Molding mold, resin molding apparatus, and method for manufacturing resin molded products

Abstract

To provide a molding mold capable of preventing an occurrence of molding defects and mold release defects in a resin molded product.SOLUTION: A molding mold includes: one mold; and another mold that is disposed facing the one mold and has a cavity in which a release film is disposed. The other mold includes: a main surface member that forms a main surface of the cavity; and a side surface member that forms a side surface of the cavity. A facing surface of the side surface member facing the one mold includes: a plurality of first suction hole parts; and second suction hole parts connecting the adjacent first suction hole parts to each other. A release film adsorption hole for adsorbing the release film is formed. In the facing surface, the first suction hole parts have a length in a direction perpendicular to a direction in which the second suction hole parts extend to connect the adjacent first suction hole parts, the length being greater than a length of the second suction hole parts.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to the technology of a mold, a resin molding apparatus, and a method for manufacturing a resin molded product.

Background Art

[0002] Patent Document 1 discloses a mold provided with a release film in order to facilitate the removal of a resin molded product. In the mold described in Patent Document 1, suction holes and gaps for adsorbing the release film are formed. Specifically, in the mold described in Patent Document 1, suction holes capable of adsorbing and holding the release film are formed outside the cavity. Further, in the mold described in Patent Document 1, a gap capable of adsorbing and holding the release film is formed inside the cavity (between the compression mold and the frame mold). A vacuum pump is connected to the suction holes and gaps of the mold, and is configured to be able to perform suction independently.

[0003] In the mold configured as described above, first, the release film is adsorbed by the suction holes, and the release film is adsorbed and fixed to the surface of the mold. Then, the release film is adsorbed by the gap, so that the release film is adsorbed along the shape of the cavity.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, as described in Patent Document 1, when the release film is adsorbed from the gap inside the cavity after being adsorbed from the adsorption holes on the outside of the cavity, the adsorption from the gap may cause significant stress on the release film. When significant stress is applied to the release film, it may wrinkle or slip, preventing it from being properly held, which can lead to molding defects or release defects in the resin molded product. There was room for improvement in this regard.

[0006] This invention was made in view of the above circumstances, and the problem it aims to solve is to provide a mold, a resin molding apparatus, and a method for manufacturing resin molded products that can prevent the occurrence of molding defects and release defects in resin molded products. [Means for solving the problem]

[0007] The problems that the present invention aims to solve are as described above, and in order to solve these problems, the present invention provides a mold comprising one mold and another mold positioned opposite to the first mold and having a cavity in which a release film is placed, wherein the other mold comprises a main surface member that forms the main surface of the cavity and a side member that forms the side surface of the cavity, and the opposing surface of the side member that faces the first mold includes a plurality of first suction holes and second suction holes that connect adjacent first suction holes, and release film adsorption holes that adsorb the release film are formed therein, and on the opposing surface, the length of the first suction holes is greater than that of the second suction holes in a direction perpendicular to the direction in which the second suction holes extend to connect adjacent first suction holes.

[0008] Furthermore, the resin molding apparatus according to the present invention is equipped with the aforementioned molding die.

[0009] Furthermore, the method for manufacturing a resin molded product according to the present invention is a method for manufacturing a resin molded product using the resin molding apparatus, and includes a film placement step of placing the release film in the other mold, and a resin molding step of performing resin molding using the other mold on which the release film is placed. [Effects of the Invention]

[0010] According to the present invention, it is possible to prevent the occurrence of molding defects and mold release defects in resin molded products. [Brief explanation of the drawing]

[0011] [Figure 1] A schematic plan view showing the overall configuration of the resin molding apparatus according to the first embodiment. [Figure 2] A schematic side view showing the configuration of the molding module. [Figure 3] Plan view showing the lower mold. [Figure 4] A plan view and cross-sectional view showing the lower mold. [Figure 5] (a) Enlarged view showing part A of Figure 3. (b) Cross-sectional view of SS. [Figure 6] (a) Cross-sectional view showing the first adsorption part adsorbing the release film. (b) Cross-sectional view showing the second adsorption part adsorbing the release film. (c) Cross-sectional view showing the third adsorption part adsorbing the release film. [Figure 7] (a) Plan view showing the lower mold according to the second embodiment. (b) Enlarged view showing part B. [Figure 8] A plan view showing the lower mold according to the third embodiment. [Modes for carrying out the invention]

[0012] <Overall configuration of resin molding apparatus 1> First, a resin molding apparatus 1 according to the first embodiment of the present invention will be described using Figure 1. In the explanation using Figure 1, the directions will be defined using the arrows X and Y shown in the figure. The resin molding apparatus 1 encapsulates a substrate W1 before encapsulation with resin to produce a resin molded product (encapsulated substrate W2). In this embodiment, the substrate before resin encapsulation is referred to as the unencapsulated substrate W1, and the substrate after resin encapsulation is referred to as the encapsulated substrate W2. In this embodiment, a resin molding apparatus 1 that performs resin molding by compression molding is illustrated.

