Resin encapsulation apparatus and resin encapsulation method

Abstract

To provide a resin sealing device and a resin sealing method which can shorten the conveyance time of a workpiece.SOLUTION: A resin sealing device 1 for resin-sealing an electronic component of a workpiece including a base material and the electronic component comprises: a resin sealing mold 21 which molds a resin material with respect to a workpiece W and resin-seals the electronic component; conveyance lines 60R, 70R which convey the workpiece to the resin sealing mold; a workpiece storage part 11 which can store at least one workpiece; a workpiece support part which is provided between the workpiece storage part and the conveyance lines and supports the workpiece; a pickup device 14 which holds the workpiece supplied onto the workpiece support part from the workpiece storage part to convey it to the conveyance lines; and a measurement part which is provided in at least one of the workpiece storage part, the workpiece support part and the pickup device and measures the weight of the workpiece.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a resin encapsulation device and a resin encapsulation method.

Background Art

[0002] As an example of a resin encapsulation device that melts resin with respect to a work including a base material and an electronic component to encapsulate the electronic component with resin, a resin encapsulation device that forms resin with respect to a work is known. When encapsulating an electronic component with resin, by calculating and supplying the resin amount in units of work, it is possible to perform uniform resin encapsulation without waste in the encapsulating resin.

[0003] Patent Document 1 discloses a technique for calculating the discharge amount of resin for a work based on appearance information for each work in advance, discharging resin onto the work, and performing resin encapsulation. Specifically, defect information of a work supplied on a support rail is acquired by a camera, and based on this, the target discharge resin weight of the resin to be discharged onto the work is calculated, and the resin is discharged onto the work by a dispenser. Further, the discharge resin weight is calculated from the difference in weight measured before and after discharging the resin, and information obtained by comparing the target discharge resin weight and the discharge resin weight is used for correction of the resin discharge for the next work.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

[0006] This invention has been made in view of these circumstances, and the object of this invention is to provide a resin sealing technology that can shorten the workpiece transport time. [Means for solving the problem]

[0007] A resin encapsulation apparatus according to one aspect of the present invention is a resin encapsulation apparatus for resin encapsulating electronic components of a workpiece including a substrate and electronic components, comprising: a resin encapsulation mold for molding a resin material onto a workpiece to resin encapsulate the electronic components; a transport line for transporting a workpiece to the resin encapsulation mold; a workpiece storage section capable of accommodating at least one workpiece; a workpiece support section provided between the workpiece storage section and the transport line for supporting a workpiece; a pickup device for holding a workpiece supplied from the workpiece storage section onto the workpiece support section and transporting it to the transport line; and a measuring section provided in at least one of the workpiece storage section, the workpiece support section, and the pickup device for measuring the weight of the workpiece.

[0008] According to this embodiment, by providing the measuring unit in at least one of the workpiece storage unit, workpiece support unit, and pickup device, the weight of the workpiece can be measured from the time the workpiece is supplied until it is transported to the transport line. As a result, since the weight of the workpiece can be measured in the process from the time the workpiece is supplied until it is transported to the transport line, there is no need to provide a separate process for measuring the weight of the workpiece, and thus the workpiece transport time can be shortened. For example, if some of the multiple chips mounted on the workpiece are partially damaged, there is no need to provide a separate process for accurately measuring and changing the amount of resin material supplied to the workpiece based on the extent of the damage. Instead, the weight of the workpiece can be measured and the resin material supplied to the workpiece W based on this, thereby shortening the workpiece transport time.

[0009] In the above embodiment, a measuring unit is provided in the workpiece storage unit, and a resin quantity calculation unit is further provided that calculates the amount of resin material to be supplied to the workpiece on a per-workpiece basis based on the weight of the workpiece obtained by the measuring unit.

[0010] In the above embodiment, a measuring unit is provided in the workpiece storage unit, and the measuring unit measures the weight of the workpiece based on the difference in weight of the workpiece storage unit before and after the workpiece is removed from the workpiece storage unit.

[0011] In the above embodiment, a measuring unit is provided in the work support unit, and the measuring unit measures the weight of the work support unit.

[0012] In the above embodiment, the work support portion includes a receiving plate portion that receives the workpiece, and a rail portion that surrounds the receiving plate portion and has an upper surface that supports the workpiece at a position higher than the upper surface of the receiving plate portion. As the pickup device moves relative to the work support portion and comes into contact with the rail portion, the support surface of the workpiece changes from the upper surface of the rail portion to the upper surface of the receiving plate portion, and the measuring unit measures the weight of the workpiece supported on the upper surface of the receiving plate portion.

[0013] In the above embodiment, the pickup device is provided with a measuring unit, which measures the weight of the workpiece held by the pickup device.

[0014] In the above embodiment, a resin sealing apparatus for resin sealing electronic components of a workpiece including a substrate and electronic components comprises: a resin sealing mold for molding a resin material onto a workpiece to resin seal the electronic components; a workpiece storage section capable of accommodating at least one workpiece; a transport line for transporting workpieces supplied from the workpiece storage section to the resin sealing mold; and a measuring section provided in the workpiece storage section for measuring the weight of the workpiece.

[0015] According to this embodiment, by providing the measuring unit in the workpiece storage unit, there is no need to provide a separate process for measuring the weight of the workpiece between the time the workpiece is supplied and when it is transported to the transport line, thus shortening the workpiece transport time. Furthermore, since the weight of the workpiece is measured in the process of supplying the workpiece, it is possible to prepare the resin material to be supplied to the workpiece in parallel with the process of transporting the workpiece to the transport line, thus shortening the time required to resin-encapsulate the electronic components on the workpiece.

