Substrate processing system and substrate processing apparatus

Abstract

This invention provides a technology that can improve power efficiency in a substrate processing system. The substrate processing system comprises a flexible member configured to bend due to pressure fluctuations, and a power generation element attached to the flexible member and configured to generate electricity through the bending of the flexible member.

Description

Technical Field

[0001] Exemplary embodiments of the present disclosure relate to a substrate processing system and a substrate processing apparatus.

Background Art

[0002] As a technology in which a substrate processing system includes a vacuum transfer module and a plurality of substrate processing modules, there is a technology described in Patent Document 1.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the substrate processing system as described above, a large amount of power is consumed.

[0005] The present disclosure provides a technology capable of improving power efficiency in a substrate processing system.

Means for Solving the Problems

[0006] A substrate processing system in one exemplary embodiment of the present disclosure includes a flexure member configured to flex by pressure fluctuations, and a power generation element attached to the flexure member and configured to generate power by the flexure of the flexure member.

Advantages of the Invention

[0007] According to one exemplary embodiment of the present disclosure, it is possible to provide a technology capable of improving power efficiency in a substrate processing system.

Brief Description of the Drawings

[0008] [Figure 1]This is a diagram illustrating an example configuration of a substrate processing system. [Figure 2] This is a diagram illustrating an example of a power generation system configuration. [Figure 3] This is a diagram illustrating an example of a load lock module configuration. [Figure 4] This is a diagram illustrating an example configuration of a vacuum transport module. [Figure 5] This is a diagram illustrating an example configuration of a vacuum transport module. [Figure 6] This is a diagram illustrating an example configuration of a plasma processing module. [Figure 7] This is a diagram illustrating an example configuration of a storage module. [Modes for carrying out the invention]

[0009] The embodiments of this disclosure are described below.

[0010] In one exemplary embodiment, a substrate processing system is provided, comprising a flexible member configured to bend in response to pressure fluctuations, and a power generation element attached to the flexible member and configured to generate electricity through the bending of the flexible member.

[0011] In one exemplary embodiment, the substrate processing system includes a chamber, the chamber includes a flexible member.

[0012] In one exemplary embodiment, the chamber has a wall portion, the wall portion includes a flexible member.

[0013] In one exemplary embodiment, the chamber has at least one of an exhaust section or an intake section, and the exhaust section or intake section includes a flexible member.

[0014] In one exemplary embodiment, the flexible member has an outer surface that faces outward from the chamber, and the power generation element is mounted on the outer surface of the flexible member.

[0015] In one exemplary embodiment, the chamber includes a substrate processing chamber.

[0016] In one exemplary embodiment, the substrate processing chamber is a plasma processing chamber that defines a plasma processing space.

[0017] In one exemplary embodiment, the chamber includes a substrate transfer chamber.

[0018] In one exemplary embodiment, the flexure member is configured to be more flexible than the peripheral member.

[0019] In one exemplary embodiment, the flexure member is configured to be more flexible than the peripheral member by being thinner than the peripheral member.

[0020] In one exemplary embodiment, the flexure member is made of a material that is more flexible than the peripheral member.

[0021] In one exemplary embodiment, the substrate processing system includes a first transfer module having a first internal pressure, a second transfer module having a second internal pressure greater than the first internal pressure, a process module connected to the first transfer module, a load lock module interposed between the first transfer module and the second transfer module, and a gate valve disposed between the first transfer module and the process module, and the flexure member and the power generation element are disposed in at least one selected from the group consisting of the first transfer module, the load lock module, the process module, and the gate valve.

[0022] In one exemplary embodiment, the first transfer module is a vacuum transfer module and the second transfer module is an atmospheric transfer module.

[0023] In one exemplary embodiment, the substrate processing system includes a stocker module configured to store consumable parts, and the flexure member and the power generation element are disposed in the stocker module.

[0024] In one exemplary embodiment, the substrate processing system further comprises a battery configured to store electricity generated by a power generation element.

[0025] In one exemplary embodiment, the system comprises a substrate processing chamber configured to define a processing space, a substrate support portion disposed within the substrate processing chamber, a gas supply portion configured to supply gas to the processing space, an exhaust portion configured to exhaust gas from the processing space, a flexible member disposed within the substrate processing chamber and configured to flex due to pressure fluctuations, and a power generation element attached to the flexible member and configured to generate electricity through the flexing of the flexible member. A substrate processing device is provided.

[0026] In one exemplary embodiment, the flexible member is positioned lower than the substrate on the substrate support portion in the substrate processing chamber.

[0027] In one exemplary embodiment, the flexible member is positioned in the exhaust section.

[0028] In one exemplary embodiment, a gas supply unit is configured to supply a processing gas to a processing space, and the substrate processing apparatus further includes a plasma generation unit configured to generate plasma from the processing gas.

[0029] In one exemplary embodiment, the substrate processing apparatus further comprises a battery configured to store electricity generated by a power generation element.

[0030] Hereinafter, each embodiment of this disclosure will be described in detail with reference to the drawings. In each drawing, the same or similar elements are denoted by the same reference numeral, and redundant explanations are omitted. Unless otherwise specified, positional relationships such as top, bottom, left, and right will be described based on the positional relationships shown in the drawings. The dimensional ratios in the drawings do not represent actual ratios, and actual ratios are not limited to those shown.

