Substrate processing equipment

Abstract

To provide a substrate processor which can prevent attachment of particles.SOLUTION: A substrate processor 1 includes: a processing tank 2; a chamber 3 surrounding the processing tank 2; solvent vapor nozzles 31 and 32 provided in the chamber 3, the nozzles being arranged above the processing tank 2; an air exhaustion pump 51 for exhausting air from the chamber 3 from an air exhaustion port 47 arranged lower than an upper surface of the processing tank 2; a substrate holding unit 5 having a holding member 7 and a back plate 9 and being movable from a position H2 in the processing tank 2 in the chamber 3 to a position H1 above the processing tank 2, the holding member 7 holding a plurality of substrates W arranged in a line to face one another in a vertical attitude at specific intervals and the back plate 9 supporting a base end part 7B of the holding member 7; and a shield plate 71 provided between an end substrate WT, which is the most distant from the back plate 9 of the substrates W, and a side wall 3A of the chamber 3, to which an end part 7A side of the holding member 7 faces, while the substrate holding unit 5 is in the position H1 above the processing tank 2.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus for processing a substrate. The substrate includes, for example, a semiconductor substrate, a substrate for a FPD (Flat Panel Display), a glass substrate for a photomask, a substrate for an optical disk, a substrate for a magnetic disk, a ceramic substrate, a substrate for a solar cell, and the like. The FPD includes, for example, a liquid crystal display device, an organic EL (electroluminescence) display device, and the like.

Background Art

[0002] Conventional substrate processing apparatuses include a substrate holding unit that holds a plurality of substrates in a vertical posture, a processing tank that stores pure water and accommodates the plurality of substrates held by the substrate holding unit, a chamber that surrounds the processing tank, a solvent vapor nozzle that supplies solvent vapor into the chamber, and an exhaust pump that exhausts the inside of the chamber (see, for example, Patent Document 1).

[0003] Note that the substrate processing apparatus of Patent Document 2 includes a shielding member (plate-like member) provided in an outer tank. This shielding member prevents a large amount of moisture from being contained in the dry air on the outer tank in order to keep the dew point of the dry air low.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, conventional substrate processing equipment has the problem of a large number of particles adhering to certain substrates. For example, when multiple substrates are located above the processing tank in a chamber, the chamber is evacuated by an exhaust pump through an exhaust port located at the bottom of the chamber. In this case, the airflow becomes poor at the tip of the holding member of the substrate holding section, causing the atmosphere to stagnate. As a result, particles mixed in the atmosphere may adhere to the substrate.

[0006] The present invention has been made in view of these circumstances, and aims to provide a substrate processing apparatus capable of preventing particle adhesion. [Means for solving the problem]

[0007] To achieve this objective, the present invention has the following configuration. That is, the substrate processing apparatus according to the present invention comprises a processing tank for storing a processing liquid, a chamber surrounding the processing tank, a solvent vapor nozzle provided in the chamber and positioned higher than the processing tank, which supplies solvent vapor into the chamber, an exhaust pump for exhausting the chamber from an exhaust port positioned lower than the upper surface of the processing tank, a substrate holding part having a holding member for holding a plurality of substrates arranged in a line facing each other in a vertical position with a predetermined interval between them, and a back plate for supporting the base end of the holding member, the substrate holding part being movable within the chamber and between a position inside the processing tank and a position above the processing tank, and a shielding plate provided between the tip substrate of the plurality of substrates furthest from the back plate and the side wall of the chamber facing the tip end of the holding member when the substrate holding part is in a position above the processing tank.

[0008] According to the substrate processing apparatus of the present invention, the presence of a shielding plate protects the substrate from particles mixed in the atmosphere stagnating at the tip of the holding member. Furthermore, the gas flow between the tip substrate and the shielding plate can be improved. As a result, it is possible to prevent particles from adhering to the substrate (tip substrate).

[0009] Furthermore, in the substrate processing apparatus described above, the solvent vapor nozzle comprises a tubular section extending horizontally in a straight line within the chamber, and a plurality of discharge ports provided in the tubular section and arranged along the axis of the tubular section. The solvent vapor nozzle further comprises a liquid discharge port provided in the tubular section upstream of the plurality of discharge ports and located in a corresponding area between the shielding plate and the side wall of the chamber. Each of the plurality of discharge ports discharges the solvent vapor into the chamber, and the liquid discharge port discharges the solvent generated by condensation of the solvent vapor into the area between the shielding plate and the side wall of the chamber.

[0010] Conventional substrate processing equipment has a problem in that solvent liquid (droplets) adheres to the substrate, and this liquid may cause particles. Specifically, due to a drop in pipe temperature upstream of the solvent vapor nozzle, solvent vapor may condense, and the condensed solvent liquid may be discharged, for example, in the form of a mist, from a predetermined discharge port upstream of the solvent vapor nozzle. If the mist-like solvent adheres to the substrate, the adhered solvent liquid may cause particles.

[0011] According to the present invention, the liquid solvent generated by condensation upstream of the solvent vapor nozzle is discharged from a liquid discharge port provided in the pipe section upstream of the multiple discharge ports. The liquid discharge port is located in a corresponding area between the shielding plate and the side wall on the tip side of the chamber's holding member. Therefore, it is possible to prevent the liquid solvent discharged from the liquid discharge port from adhering to the substrate (tip substrate). Therefore, it is possible to prevent particles from adhering to the substrate. Furthermore, it is possible to prevent the liquid solvent from being supplied to the substrate from a predetermined discharge port among the multiple discharge ports. Therefore, solvent vapor can be supplied from all of the multiple discharge ports.

[0012] Furthermore, in the substrate processing apparatus described above, it is preferable that the liquid discharge port faces a different direction from the plurality of discharge ports. This allows the condensed solvent liquid to be directed in a direction that does not affect the substrate, such as causing particle adhesion problems.

[0013] Furthermore, in the substrate processing apparatus described above, it is preferable that the upper end of the shielding plate is positioned higher than the upper end of the leading substrate. This prevents the mist-like solvent discharged from the liquid outlet of the solvent vapor nozzle from going over the shielding plate, which is higher than the upper end of the leading substrate, and heading towards multiple substrates.

[0014] Furthermore, in the substrate processing apparatus described above, it is preferable that the upper end of the shielding plate is positioned to reach the ceiling surface of the chamber. This prevents the mist-like solvent discharged from the liquid outlet of the solvent vapor nozzle from crossing the shielding plate that reaches the ceiling surface of the chamber and heading towards the multiple substrates.

[0015] Furthermore, the substrate processing apparatus described above further comprises a water-repellent vapor nozzle provided in the chamber and positioned higher than the processing tank, which supplies water-repellent vapor into the chamber, the water-repellent vapor nozzle comprising a second pipe section extending horizontally in a straight line within the chamber, and a plurality of second discharge ports provided in the second pipe section and arranged along the pipe axis, the water-repellent vapor nozzle further comprising a second liquid discharge port provided in the second pipe section upstream of the plurality of second discharge ports and positioned in a region corresponding to the area between the shielding plate and the side wall of the chamber, each of the plurality of second discharge ports preferably discharges the water-repellent vapor into the chamber, and the second liquid discharge port preferably discharges the water-repellent agent generated by condensation of the water-repellent vapor into the area between the shielding plate and the side wall of the chamber.

[0016] The liquid water repellent generated by condensation upstream of the water repellent vapor nozzle is discharged from a second liquid outlet located in the second pipe section upstream of the multiple second discharge ports. The second liquid outlet is positioned in a corresponding area between the shielding plate and the side wall on the tip side of the chamber's holding member. This prevents the liquid water repellent discharged from the second liquid outlet from adhering to the substrate (tip substrate). This prevents particles from adhering to the substrate. Furthermore, it prevents the liquid water repellent from being supplied to the substrate from a predetermined second discharge port among the multiple second discharge ports. This allows water repellent vapor to be supplied from all of the multiple second discharge ports.

[0017] Furthermore, in the substrate processing apparatus described above, it is preferable that the shielding plate is attached to the processing tank. The shielding plate attached to the processing tank can prevent particles from adhering to the substrate (tip substrate).

[0018] Furthermore, in the substrate processing apparatus described above, it is preferable that the shielding plate is a dummy substrate held by the holding member. By providing a dummy substrate as a shielding plate, the substrate is protected from particles mixed in the atmosphere that accumulates at the tip of the holding member. In addition, the gas flow between the tip substrate and the dummy substrate can be improved. As a result, it is possible to prevent particles from adhering to the substrate (tip substrate).

[0019] Furthermore, the above-described substrate processing apparatus further comprises: a carrier mounting shelf on which a carrier for storing the plurality of substrates in a horizontal position is mounted; a dummy substrate carrier for storing the dummy substrates; a horizontal substrate transport mechanism for transporting the plurality of substrates and the dummy substrates; a posture conversion mechanism for changing the posture of the plurality of substrates and the dummy substrates between a horizontal position and a vertical position; and a batch substrate transport mechanism for transporting the plurality of substrates and the dummy substrates in a vertical position. The horizontal substrate transport mechanism transports the plurality of substrates from the carrier mounted on the carrier mounting shelf to the posture conversion mechanism, and transports the dummy substrates from the dummy substrate carrier to the posture conversion mechanism. The posture conversion mechanism converts the plurality of substrates and the dummy substrates transported by the horizontal substrate transport mechanism from a horizontal position to a vertical position. The batch substrate transport mechanism transports the plurality of substrates and the dummy substrates in a vertical position from the posture conversion mechanism. The substrate holding unit holds the plurality of substrates in a vertical position and holds the dummy substrate so that it is positioned between the front substrate furthest from the back plate and the side wall of the chamber opposite the front end of the holding member. The substrate holding unit moves between a position inside the processing tank and a position above the processing tank while holding the plurality of substrates and the dummy substrate. The batch substrate transport mechanism transports the plurality of substrates and the dummy substrate in a vertical position processed in the processing tank from the substrate holding unit to the orientation change mechanism. The orientation change mechanism changes the plurality of substrates and the dummy substrate transported by the batch substrate transport mechanism from a vertical position to a horizontal position. Preferably, the horizontal substrate transport mechanism returns the plurality of substrates in a horizontal position to the carrier placed on the carrier rack from the orientation change mechanism, and also returns the dummy substrate in a horizontal position to the dummy substrate carrier from the orientation change mechanism.

[0020] The substrate holding section holds multiple substrates in a vertical position and also holds a dummy substrate positioned between the leading substrate and the side wall of the chamber. This prevents particles from adhering to the leading substrate. The substrate processing device also includes a dummy substrate carrier, which houses a shielding dummy substrate. A dummy substrate is added for each of the multiple substrates that are processed together in the processing tank. After processing in the processing tank, the dummy substrate is returned to the dummy substrate carrier separately from the multiple substrates. Therefore, it is possible to prevent particles from adhering to the leading substrate without permanently installing a shielding plate inside the chamber surrounding the processing tank.

[0021] Furthermore, the substrate processing apparatus described above further comprises a storage rack for storing multiple carriers, and a carrier transport mechanism for transporting any carrier stored in the storage rack to the carrier mounting rack, wherein the dummy substrate carriers are preferably stored in the storage rack beforehand. The dummy substrate carriers are transported from the storage rack where they are previously stored to the carrier mounting rack by the carrier transport mechanism. The horizontal substrate transport mechanism can transport dummy substrates from the dummy substrate carriers placed on the carrier mounting rack.

[0022] Furthermore, the substrate processing apparatus described above further comprises: a carrier mounting shelf on which a carrier for storing the plurality of substrates in a horizontal position is mounted; a dummy substrate carrier for storing the dummy substrates; a horizontal substrate transport mechanism for transporting the plurality of substrates and the dummy substrates; a posture change mechanism for changing the posture of the plurality of substrates and the dummy substrates between a horizontal position and a vertical position; a batch substrate transport mechanism for transporting the plurality of substrates and the dummy substrates in a vertical position; and a substrate detection sensor unit for detecting the presence or absence of substrates stored in the carrier, and further comprises the holding unit The material has a plurality of holding grooves arranged in a row for holding the plurality of substrates, the plurality of holding grooves having a tip holding groove located at the very end on the tip side of the holding member, the substrate detection sensor unit moves vertically relative to the carrier placed on the carrier shelf and detects the presence or absence of substrates to be stored in the carrier, the horizontal substrate transport mechanism transports the plurality of substrates from the carrier placed on the carrier shelf to the attitude change mechanism, and the substrate detection sensor unit detects that there is no corresponding substrate in the carrier that corresponds to the tip holding groove. The horizontal substrate transport mechanism transports the dummy substrate from the dummy substrate carrier to the portion of the row of substrates transported to the orientation change mechanism where there is no corresponding substrate; the orientation change mechanism converts the multiple substrates and the dummy substrate transported by the horizontal substrate transport mechanism from a horizontal orientation to a vertical orientation; the batch substrate transport mechanism transports the multiple substrates and the dummy substrate in the vertical orientation from the orientation change mechanism; and the substrate holding section holds the multiple substrates and the dummy substrate in the vertical orientation using the multiple holding grooves of the holding member to the batch substrate transport mechanism. Preferably, the batch substrate transport mechanism receives the substrates and dummy substrates in a vertical orientation processed in the processing tank and transports them from the substrate holding section to the orientation change mechanism, the orientation change mechanism converts the substrates and dummy substrates transported by the batch substrate transport mechanism from a vertical orientation to a horizontal orientation, and the horizontal substrate transport mechanism returns the substrates in a horizontal orientation from the orientation change mechanism to the carrier placed on the carrier rack, and also returns the dummy substrates in a horizontal orientation from the orientation change mechanism to the dummy substrate carrier.

[0023] The substrate holding section has multiple holding grooves, each with a tip holding groove located at the very end of the holding member on the tip side. When the substrate detection sensor detects that there is no corresponding substrate in the carrier that corresponds to the tip holding groove, the horizontal substrate transport mechanism transports a dummy substrate to the section of the row of substrates transported to the attitude change mechanism where there is no corresponding substrate. This allows the dummy substrate to be automatically positioned between the tip substrate and the side wall of the chamber facing the tip side of the holding member. The substrate processing device also includes a dummy substrate carrier, which houses a dummy substrate for shielding. The dummy substrate is selectively added to multiple substrates that are processed together in the processing tank. After processing in the processing tank, the dummy substrate is returned to the dummy substrate carrier separately from the multiple substrates. Therefore, it is possible to prevent particles from adhering to the tip substrate without permanently installing a shielding plate inside the chamber surrounding the processing tank.