[0013] The resin molding apparatus 1 comprises a substrate supply / storage module 10, a molding module 20, and a material supply module 30 as its components. Each component is detachable and interchangeable with respect to the other components.

[0014] The substrate supply and storage module 10 supplies unsealed substrates W1 to the molding module 20 and stores sealed substrates W2 received from the molding module 20. The unsealed substrate W1 can be a lead frame or various other substrates (glass epoxy substrates, ceramic substrates, resin substrates, metal substrates). The substrate supply and storage module 10 mainly comprises an unsealed substrate supply section 11, a sealed substrate storage section 12, a substrate mounting section 13, and a substrate transport mechanism 14.

[0015] The substrate mounting unit 13 appropriately transfers the unsealed substrate W1 and the sealed substrate W2 between the unsealed substrate supply unit 11, the sealed substrate storage unit 12, and the substrate transport mechanism 14. The substrate mounting unit 13 can move in the Y direction within the substrate supply / storage module 10. The unsealed substrate supply unit 11 can supply the unsealed substrate W1 to the substrate mounting unit 13. The sealed substrate storage unit 12 can store the sealed substrate W2 received from the substrate mounting unit 13. The substrate transport mechanism 14 can move in the X and Y directions within the substrate supply / storage module 10 and the molding module 20. The substrate transport mechanism 14 can appropriately transport the unsealed substrate W1 and the sealed substrate W2 across the substrate supply / storage module 10 and the molding module 20.

[0016] The molding module 20 performs resin molding. In this embodiment, a resin molding apparatus 1 provided with three molding modules 20 is exemplified, but the number of molding modules 20 is not limited. The molding module 20 mainly includes a clamping mechanism 100 and a mold 200.

[0017] The mold 200 includes an upper mold 200U (see FIG. 2 etc.) and a lower mold 200D that can move up and down with respect to the upper mold 200U. The upper mold 200U and the lower mold 200D are each an embodiment of one mold and the other mold of the present application. A cavity C corresponding to the shape of the resin molded product is formed in the lower mold 200D. The clamping mechanism 100 can perform mold clamping and mold opening of the mold 200 by moving the lower mold 200D up and down. A more specific configuration of the molding module 20 will be described later.

[0018] The material supply module 30 supplies the release film F and the resin material to the molding module 20. The material supply module 30 mainly includes a material placement part 31, a release film supply mechanism 32, a resin material storage part 33, a resin material input mechanism 34, and a material transfer mechanism 35.

[0019] The material placement part 31 can place the release film F and the resin material storage part 33. The material placement part 31 can move in the X direction and the Y direction within the material supply module 30. The release film supply mechanism 32 can supply the release film F to the material placement part 31.

[0020] The resin material storage part 33 has a substantially frame shape and can accommodate the resin material supplied from the resin material input mechanism 34 together with the release film F supplied to the material placement part 31. The material transfer mechanism 35 can move in the X direction and the Y direction within the material supply module 30 and the molding module 20. The material transfer mechanism 35 can transfer the integrated release film F and resin material storage part 33 together with the resin material to the molding module 20.

[0021] <Method for resin molding using resin molding apparatus 1> Below, we will describe an example of a resin molding method using the resin molding apparatus 1 configured as described above.

[0022] The method for manufacturing a resin molded product according to this embodiment mainly includes a substrate loading step, a film placement step, a mold clamping step, a resin molding step, a mold opening step, and a removal step. These steps will be described in order below.

[0023] First, in the substrate loading process, the unsealed substrate W1 is loaded into the molding die 200. Specifically, in the substrate loading process, the unsealed substrate W1 is supplied from the unsealed substrate supply unit 11 to the substrate placement unit 13. The substrate transport mechanism 14 receives the unsealed substrate W1 placed in the substrate placement unit 13 and transports it to the molding die 200 of the molding module 20.

[0024] Next, in the film placement process, the release film F and resin material are placed in the mold 200 (lower mold 200D). Specifically, in the film placement process, the release film F is supplied from the release film supply mechanism 32 to the material placement section 31. At this time, it is also possible to cut the release film F to a predetermined size in the material placement section 31. The release film F placed in the material placement section 31 forms a box shape capable of containing the resin material together with the resin material storage section 33 placed on top of it. Resin material is then fed into the integrated release film F and resin material storage section 33 from the resin material input mechanism 34, and the release film F and resin material storage section 33 containing the resin material are placed on the material placement section 31. The material transport mechanism 35 receives the release film F containing the resin material and the resin material storage section 33, moves them to the molding module 20, and places the release film F containing the resin material and the resin material storage section 33 into the mold 200 (lower mold 200D). Subsequently, as described later, the release film F is held in the lower mold 200D, and the resin material is supplied to the cavity C of the lower mold 200D. After the resin material has been supplied to the cavity C, the material transport mechanism 35 unloads the resin material storage section 33 from the mold 200 and returns it to the material supply module 30.