[0016] In the above embodiment, the system further includes a first loader that moves along a transport line to transport a workpiece to a resin encapsulation mold, and a second loader that transports resin material to the resin encapsulation mold.

[0017] A resin encapsulation method according to one aspect of the present invention is a resin encapsulation method for resin encapsulating electronic components of a workpiece including a substrate and electronic components, comprising: (a) a step of supplying a workpiece from a workpiece storage section capable of accommodating at least one workpiece onto a workpiece support section; (b) a step of transporting the workpiece supplied from the workpiece storage section onto the workpiece support section to a transport line using a pickup device; (c) a step of transporting the workpiece to a resin encapsulation mold via the transport line; and (d) a step of resin encapsulating electronic components by molding a resin material onto the workpiece in the resin encapsulation mold, wherein (a) or (b) includes a step of calculating the weight of the workpiece using a measuring section provided in at least one of the workpiece storage section, the workpiece support section, or the pickup device.

[0018] According to this aspect, a method for shortening the conveyance time of the work can be provided.

Brief Description of the Drawings

[0019] [Figure 1] It is a plan view of a resin sealing device according to an embodiment of the present invention. [Figure 2A] It is a figure which shows an example of the cross section of the workpiece accommodation part 11 before the workpiece W is taken out from the workpiece magazine WM of the resin sealing device 1 which concerns on 1st Embodiment. [Figure 2B] It is a figure which shows an example of the cross section of the workpiece accommodation part 11 after the workpiece W is taken out from the workpiece magazine WM of the resin sealing device 1 which concerns on 1st Embodiment. [Figure 3] It is a flowchart which shows the resin sealing method in the resin sealing device which concerns on 1st Embodiment [Figure 4A] It is a figure which shows an example of the cross section of the workpiece delivery part 13 before the pickup device 14 of the resin sealing device 1 which concerns on 2nd Embodiment acquires the workpiece W on the workpiece support part WS. [Figure 4B] It is a figure which shows an example of the cross section of the workpiece delivery part 13 when the pickup device 14 of the resin sealing device 1 which concerns on 2nd Embodiment acquires the workpiece W on the workpiece support part WS. [Figure 4C] It is a figure which shows an example of the cross section of the workpiece delivery part 13 which the pickup device 14 of the resin sealing device 1 which concerns on 2nd Embodiment acquired and holds the workpiece W from the workpiece support part WS. [Figure 5A] It is a figure which shows an example of the cross section of the workpiece delivery part 13 before the pickup device 14 of the resin sealing device 1 which concerns on 3rd Embodiment acquires the workpiece W on the workpiece support part WS. [Figure 5B] It is a figure which shows an example of the cross section of the workpiece delivery part 13 when the pickup device 14 of the resin sealing device 1 which concerns on 3rd Embodiment acquires the workpiece W on the workpiece support part WS. [Figure 5C]It is a figure which shows an example of the cross section of the work delivery part 13 which the pickup device 14 of the resin sealing device 1 which concerns on a 3rd Embodiment has acquired and holds | maintains the work W from the work support part WS.

Mode for carrying out the invention

[0020] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The drawings of each embodiment are illustrative, and the dimensions and shapes of each part are schematic, and the technical scope of the present invention should not be construed as being limited to the embodiment.

[0021] <First Embodiment> The configuration of the resin sealing device 1 according to an embodiment of the present invention will be described with reference to FIGS. 1, 2A, and 2B. FIG. 1 is a plan view of a resin sealing device according to an embodiment of the present invention. FIGS. 2A and 2B are diagrams showing an example of a configuration for measuring the weight of the work W in the resin sealing device 1 according to the first embodiment. FIG. 2A is a diagram showing an example of a cross section of the work storage part 11 before the work W is taken out from the work magazine WM of the resin sealing device 1 according to the first embodiment. FIG. 2B is a diagram showing an example of a cross section of the work storage part 11 after the work W is taken out from the work magazine WM of the resin sealing device 1 according to the first embodiment. In the first embodiment, the measurement unit MP1 is provided in the work storage part 11. In each drawing, for the sake of clarifying the relationship between the respective drawings and helping to understand the positional relationship of each member, the directions of front, back, left, right, up, and down are arbitrarily attached.

[0022] The resin encapsulation apparatus 1 is an apparatus for manufacturing a molded product M by molding a resin material R onto a workpiece W. The workpiece W includes a base material and electronic components. The molded product M is a workpiece W in which the electronic components have been resin-encapsulated by the resin material R. Workpiece W corresponds to an example of a "workpiece before resin encapsulation," and molded product M corresponds to an example of a "workpiece after resin encapsulation." The base material is, for example, an interposer substrate, but is not limited thereto, and may be a lead frame, a carrier plate with an adhesive sheet, or a semiconductor substrate, etc. The electronic components are, for example, semiconductor elements such as IC chips, but are not limited thereto, and may be various active elements, passive elements, or MEMS devices, etc. The resin material R is, for example, a granular thermosetting resin, but is not limited thereto, and may be in powder, liquid, tablet, or sheet form, etc. In this embodiment, as an example, the resin material R is molded onto a workpiece W and a functional member H. The functional member H is, for example, a plate-shaped member. The functional member H may be, for example, a heat dissipation member that releases heat generated by electronic components or a shielding member that shields against electromagnetic waves. In that case, for example, the functional member H is provided so as to be exposed on the side opposite to the side where the base material of the molded product M is exposed. Alternatively, the functional member H may be a sheet-like resin member.