[0031] <Example of a PCB processing system configuration> Referring to Figure 1, a substrate processing system PS according to one embodiment will be described. Figure 1 is a diagram illustrating an example of the configuration of the substrate processing system PS.

[0032] The substrate processing system PS includes a vacuum transport module TM, process modules PM1 to PM6, stocker modules SM1 and SM2, load lock modules LL1 and LL2, atmospheric transport module LM, load ports LP1 to LP4, aligner AN, and the like.

[0033] The vacuum transfer module TM has a substantially polygonal shape in plan view. Process modules PM1 to PM6 and stocker modules SM1 and SM2 are connected to several sides of the vacuum transfer module TM. Load lock modules LL1 and LL2 are connected to some sides of the vacuum transfer module TM. The vacuum transfer module TM has a vacuum chamber with a vacuum atmosphere, and the vacuum transfer robot TR1 is located inside it.

[0034] The vacuum transport robot TR1 is configured to rotate, extend, and move up and down. Based on the operation instructions output by the control unit CU (described later), the vacuum transport robot TR1 can transport objects such as substrates. For example, the vacuum transport robot TR1 can place and hold an object on the end effector EE1 located at its tip and transport the object between the load lock modules LL1, LL2, process modules PM1 to PM6, and stocker modules SM1 and SM2. The end effector is also called a pick, fork, or transport arm. The end effector EE1 of the vacuum transport robot TR1 may have a U-shaped bifurcated form and be configured to transport an object placed on it.

[0035] The transported objects include, for example, substrates and consumable parts (replacement parts). The substrates may be, for example, semiconductor wafers, dummy wafers, sensor wafers, etc. The consumable parts are components that are replaceably installed within process modules PM1 to PM6 and are consumed as various processes such as plasma processing are performed within process modules PM1 to PM6. The consumable parts may include, for example, components that constitute a ring assembly arranged around the substrate support portion in the plasma processing module, and components that constitute a shower head that supplies processing gas into the plasma processing chamber.

[0036] Process modules PM1 to PM6 are modules for processing substrates. At least one of process modules PM1 to PM6 may be a plasma processing module for plasma processing of substrates. At least one of process modules PM1 to PM6 may be a module for post-processing of substrates. The vacuum transport module TM and each of the process modules PM1 to PM6 are separated by a gate valve GV1 that can be opened and closed.

[0037] The stocker modules SM1 and SM2 are modules for storing consumable parts. In one embodiment, the stocker modules SM1 and SM2 have vacuum chambers with a vacuum atmosphere. The vacuum transport module TM and each stocker module SM1 and SM2 are separated by a gate valve GV2 that can be opened and closed.

[0038] Load lock modules LL1 and LL2 are positioned between the vacuum transport module TM and the atmospheric transport module LM. Load lock modules LL1 and LL2 have internal pressure variable chambers that can be switched between vacuum and atmospheric pressure. When transporting substrates from the atmospheric transport module LM to the vacuum transport module TM, load lock modules LL1 and LL2 can receive the substrates from the atmospheric transport robot TR3 of the atmospheric transport module LM by setting their internal pressure to atmospheric pressure, and then pass the substrates to the vacuum transport robot TR1 of the vacuum transport module TM by setting their internal pressure to atmospheric pressure. Similarly, when transporting substrates from the vacuum transport module TM to the atmospheric transport module LM, load lock modules LL1 and LL2 can receive the substrates from the vacuum transport robot TR1 of the vacuum transport module TM by setting their internal pressure to atmospheric pressure, and then pass the substrates to the atmospheric transport robot TR3 of the atmospheric transport module LM by setting their internal pressure to atmospheric pressure. Each load lock module LL1 and LL2 is separated from the vacuum transport module TM by a gate valve GV3 that can be opened and closed. Each load lock module LL1 and LL2 is separated from the atmospheric transport module LM by a gate valve GV4 that can be opened and closed.

[0039] The atmospheric transport module LM is positioned opposite the vacuum transport module TM, with load lock modules LL1 and LL2 in between. The atmospheric transport module LM may be, for example, an EFEM (Equipment Front End Module). The atmospheric transport module LM is rectangular in shape, equipped with an FFU (Fan Filter Unit), and has an atmospheric chamber for atmospheric air inside. Two load lock modules LL1 and LL2 are connected to one side of the atmospheric transport module LM along its longitudinal direction. Load ports LP1 to LP4 are connected to the other side of the atmospheric transport module LM along its longitudinal direction. An aligner AN is connected to one side of the atmospheric transport module LM along its short direction. Note that the connection position of the aligner AN to the atmospheric transport module LM is not limited to this and can be arbitrarily selected. An atmospheric transport robot TR3 for transporting substrates is located inside the atmospheric transport module LM.