[0025] Next, in the mold clamping process, the mold 200 is clamped. Specifically, in the mold clamping process, the resin material contained in the cavity C is heated by a heating mechanism (not shown) provided in the lower mold 200D. Next, the mold clamping mechanism 100 is driven, causing the lower mold 200D to rise toward the upper mold 200U. When the lower mold 200D rises to a predetermined position, the upper surface of the lower mold 200D and the lower surface of the upper mold 200U come into direct contact, or indirectly via the pre-sealed substrate W1, and the cavity C formed in the lower mold 200D is closed from above by the upper mold 200U and the pre-sealed substrate W1. In this state, the lower mold 200D is further pushed up, pressurizing the resin material contained in the lower mold 200D.

[0026] Next, in the resin molding process, the resin material is cured and resin molding is performed. Specifically, in the resin molding process, the resin material is held under pressure for a predetermined time. This allows the resin material to cure, and resin molding is performed on the unsealed substrate W1 to obtain a resin molded product (sealed substrate W2).

[0027] Next, in the mold opening process, the molding die 200 is opened. Specifically, in the mold opening process, the mold clamping mechanism 100 is driven, causing the lower die 200D to descend so that it separates from the upper die 200U. This opens the molding die 200, making it possible to remove the sealed substrate W2.

[0028] Next, in the unloading process, the resin molded product (sealed substrate W2) is unloaded from the mold 200. Specifically, in the unloading process, the substrate transport mechanism 14 receives the sealed substrate W2 from the mold 200 and transfers the received sealed substrate W2 to the substrate mounting section 13 of the substrate supply and storage module 10. The sealed substrate storage section 12 receives the sealed substrate W2 from the substrate mounting section 13 and stores the received sealed substrate W2.

[0029] In this resin molding apparatus 1, the unsealed substrate W1, release film F, and resin material are supplied to the molding module 20, and resin molding can be performed. Furthermore, resin molding can be performed in parallel using multiple molding modules 20, enabling efficient production of resin molded products. The operation of each part of the resin molding apparatus 1 described above can be appropriately controlled by a control device (not shown).

[0030] <Configuration of molding module 20> The specific configuration of the molding module 20 will be described below. As shown in Figure 2, the molding module 20 mainly comprises a mold clamping mechanism 100 and a molding die 200, etc.

[0031] The mold clamping mechanism 100 raises and lowers the lower mold 200D to perform mold clamping and mold opening, etc. The mold clamping mechanism 100 mainly comprises a base 101, support columns 102, lower mold base member 103, upper mold base member 104, and a drive mechanism 105, etc.

[0032] The base 101 supports the mold 200 and the like. Multiple support columns 102 are fixed to the base 101. The multiple support columns 102 are provided to extend upward from the base 101. Lower mold base members 103 are provided at the upper and lower intermediate parts of the support columns 102 so as to be able to move up and down. Upper mold base members 104 are fixed to the upper ends of the support columns 102.

[0033] The drive mechanism 105 is for raising and lowering the lower mold 200D. The drive mechanism 105 can be a ball screw mechanism, a hydraulic cylinder, a toggle mechanism, or the like. The drive mechanism 105 is positioned between the base 101 and the lower mold base member 103. By extending and retracting vertically between the base 101 and the lower mold base member 103, the drive mechanism 105 can raise and lower the lower mold base member 103.

[0034] The molding die 200 consists of an upper mold 200U and a lower mold 200D, and forms a cavity C for molding resin material.

[0035] The upper mold 200U is formed to have an appropriate vertical width. The upper mold 200U is positioned with the surface for molding the resin (mold surface) facing downwards. The mold surface of the upper mold 200U is formed to be a flat surface without irregularities. The upper mold 200U is fixed to the bottom surface of the upper mold base member 104. Adsorption holes (not shown) capable of adsorbing substrates (pre-sealed substrate W1 and sealed substrate W2) are appropriately formed on the mold surface of the upper mold 200U.

[0036] As shown in Figures 2 and 3, the lower mold 200D is positioned on the upper surface of the lower mold base member 103. The upper surface (mold surface) of the lower mold 200D is positioned to face the mold surface of the upper mold 200U in the vertical direction. The lower mold 200D mainly comprises a main surface member 210 and side members 220, etc.

[0037] The main surface member 210 forms the main surface of the cavity C. In this embodiment, since the main surface member 210 is the lower mold 200D, the main surface is the bottom surface. The main surface member 210 is formed in a rectangular shape in plan view. The main surface member 210 is formed to have an appropriate width in the vertical direction. The main surface member 210 is positioned on the upper surface of the lower mold base member 103.

[0038] The side member 220 forms the side of the cavity C and surrounds the main surface member 210 from the side. The side member 220 is formed to have an appropriate vertical width. The side member 220 mainly comprises a hollow portion 221.

[0039] The hollow portion 221 is formed to penetrate vertically through the center of the side member 220. The hollow portion 221 is formed in a rectangular shape in plan view. The hollow portion 221 is formed in a shape that generally matches the outer shape of the main surface member 210 in plan view.