[0024] Furthermore, in the above-described substrate processing apparatus, a carrier mounting rack on which a first carrier for storing a first group of substrates consisting of two or more substrates in a horizontal position is placed, a dummy substrate carrier for storing the dummy substrates, a horizontal substrate transport mechanism for transporting the first group of substrates, transporting a second group of substrates consisting of two or more substrates, and transporting the dummy substrates, a posture conversion mechanism for changing the posture of the first group of substrates, the second group of substrates, and the dummy substrates between a horizontal posture and a vertical posture, and for combining the first group of substrates and the second group of substrates to form the plurality of substrates in a vertical posture, and a vertical posture The holding member further comprises a batch substrate transport mechanism for transporting the plurality of substrates and the dummy substrate, and a substrate detection sensor unit for detecting the presence or absence of a substrate to be stored in the first carrier, wherein the holding member has a plurality of holding grooves for holding the plurality of substrates, which are aligned in a row, and the plurality of holding grooves have a tip holding groove located at the very end of the tip side of the holding member, and the substrate detection sensor unit detects the presence or absence of a substrate to be stored in the first carrier while moving vertically relative to the first carrier which is placed on the carrier mounting shelf, and the substrate detection sensor unit detects the presence or absence of a substrate to be stored in the first carrier The horizontal substrate transport mechanism moves vertically relative to a second carrier that stores the second group of substrates in a horizontal position, which is placed on a storage shelf, and detects the presence or absence of substrates to be stored in the second carrier. The horizontal substrate transport mechanism then transports the first group of substrates from the first carrier placed on the carrier storage shelf to the attitude changing mechanism, and the horizontal substrate transport mechanism then transports the second group of substrates from the second carrier placed on the carrier storage shelf to the attitude changing mechanism. The substrate detection sensor unit then detects whether there is a corresponding substrate corresponding to the tip holding groove on either the first or second carrier. When deployed, the horizontal substrate transport mechanism transports the dummy substrate from the dummy substrate carrier to the portion of the row of the first substrate group or the second substrate group that has been transported to the attitude conversion mechanism where there is no corresponding substrate; the attitude conversion mechanism converts the first substrate group, the second substrate group and the dummy substrate from a horizontal orientation to a vertical orientation; and combines the first substrate group and the second substrate group to form the plurality of substrates in a vertical orientation; the batch substrate transport mechanism transports the plurality of substrates in a vertical orientation and the dummy substrate from the attitude conversion mechanism; and the substrate holding unit,Receive the plurality of substrates and the dummy substrate in the vertical posture in the plurality of holding grooves of the holding member, and the batch substrate transfer mechanism transfers the plurality of substrates and the dummy substrate in the vertical posture processed in the processing tank from the substrate holding portion to the posture conversion mechanism. The posture conversion mechanism divides the plurality of substrates conveyed by the batch substrate transfer mechanism into the first substrate group and the second substrate group, and also converts the first substrate group, the second substrate group, and the dummy substrate from the vertical posture to the perpendicular posture. The horizontal substrate transfer mechanism returns the first substrate group in the horizontal posture to the first carrier placed on the carrier placement shelf from the posture conversion mechanism, returns the second substrate group in the horizontal posture to the second carrier placed on the carrier placement shelf from the posture conversion mechanism, and preferably returns the dummy substrate in the horizontal posture to the dummy substrate carrier from the posture conversion mechanism.

[0025] The plurality of holding grooves of the holding member of the substrate holding portion have a tip holding groove located at the outermost end on the tip end side of the holding member. When the substrate detection sensor unit detects that the corresponding substrate corresponding to the tip holding groove is not in the first carrier or the second carrier, the horizontal substrate transfer mechanism conveys a dummy substrate to a portion where there is no corresponding substrate in the row of the first substrate group or the second substrate group conveyed to the posture conversion mechanism. Thereby, the dummy substrate can be automatically arranged between the tip substrate and the side wall of the chamber facing the tip end side of the holding member. Further, the substrate processing apparatus includes a dummy substrate carrier, and the dummy substrate carrier houses a shielding dummy substrate. The dummy substrate is selectively added to the plurality of substrates processed in a batch in the processing tank. After being processed in the processing tank, the dummy substrate is returned to the dummy substrate carrier separately from the plurality of substrates. Therefore, it is possible to prevent particles from adhering to the tip substrate without permanently installing a shielding plate in the chamber surrounding the processing tank.

[0026] Also, in the above-described substrate processing apparatus, it is preferable that the plurality of substrates are arranged such that the substrates in the first substrate group and the substrates in the second substrate group are alternately arranged one by one. When the substrates in the first substrate group and the substrates in the second substrate group are alternately arranged one by one among the plurality of substrates, it is possible to prevent particles from adhering to the substrate (the leading substrate).

[0027] Also, in the above-described substrate processing apparatus, it is preferable that the leading substrate faces the side wall of the chamber. When the leading substrate faces the side wall of the chamber, it is possible to prevent particles from adhering to the substrate (the leading substrate).

Advantages of the Invention

[0028] According to the substrate processing apparatus of the present invention, it is possible to prevent the adhesion of particles.

Brief Description of the Drawings

[0029] [Figure 1] It is a longitudinal sectional view showing a schematic configuration of the front of the substrate processing apparatus according to Example 1. [Figure 2] (a) is a left side view showing the substrate holding portion of the lifter, and (b) is a plan view of (a). [Figure 3] It is a longitudinal sectional view showing a schematic configuration of the left side of the substrate processing apparatus. [Figure 4] (a) is a longitudinal sectional view showing a schematic configuration of the left side of the substrate processing apparatus when a plurality of substrates are not shown, and (b) is a view showing the solvent vapor nozzle (water repellent vapor nozzle). [Figure 5] It is a longitudinal sectional view showing a schematic configuration of the front of the substrate processing apparatus. [Figure 6] It is a diagram for explaining the operation of the substrate processing apparatus. [Figure 7] It is a diagram for explaining the problems of the substrate processing apparatus. [Figure 8] (a) to (c) are diagrams for explaining the problems of the substrate processing apparatus. [Figure 9]This is a longitudinal cross-sectional view showing the schematic configuration of the left side of the cleaning unit according to Example 2. [Figure 10] This is a plan view showing the schematic configuration of the substrate processing apparatus according to Example 2. [Figure 11] This is a side view of the circuit board handling mechanism. [Figure 12] (a) to (f) are side views illustrating the configuration and operation of the attitude change mechanism (attitude change unit and pusher mechanism). [Figure 13] (a) is a left side view showing the substrate holding portion of the lifter according to Example 2, and (b) is a top view of (a). [Figure 14] This is a flowchart illustrating the operation of the substrate processing apparatus in Example 2. [Figure 15] This is a longitudinal cross-sectional view showing the schematic configuration of the left side of the cleaning unit according to Example 3. [Figure 16] (a) is a side view showing the configuration of the opener, and (b) is a top view showing the detection state of the substrate detection sensor. [Figure 17] This is a flowchart illustrating the operation of the substrate processing apparatus in Example 3. [Figure 18] (a) to (f) are side views illustrating the operation of the attitude change mechanism according to Example 3. [Figure 19] This is a left side view showing the substrate holding portion of the lifter. [Figure 20] (a) to (f) are side views illustrating the operation of the attitude change mechanism according to Example 4. [Figure 21] (a) is a left side view illustrating a modified shielding plate, and (b) is a view in the direction of the arrow in (a). [Figure 22] This figure shows a modified solvent vapor nozzle (water-repellent vapor nozzle). [Figure 23] This is a left side view illustrating a dummy circuit board related to a modified example. [Example 1]

[0030] Hereinafter, Embodiment 1 of the present invention will be described with reference to the drawings. Figure 1 is a longitudinal cross-sectional view showing the schematic front configuration of the substrate processing apparatus 1 according to Embodiment 1. Figure 2(a) is a left side view showing the substrate holding portion 5 of the lifter 4. Figure 2(b) is a top view of Figure 2(a).

[0031] <1. Configuration of the substrate processing device 1> Refer to Figure 1. The substrate processing apparatus 1 is a device for processing multiple substrates W at once. The substrate processing apparatus 1 comprises a processing tank 2 for storing processing liquid, a chamber 3 surrounding the processing tank 2, and a lifter 4. The processing tank 2 is configured to accommodate multiple substrates W in a substantially vertical position. The processing tank 2 is positioned away from the sides and bottom of the chamber 3.

[0032] The lifter 4 includes a substrate holding section 5 for holding multiple substrates W, and a lifting mechanism 6 for raising and lowering the substrate holding section 5 in the vertical direction (Z direction). The lifting mechanism 6 can raise and lower the substrates W between a "drying position H1" above the processing tank 2 and inside the chamber 3, and a "processing position H2" inside the processing tank 2. In Figure 1, the substrate holding section 5 is located in the chamber 3 and above the processing tank 2 at the drying position H1. The lifting mechanism 6 is equipped with an electric motor or an air cylinder for raising and lowering the substrate holding section 5.

[0033] The substrate holding section 5 comprises three holding members 7 and a back plate 9. The holding members 7 are formed to extend linearly in the horizontal direction (Y direction), as shown in Figures 2(a) and 2(b). The holding members 7 hold a plurality of substrates W (e.g., 50) that are arranged in a line facing each other in a substantially vertical position with a predetermined interval between them. In other words, the holding members 7 hold a plurality of substrates W arranged in a line along the Y axis extending in the horizontal direction. The holding members 7 hold a plurality of substrates W in a substantially vertical position. The plurality of substrates W are arranged parallel to each other. The holding members 7 have a plurality of grooves (e.g., 50) that are arranged in the Y direction at a predetermined pitch (e.g., 5 mm (half pitch)).

[0034] The 50 grooves are each called slots 1 to 50. In Figure 2(a) and Figures 8(a) to 8(c) described later, for example, slot 1 is shown as "SL1" and slot 49 is shown as "SL49". The groove closest to the back plate 9 is slot 1. As you move away from the back plate 9, the slot numbers increase, such as slot 2, slot 3, and slot 4. The groove furthest from the back plate 9 is slot 50. For example, by placing 50 substrates W into 50 grooves, the holding member 7 can hold 50 substrates W.

[0035] As shown in Figures 1 and 2(b), the substrate holder 5 has three holding members 7. However, the substrate holder 5 only needs to have one or more holding members 7.

[0036] The back plate 9 supports the base ends 7B of the three retaining members 7. That is, the three retaining members 7 are connected to the lower ends of the back plate 9. For example, as shown by arrow AR1 in Figure 2(a), when viewing multiple substrates W from the back plate 9 side, the back plate 9 is formed to cover, for example, each substrate W. The tip ends 7A of the three retaining members 7 are connected by connecting members 11 (see Figure 2(b)).

[0037] Returning to Figure 1, two discharge pipes 13 are provided at the bottom of the treatment tank 2 to supply the treatment liquid into the tank 2. Each discharge pipe 13 is formed in a straight line along the Y direction in which the multiple substrates W are aligned. Each discharge pipe 13 has multiple discharge ports (not shown) arranged in the Y direction (pipe axis).

[0038] The treatment liquid piping 15 connects two discharge pipes 13 to a treatment liquid supply source 17. The treatment liquid supply source 17 sends pure water as the treatment liquid to the treatment liquid piping 15. For example, deionized water (DIW) is used as the pure water. An on-off valve V1 is provided in the treatment liquid piping 15. The on-off valve V1 controls the supply and cessation of pure water. When the on-off valve V1 is open, pure water is supplied to the treatment tank 2 from the two discharge pipes 13. When the on-off valve V1 is closed, the supply of pure water from the two discharge pipes 13 is stopped.

[0039] Furthermore, the tip of the processing liquid pipe 19 is connected to the processing liquid pipe 15 between the two discharge pipes 13 and the on-off valve V1. The base end of the processing liquid pipe 19 is connected to the second processing liquid supply source 21. The second processing liquid supply source 21 sends isopropyl alcohol solution diluted with pure water (e.g., DIW) (hereinafter referred to as "diluted IPA solution") to the processing liquid pipe 19. The on-off valve V2 is provided in the processing liquid pipe 19. The on-off valve V2 supplies and stops the diluted IPA solution. The two on-off valves V1 and V2 selectively supply either pure water or diluted IPA solution from each discharge pipe 13.

[0040] A QDR valve (on-off valve) 23 is provided at the bottom of the treatment tank 2 to release the treatment liquid from the treatment tank 2 to the bottom surface of the chamber 3. When the QDR valve 23 is open, the treatment liquid from the treatment tank 2 is rapidly released to the bottom surface of the chamber 3. When the QDR valve 23 is closed, the treatment liquid can be stored in the treatment tank 2.

[0041] Chamber 3 houses the processing tank 2. Chamber 3 is equipped with an upper cover 25 on its top surface that can be opened and closed. When the upper cover 25 is closed, the upper cover 25 functions as the ceiling wall of Chamber 3.

[0042] Chamber 3 is equipped with two inert gas nozzles 27, four solvent vapor nozzles 31 and 32, and two water-repellent vapor nozzles 33. The eight nozzles 27, 31, 32, and 33 are positioned higher than the processing tank 2 (or the top surface of the processing tank 2). The two inert gas nozzles 27, two solvent vapor nozzles 31, two solvent vapor nozzles 32, and two water-repellent vapor nozzles 33 are arranged from top to bottom in this order.

[0043] Furthermore, when the substrate holding section 5 is in the drying position H1, two solvent vapor nozzles 31 are positioned at a height near the upper end of each substrate W. Two solvent vapor nozzles 32 are positioned at a height near the center of each substrate W. In addition, two water-repellent vapor nozzles 33 are positioned at a height near the lower end of each substrate W.

[0044] Two inert gas nozzles 27 each supply inert gas into the chamber 3. The tip of a supply pipe 35 is connected to each inert gas nozzle 27. The base end of the supply pipe 35 is connected to an inert gas supply source 37. The inert gas supply source 37 supplies nitrogen gas, for example, as the inert gas to the supply pipe 35. An on-off valve V4 is provided in the supply pipe 35. The on-off valve V4 controls the supply and cessation of the inert gas.

[0045] The two inert gas nozzles 27 are arranged horizontally so as to sandwich the movement path RT of the multiple substrates W. Each inert gas nozzle 27 has a tubular section 27A that extends linearly horizontally (in the Y direction) (see Figure 4(a) described later). Multiple discharge ports 27B are formed in the tubular section 27A along the tubular axis (in the Y direction).

[0046] Four solvent vapor nozzles 31 and 32 each supply solvent vapor into the chamber 3. The tip of a supply pipe 39 is connected to each solvent vapor nozzle 31 and 32. The base end of the supply pipe 39 is connected to a solvent vapor supply source 41. The solvent vapor supply source 41 sends, for example, isopropyl alcohol vapor (hereinafter referred to as "IPA vapor") as solvent vapor to the supply pipe 39. The solvent vapor is produced by evaporating the liquid solvent with a heater. The solvent vapor may contain an inert gas (nitrogen gas) as a carrier gas. A shut-off valve V5 is provided on the supply pipe 39. The shut-off valve V5 supplies and stops the solvent vapor.

[0047] The two solvent vapor nozzles 31 are arranged horizontally so as to sandwich the movement path RT of the multiple substrates W. Similarly, the two solvent vapor nozzles 32 are arranged horizontally so as to sandwich the movement path RT of the multiple substrates W. Further configurations of the four solvent vapor nozzles 31 and 32 will be described later.

[0048] Two water-repellent vapor nozzles 33 each supply water-repellent vapor into the chamber 3. The tip of a supply pipe 43 is connected to each water-repellent vapor nozzle 33. The base end of the supply pipe 43 is connected to a water-repellent vapor supply source 45. The water-repellent vapor supply source 45 sends water-repellent vapor to the supply pipe 43. The water-repellent vapor is produced by evaporating the liquid water-repellent agent (silylater) using a heater. The water-repellent vapor may contain an inert gas (nitrogen gas) as a carrier gas. An on-off valve V6 is provided in the supply pipe 43. The on-off valve V6 supplies and stops the water-repellent vapor.

[0049] The two water-repellent vapor nozzles 33 are arranged horizontally so as to sandwich the movement path RT of the multiple substrates W. Further details of the configuration of the two water-repellent vapor nozzles 33 will be described later.

[0050] An exhaust port 47 is provided on the side wall of the chamber 3. The exhaust port 47 is positioned lower than the top surface of the processing tank 2. For example, the exhaust port 47 is positioned at a height that faces the outer surface 2A of the processing tank 2. Also, the exhaust port 47 is positioned lower than the shield plate 55, which will be described later. An exhaust pipe 49 is connected to the exhaust port 47. An on-off valve V7 and an exhaust pump 51 are provided on the exhaust pipe 49, in order from the exhaust port 47 side. The exhaust pump 51 exhausts the gas inside the chamber 3 from the exhaust port 47. This reduces the pressure inside the chamber 3 to a pressure lower than atmospheric pressure.