[0023] The resin encapsulation apparatus 1 according to this embodiment is a compression-type resin encapsulation apparatus (compression molding apparatus). As shown in Figure 1, the resin encapsulation apparatus 1 includes a work supply unit 10, resin molding units 20 and 30, a resin supply unit 40, a functional member supply unit 50, a molded product recovery unit 90, a first loader 60, and a second loader 70. The first loader 60 is movable along the first transport line 60R. The second loader 70 is also movable along the second transport line 70R.

[0024] The planar layout of the resin encapsulation apparatus 1 is not particularly limited, but in the example shown in Figure 1, the work supply unit 10, resin molding unit 20, resin supply unit 40, resin molding unit 30, and molded product recovery unit 90 are arranged in this order along the first transport line 60R from left to right in Figure 1. Also, with respect to the first transport line 60R, the resin supply unit 41 is located at the rear and the functional component supply unit 50 is located at the front. The functional component supply unit 50 and the resin supply unit 40 are arranged in this order along the second transport line 70R from front to back in Figure 1. Also, with respect to the second transport line 70R, the work supply unit 10 and resin molding unit 20 are located on the left side and the resin molding unit 30 and molded product recovery unit 90 are located on the right side.

[0025] The work supply unit 10 supplies workpieces W before resin encapsulation. The work supply unit 10 comprises a workpiece storage section 11, a workpiece transfer section 13, a workpiece preheating section 15, and a work supply control panel 19. In the example planar layout shown in Figure 1, the workpiece storage section 11 and the workpiece transfer section 13 are located in front of the first transport line 60R, and the workpiece transfer section 13 is located between the workpiece storage section 11 and the first transport line 60R in the front-rear direction. The workpiece preheating section 15 is located on the first transport line 60R. The work supply control panel 19 is located in front of the work supply unit 10.

[0026] The workpiece storage section 11 is a supply storage section for supplying at least one workpiece W before resin sealing in the workpiece supply unit 10. The workpiece storage section 11 stores at least one workpiece W and dispenses the workpiece W. In the first embodiment, the workpiece storage section 11 may include a workpiece magazine WM, a magazine guide MG, a measuring unit MP1, and a lifting mechanism EM.

[0027] In the first embodiment, the measuring unit MP1 provided in the workpiece storage unit 11 measures the weight of the workpiece W based on the difference in weight of the workpiece magazine WM before and after the workpiece W is removed from the workpiece magazine WM. Specifically, the measuring unit MP1 calculates the weight of the removed workpiece W from the difference between the weight of the workpiece magazine WM and magazine guide MG before the workpiece W is removed in Figure 2A and the weight of the workpiece magazine WM and magazine guide MG after the workpiece W is removed in Figure 2B.

[0028] The work magazine WM accommodates at least one workpiece W. As shown in Figures 2A and 2B, for example, the work magazine WM may have slits corresponding to each of multiple workpieces W, and the multiple workpieces W may be stored so that they overlap with a gap between them. The work magazine WM has a maximum capacity of 8 workpieces W, but the slit shape and maximum capacity of the work magazine WM may be appropriately selected depending on the type of workpiece W. Furthermore, the position of the work magazine WM is adjusted by the lifting and lowering operation of the lifting mechanism EM, so that the workpiece W at the removal position ep can be removed from among the multiple workpieces W stored in the work magazine WM.

[0029] The magazine guide MG may hold the work magazine WM so that it does not tilt. As shown in Figures 2A and 2B, for example, the magazine guide MG may be configured to move vertically up and down while holding the work magazine WM so that it does not tilt, along a plurality of guide rails (not shown) provided parallel to the lifting mechanism EM described later. In this case, the space between the magazine guide MG and the plurality of guide rails (not shown) is smooth and frictional resistance is low, and the total weight of the work magazine WM containing multiple workpieces W and the magazine guide MG is transmitted to the measuring unit MP1.

[0030] The measuring unit MP1 measures the weight of the workpiece W. As shown in Figures 2A and 2B, for example, the measuring unit MP1 may support the workpiece magazine WM via the magazine guide MG on the lifting mechanism EM. In the measuring unit MP1 shown in Figure 2A, the total weight tw1 of the workpiece magazine WM containing eight workpieces W and the magazine guide MG is measured. In the measuring unit MP1 shown in Figure 2B, the total weight tw2 of the workpiece magazine WM containing seven workpieces W and the magazine guide MG is measured. That is, from Figures 2A and 2B, the measuring unit MP1 can calculate the weight of the workpiece W based on the difference in the measured total weight (total weight tw1 - total weight tw2) before and after the workpieces W are removed from the workpiece magazine WM. In addition, the measuring unit MP1 may perform a correction based on the weight when the magazine guide MG is mounted on the measuring unit MP1 in order to measure the weight of the workpiece magazine WM containing the workpieces W.

[0031] The lifting mechanism EM adjusts the position of the work magazine WM. As shown in Figures 2A and 2B, for example, after a workpiece W is removed from the work magazine WM at the removal position ep, the position of the work magazine WM may be adjusted in conjunction with the lifting operation of the lifting mechanism EM to position another workpiece W at the removal position ep. The lifting mechanism EM may include a motor em1 as a drive source, a screw shaft em2 rotatably connected integrally with the motor em1, a nut em3 that screws onto the screw shaft em2 so as to move up and down in conjunction with its rotation, and a lifting platform em4 rotatably connected integrally with the nut em3. The linear motion mechanism composed of the screw shaft em2 and the nut em3 may be, for example, a sliding screw mechanism or a ball screw mechanism.

[0032] The workpiece transfer unit 13 transfers the workpiece W received from the workpiece storage unit 11 to the first loader 60, which will be described later. For example, the workpiece transfer unit 13 includes a workpiece support unit WS and a pickup device 14.

