Molding mold, resin molding apparatus, method for manufacturing resin molded products, outer frame member, main body member, and intermediate mold

Abstract

To provide a molding mold capable of manufacturing an intermediate mold in a short time, a resin molding apparatus, and a method for manufacturing a resin molded product.SOLUTION: A molding mold includes a molding mold body that holds an object to be molded and has a cavity into which a resin material is supplied. The molding mold body has an upper mold, a lower mold including a pot block in which a pot into which the resin material is filled is formed, and an intermediate mold IM arranged between the upper and lower molds and having a first surface 81 facing the object to be molded. The intermediate mold IM has a main body member 86 having a gate 84 for supplying the resin material to the cavity, an outer frame member 87 arranged on a periphery of the main body member 86, and a holding mechanism 88 for holding the main body member 86 to the outer frame member 87. The main body member 86 and the outer frame member 87 are separable.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to a mold, a resin molding apparatus, and a method for manufacturing a resin molded product.

Background Art

[0002] A substrate or the like to which a semiconductor chip is fixed is generally used as an electronic component by resin encapsulation. Conventionally, a resin molding apparatus for resin encapsulating a substrate or the like, which includes a mold for transfer molding, is known. In transfer molding, there is a top gate method in which a resin material is supplied from a direction perpendicular to the substrate or the like (see, for example, Patent Document 1).

[0003] In the mold for transfer molding of the top gate method disclosed in Patent Document 1, it is composed of an upper mold, a lower mold, and an intermediate mold (medium mold in Patent Document 1) between them. In the mold disclosed in Patent Document 1, a runner is formed in the upper mold, a cavity and a gate are formed in the intermediate mold, and a cavity is formed in the lower mold. The runner may be formed in the intermediate mold.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the mold for transfer molding of the top gate method, since a cavity, a gate, a runner, etc. are formed in the intermediate mold, it takes a long time to process the intermediate mold during the manufacture of the mold. Further, when a processing error occurs in the intermediate mold or damage occurs in a part of the intermediate mold, the entire intermediate mold cannot be used.

[0006] Therefore, a mold, a resin molding apparatus, and a method for manufacturing a resin molded product that enable the manufacture of an intermediate mold in a short time are desired. [Means for solving the problem]

[0007] The characteristic configuration of the mold according to the present invention is a mold body having a cavity for holding an object to be molded and for supplying resin material, the mold body having an upper mold, a lower mold including a pot block in which a pot for filling with the resin material is formed, and an intermediate mold disposed between the upper mold and the lower mold and having a first surface facing the object to be molded, the intermediate mold having a main body member having a gate for supplying the resin material to the cavity, an outer frame member disposed around the periphery of the main body member, and a holding mechanism for holding the main body member in the outer frame member, the main body member and the outer frame member being separable.

[0008] The characteristic configuration of the resin molding apparatus according to the present invention is that it comprises the molding die described above and a mold clamping mechanism for clamping the molding die.

[0009] The characteristic feature of the method for manufacturing a resin molded product according to the present invention is that it is a method for manufacturing a resin molded product using the resin molding apparatus described above, and includes a supply step of supplying the object to be molded and the resin material to the mold; a mold clamping step of clamping the mold with the mold clamping mechanism; and a molding step of performing resin molding of the object to be molded by flowing the molten resin material from the pot through the gate into the cavity. [Effects of the Invention]

[0010] According to the present invention, it is possible to provide a mold that can manufacture an intermediate mold in a short time, a resin molding apparatus, and a method for manufacturing resin molded products. [Brief explanation of the drawing]

[0011] [Figure 1] This is a schematic diagram representing a resin molding apparatus according to the first embodiment. [Figure 2] This is a schematic diagram illustrating the mold clamping mechanism of a resin molding machine. [Figure 3]It is a schematic diagram showing a molding process including a mold clamping process. [Figure 4] It is a schematic diagram showing a molding process including a mold clamping process. [Figure 5] It is an exploded perspective view of an intermediate mold according to the first embodiment. [Figure 6] It is a perspective view showing an intermediate mold. [Figure 7] It is a plan view showing an intermediate mold. [Figure 8] It is a cross-sectional view taken along the line VIII-VIII of FIG. 7. [Figure 9] It is a cross-sectional view taken along the line IX-IX of FIG. 7. [Figure 10] It is a cross-sectional view taken along the line X-X of FIG. 7. [Figure 11] It is a cross-sectional view taken along the line XI-XI of FIG. 7. [Figure 12] It is a perspective view showing a first holding member. [Figure 13] It is a perspective view showing a second holding member. [Figure 14] It is a cross-sectional view showing an intermediate mold according to the second embodiment. [Figure 15] It is a cross-sectional view showing an intermediate mold according to the second embodiment. [Figure 16] It is a cross-sectional view showing an intermediate mold according to the third embodiment.

Embodiments for Carrying Out the Invention

[0012] Hereinafter, embodiments of a molding die, a resin molding apparatus, and a method for manufacturing a resin molded product according to the present invention will be described based on the drawings. However, the present invention is not limited to the following embodiments, and various modifications can be made without departing from the gist thereof.

[0013] 〔Configuration of the Entire Apparatus〕 A molding object such as a substrate on which a semiconductor chip (hereinafter sometimes simply referred to as a "chip") is fixed is resin-sealed and used as an electronic component. This electronic component is used, for example, as a high-frequency module substrate for a mobile communication terminal, a power control module substrate, an equipment control substrate, or the like. As one of the technologies for resin-sealing a molding object, there is a transfer method for manufacturing a semiconductor package by resin-sealing a BGA (Ball Grid Array) substrate or the like. In this transfer method, a substrate or the like on which a chip is fixed is housed in a cavity of a mold, a resin tablet obtained by compacting a granular resin is supplied to a pot of the mold, heated and melted, and then the melted resin obtained by melting the resin tablet is supplied to the cavity in a state where the mold is clamped, hardened, and the mold is opened to manufacture a resin molded product. In addition, in the transfer method in the present embodiment, a top gate method is used.

[0014] The granular resin includes not only the granular resin but also a resin tablet formed of a solid resin obtained by compacting the granular resin, and both are melted by heating to become a liquid molten resin. This granular resin may be a thermoplastic resin or a thermosetting resin. When heated, the thermosetting resin has a reduced viscosity, and when further heated, it polymerizes and hardens to become a cured resin. In the present embodiment, the granular resin is preferably a resin tablet formed of a solid resin for ease of handling. Further, it is preferably a highly fluid thermosetting resin containing micronized fillers.

[0015] FIG. 1 shows a schematic configuration of a resin molding apparatus 100 according to the present embodiment. The resin molding apparatus 100 is an apparatus for molding a pre-resin-molding substrate Sa (an example of a molding object) with resin using a mold C. In the present embodiment, the pre-resin-molding substrate Sa is rectangular, and a semiconductor chip is fixed in advance.

[0016] The resin molding apparatus 100 includes a CPU 1 as a central control unit, a storage unit 8 for storing control information such as control programs, a molding mechanism 2 having a mold C, a drive mechanism for driving the parts described later, and a touch panel 9 that receives input of operation commands and error handling related information from the operator and displays various output information of the resin molding apparatus 100. The CPU 1 constitutes a control unit 10 that controls the operation of each part of the resin molding apparatus 100 by executing programs stored in the storage unit 8.

