ch attached to the sheet member Ws is stored in advance as map information in the storage unit 10b along with the location information of each of the multiple semiconductor chips Ch.

[0090] <Acquiring correction values ​​for the upward-extending pin> First, referring to Figures 12 to 14, we will explain how to obtain the correction value Vc corresponding to the correction push-up length pin 632b. In the following explanation, we will describe the case where the correction push-up length pin 632b is attached to the push-up head 62 located on the X1 direction side among the multiple push-up heads 62.

[0091] Specifically, as shown in Figures 12 and 13, the control unit 10 is configured to raise the push-up head 62 to its upper end position, and then to move the lower end of the suction head 73 to a reference surface height position Hw. Furthermore, the control unit 10 is configured to move the lower end of the suction head 73 to a predetermined height position Hvp after moving the lower end of the suction head 73 to the reference surface height position Hw.

[0092] As shown in Figure 14, the control unit 10 is configured to perform control to acquire the amount Ml of upward movement of the corrective upward-extending pin 632b when the non-mountable chip Cb is picked up by the suction head 73, based on the fact that the operation to acquire the amount of upward movement of the non-mountable chip Cb is performed only once, by the upward movement of the non-mountable chip Cb by the corrective upward-extending pin 632b, which is spaced above the non-mountable chip Cb.

[0093] In other words, the control unit 10 is configured to perform control to acquire the amount Ml of upward movement of the corrective upward-pushing pin 632b when the unmountable chip Cb is picked up by the suction head 73, based on the height position of the lower end of the suction head 73 which is spaced above the unmountable chip Cb, by pushing up the unmountable chip Cb with the corrective upward-pushing pin 632b. Here, the control unit 10 is configured to perform control to push up the unmountable chip Cb with the corrective upward-pushing pin 632b in accordance with the height position of the lower end of the suction head 73 which is spaced above the unmountable chip Cb.

[0094] Specifically, the control unit 10 is configured to perform control to acquire the long pin lowering position Hld, which is the height position of the upper end 63a of the corrective push-up long pin 632b before it rises. The control unit 10 is configured to perform control to acquire the long pin rising position Hlu, which is the height position of the upper end 63a of the corrective push-up long pin 632b, based on the fact that the negative pressure of the suction head 73 has exceeded a threshold when the corrective push-up long pin 632b is moved in the Z1 direction (upwards). The control unit 10 is configured to perform control to acquire the push-up movement amount Ml based on the difference between the long pin lowering position Hld and the long pin rising position Hlu. Here, the long pin lowering position Hld and the long pin rising position Hlu are acquired based on the output signal of the drive source (servo motor) of the Z-direction movement mechanism 66 of the push-up section 6.

[0095] The control unit 10 in this embodiment is configured to perform control to acquire a correction value Vc based on the difference between the upward movement amount Ml of the correction upward length pin 632b and the reference movement amount Mc of the acquisition reference length pin 631b.

[0096] Specifically, the control unit 10 is configured to perform control to acquire a correction value Vc by subtracting the upward movement amount Ml of the correction upward length pin 632b from the reference movement amount Mc of the reference length pin 631b for acquisition. The correction value Vc is a numerical value used to correct the reference movement amount Mc to an upward movement amount Ml that allows the semiconductor chip Ch to be properly adsorbed by the suction head 73, because if the upward length pin 632 is moved by the reference movement amount Mc, the semiconductor chip Ch will be pressed too hard against the suction head 73. The correction value Vc is acquired when the upward movement amount acquisition operation is performed. The upward movement amount acquisition operation is performed only once.

[0097] Thus, the control unit 10 is configured to perform control to acquire a correction value Vc that corrects the reference movement amount Mc to the push-up movement amount Ml when the push-up movement amount acquisition operation is performed only once. In other words, the control unit 10 is configured to perform control to acquire the correction value Vc based on the fact that the non-mountable chip Cb has been pushed up by the correction push-up long pin 632b in accordance with the height position of the lower end of the suction head 73. In the semiconductor chip mounting apparatus 100, the reference pin lowering position Hcd is corrected by the acquired correction value Vc. As a result, the amount of movement of the reference movement amount Mc is reduced by the amount that the reference pin lowering position Hcd has risen to a position on the Z1 side by the amount of the correction value Vc, and the amount of movement of the push-up long pin 632 decreases. Therefore, the reference movement amount Mc is corrected to the push-up movement amount Ml.