[0040] The atmospheric transport robot TR3 is configured to move along the longitudinal direction of the atmospheric transport module LM, and is also configured to rotate, extend and retract, and move up and down. The atmospheric transport robot TR3 can transport substrates based on operation instructions output by the control unit CU, which will be described later. For example, the atmospheric transport robot TR3 can place and hold a substrate on the end effector EE3 located at its tip, and transport the substrate between the load ports LP1 to LP4, load lock modules LL1 and LL2, and aligner AN.

[0041] Load ports LP1 to LP4 are configured to accommodate multiple containers C. Each container C may contain multiple (e.g., 25) circuit boards. Each container C may be, for example, a Front-Opening Unified Pod (FOUP).

[0042] The aligner AN may be a device that detects the position (orientation and center) of the substrate. The aligner AN may have a rotating support base, an optical sensor (neither of which are shown), etc. The control unit CU may correct the orientation of the substrate based on the detection result by the aligner AN. Based on the detection result by the aligner AN, the control unit CU may correct the position of the end effector EE3 of the air transport robot TR3 when receiving the substrate from the aligner AN so that the center of the substrate is positioned at a predetermined position on the end effector EE3 of the air transport robot TR3.

[0043] The substrate processing system PS is connected to the control unit CU via a communication interface. In one embodiment, part or all of the control unit CU may be included in the substrate processing system PS. The control unit CU may be, for example, a computer. The control unit CU includes a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory), auxiliary storage device, etc. The CPU operates based on a program stored in the ROM or auxiliary storage device and can control various parts of the substrate processing system PS.

[0044] <Example of a power generation system configuration> The substrate processing system PS has a power generation system GS. Figure 2 is a diagram illustrating an example of the configuration of the power generation system GS. In one embodiment, as shown in Figure 2, the power generation system GS comprises a flexible member 300 configured to bend due to pressure fluctuations, a power generation element 301 configured to generate electricity by the bending of the flexible member 300, and a battery 302.

[0045] In one embodiment, the flexible member 300 has a plate shape. The flexible member 300 may be made of a material, have a shape, size, and thickness that enhances its flexibility. The flexible member 300 may be made of resin. The flexible member 300 may have a thickness of 5 mm to 10 mm. The power generation element 301 may be a piezoelectric element. In one embodiment, the power generation element 301 has a first electrode 310, a piezoelectric body 311, and a second electrode 312. The first electrode 310, the piezoelectric body 311, and the second electrode 312 each have a plate shape and are stacked in this order. The first electrode 310 and the second electrode 312 are electrically connected to the battery 302 via wiring 313 and 314.

[0046] The power generation element 301 is attached to the flexible member 300. The first electrode 310 is attached to the flexible member 300 and is in surface contact with it. When the flexible member 300 bends, pressure is applied to the piezoelectric body 311, generating electricity. This electricity is supplied from the first electrode 310 and the second electrode 312 through wiring 313 and 314 to the battery 302 for storage.

[0047] The power generation system GS is positioned in the part of the substrate processing system PS where pressure fluctuations occur. The power generation system GS is positioned in one or more locations within the substrate processing system PS.

[0048] <Example of GS power generation system layout> In one embodiment, the power generation system GS is positioned on load lock modules LL1 and LL2.

[0049] In one embodiment, as shown in Figure 3, the load lock modules LL1 and LL2 include a chamber 400, a substrate support portion 401 disposed within the chamber 400, a lifting portion 402 for raising and lowering the substrate W on the substrate support portion 401, an exhaust portion 403, and an air supply portion 404.

[0050] Chamber 400 defines a variable-pressure space within which the internal pressure can be switched between vacuum and atmospheric pressure. The substrate support section 401 has a thick plate shape. The lifting section 402 has a lift pin that penetrates the substrate support section 401 in the vertical direction and moves up and down. The exhaust section 403 is configured to create a vacuum inside the chamber 400 by exhausting the atmosphere inside the chamber 400. The supply section 404 is configured to create atmospheric pressure inside the chamber 400 by supplying gas into the chamber 400. A transport port 400b for transporting substrates to the vacuum transport module TM is formed in the side wall section 400a of the chamber 400. A transport port 400c for transporting substrates to the atmospheric transport module LM is formed in the other side wall section 400a of the chamber 400. As shown in Figure 1, the transport ports 400b and 400c are arranged to face each other. The transport port 400b is opened and closed by gate valve GV3, and the transport port 400c is opened and closed by gate valve GV4.

[0051] In one embodiment, as shown in Figure 2, the flexible member 300 is positioned on the side wall portion 400a of the chamber 400. The chamber 400 has a side wall portion 400a that is thinner than the surrounding portion, and the flexible member 300 is composed of this thinner side wall portion 400a. The flexible member 300 has an outer surface that faces outward from the chamber 400, and the power generation element 301 is attached to the outer surface of the flexible member 300. When substrates are loaded into or unloaded from the load lock modules LL1 and LL2, the inside of the chamber 400 of the load lock modules LL1 and LL2 becomes a vacuum or atmospheric pressure. At this time, the pressure inside the chamber 400 fluctuates, causing the flexible member 300 to bend, and power is generated by the power generation element 301. The flexible member 300 may be positioned on the ceiling wall portion (top portion) or the bottom wall portion (bottom portion) of the chamber 400. The flexible members 300 may be arranged at multiple locations within the chamber 400.