[0017] The operation of the resin molding apparatus 100 described below is performed based on the operation commands of the control unit 10, unless otherwise specified. In the following description, the operation commands of the control unit 10 will generally not be explained, and will be explained as needed.

[0018] The resin molding apparatus 100 is constructed by connecting the following modules in this order as an integrated apparatus: a supply module M1 having an in-magazine 7 for accommodating multiple pre-molded substrates Sa; a molding module M2 having a molding die C; and a storage module M3 having an out-magazine 72 for accommodating pre-molded substrates Sb (an example of a resin molded product) after the pre-molded substrates Sa have been molded with resin. The supply module M1, the molding module M2, and the storage module M3 are each provided with guides G arranged linearly across each of these modules. The guides G are rail-shaped members on which the loader 40 and unloader 44, described later, travel. The guides G are located on the back side of each module.

[0019] Each module is detachable from the others and can be added or removed. The resin molding apparatus 100 of this embodiment has two molding modules M2. The resin molding apparatus 100 may have only one molding module M2, or it may have three or more.

[0020] [Drive mechanism] The drive mechanism includes a loader 40, a substrate supply unit 42, an unloader 44, a mold clamping mechanism 35, and a transfer mechanism, which will be described later.

[0021] The loader 40 is a transport mechanism that loads the unmolded substrate Sa into the mold C. The substrate supply unit 42 is a transport mechanism that pushes the unmolded substrate Sa from the in-magazine 7 and passes it to the alignment mechanism 70. The unloader 44 is a transport mechanism that unloads the molded substrate Sb from the mold C. The transfer mechanism is a mechanism that supplies molten resin from the pot to the cavity in the mold C, using resin tablets T (an example of resin material). The clamping mechanism 35 is a mechanism that clamps the mold C. The transfer mechanism is driven independently of the clamping mechanism 35.

[0022] The loader 40, the substrate supply unit 42, and the unloader 44 each have actuators 40b, 42b, and 44b, respectively. Actuators 40b, 42b, and 44b are air cylinders, for example, depending on their respective installation locations and the distance to which each part is driven.

[0023] [Circuit board supply unit] The substrate supply unit 42 is a mechanism that pushes out one pre-molded substrate Sa at a time from the in-magazine 7, which is a storage container that holds multiple pre-molded substrates Sa at vertical intervals, and transports them to the alignment mechanism 70. The substrate supply unit 42 has an actuator 42b. In this embodiment, the substrate supply unit 42 uses the actuator 42b to push the pre-molded substrate Sa out of the in-magazine 7 and move it to the alignment mechanism 70 which is located adjacent to the in-magazine 7. The alignment mechanism 70 has a rotating disc 70a, and when a pre-molded substrate Sa is placed on it, it rotates the rotating disc 70a to align the pre-molded substrate Sa so that it is in a state suitable for pickup by the loader 40. The substrate supply unit 42, the in-magazine 7, and the alignment mechanism 70 are provided in the supply module M1. The substrate supply unit 42, the in-magazine 7, and the alignment mechanism 70 are located in the supply module M1 on the front side of the guide G.

[0024] 〔loader〕 The loader 40 is a transport mechanism that loads the resin-molded substrate Sa into the mold C. The loader 40 is movable along the guide G from the supply module M1 to the molding module M2. The loader 40 has a loader pickup unit 40a that picks up the resin-molded substrate Sa and the resin tablet T.

[0025] The loader pickup unit 40a is equipped with multiple pairs of claws (not shown) that extend downward. The loader pickup unit 40a drives these pairs of claws (not shown) by an actuator to pick up the resin-molded substrate Sa from the alignment mechanism 70, transport it to the lower mold LM of the molding die C, and place it on the lower mold LM (load it in). Hereinafter, the picking operation by the loader pickup unit 40a will be simply referred to as "pickup."

[0026] Furthermore, the loader pickup unit 40a drives claws for holding resin material using other actuators (not shown) to pick up resin tablets T from the resin supply device 79. The pickup of resin tablets T is performed in the same manner as the pickup of the substrate Sa before resin molding. However, in this embodiment, one resin tablet T is picked up per claw.

[0027] The loader pickup unit 40a is movable forward and backward from the rear side to the front side in Figure 1 by the actuator 40b. The loader 40 moves the loader pickup unit 40a forward and backward to pick up the resin-pre-molded substrate Sa from the alignment mechanism 70, and then moves along the guide G from the supply module M1 to the molding module M2 to load the resin-pre-molded substrate Sa into the molding die C. The loader 40 also moves the loader pickup unit 40a forward and backward to receive the resin tablet T from the resin supply device 79, and moves from the supply module M1 to the molding module M2 to load the resin tablet T into the molding die C.

[0028] [Unloader] The unloader 44 is a transport mechanism that unloads the resin-molded substrate Sb from the mold C. The unloader 44 is movable along the guide G from the molding module M2 to the storage module M3. The unloader 44 has an unloader pickup unit 44a that picks up the resin-molded substrate Sb, etc. The unloader pickup unit 44a is movable back and forth from the rear side to the front side in Figure 1 by an actuator 44b. The unloader 44 moves the unloader pickup unit 44a back and forth to pick up the resin-molded substrate Sb from the lower mold LM of the mold C, moves from the molding module M2 to the storage module M3, and transports the resin-molded substrate Sb to the out magazine 72 of the storage module M3 for storage.

[0029] The unloader pickup unit 44a, like the loader pickup unit 40a, is equipped with multiple pairs of claws (not shown) that extend downward. The pickup of the unloader pickup unit 44a is performed in the same manner as the pickup of the loader pickup unit 40a.

[0030] [Molding Module] Next, the molding module M2 will be described in detail using Figure 2. As shown in Figure 2, the molding module M2 has a rectangular lower fixing plate 31 in plan view, with tie bars 32 erected at the four corners, and a rectangular upper fixing plate 33 in plan view is provided near the upper ends of the tie bars 32. A rectangular movable platen 34 in plan view is provided between the lower fixing plate 31 and the upper fixing plate 33. The movable platen 34 has holes at its four corners through which the tie bars 32 pass, and is movable up and down along the tie bars 32. A clamping mechanism 35, which is a device for moving the movable platen 34 up and down, is provided on the lower fixing plate 31. This clamping mechanism 35 includes an electric motor Ma, which is composed of a servo motor or the like as a drive source, and a load sensor Wa, which is composed of a strain gauge or load cell or the like for measuring the clamping force (hereinafter referred to as "clamping force") of the molding die C. The mold clamping mechanism 35 can clamp the mold C by moving the movable platen 34 upward, and open the mold C by moving the movable platen 34 downward.

[0031] The molding die C is composed of a molding die body M having a lower die LM, an upper die UM, and an intermediate die IM. The lower die LM, upper die UM, and intermediate die IM are composed of a mold, etc., with the intermediate die IM positioned between the lower die LM and the upper die UM.

[0032] The lower mold LM is mounted on a lower mold plate 38 which is placed on a movable platen 34. The lower mold LM comprises a base block 51, a lower mold ejector block 52 and a lower mold cavity block 53 positioned on the base block 51, and a pot block 54. The lower mold ejector block 52 is movable in the vertical direction (hereinafter also referred to as the vertical direction) relative to the base block 51 and the lower mold cavity block 53. The lower mold ejector block 52 houses a plurality of lower mold ejector pins (not shown), which eject the resin-molded substrate Sb from the lower mold cavity block 53. The lower mold cavity block 53 is held by a lower mold holding block 38a and a plurality of lower mold support pillars 51a that extend upward from the lower mold plate 38. The lower mold holding block 38a has lower mold holding claws 38b for holding the intermediate mold IM in the lower mold LM.