[0098] Furthermore, the control unit 10 is configured to perform control to acquire a correction value Vc based on the fact that after moving the lower end of the suction head 73 to a predetermined height position Hvp, the correction push-up length pin 632b is moved upward to pick up the unmountable chip Cb on the suction head 73. Specifically, the control unit 10 is configured to perform control to acquire the amount Ml of upward movement of the correction push-up length pin 632b based on the fact that the negative pressure of the suction head 73 has exceeded a threshold. In addition, the control unit 10 is configured to perform control to acquire a correction value Vc based on the difference between the amount Ml of upward movement of the correction push-up length pin 632b and the reference movement Mc of the acquisition reference length pin 631b based on the fact that the negative pressure of the suction head 73 has exceeded a threshold.

[0099] Furthermore, when the lifting movement amount acquisition operation is performed only once, the control unit 10 is configured to control the display unit 11 to display a screen indicating that a suction error has occurred by the suction head 73, based on the fact that the negative pressure of the suction head 73 is below a threshold when the height position of the upper end 63a of the correction lifting length pin 632b reaches a predetermined height position Hvp. The screen indicating that a suction error has occurred is a screen that displays the text "Suction Error Occurred" on the display unit 11.

[0100] This operation to acquire the amount of upward movement is performed only once. The acquired correction value Vc is stored in the memory unit 10b. After the operation to acquire the amount of upward movement, the correction upward length pin 632b is replaced with the mounting upward length pin 632a, and then the mounting of the semiconductor chip Ch onto the substrate Sb begins. Here, the control unit 10 is configured to perform control to correct the reference pin downward position Hcd based on the fact that the correction value Vc has been subtracted from the reference pin downward position Hcd when mounting the semiconductor chip Ch onto the substrate Sb. As a result, the reference movement amount Mc is corrected to the upward movement amount Ml.

[0101] <Obtaining correction values ​​for upward-pushing short pins> First, referring to Figures 15 to 17, we will explain how to obtain the correction value Vc corresponding to the correction push-up short pin 633b. In the following explanation, we will describe the case where the correction push-up short pin 633b is attached to the push-up head 62 located on the X1 direction side among the multiple push-up heads 62.

[0102] Specifically, as shown in Figures 15 and 16, the control unit 10 is configured to raise the push-up head 62 to its upper end position, and then to move the lower end of the suction head 73 to a reference surface height position Hw. Furthermore, the control unit 10 is configured to move the lower end of the suction head 73 to a predetermined height position Hvp after moving the lower end of the suction head 73 to the reference surface height position Hw.

[0103] As shown in Figure 17, the control unit 10 is configured to perform control to acquire the amount of upward movement Ms of the corrective upward-pushing short pin 633b when the unmountable chip Cb is picked up by the suction head 73, based on the fact that the operation to acquire the amount of upward movement of the unmountable chip Cb is performed only once by the upward movement of the unmountable chip Cb by the corrective upward-pushing short pin 633b, which is spaced above the unmountable chip Cb.

[0104] In other words, the control unit 10 is configured to perform control to acquire the amount Ms of upward movement of the corrective upward-pushing short pin 633b when the unmountable chip Cb is picked up by the suction head 73, based on the height position of the lower end of the suction head 73 which is spaced above the unmountable chip Cb, by pushing up the unmountable chip Cb with the corrective upward-pushing short pin 633b. Here, the control unit 10 is configured to perform control to push up the unmountable chip Cb with the corrective upward-pushing short pin 633b in accordance with the height position of the lower end of the suction head 73 which is spaced above the unmountable chip Cb.

[0105] Specifically, the control unit 10 is configured to perform control to acquire the short pin lowering position Hsd, which is the height position of the upper end 63a of the corrective push-up short pin 633b before it rises. The control unit 10 is configured to perform control to acquire the short pin rising position Hsu, which is the height position of the upper end 63a of the corrective push-up short pin 633b, based on the fact that the negative pressure of the suction head 73 has exceeded a threshold when the corrective push-up short pin 633b is moved in the Z1 direction (upwards). The control unit 10 is configured to perform control to acquire the push-up movement amount Ms based on the difference between the short pin lowering position Hsd and the short pin rising position Hsu. Here, the short pin lowering position Hsd and the short pin rising position Hsu are acquired based on the output signal of the drive source (servo motor) of the Z-direction movement mechanism 66 of the push-up section 6.