[0040] Thus, the side member 220 is formed in a rectangular frame shape in plan view. The main surface member 210 is positioned in the hollow portion 221 of the side member 220. The side member 220 is positioned on the upper surface of the lower mold base member 103 via an elastic member 220a. The elastic member 220a is formed, for example, by a compression coil spring that can expand and contract vertically. The upper surface of the side member 220 is positioned above the upper surface of the main surface member 210. The area enclosed by the main surface member 210 and the side member 220 (above the main surface member 210 and inside the side member 220) becomes the cavity C for resin molding.

[0041] A release film F is placed on the mold surface of the lower mold 200D configured in this way, and resin material is supplied to the portion of the release film F corresponding to the cavity C. Subsequently, the release film F is adsorbed onto the lower mold 200D, supplying the resin material into the cavity C. The unsealed substrate W1 is also adsorbed and held in the upper mold 200U. In this state, the upper mold 200U and the lower mold 200D are clamped together by the clamping mechanism 100, and the resin is compression molded onto the unsealed substrate W1 to obtain a sealed substrate W2.

[0042] <Configuration of the lower mold 200D> Here, the lower mold 200D is appropriately formed with adsorption holes and the like for adsorbing and holding the release film F. The structure of the lower mold 200D for adsorbing the release film F will be described in detail below.

[0043] As shown in Figures 3 to 5, the lower mold 200D is equipped with a first adsorption section 230, a second adsorption section 240, and a third adsorption section 250 for adsorbing the release film F.

[0044] The first adsorption section 230 is for adsorbing the release film F onto the upper surface of the side member 220. The first adsorption section 230 mainly comprises a first suction hole 231, a second suction hole 232, and a suction path 233.

[0045] The first suction holes 231 shown in Figures 3 and 5 are through holes formed along the vertical direction to connect the upper surface of the side member 220 and the suction path 233. The first suction holes 231 are formed in a circular shape in plan view. Multiple first suction holes 231 are formed in a row to surround the cavity C in plan view. The first suction holes 231 are formed to be arranged in a rectangular shape following the shape of the cavity C in plan view. The first suction holes 231 are arranged at approximately equal intervals. Adjacent first suction holes 231 are formed to be separated by a distance of, for example, 0.05 mm or more. In this embodiment, the first suction holes 231 are formed in a circular shape with a diameter of 1 to 5 mm in plan view.

[0046] Furthermore, the shape of the first suction hole 231 is not limited to a circular shape; the area in plan view can be the area of ​​a circle with a diameter of 1 to 5 mm (approximately 0.5 to 20 mm). 2 It is also possible to form it into other shapes, such as the one shown above. In this embodiment, multiple first suction holes 231 are arranged so that the spacing between adjacent first suction holes 231 is generally constant, but it is also possible to form multiple first suction holes 231 at unequal intervals.

[0047] The second suction hole 232 is a through hole formed along the vertical direction to connect the upper surface of the side member 220 and the suction path 233. In a plan view, the second suction hole 232 is formed to extend from one first suction hole 231 to another first suction hole 231 adjacent to that first suction hole 231. In this way, the second suction hole 232 is formed to connect adjacent first suction holes 231. The width H of the second suction hole 232 in a plan view (the width H being the length in the direction perpendicular to the direction in which the second suction hole 232 extends to connect adjacent first suction holes 231) is formed to be approximately constant. The width H of the second suction hole 232 is formed to be, for example, four times or less the thickness of the release film F.

[0048] The width H of the second suction hole 232 is formed to be smaller than the width of the first suction hole 231 (the maximum length of the first suction hole 231 in a direction perpendicular to the direction in which the second suction hole 232 extends to connect adjacent first suction holes 231. In this embodiment, this is the diameter of the first suction hole 231). As a result, the first suction hole 231 is formed to protrude from the second suction hole 232 on both sides in the width direction of the second suction hole 232 (for example, in the left-right direction of the paper in Figure 5(a)). That is, the first suction hole 231 is formed to protrude from the second suction hole 232 on the inside (towards cavity C) and the outside (opposite side of cavity C) of the lower mold 200D.

[0049] The first suction holes 231 and the second suction holes 232 are formed to be alternately connected in a plan view. Furthermore, the first suction holes 231 and the second suction holes 232 are formed to surround the cavity C. In this embodiment, the first suction holes 231 and the second suction holes 232 are formed to surround the cavity C without interruption. That is, in a plan view, the first suction holes 231 and the second suction holes 232 are formed in an annular shape without ends, and they are continuously connected to surround the entire cavity C. In this way, the first suction holes 231 and the second suction holes 232, which open to the upper surface (mold surface) of the side member 220, form adsorption holes for adsorbing the release film F. Note that the first suction holes 231 and the second suction holes 232 are one embodiment of the release film adsorption holes of the present application.