[0033] The resin-molded substrate Sa is placed on the upper surface of the lower mold cavity block 53 with the side on which the semiconductor chips Sc and the like are fixed facing upwards. In this embodiment, the lower mold LM has two lower mold cavity blocks 53, 53 arranged side by side so that two resin-molded substrates Sa can be molded in a single molding operation, and a pot block 54 is positioned between the two lower mold cavity blocks 53, 53. A cylindrical recess called a pot 54b is formed in the pot block 54, and the inside of the pot 54b is filled with a resin tablet T (a resin that melts when heated). Below the pot block 54, a plunger 54a driven by an electric motor Mb such as a servo motor is inserted so as to be able to move up and down. An elastic member (not shown) is provided at the support part of the plunger 54a, so that the plunger 54a is slightly displaced by the elastic force of the elastic member to release excessive pressing force, and can also adapt to variations in the amount of resin when the resin tablet T melts during holding pressure. Furthermore, the lower mold LM has a load sensor Wb, which consists of a strain gauge, load cell, etc., for measuring the force with which the plunger 54a extrudes the molten resin Ta (an example of a resin material).

[0034] The upper type UM is positioned opposite the lower type LM, with an intermediate type IM in between. The upper type UM comprises a holder base 61 fixed to the lower surface of the upper fixing plate 33, a first upper type ejector block 62, a second upper type ejector block 63, an upper type cavity block 64, and a cal block 65, all positioned below the holder base 61. The cal block 65 is attached to the lower surface 68 of the upper type cavity block 64. The first upper type ejector block 62 and the second upper type ejector block 63 are movable vertically relative to the holder base 61 and the upper type cavity block 64. The first upper type ejector block 62 houses a plurality of first upper type ejector pins (not shown). The first upper mold ejector pin has a Z shape and, when the mold is opened, holds the excess resin (hereinafter also referred to as residual resin Tb) remaining and hardened in the car runner 83a, runner 83, and gate 84 in the upper mold UM, and then separates the residual resin Tb from the resin-molded substrate Sb and ejects it from the upper mold cavity block 64. The second upper mold ejector block 63 houses a plurality of second upper mold ejector pins (not shown). The resin-molded substrate Sb is ejected from the intermediate mold IM by the second upper mold ejector pins. The upper mold cavity block 64 is held by upper mold holding blocks 61a and a plurality of upper mold support pillars 61b that extend downward from both ends of the holder base 61. The upper mold holding block 61a has upper mold holding claws 61c formed therein for holding the intermediate mold IM in the upper mold UM.

[0035] The intermediate mold IM has a plate shape, with a runner 83 formed on the second surface 82 facing the upper mold UM, and a cavity MC formed on the first surface 81 facing the lower mold LM. Here, in the intermediate mold IM, the surface facing the substrate Sa before resin molding is called the molding surface, and the opposite surface is called the non-molding surface. In this embodiment, the second surface 82 is the non-molding surface, and the first surface 81 is the molding surface. The intermediate mold IM has a gate 84 formed from the second surface 82 to the first surface 81, which supplies molten resin Ta flowing through the runner 83 to the cavity MC. In Figure 2, the intermediate mold IM has a cavity MC that accommodates a plurality of semiconductor chips Sco etc. fixed to the substrate Sa before resin encapsulation, and a through hole 85 is formed in the part of the pot block 54 corresponding to the pot 54b through which molten resin Ta from the pot 54b flows. The mold body M of this embodiment is configured in a top-gate system in which the gate 84 is positioned above the cavity MC.

[0036] [Method for manufacturing resin molded products] Next, a method for manufacturing a resin molded product will be described using Figures 1 to 4. The method for manufacturing a resin molded product (resin-molded substrate Sb) includes a supply step of supplying a substrate Sa and a resin tablet T to a mold C, a mold clamping step of clamping the mold C, and a molding step of performing resin molding of the substrate Sa by filling the cavity MC with molten resin Ta supplied from the gate 84. This molding step is a process in which the molding module M2 resin-moldes the substrate Sa from the time the substrate Sa is loaded into the molding module M2 until the resin-molded substrate Sb is unloaded from the molding module M2, and this molding step includes a mold clamping step. The operation of the mold C and the mold clamping mechanism 35 in the molding step is controlled by the control unit 10.

[0037] First, the supply process will be explained. As shown in Figure 1, the loader 40 is preheated with the resin tablet T storage space insulated. Also, the mold body M is preheated by energizing a heater (not shown) (see also Figure 2). Then, the two pre-molded resin substrates Sa taken out of the in-magazine 7 are placed on the alignment mechanism 70. The alignment mechanism 70 has a rotating disc 70a, and when the pre-molded resin substrates Sa are placed on it, the rotating disc 70a is rotated to align the pre-molded resin substrates Sa so that they are suitable for pickup by the loader 40. The loader pickup unit 40a uses an actuator 40b to pick up the pre-molded resin substrates Sa from the alignment mechanism 70 and place them on the loader 40, and also receives the resin tablets T from the resin supply device 79 and stores them in the resin tablet T storage space of the loader 40. The loader 40 then transports the pre-molded substrate Sa to the molding module M2, places the pre-molded substrate Sa with the side containing the semiconductor chip facing upwards on the substrate setting section of the lower mold LM, and houses the resin tablet T inside the pot 54b of the pot block 54 (see Figure 2). By housing the resin tablet T inside the pot 54b of the pot block 54, a heater (not shown) built into the lower mold LM heats the resin tablet T, turning it into molten resin Ta.

[0038] As shown in Figure 2, the intermediate mold IM is held by the upper mold retaining claws 61c, and the second surface 82 is in contact with the lower surface 68 of the upper mold cavity block 64. As a result, the intermediate mold IM is integrated with the upper mold cavity block 64. At this time, the cal block 65 attached to the upper mold cavity block 64 is inserted into the through hole 85 of the intermediate mold IM, and a cal runner 83a (resin passage for the cal portion) is formed between the inner circumferential surface of the through hole 85 and the outer circumferential surface of the cal block 65 through which molten resin Ta flows.

[0039] Next, the molding process, including the mold clamping process, will be described. First, from the state shown in Figure 2, the mold clamping mechanism 35 moves the movable platen 34 upward, moving the lower mold LM in the direction of the upper mold UM and the intermediate mold IM (vertically), so that the lower mold cavity block 53 and the first surface 81 of the intermediate mold IM come into contact, as shown in Figure 3. Furthermore, the mold clamping mechanism moves the movable platen 34 upward to move the lower mold LM further in the direction of the upper mold UM, and the mold is clamped. After the mold clamping is complete, the electric motor Mb moves the plunger 54a upward, and the molten resin Ta flows from the pot 54b through the car runner 83a and runner 83 to the gate 84. Then, the supply of molten resin Ta from the gate 84 to the cavity MC begins. After this, the transfer mechanism 39, including the plunger 54a, rises further, and the molten resin Ta in the pot 54b fills the cavity MC. Then, after the molten resin Ta has been filled into the cavity MC, a predetermined time is allowed to pass to allow the molten resin Ta to harden.