[0106] The control unit 10 in this embodiment is configured to perform control to acquire a correction value Vc based on the difference between the upward movement amount Ms of the correction upward short pin 633b and the reference movement amount Mc of the acquisition reference length pin 631b.

[0107] Specifically, the control unit 10 is configured to perform control to acquire a correction value Vc by subtracting the upward movement amount Ms of the corrective upward-pushing short pin 633b from the reference movement amount Mc of the acquisition reference length pin 631b. The correction value Vc is a numerical value used to correct the reference movement amount Mc to an upward movement amount Ms that allows the semiconductor chip Ch to be picked up by the suction head 73, because even if the upward-pushing short pin 633 is moved by the reference movement amount Mc, the semiconductor chip Ch cannot be picked up by the suction head 73. The correction value Vc is acquired when the upward movement amount acquisition operation is performed. The upward movement amount acquisition operation is performed only once.

[0108] Thus, the control unit 10 is configured to perform control to acquire a correction value Vc that corrects the reference movement amount Mc to the push-up movement amount Ms when the push-up movement amount acquisition operation is performed only once. In other words, the control unit 10 is configured to perform control to acquire the correction value Vc based on the fact that the non-mountable chip Cb has been pushed up by the correction push-up short pin 633b in accordance with the height position of the lower end of the suction head 73. In the semiconductor chip mounting apparatus 100, the reference pin lowering position Hcd is corrected by the acquired correction value Vc. As a result, the amount of movement of the push-up short pin 633 increases because the amount of movement of the reference movement amount Mc is increased by the amount that the reference pin lowering position Hcd has descended to a position on the Z2 side by the amount of the correction value Vc. Therefore, the reference movement amount Mc is corrected to the push-up movement amount Ms.

[0109] Furthermore, the control unit 10 is configured to perform control to acquire a correction value Vc based on the fact that after moving the lower end of the suction head 73 to a predetermined height position Hvp, the corrective push-up short pin 633b is moved upward to pick up the unmountable chip Cb on the suction head 73. Specifically, the control unit 10 is configured to perform control to acquire the amount of upward movement Ms of the corrective push-up short pin 633b based on the fact that the negative pressure of the suction head 73 has exceeded a threshold. In addition, the control unit 10 is configured to perform control to acquire a correction value Vc based on the difference between the amount of upward movement Ms of the corrective push-up short pin 633b and the reference movement Mc of the acquisition reference length pin 631b based on the fact that the negative pressure of the suction head 73 has exceeded a threshold.

[0110] Furthermore, when the lifting movement amount acquisition operation is performed only once, the control unit 10 is configured to control the display unit 11 to display a screen indicating that a suction error has occurred by the suction head 73, based on the fact that the negative pressure of the suction head 73 is below a threshold when the height position of the upper end 63a of the corrective lifting short pin 633b reaches a predetermined height position Hvp. The screen indicating that a suction error has occurred is a screen that displays the text "Suction Error Occurred" on the display unit 11.

[0111] This operation to acquire the amount of upward movement is performed only once. The acquired correction value Vc is stored in the memory unit 10b. After the operation to acquire the amount of upward movement, the correction push-up short pin 633b is replaced with the mounting push-up short pin 633a, and then the mounting of the semiconductor chip Ch onto the substrate Sb begins. Here, the control unit 10 is configured to perform control to correct the reference pin lowering position Hcd based on the addition of the correction value Vc to the reference pin lowering position Hcd when mounting the semiconductor chip Ch onto the substrate Sb. As a result, the reference movement amount Mc is corrected to the amount of upward movement Ms.

[0112] (Process to obtain upward movement amount) Referring to Figure 18, the process of acquiring the amount of upward movement performed by the control unit 10 on the non-mountable chip Cb based on the upward movement acquisition program will be described below.