[0052] In one embodiment, the power generation system GS is located in the vacuum transport module TM.

[0053] In one embodiment, as shown in Figure 4, the vacuum transfer module TM includes a vacuum transfer chamber 500, a vacuum transfer robot TR1 disposed within the vacuum transfer chamber 500, an exhaust unit 501, and an air supply unit 502.

[0054] In one embodiment, as shown in Figures 4 and 5, the vacuum transfer chamber 500 has a substantially rectangular parallelepiped shape. The vacuum transfer chamber 500 defines a vacuum space inside which the vacuum is adjusted to a vacuum. A transfer port 510 for transferring substrates to process modules PM1 to PM6 is formed in the side wall portion (side wall portion) 500a of the vacuum transfer chamber 500. The transfer port 510 is opened and closed by a gate valve GV1. A transfer port 511 for transferring consumable parts to stocker modules SM1 and SM2 is formed in another side wall portion 500a of the vacuum transfer chamber 500. The transfer port 511 is opened and closed by a gate valve GV2. A transfer port 512 for transferring substrates to load lock modules LL1 and LL2 is formed in yet another side wall portion 500a of the vacuum transfer chamber 500. The transfer port 512 is opened and closed by a gate valve GV3.

[0055] In one embodiment, the ceiling wall (top section) 500b of the vacuum transfer chamber 500 has a plurality of windows 520 for visually inspecting the inside of the vacuum transfer chamber 500 from the outside. The windows 520 may be made of a material that is more flexible than the surrounding portion of the top section 500b. The windows 520 may be made of transparent resin. The surrounding portion may be made of metal. The windows 520 may be thinner than the surrounding portion of the top section 500b.

[0056] The exhaust unit 501 is configured to create a vacuum inside the vacuum transfer chamber 500 by exhausting the atmosphere inside the chamber 500. The supply unit 502 is configured to supply an inert gas, such as nitrogen gas, into the chamber 500.

[0057] In one embodiment, the flexible member 300 is positioned on the top 500b of the vacuum transfer chamber 500. Part of the window 520 of the top 500b may be the flexible member 300. The power generation element 301 is attached to the upper surface of the flexible member 300. When the gate valves GV1, GV2, and GV3 are opened in the vacuum transfer module TM, the pressure inside the vacuum transfer chamber 500 fluctuates and is adjusted to a vacuum by the exhaust section 501. The flexible member 300 flexes due to this pressure fluctuation, and power is generated by the power generation element 301. The flexible member 300 may be positioned on the side wall 500a or the bottom wall (bottom) of the vacuum transfer chamber 500. The flexible member 300 may be positioned at multiple locations in the vacuum transfer chamber 500.

[0058] In one embodiment, the power generation system GS is located in process modules PM1 to PM6. At least one of the process modules PM1 to PM6 may be a plasma processing module 700. The plasma processing module 700 is an example of a substrate processing apparatus.

[0059] In one embodiment, as shown in Figure 6, the plasma processing module 700 includes a plasma processing chamber 800, a substrate support section 801, a gas supply section 802, a plasma generation section 803, and an exhaust section 804. The plasma processing chamber 800 is an example of a substrate processing chamber. The plasma processing chamber 800 defines a plasma processing space 800s inside it. The substrate support section 801 is located inside the plasma processing chamber 800. In one embodiment, the substrate support section 801 includes a base 810, an electrostatic chuck 811 for electrostatically adsorbing the substrate, and an edge ring 812 positioned around the substrate on the electrostatic chuck 811.

[0060] The gas supply unit 802 is configured to supply processing gas into the plasma processing chamber 800.

[0061] The plasma processing chamber 800 has a shower head 820 that introduces at least one processing gas from the gas supply unit 802 into the plasma processing chamber 800.

[0062] In one embodiment, the plasma generation unit 803 is configured to supply at least one RF signal (RF power) to at least one lower electrode and / or at least one upper electrode. In one embodiment, the lower electrode may consist of at least a part of the substrate support unit 801, and the upper electrode may consist of at least a part of the shower head 820.

[0063] The exhaust unit 804 is configured to create a vacuum inside the plasma processing chamber 800 by exhausting the atmosphere inside the plasma processing chamber 800. The exhaust unit 804 may have a gas outlet 800b provided in the lower wall (bottom) 800e of the plasma processing chamber 800.

[0064] In one embodiment, the flexible member 300 is positioned on the side wall portion (side wall portion) 800a of the plasma processing chamber 800. The flexible member 300 may be positioned on the side wall portion 800a near the gas outlet 800b at a position lower than the substrate W on the electrostatic chuck 811. The chamber 800 has a side wall portion 800a that is thinner than the surrounding portion, and the flexible member 300 may be made of this thin side wall portion 800a. The power generation element 301 is attached to the outer surface of the flexible member 300. When a substrate is transported into the plasma processing chamber 800 of the plasma processing module 700, or when the substrate is plasma processed, the pressure inside the plasma processing chamber 800 fluctuates. This pressure fluctuation causes the flexible member 300 to flex, and power is generated by the power generation element 301. The flexible member 300 may also be positioned on the ceiling wall portion (top portion) or bottom portion 800e of the plasma processing chamber 800. The flexible members 300 may be arranged at multiple locations within the plasma processing chamber 800.