[0040] After the molten resin Ta has hardened, the control unit 10 moves the movable platen downward using the mold clamping mechanism to open the mold C. At this time, the intermediate mold IM is held by the lower mold holding claws 38b and moves downward together with the lower mold LM, and the remaining resin Tb separates from the intermediate mold IM and remains in close contact with the upper mold cavity block 64. In other words, as the intermediate mold IM separates from the upper mold UM, the remaining resin Tb is separated from the resin-molded substrate Sb (see Figure 4).

[0041] Subsequently, the remaining resin Tb that is in close contact with the upper mold cavity block 64 is released from the upper mold cavity block 64 and unloaded by a plurality of first upper mold ejector pins (not shown) that protrude downward from the upper mold cavity block 64 as the first upper mold ejector block 62 moves downward.

[0042] Next, the mold clamping mechanism 35 moves the movable platen 34 upward again, moving the lower mold LM toward the upper mold UM and the intermediate mold IM, bringing the lower mold cavity block 53 into contact with the intermediate mold IM. Then, the holding mechanism for the intermediate mold IM is switched from the lower mold holding claw 38b to the upper mold holding claw 61c. As a result, the intermediate mold IM is once again integrated with the upper mold UM.

[0043] Subsequently, the control unit 10 moves the movable platen downward to open the mold C. At this time, since the intermediate mold IM is held by the upper mold holding claws 61c, only the lower mold LM moves downward. In conjunction with the downward movement of the lower mold LM, the second upper mold ejector block 63 (not shown) also moves downward, and the second upper mold ejector pin protrudes downward from the intermediate mold IM while remaining in contact with the resin-molded substrate Sb. As a result, the resin-molded substrate Sb is separated from the intermediate mold IM and maintains a state of close contact with the lower mold cavity block 53.

[0044] After the lower mold LM moves downward, the lower mold ejector block 52 moves relatively upward, and consequently, the lower mold ejector pins (not shown) also rise. This releases the resin-molded substrate Sb from the lower mold LM, completing the resin molding process. Subsequently, the resin-molded substrate Sb is picked up by the unloader pickup unit 44a of the unloader 44, and the unloader 44 moves the resin-molded substrate Sb from the molding module M2 to the storage module M3. Then, in the storage module M3, it is stored in the out magazine 72 (see Figure 1).

[0045] [Intermediate type configuration] [First Embodiment] The intermediate IM of this embodiment, as shown in Figures 5 and 6, includes a plurality (two in this embodiment) of main body members 86 and an outer frame member 87 arranged around the periphery of the main body members 86. The main body member 86 has a main body molding surface 81a (an example of a first surface) on which the cavity MC is formed, a main body non-molding surface 82a (an example of a second surface) which is the surface opposite to the main body molding surface 81a, a runner 83, and a gate 84. The outer frame member 87 has an outer frame molding surface 81b (an example of a first surface), an outer frame non-molding surface 82b (an example of a second surface), and a through hole 85 (car runner 83a). The outer frame member 87 has two rectangular openings 87a, and the two main body members 86 are held by a holding mechanism 88 with each of them mounted in the openings 87a. The main body members 86 and the outer frame member 87 are separable.

[0046] [Outer frame component] The outer frame member 87 is plate-shaped and has two rectangular openings 87a in a plan view (viewed perpendicular to the first surface 81; the same applies hereinafter). The outer frame member 87 has two short frames 87c and two long frames 87d that constitute the outer frame of the outer frame member 87, and one central frame 87e that spans the two short frames 87c. Each opening 87a is demarcated by the two short frames 87c, one long frame 87d, and one central frame 87e. The central frame 87e has multiple (five in this embodiment) through holes 85 and runners 83 formed therein. Since the two openings 87a have the same shape, only one of the openings 87a will be described below.

[0047] The opening 87a is composed of four inner surfaces. Specifically, these are two first inner surfaces 87f (an example of an inner surface) composed of each of the two short frames 87c, a second inner surface 87g (an example of an inner surface) composed of the long frame 87d, and a third inner surface 87h (an example of an inner surface) composed of the central frame 87e. Of these, each of the two first inner surfaces 87f has a stepped portion 87i formed thereon. Specifically, the surface of the first inner surface 87f adjacent to the outer frame molded surface 81b protrudes further inward into the opening 87a than the surface adjacent to the outer frame non-molded surface 82b, thus forming the stepped portion 87i.

[0048] As shown in Figure 7, two first inner surfaces 87f and a second inner surface 87g adjacent to the unformed outer surface 82b of the outer frame member 87 have tapers 87j formed on them to facilitate the attachment of the main body member 86 to the opening 87a (see also Figure 8). In other words, three tapers 87j are formed on the opening 87a. Also, as shown in Figure 9, a plurality (four in this embodiment) of socket head cap screws 87k (an example of set screws) are attached to the second inner surface 87g of the outer frame member 87 in a manner that allows them to protrude from the second inner surface 87g into the opening 87a (see also Figure 5). With the main body member 86 attached to the opening 87a, the socket head cap screws 87k are tightened and protrude from the second inner surface 87g into the opening 87a, thereby pressing the main body member 86 toward the third inner surface 87h. As a result, there is no gap between the unmolded surface 82a of the main body member 86 and the unmolded surface 82b of the central frame 87e of the outer frame member 87, and during the manufacturing of the resin molded product (resin molded substrate Sb), the molten resin Ta flowing through the runner 83 does not leak out from between the main body member 86 and the central frame 87e.

[0049] [Main body components] As shown in Figures 5 and 6, the main body member 86 is a rectangular plate in plan view, with a cavity MC formed on the molded surface 81a of the main body and a runner 83 formed on the unmolded surface 82a of the main body. A gate 84 is formed penetrating the main body member 86 in the thickness direction from the runner 83 to the cavity MC. On the main body member 86, the outer surface 86b facing the first inner surface 87f of the short frame 87c of the outer frame member 87 has a stepped portion 86c formed thereon, which corresponds to the stepped portion 87i of the first inner surface 87f. Specifically, the surface of the outer surface 86b adjacent to the molded surface 81a is more recessed than the surface adjacent to the unmolded surface 82a of the main body. Therefore, when the main body member 86 is moved downward relative to the opening 87a of the outer frame member 87 with the molded surface 81a facing downward, the stepped portion 86c of the main body member 86 contacts the stepped portion 87i of the outer frame member 87. As a result, the main body molded surface 81a is held against the outer frame member 87 (see also Figure 11). When the stepped portion 86c of the main body member 86 is in contact with the stepped portion 87i of the outer frame member 87, the main body molded surface 81a of the main body member 86 and the outer frame molded surface 81b of the outer frame member 87 become flush, and the non-molded surface 82a of the main body member 86 and the non-molded surface 82b of the outer frame member 87 become flush.

[0050] [Holding mechanism] As shown in Figure 5, the holding mechanism 88 in this embodiment includes a first holding member 88a (an example of a holding member), a second holding member 88b (an example of a holding member), a main body groove 86a (an example of a groove), and an outer frame groove 87b (an example of a groove). The first holding member 88a and the second holding member 88b are fixed to the outer frame member 87 to hold the main body member 86. The main body groove 86a is formed in the main body member 86, and the outer frame groove 87b is formed in the outer frame member 87 at a position continuous with the main body groove 86a. The first holding member 88a is positioned on the first surface 81 side of the main body member 86, and the second holding member 88b is positioned on the second surface 82 side of the main body member 86. The main body member 86 is held against the outer frame member 87 by sandwiching it between the first holding member 88a and the second holding member 88b.