[0113] The following description will focus on the case where a corrective long-up pin 632b (or corrective short-up pin 633b) is attached to the upright head 62 located on the X1 side among the multiple upright heads 62. Alternatively, the corrective long-up pin 632b (or corrective short-up pin 633b) may be attached to the upright head 62 located on the X2 side among the multiple upright heads 62. Furthermore, the corrective long-up pin 632b (or corrective short-up pin 633b) may be attached to the upright head 62 located on the X1 side among the multiple upright heads 62, and the corrective long-up pin 632b (or corrective short-up pin 633b) may also be attached to the upright head 62 located on the X2 side among the multiple upright heads 62.

[0114] Furthermore, we will describe the case in which the suction head 73 located on the X1 direction side of the multiple suction heads 73 is used. Note that the suction head 73 located on the X2 direction side of the multiple suction heads 73 may be used, or both of the multiple suction heads 73 may be used.

[0115] As shown in Figure 18, in step S1, the corrective push-up long pin 632b (or corrective push-up short pin 633b) moves to a position below the non-mountable chip Cb. Specifically, as the corrective push-up long pin 632b (or corrective push-up short pin 633b) moves in the X direction by the X direction movement mechanism 64, and the holding part 51 moves in the Y direction, the corrective push-up long pin 632b (or corrective push-up short pin 633b) moves to a position below the non-mountable chip Cb among the multiple semiconductor chips Ch held by the holding part 51.

[0116] In step S2, the suction head 73 moves to a position above the unmountable chip Cb. Specifically, the suction head 73 moves horizontally by the X-direction movement mechanism 74 and the Y-direction movement mechanism 76, thereby moving to a position above the unmountable chip Cb among the multiple semiconductor chips Ch held in the holding unit 51.

[0117] In step S3, the push-up head 62 rises to the upper end position. Specifically, the push-up head 62 is raised to the upper end position of the holding part 51 by the cylinder 65. In step S4, the suction head 73 descends to the reference surface height position Hw. Specifically, the lower end of the suction head 73 descends until it reaches the reference surface height position Hw. In step S5, the suction head 73 rises toward a predetermined height position Hvp. Specifically, the lower end of the suction head 73 rises until it reaches the predetermined height position Hvp.

[0118] In step S6, the corrective upward-extending long pin 632b (or corrective upward-extending short pin 633b) rises toward a predetermined height position Hvp. Specifically, the corrective upward-extending long pin 632b (or corrective upward-extending short pin 633b) moves in the Z1 direction by the Z direction movement mechanism 66.

[0119] In step S7, it is determined whether the negative pressure of the suction head 73 has exceeded a threshold. Specifically, it is determined whether the negative pressure of the suction head 73, as measured by the negative pressure measurement unit 77, has exceeded a threshold. If the negative pressure is above the threshold, the process proceeds to step S8, where a correction value Vc is obtained and stored in the storage unit 10b, after which the lifting movement amount acquisition process is completed. If the negative pressure is below the threshold, the process proceeds to step S9.

[0120] In step S9, it is determined whether the upward movement amount Ml (or upward movement amount Ms) of the corrective upward-extending long pin 632b (or corrective upward-extending short pin 633b) has exceeded a predetermined movement distance. If the upward movement amount Ml (or upward movement amount Ms) of the corrective upward-extending long pin 632b (or corrective upward-extending short pin 633b) is less than the predetermined movement distance, the process returns to step S7. If the upward movement amount Ml (or upward movement amount Ms) of the corrective upward-extending long pin 632b (or corrective upward-extending short pin 633b) is greater than or equal to the predetermined movement distance, the process proceeds to step S10, where the suction error is displayed on the display unit 11, and then the upward movement amount acquisition process ends.

[0121] Here, the predetermined travel distance is, for example, a distance that exceeds the maximum value of the expected upward thrusting amount Ml (or upward thrusting amount Ms). Furthermore, the upward thrusting amount Ml (or upward thrusting amount Ms) of the corrective upward thrusting long pin 632b (or corrective upward thrusting short pin 633b) is obtained based on the output signal of the drive source (servo motor) of the Z-direction movement mechanism 66 of the upward thrusting section 6.

[0122] (Effects of this embodiment) In this embodiment, the following effects can be obtained.