[0051] Note that in Figure 1, for illustrative purposes, the exhaust port 47 is located on the side wall 3C. However, as shown in Figure 3, which will be described later, the exhaust port 47 is located on the side wall 3A.

[0052] Furthermore, a discharge pipe 53 is connected to the bottom wall of chamber 3. A shut-off valve V8 is provided on the discharge pipe 53. When the shut-off valve V8 is open, the processed liquid inside chamber 3 can be discharged to the outside of chamber 3. When the shut-off valve V8 is closed, the processed liquid can be stored at the bottom of chamber 3.

[0053] Chamber 3 also includes a shield plate 55. The shield plate 55 is provided slightly below the upper edge (or opening) of the processing tank 2 and around the entire circumference of the outer surface 2A of the processing tank 2. In other words, the shield plate 55 is provided between the outer wall of the processing tank 2 and the inner wall of Chamber 3. The shield plate 55 shields the atmosphere between the upper part (upper space) and the lower part (lower space) of Chamber 3. The shield plate 55 has gaps G1 and G2 (openings) that allow the processing liquid overflowing from the processing tank 2 to flow into the lower part of Chamber 3. That is, the shield plate 55 has a gap G1 between it and the outer wall of the processing tank 2, and a gap G2 between it and the inner wall of Chamber 3. Note that, if necessary, one of the gaps G1 and G2 may be omitted.

[0054] The substrate processing apparatus 1 comprises a control unit 61 and a storage unit (not shown). The control unit 61 controls each component of the substrate processing apparatus 1. The control unit 61 comprises one or more processors, such as a central processing unit (CPU). The storage unit comprises at least one of ROM (Read-Only Memory), RAM (Random-Access Memory), and a hard disk. The storage unit stores the computer programs necessary to control each component of the substrate processing apparatus 1.

[0055] <2. Shielding plate 71> Next, we will describe the shielding plate 71, which is one of the characteristic parts of this embodiment. Figure 3 is a longitudinal cross-sectional view showing the schematic configuration of the left side of the substrate processing apparatus 1. Figure 4(a) is a longitudinal cross-sectional view showing the schematic configuration of the left side of the substrate processing apparatus 1 when the multiple substrates W are not shown. Figure 4(b) shows the solvent vapor nozzles 31, 32 (water repellent vapor nozzle 33). Figure 5 is a longitudinal cross-sectional view showing the schematic configuration of the front of the substrate processing apparatus 1.

[0056] The substrate processing apparatus 1 includes a shielding plate 71. The shielding plate 71 prevents particles and mist from adhering to the device surface of the leading substrate WT, which will be described later. The shielding plate 71 is attached to the processing tank 2 via a mounting member (not shown). The shielding plate 71 is formed to extend in the vertical direction (Z direction). The shielding valve 71 may be attached to the chamber 3.

[0057] The shielding plate 71 is provided between the "tip substrate WT" and the side wall 3A of the chamber 3, which faces the tip portion 7A of the holding member 7. The tip substrate WT is the substrate W furthest from the back plate 9 among a plurality (e.g., 49) of substrates W. The side wall of the chamber 3 on the base end portion 7B side of the holding member 7 and the back plate 9 side is indicated by reference numeral 3B.

[0058] In Figure 5, the shielding plate 71 is positioned to cover the entire surface of each substrate W when viewed from the tip end 7A side to the base end 7B side of the retaining member 7 (+Y direction). The device surface (front surface) of the tip substrate WT faces from the base end 7B side to the tip end 7A side of the retaining member 7 (-Y direction). Assume that the slot 49 (SL49) shown in Figure 2(a) is the tip substrate WT. As indicated by arrow AR2 in Figure 2(a), the device surface of the tip substrate WT faces the shielding plate 71.

[0059] The distance K1 between the device surface of the leading substrate WT of slot 49 and the shielding plate 71 is, for example, 13 mm (see Figure 3). Assume that the distance between the shielding plate 71 and the side wall 3A is distance K2. Distance K1 is smaller than distance K2 (distance K1 < distance K2).

[0060] The device side of the substrate W, including the leading substrate WT, is the side on which electronic circuits are formed and is called the "front surface." The back surface of the substrate W is the side on which electronic circuits are not formed. The back surface is the side opposite the device side.

[0061] Furthermore, as shown in Figures 3 and 5, the upper end 72 of the shielding plate 71 is positioned to reach the ceiling surface 3E of the chamber 3. That is, the upper end 72 of the shielding plate 71 is positioned at approximately the same height as the ceiling surface 3E of the chamber 3 (for example, there is a gap between the upper end 72 of the shielding plate 71 and the ceiling surface 3E). For example, it is possible to prevent the mist-like solvent discharged from the liquid outlet 76 of the solvent vapor nozzles 31 and 32 (described later) from crossing the shielding plate 71, which reaches the ceiling surface 3E of the chamber 3, and heading toward the multiple substrates W. Note that the airflow is relatively fast on the lower end side of the shielding plate 71, so it is considered that the mist-like solvent will not head toward the multiple substrates W. The same applies to the mist-like water repellent discharged from the second liquid outlet 86 of the water repellent vapor nozzle 33 (described later).

[0062] <3. Liquid outlets 76, 86 of solvent vapor nozzles 31, 32 and water-repellent vapor nozzle 33> Next, we will describe the liquid outlets 76 and 86 of each solvent vapor nozzle 31 and 32 and the water-repellent vapor nozzle 33, which are other characteristic features of this embodiment.

[0063] Refer to Figures 3, 4(a), and 4(b). Each solvent vapor nozzle 31, 32 comprises a pipe section 73 extending horizontally (in the Y direction) in a straight line, and a plurality (e.g., 50) discharge ports 75 provided on the pipe section 73. The 50 discharge ports 75 are arranged along the pipe axis AX (see Figure 4(b)) at predetermined intervals. For example, the 50 discharge ports 75 are arranged at 5 mm intervals (pitch). Each of the 50 discharge ports 75 discharges solvent vapor into the chamber 3.

[0064] The 50 discharge ports 75 each have circular openings with the same diameter D1. The 50 discharge ports 75 are arranged to correspond to, for example, 50 substrates W that can be held by the substrate holder 5. That is, the 50 discharge ports 75 are arranged in areas corresponding to the areas of the 50 substrates W held by the substrate holder 5. Each discharge port 75 is oriented, for example, horizontally (X direction) or diagonally downward (XZ direction) to discharge solvent vapor toward the substrates W.

[0065] Furthermore, conventional substrate processing equipment has a problem in that solvent liquid (droplets) adheres to the substrate W, and this liquid may cause particles. Specifically, due to a decrease in piping temperature upstream of each solvent vapor nozzle 31, 32, solvent vapor condenses, and the condensed solvent liquid may be discharged, for example, in the form of a mist, from one or more discharge ports upstream of each solvent vapor nozzle 31, 32. If the mist-like solvent adheres to the substrate W on the slot 49 side, the adhered solvent liquid may cause particles. The same applies to the water-repellent vapor nozzle 33.

[0066] Therefore, in this embodiment, each solvent vapor nozzle 31, 32 is further provided with a liquid discharge port 76 located in the pipe section 73 upstream of the multiple discharge ports 75. The liquid discharge port 76 discharges the liquid solvent generated by condensation of solvent vapor into the chamber 3. As shown in Figures 3 and 4(a), the liquid discharge port 76 is positioned in a corresponding area 78 between the shielding plate 71 and the side wall 3A of the chamber 3. The liquid discharge port 76 discharges, for example, the liquid solvent into the area between the shielding plate 71 and the side wall 3A of the chamber 3 (i.e., the space sandwiched between the shielding plate 71 and the side wall 3A of the chamber 3).

[0067] Of the 50 discharge ports 75, the discharge port 75 on the tip 7A side of the holding member 7 is designated as "discharge port 75A". In this case, the distance LN1 from discharge port 75A to liquid outlet 76 is configured to be longer than the distance LN2 between two discharge ports 75. The liquid outlet 76 has a circular opening with a diameter D2. The diameter D2 of the liquid outlet 76 is the same as the diameter D1 of each discharge port 75 (diameter D1 = diameter D2). Also, for example, if each discharge port 75 of the solvent vapor nozzle 32 discharges solvent vapor in the horizontal direction (X direction), the liquid outlet 76 also discharges the condensed solvent in the same direction as each discharge port 75, in the horizontal direction (X direction).

[0068] Each water-repellent vapor nozzle 33 is configured in substantially the same way as the solvent vapor nozzle 31. That is, each water-repellent vapor nozzle 33 has a second pipe section 83 that extends linearly horizontally (Y direction) and a plurality (for example, 50) of second discharge ports 85 provided on the second pipe section 83. The 50 second discharge ports 85 are arranged along the pipe axis AX (Y direction) at a predetermined interval (for example, 5 mm). Each second discharge port 85 discharges water-repellent vapor into the chamber 3. Each second discharge port 85 is also oriented, for example, horizontally (X direction) or diagonally downwards (XZ direction).

[0069] The water-repellent vapor nozzle 33 further includes a second liquid outlet 86 provided in the second pipe section 83 upstream of the 50 second discharge ports 85. The second liquid outlet 86 is located in a corresponding region 78 between the shielding plate 71 and the side wall 3A of the chamber 3. In Figure 4(a), the second discharge port 85 on the tip 7A side of the holding member 7 among the 50 second discharge ports 85 is referred to as "second discharge port 85A". In this case, the distance LN1 from the second discharge port 85A to the second liquid outlet 86 is greater than the distance LN2 (e.g., 5 mm) between the two second discharge ports 85. The second liquid outlet 86 discharges the liquid water-repellent agent (droplets) generated by condensation of the water-repellent vapor into the chamber 3. For example, the second liquid outlet 86 discharges the liquid water-repellent agent into the region between the shielding plate 71 and the side wall 3A of the chamber 3. The second liquid outlet 86 discharges, for example, a water-repellent liquid in a mist form.

[0070] In this embodiment, each solvent vapor nozzle 31, 32 is provided with one liquid outlet 76, but may be provided with two or more liquid outlets 76 arranged in the Y direction. Similarly, the water-repellent vapor nozzle 33 is provided with one second liquid outlet 86, but may be provided with two or more second liquid outlets 86 arranged in the Y direction.

[0071] <4. Operation of the substrate processing device 1> The operation of the substrate processing apparatus 1 will be explained with reference to Figure 6. Note that the substrate holding section 5 is not shown in Figure 6. In Figure 6, the exhaust operation by the exhaust pump 51 and the on-off valve V7 is indicated by the symbol "VAC".

[0072] The processing tank 2 stores pure water as the processing liquid through a discharge pipe 13. The substrate holding unit 5 is located in the drying position H1. A transport robot (not shown) transports, for example, 49 substrates W to the substrate holding unit 5. The substrate holding unit 5 holds, for example, 49 substrates W in a vertical position. The lifter 4 lowers the substrate holding unit 5 from the drying position H1 to the processing position H2, thereby immersing the 49 substrates W in the pure water of the processing tank 2 for a predetermined period (step S01). As a result, the substrates W are washed. After lowering the substrate holding unit 5, the upper cover 25 is closed.

[0073] Furthermore, for the 49 substrates W, the device side of the substrates W in odd-numbered slots (e.g., slots 1, 3, 5, ..., 47, 49) faces the shielding plate 71 side (-Y direction), while the device side of the substrates W in even-numbered slots (e.g., slots 2, 4, 6, ..., 46, 48) faces the back plate 9 side. In other words, the 49 substrates W are arranged in a face-to-face configuration. The substrate W in slot 49 (SL49) is the leading substrate WT (see Figures 2(a) and 3).

[0074] Subsequently, nitrogen gas is supplied into the chamber 3 from the inert gas nozzle 27. Also, by opening the on-off valve V7 while operating the exhaust pump 51, the chamber 3 is evacuated from the exhaust port 47, reducing the pressure inside the chamber 3 to below atmospheric pressure (step S02). After that, the exhaust of the chamber 3 is continued by the exhaust pump 51, etc. At the same time, the supply of nitrogen gas from the inert gas nozzle 27 is stopped, and IPA vapor is supplied into the chamber 3 from the solvent vapor nozzles 31 and 32 (step S03).

[0075] Subsequently, the exhaust pump 51 is stopped and the on-off valve V7 is closed. The supply of IPA steam is continued. The lifter 4 moves the substrate holding part 5 from the processing position H2 to the drying position H1, thereby lifting the 49 substrates W from the pure water in the processing tank 2 (step S04). This replaces the pure water adhering to the device surface of the substrates W with IPA.

[0076] Here, the effects of the liquid discharge port 76 and the shielding plate 71 will be explained. Since the condensed solvent liquid (droplets) is discharged from the liquid discharge port 76, it prevents the discharge of mist-like solvent onto the substrate W side of the slot 49. As a result, IPA vapor can be supplied evenly to 49 substrates W from the 50 discharge ports 75. In addition, the shielding plate 71 prevents the solvent liquid discharged from the liquid discharge port 76 from adhering to the substrate W. The same applies to steps S07 and S12 described later.

[0077] After step S04, the QDR valve 23 is opened, and the pure water in the treatment tank 2 is released to the bottom of the chamber 3 (step S05). Then, the chamber 3 is evacuated by opening the on-off valve V7 while operating the exhaust pump 51. At the same time, the supply of IPA vapor from the solvent vapor nozzles 31 and 32 is stopped, and water-repellent vapor is supplied into the chamber 3 from the water-repellent vapor nozzle 33 (step S06). This replaces the IPA adhering to the substrate W with the water-repellent. The device surface of the substrate W is modified by the water-repellent.

[0078] Here too, water-repellent vapor can be supplied evenly to 49 substrates W from multiple second discharge ports 85. In addition, the shielding plate 71 prevents the water-repellent liquid discharged from the second liquid discharge port 86 from adhering to the substrates W.

[0079] After step S06, exhaust from chamber 3 is continued using the exhaust pump 51 or the like. At the same time, the supply of water-repellent vapor from the water-repellent vapor nozzle 33 is stopped, and IPA vapor is supplied into chamber 3 from the solvent vapor nozzles 31 and 32 (step S07). This replaces the water-repellent agent adhering to the substrate W with IPA, while washing away, for example, the water-repellent agent and particles derived from the water-repellent agent.

[0080] Subsequently, the exhaust pump 51 is stopped and the on-off valve V7 is closed. At the same time, the supply of IPA vapor from the solvent vapor nozzles 31 and 32 is stopped, and nitrogen gas is supplied into the chamber 3 from the inert gas nozzle 27 (step S08). This returns the pressure inside the chamber 3, which was under reduced pressure, back to atmospheric pressure. Then, the pure water at the bottom of the chamber 3 is discharged to the outside of the chamber 3 through the discharge pipe 53 (step S08).

[0081] Here, the effect of the shielding plate 71 will be explained. Figure 7 shows the substrate processing apparatus 201 without the shielding plate 71. Note that the components of the substrate processing apparatus 201 are denoted by the same reference numerals as those of the substrate processing apparatus 1 shown in Figure 3. In Figure 7, the exhaust pump 51 exhausts air from the chamber 3 through the exhaust port 47 provided on the side wall 3A, thereby reducing the pressure inside the chamber 3. At this time, the region 91 on the tip end 7A side of the holding member 7 is a region with slow airflow. As a result, the atmosphere tends to stagnate. For example, particles (dirt) generated in step S06 and particles (dirt) generated in step S07 may accumulate and stagnate in region 91. Note that particles include mist, which is a cause of particles.