[0051] As shown in Figures 8, 10, and 11, the first retaining member 88a and the second retaining member 88b are housed in the main body groove 86a and the outer frame groove 87b. The depth of the main body groove 86a from the main body molded surface 81a and the main body non-molded surface 82a is slightly deeper than the depth of the outer frame groove 87b from the outer frame molded surface 81b and the outer frame non-molded surface 82b. Furthermore, the outer frame groove 87b is deep enough that, with the first retaining member 88a and the second retaining member 88b housed there, the first retaining member 88a does not protrude beyond the outer frame molded surface 81b and the second retaining member 88b does not protrude beyond the outer frame non-molded surface 82b.

[0052] The first retaining member 88a and the second retaining member 88b, as shown in Figures 12 and 13, have the same shape except for the shape of the through-hole, which will be described later. Therefore, only the first retaining member 88a will be described below, and the description of the second retaining member 88b will be omitted. The shape of the through-hole will be described separately for the first retaining member 88a and the second retaining member 88b.

[0053] As shown in Figure 12, the first retaining member 88a has a fixed portion 88c and a retaining portion 88d extending from the fixed portion 88c. The fixed portion 88c is the part that is housed in the outer frame groove portion 87b, and the retaining portion 88d is the part that is housed in the main body groove portion 86a (see also Figure 8). The first retaining member 88a has a roughly D-shape in plan view, and the aforementioned through hole is formed in the fixed portion 88c. The through hole formed in the fixed portion 88c of the first retaining member 88a is a female screw 88e. On the other hand, the through hole in the fixed portion 88c of the second retaining member 88b is a counterbore hole 88f, as shown in Figure 13 (see also Figures 10 and 11). A C-chamfer is formed on the end of the fixed portion 88c opposite to the retaining portion 88d, and on the end of the retaining portion 88d opposite to the fixed portion 88c. The first retaining member 88a and the second retaining member 88b are fixed to the outer frame member 87 by headed bolts 87l (an example of a bolt; hereinafter simply referred to as bolt 87l), as shown in Figures 8, 10, and 11. The thickness of the through hole (female thread 88e) in the fixing portion 88c and the retaining portion 88d of the first retaining member 88a is the same in the direction along the central axis.

[0054] As shown in Figure 8, at the bottom of the outer frame groove 87b on the outer frame molded surface 81b side in which the first retaining member 88a is housed, a through hole 87m is formed that is coaxial with the female thread 88e of the housed first retaining member 88a and through which a bolt 87l that can be fastened to the female thread 88e can pass. Furthermore, on the outer frame non-molded surface 82b side of the through hole 87m, a counterbore 87o (an example of a recess) is formed that can accommodate the head 87p of the bolt 87l. The depth of the counterbore 87o is greater than the thickness of the head 87p of the bolt 87l. Also, as shown in Figures 10 and 11, at the bottom of the outer frame groove 87b on the outer frame non-molded surface 82b side in which the second retaining member 88b is housed, a female thread 87n is formed that is coaxial with the counterbore hole 88f through which the bolt 87l can pass in the housed second retaining member 88b and through which the bolt 87l can be fastened. In this embodiment, the female thread 87n does not penetrate to the first surface 81, but it may be made to penetrate. The depth of the counterbore in the counterbore hole 88f of the second retaining member 88b is deeper than the thickness of the head 87p of the bolt 87l.

[0055] As shown in Figures 5 and 6, the first retaining member 88a is attached to two locations on the long frame 87d of the outer frame molding surface 81b. The second retaining member 88b is attached to the outer frame non-molded surface 82b, one location on each of the two short frames 87c, two locations on the long frame 87d, and two locations on the central frame 87e, as shown in Figures 5 and 7. On the first surface 81 side, as described above, the stepped portion 86c of the main body member 86 is held by the stepped portion 87i of the short frame 87c, so the first retaining member 88a is not required on the short frame 87c on the first surface 81 side. Note that in Figure 5, the depiction of the second retaining member 88b attached to two locations on the central frame 87e is omitted.

[0056] As shown in Figures 8, 10, and 11, the first retaining member 88a housed on the first surface 81 side and the second retaining member 88b housed on the second surface 82 side are both fastened by inserting a bolt 87l from the second surface 82 side (the non-molded outer frame surface 82b). By fastening them by inserting the bolt 87l from the second surface 82 side in this way, the risk of accidentally damaging the cavity MC formed on the first surface 81 during fastening or other operations is suppressed.

[0057] The main body member 86 and the outer frame member 87 have the same thickness. That is, the distance between the molded surface 81a and the unmolded surface 82a of the main body is the same as the distance between the molded surface 81b and the unmolded surface 82b of the outer frame. Also, as shown in Figures 8, 10, and 11, the thickness of the first retaining member 88a and the second retaining member 88b in the direction along the central axis of the through holes (female thread 88e, counterbore hole 88f) of the fixing portion 88c and the retaining portion 88d is the same. Furthermore, the depth of the main body groove portion 86a from the molded surface 81a and the unmolded surface 82a of the main body is slightly deeper than the depth of the outer frame groove portion 87b from the molded surface 81b and the unmolded surface 82b of the outer frame. Therefore, when the main body member 86 is attached to the outer frame member 87 and held by the first holding member 88a and the second holding member 88b, and the main body molding surface 81a of the main body member 86 and the outer frame molding surface 81b of the outer frame member 87 are made flush, a gap d exists between the bottom surfaces of the fixing portions 88c of the first holding member 88a and the second holding member 88b and the bottom surface of the main body groove portion 86a. Due to the existence of the gap d, the main body member 86 can move relative to the outer frame member 87 (first holding member 88a and second holding member 88b) by the gap d in the vertical direction (thickness direction of the main body member 86).

[0058] If the depth of the main body groove 86a from the main body molding surface 81a and the main body non-molding surface 82a is the same as the depth of the outer frame groove 87b from the outer frame molding surface 81b and the outer frame non-molding surface 82b, then the main body member 86 will be fixed to the outer frame member 87 without any gaps. In that case, even if the thickness of the main body member 86 and the outer frame member 87 is the same, variations in the depth of the main body groove 86a and the outer frame groove 87b on the first surface 81 and the second surface 82 may cause the main body molding surface 81a of the main body member 86 and the outer frame molding surface 81b of the outer frame member 87 to not be flush. In that case, a step difference will occur on the surface of the intermediate mold IM due to the main body member 86 and the outer frame member 87, and the mold clamping mechanism will not be able to properly clamp the mold. However, as in this embodiment, if the main body member 86 is movable relative to the outer frame member 87 in the vertical direction, then by simply processing the main body member 86 and the outer frame member 87 to have the same thickness, when the mold clamping mechanism 35 clamps the mold, the intermediate mold IM is sandwiched between the upper mold and the lower mold, causing the main body member 86 to move vertically relative to the outer frame member 87 so that the main body molding surface 81a and the outer frame molding surface 81b become flush, and thus the mold clamping can be performed correctly.

[0059] [Second Embodiment] Next, the configuration of the intermediate IM according to the second embodiment will be described with reference to Figures 14 and 15. In this embodiment, the method of holding the main body molding surface 81a of the main body member 86 with the first inner surface 87f of the short frame 87c of the outer frame member 87 differs from that of the first embodiment, but otherwise it has the same configuration as the first embodiment. Therefore, in the description of this embodiment, the same reference numerals are used for parts with the same configuration as the first embodiment, and detailed explanations of similar configurations are omitted.