[0065] Furthermore, at least one of the process modules PM1 to PM6 is not limited to the plasma processing module 700, but may be another substrate processing module for processing substrates. The substrate processing module may be equipped with a heating plate for heating the substrate. The substrate processing module may have the same functions as the plasma processing module 700. The vacuum transport module TM and the atmospheric transport module LM may be transport modules having internal pressures other than vacuum and atmospheric pressure. Also, the transport module may be a transport module having a gas atmosphere such as nitrogen.

[0066] In one embodiment, the power generation system GS is located in the stocker modules SM1 and SM2.

[0067] In one embodiment, as shown in Figure 7, the storage modules SM1 and SM2 include a chamber 900, a container mounting section 901, a lifting section 902 for raising and lowering the container mounting section 901, an exhaust section 903, and an air supply section 904.

[0068] Chamber 900 defines a vacuum space within which a vacuum is maintained. A transport port 900b is formed in the side wall portion 900a of chamber 900 for transporting consumable parts K to the vacuum transport module TM. The transport port 900b is opened and closed by a gate valve GV2. A door 900c is formed in the other side wall portion 900a of chamber 900 for loading and unloading containers L from the outside.

[0069] The container mounting section 901 is located inside the chamber 900. The container mounting section 901 is configured to accommodate a container L for storing consumable parts K. The container L is configured to store multiple consumable parts K in multiple vertical rows. The lifting section 902 has a motor 910 located outside the chamber 900 and a ball screw 911 extending vertically inside the chamber 900. The container mounting section 901 is attached to the ball screw 911. The container mounting section 901 is configured to move up and down along the ball screw 911 by the motor 910. The lifting section 902 can move the container mounting section 901 up and down to adjust the height of each consumable part K inside the container L to the height of the transport opening 900b.

[0070] The exhaust unit 903 is configured to create a vacuum inside the chamber 900 by exhausting the atmosphere inside the chamber 900. The supply unit 904 is configured to supply an inert gas, such as nitrogen gas, into the chamber 900.

[0071] In one embodiment, the flexible member 300 is positioned on the side wall portion 900a of the chamber 900. The chamber 900 has a side wall portion 900a that is thinner than the surrounding portion, and the flexible member 300 may be made of this thinner side wall portion 900a. The power generation element 301 is attached to the outer surface of the flexible member 300. When containers L are loaded into or out of the chambers 900 of the stocker modules SM1 and SM2, or when consumable parts K are transported to the vacuum transport module TM, the pressure inside the chamber 900 fluctuates. This pressure fluctuation causes the flexible member 300 to flex, and power is generated by the power generation element 301. The flexible member 300 may be positioned on the ceiling wall portion (top portion) or the bottom wall portion (bottom portion) of the chamber 900. The flexible member 300 may be positioned at multiple locations in the chamber 900.

[0072] The battery 302 shown in Figure 2 may be located in a module of the substrate processing system PS. The battery 302 may be located in the space formed beneath the vacuum transport module TM. One or more batteries 302 may be located in the substrate processing system PS.

[0073] The control unit CU shown in Figure 1 may supply power stored in the battery 302 to the electrical equipment of the substrate processing system PS. The electrical equipment may include sensors, valves, pumps, motors, lamps, etc., used in the vacuum transport module TM, process modules PM1 to PM6, load lock modules LL1 and LL2, atmospheric transport module LM, and stocker modules SM1 and SM2, etc.

[0074] <An example of substrate processing> An example of substrate processing performed in the substrate processing system PS shown in Figure 1 will be described. In one embodiment, substrate processing is performed by the control unit CU. Substrates contained in containers C of load ports LP1 to LP4 are transported into the chambers 400 of load lock modules LL1 and LL2 by the atmospheric transport robot TR3 of the atmospheric transport module LM. At this time, the pressure inside the chambers 400 of load lock modules LL1 and LL2 is adjusted to atmospheric pressure. Next, the pressure inside the chambers 400 of load lock modules LL1 and LL2 is adjusted to a vacuum. Pressure adjustment inside the chambers 400 at this time is performed by the exhaust unit 403 and the supply unit 404. Then, the substrates in load lock modules LL1 and LL2 are transported into the vacuum transport chamber 500 of the vacuum transport module TM by the vacuum transport robot TR1 of the vacuum transport module TM. The pressure inside the vacuum transport chamber 500 of the vacuum transport module TM is regulated to a vacuum. Pressure adjustment inside the vacuum transport chamber 500 is performed by the exhaust unit 501. Subsequently, the substrate is transported by the vacuum transport robot TR1 through the vacuum transport chamber 500 to at least one of the process modules PM1 to PM6.

[0075] For example, the substrate is transported to the plasma processing module 700, which is one of the process modules PM1 to PM6. In the plasma processing module 700 shown in Figure 6, plasma processing is performed on the substrate.

[0076] The plasma treatment includes an etching process in which a film on a substrate W is etched using plasma. First, the substrate W is transported into the plasma treatment chamber 800 by a vacuum transport robot TR1, placed on a substrate support section 801 by a lifter, and held in place by suction on the substrate support section 801.