[0082] Then, when nitrogen gas is supplied to return the chamber 3 to atmospheric pressure, the exhaust pump 51 is stopped, and particles remaining in region 91 are stirred up by the nitrogen gas, and these particles may adhere to the substrate W (tip substrate WT) of slot 49.

[0083] As shown in Figure 8(a), when the substrate holding unit 5 holds 50 substrates W arranged face-to-face, the device side of the substrate W in slot 50 (SL50) faces the back plate 9 side. Arrow AR2 indicates the orientation of the device side. That is, the back surface of the substrate W in slot 50 faces the tip 7A side (-Y direction) of the holding member 7. In this case, perhaps because it is shielded by the back surface of the substrate W in slot 50, the problem of particle adhesion to the device surface due to the slowing of the airflow in region 91 does not occur.

[0084] As shown in Figure 8(b), when the substrate holder 5 holds 49 substrates W arranged face-to-face, the device surface of the substrate W in the slot 49 (SL49) faces the tip 7A side (-Y direction) of the holding member 7. Therefore, the device surface of the substrate W in the slot 49 faces region 91, and particles are likely to adhere to that device surface.

[0085] Furthermore, as shown in Figure 8(c), when the substrate holder 5 holds 25 substrates W arranged face-to-face, the device surface of the substrate W in slot 25 (SL25) faces the tip 7A side (-Y direction) of the holding member 7. Therefore, the device surface of the substrate W in slot 25 faces region 91, making it prone to particle adhesion. However, since the substrate W in slot 25 is far from region 91, the number of particles adhering to the substrate W in slot 25 in Figure 8(c) is less than the number of particles adhering to the substrate W in slot 49 in Figure 8(b).

[0086] In Figures 8(a) to 8(c), "Good" indicates that no particle adhesion to the device surface is observed. "Poor" indicates that particle adhesion to the device surface is observed. Furthermore, since the substrate W in slot 1 has a back plate 9 and the device surface is not facing the back plate 9, it is considered that the problem of particle adhesion to the device surface does not occur.

[0087] The shielding plate 71 protects the device surface of the tip substrate WT of the slot 49 from particles mixed in the atmosphere of the region 91 that accumulates on the tip end 7A side of the holding member 7. This is achieved by improving the gas flow between the tip substrate WT and the shielding plate 71. This prevents the atmosphere from accumulating opposite the tip substrate WT, as in region 91. As a result, it is possible to prevent particles from adhering to the device surface of the substrate W.

[0088] After step S08, in steps S09 and S10, pure water is supplied to the treatment tank 2 from the injection pipe 13 to clean the inside of the treatment tank 2. Then, the pure water inside the treatment tank 2 is discharged to the outside of the treatment tank 2 and chamber 3 by the QDR valve 23 and the on-off valve V8. Nitrogen gas is supplied continuously in steps S09 to S11.

[0089] Subsequently, a predetermined amount of diluted IPA solution is supplied from the ejection pipe 13 to the treatment tank 2 as the second treatment solution. Then, the lifter 4 immerses the 49 substrates W in the diluted IPA solution in the treatment tank 2 for a predetermined period of time (step S11). This performs additional cleaning of the substrates W to remove any remaining particles, etc., from step S07.

[0090] Subsequently, the chamber 3 is evacuated by opening the on-off valve V7 while operating the exhaust pump 51. At the same time, the supply of nitrogen gas from the inert gas nozzle 27 is stopped, and IPA vapor is supplied into the chamber 3 from the solvent vapor nozzles 31 and 32 (step S12). Then, the lifter 4 raises the 49 substrates W, lifting them out of the diluted IPA solution in the processing tank 2 (step S12). This replaces the diluted IPA solution adhering to the substrates W with IPA. After that, the supply of IPA vapor from the solvent vapor nozzles 31 and 32 is stopped to dry the substrates W (step S12).

[0091] Subsequently, the exhaust pump 51 is stopped and the on-off valve V7 is closed. At the same time, the supply of IPA vapor from the solvent vapor nozzles 31 and 32 is stopped, and nitrogen gas is supplied into the chamber 3 from the inert gas nozzle 27 (step S13). This returns the pressure inside the chamber 3, which was under reduced pressure, back to atmospheric pressure.

[0092] Here, particles (dirt) generated in step S12 may accumulate and remain in region 91 (see Figure 7). Then, when nitrogen gas is supplied to return the chamber 3 to atmospheric pressure, the exhaust pump 51 is stopped, and the particles that have accumulated in region 91 may adhere to the substrate W (tip substrate WT) of slot 49 (SL49) due to the nitrogen gas. However, the shielding plate 71 protects the device surface of the tip substrate WT of slot 49 from particles mixed in with the atmosphere of region 91 that has accumulated on the tip end 7A side of the holding member 7.

[0093] After step S13, the supply of nitrogen gas from the inert gas nozzle 27 is stopped. Then, the upper cover 25 is opened and a transport robot (not shown) transports the 49 substrates W to the next destination (step S14).

[0094] In this embodiment, the shielding plate 71 protects the substrate W from particles mixed in the atmosphere stagnating at the tip 7A of the holding member 7. Furthermore, the gas flow between the tip substrate WT and the shielding plate 71 can be improved. As a result, it is possible to prevent particles from adhering to the substrate W (tip substrate WT).

[0095] Furthermore, the substrate processing apparatus 1 includes solvent vapor nozzles 31 and 32, each comprising a tubular section 73 extending linearly horizontally (in the Y direction) within the chamber 3, and a plurality of discharge ports 75 provided on the tubular section 73 and arranged along the tubular axis AX (in the Y direction). The solvent vapor nozzles 31 and 32 further include a liquid discharge port 76 provided on the tubular section 73 upstream of the plurality of discharge ports 75, and located in a corresponding region 78 between the shielding plate 71 and the side wall 3A of the chamber 3. Each of the plurality of discharge ports 75 discharges solvent vapor into the chamber 3. The liquid discharge port 76 discharges the solvent generated by condensation of the solvent vapor into the region between the shielding plate 71 and the side wall 3A of the chamber 3.

[0096] The solvent liquid generated by condensation upstream of the solvent vapor nozzles 31 and 32 is discharged from a liquid discharge port 76 provided in the pipe section 73 upstream of the multiple discharge ports 75. The liquid discharge port 76 is located in a corresponding area 78 between the shielding plate 71 and the side wall 3A on the tip end 7A side of the holding member 7 of the chamber 3. Therefore, it is possible to prevent the solvent liquid discharged from the liquid discharge port 76 from adhering to the substrate W (tip substrate WT). Furthermore, it is possible to prevent the solvent liquid from being supplied to the substrate W from a predetermined discharge port 75 (e.g., discharge port 75A) among the multiple discharge ports 75. Therefore, solvent vapor can be supplied from all of the multiple discharge ports.

[0097] Furthermore, the substrate processing apparatus 1 further includes a water-repellent vapor nozzle 33 provided in the chamber 3 and positioned higher than the processing tank 2, which supplies water-repellent vapor into the chamber 3. The water-repellent vapor nozzle 33 comprises a second pipe section 83 extending linearly horizontally (Y direction) within the chamber 3, and a plurality of second discharge ports 85 provided in the second pipe section 83 and arranged along the pipe axis AX (Y direction). The water-repellent vapor nozzle 33 further includes a second liquid discharge port 86 provided in the second pipe section 83 upstream of the plurality of second discharge ports 85 and positioned in a corresponding region 78 between the shielding plate 71 and the side wall 3A of the chamber 3. Each of the plurality of second discharge ports 85 discharges water-repellent vapor into the chamber 3. The second liquid discharge port 86 discharges the water-repellent agent generated by condensation of the water-repellent vapor into the region between the shielding plate 71 and the side wall 3A of the chamber 3.

[0098] The liquid water repellent generated by condensation upstream of the water repellent vapor nozzle 33 is discharged from a second liquid outlet 86 provided in the second pipe section 83 upstream of the multiple second discharge ports 85. The second liquid outlet 86 is located in a corresponding area 78 between the shielding plate 71 and the side wall 3A on the tip end 7A side of the holding member 7 of the chamber 3. Therefore, it is possible to prevent the liquid water repellent discharged from the second liquid outlet 86 from adhering to the substrate W (tip substrate WT). Furthermore, it is possible to prevent the liquid water repellent from being supplied to the substrate W from a predetermined second discharge port 85 (for example, second discharge port 85A) among the multiple second discharge ports 85. Therefore, water repellent vapor can be supplied from all of the multiple second discharge ports 85. [Example 2]

[0099] Next, Embodiment 2 of the present invention will be described with reference to the drawings. Note that explanations that overlap with those in Embodiment 1 will be omitted.

[0100] Figure 9 is a longitudinal cross-sectional view showing the schematic configuration of the left side of each cleaning unit BT2 and BT4 according to Example 2. Figure 10 is a plan view showing the schematic configuration of the substrate processing apparatus 1A according to Example 2. Figure 11 is a side view of the substrate handling mechanism HTR.

[0101] In Example 1, the shielding plate 71 was attached to the processing tank 2 via a mounting member (not shown). In this respect, the shielding plate in Example 2 may be a dummy substrate (dummy wafer) 100 without a pattern formed on it, held by a holding member 7, as shown in Figure 9. The dummy substrate 100 is a shielding dummy substrate for shielding particles. The dummy substrate 100 is made of silicon. Alternatively, the dummy substrate 100 may be made of ceramic.

[0102] In this embodiment, the substrate processing apparatus 1 of Example 1 will be described as the cleaning processing units BT2 and BT4. Note that the cleaning processing units BT2 and BT4 do not have the shielding plate 71 shown in Figure 3.

[0103] <5. Configuration of substrate processing equipment> Refer to Figure 10. The substrate processing apparatus 1A of this embodiment has a function to automatically set the dummy substrate 100. The substrate processing apparatus 1A includes a stocker block 103, a transfer block 105, and a processing block 107.

[0104] <5-1. Storage Block> The stocker block 103 accommodates at least one carrier C. The stocker block 103 is equipped with at least one load port 109. The stocker block 103 also includes a carrier transport mechanism (robot) 111 and a plurality of storage shelves 113. Each of the plurality of storage shelves 113 stores a plurality of carriers C, including a carrier CD for a dummy substrate. The carrier transport mechanism 111 transports any carrier C stored in the storage shelves 113 to a mounting shelf 119 (described later). The carrier transport mechanism 111 transports the carrier C between the load port 109, the plurality of storage shelves 113, and the mounting shelf 119 (described later). The carrier transport mechanism 111 is equipped with a gripping part that grips a projection on the upper surface of the carrier C, or a hand that supports the carrier C while in contact with the bottom surface of the carrier C.

[0105] The stocker block 103 is equipped with a dummy board carrier CD for storing one or more dummy boards 100 in a horizontal position. The dummy board carrier CD is stored in advance in the storage shelf 113. The carrier transport mechanism 111 normally transports the dummy board carrier CD between the storage shelf 113 and the mounting shelf 119, which will be described later.

[0106] <5-2. Reprint Block> The transfer block 105 is positioned adjacent to the stocker block 103. The transfer block 105 includes an opener 115, a substrate handling mechanism (robot) HTR, and a posture change mechanism 117. The opener 115 includes a mounting shelf 119 on which carriers C are placed. The mounting shelf 119 places multiple carriers C one by one in sequence. The transfer block 105 may include multiple openers 115. The substrate handling mechanism HTR corresponds to the horizontal substrate transport mechanism of the present invention. The mounting shelf 119 corresponds to the carrier mounting shelf of the present invention.

[0107] Carrier C houses multiple (e.g., 25) substrates W in a horizontal position with predetermined spacing (e.g., 10 mm spacing (full pitch)) in the vertical direction Z. The substrates W are aligned in the thickness direction of the substrates W. For example, carrier C can house up to 25 substrates W. For example, FOUP (Front Opening Unify Pod) can be used as carrier C. FOUP is a sealed container. Carrier C may be an open container, and the type is not limited. Carrier CD for dummy substrates is configured similarly to carrier C.

[0108] <5-2-1. Circuit board handling mechanism> Refer to Figures 10 and 11. The substrate handling mechanism HTR picks up and transports multiple substrates W from the carrier C placed on the mounting shelf 119. That is, the substrate handling mechanism HTR can transport multiple (e.g., 25) substrates W in a horizontal orientation all at once between the carrier C placed on the mounting shelf 119 and the orientation change mechanism 117. In addition, the substrate handling mechanism HTR can transport substrates W in a horizontal orientation one at a time between the carrier C placed on the mounting shelf 119 and the orientation change mechanism 117. Therefore, the substrate handling mechanism HTR can pick up and transport one dummy substrate 100 from the dummy substrate carrier CD placed on the mounting shelf 119.

[0109] The substrate handling mechanism HTR includes a batch hand 125 and a single-wafer hand 127. The batch hand 125 comprises multiple (for example, 25) hands 125A. In Figure 11, for illustrative purposes, the batch hand 125 is shown as comprising three hands 125A. Each hand 125A holds one substrate W. The single-wafer hand 127 also holds one substrate W.

[0110] The substrate handling mechanism HTR also includes a batch hand support section 129, a single-wafer hand support section 131, a forward / backward section 133, and a lifting / rotating section 135. The batch hand support section 129 supports the batch hand 125 (multiple hands 125A). As a result, the multiple hands 125A move as a single unit. The single-wafer hand support section 131 supports the single-wafer hand 127.

[0111] The forward / backward unit 133 can independently move the batch hand 125 and the sheet-fed hand 127 forward and backward. Specifically, the forward / backward unit 133 moves multiple hands 125A forward and backward via the batch hand support unit 129, independently of the sheet-fed hand 127. The forward / backward unit 133 can also move the sheet-fed hand 127 forward and backward independently of the batch hand 125. The lifting / rotating unit 135 rotates the batch hand 125 and the sheet-fed hand 127 around the vertical axis AX1 by rotating the forward / backward unit 133 around the vertical axis AX1. The lifting / rotating unit 135 also lifts and lowers the batch hand 125 and the sheet-fed hand 127 by lifting and lowering the forward / backward unit 133. The forward / backward unit 133 and the lifting / rotating unit 135 are each equipped with electric motors.

[0112] <5-2-2. Posture Change Mechanism> Refer to Figure 10. The attitude change mechanism 117 changes the attitude of multiple substrates W and dummy substrates 100 between a horizontal attitude and a vertical attitude. For example, the attitude change mechanism 117 changes the attitude of multiple substrates W and dummy substrates 100 transported by the substrate handling mechanism HTR from a horizontal attitude to a vertical attitude. Also, the attitude change mechanism 117 changes the attitude of multiple substrates W and dummy substrates 100 transported by the transport mechanism WTR (described later) from a vertical attitude to a horizontal attitude.

[0113] Furthermore, the multiple substrates W include a first substrate group and a second substrate group. Therefore, the attitude changing mechanism 117 combines two or more substrates W1 from the first substrate group and two or more substrates W2 from the second substrate group to form multiple substrates W(W1,W2).

[0114] The attitude changing mechanism 117 comprises an attitude changing unit 137 and a pusher mechanism 139. In Figure 10, the substrate handling mechanism HTR, the attitude changing unit 137, and the pusher mechanism 139 are arranged in this order in the width direction Y. Figures 12(a) to 12(f) are diagrams illustrating the attitude changing mechanism 117 (attitude changing unit 137 and pusher mechanism 139) of the transfer block 105.

[0115] Refer to Figure 12(a). The attitude change unit 137 comprises a support base 137A, a pair of horizontal holding units 137B, a pair of vertical holding units 137C, and a rotation drive unit 137D. The pair of horizontal holding units 137B and the pair of vertical holding units 137C are provided on the support base 137A. The horizontal holding units 137B and the vertical holding units 137C receive a plurality of substrates W transported by the substrate handling mechanism HTR. When the substrates W are in a horizontal position, the pair of horizontal holding units 137B support the substrates W from below while contacting the lower surface of each substrate W.