[0033] The workpiece preheating unit 15 preheats the workpiece W received from the workpiece transfer unit 13. Preheating the workpiece W before it is transported to the resin molding units 20 and 30 suppresses deformation of the workpiece W due to rapid temperature changes. The workpiece preheating unit 15 is equipped with a preheating heater that heats the workpiece W placed on the first loader 60. The preheating heater is, for example, a hot air heater or an infrared heater. The preheating heater is positioned, for example, to heat the workpiece W from above. The preheating heater is not limited to the above, and the workpiece W may be heated from the front-to-back direction or from the left-to-right direction. From the viewpoint of suppressing the impact of the preheating heater on the surrounding environment and reducing heat loss, the workpiece preheating unit 15 may be equipped with a cover that surrounds the preheating heater. Note that the workpiece W may not be preheated if the workpiece preheating unit 15 is not provided. In this case, the time from when the workpiece W is transported to the resin molding units 20 and 30 until the start of loading the resin material R and functional member H into the resin molding units 20 and 30 or the start of mold closing may be controlled.

[0034] The work supply control panel 19 controls the operation of the work supply unit 10. For example, the work supply control panel 19 includes a display unit that displays the control parameters of the work supply unit 10 and an input unit that inputs the control parameters of the work supply unit 10. Alternatively, for example, the work supply control panel 19 may integrate display units that display the control parameters of the molded product recovery unit 90, resin supply unit 40, functional component supply unit 50, first loader 60, and second loader 70, as described later, and input units that input these control parameters.

[0035] The work supply unit 10 may further include an appearance inspection unit for inspecting the appearance of the workpiece W.

[0036] The molded product recovery unit 90 recovers the molded product M corresponding to the workpiece W after resin encapsulation. The molded product recovery unit 90 includes a molded product heat removal unit 91, a molded product transfer unit 92, and a molded product storage unit 93. In the example of the planar layout shown in Figure 1, the molded product transfer unit 92 and the molded product storage unit 93 are located in front of the first loader 60, and the molded product transfer unit 92 is located between the molded product storage unit 93 and the first loader 60 in the front-rear direction. The molded product heat removal unit 91 is located overlapping the first loader 60.

[0037] The molded product heat removal unit 91 removes heat from the molded product M that is to be handed over to the molded product transfer unit 92. The molded product heat removal unit 91 is equipped with a heat removal cooler that cools the molded product M placed on the mounting surface of the stage. The heat removal cooler is, for example, an air-cooled cooling device or a Peltier-type cooling device. The heat removal cooler is arranged, for example, to cool the molded product M from above. The heat removal cooler is not limited to the above, and the molded product M may be cooled from the front-to-back direction or from the left-to-right direction. Note that the molded product M may be cooled by natural cooling without the molded product heat removal unit 91, and the molded product M may not be heat removed at all.

[0038] The molded product transfer unit 92 transfers the molded product M received from the molded product heat removal unit 91 to the molded product storage unit 93. For example, the molded product transfer unit 92 includes a pickup device (not shown) and a feed-out unit. The pickup device acquires the molded product M from the mounting surface of the first loader 60, moves forward while holding the molded product M, and places the molded product M on the feed-out unit. The feed-out unit aligns the molded product M received from the pickup device and sends it to the molded product storage unit 93.

[0039] The molded product storage section 93 is a recovery storage section for recovering the workpiece W after resin sealing in the molded product recovery unit 90, and is an example of a "workpiece storage section". For example, the molded product storage section 93 includes a molded product magazine MM and a molded product elevation. At least one molded product M is stored in each molded product magazine so as to overlap. The molded product elevation adjusts the position of the molded product magazine MM.

[0040] The molded product recovery unit 90 may further include a volume measuring unit for measuring the volume of the molded product M, and an appearance inspection unit for inspecting the appearance of the molded product M.

[0041] The resin molding unit 20 molds resin material R onto the workpiece W and functional member H. The resin molding unit 20 comprises a resin encapsulation mold 21, a film handler 27, and a resin molding control panel 29. In the example planar layout shown in Figure 1, the resin encapsulation mold 21 is positioned in front of the first transport line 60R, and the film handlers 27 are positioned to the left and right of the resin encapsulation mold 21. The resin molding control panel 29 is positioned in front of the resin molding unit 20.

[0042] The resin encapsulation mold 21 comprises a pair of openable and closable lower and upper molds that seal electronic components by heating and curing a resin material R in the cavity 25 inside. The resin encapsulation mold 21 is, as an example, a compression molding mold with a so-called movable upper cavity structure. Specifically, the lower mold has a flat surface on the side facing the upper mold on which the workpiece W is placed, and the upper mold has a concave surface on the side facing the lower mold that forms the cavity 25. The resin encapsulation mold 21 may also be a compression molding mold with a movable lower cavity structure.

[0043] The film handler 27 supplies film to the resin encapsulation mold 21. The film is a release film that prevents the resin material R from entering the gaps in the cavity 25 and facilitates the peeling of the molded product M from the cavity 25. The film handler 27 handles, for example, roll-shaped film and includes an unwinding section for supplying unused film and a winding section for collecting used film. As the film material, polymer materials with excellent heat resistance, ease of peeling, flexibility, and extensibility can be used, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene-ethylene copolymer), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), PET (polyethylene terephthalate), PP (polypropylene), and PVDC (polyvinylidine chloride). The thickness of the film is suitably selected according to the physical properties of the material, and is approximately 50 μm as an example. The shape of the film is not limited to roll shape, but may also be in strip shape.