[0077] Next, plasma is generated in the plasma processing space 800s by the plasma generation unit 803. At this time, the gas supply unit 802 supplies processing gas to the plasma processing space 800s via the shower head 820. The processing gas supplied at this time includes a gas that generates active species necessary for etching the substrate W. The atmosphere in the plasma processing space 800s is exhausted by the exhaust unit 804, and the inside of the plasma processing chamber 800 is reduced to a vacuum. Then, an RF signal is supplied from the plasma generation unit 803 to the upper electrode and / or lower electrode, and plasma is generated from the processing gas in the plasma processing space 800s. In this way, the substrate W is etched.

[0078] Once the plasma processing is complete, the substrate is removed from the plasma processing chamber 800 of the plasma processing module 700 by the vacuum transfer robot TR1 of the vacuum transfer module TM shown in Figure 1. The substrate is then transported by the vacuum transfer robot TR1 through the vacuum transfer chamber 500 of the vacuum transfer module TM to the load lock modules LL1 and LL2. Alternatively, the substrate is transported by the vacuum transfer robot TR1 through the vacuum transfer chamber 500 of the vacuum transfer module TM to other process modules PM1 to PM6, where processing takes place, and then the substrate is transported to the load lock modules LL1 and LL2. At this time, the chambers 400 of the load lock modules LL1 and LL2 are set to a vacuum. Next, the chambers 400 of the load lock modules LL1 and LL2 are set to atmospheric pressure. Finally, the substrate is transported from the load lock modules LL1 and LL2 through the atmospheric transfer module LM to the containers C of the load ports LP1 to LP4 by the atmospheric transfer robot TR3 of the atmospheric transfer module LM.

[0079] In the substrate processing system PS, when replacing consumable parts, for example, the consumable parts of the plasma processing module 700 are unloaded from the plasma processing chamber 800 by the vacuum transport robot TR1 of the vacuum transport module TM. The consumable parts may be edge rings 812. The vacuum transport robot TR1 transports the consumable parts through the vacuum transport chamber 500 of the vacuum transport module TM into the chambers 900 of the stocker modules SM1 and SM2. As shown in Figure 7, the consumable parts are stored in the container L of the container mounting section 901 within the chamber 900. At this time, the chambers 900 of the stocker modules SM1 and SM2 are regulated to a vacuum. Pressure adjustment within the chamber 900 is performed by the exhaust section 903.

[0080] Then, the vacuum transport robot TR1 of the vacuum transport module TM unloads the new consumable parts of the container L in the container mounting section 901 from inside the chamber 900. As shown in Figure 1, the vacuum transport robot TR1 transports the consumable parts through the vacuum transport chamber 500 of the vacuum transport module TM into the plasma processing chamber 800 of the plasma processing module 700, where they are placed in a predetermined position. Note that the consumable parts are not limited to the parts of process modules PM1 to PM6, but may be other parts of the substrate processing system PS.

[0081] According to this exemplary embodiment, the substrate processing system PS includes a flexible member 300 configured to bend due to pressure fluctuations, and a power generation element 301 configured to generate electricity through the bending of the flexible member 300. This allows power generation to be performed using the pressure fluctuations that occur in the substrate processing system PS, thereby improving the power efficiency of the substrate processing system PS.

[0082] In this exemplary embodiment, since the walls of the chambers 400, 500, 800, and 900 of the substrate processing system PS include flexible members 300, the flexible members 300 can effectively capture and flex vibrations and deformations of the chambers, pressure fluctuations inside the chambers, etc., thereby enabling effective power generation by the power generation element 301.

[0083] In this exemplary embodiment, the flexible member 300 has an outer surface that faces outward from the chamber 400, and the power generation element 301 is attached to the outer surface of the flexible member 300, so that the power generation element 301 can be easily attached and wired.

[0084] In this exemplary embodiment, since the chambers 400, 500, 800, and 900 include at least one of an exhaust section or an air intake section, pressure fluctuations are likely to occur within the chamber, the flexible member 300 will bend more easily, and the power generation element 301 will be able to generate electricity effectively.

[0085] In this exemplary embodiment, the flexible member 300 is configured to be more flexible than the surrounding members, so that the flexible member 300 can bend more easily, and power generation by the power generation element 301 can be performed effectively.

[0086] In this exemplary embodiment, the flexible member 300 and the power generation element 301 are arranged in the load lock modules LL1 and LL2, the vacuum transport module TM, the process modules PM1 to PM6, and the stocker modules SM1 and SM2.

[0087] In load lock modules LL1 and LL2, the pressure fluctuates significantly because the vacuum and atmospheric pressure switch each time a substrate is transported. By arranging the flexible member 300 and the power generation element 301 in load lock modules LL1 and LL2, power generation can be effectively performed by the power generation element 301.

[0088] The vacuum transport module TM is pressure-regulated to a vacuum. In the vacuum transport module TM, the pressure fluctuates frequently when substrates are transported to process modules PM1-PM6 or load lock modules LL1 and LL2, or when consumable parts are transported to stocker modules SM1 and SM2. By arranging the flexible member 300 and the power generation element 301 in the vacuum transport module TM, power generation can be effectively performed by the power generation element 301.