[0116] Furthermore, when the substrate W is in a vertical position, a pair of vertical holding parts 137C hold the substrate W. Each vertical holding part 137C is equipped with multiple (e.g., 26) holding grooves for holding multiple (e.g., 26) substrates W, and multiple (e.g., 26) passing grooves for passing multiple (e.g., 26) substrates. The multiple holding grooves and multiple passing grooves are provided alternately, one at a time.

[0117] The rotary drive unit 137D rotatably supports the support base 137A around the horizontal axis AX2. The rotary drive unit 137D also rotates the support base 137A around the horizontal axis AX2, thereby changing the orientation of the multiple substrates W held by the holding units 137B and 137C from horizontal to vertical.

[0118] Refer to Figure 12(f). The pusher mechanism 139 comprises a pusher 139A, a lifting and rotating section 139B, a horizontal moving section 139C, and a rail 139D. The pusher 139A has a plurality (e.g., 52) of retaining grooves. The pusher 139A supports the lower part of each of the plurality (e.g., 52) vertically positioned substrates W and dummy substrates 100. In Figures 12(a) to 12(f), for illustrative purposes, the pusher 139A is configured to hold eight substrates W, including the dummy substrates 100. In Figures 18(a) and 20(a), described later, for illustrative purposes, the pusher 139A is configured to hold six substrates W.

[0119] The lifting and rotating section 139B is connected to the underside of the pusher 139A. The lifting and rotating section 139B moves the pusher 139A up and down by extending and retracting. The lifting and rotating section 139B also rotates the pusher 139A around the vertical axis AX3. The horizontal moving section 139C supports the lifting and rotating section 139B. The horizontal moving section 139C moves the pusher 139A and the lifting and rotating section 139B horizontally along the rail 139D. The rail 139D is formed to extend in the width direction Y. The rotation drive section 137D, the lifting and rotating section 139B, and the horizontal moving section 139C are each equipped with electric motors.

[0120] <5-3. Processing Block> Refer to Figure 10. The processing block 107 is adjacent to the transfer block 105. The processing block 107 is located on the opposite side of the stocker block 103 via the transfer block 105. The processing block 107 comprises four batch processing units BT1 to BT4 and a transport mechanism WTR.

[0121] The four batch processing units BT1 to BT4 are arranged in this order along the front-to-back direction X. In Figure 10, batch processing unit BT1 is positioned furthest from the transfer block 105. Each of the four batch processing units BT1 to BT4 processes multiple substrates W and dummy substrates 100 at once. For example, the four batch processing units BT1 to BT4 consist of two chemical solution processing units BT1 and BT3, and two cleaning processing units BT2 and BT4. Chemical solution processing unit BT1 and cleaning processing unit BT2 form one pair, and chemical solution processing unit BT3 and cleaning processing unit BT4 form the other pair. Note that one batch processing unit only needs to have one or more chemical solution processing units and one or more cleaning processing units.

[0122] Each of the two chemical treatment units BT1 and BT3 is equipped with a treatment tank 141. Each of the two chemical treatment units BT1 and BT3 performs etching with a chemical solution. For example, phosphoric acid is used as the chemical solution. Each of the two treatment tanks 141 of the chemical treatment units BT1 and BT3 stores the chemical solution supplied from a chemical solution discharge pipe (not shown). The chemical solution discharge pipe is provided on the inner wall of each treatment tank 141.

[0123] Each of the two chemical treatment units BT1 and BT3 is equipped with two lifters LF1 and LF3. Each of the two lifters LF1 and LF3 holds multiple substrates W and dummy substrates 100 in a vertical position, arranged at predetermined intervals (e.g., 5 mm (half pitch)). Each lifter LF1 and LF3 also raises and lowers the multiple substrates W and dummy substrates 100 between a processing position inside the processing tank 141 and a transfer position above the processing tank 141.

[0124] As described above, the cleaning units BT2 and BT4 each have the configuration of Embodiment 1 shown in Figures 1 and 3, except for the shielding plate 71. Each of the cleaning units BT2 and BT4 includes a processing tank 2 for storing processing liquid, a chamber 3 surrounding the processing tank 2, and a lifter 4. The lifter 4 includes a substrate holding part 5 and a lifting mechanism 6 for raising and lowering the substrate holding part 5. The substrate holding part 5 includes three holding members 7 and a back plate 9.

[0125] Refer to Figures 13(a) and 13(b). Each retaining member 7 has a plurality of grooves (e.g., 51) formed in the Y direction at a predetermined pitch (e.g., 5 mm (half pitch)). The 51 grooves are each called slots 1 to 51 (SL1 to SL51). The groove closest to the back plate 9 is slot 1, and the groove furthest from the back plate 9 is slot 51.

[0126] In other words, each retaining member 7 has multiple (e.g., 50) grooves SL1 to SL50 for holding multiple (e.g., 50) substrates W, and a groove SL51 for holding a dummy substrate 100. The groove SL51 (retaining groove for dummy substrates) is positioned on the tip 7A side of each retaining member 7 relative to the grooves SL1 to SL50. That is, the groove SL51 is positioned on the opposite side of the groove SL49 via the groove SL50. Furthermore, the grooves SL1 to SL50 and the groove SL51 are arranged in a line with a predetermined interval (half pitch) between them. Note that each groove SL1 to SL50 corresponds to the retaining groove of the present invention.

[0127] In this embodiment, in order to process multiple substrates W in each cleaning unit BT2, BT4, dummy substrates 100 are added to multiple substrates W each time. Therefore, the groove SL51 is configured so that no substrates W other than the shielding dummy substrates 100 are placed there. Also, as shown in Figure 9, the liquid outlet 76 and the second liquid outlet 86 are positioned closer to the side wall 3A of the chamber 3 than to the dummy substrates 100.

[0128] The transport mechanism WTR transports multiple vertically oriented substrates W and dummy substrates 100 together. The transport mechanism WTR transports multiple vertically oriented substrates W and dummy substrates 100 between the orientation changing mechanism 117 and four batch processing units BT1 to BT4. The transport mechanism WTR comprises a pair of chucks 143, 145, a guide rail 147, and a lifting unit (not shown). Each of the chucks 143, 145 has 51 holding grooves to hold, for example, 50 substrates W and 1 dummy substrate 100. The transport mechanism WTR opens and closes the two chucks 143, 145. The transport mechanism WTR moves the pair of chucks 143, 145 along the guide rail 147. The lifting unit raises and lowers the pair of chucks 143, 145. The transport mechanism WTR is driven by an electric motor.

[0129] The substrate processing apparatus 1A comprises a control unit 61 and a storage unit (not shown). The control unit 61 controls each component of the substrate processing apparatus 1A. The storage unit stores the computer programs necessary to control each component of the substrate processing apparatus 1A.

[0130] <6. Operation of the substrate processing apparatus> The operation of the substrate processing apparatus 1A will be explained with reference to the flowchart in Figure 14. Refer to Figure 10. An external transport robot (not shown) transports the two carriers C to the load port 109 in sequence.

[0131] The substrate processing apparatus 1A combines two or more substrates W1 from the first substrate group of the first carrier C and two or more substrates W2 from the second substrate group of the second carrier C to form a group of processed substrates W aligned face-to-face and at half-pitch. The substrate processing apparatus 1A then transports the group of processed substrates sequentially to, for example, the first chemical treatment unit BT1 and the second cleaning unit BT2, and processes the group of processed substrates all at once. These details will be explained below.

[0132] [Step S21] Transfer of the first group of substrates to the attitude change mechanism The carrier transport mechanism 111 of the stocker block 103 transports the first carrier C from the load port 109 to the storage shelf 119. Here, the first carrier C stores the first group of substrates consisting of 25 substrates W1. Alternatively, the two carriers C may be transported from the load port 109 to the storage shelf 119 via the storage shelf 113.

[0133] Refer to Figure 12(a). In Figures 12(a) to 12(f), for illustrative purposes, the first substrate group consists of three substrates W1, and the second substrate group consists of three substrates W2. Furthermore, when substrates W1 and W2 are not specifically distinguished, they are referred to as "substrate W".

[0134] The substrate handling mechanism HTR uses a batch hand 125 to transport 25 substrates W1 of the first substrate group from the first carrier C placed on the mounting shelf 119 to the attitude changing unit 137. Here, the substrate handling mechanism HTR transports the 25 substrates W1 to the attitude changing unit 137 so that they correspond to the 25 odd-numbered grooves SL1, SL3, SL5, ... SL47, SL49 shown in Figures 13(a) and 13(b). The attitude changing unit 137 uses two pairs of holding units 137B and 137C to receive the 25 substrates W1 from the substrate handling mechanism HTR. At this time, the 25 substrates W1 are in a horizontal orientation with the device surface facing upward. The 25 substrates W1 are arranged at predetermined intervals (full pitch). Full pitch is, for example, 10 mm intervals. Full pitch is also called normal pitch. Half-pitch refers to half the spacing of full-pitch (for example, 5mm).

[0135] [Step S22] Insertion of dummy circuit board After the substrate handling mechanism HTR removes 25 substrates W1 from the first carrier C, the carrier transport mechanism 111 transports the empty first carrier C from the mounting shelf 119 to the storage shelf 113, and then transports the dummy substrate carrier CD from the storage shelf 113 to the mounting shelf 119 (see Figure 10).

[0136] Subsequently, the substrate handling mechanism HTR uses the single-wafer hand 127 to transport the dummy substrate 100 from the dummy substrate carrier CD to the attitude changing unit 137, as shown in Figure 12(a). Here, the substrate handling mechanism HTR transports the dummy substrate 100 to the attitude changing unit 137 so that it corresponds to the groove SL51. As shown in Figure 12(a), the attitude changing unit 137 receives the horizontally positioned dummy substrate 100 in a holding groove above the 25 horizontally positioned substrates W1. In Figure 12(a), the 25 horizontally positioned substrates W1 and the dummy substrate 100 are aligned vertically in the Z direction with a full pitch (e.g., 10 mm).

[0137] After the substrate handling mechanism HTR removes one dummy substrate 100 from the dummy substrate carrier CD, the carrier transport mechanism 111 transports the dummy substrate carrier CD from the mounting shelf 119 to the storage shelf 113, and then transports the second carrier C from the load port 109 to the mounting shelf 119 (see Figure 10).

[0138] [Step S23] Changing the orientation of the first substrate group to a vertical orientation. Refer to Figure 12(b). After the dummy substrate 100 is transported to the attitude change unit 137, the rotation drive unit 137D rotates the two pairs of holding parts 137B and 137C provided on the support base 137A by 90 degrees around the horizontal axis AX2. As a result, the attitude change unit 137 changes the orientation of the 25 substrates W1 and the dummy substrate 100 from horizontal to vertical.

[0139] Refer to Figure 12(c). Subsequently, the lifting and rotating section 139B of the pusher mechanism 139 raises the pusher 139A to a position higher than the holding sections 137B and 137C of the attitude changing section 137. As a result, the pusher 139A receives the 25 substrates W1 and dummy substrates 100 from the holding sections 137B and 137C. The 25 substrates W1 held by the pusher 139A are oriented to the left Y. In Figures 12(a) to 12(f), the arrows AR2 attached to the substrates W (W1, W2) indicate the orientation of the device surface of the substrate W.

[0140] Refer to Figure 12(d). The pusher mechanism 139 rotates the 25 vertically oriented substrates W1 and dummy substrate 100 by 180 degrees around the vertical axis AX3. As a result, the 25 substrates W1 are inverted and face right Y. Furthermore, the inverted 25 substrates W1 move half a pitch (e.g., 5 mm) to the left Y from their positions before rotation. The attitude change unit 137 also rotates the holding units 137B and 137C by -90 degrees around the horizontal axis AX2 to prepare them to receive the next substrate W2. Note that the attitude change unit 137 and the pusher mechanism 139 are operated in such a way that they do not interfere with each other.

[0141] [Step S24] Transfer of the second group of substrates to the attitude change mechanism The second carrier C is placed on the mounting shelf 119. The second carrier C houses a second group of substrates consisting of 25 substrates W2. The substrate handling mechanism HTR uses the batch hand 125 to transport all 25 substrates W2 of the second group from the second carrier C placed on the mounting shelf 119 to the attitude changing unit 137. Here, the substrate handling mechanism HTR transports the 25 substrates W2 to the attitude changing unit 137 so that they correspond to the 25 even-numbered grooves SL2, SL4, SL6, ... SL48, SL50 shown in Figures 13(a) and 13(b). As shown in Figure 12(d), the attitude changing unit 137 receives the 25 substrates W2 in a horizontal orientation using two holding units 137B and 137C. At this time, the device side of each of the 25 substrates W2 is facing upward.

[0142] [Step S25] Changing the orientation of the second group of substrates to a vertical orientation. Refer to Figure 12(e). The pusher mechanism 139 lowers the pusher 139A, which holds the 25 substrates W1 and the dummy substrate 100, to a retracted position. Then, the attitude change unit 137 changes the attitude of the 25 substrates W2 from horizontal to vertical. After the attitude change, the 25 substrates W2 are facing left Y. Refer to Figure 12(f). Then, the pusher mechanism 139 raises the pusher 139A, which holds the 25 substrates W2 of the second substrate group. As a result, the pusher mechanism 139 receives another 25 substrates W2 from the attitude change unit 137.

[0143] Therefore, the first substrate group, the second substrate group, and the dummy substrate 100 are combined to form a processing substrate group (50 substrates W1, W2, and the dummy substrate 100). The processing substrate group is aligned at half-pitch. The 50 substrates W1 and W2 are arranged alternately, with 25 substrates W1 from the first substrate group and 25 substrates W2 from the second substrate group, one at a time. The 25 substrates W1 are oriented in the opposite direction to the 25 substrates W2. Therefore, the 50 substrates W1 and W2 are arranged in a face-to-face manner. That is, two adjacent substrates W1 and W2 have their two device faces (or two back faces) facing each other.

[0144] Subsequently, the pusher mechanism 139 transports the group of processed substrates along the rail 139D to a substrate transfer position PP defined within the transfer block 105. The substrate transfer position PP is located below a pair of chucks 143 and 145 of the transport mechanism WTR.

[0145] [Step S26] Chemical treatment The transport mechanism WTR transports the vertically oriented processing substrates (50 substrates W1, W2 and 1 dummy substrate 100) from the pusher mechanism 139 at the substrate transfer position PP. That is, the transport mechanism WTR receives the vertically oriented processing substrates at the substrate transfer position PP and transports the processing substrates to one of the two lifters LF1, LF3 of the two chemical treatment units BT1, BT3. For example, lifter LF1 receives the processing substrates transported by the transport mechanism WTR at a position above the treatment tank 141 of the chemical treatment unit BT1. Lifter LF1 immerses the processing substrates in the phosphoric acid (treatment solution) stored in the treatment tank 141. As a result, the 50 substrates W are etched. During this process, the dummy substrate 100 is not counted, and phosphoric acid is replenished according to the number of substrates W.

[0146] After etching, lifter LF1 removes the processed substrates from the phosphoric acid in the processing tank 141. Even if the processed substrates are transported to lifter LF3, chemical treatment unit BT3 performs the same treatment on the processed substrates as chemical treatment unit BT1.