[0123] In this embodiment, as described above, the semiconductor chip mounting apparatus 100 includes a control unit 10 configured to perform control to acquire the amount Ml (or Ms) of upward movement of the corrective upward-pushing long pin 632b (or corrective upward-pushing short pin 633b) when the unmountable chip Cb is picked up by the suction head 73, based on the height position of the lower end of the suction head 73 which is spaced above the unmountable chip Cb, by pushing up the unmountable chip Cb with the corrective upward-pushing long pin 632b (or corrective upward-pushing short pin 633b). This makes it possible to obtain the upward movement amount Ml (or Ms) of the corrective upward-pushing long pin 632b (or corrective upward-pushing short pin 633b), thus reducing the time required to obtain the upward movement amount Ml (or Ms) of the corrective upward-pushing long pin 632b (or corrective upward-pushing short pin 633b) in a single upward movement amount acquisition operation compared to repeatedly performing the upward movement amount acquisition operation to obtain the upward movement amount Ml (or Ms) of the corrective upward-pushing long pin 632b (or corrective upward-pushing short pin 633b) when the unmountable chip Cb that has been pushed up by the corrective upward-pushing long pin 632b (or corrective upward-pushing short pin 633b) is picked up by the suction head 73.

[0124] Furthermore, in this embodiment, as described above, the control unit 10 is configured to perform control to acquire the amount Ml (Ms) of upward movement of the corrective upward-pushing long pin 632b (or corrective upward-pushing short pin 633b) based on the negative pressure of the suction head 73 exceeding a threshold value. This makes it possible to accurately acquire the position where the non-mountable chip Cb is attracted to the suction head 73, and thus the amount Ml (or Ms) of upward-pushing long pin 632b (or corrective upward-pushing short pin 633b) can be accurately acquired in a single operation without having to repeatedly perform the upward-pushing-movement acquisition operation.

[0125] Furthermore, in this embodiment, as described above, the wafer adsorption unit 7 includes a negative pressure measuring unit 77 that measures the negative pressure of the adsorption head 73 both when pushing up an unmountable chip Cb using a corrective push-up long pin 632b (or corrective push-up short pin 633b) based on the height position of the lower end of the adsorption head 73, and when mounting each of the multiple semiconductor chips Ch onto the substrate Sb. This makes it possible to suppress an increase in the number of sensors that measure the negative pressure of the adsorption head 73.

[0126] Furthermore, in this embodiment, as described above, the control unit 10 is configured to perform control to acquire a correction value Vc that corrects the reference movement amount Mc to the upward movement amount Ml (Ms) of the corrective push-up long pin 632b (or corrective push-up short pin 633b), which has a different length from the reference length pin 631. As a result, the reference movement amount Mc is corrected based on the correction value Vc, so that the corrective push-up long pin 632b (or corrective push-up short pin 633b) can be raised to the same height position as the reference length pin 631. This makes it possible to align the height position of the upper end 63a of the reference length pin 631 with the height position of the upper end 63a of the corrective push-up long pin 632b (or corrective push-up short pin 633b) when the semiconductor chip Ch adsorbed on the suction head 73 is detached from the sheet member Ws. As a result, it is possible to suppress errors such as when the semiconductor chip Ch does not rise despite raising the corrective push-up short pin 633b due to the difference in length with the reference length pin 631, and when the corrective push-up long pin 632b rises to a higher position than the reference length pin 631 when it is raised.

[0127] Furthermore, in this embodiment, as described above, the control unit 10 is configured to perform control to acquire a correction value Vc based on the difference between the upward movement amount Ml(Ms) of the corrective upward-extending long pin 632b (or corrective upward-extending short pin 633b) and the reference movement amount Mc of the reference length pin 631. As a result, the correction value Vc can be acquired simply by calculating the difference between the upward movement amount Ml(Ms) of the corrective upward-extending long pin 632b (or corrective upward-extending short pin 633b) and the reference movement amount Mc of the reference length pin 631, thus simplifying the process for acquiring the correction value Vc.