[0050] The suction path 233 shown in Figures 4 and 5 is for drawing air from the first suction hole 231 and the second suction hole 232. The suction path 233 is formed below the first suction hole 231 and the second suction hole 232. The suction path 233 is formed to extend downward from the upper and lower middle part of the side member 220. In a plan view, the suction path 233 is formed to extend along the first suction hole 231 and the second suction hole 232. That is, the suction path 233 is also formed as an annular shape without ends in a plan view. The upper part of the suction path 233 is connected to the first suction hole 231 and the second suction hole 232. A suction device (not shown), such as a vacuum pump, is connected to the lower part of the suction path 233 via an appropriately formed air flow path. By activating this suction device and drawing in air, air can be drawn in through the suction path 233 from the first suction hole 231 and the second suction hole 232, allowing the release film F to be adsorbed onto the upper surface of the side member 220.

[0051] As described above, the first suction hole 231, the second suction hole 232, and the suction path 233 are formed to continuously surround the cavity C without interruption. For this reason, the side member 220 is separated in a plan view into an outer portion and an inner portion, with the first suction hole 231, etc. in between. Hereinafter, the outer portion of the side member 220, with the first suction hole 231, etc. in between, will be referred to as the outer member 222, and the inner portion, with the first suction hole 231, etc. in between, will be referred to as the inner member 223.

[0052] The second adsorption section 240 shown in Figures 3 to 5 is for adsorbing the release film F onto the upper surface of the side member 220 (inner member 223). The second adsorption section 240 mainly comprises a concave portion 241, a suction hole portion 242, and a suction path 243.

[0053] The concave portions 241 shown in Figures 3 and 5 are concave portions formed on the upper surface of the inner member 223. Multiple concave portions 241 are formed around the cavity C. In this embodiment, four concave portions 241 are formed along each side of the rectangular cavity C in a plan view. The concave portions 241 are formed in straight lines parallel to each side of the cavity C. The four concave portions 241 are formed with appropriate spacing between them so that they are not connected to each other. In a longitudinal cross-sectional view, the concave portions 241 are formed in a V-shape that slopes downward toward the center.

[0054] The suction hole portion 242 is a through hole formed along the vertical direction to connect the upper surface of the inner member 223 and the suction path 243. Note that the suction hole portion 242 is one embodiment of the third suction hole portion of the present application. The suction hole portion 242 is formed in a circular shape in plan view. The suction hole portion 242 is formed inside the concave portion 241 in plan view. Multiple suction holes 242 are formed in each concave portion 241.

[0055] The suction path 243 shown in Figures 4 and 5 is for drawing air from the suction hole 242. The suction path 243 is formed below the suction hole 242. The suction path 243 is formed to extend downward from the middle of the inner member 223. In a plan view, the suction path 243 is formed to extend along the concave portion 241 and the suction hole 242. In a plan view, the suction path 243 is formed as an annular shape without ends, surrounding the cavity C. The upper part of the suction path 243 is connected to the suction hole 242. A suction device (not shown), such as a vacuum pump, is connected to the lower part of the suction path 243 via an appropriately formed air flow path. By operating this suction device to draw in air, air can be drawn in from the suction hole 242 via the suction path 243, and the release film F can be adsorbed onto the upper surface (concave portion 241) of the inner member 223.

[0056] The third adsorption section 250 shown in Figures 3 to 5 is for adsorbing the release film F onto the cavity C. The third adsorption section 250 is formed by the gap between the outer surface of the main surface member 210 and the inner surface (hollow portion 221) of the side member 220 (inner member 223). The gap between the main surface member 210 and the side member 220 extends around the entire circumference of the main surface member 210 in a plan view. As a result, the third adsorption section 250 is formed in an annular shape without ends, surrounding the cavity C in a plan view. A suction device (not shown), such as a vacuum pump, is connected to the lower part of the third adsorption section 250 via an appropriately formed air flow path. By operating this suction device and sucking in air, air can be sucked from the third adsorption section 250, and the release film F can be adsorbed along the inner surface of the cavity C.

[0057] The suction of air by the first suction section 230, the second suction section 240, and the third suction section 250 can be performed independently of each other. For example, by providing valves in the air flow paths connected to the first suction section 230, the second suction section 240, and the third suction section 250, and appropriately controlling the opening and closing of each valve, the first suction section 230, the second suction section 240, and the third suction section 250 can each be made to suction air at any desired timing.

[0058] In this embodiment, the dimensions (size, position, etc.) of the first adsorption part 230, the second adsorption part 240, and the third adsorption part 250 are exaggerated for illustrative purposes. The actual dimensions of the first adsorption part 230, etc., are not limited to those shown.

[0059] <Adsorption of release film F> In the following section, using Figure 6, we will explain how the release film F is adsorbed onto the lower mold 200D, which is configured as described above, during the film placement process. In this embodiment, although a resin material is actually placed on top of the release film F as described above, the resin material is omitted from the following figures and explanation.

[0060] First, as shown in Figure 6(a), when the release film F is placed on the lower mold 200D, air is drawn in by the first suction part 230. As a result, air is drawn in through the first suction hole 231 and the second suction hole 232, and the release film F is adsorbed onto the upper surface of the side member 220.