[0147] [Step S27] Washing and drying process The transport mechanism WTR receives a group of vertically positioned substrates (50 substrates W1, W2 and 1 dummy substrate 100) from, for example, the lifter LF1, and transports the group of substrates to the substrate holding section 5 of the lifter 4 of the cleaning processing section BT2, as shown in Figures 1, 9, 13(a), and 13(b). When receiving the group of substrates, the lifting mechanism 6 (see Figure 1) positions the substrate holding section 5 in the drying position H1. The substrate holding section 5 holds the 50 vertically positioned substrates W1, W2, and also holds the dummy substrate 100 so that it is positioned between the leading substrate WT, which is furthest from the back plate 9 among the 50 substrates W1, W2, and the side wall 3A of the chamber 3, where the leading edges 7A of each holding member 7 face each other. Specifically, the substrate holding unit 5 receives and holds 50 substrates W1, W2 and a dummy substrate 100 using the 50 grooves SL1 to SL50 and one groove SL51 of each holding member 7. The substrate holding unit 5 moves between the processing position H2 in the processing tank 2 and the drying position H1 above the processing tank 2 while holding the group of substrates to be processed.

[0148] The cleaning unit BT2 performs the cleaning and drying processes shown in steps S01 to S14 of Figure 6 on the group of substrates to be processed. During this process, a dummy substrate 100 is provided to shield the atmosphere that accumulates on the tip 7A side of each holding member 7. This protects the substrates W from particles mixed in that atmosphere.

[0149] When the processing substrates are processed in the chemical solution processing unit BT3, the transport mechanism WTR transports the processing substrates from the chemical solution processing unit BT3 to the cleaning processing unit BT4. The cleaning processing unit BT4 performs the same processing on the processing substrates as the cleaning processing unit BT2.

[0150] [Step S28] Change of posture to horizontal position Subsequently, the transport mechanism WTR transports the vertically oriented processed substrates from the processing tank 2, etc., from one of the two substrate holding units 5 to the orientation change mechanism 117. That is, the transport mechanism WTR receives the processed substrates from one of the two substrate holding units 5 of the two cleaning processing units BT2, BT4, and transports the processed substrates to the orientation change mechanism 117. The pusher 139A is moved to the substrate transfer position PP by the horizontal movement unit 139C. The pusher 139A holds the 50 substrates W (W1, W2) and the dummy substrate 100 of the processed substrate group transported by the transport mechanism WTR in a vertical position.

[0151] The attitude change mechanism 117 divides the 50 substrates W1 and W2 transported by the transport mechanism WTR into a first substrate group of 25 substrates W1 and a second substrate group of 25 substrates W2. The attitude change mechanism 117 also changes the orientation of the first substrate group, the second substrate group, and the dummy substrate 100 from a vertical orientation to a vertical orientation. This will be explained in detail.

[0152] The attitude change mechanism 117 operates, for example, in the order from Figure 12(f) to Figure 12(a). That is, the attitude change mechanism 117 removes the 25 boards W2 of the second board group from the processing board group and changes them from a horizontal orientation to a vertical orientation. After that, the attitude change mechanism 117 changes the 25 boards W1 of the first board group and the dummy board 100 from a vertical orientation to a horizontal orientation. Note that the attitude change mechanism 117 may remove the 25 boards W1 and the dummy board 100 of the first board group from the processing board group in order to return the first board group to the empty carrier C before the second board group.

[0153] [Step S29] Transfer of substrate to carrier The carrier transport mechanism 111 selectively transports one of the first carrier C, the second carrier C, and the dummy substrate carrier CD to the mounting shelf 119. The substrate handling mechanism HTR uses the batch hand 127 to transport 25 substrates W2 of the second substrate group from the attitude changing unit 137 to the second carrier C on the mounting shelf 119. The substrate handling mechanism HTR also uses the single-wafer hand 127 to transport dummy substrates 100 from the attitude changing unit 137 to the dummy substrate carrier CD on the mounting shelf 119. Furthermore, the substrate handling mechanism HTR uses the batch hand 125 to transport 25 substrates W1 of the first substrate group from the attitude changing unit 137 to the first carrier C on the mounting shelf 119.

[0154] The carrier transport mechanism 111 transports the dummy board carrier CD, which contains the dummy board 100, from the loading shelf 119 to the storage shelf 113. The carrier transport mechanism 111 also transports the first carrier C, which contains the processed board W1, and the second carrier C, which contains the processed board W2, from the loading shelf 119 to the load port 109. The external transport robot then transports the two carriers C, each transported to the load port 109, to their respective next destinations in sequence.

[0155] In this embodiment, the dummy substrate 100, acting as a shielding plate, protects the substrate W from particles mixed in the atmosphere stagnating at the tip 7A of the holding member 7. Furthermore, the gas flow between the tip substrate WT and the dummy substrate 100 can be improved. As a result, it is possible to prevent particles from adhering to the substrate W (tip substrate WT).

[0156] The substrate holding section 5 holds multiple substrates W in a vertical position and also holds a dummy substrate 100 so as to be positioned between the leading substrate WT and the side wall 3A of the chamber 3. This prevents particles from adhering to the leading substrate WT. The substrate processing apparatus 1A is also equipped with a dummy substrate carrier CD, which houses the shielding dummy substrate 100. The dummy substrate 100 is added for each of the multiple substrates W that are processed together in the processing tank 2. After processing in the processing tank 2, the dummy substrate 100 is returned to the dummy substrate carrier CD separately from the multiple substrates W. Therefore, it is possible to prevent particles from adhering to the leading substrate WT without permanently installing a shielding plate 71 inside the chamber 3 surrounding the processing tank 2.

[0157] In Figure 12(f), substrate W2 of the second substrate group, indicated by the symbol EE1, was the leading substrate WT. When the pusher 139A is rotated 180 degrees around the vertical axis AX3 from this state, substrate W1 of the first substrate group, indicated by the symbol EE2, becomes the leading substrate WT. Therefore, the leading substrate WT changes depending on the formation method of the 50 substrates W. In this case, the dummy substrate 100 may not be transported to the attitude conversion unit 137 in Figure 12(a), but may be transported to the attitude conversion unit 137 in Figure 12(d). After that, the attitude conversion unit 137 converts the second substrate group and the dummy substrate 100 from a horizontal attitude to a vertical attitude. [Example 3]

[0158] Next, Embodiment 3 of the present invention will be described with reference to the drawings. Note that explanations that overlap with Embodiments 1 and 2 will be omitted. Figure 15 is a longitudinal cross-sectional view showing the schematic configuration of the left side of each cleaning unit BT2 and BT4 according to Embodiment 3.

[0159] In Example 2, a dummy substrate 100 was added to a set of multiple substrates W (W1, W2) that were to be processed in batches each time. In contrast, in Example 3, when the substrate detection sensor unit 153 detects that there is no substrate W corresponding to the groove SL50 (tip holding groove) in the carrier C, a dummy substrate 100 is added to a set of multiple substrates W that are to be processed in batches. The dummy substrate 100 is held in the groove SL50, as shown in Figure 15.

[0160] Figure 16(a) is a side view showing the configuration of the opener 115. Figure 16(b) is a top view showing the detection state of the substrate detection sensor. The opener 115 comprises a mounting shelf 119 on which the carrier C is placed, a shutter 151 for attaching and detaching the door DR of the carrier C, and a substrate detection sensor unit 153. The mounting shelf 119 is positioned to protrude into the area of ​​the stocker block 103.

[0161] The substrate detection sensor unit 153 moves vertically relative to the carrier C placed on the mounting shelf 119 and detects the presence or absence of a substrate W housed in the carrier C. The substrate detection sensor unit 153 comprises a sensor body 153A, an arm 153B, a sensor lifting unit 153C, and a sensor moving unit 153D.

[0162] The sensor body 153A includes, for example, a through-type sensor (optical sensor) having a light emitter and a light receiver. The control unit 61 detects the presence of the substrate W when the light from the light emitter is blocked by the substrate W and the light receiver does not detect light. The control unit 61 also detects the absence of the substrate W when the light receiver detects light from the light emitter.

[0163] Arm 153B supports the sensor body 153A. Sensor lifting unit 153C raises and lowers the sensor body 153A and arm 153B. That is, sensor lifting unit 153C moves the sensor body 153A, etc., in the vertical direction Z. Sensor reciprocating unit 153D moves the sensor body 153A and arm 153B in the front-rear direction X. Sensor lifting unit 153C and sensor reciprocating unit 153D are each equipped with an electric motor. Sensor lifting unit 153C is also equipped with a height sensor (e.g., a linear encoder or rotary encoder) for detecting the height position of the sensor body 153A (the substrate W to be detected).

[0164] As shown in Figures 2(a) and 2(b), each holding member 7 of the substrate holding section 5 in this embodiment is provided with, for example, 50 grooves SL1 to SL50. Also, each of the two chucks 143 and 145 of the transport mechanism WTR in this embodiment is provided with, for example, 50 holding grooves. Each vertical holding section 137C is provided with, for example, 25 holding grooves and 25 passing grooves. The pusher 139A has 50 holding grooves.

[0165] <7. Operation of the substrate processing device> The operation of the substrate processing apparatus 1A will be explained with reference to the flowchart in Figure 17. Figures 18(a) to 18(f) are side views illustrating the attitude change mechanism according to Embodiment 3.

[0166] The substrate processing apparatus 1A combines substrate W1 of the first substrate group of the first carrier C and substrate W2 of the second substrate group of the second carrier C to form a group of processed substrates W that are aligned face-to-face and at half-pitch. These details will be explained below.

[0167] [Step S41] Detection of the presence or absence of a substrate in the first carrier The carrier transport mechanism 111 of the stocker block 103 transports the first carrier C from the load port 109 to the storage shelf 119. Here, the first carrier C stores 25 circuit boards W1.

[0168] The shutter 151 of the opener 115 removes the door DR of the first carrier C. Then, the substrate detection sensor unit 153 (sensor lifting unit 153C and sensor forward / backward unit 153D) moves the sensor body 153A into the carrier C, as shown in Figure 16(b). Subsequently, the sensor lifting unit 153C detects the presence or absence of the substrate W1 inside the first carrier C by raising or lowering the sensor body 153A.

[0169] Furthermore, the substrate detection sensor unit 153 can detect when a substrate W1 (corresponding substrate) corresponding to groove SL50 is not present in the first carrier C (first substrate absence state). The memory unit of the substrate processing apparatus 1A stores the correspondence between substrates W (processing substrate group) aligned face-to-face and at half-pitch based on the processing substrate group formation method, substrate W1 (first substrate group) of the first carrier C, and substrate W2 (second substrate group) of the first carrier C. Therefore, if a predetermined substrate W1 is not present in the first carrier C, the substrate processing apparatus 1A can determine which position in the processing substrate group the missing substrate W1 is located at.

[0170] In the formation method of the processed substrate groups shown in Figures 18(a) to 18(f), the substrate W1 of the first substrate group is held in the odd-numbered grooves SL1, SL3, SL5, ..., SL47, SL49 of each retaining member 7. The substrate W2 of the second substrate group is held in the even-numbered grooves SL2, SL4, SL6, ..., SL48, SL50 of each retaining member 7.

[0171] [Step S42] Transfer of the first group of substrates to the attitude change mechanism As shown in Figure 18(a), the substrate handling mechanism HTR uses the batch hand 125 to transport 25 substrates W1 at once from the first carrier C placed on the mounting shelf 119 to the attitude changing section 137 of the attitude changing mechanism 117. Here, the substrate detection sensor 153 does not detect that there is no substrate W1 (corresponding substrate W1) corresponding to groove SL50 on the first carrier C. Therefore, the dummy substrate 100 is not inserted.

[0172] [Step S43] Changing the orientation of the first group of substrates to a vertical orientation. Subsequently, the attitude conversion unit 137 converts the 25 substrates W1 from a horizontal orientation to a vertical orientation. See Figure 18(b). Then, the lifting and rotating unit 139B of the pusher mechanism 139 receives the 25 substrates W1 in the vertical orientation from the attitude conversion unit 137 by raising the pusher 139A. See Figure 18(c). Then, the lifting and rotating unit 139B rotates the 25 substrates W1 180 degrees around the vertical axis AX3.

[0173] [Step S44] Detection of the presence or absence of a substrate in the second carrier After 25 substrates W1 are transported from the first carrier C, the shutter 151 of the opener 115 attaches the door DR to the first carrier C. Then, the carrier transport mechanism 111 transports the empty first carrier C to the storage shelf 113. After that, the carrier transport mechanism 111 transports the second carrier C from the load port 9 to the mounting shelf 119. Here, the second carrier C can store a maximum of 25 substrates W2. However, let's assume that the second carrier C already stores 24 substrates W2 from the second group of substrates.

[0174] Subsequently, the shutter 151 of the opener 115 removes the door DR of the second carrier C. Then, the circuit board detection sensor unit 153 detects the presence or absence of circuit board W2 in the second carrier C. The circuit board detection sensor unit 153 then detects that there is no circuit board W2 (corresponding circuit board W2) corresponding to groove SL50 in the second carrier C (first circuit board absent state).

[0175] [Step S45] Transfer of the second group of substrates to the attitude change mechanism As shown in Figure 18(c), the substrate handling mechanism HTR uses the batch hand 125 to transport 24 substrates W2 at once from the second carrier C, which is placed on the mounting shelf 119 in place of the first carrier C, to the attitude changing section 137 of the attitude changing mechanism 117.

[0176] [Step S46] Insertion of dummy circuit board Subsequently, when the substrate detection sensor unit 153 detects that there is no corresponding substrate W2 in the second carrier C that corresponds to groove SL50, the substrate processing device 1A operates as follows: After 24 substrates W2 have been transported from the second carrier C, the shutter 151 of the opener 115 attaches the door DR to the second carrier C. Then, the carrier transport mechanism 111 transports the empty second carrier C to the storage shelf 113. After that, the carrier transport mechanism 111 transports the dummy substrate carrier CD, which contains one or more dummy substrates 100, from the storage shelf 113 to the mounting shelf 119.

[0177] Subsequently, the shutter 151 of the opener 115 removes the door DR of the dummy substrate carrier CD. Then, the substrate handling mechanism HTR uses the single-wafer hand 127 to transport the dummy substrate 100 to the section of the row of 24 substrates W2 that has been transported to the attitude change unit 137 where there is no corresponding substrate W2. To explain in detail, the substrate handling mechanism HTR uses the single-wafer hand 127 to remove the dummy substrate 100 from the dummy substrate carrier CD that has been placed on the mounting shelf 119 in place of the second carrier C. Then, as shown in Figure 18(d), the substrate handling mechanism HTR transports the dummy substrate 100 to the holding groove (section) of the vertical holding part 137C of the attitude change unit 137 where there is no corresponding substrate W2 (substrate W2 corresponding to the groove SL50 of each holding member 7).

[0178] [Step S47] Changing the orientation of the second group of substrates to a vertical orientation. Refer to Figure 18(e). The pusher 139A, which holds the 25 substrates W1 (first substrate group) in a vertical position, is lowered below the holding parts 137B and 137C of the attitude conversion unit 137 by the lifting and rotating part 139B of the pusher mechanism 139. After the 24 substrates W2 and dummy substrates 100 are transported to the attitude conversion unit 137, the attitude conversion unit 137 converts the 24 substrates W2 and dummy substrates 100 from a horizontal position to a vertical position.

[0179] Refer to Figure 18(f). Subsequently, the lifting and rotating section 139B receives 24 vertically positioned substrates W2 (second substrate group) and a dummy substrate 100 from the attitude changing section 137 by raising the pusher 139A. As a result, the first substrate group, the second substrate group, and the dummy substrate 100 are combined to form a processing substrate group (49 substrates W1, W2 and 1 dummy substrate 100) aligned in a half-pitch and face-to-face manner. The horizontal movement section 139C of the pusher mechanism 139 transports the processing substrate group to the substrate transfer position PP determined within the transfer block 5.