[0089] In process modules PM1 to PM6, the pressure is adjusted to a predetermined level when the substrate is processed. Pressure also fluctuates when the substrate is transported to the vacuum transport module TM. In particular, the plasma processing module 700 experiences significant pressure fluctuations because the pressure is reduced to a vacuum during plasma processing. By arranging the flexible member 300 and the power generation element 301 in process modules PM1 to PM6, power generation can be effectively achieved by the power generation element 301.

[0090] In the storage modules SM1 and SM2, the atmosphere is controlled to prevent contaminants from entering, and the pressure fluctuates frequently. By arranging the flexible member 300 and the power generation element 301 in the storage modules SM1 and SM2, power generation can be effectively performed by the power generation element 301.

[0091] In this exemplary embodiment, the substrate processing system PS is equipped with a battery 302, so that the generated electricity can be stored and used.

[0092] In this exemplary embodiment, in the plasma processing module 700, the flexible member 300 is positioned lower than the substrate on the substrate support portion 801 in the plasma processing chamber 800, thereby preventing the generation of particles due to the bending of the flexible member 300 from contaminating the substrate.

[0093] In the above embodiments, the flexible member 300 and the power generation element 301 may be placed in other parts of the PS of the substrate processing system. The flexible member 300 and the power generation element 301 may be placed in parts of the PS of the substrate processing system where pressure fluctuations are large, such as walls or windows separating vacuum and atmospheric pressure. For example, the flexible member 300 and the power generation element 301 may be placed in gate valve GV1. The flexible member 300 and the power generation element 301 may be placed in gate valve GV2, gate valve GV3, or gate valve GV4.

[0094] Embodiments of this disclosure further include the following embodiments:

[0095] (Note 1) A substrate processing system, A flexible member configured to bend due to pressure fluctuations, The system comprises a power generation element attached to the flexible member and configured to generate electricity through the bending of the flexible member, PCB processing system.

[0096] (Note 2) The substrate processing system includes a chamber, The chamber includes the flexible member, The substrate processing system described in Appendix 1.

[0097] (Note 3) The chamber has a wall portion, The wall portion includes the flexible member, The substrate processing system described in Appendix 2.

[0098] (Note 4) The chamber has at least one of an exhaust section or an air intake section. The exhaust section or the air intake section includes the flexible member, A substrate processing system as described in Appendix 2 or 3.

[0099] (Note 5) The flexible member has an outer surface that is positioned to face outward from the chamber, The power generation element is attached to the outer surface of the flexible member. A substrate processing system as described in any one of the items 2 to 4 of the appendix.

[0100] (Note 6) The chamber includes a substrate processing chamber. A substrate processing system as described in any one of the items 2 to 5 of the appendix.

[0101] (Note 7) The substrate processing chamber is a plasma processing chamber that defines the plasma processing space. The substrate processing system described in Appendix 6.

[0102] (Note 8) The chamber includes a substrate transport chamber, A substrate processing system as described in any one of the items 2 to 7 of the appendix.

[0103] (Note 9) The aforementioned flexible member is configured to have higher flexibility than the surrounding members. A substrate processing system as described in any one of the appendices 1 to 8.

[0104] (Note 10) The aforementioned flexible member is configured to be thinner than the surrounding member so that it is more flexible than the surrounding member. The substrate processing system described in Appendix 9.

[0105] (Note 11) The aforementioned flexible member is made of a material that is more flexible than the surrounding member. The substrate processing system described in Appendix 9.

[0106] (Note 12) The substrate processing system is A first transport module having a first internal pressure, A second transport module having a second internal pressure greater than the first internal pressure, A process module connected to the first transport module, A load lock module interposed between the first transport module and the second transport module, The system comprises a gate valve positioned between the first transport module and the process module, The flexible member and the power generation element are arranged in at least one selected from the group consisting of the first transport module, the load lock module, the process module, and the gate valve. A substrate processing system as described in any one of the appendices 1 to 11.

[0107] (Note 13) The first transport module is a vacuum transport module, The second transport module is an atmospheric transport module. The substrate processing system described in Appendix 12.

[0108] (Note 14) The substrate processing system includes a stocker module configured to store consumable parts, The flexible member and the power generation element are arranged in the stocker module. A substrate processing system as described in any one of the appendices 1 to 13.

[0109] (Note 15) The substrate processing system further comprises a battery configured to store the electricity generated by the power generation element. A substrate processing system as described in any one of the appendices 1 to 14.

[0110] (Note 16) A substrate processing chamber configured to define the processing space, A substrate support unit arranged within the substrate processing chamber, A gas supply unit configured to supply gas to the processing space, An exhaust unit configured to exhaust the gas from the processing space, A flexible member is placed in the substrate processing chamber and is configured to bend due to pressure fluctuations, The system comprises a power generation element attached to the flexible member and configured to generate electricity through the bending of the flexible member, Circuit board processing equipment.

[0111] (Note 17) The flexible member is positioned lower than the substrate on the substrate support portion in the substrate processing chamber. The substrate processing apparatus described in Appendix 16.