[0061] Here, as shown in Figure 5(a), the first suction portion 230 has a relatively large area first suction hole portion 231, so that the release film F can be held with a relatively large suction force. Furthermore, since the adjacent first suction holes 231 are connected by a second suction hole portion 232, the release film F can also be adsorbed between adjacent first suction holes 231. In particular, in this embodiment, the first suction holes 231 and the second suction holes 232 are formed to be continuously connected and surround the cavity C without interruption. Because the continuous first suction holes 231 and the second suction holes 232 can exert suction force without gaps, the release film F can be firmly held. As a result, even if the release film F attempts to deform and separate from the mold surface of the lower mold 200D due to the heat of the lower mold 200D, the release film F can be held and air leakage from the first suction portion 230 can be prevented.

[0062] Furthermore, by connecting the relatively large first suction holes 231 with the narrower second suction holes 232, it is possible to prevent the release film F from being pulled into the first suction holes 231 by the suction force of the first suction part 230. This prevents poor suction of the release film F (such as wrinkles or slippage).

[0063] Next, as shown in Figure 6(b), while air is being drawn in by the first adsorption part 230, air is drawn in by the second adsorption part 240. As a result, air is drawn in through the suction hole part 242, and the release film F is adsorbed onto the concave part 241. By drawing the release film F into the concave part 241 in this way, the release film F can be stretched and tension can be applied to the release film F.

[0064] Next, as shown in Figure 6(c), while air is being drawn in by the first adsorption section 230 and the second adsorption section 240, air is drawn in by the third adsorption section 250. As a result, the release film F is adsorbed so as to follow the inner surface of the cavity C. By pulling in the release film F in this way, the release film F can be further stretched, and tension can be applied to the release film F. In reality, at this time, a resin material (not shown) is supplied into the cavity C along with the release film F.

[0065] In this embodiment, tension is applied to the release film F by first adsorption by the first adsorption part 230, followed by adsorption by the second adsorption part 240 and the third adsorption part 250. At this time, as described above, the release film F is firmly held by the first adsorption part 230, so it is possible to prevent poor adsorption of the release film F (such as wrinkles or slippage) caused by adsorption by the second adsorption part 240 and the third adsorption part 250. This prevents molding defects and release defects in the resin molded product.

[0066] Although the first embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and appropriate modifications can be made within the scope of the technical idea of ​​the invention as described in the claims.

[0067] For example, the configuration of each part of the resin molding apparatus 1 described in this embodiment (shape, arrangement, number, etc.) is not particularly limited and can be changed as desired.

[0068] Furthermore, in this embodiment, the substrate (pre-sealed substrate W1, etc.) is held by adsorption on the upper mold 200U, but the present invention is not limited to this. For example, it is also possible to configure the substrate to be held by the lower mold 200D.

[0069] Furthermore, although this embodiment shows an example in which the first suction hole portion 231 is formed in a circular shape in plan view (see Figure 5(a)), the present invention is not limited to this, and it is also possible to form the first suction hole portion 231 in any shape. For example, the first suction hole portion 231 can be formed in a polygonal shape such as a triangle or square in plan view, an ellipse, or any other arbitrary shape.

[0070] Furthermore, in this embodiment, an example is shown in which the second suction hole portion 232 is formed in a groove shape (slit shape) having a certain width H (see Figure 5(a)), but the present invention is not limited to this, and it is also possible to form the second suction hole portion 232 in any shape. For example, the second suction hole portion 232 can be formed in a circular shape, a polygonal shape, or any other shape in plan view. In this case as well, it is desirable to set the width H (minimum width or maximum width) of the second suction hole portion 232 to be small enough not to pull in the release film F.

[0071] Furthermore, the dimensions of the first suction hole 231 and the second suction hole 232 shown in this embodiment (area and diameter of the first suction hole 231, width H of the second suction hole 232, etc.) are examples and can be changed as needed.

[0072] Furthermore, in this embodiment, an example is shown in which the first suction hole portion 231 and the second suction hole portion 232 are formed in a rectangular shape that follows the shape of the cavity C in a plan view. However, the present invention is not limited to this, and it is possible to form them in any shape.

[0073] Furthermore, although this embodiment shows an example in which multiple first suction holes 231 are arranged at approximately equal intervals, the present invention is not limited to this, and it is possible to arrange them at any interval, such as at unequal intervals.

[0074] Furthermore, although this embodiment describes a mold 200 with a rectangular shape in plan view as an example, the shape of the mold 200 is not limited to this, and it is possible to use a mold 200 of any shape, such as a circular shape in plan view.

[0075] Furthermore, the shape of the release film F used in this embodiment is not particularly limited. For example, a rectangular or circular release film F can be used. The shape of the release film F can also be appropriately selected according to the shape of the mold 200, etc.

[0076] Furthermore, the material of the release film F used in this embodiment is not particularly limited. For example, a resin film, metal foil, rubber sheet, or a composite thereof can be used as the release film F.