[0060] Figure 14 is a cross-sectional view of the intermediate type IM at the point where the first retaining member 88a is cut perpendicular to the extension direction of the short frame 87c, showing the cross section from the main body member 86 to the short frame 87c of the outer frame member 87. Figure 15 is a cross-sectional view of the intermediate type IM at the point where the second retaining member 88b is cut perpendicular to the extension direction of the short frame 87c, showing the cross section from the main body member 86 to the short frame 87c of the outer frame member 87. In this embodiment, no stepped portion 87i is formed on the first inner surface 87f of the short frame 87c of the outer frame member 87, and the first inner surface 87f is planar. Also, no stepped portion 86c is formed on the outer surface 86b of the main body member 86, and the outer surface 86b is planar. In the short frame 87c of this embodiment, the main body molded surface 81a is held by the first retaining member 88a, and the main body non-molded surface 82a is held by the second retaining member 88b.

[0061] [Third Embodiment] Next, the configuration of the intermediate IM according to the third embodiment will be described with reference to Figure 16. In this embodiment, the method of holding the non-molded surface 82a of the main body member 86 with the first inner surface 87f of the short frame 87c of the outer frame member 87 differs from that of the first embodiment, but otherwise it has the same configuration as the first embodiment. Therefore, in the description of this embodiment, the same reference numerals are used for parts with the same configuration as the first embodiment, and detailed explanations of similar configurations are omitted.

[0062] Figure 16 is a cross-sectional view of the intermediate type IM at the point where the bolt 87l is cut perpendicular to the extension direction of the short frame 87c, showing the cross section from the main body member 86 to the short frame 87c of the outer frame member 87. In this embodiment, the main body molded surface 81a is held by the contact between the stepped portion 87i formed on the first inner surface 87f of the short frame 87c of the outer frame member 87 and the stepped portion 86c formed on the outer surface 86b of the main body member 86. The main body non-molded surface 82a is fixed to the outer frame member 87 by a plurality of bolts 87l that fasten the stepped portion 86c and the stepped portion 87i. The bolts 87l are inserted from the side of the main body non-molded surface 82a toward the main body molded surface 81a. The heads 87p of the bolts 87l are housed in counterbores 87o.

[0063] [Another embodiment] The following describes another embodiment of the above-described embodiment. For the same components as in the above-described embodiment, the same terms and reference numerals will be used for explanation to facilitate understanding.

[0064] <1> In the above-described embodiment, the molding die is used to mold two pre-molded resin substrates Sa in a single molding operation, and the intermediate mold IM has two main body members 86. However, in a molding die used to mold one pre-molded resin substrate Sa in a single molding operation, the intermediate mold IM may have only one main body member 86.

[0065] <2> In the embodiment described above, the main body member 86 of the intermediate IM was rectangular, but it is not limited to this. Any shape can be used, such as a circular shape. Furthermore, the size of the main body member 86 is not limited.

[0066] <3> In the embodiments described above, the cavity MC was formed only in the intermediate IM, but this is not the only possible configuration. The cavity MC may be formed in both the intermediate IM and the lower LM, or it may be formed only in the lower LM.

[0067] <4> In the embodiment described above, the runner 83 was formed only on the intermediate mold IM, but it is not limited to this. The runner 83 may be formed across the intermediate mold IM and the upper mold UM, or it may be formed only on the upper mold UM.

[0068] <5> In the main body member 86 of the embodiment described above, the depth of the main body groove 86a from the main body molded surface 81a and the main body non-molded surface 82a was formed to be slightly deeper than the depth of the outer frame groove 87b from the outer frame molded surface 81b and the outer frame non-molded surface 82b. In addition, the thickness of the through holes (female threads 88e, counterbore holes 88f) of the fixing portion 88c and the holding portion 88d in the first holding member 88a and the second holding member 88b was the same in the direction along the central axis, but this is not limited to this. The depth of the main body groove 86a and the depth of the outer frame groove 87b may be made the same, and the thickness of the holding portion 88d in the first holding member 88a and the second holding member 88b may be made thinner than the thickness of the fixing portion 88c. Alternatively, the depth of the main body groove 86a may be made deeper than the depth of the outer frame groove 87b, and the thickness of the holding portion 88d in the first holding member 88a and the second holding member 88b may be made thinner than the thickness of the fixing portion 88c. As long as the main body member 86 is configured to be able to move relative to the outer frame member 87 in the vertical direction, any configuration can be adopted for the relationship between the depth of the main body groove 86a and the depth of the outer frame groove 87b, and for the relationship between the thickness of the holding portion 88d and the thickness of the fixing portion 88c in the first holding member 88a and the second holding member 88b.

[0069] <6> In the embodiments described above, the number of first retaining members 88a and second retaining members 88b that hold the main body member 86 is not limited to the number disclosed in the embodiments. It may be more or less than the number disclosed in the embodiments. Furthermore, although the shapes of the first retaining members 88a and second retaining members 88b in the embodiments described above are substantially D-shaped in plan view, they are not particularly limited as long as they are arranged across the main body groove 86a and the outer frame groove 87b, and for example, they may be rectangular in plan view.

[0070] <7> In the embodiment described above, the stepped portion 86c of the main body member 86 was in contact with the stepped portion 87i of the outer frame member 87 when the main body member 86 was attached to the outer frame member 87, but it is not limited to this. There may be a gap of about d between the stepped portion 86c of the main body member 86 and the stepped portion 87i of the outer frame member 87.

[0071] <8> In the configuration in which the main body member 86 is held by the first inner surface 87f of the short frame 87c of the outer frame member 87, in the first embodiment, a stepped portion 87i is provided on the first inner surface 87f to hold the stepped portion 86c of the main body member 86, thereby holding the molded surface 81a of the main body, and the unmolded surface 82a of the main body is held by the second holding member 88b. In the second embodiment, the molded surface 81a of the main body member 86 is held by the first holding member 88a, and the unmolded surface 82a of the main body is held by the second holding member 88b. In the third embodiment, a stepped portion 87i is provided on the first inner surface 87f to hold the stepped portion 86c of the main body member 86, thereby holding the molded surface 81a of the main body, and the unmolded surface 82a of the main body is held by fastening it with a bolt 87l. However, the method of holding the molded surface 81a and the unmolded surface 82a of the main body is not limited to these. In the outer frame member 87, steps may be provided on the second inner surface 87g and the third inner surface 87h in place of or together with the first inner surface 87f. Furthermore, the method for holding the unmolded surface 82a of the main body member 86 when the molded surface 81a of the main body member 86 is held by the steps may be by either the second holding member 88b, the bolt 87l, or both. These methods can be freely combined as much as possible to hold the main body member 86.

[0072] <9> In the embodiment described above, a taper 87j was formed on the two first inner surfaces 87f and the second inner surface 87g (the three inner surfaces of the opening 87a) adjacent to the non-molded outer surface 82b of the outer frame member 87, but it is not limited to this. The taper 87j only needs to be formed on at least one of the three inner surfaces of the two first inner surfaces 87f and the second inner surface 87g.

[0073] <10> In the embodiments described above, the mold is a top-gate type transfer mold with the gate formed above the cavity, but it is not limited to this. For example, the mold may also have the gate formed below the cavity.

[0074] [Summary of the above embodiment] The following describes the general outline of the mold C, resin molding apparatus 100, and method for manufacturing the resin molded product (resin-molded substrate Sb) as described in the above embodiment.