[0112] (Note 18) The aforementioned flexible member is arranged in the exhaust section. The substrate processing apparatus described in Appendix 17.

[0113] (Note 19) The gas supply unit is configured to supply processing gas to the processing space, The substrate processing apparatus is The substrate processing apparatus according to any one of the appendices 16 to 18, further comprising a plasma generation unit configured to generate plasma from the processing gas.

[0114] (Note 20) The substrate processing apparatus further comprises a battery configured to store the power generated by the power generation element. A substrate processing apparatus as described in any one of the appendices 16 to 19.

[0115] The embodiments described above are for illustrative purposes only and are not intended to limit the scope of this disclosure. The embodiments described above can be modified in various ways without departing from the scope and spirit of this disclosure. For example, some components of one embodiment can be added to other embodiments, or some components of one embodiment can be replaced with corresponding components of other embodiments. [Explanation of symbols]

[0116] PS...Substrate processing system, TM...Vacuum transfer module, LL1, LL2...Load lock module, PM1~PM6...Process module, SM1, SM2...Stocker module, GS...Power generation system, 300...Flexible member, 301...Power generation element, 302...Battery, 400...Chamber, 500...Vacuum transfer chamber, 700...Plasma processing module, 800...Plasma processing chamber, 900...Chamber

Claims

1. A substrate processing system, A flexible member configured to bend due to pressure fluctuations, The system comprises a power generation element attached to the flexible member and configured to generate electricity through the bending of the flexible member, The aforementioned flexible member is configured to have higher flexibility than the surrounding members. PCB processing system.

2. A substrate processing system, A flexible member configured to bend due to pressure fluctuations, The system comprises a power generation element attached to the flexible member and configured to generate electricity through the bending of the flexible member, The substrate processing system is A first transport module having a first internal pressure, A second transport module having a second internal pressure greater than the first internal pressure, A process module connected to the first transport module, A load lock module interposed between the first transport module and the second transport module, The system comprises a gate valve positioned between the first transport module and the process module, The flexible member and the power generation element are arranged in at least one selected from the group consisting of the first transport module, the load lock module, the process module, and the gate valve. PCB processing system.

3. The substrate processing system includes a chamber, The chamber includes the flexible member, A substrate processing system according to claim 1 or 2.

4. The chamber has a wall portion, The wall portion includes the flexible member, The substrate processing system according to claim 3.

5. The chamber has at least one of an exhaust section or an air intake section. The exhaust section or the air intake section includes the flexible member, The substrate processing system according to claim 3.

6. The flexible member has an outer surface that is positioned to face outward from the chamber, The power generation element is attached to the outer surface of the flexible member. The substrate processing system according to claim 3.

7. The chamber includes a substrate processing chamber. The substrate processing system according to claim 3.

8. The substrate processing chamber is a plasma processing chamber that defines the plasma processing space. The substrate processing system according to claim 7.

9. The chamber includes a substrate transport chamber, The substrate processing system according to claim 3.

10. The aforementioned flexible member is configured to be thinner than the surrounding member so that it is more flexible than the surrounding member. The substrate processing system according to claim 1.

11. The aforementioned flexible member is made of a material that is more flexible than the surrounding member. The substrate processing system according to claim 1.

12. The substrate processing system is A first transport module having a first internal pressure, A second transport module having a second internal pressure greater than the first internal pressure, A process module connected to the first transport module, A load lock module interposed between the first transport module and the second transport module, The system comprises a gate valve positioned between the first transport module and the process module, The flexible member and the power generation element are arranged in at least one selected from the group consisting of the first transport module, the load lock module, the process module, and the gate valve. The substrate processing system according to claim 1.

13. The first transport module is a vacuum transport module, The substrate processing system according to claim 2 or 12, wherein the second transport module is an air transport module.

14. The substrate processing system includes a stocker module configured to store consumable parts, The flexible member and the power generation element are arranged in the stocker module. A substrate processing system according to claim 1 or 2.

15. The substrate processing system further comprises a battery configured to store the electricity generated by the power generation element. A substrate processing system according to claim 1 or 2.

16. A substrate processing chamber configured to define the processing space, A substrate support unit arranged within the substrate processing chamber, A gas supply unit configured to supply gas to the processing space, An exhaust unit configured to exhaust the gas from the processing space, A flexible member is placed in the substrate processing chamber and is configured to bend due to pressure fluctuations, The system comprises a power generation element attached to the flexible member and configured to generate electricity through the bending of the flexible member, The aforementioned flexible member is configured to have higher flexibility than the surrounding members. Circuit board processing equipment.

17. The flexible member is positioned lower than the substrate on the substrate support portion in the substrate processing chamber. The substrate processing apparatus according to claim 16.

18. The aforementioned flexible member is arranged in the exhaust section. The substrate processing apparatus according to claim 17.

19. The gas supply unit is configured to supply processing gas to the processing space, The substrate processing apparatus is The substrate processing apparatus according to claim 16, further comprising a plasma generation unit configured to generate plasma from the processing gas.

20. The substrate processing apparatus further comprises a battery configured to store the power generated by the power generation element. The substrate processing apparatus according to claim 16.

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