[0077] Furthermore, although this embodiment illustrates a mold 200 (lower mold 200D) equipped with a second suction portion 240 (see Figure 5), the present invention is not limited to this and can also be applied to a mold 200 that is not equipped with a second suction portion 240.

[0078] Furthermore, although this embodiment describes an example in which the resin material is transported to the lower mold 200D together with the release film F, the present invention is not limited to this, and the release film F and the resin material can be transported to the lower mold 200D separately.

[0079] Furthermore, although this embodiment describes an example in which the release film F is adsorbed and held by the lower mold 200D, the present invention is not limited to this, and it is also possible to adsorb and hold the release film F by the upper mold 200U.

[0080] <Second Embodiment> In the following section, the lower mold 200D according to the second embodiment will be described with reference to Figure 7.

[0081] The lower mold 200D according to the second embodiment differs from the first embodiment in that it has a first suction hole 234 which has a different shape from the first suction hole 231 of the lower mold 200D according to the first embodiment (see Figures 3 and 5). Therefore, the following will mainly describe this difference, and other components that are the same as those in the first embodiment will be denoted by the same reference numerals and their descriptions will be omitted.

[0082] The first suction hole 234 is formed in a semicircular shape in plan view. The first suction hole 234 is formed to protrude only outward from the lower mold 200D (opposite side of cavity C) relative to the second suction hole 232. In other words, the first suction hole 234 is formed on the inner surface of the outer member 222.

[0083] Thus, unlike the first embodiment, the first suction hole portion 234 can also be formed in a semicircular shape. Even in this case, the release film F can be firmly held while preventing it from being pulled into the first suction hole portion 234.

[0084] Furthermore, as in the second embodiment, by forming the first suction hole portion 234 to protrude only outward, space can be secured inside the second suction hole portion 232 (on the cavity C side), allowing the entire first suction portion 230 to be formed closer to the inside of the lower mold 200D. This also makes it possible to miniaturize the lower mold 200D.

[0085] Furthermore, as in the second embodiment, by forming the first suction hole portion 234 only on the outer member 222, the processing steps for forming the first suction hole portion 234 can be simplified. This makes it possible to reduce the manufacturing cost of the lower mold 200D.

[0086] In the second embodiment, an example was shown in which the first suction hole portion 234 is formed to protrude only outward relative to the second suction hole portion 232, but the present invention is not limited thereto. For example, it is also possible to form the first suction hole portion 234 to protrude only inward relative to the second suction hole portion 232. Furthermore, it is also possible to combine a first suction hole portion 234 that protrudes only outward relative to the second suction hole portion 232 with a first suction hole portion 234 that protrudes only inward relative to the second suction hole portion 232.

[0087] <Third Embodiment> In the following section, the lower mold 200D according to the third embodiment will be described with reference to Figure 8.

[0088] The lower mold 200D according to the third embodiment differs from the first embodiment in that a portion of the first suction holes 231 and the second suction holes 232, which are formed to surround the cavity C, are interrupted. Specifically, in the third embodiment, the first suction holes 231 and the second suction holes 232 are formed to be interrupted near the four corners of the lower mold 200D.

[0089] In this way, by forming the first suction hole portion 231 and the second suction hole portion 232 in a partially interrupted manner, it is possible to prevent excessive tension from being applied to the release film F when the release film F is adsorbed by the second adsorption portion 240 and the third adsorption portion 250, thereby preventing wrinkles, slippage, and other problems from occurring in the release film F.

[0090] Furthermore, when the first suction hole portion 231 and the second suction hole portion 232 are formed in such a way that they are partially interrupted, it is possible to form the side member 220 as a single integrated member rather than dividing it into two members (outer member 222 and inner member 223) as in the first embodiment.

[0091] Furthermore, the first suction hole 231 and the second suction hole 232 can be interrupted at any point, and the point of interruption can be arbitrarily determined according to, for example, the shape of each part of the lower mold 200D and the suction force of each suction part.

[0092] <Note> The mold 200 in the first aspect of this disclosure is A molding die 200 comprising an upper mold 200U (one mold) and a lower mold 200D (the other mold) positioned opposite the upper mold 200U and having a cavity C in which a release film F is placed, The lower mold 200D comprises a main surface member 210 that forms the main surface of the cavity C, and a side surface member 220 that forms the side surface of the cavity C. The side surface of the side member 220 facing the upper mold 200U includes a plurality of first suction holes 231 and second suction holes 232 connecting adjacent first suction holes 231, and release film adsorption holes (first suction holes 231 and second suction holes 232) for adsorbing the release film F are formed therein. In the aforementioned opposing surfaces, the length of the first suction hole 231 is greater than that of the second suction hole 232 in a direction perpendicular to the direction in which the second suction hole 232 extends to connect adjacent first suction hole 231s. The mold 200 of the first aspect of this disclosure can prevent molding defects and release defects in resin molded products. Specifically, by connecting a relatively large first suction hole 231 with a relatively narrow second suction hole 232, it is possible to prevent the release film F from being pulled into the first suction hole 231 while adsorbing the release film F with a relatively large suction force. This prevents poor adsorption of the release film F (such as wrinkles or slippage), and thus prevents molding defects and release defects in resin molded products caused by poor adsorption of the release film F.