[0075] (1) The characteristic configuration of the mold C is that it comprises a mold body M having a cavity MC that holds the object to be molded (resin substrate Sa before resin molding) and into which resin material (resin tablet T, molten resin Ta) is supplied, and the mold body M comprises an upper mold UM, a lower mold LM including a pot block 54 in which a pot 54b into which the resin material (resin tablet T) is formed is formed, and an intermediate mold IM disposed between the upper mold UM and the lower mold LM and having a first surface 81 facing the object to be molded (resin substrate Sa before resin molding), and the intermediate mold IM comprises a main body member 86 having a gate 84 for supplying resin material (molten resin Ta) to the cavity MC, an outer frame member 87 disposed on the periphery of the main body member 86, and a holding mechanism 88 that holds the main body member 86 in the outer frame member 87, and the main body member 86 and the outer frame member 87 are separable.

[0076] In the mold C according to this characteristic configuration, the intermediate mold IM is composed of a main body member 86 and an outer frame member 87. The main body member 86 is held by the outer frame member 87 by a holding mechanism 88, and the main body member 86 and the outer frame member 87 are separable from each other. Therefore, the main body member 86 and the outer frame member 87 can be manufactured in parallel, thus shortening the time required to manufacture the intermediate mold IM. Furthermore, since the main body member 86 and the outer frame member 87 are manufactured separately, even if a defect occurs in one manufacturing process and is discarded, it does not affect the other. Therefore, the intermediate mold IM can be manufactured efficiently.

[0077] (2) In the mold C described in (1) above, the holding mechanism 88 may include a holding member (first holding member 88a, second holding member 88b) fixed to the outer frame member 87 and holding the main body member 86, and a groove (main body groove 86a, outer frame groove 87b) formed from the outer frame member 87 to the main body member 86 and accommodating the holding member (first holding member 88a, second holding member 88b).

[0078] With this configuration, the main body member 86 can be held relative to the outer frame member 87 simply by housing the retaining members (first retaining member 88a, second retaining member 88b) in the grooves (main body groove 86a, outer frame groove 87b).

[0079] (3) In the mold C described in (2) above, the main body member 86 may be movable in the vertical direction with respect to the retaining members (first retaining member 88a, second retaining member 88b) fixed to the outer frame member 87.

[0080] In this configuration, simply by processing the main body member 86 and the outer frame member 87 to have the same thickness, when the mold clamping mechanism 35 clamps the mold, the intermediate mold IM is sandwiched between the upper mold UM and the lower mold LM, causing the main body member 86 to move vertically relative to the outer frame member 87 so that the first surface 81 of the main body member 86 becomes flush with the first surface 81 of the outer frame member 87. This allows the molding die C to be clamped correctly.

[0081] (4) In the mold C described in (2) or (3) above, the retaining members (first retaining member 88a, second retaining member 88b) are fixed to the outer frame member 87 by bolts (headed bolts 87l), and the heads 87p of the bolts (headed bolts 87l) may be housed in recesses (countersinks 87o) formed on the second surface 82 of the outer frame member 87 opposite to the first surface 81.

[0082] In this configuration, since the head 87p of the bolt (headed bolt 87l) is housed in the recess (counterbore 87o), the head 87p of the bolt (headed bolt 87l) does not obstruct the mold clamping when the mold clamping mechanism 35 is used.

[0083] (5) In the mold C described in any one of (1) to (4) above, the outer frame member 87 has a rectangular opening 87a to which the main body member 86 is attached, and a through hole 85 connected to the pot 54b, and a taper 87j is formed on at least one of the three inner surfaces (first inner surface 87f, second inner surface 87g, third inner surface 87h) of the four inner surfaces (first inner surface 87f, second inner surface 87g, third inner surface 87h) that constitute the opening 87a, excluding the inner surface adjacent to the through hole 85.

[0084] With this configuration, the main body member 86 can be smoothly attached to the outer frame member 87 along the taper 87j.

[0085] (6) In the mold C described in (5) above, the main body member 86 may be pressed against one inner surface of the opening 87a of the outer frame member 87 adjacent to the through hole 85 by a set screw (hex socket head bolt 87k).

[0086] In this configuration, the main body member 86 is pressed against one of the inner surfaces of the opening 87a of the outer frame member 87 adjacent to the through hole 85 by a set screw (hex socket head bolt 87k), so that there is no gap between the main body member 86 and the outer frame member 87, and molten resin Ta does not leak out from between the main body member 86 and the outer frame member 87 during the manufacturing of the resin molded product (resin molded substrate Sb).

[0087] (7) In the mold C described in any one of (1) to (6) above, the main body member 86 may have a cavity MC on the first surface 81 (main body molding surface 81a) and a runner 83 on the second surface 82 (main body non-molding surface 82a) opposite to the first surface 81.

[0088] With this configuration, the top-gate type mold C can be constructed simply by processing the main body component 86.

[0089] (8) The characteristic configuration of the resin molding apparatus 100 is that it comprises a mold C as described in any one of (1) to (7) above, and a mold clamping mechanism 35 for clamping the mold C.

[0090] With the resin molding apparatus 100 relating to this characteristic configuration, a resin molded product (resin-molded substrate Sb) can be manufactured using the mold C described in any one of (1) to (7) above.

[0091] (9) The characteristic of the method for manufacturing a resin molded product (resin-molded substrate Sb) using the resin molding apparatus 100 described in (8) above is that it includes a supply step of supplying the object to be molded (substrate Sa before resin molding) and resin material (resin tablet T) to the mold C, a mold clamping step of clamping the mold C with the mold clamping mechanism 35, and a molding step of performing resin molding of the object to be molded (substrate Sa before resin molding) by flowing molten resin material (molten resin Ta) from the pot 54b through the gate 84 into the cavity MC.

[0092] In the method for manufacturing a resin molded product (resin-molded substrate Sb) having these features, in the supply step, the object to be molded (substrate Sa before resin molding) and resin material (resin tablet T) are supplied to the mold C, and in the clamping step, the mold C is clamped by the clamping mechanism 35 while the resin material (resin tablet T) is heated. Then, in the molding step, the resin material (molten resin Ta) is flowed from the pot 54b through the gate 84 into the cavity MC to perform resin molding of the object to be molded (substrate Sa before resin molding), thereby manufacturing a resin molded product (resin-molded substrate Sb) using the mold C. [Industrial applicability]

[0093] This invention can be used in molds, resin molding apparatus, and methods for manufacturing resin molded products. [Explanation of Symbols]

[0094] 35: Clamping mechanism 54: Pot Block 54b: Pot 81: 1st page 81a: Main body molding surface (first surface) 81b: Outer frame molding surface (first surface) 82: 2nd side 82a: Main body non-molding surface (second surface) 82b: Unmolded outer frame surface (second surface) 83: Runner 84: Gate 85: Through hole 86: Main body components 86a: Main body groove (groove) 87: Outer frame component 87a: Opening 87b: Outer frame groove (groove) 87f: 1st inner surface (inner surface) 87g: 2nd inner surface (inner surface) 87h: 3rd inner surface (inner surface) 87j: Taper 87k: Hex socket head cap screw (set screw) 87l: Headed bolt (bolt) 87o: Counterbore (recess) 87p:Head 88: Holding mechanism 88a: First retaining member (retaining member) 88b: Second retaining member (retaining member) 100: Resin molding equipment C: Molding mold IM: intermediate type LM: Lower mold M:Mold body MC: Cavity Sa: Pre-molded substrate (object to be molded) Sb: Resin-molded substrate (resin molded product) T: Resin tablet (resin material) Ta: Molten resin (resin material) UM: Upper mold

Claims

1. The mold body comprises a cavity that holds the object to be molded and through which resin material is supplied, The aforementioned mold body is Upper mold and, A lower mold including a pot block in which a pot filled with the aforementioned resin material is formed, It comprises an intermediate mold positioned between the upper mold and the lower mold, having a first surface facing the object to be molded, The intermediate mold comprises a main body member having a gate for supplying the resin material to the cavity, an outer frame member disposed around the periphery of the main body member, and a holding mechanism for holding the main body member to the outer frame member. The main body member and the outer frame member are separable. The holding mechanism includes a holding member fixed to the outer frame member for holding the main body member, and a groove formed extending from the outer frame member to the main body member for accommodating the holding member.