[0128] Furthermore, in this embodiment, as described above, the control unit 10 is configured to perform control to acquire a correction value Vc based on the difference between the upward movement amount Ms of the corrective push-up short pin 633b, which is shorter than the reference length pin 631, and the reference movement amount Mc. As a result, the reference movement amount Mc is corrected based on the correction value Vc, so that the mounting push-up short pin 633a can be raised to the same height position as the reference length pin 631. This makes it possible to align the height position of the upper end 63a of the reference length pin 631 with the height position of the upper end 63a of the mounting push-up short pin 633a when the semiconductor chip Ch adsorbed by the suction head 73 is detached from the sheet member Ws. As a result, it is possible to suppress the occurrence of errors in which the semiconductor chip Ch does not rise even though the mounting push-up short pin 633a has been raised, due to the difference in length with the reference length pin 631.

[0129] Furthermore, in this embodiment, as described above, the control unit 10 is configured to perform control to acquire a correction value Vc based on the difference between the upward movement amount Ml of the correction push-up length pin 632b, which is longer than the reference length pin 631, and the reference movement amount Mc. As a result, the reference movement amount Mc is corrected based on the correction value Vc, so that the mounting push-up length pin 632a can be raised to the same height position as the reference length pin 631. This makes it possible to align the height position of the upper end 63a of the reference length pin 631 with the height position of the upper end 63a of the mounting push-up length pin 632a when the semiconductor chip Ch adsorbed by the suction head 73 is detached from the sheet member Ws. As a result, it is possible to suppress the occurrence of errors in which the mounting push-up length pin 632a rises to a higher position than the reference length pin 631 when the mounting push-up length pin 632a is raised due to the difference in length with the reference length pin 631.

[0130] Furthermore, in this embodiment, as described above, the control unit 10 is configured to perform control to acquire a correction value Vc based on the fact that, after moving the lower end of the suction head 73 to a predetermined height position Hvp which is the height position of the lower end of the suction head 73 spaced above the surface of the non-mountable chip Cb, the correction push-up long pin 632b (or correction push-up short pin 633b) is moved upward to adsorb the non-mountable chip Cb onto the suction head 73. As a result, the reference movement amount Mc is corrected based on the correction value Vc, so that the height position of the upper end 63a of the reference length pin 631 and the height position of the upper end 63a of the correction push-up long pin 632b (or correction push-up short pin 633b) when the semiconductor chip Ch adsorbed onto the suction head 73 is peeled off from the sheet member Ws can be aligned to the predetermined height position Hvp, thereby suppressing the occurrence of errors when peeling off the semiconductor chip Ch caused by the difference in length with the reference length pin 631.

[0131] Furthermore, in this embodiment, as described above, the predetermined height position Hvp is a height position above the preset reference upward end position Hvu of the lower end of the suction head 73 when it moves upward while holding the non-mountable chip Cb with the reference length pin 631 and the suction head 73. This allows the correction value Vc used to correct the reference movement amount Mc to be increased by the difference between the reference upward end position Hvu and the predetermined height position Hvp. As a result, when the upward movement amount Ml becomes smaller than the reference movement amount Mc by the amount of the correction value Vc, the height position of the upper end 63a of the push-up length pin 632 when the semiconductor chip Ch adsorbed on the suction head 73 peels off from the sheet member Ws can be lowered, thereby suppressing interference between the relatively long push-up length pin 632 and the suction head 73. Furthermore, if the upward movement amount Ms becomes larger than the reference movement amount Mc by the amount of the correction value Vc, the height position of the upper end 63a of the push-up short pin 633 when the semiconductor chip Ch adsorbed on the adsorption head 73 peels off from the sheet member Ws can be raised, so that the semiconductor chip Ch can be reliably raised to the reference upward end position Hvu by the relatively short push-up short pin 633.

[0132] Furthermore, in this embodiment, as described above, the control unit 10 is configured to move the lower end of the suction head 73 to a preset reference surface height position Hw on the surface of the wafer Wf, and then to a predetermined height position Hvp. As a result, the same movement of the suction head 73 when holding the semiconductor chip Ch and peeling it off the sheet member Ws by the upward push-up of the push-up pin 63 from below and the upward suction of the suction head 73 from above is performed when acquiring the correction value Vc. Therefore, the control process for moving the suction head 73 when holding the semiconductor chip Ch and peeling it off the sheet member Ws can be directly applied to the movement of the suction head 73 when acquiring the correction value Vc. As a result, the control process can be easily changed, thus reducing the workload on the user when changing the movement of the suction head 73.