[0044] The resin molding control panel 29 controls the operation of the resin molding unit 20. For example, the resin molding control panel 29 includes a display unit that displays the control parameters of the resin molding unit 20 and an input unit that inputs the control parameters of the resin molding unit 20.

[0045] The resin molding unit 30 comprises a resin encapsulation mold 31 with a cavity 35, a film handler 37, and a resin molding control panel 39. Details of the resin encapsulation mold 31, film handler 37, and resin molding control panel 39 will be omitted in the following description, but configurations similar to those described for the resin molding unit 20 can be applied.

[0046] Furthermore, at least some of the functions of the resin molding control panels 29 and 39 may be integrated into the work supply control panel 19. For example, the control parameters of the resin molding units 20 and 30 may be displayed on the display unit of the work supply control panel 19, or the control parameters of the resin molding units 20 and 30 may be input into the input unit of the work supply control panel 19. If all the functions of the control panels of each unit are integrated into the work supply control panel 19, the resin molding control panels 29 and 39 may be omitted.

[0047] The resin supply unit 40 supplies the resin material R. The resin supply unit 40 includes a resin supply section 41. In the example of the planar layout shown in Figure 1, the resin supply section 41 is located behind the first transport line 60R.

[0048] The resin supply unit 41 supplies resin material R to the resin loader 71 based on the weight of the workpiece W obtained by the measurement unit MP1. The resin supply unit 41 is equipped with a resin quantity calculation unit that calculates the amount of resin material R to be supplied to the resin loader 71 based on the weight of the workpiece W obtained by the measurement unit MP1. The resin supply unit 41 includes, for example, a hopper, a feeder, and a flow rate control valve. The hopper stores the resin material R, and the feeder delivers the resin material R from the hopper to the resin loader 71. If the resin is liquid, the resin supply unit 41 may also include a syringe for storing the resin, a piston for pushing out the resin, a servo motor for driving the piston, and a pinch valve for opening and closing the tip of the syringe.

[0049] The resin supply unit 40 may further include a weight measuring unit for measuring the weight of the resin material R, a resin preheating unit for preheating the resin material R, a resin guard used as a frame surrounding the resin material R, a vibration unit for dispersing the resin material R by vibration, and an inspection unit for inspecting the degree of dispersion of the resin material R.

[0050] The functional component supply unit 50 supplies the functional component H. The functional component supply unit 50 comprises a functional component storage section 51 and a functional component transfer section 53. In the example of the planar layout shown in Figure 1, the functional component transfer section 53 is located behind the functional component storage section 51.

[0051] The functional component storage unit 51 supplies functional components to the resin loader 71. The functional component storage unit 51 stores multiple functional components H and sequentially feeds out the functional components H. For example, the functional component storage unit 51 comprises multiple functional component magazines and a functional component elevation. Multiple functional components are stored in each of the multiple functional component magazines so that they overlap. The functional component elevation adjusts the position of the multiple functional component magazines.

[0052] The functional component transfer unit 53 transfers the functional component H received from the functional component storage unit 51 to the resin loader 71. For example, the functional component transfer unit 53 includes a functional component index unit and a functional component pickup device. The functional component index unit receives the functional component H sent out by the functional component storage unit 51 and aligns them. The functional component pickup device is configured to be movable in the front-rear direction and transports the workpiece W between the functional component storage unit 51 and the resin loader 71. The functional component pickup device acquires the functional component from the functional component index unit, moves backward while holding the functional component, and places the functional component on the resin loader 71.

[0053] The functional component supply unit 50 may further include a volume measuring unit for measuring the volume of the functional component H, an appearance inspection unit for inspecting the appearance of the functional component H, and a functional component preheating unit for preheating the functional component H. The functional component supply unit 50 may be omitted, in which case the resin supply unit 40 may include the functions of the functional component supply unit 50 described above.

[0054] The first loader 60 transports the workpiece W or molded product M between units. The first loader 60 transports the workpiece W while moving left to right along the first transport line 60R as its movement path. The first loader 60 may also be equipped with a loader hand. For example, when the first loader 60 has moved along the first transport line 60R to the position of the resin encapsulation mold 21, the loader hand transports the workpiece W in the front-rear direction to the resin encapsulation mold 21. Specifically, the loader hand moves forward from the first loader 60 on the first transport line 60R while holding the workpiece W, loads the workpiece W into the resin encapsulation mold 21, delivers the workpiece W to the resin encapsulation mold 21, moves backward, and exits the resin encapsulation mold 21. Furthermore, the loader hand enters the resin encapsulation mold 31 from the rear, retrieves the molded product M from the resin encapsulation mold 31, and moves backward while holding the molded product M to unload the molded product M from the resin encapsulation mold 31 to the first loader 60 on the first transport line 60R. The first loader 60 may move along a path different from the first transport line 60R. Alternatively, the first loader 60 may be fixed in a fixed position on the first transport line 60R.

[0055] The second loader 70 transports the resin material R between the resin supply unit 40 and the functional component supply unit 50. The second loader 70 transports the resin material R while moving in the forward and backward direction along the second transport line 70R, with the resin loader 71 as its movement path.

[0056] The resin loader 71 is configured to be movable between the resin supply unit 40 and the functional component supply unit 50. The resin loader 71 transports the resin material R from the resin supply unit 40 to the resin molding unit 20 or the resin molding unit 30. The resin loader 71 also transports the functional component H from the functional component supply unit 50 to the resin molding unit 20 or the resin molding unit 30. Although not shown in the figures, the resin loader 71 includes a holding mechanism for holding the resin material R and the functional component H, a pivoting mechanism for rotating between positions P1, P2, and P3, and a reciprocating mechanism for moving forward and backward relative to the pivoting starting point.