[0180] Steps S48 and S49 are performed in the same manner as steps S26 and S27 of Example 2. During the etching process in step S48, the dummy substrate 100 is not counted, and phosphoric acid is replenished according to the number of substrates W (49). In the cleaning and drying process in step S49, each holding member 7 of the substrate holding section 5 holds the 49 substrates W and the dummy substrate 100 in 50 grooves SL1 to SL50. At this time, the leading substrate WT is held in groove (slot) SL49, as shown in Figure 15. The dummy substrate 100 is held in groove SL50. The dummy substrate 100 prevents particles from adhering to the substrate W (leading substrate WT).

[0181] [Step S50] Change of posture to horizontal position Subsequently, the transport mechanism WTR receives the processed substrates from one of the two substrate holding units 5 of the two cleaning processing units BT2 and BT4, and transports the processed substrates to the attitude change mechanism 117. The pusher 139A is moved to the substrate transfer position PP by the horizontal movement unit 139C. The pusher 139A holds the 49 substrates W (W1, W2) and the dummy substrate 100 of the processed substrates transported by the transport mechanism WTR in a vertical position.

[0182] The attitude change mechanism 117 operates, for example, in the order from Figure 18(f) to Figure 18(a). That is, the attitude change mechanism 117 removes 24 boards W2 and 1 dummy board 100 from the processing board group and changes their orientation from horizontal to vertical. After that, the attitude change mechanism 117 changes the 25 boards W1 of the first board group from vertical to horizontal. The attitude change mechanism 117 may remove the 25 boards W1 of the first board group from the processing board group in order to return the first board group to the empty carrier C before the second board group.

[0183] [Step S51] Transport of substrate to carrier The carrier transport mechanism 111 selectively transports one of the first carrier C, the second carrier C, and the dummy substrate carrier CD to the mounting shelf 119. The substrate handling mechanism HTR uses the single-wafer hand 127 to transport the dummy substrate 100 from the attitude changing unit 137 to the dummy substrate carrier CD on the mounting shelf 119. The substrate handling mechanism HTR also uses the batch hand 125 to transport the 24 substrates W2 of the second substrate group from the attitude changing unit 137 to the second carrier C on the mounting shelf 119. Furthermore, the substrate handling mechanism HTR uses the batch hand 125 to transport the 25 substrates W1 of the first substrate group from the attitude changing unit 137 to the first carrier C on the mounting shelf 119.

[0184] The carrier transport mechanism 111 transports the dummy board carrier CD, which contains the dummy board 100, to the storage shelf 113. The carrier transport mechanism 111 also transports the first carrier C, which contains the processed board W1, and the second carrier C, which contains the processed board W2, to the load port 109. The external transport mechanism then transports the two carriers C, each transported to the load port 109, to their respective next destinations in sequence.

[0185] In this embodiment, the 50 grooves SL1 to SL50 of each holding member 7 of the substrate holding unit 5 have a groove SL50 (tip holding groove) located at the very end on the tip end 7A side of each holding member 7. When the substrate detection sensor unit 153 detects that there is no corresponding substrate W2 in the second carrier C corresponding to groove SL50, the substrate handling mechanism HTR transports a dummy substrate 100 to the part of the row of second substrates transported to the attitude change mechanism 117 where there is no corresponding substrate W. This allows the dummy substrate 100 to be automatically positioned between the tip substrate WT and the side wall 3A of the chamber 3 where the tip ends 7A sides of each holding member 7 face each other. The substrate processing device 1A is also equipped with a dummy substrate carrier CD, which houses the dummy substrate 100 for shielding. The dummy substrate 100 is selectively added to a plurality of substrates W that are processed collectively in the processing tank 2. After being processed in the processing tank 2, the dummy substrate 100 is returned to the dummy substrate carrier CD separately from the 49 substrates W. Therefore, it is possible to prevent particles from adhering to the leading substrate WT without having to permanently install a shielding plate 71 inside the chamber 3 surrounding the processing tank 2.

[0186] In this embodiment, if the substrate detection sensor unit 153 does not detect that there is no substrate W2 corresponding to groove SL50 in the second carrier C, for example, dummy substrates 100 will not be inserted into a set of 50 substrates W1 and W2. This is because, as shown in Figure 2(a), the device surface of groove SL49, for example, which faces the tip 7A side of the holding member 7, is protected by the substrate W1 held in groove SL50. Also, since the device surface of substrate W1 held in groove SL50 faces substrate W2 held in groove SL49, it prevents particles from adhering to the device surface of substrate W1 held in groove SL50. In this case, particles will adhere to the back surface of substrate W1 held in groove SL50, but in this embodiment, this particle adhesion is permitted.

[0187] In the manufacturing method of the processing substrate group shown in Figures 18(a) to 18(f), one substrate W2 of the second substrate group housed in the second carrier C corresponds to the corresponding substrate W2 for groove SL50. In this regard, for example, in the state shown in Figure 18(f), if the vertically oriented substrates W(W1,W2) are rotated 180 degrees around the vertical axis AX3, substrate W1 of the first substrate group corresponds to the corresponding substrate W1 for groove SL50. [Example 4]

[0188] Next, Embodiment 4 of the present invention will be described with reference to the drawings. Note that explanations that overlap with Embodiments 1 to 3 will be omitted.

[0189] Figure 19 is a left side view showing the substrate holding portion 5 of the lifter 4. Figures 20(a) to 20(f) are side views illustrating the operation of the attitude changing mechanism 117 according to Embodiment 4, including the insertion of the dummy substrate 100.

[0190] In Embodiment 3, when the substrate detection sensor unit 153 detects that there is no corresponding substrate W (W2) corresponding to groove SL50 on the second carrier C, the substrate handling mechanism HTR transports one dummy substrate 100 to the portion of the row of second substrates transported to the attitude conversion unit 137 where there is no corresponding substrate W2 (corresponding to groove SL50). The same applies when there is no substrate W corresponding to grooves SL48 and SL49. In this respect, in Embodiment 3, as shown in Figure 19, when the substrate detection sensor unit 153 detects that there is no substrate W (corresponding substrate W) corresponding not only to groove SL50 but also to, for example, two grooves SL48 to SL49, the substrate handling mechanism HTR transports one dummy substrate 100.

[0191] Refer to Figure 19. For example, the substrate holding section 5 of the lifter 4 holds 47 substrates W with 47 grooves SL1 to SL47. That is, the three grooves SL48 to SL50 of the substrate holding section 5 do not hold any substrates W. In this case, the substrate processing device 1A operates to place a dummy substrate 100 in either of the two grooves SL48 or SL50.

[0192] The substrate detection sensor unit 153 shown in Figure 16(a) is capable of detecting that there is no corresponding substrate in the carrier C corresponding to groove SL50 (first substrate-less state). Furthermore, the substrate detection sensor unit 153 is capable of detecting that there is no second corresponding substrate W in at least one of the first carrier C and the second carrier corresponding to one or more grooves between the groove that holds the leading substrate WT (leading retaining groove) and groove SL50 among the 50 grooves SL1 to SL50 (second substrate-less state). For example, in Figure 19, the substrate detection sensor unit 153 detects that there is no corresponding substrate W corresponding to groove SL50, and that there are no second corresponding substrates W corresponding to the two grooves SL48 and SL49 between groove SL47 that holds the leading substrate WT and groove SL50. The substrate handling mechanism HTR uses a single-wafer hand 127 to transport one dummy substrate 100 to the portion of a row of multiple substrates W2 in the second substrate group that corresponds to either groove SL48 or SL50.

[0193] Next, the operation of the substrate processing apparatus 1A in this embodiment will be described with reference to the flowchart in Figure 17.

[0194] The carrier transport mechanism 111 transports the first carrier C to the mounting shelf 119. The substrate detection sensor unit 153 moves vertically relative to the first carrier C placed on the mounting shelf 119 and detects the presence or absence of a substrate W1 to be stored in the first carrier C. As a result, the substrate detection sensor unit 153 detects that there is no corresponding substrate W1 corresponding to the groove SL49 of each holding member 7 (step S41).

[0195] Subsequently, as shown in Figure 20(a), the substrate handling mechanism HTR uses the batch hand 125 to transport the 24 substrates W1 of the first substrate group from the first carrier C placed on the mounting shelf 119 to the attitude conversion unit 137 (step S42). The attitude conversion unit 137 then converts the transported 24 substrates W1 from a horizontal orientation to a vertical orientation. As shown in Figure 20(b), the pusher mechanism 139 receives the 24 substrates W1 that have been converted to a vertical orientation with the pusher 139A. As shown in Figure 20(c), the pusher mechanism 139 rotates the 24 vertical substrates W1 held by the pusher 139A around the vertical axis AX3 (step S43).

[0196] Subsequently, the carrier transport mechanism 111 transports the second carrier C to the mounting shelf 119 in place of the first carrier C. The substrate detection sensor unit 153 moves vertically relative to the second carrier C placed on the mounting shelf 119 and detects the presence or absence of a substrate W2 to be stored in the second carrier C. As a result, the substrate detection sensor unit 153 detects that there is no corresponding substrate W corresponding to the grooves SL48, 50 of each holding member 7 (step S44).

[0197] Subsequently, as shown in Figure 20(c), the substrate handling mechanism HTR uses the batch hand 125 to transport the 23 substrates W2 of the first substrate group from the first carrier C placed on the mounting shelf 119 to the attitude change unit 137 (step S45). At this point, in step S44, the substrate detection sensor unit 153 detects that there is no corresponding substrate W corresponding to groove SL50 (first substrate-less state), and that there is no second corresponding substrate corresponding to the two grooves SL48 and SL49 between groove SL47, which holds the leading substrate WT, and groove SL50 (second substrate-less state).

[0198] In this case, as shown in Figure 20(d), the substrate handling mechanism HTR uses the single-wafer hand 127 to transport the dummy substrate 100 to the part of the groove SL48 that is the closest even-numbered groove to the leading substrate WT among the three grooves SL48 to SL50 that do not have a corresponding substrate W, for example groove SL48, where there is no corresponding substrate W2 (step S46). Alternatively, the dummy substrate 100 may be transported to the part of the groove SL50 where there is no corresponding substrate W. Furthermore, for example, if there are no corresponding substrates W for five consecutive grooves SL46 to SL50, the dummy substrate 100 may be transported to any part of the groove SL46, LS48, or LS50 where there is no corresponding substrate W2.

[0199] Subsequently, as shown in Figure 20(e), the attitude conversion unit 137 converts the 23 transported substrates W2 and the 1 dummy substrate 100 from a horizontal orientation to a vertical orientation. As shown in Figure 20(f), the pusher mechanism 139 receives the 23 substrates W2 and the 1 dummy substrate 100, which have been converted to a vertical orientation, with the pusher 139A (step S47).

[0200] As a result, the first substrate group, the second substrate group, and the dummy substrate 100 are combined to form a group of processing substrates (47 substrates W1, W2 and 1 dummy substrate 100) aligned in a half-pitch and face-to-face manner. The following explanation is the same as in Example 3 and will be omitted.

[0201] According to this embodiment, the substrate detection sensor unit 153 can detect that there is no corresponding substrate in the second carrier C corresponding to groove SL50 (tip holding groove) (first substrate-less state). The substrate detection sensor unit 153 can detect that there are no two second corresponding substrates (one or more second corresponding substrates) in the first carrier C or second carrier C corresponding to, for example, two grooves SL48, SL49 (one or more grooves) between groove SL47 and groove SL50 that hold the tip substrate WT among the 50 grooves SL1 to SL50 (second substrate-less state). When the substrate detection sensor unit 153 detects the first substrate-less state or the second substrate-less state, the substrate handling mechanism HTR transports a dummy substrate to the part of the row of second substrates transported to the attitude change mechanism 117 where either the first or second corresponding substrate is missing.

[0202] The dummy substrate 100 can be inserted into either groove SL48 or SL50, for example. When the dummy substrate 100 is held in groove SL50, it can shield the atmosphere that has accumulated near the tip 7A of the holding member 7. Furthermore, particle adhesion can be prevented at the same position regardless of the number of substrates W1 and W2. Also, if the dummy substrate 100 is placed near the tip substrate WT, particles can be prevented from near the tip substrate WT.

[0203] The present invention is not limited to the embodiments described above, and can be modified and implemented as follows.

[0204] (1) In the above-described embodiment, the holding member 7 of the substrate holding section 5 was configured to hold a plurality of substrates W, for example, 50 substrates W. However, it may be configured to hold, for example, 25 substrates W. In this case, the holding member 7 may have 25 grooves spaced 10 mm apart.

[0205] (2) In the above-described embodiment and modification (1), the holding member 7 held 49 (odd number) substrates W. This prevented particles from adhering to the device surface of the tip substrate WT. In this regard, the holding member 7 may hold 50 (even number) substrates W. This prevents particles from adhering to the "back surface" of the tip substrate WT.

[0206] (3) In the embodiments and modifications described above, the holding member 7 held 49 substrates W. The device surfaces of the substrates W in the odd-numbered slots were oriented in the direction from the base end 7B to the tip end 7A of the holding member 7 (-Y direction). The device surfaces of the substrates W in the even-numbered slots were oriented in the direction toward the base end 7B (+Y direction). That is, the two device surfaces or two back surfaces of two adjacent substrates W were facing each other. Alternatively, all 49 substrates W may be oriented toward the tip end 7A (-Y direction). Alternatively, all 49 substrates W may be oriented toward the base end 7B (+Y direction). That is, the device surface and back surface of two adjacent substrates W would face each other.

[0207] (4) The shielding plate 71 of the above-described embodiments and each modified example may be configured as follows. That is, as shown in Figure 21(a), the shielding plate 95 may comprise a main body 95A and a cylindrical portion 95B. The cylindrical portion 95B is positioned on the substrate holding portion 5 side and faces the front substrate WT. The diameter of the cylindrical portion 95B is approximately the same as the diameter of each substrate W. This further ensures that, as shown in Figure 21(b), when the transport robot transports multiple substrates W located at the drying position H1, the two arms 96 of the transport robot do not interfere with the shielding plate 95. Figure 21(b) is a view in the direction of arrow AR1 in Figure 21(a).

[0208] (5) In the embodiments and modifications described above, the liquid outlet 76 faced the same direction as the multiple discharge ports 75. However, as shown in Figure 22, the liquid outlet 76 may face a different direction (for example, downward) from the multiple discharge ports 75. This allows the condensed solvent liquid to be directed in a direction that does not affect the substrate W, such as causing particle adhesion problems. The second liquid outlet 86 of the water-repellent vapor nozzle 33 may also face a different direction from the multiple second discharge ports 85.

[0209] (6) In the embodiments and modifications described above, the exhaust port 47 is provided on the side wall 3A of the chamber 3, as shown in Figure 3. However, if the flow velocity slows down in the region 91 shown in Figure 7, and as a result the atmosphere tends to stagnate, the exhaust port 47 does not need to be provided on the side wall 3A facing the tip 7A of the holding member 7.

[0210] (7) In each of the embodiments and modifications described above, as shown by arrow AR1 in Figure 2(a), when viewing the multiple substrates W from the back plate 9 side, the back plate 9 was formed to cover a portion of each substrate W. However, the back plate 9 may be formed to cover the entirety of each substrate W.

[0211] (8) In each of the embodiments and modifications described above, the upper end 72 of the shielding plate 71 is positioned to reach the ceiling surface 3E of the chamber. In this respect, the upper end of the shielding plate 71 may be positioned higher than the upper end of the tip substrate WT. This prevents the mist-like solvent discharged from the liquid outlets 76, 86 of the nozzles 31, 32, 33 from going over the shielding plate 71 which is higher than the upper end of the tip substrate WT and heading toward the multiple substrates W.