[0093] In a mold 200 with a second side conforming to the first side, The first suction hole 231 is formed to protrude from the second suction hole 232 toward at least one of the sides of the cavity C or the side opposite to the cavity C. According to the mold 200 of the second aspect of this disclosure, the first suction hole portion 231 can be formed relatively simply.

[0094] In a mold 200 having a third side corresponding to the first or second side, The release film adsorption holes (first suction hole portion 231 and second suction hole portion 232) are formed to continuously surround the periphery of the cavity C. According to the mold 200 of the third aspect of this disclosure, the release film F can be firmly held around the entire circumference of the cavity C. This makes it possible to more effectively prevent poor adhesion of the release film F.

[0095] In the molding die 200 of the fourth side following the third side, The aforementioned side member 220 is The inner member 223, which constitutes the portion on the cavity C side of the release film adsorption hole, The outer member 222 is composed of the inner member 223 and another member, and the outer member 222 is the part that is opposite to the cavity C from the release film adsorption hole, It is equipped with. According to the fourth side mold 200 of this disclosure, the release film adsorption holes (first suction hole portion 231 and second suction hole portion 232) can be easily processed by separating the side member 220 into an inner member 223 and an outer member 222.

[0096] In the molding die 200 of the fifth side following the fourth side, The first suction hole 231 is formed in the outer member 222. According to the fifth aspect of the mold 200 of this disclosure, by forming the first suction hole portion 231 in the outer member 222, the inner member 223 can be miniaturized, and consequently the mold 200 can be miniaturized.

[0097] In a molding die 200 with a sixth side corresponding to the first to fifth sides, On the opposing surface of the side member 220, on the side of the cavity C that is closer to the mold release film adsorption hole, a recessed portion 241 and a suction hole portion 242 (third suction hole portion) capable of drawing in air are formed inside the recessed portion 241. According to the sixth side of the mold 200 of this disclosure, tension can be applied to the release film F by pulling it into the concave portion 241. This makes it possible to more effectively prevent poor adhesion of the release film F.

[0098] The seventh aspect of this disclosure, the resin molding apparatus 1, It comprises one of the first to sixth side molds 200. According to the resin molding apparatus 1 of the seventh aspect of this disclosure, it is possible to prevent the occurrence of molding defects and mold release defects in resin molded products.

[0099] The eighth aspect of this disclosure is the method for manufacturing a resin molded article, A method for manufacturing a resin molded product using the resin molding apparatus 1 on the seventh side, A film placement step in which the release film F is placed in the lower mold 200D, A resin molding process in which resin molding is performed using the lower mold 200D on which the release film F is placed, Includes. The method for manufacturing resin molded articles described in the eighth aspect of this disclosure can prevent the occurrence of molding defects and mold release defects in resin molded articles. [Explanation of Symbols]

[0100] 1 Resin molding equipment 200 mold 200D lower mold 200U upper mold 210 Main surface member 220 Side members 222 Outer member 223 Inner component 230 1st adsorption part 231 1st suction hole 232 2nd suction hole 240 2nd suction part 241 Concave part 242 Suction hole

Claims

1. A molding die comprising one mold and another mold positioned opposite the first mold and having a cavity in which a release film is placed, The other mold comprises a main surface member that forms the main surface of the cavity and a side surface member that forms the side surface of the cavity, The opposing surface of the side member facing one of the molds includes a plurality of first suction holes and second suction holes connecting adjacent first suction holes, and release film adsorption holes are formed to adsorb the release film. In the opposing surfaces, the length of the first suction hole is greater than that of the second suction hole in the direction perpendicular to the direction in which the second suction hole extends to connect adjacent first suction holes. Molding mold.

2. The first suction hole is formed to protrude from the second suction hole toward at least one of the sides opposite to the cavity, either toward the cavity side or the side opposite to the cavity. The molding die according to claim 1.

3. The release film adsorption holes are formed to continuously surround the cavity. The molding die according to claim 1.

4. The aforementioned side member is The inner member that constitutes the portion on the cavity side of the release film adsorption hole, The inner member and the outer member, which is composed of another member and constitutes the portion opposite to the cavity from the release film adsorption hole, Equipped with, The molding die according to claim 3.

5. The first suction hole is formed in the outer member. The molding die according to claim 4.

6. On the opposing surface of the side member, on the cavity side of the release film adsorption hole, a concave portion and a third suction hole portion capable of drawing in air are formed inside the concave portion. The molding die according to claim 1.

7. A resin molding apparatus comprising a mold according to any one of claims 1 to 6.

8. A method for manufacturing a resin molded product using the resin molding apparatus described in claim 7, A film placement step involves placing the release film in the other mold, A resin molding process in which resin molding is performed using the other mold on which the release film is placed, A method for manufacturing resin molded products, including

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