[0057] The second transport line 70R moves the resin loader 71 in the front-to-back direction. The second transport line 70R extends in the front-to-back direction across the resin supply unit 40 and the functional component supply unit 50. The second transport line 70R corresponds to the movement path of the resin loader 71.

[0058] In the example of the planar layout shown in Figure 1, the resin loader 71 receives the resin material R from the resin supply unit 41 and then moves to a position P1 in front of the first transport line 60R via the second transport line 70R. Next, the resin loader 71 moves to a position P2 behind the functional member transfer unit 53 via a swivel mechanism. Next, the resin loader 71 moves to the functional member transfer unit 53 via a reciprocating mechanism, receives the functional member H, and then moves back to position P2 via the reciprocating mechanism. Next, the resin loader 71 moves to a position P3 to the right of the resin encapsulation mold 21 via a swivel mechanism. Next, the resin loader 71 enters the resin encapsulation mold 21 via a reciprocating mechanism and delivers the resin material R and functional member H into the resin encapsulation mold 21. After delivering the resin material R and functional member H to the resin encapsulation mold 21, the resin loader 71 exits the resin encapsulation mold 21 via a reciprocating mechanism and moves back to position P3.

[0059] The second loader 70 operates with respect to the resin encapsulation mold 31 of the resin molding unit 30 in the same way as it operates with respect to the resin encapsulation mold 21 of the resin molding unit 20. Therefore, the description of the operation of the first loader 60 and the second loader 70 with respect to the resin encapsulation mold 31 is omitted. However, the operation of the second loader 70 with respect to the resin encapsulation mold 31 is the reverse of the operation of the second loader 70 with respect to the resin encapsulation mold 21.

[0060] Figure 3 is a flowchart showing a resin sealing method in a resin sealing apparatus according to the first embodiment. As shown in Figure 3, the resin sealing method of the first embodiment includes a step S1 for supplying a workpiece, a step S2 for picking and placing a workpiece, a step S3 for transporting a workpiece, a step S4 for transporting a resin material, and a step S5 for resin sealing. The resin sealing method of the first embodiment will be described below with reference to Figures 1, 2, and 3.

[0061] (Process S1: Supply the workpiece) In process S1, the workpiece storage unit 11 takes the workpiece W out of the workpiece magazine WM and supplies it onto the workpiece support unit WS of the workpiece transfer unit 13. The workpiece storage unit 11 is equipped with a measuring unit MP1, and as described above, the weight of the workpiece W is measured.

[0062] (Process S2: Pick and place the workpiece) In process S2, in the workpiece transfer section 13, the pickup device 14 acquires the workpiece W from the workpiece support section WS, moves backward while holding the workpiece W, and places the workpiece W on the first loader 60.

[0063] (Process S3: Workpiece transport) In process S3, the first loader 60 on which the workpiece W is placed moves left and right along the first transport line 60R to transport the workpiece W to the position of the resin sealing mold 21.

[0064] (Process S4: Transporting resin material) In process S4, the second loader 70 receives the resin material R and moves in the forward and backward direction along the second transport line 70R to transport the resin material R to the position of the resin sealing mold 21. At this time, the resin quantity calculation unit of the resin supply unit 41 calculates the amount of resin material R to be supplied to the workpiece W based on the weight of the workpiece W obtained from the measurement unit MP1 in process S1, and supplies the resin material R to the second loader 70, which then transports it to the resin sealing mold 21. Process S4 may proceed in parallel with processes S1 to S3 as soon as the weight of the workpiece W is obtained in process S1.

[0065] (Process S5: Resin sealing) In process S5, the resin encapsulation mold 21 encapsulates the electronic component by compression molding the workpiece W, which was transported from the first loader 60, using the resin material R transported from the second loader 70.

[0066] The above describes the resin encapsulation apparatus 1 according to the first embodiment, in which the measuring unit MP1 is provided in the workpiece storage unit 11. In the resin encapsulation apparatus 1 according to the first embodiment, the weight of the workpiece W is measured by the measuring unit MP1 provided in the workpiece storage unit 11 during the process of supplying the workpiece W. As a result, the resin quantity calculation unit 41 can calculate the appropriate amount of resin material R to be supplied to each workpiece W based on the weight information of the workpiece W obtained in advance from the measuring unit MP1, and can supply this amount to the workpiece W. Furthermore, since there is no separate process for measuring the weight of the workpiece W, it is possible to shorten the transport time from when the workpiece W is supplied from the workpiece storage unit 11 until it is transported onto the first transport line 60R via the workpiece transfer unit 13.

[0067] Furthermore, since the weight of the workpiece W is measured by the measuring unit MP1 in step S1, as soon as the weight of the workpiece W is obtained, the resin amount of the resin material R can be calculated in parallel by the resin supply unit 41 in step 4. As a result, the time required to resin-encapsulate the electronic components on the workpiece W in the resin encapsulation method from step S1 to step S5 can also be shortened.

[0068] <Second Embodiment> Figures 4A, 4B, and 4C show another example of a configuration for measuring the weight of a workpiece W in the resin encapsulation apparatus 1 according to the second embodiment. The second embodiment will be explained using as an example the case in which the weight of the workpiece W is measured in the workpiece transfer section 13 and process S2, as shown in the first embodiment in Figures 1 and 3. Figure 4A shows an example of a cross-section of the workpiece transfer section 13 before the pickup device 14 of the resin encapsulation apparatus 1 according to the second embodiment acquires the workpiece W on the workpiece support section WS. Figure 4B shows an example of a cross-section of the workpiece transfer section 13 when the pickup device 14 of the resin encapsulation apparatus 1 according to the second embodiment acquires the workpiece W on the workpiece support section WS. Figure 4C shows an example of a cross-section of the workpiece transfer section 13 after the pickup device 14 of the resin encapsulation apparatus 1 according to the second embodiment has acquired and is holding the workpiece W from the workpiece support section WS.