[0212] (9) In each of the embodiments and modifications described above, the upper end 72 of the shielding plate 71 is positioned to reach the ceiling surface 3E of the chamber. In this respect, the upper end 72 of the shielding plate 71 may be positioned higher than the upper end of the inert gas nozzle 27. This prevents the mist-like solvent discharged from the liquid outlets 76 and 86 of the nozzles 31, 32, and 33 from going over the shielding plate 71 which is higher than the upper end of the inert gas nozzle 27 and heading toward the multiple substrates W.

[0213] (10) In each of the embodiments and modifications described above, the substrate processing apparatus 1 is equipped with four solvent vapor nozzles 31, 32. In this regard, the substrate processing apparatus 1 may be equipped with one or more solvent vapor nozzles 31. The same applies to the ejection tube 13, the inert gas nozzle 27, and the water-repellent vapor nozzle 33.

[0214] (11) In each of the embodiments and modifications described above, the dummy substrate 100 was housed in a dummy substrate carrier CD, and the dummy substrate carrier CD was stored in a storage shelf 113 of the stocker block 103. In this regard, as shown by the dashed line in Figure 10, the substrate processing apparatus 1A may be provided with a substrate buffer section (including a carrier) 160 at a location accessible to the substrate handling mechanism HTR. In this case, the substrate buffer section 160 is provided with a plurality of substrate mounting shelves arranged in the vertical direction Z. Each of the plurality of substrate mounting shelves is configured to hold one dummy substrate 100. This allows the substrate handling mechanism HTR to immediately transport the dummy substrate 100 when needed.

[0215] (12) In each of the embodiments and modifications described above, one dummy substrate 100 was inserted. However, two or more dummy substrates 100 may be inserted. As shown in Figure 23, for example, the holding member 7 of the substrate holding part 5 may hold 47 substrates W and 3 dummy substrates 100 in 50 grooves SL1 to SL50. When the holding member 7 of the substrate holding part 5 does not hold two or more substrates W, the holding member 7 holds multiple dummy substrates 100 rather than one dummy substrate 100, so the rectification function can be improved compared to one dummy substrate 100.

[0216] (13) In each of the embodiments and modifications described above, the cleaning units BT2 and BT4 each processed a plurality of substrates W arranged in a half-pitch and face-to-face manner and one dummy substrate 100 all at once. In this regard, the cleaning units BT2 and BT4 may each process a plurality of substrates W arranged in a half-pitch and face-to-back manner and one dummy substrate 100 all at once. The face-to-back method is a method in which all substrates W are arranged facing the same direction.

[0217] Furthermore, the cleaning units BT2 and BT4 may each process 25 substrates W for a single carrier, arranged in a full-pitch and face-to-back configuration, all at once. In the face-to-back configuration, the substrates W may be oriented either toward the leading edge 7A or toward the base edge 7B.

[0218] (14) In each of the embodiments and modifications described above, the multiple (e.g., 50 or 49) substrates W other than the shielding dummy substrate 100 may include a check dummy substrate for checking the state of substrate processing. The check dummy substrate is housed in the first carrier C or the second carrier C. The check dummy substrate is not returned to the dummy substrate carrier CD. [Explanation of Symbols]

[0219] 1,1A … Substrate processing equipment 2… Processing tank 3… Chamber 5... Board holding part 7 ... Retaining member 7A … Tip 7B … Proximal end 9 … Back plate 31, 32 ... Solvent vapor nozzles 33… Water-repellent steam nozzle 47… Exhaust vent 51… Exhaust pump 61 ... Control Unit 71,95 … Shielding plate 72…Top end 73 … Pipe section AX … Tube axis 75…Discharge port 76 … Liquid outlet 78 … area 83... Second Section 85…Second discharge port 86 … 2nd liquid outlet WT ... Advanced substrate RT... Travel route AR2 ... Orientation of the device surface H1…Drying position H2 ... Processing position 100 ... Dummy circuit board HTR… Circuit board handling mechanism 117 ... Posture change mechanism 119 ... Storage shelf 137 ... Posture change unit 139… Pusher mechanism 153 ... Substrate detection sensor unit WTR… Conveyor mechanism C... Career SL1~SL51 ... Groove

Claims

1. A treatment tank for storing the treated liquid, A chamber surrounding the aforementioned processing tank, A solvent vapor nozzle provided within the chamber and positioned higher than the processing tank, the solvent vapor nozzle supplying solvent vapor into the chamber, An exhaust pump that exhausts the contents of the chamber from an exhaust port located at a position lower than the upper surface of the processing tank, A substrate holding portion having a holding member for holding a plurality of substrates arranged in a line facing each other in a vertical position with a predetermined interval between them, and a back plate for supporting the base end of the holding member, wherein the substrate holding portion is movable within the chamber and between a position within the processing tank and a position above the processing tank, A substrate processing apparatus characterized by comprising, with the substrate holding portion positioned above the processing tank, the leading substrate among the plurality of substrates furthest from the back plate, and a shielding plate provided between the leading end of the holding member and the side wall of the chamber facing it.

2. In the substrate processing apparatus according to claim 1, The solvent vapor nozzle comprises a tubular section extending horizontally in a straight line within the chamber, and a plurality of discharge ports provided in the tubular section and arranged along the axis of the tubular section. The solvent vapor nozzle further includes a liquid discharge port provided in the pipe section upstream of the plurality of discharge ports, and located in a corresponding area between the shielding plate and the side wall of the chamber. Each of the plurality of discharge ports discharges the solvent vapor into the chamber. The substrate processing apparatus is characterized in that the liquid discharge port discharges the solvent generated by the condensation of the solvent vapor into the region between the shielding plate and the side wall of the chamber.

3. In the substrate processing apparatus according to claim 2, A substrate processing apparatus characterized in that the liquid discharge port faces a different direction from the plurality of discharge ports.

4. In the substrate processing apparatus according to any one of claims 1 to 3, A substrate processing apparatus characterized in that the upper end of the shielding plate is positioned higher than the upper end of the tip substrate.

5. In the substrate processing apparatus according to any one of claims 1 to 3, The substrate processing apparatus is characterized in that the upper end of the shielding plate is positioned to reach the ceiling surface of the chamber.

6. In the substrate processing apparatus according to any one of claims 1 to 3, A water-repellent vapor nozzle is provided within the chamber and positioned higher than the processing tank, and further comprises the water-repellent vapor nozzle for supplying water-repellent vapor into the chamber, The water-repellent vapor nozzle comprises a second pipe section extending horizontally in a straight line within the chamber, and a plurality of second discharge ports provided in the second pipe section and arranged along the pipe axis. The water-repellent vapor nozzle further includes a second liquid discharge port provided in the second pipe section upstream of the plurality of second discharge ports, and located in a corresponding area between the shielding plate and the side wall of the chamber. Each of the plurality of second discharge ports discharges the water-repellent vapor into the chamber. The substrate processing apparatus is characterized in that the second liquid discharge port discharges the water-repellent agent generated by condensation of the water-repellent agent vapor into the region between the shielding plate and the side wall of the chamber.

7. In the substrate processing apparatus according to any one of claims 1 to 3, A substrate processing apparatus characterized in that the shielding plate is attached to the processing tank.

8. In the substrate processing apparatus according to claim 1, The substrate processing apparatus is characterized in that the shielding plate is a dummy substrate held by the holding member.

9. In the substrate processing apparatus according to claim 8, A carrier mounting shelf on which a carrier for storing the aforementioned multiple substrates in a horizontal position is mounted, A carrier for dummy circuit boards that houses the aforementioned dummy circuit board, A horizontal substrate transport mechanism for transporting the aforementioned multiple substrates and for transporting the aforementioned dummy substrate, An attitude change mechanism for changing the attitude of the plurality of substrates and the dummy substrate between a horizontal attitude and a vertical attitude, A batch substrate transport mechanism for transporting the multiple substrates and the dummy substrate in a vertical position, Furthermore, The horizontal substrate transport mechanism transports the plurality of substrates from the carrier placed on the carrier shelf to the attitude changing mechanism, and also transports the dummy substrate from the dummy substrate carrier to the attitude changing mechanism. The attitude conversion mechanism converts the plurality of substrates and the dummy substrates transported by the horizontal substrate transport mechanism from a horizontal orientation to a vertical orientation. The batch substrate transport mechanism transports the multiple substrates and the dummy substrate in a vertical orientation from the orientation change mechanism. The substrate holding portion holds the plurality of substrates in a vertical position, and also holds the dummy substrate so that it is positioned between the front substrate furthest from the back plate and the side wall of the chamber opposite the front end of the holding member. The substrate holding unit moves between a position inside the processing tank and a position above the processing tank while holding the plurality of substrates and the dummy substrate. The batch substrate transport mechanism transports the multiple substrates and dummy substrates in a vertical orientation that have been processed in the processing tank from the substrate holding section to the orientation changing mechanism. The attitude changing mechanism changes the multiple substrates and the dummy substrates transported by the batch substrate transport mechanism from a vertical orientation to a horizontal orientation. The substrate processing apparatus is characterized in that the horizontal substrate transport mechanism returns the plurality of substrates in a horizontal orientation to the carrier placed on the carrier mounting shelf from the orientation changing mechanism, and also returns the dummy substrate in a horizontal orientation to the dummy substrate carrier from the orientation changing mechanism.

10. In the substrate processing apparatus according to claim 9, Storage shelves for storing multiple carriers, The system further comprises a carrier transport mechanism for transporting any carrier stored in the storage rack to the carrier mounting rack, The substrate processing apparatus is characterized in that the carrier for the dummy substrate is stored in advance in the storage shelf.

11. In the substrate processing apparatus according to claim 8, A carrier mounting shelf on which a carrier for storing the aforementioned multiple substrates in a horizontal position is mounted, A carrier for dummy circuit boards that houses the aforementioned dummy circuit board, A horizontal substrate transport mechanism for transporting the aforementioned multiple substrates and for transporting the aforementioned dummy substrate, An attitude change mechanism for changing the attitude of the plurality of substrates and the dummy substrate between a horizontal attitude and a vertical attitude, A batch substrate transport mechanism for transporting the multiple substrates and the dummy substrate in a vertical position, The carrier further includes a substrate detection sensor unit for detecting the presence or absence of a substrate to be stored in the carrier, Furthermore, The retaining member comprises a plurality of retaining grooves arranged in a row for holding the plurality of substrates, The plurality of retaining grooves have a tip retaining groove located at the very end of the retaining member on the tip side, The substrate detection sensor unit moves vertically relative to the carrier placed on the carrier rack, and detects the presence or absence of a substrate stored in the carrier. The horizontal substrate transport mechanism transports the plurality of substrates from the carrier placed on the carrier shelf to the attitude changing mechanism. When the substrate detection sensor unit detects that there is no corresponding substrate on the carrier that corresponds to the tip holding groove, the horizontal substrate transport mechanism transports the dummy substrate from the dummy substrate carrier to the portion of the row of substrates that has been transported to the attitude change mechanism that does not have a corresponding substrate. The attitude conversion mechanism converts the plurality of substrates and the dummy substrates transported by the horizontal substrate transport mechanism from a horizontal orientation to a vertical orientation. The batch substrate transport mechanism transports the multiple substrates and the dummy substrate in a vertical orientation from the orientation change mechanism. The substrate holding section receives the multiple substrates and the dummy substrate in a vertical position from the batch substrate transport mechanism using the multiple holding grooves of the holding member. The batch substrate transport mechanism transports the multiple substrates and dummy substrates in a vertical orientation that have been processed in the processing tank from the substrate holding section to the orientation changing mechanism. The attitude changing mechanism changes the multiple substrates and the dummy substrates transported by the batch substrate transport mechanism from a vertical orientation to a horizontal orientation. The substrate processing apparatus is characterized in that the horizontal substrate transport mechanism returns the plurality of substrates in a horizontal orientation to the carrier placed on the carrier mounting shelf from the orientation changing mechanism, and also returns the dummy substrate in a horizontal orientation to the dummy substrate carrier from the orientation changing mechanism.

12. In the substrate processing apparatus according to claim 8, A carrier mounting shelf on which a first carrier is placed for storing a first group of two or more circuit boards in a horizontal position, A carrier for dummy circuit boards that houses the aforementioned dummy circuit board, A horizontal substrate transport mechanism that transports the first group of substrates, transports a second group of substrates consisting of two or more substrates, and transports the dummy substrate, An attitude changing mechanism that changes the attitude of the first substrate group, the second substrate group, and the dummy substrate between a horizontal attitude and a vertical attitude, and also combines the first substrate group and the second substrate group to form the plurality of substrates in a vertical attitude, A batch substrate transport mechanism for transporting the multiple substrates and the dummy substrate in a vertical position, A substrate detection sensor unit for detecting the presence or absence of a substrate to be stored in the first carrier, Furthermore, The retaining member comprises a plurality of retaining grooves arranged in a row for holding the plurality of substrates, The plurality of retaining grooves have a tip retaining groove located at the very end of the retaining member on the tip side, The substrate detection sensor unit moves vertically relative to the first carrier placed on the carrier mounting shelf, and detects the presence or absence of a substrate stored in the first carrier. The substrate detection sensor unit moves vertically relative to the second carrier, which is placed on the carrier mounting shelf and stores the second group of substrates in a horizontal position, and detects the presence or absence of substrates stored in the second carrier. The horizontal substrate transport mechanism transports the first group of substrates from the first carrier placed on the carrier rack to the attitude changing mechanism. The horizontal substrate transport mechanism transports the second group of substrates from the second carrier placed on the carrier rack to the attitude changing mechanism. When the substrate detection sensor unit detects that there is no corresponding substrate on the first carrier or the second carrier that corresponds to the tip holding groove, the horizontal substrate transport mechanism transports the dummy substrate from the dummy substrate carrier to the portion of the row of the first substrate group or the second substrate group that has been transported to the attitude change mechanism that does not have the corresponding substrate. The attitude changing mechanism converts the first substrate group, the second substrate group, and the dummy substrate from a horizontal orientation to a vertical orientation, and also combines the first substrate group and the second substrate group to form the plurality of substrates in a vertical orientation. The batch substrate transport mechanism transports the multiple substrates and the dummy substrate in a vertical orientation from the orientation change mechanism. The substrate holding section receives the multiple substrates and the dummy substrate in a vertical position from the batch substrate transport mechanism using the multiple holding grooves of the holding member. The batch substrate transport mechanism transports the multiple substrates and dummy substrates in a vertical orientation that have been processed in the processing tank from the substrate holding section to the orientation changing mechanism. The attitude changing mechanism divides the plurality of substrates transported by the batch substrate transport mechanism into a first substrate group and a second substrate group, and also changes the first substrate group, the second substrate group and the dummy substrate from a vertical orientation to a vertical orientation. The substrate processing apparatus is characterized in that the horizontal substrate transport mechanism returns the first group of substrates in a horizontal orientation to the first carrier placed on the carrier mounting shelf from the orientation changing mechanism, returns the second group of substrates in a horizontal orientation to the second carrier placed on the carrier mounting shelf from the orientation changing mechanism, and returns the dummy substrate in a horizontal orientation to the dummy substrate carrier from the orientation changing mechanism.

13. In the substrate processing apparatus according to claim 12, The substrate processing apparatus is characterized in that the plurality of substrates are arranged alternately, with one substrate from the first substrate group and one substrate from the second substrate group.

14. In the substrate processing apparatus according to any one of claims 11 to 13, A substrate processing apparatus characterized in that the tip substrate faces the side wall of the chamber.

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