[0133] Furthermore, in this embodiment, as described above, the unmountable chip Cb includes unmountable chip Cb from among the multiple semiconductor chips Ch that do not meet the conditions for being mountable on the substrate Sb. The control unit 10 is configured to perform control to acquire a correction value Vc based on the fact that the unmountable chip Cb is pushed up by the correction push-up long pin 632b (or correction push-up short pin 633b) in accordance with the height position of the lower end of the suction head 73. As a result, even if a part of the unmountable chip Cb is unexpectedly chipped due to the push-up of the correction push-up long pin 632b when acquiring the correction value Vc, the unmountable chip Cb will not be mounted on the substrate Sb, so the semiconductor chip Ch can be mounted on the substrate Sb without having to replenish the semiconductor chip Ch that is necessary when mounting on the substrate Sb. As a result, delays in starting the semiconductor chip Ch mounting work on the substrate Sb due to the replenishment of semiconductor chip Ch can be avoided.

[0134] [Differentiation] It should be noted that the embodiments disclosed herein are illustrative and not restrictive in all respects. The scope of the present invention is indicated by the claims rather than by the description of the embodiments above, and further includes all modifications (exceptions) within the meaning and scope of the claims.

[0135] For example, in the above embodiment, the program for acquiring the amount of upward movement is shown to be executed when the first substrate Sb is loaded into the semiconductor chip mounting apparatus 100 after replacing the upward-pushing pin 63 attached to the upward-pushing head 62 with an upward-pushing long pin 632 or an upward-pushing short pin 633, but the present invention is not limited to this. In the present invention, the program for acquiring the amount of upward movement may be executed while semiconductor chips are being mounted on the substrate.

[0136] Furthermore, in the above embodiment, the semiconductor chip Ch that is pushed up by the correction push-up long pin 632b or the correction push-up short pin 633b (predetermined push-up pin) when acquiring the correction value Vc is shown as an example of an unmountable chip Cb among a plurality of semiconductor chips Ch that does not meet the conditions for being mountable on the substrate Sb, but the present invention is not limited to this. In the present invention, the semiconductor chip that is pushed up by the predetermined push-up pin when acquiring the correction value may be a mountable chip among a plurality of semiconductor chips that meets the conditions for being mountable on the substrate.

[0137] Furthermore, in the above embodiment, the control unit 10 is configured to perform control to acquire a correction value Vc based on the fact that, after moving the lower end of the suction head 73 to a reference surface height position Hw, then moving the lower end of the suction head 73 to a predetermined height position Hvp, and then moving the correction push-up long pin 632b or correction push-up short pin 633b (predetermined push-up pin) upward to pick up the unmountable chip Cb (predetermined chip) on the suction head 73, but the present invention is not limited to this. In the present invention, the control unit may be configured to perform control to acquire a correction value based on the fact that, after moving the lower end of the suction head directly to a predetermined height position without moving it to the reference surface height position, and then moving the predetermined push-up pin upward to pick up the predetermined chip on the suction head.

[0138] Furthermore, in the above embodiment, when acquiring the correction value Vc, an example was shown in which a correction push-up long pin 632b or a correction push-up short pin 633b is attached to the push-up head 62 according to the type of semiconductor chip Ch mounted on the substrate Sb, but the present invention is not limited to this. In the present invention, when acquiring the correction value, a mounting push-up long pin or a mounting push-up short pin may be attached to the mounting head according to the type of semiconductor chip mounted on the substrate.

[0139] Furthermore, in the above embodiment, for the sake of explanation, an example was shown in which the control processing of the control unit 10 was explained using a flow-driven flowchart that processes sequentially according to the processing flow, but the present invention is not limited to this. In the present invention, the control processing of the control unit may be performed by event-driven processing that executes processing on an event-by-event basis. In this case, it may be performed as a completely event-driven system, or a combination of event-driven and flow-driven systems may be used. [Explanation of symbols]