[0069] The work support unit WS may include a rail unit WI that receives and aligns the workpieces W sent out by the work storage unit 11, a measuring unit MP2 that measures the weight of the workpieces W, and a piston member PC that transfers the workpieces W to the pickup device 14. As shown in Figures 4A, 4B, and 4C, the pickup device 14 acquires the workpieces W from the work support unit WS. The pickup device 14 moves to the first transport line 60R while holding the workpieces W and places the workpieces W on the first loader 60.

[0070] The rail section WI may be used to align the workpieces W. As shown in Figure 4A, for example, the rail section WI may be used to align the workpieces W, which have been removed from the removal position ep of the work magazine WM, to a position where they can be transferred to the pickup device 14 described later. The workpieces W may be removed from the work magazine WM onto the rail section WI using a known pusher (not shown) and aligned along the grooves on the rail section WI. The rail section WI may also be provided with grooves for aligning multiple workpieces W, for example, the rail section WI may be rotated to align multiple workpieces W.

[0071] The piston member PC may extend and retract to transfer the workpiece W to the pickup device 14. As shown in Figures 4A and 4B, for example, the piston member PC may extend and retract vertically, and may extend and retract in such a way that it pushes the workpiece W, which has been aligned by the rail section WI, up to an internal region ia in which the pickup device 14 can grip the workpiece W. As shown in Figure 4C, the piston member PC may retract, and the pickup device 14 may grip the workpiece W. The extension and retraction of the piston member PC may be performed by, for example, pneumatic pressure, hydraulic pressure, or electromagnetic force. Also, as shown in Figure 4B, the rail section WI may be pushed up simultaneously with the extension and retraction of the piston member PC that pushes up the workpiece W. The rail section WI may also remain in the position shown in Figure 4A.

[0072] The measuring unit MP2 may measure the weight of the workpiece W. As shown in Figures 4A and 4B, for example, the measuring unit MP2 is attached to the tip of the piston member PC, and in the initial stopped state when the piston member PC is not operating, it is positioned to face the workpiece W with a gap between them, and may move upward while supporting the workpiece W when the piston member PC performs an upward extension and retraction movement. The measuring unit MP2 may measure the weight of the workpiece W during the upward extension and retraction movement of the piston member PC, or it may measure the weight of the workpiece W when the piston member PC has pushed the workpiece W up to a position where the pickup device 14 can grip it and hold it.

[0073] The pickup device 14 transports the workpiece W to the first loader 60 on the first transport line 60R. As shown in Figures 4A, 4B, and 4C, for example, the pickup device 14 may be equipped with a chuck CP that can be opened and closed in the left and right directions, and may grip the workpiece W by opening and closing the chuck CP in conjunction with the extension and retraction movement of the piston member PC. That is, the pickup device 14 may control the chuck CP, which is in the closed state as shown in Figure 4A, to open as shown in Figure 4B in conjunction with the extension and retraction movement of the piston member PC that pushes the workpiece W toward the pickup device 14. Alternatively, the pickup device 14 may control the chuck CP, which is in the open state as shown in Figure 4B, to close in conjunction with the piston member PC pushing the workpiece W into the internal region ia, in order to grip the workpiece W. As shown in Figure 4B, the pickup device 14 may control the chuck CP to close while the chuck jaws cc of the open chuck CP are in contact with the rail portion WI in order to grip the workpiece W. Then, as shown in Figure 4C, the piston member PC retracts and the pickup device 14 grips the workpiece W. After the operations shown in Figures 4A to 4C, the pickup device 14 may transport the workpiece W to the first loader 60. The pickup device 14 may move left to right to the position of the workpiece support portion WS which has received multiple workpieces W. Alternatively, the workpiece support portion WS may move left to right to a position where it can receive multiple workpieces W and hand them over to the pickup device 14.

[0074] The measuring unit MP3 may measure the weight of the workpiece W. As shown in Figures 4A, 4B, and 4C, for example, the measuring unit MP3 may be connected to the pickup device 14, and the weight of the workpiece W may be measured when the pickup device 14 is gripping the workpiece W, or the weight of the workpiece W may be measured while the pickup device 14 is transporting the workpiece W to the first loader 60. Note that at least one measuring unit MP2 and one measuring unit MP3 are required.

[0075] <Third Embodiment> Figures 5A, 5B, and 5C show another example of a configuration for measuring the weight of a workpiece W in the resin encapsulation apparatus 1 according to the third embodiment. The third embodiment will be explained using as an example the case in which the weight of the workpiece W is measured in the workpiece transfer section 13 and process S2 as shown in the first embodiment in Figures 1 and 3. Figure 5A shows an example of a cross-section of the workpiece transfer section 13 before the pickup device 14 of the resin encapsulation apparatus 1 according to the third embodiment acquires the workpiece W on the workpiece support section WS. Figure 5B shows an example of a cross-section of the workpiece transfer section 13 when the pickup device 14 of the resin encapsulation apparatus 1 according to the third embodiment acquires the workpiece W on the workpiece support section WS. Figure 5C shows an example of a cross-section of the workpiece transfer section 13 after the pickup device 14 of the resin encapsulation apparatus 1 according to the third embodiment has acquired and is holding the workpiece W from the workpiece support section WS.