2. The molding die according to claim 1, wherein the groove portion comprises an outer frame groove portion formed on the surface of the outer frame member and a main body groove portion formed on the surface of the main body member.

3. The molding die according to claim 2, wherein the retaining member has a fixing portion and a retaining portion extending from the fixing portion, and the retaining portion is housed in the groove portion of the main body.

4. The molding die according to claim 2, wherein the depth of the main body groove of the main body member from the first surface is greater than the depth of the outer frame groove of the outer frame member from the first surface, and the depth of the main body groove of the main body member from the second surface opposite to the first surface is greater than the depth of the outer frame groove of the outer frame member from the second surface.

5. The molding die according to claim 1, wherein the main body member is movable in the vertical direction relative to the holding member fixed to the outer frame member.

6. The retaining member is fixed to the outer frame member by bolts. The molding die according to claim 1, wherein the head of the bolt is housed in a recess formed on the second surface of the outer frame member opposite to the first surface.

7. The outer frame member has a rectangular opening into which the main body member is attached, and a through hole connected to the pot. The molding die according to any one of claims 1 to 6, wherein a taper is formed on at least one of the three inner surfaces of the four inner surfaces constituting the opening, excluding the one inner surface adjacent to the through hole.

8. The molding die according to claim 7, wherein the main body member is pressed against one of the inner surfaces of the outer frame member adjacent to the through hole in the opening by a set screw.

9. The mold according to claim 1, wherein the main body member has the cavity on the first surface and a runner on the second surface opposite to the first surface.

10. The mold described in claim 1, A resin molding apparatus comprising a mold clamping mechanism for clamping the aforementioned molding die.

11. A method for manufacturing a resin molded product using the resin molding apparatus described in claim 10, A supply step of supplying the object to be molded and the resin material to the molded die, A mold clamping step in which the mold is clamped by the mold clamping mechanism, A method for manufacturing a resin molded product, comprising a molding step of performing resin molding of an object to be molded by flowing the molten resin material from the pot through the gate into the cavity.

12. An outer frame member constituting an intermediate mold incorporated into a mold body used for resin molding of an object to be molded, An opening into which a main body component with a cavity formed therein can be attached, It comprises a through hole leading to a pot filled with resin material, The main body member is an outer frame member that is detachably held by a holding mechanism.

13. The outer frame member has an outer frame groove for holding the main body member in the outer frame member, The outer frame member according to claim 12, wherein the outer frame groove is formed on the inner circumferential surface of the opening and at a position continuous with the main body groove formed on the outer circumferential surface of the main body member.

14. The outer frame groove is provided with through holes into which bolts are inserted for fixing a retaining member for holding the main body member to the outer frame member, The outer frame member according to claim 13, having a recess for accommodating the head of the bolt, formed on a second surface opposite to the first surface facing the object to be molded.

15. The outer frame member according to claim 12, wherein the opening is rectangular in shape, and at least one of the three inner surfaces constituting the opening, excluding the one inner surface adjacent to the through hole, has a taper formed on it.

16. The outer frame member according to claim 15, wherein the main body member can be pressed against one of the inner surfaces of the opening adjacent to the through hole by a set screw.

17. comprising two short frames, two long frames, and a central frame, The opening is formed in two rectangular shapes by dividing the outer frame, which is rectangular in plan view, by connecting the two short frames and the two long frames, with the central frame spanning between the two short frames. The outer frame member according to claim 12, wherein the main body member can be attached to each of the two openings.

18. comprising two short frames, two long frames, and a central frame, The opening is formed in two rectangular shapes by dividing the outer frame, which is rectangular in plan view, by connecting the two short frames and the two long frames, with the central frame spanning between the two short frames. The main body member can be attached to each of the two openings, The outer frame member according to claim 13, wherein the outer frame grooves are formed in the two short frames, the two long frames, and the central frame, respectively.

19. The central frame has a through hole formed therein that connects to the pot, The outer frame member according to claim 17 or 18, wherein a taper is formed on at least one of the inner surfaces of the two short frames and the two long frames that constitute the opening.

20. A main body member that constitutes an intermediate mold incorporated into a mold body used for resin molding of an object to be molded, Cavity and, A gate for supplying resin material to the cavity, The outer frame member has a through hole that connects to a pot, and a groove formed extending from the outer frame member to the main body member accommodates a retaining member for holding the outer frame member in the opening of the outer frame member, A main body member is detachably held by the outer frame member.

21. The main body member according to claim 20, wherein the groove is formed on the outer circumferential surface of the main body member and at a position continuous with the outer frame groove formed on the inner circumferential surface of the opening of the outer frame member.

22. The main body member according to claim 20, having a stepped portion that contacts the outer frame member when attached to the outer frame member.

23. An intermediate mold disposed between an upper mold and a lower mold which includes a pot block in which a pot filled with the resin material is formed, comprising an upper mold which constitutes a mold body having a cavity for holding an object to be molded and for supplying resin material, The device comprises a main body member having a gate for supplying the resin material to the cavity, an outer frame member disposed on the periphery of the main body member, a first surface extending from the main body member to the outer frame member and facing the object to be molded, and a holding mechanism for holding the main body member to the outer frame member. An intermediate type in which the main body member and the outer frame member are separable.

24. The intermediate type according to claim 23, wherein the holding mechanism includes a holding member fixed to the outer frame member and holding the main body member, and a groove formed extending from the outer frame member to the main body member and accommodating the holding member.

25. The groove portion includes a main body groove portion formed on the surface of the main body member, There is a gap between the main body groove and the retaining member. The intermediate type according to claim 24, wherein the main body member is movable vertically by the length of the gap with respect to the holding member fixed to the outer frame member.

26. The retaining member is fixed to the outer frame member by bolts, The intermediate type according to claim 24, wherein the head of the bolt is housed in a recess formed on the second surface of the outer frame member opposite to the first surface.

27. ​​The outer frame member has a rectangular opening into which the main body member is attached, and a through hole connected to the pot, The intermediate type according to any one of claims 23 to 26, wherein a taper is formed on at least one of the three inner surfaces of the four inner surfaces constituting the opening, excluding the one inner surface adjacent to the through hole.

28. The intermediate type according to claim 27, wherein the main body member is pressed against one of the inner surfaces of the outer frame member adjacent to the through hole in the opening by a set screw.

29. The intermediate type according to claim 23, wherein the main body member has the cavity on the first surface and a runner on the second surface opposite to the first surface.

Images