[0140] 6. Push-up section 7. Wafer adsorption section 10 Control Unit 62 Upward thrusting head 62a Upper end 63 Push-up pin 63a Upper end 73 Suction Head 77. Negative pressure measurement unit 100 Semiconductor chip mounting equipment 631 Standard length pin 632 Push-up long pin (specified push-up pin) 633 Push-up short pin (specified push-up pin) Cb chip not compatible with this design. CH Semiconductor Chips Hvp predetermined height position Hvu Reference rising end position Hw Reference surface height position Mc standard movement amount Ml Overhead travel amount Ms overhang travel amount Sb substrate Vc correction value Wf wafer Ws Sheet Material

Claims

1. The device includes a push-up head to which predetermined push-up pins corresponding to multiple types of semiconductor chips formed by dividing a wafer attached to a sheet member are interchangeably attached, and a push-up section configured to move the predetermined push-up pins from below to push up a predetermined chip among the multiple semiconductor chips from below, A wafer adsorption unit includes an adsorption head that adsorbs the predetermined chip from above, and is configured to move the adsorption head from below to above in order to detach the predetermined chip from the sheet member, A semiconductor chip mounting apparatus comprising: a control unit configured to maintain the lower end of the suction head at a predetermined height position, based on a predetermined height position of the lower end of the suction head spaced upward from the predetermined chip, push up the predetermined chip with the predetermined push-up pin until the predetermined chip is adsorbed onto the suction head, and to perform control to acquire the amount of upward movement of the predetermined push-up pin when the predetermined chip is adsorbed onto the suction head, based on the fact that the predetermined chip has been adsorbed onto the suction head.

2. The semiconductor chip mounting apparatus according to claim 1, wherein the control unit is configured to perform control to acquire the amount of upward movement of the predetermined upward-pushing pin based on the negative pressure of the suction head becoming greater than or equal to a threshold.

3. The semiconductor chip mounting apparatus according to claim 2, wherein the wafer adsorption unit further comprises a negative pressure measuring unit that measures the negative pressure of the adsorption head both when pushing up the predetermined chip with the predetermined push-up pin based on the height position of the lower end of the adsorption head, and when mounting each of the plurality of semiconductor chips onto a substrate.

4. The semiconductor chip mounting apparatus according to claim 1, wherein the control unit is configured to perform control to acquire a correction value that corrects the reference amount of movement when the predetermined chip is picked up by the pick-up head with a reference length pin housed in the pick-up head with the upper end of the pick-up head positioned substantially flush with the upper end of the pick-up head, to the pick-up amount of movement of the predetermined pick-up pin which is of a different length from the reference length pin.

5. The semiconductor chip mounting apparatus according to claim 4, wherein the control unit is configured to perform control to acquire the correction value based on the difference between the amount of upward movement of the predetermined push-up pin and the reference amount of movement of the reference length pin.

6. The semiconductor chip mounting apparatus according to claim 5, wherein the control unit is configured to perform control to acquire the correction value based on the difference between the amount of upward movement of the short upward pin, which is a predetermined upward pin shorter than the reference length pin, and the reference amount.

7. The semiconductor chip mounting apparatus according to claim 5, wherein the control unit is configured to perform control to acquire the correction value based on the difference between the amount of upward movement of the push-up length pin, which is a predetermined push-up pin that is longer than the reference length pin, and the reference amount.

8. The semiconductor chip mounting apparatus according to claim 4, wherein the control unit is configured to perform control to acquire the correction value based on the fact that the lower end of the suction head is moved to a predetermined height position which is the height position of the lower end of the suction head spaced above the surface of the predetermined chip, and then moves the predetermined push-up pin upward to adsorb the predetermined chip onto the suction head.

9. The semiconductor chip mounting apparatus according to claim 8, wherein the predetermined height position is a height position above a preset reference upward end position of the lower end of the suction head when it moves upward while holding the predetermined chip with the reference length pin and the suction head.

10. The semiconductor chip mounting apparatus according to claim 8, wherein the control unit is configured to move the lower end of the suction head to a preset reference surface height position on the surface of the wafer, and then to move the lower end of the suction head to the predetermined height position.

11. The predetermined chip includes, among the plurality of semiconductor chips, a non-mountable chip that does not meet the conditions for being mountable on a substrate. The semiconductor chip mounting apparatus according to claim 4, wherein the control unit is configured to perform control to acquire the correction value based on the fact that the predetermined chip has been pushed up by the predetermined push-up pin in accordance with the height position of the lower end of the suction head.

Images