[0076] The work support section WS may include a rail section WI that receives and aligns the workpiece W sent out by the work storage section 11, an elastic member EC that elastically deforms the rail section WI, and a measuring section MP3 and a base SC on which the elastic member EC and measuring section MP3 are provided for measuring the weight of the workpiece W. As shown in Figures 5A, 5B, and 5C, the pickup device 14 acquires the workpiece W from the work support section WS. The pickup device 14 moves to the first transport line 60R while holding the workpiece W and places the workpiece W on the first loader 60.

[0077] The rail section WI may be used to align the workpieces W. As shown in Figure 5A, for example, the rail section WI is provided on the base SC so as to be elastically deformable in the vertical direction via an elastic member EC, and may be used to align the workpieces W taken out from the removal position ep of the work magazine WM to a position where they can be transferred to the pickup device 14 described later. The workpieces W may be taken out from the work magazine WM onto the rail section WI using a known pusher (not shown) and aligned along the grooves on the rail section WI. The rail section WI may also be provided with grooves for aligning multiple workpieces W, for example, the rail section WI may be rotated to align multiple workpieces W.

[0078] The measuring unit MP2 measures the weight of the workpiece W. As shown in Figures 5A and 5B, for example, the measuring unit MP2 may be mounted on a base SC and positioned opposite the workpiece W with a gap between them. The measuring unit MP2 may also measure the weight of the workpiece W by supporting it through the elastic downward deformation of the rail portion WI, which is supported by the chuck jaws cc of the chuck CP provided on the pickup device 14 (described later).

[0079] The pickup device 14 transports the workpiece W to the first loader 60. As shown in Figures 5A, 5B, and 5C, for example, the pickup device 14 is equipped with a chuck CP that can be opened and closed in the left and right directions, and may grip the workpiece W by performing a vertical movement relative to the workpiece support WS and an opening and closing movement of the chuck CP that is linked to this movement. That is, the pickup device 14 may control the chuck CP, which is in the closed state as shown in Figure 5A, to open as shown in Figure 5B in conjunction with the movement of the pickup device 14 downward toward the workpiece support WS. Alternatively, the pickup device 14 may control the chuck CP, which is in the open state as shown in Figure 5B, to close in order to grip the workpiece W when the chuck jaws cc of the chuck CP provided on the pickup device 14 are in contact with the rail portion WI and elastically deformed. Then, as shown in Figure 5C, the pickup device 14 rises and the pickup device 14 grips the workpiece W. After the operations shown in Figures 5A to 5C, the pickup device 14 may transport the workpiece W to the first loader 60. The workpiece support unit WS may move laterally to a position where it can receive multiple workpieces W and hand them over to the pickup device 14. Alternatively, the pickup device 14 may move laterally to the position of the workpiece support unit WS after it has received multiple workpieces W.

[0080] The measuring unit MP3 may measure the weight of the workpiece W. As shown in Figures 5A, 5B, and 5C, for example, the measuring unit MP3 may be connected to the pickup device 14, and the weight of the workpiece W may be measured when the pickup device 14 is gripping the workpiece W, or the weight of the workpiece W may be measured while the pickup device 14 is transporting the workpiece W to the first loader 60. Note that at least one measuring unit MP2 and one measuring unit MP3 are required.

[0081] In the resin encapsulation apparatus 1 according to the first to third embodiments described above, an example was explained in which a measuring unit MP1 is provided in the workpiece storage unit 11, a measuring unit MP2 is provided in the workpiece support unit WS, and a measuring unit MP3 is provided in the pickup device 14 to measure the weight of the workpiece W. The measuring units MP1, MP2, and MP3 only need to be provided in at least one of the workpiece storage unit 11, the workpiece support unit WS, and the pickup device 14. In this way, by configuring the apparatus to measure the weight of the workpiece W while it is being transported to the first loader 60 on the first transport line 60R, it is not necessary to provide a separate process for measuring the weight of the workpiece W, and the transport time of the workpiece W can be shortened. For example, if some of the multiple chips mounted on the workpiece W are partially damaged, it is not necessary to provide a separate process for accurately measuring and changing the amount of resin material supplied to the workpiece W based on the extent of the damage, and it is possible to calculate the amount of resin material supplied to the workpiece W by measuring the weight of the workpiece W.

[0082] <Other Embodiments> The above describes the resin encapsulation apparatus 1 according to the first to third embodiments, specifically the case where the present invention is applied to a compression-type resin encapsulation apparatus. However, the present invention may also be applied to a transfer-type resin encapsulation apparatus instead of a compression-type resin encapsulation apparatus. In the case of a transfer-type resin encapsulation apparatus, similar to the compression-type resin encapsulation apparatus in Figure 1, the weight of the workpiece W is measured while the workpiece W is being transported to the first loader 60 on the first transport line 60R. This eliminates the need for a separate process to measure the weight of the workpiece W, thereby shortening the transport time of the workpiece W. In the transfer-type resin encapsulation apparatus, resin encapsulation is performed regardless of the degree of defects in the workpiece W by filling the resin material into the resin encapsulation mold and curing it. In this case, based on the weight information of the workpiece W, it is possible to remove defective workpieces W in advance before performing resin encapsulation.

[0083] The embodiments described above are provided to facilitate understanding of the present invention and are not intended to limit its interpretation. The elements, arrangement, materials, conditions, shapes, and sizes of the embodiments are not limited to those exemplified and can be modified as appropriate. Furthermore, it is possible to partially substitute or combine the configurations shown in different embodiments. [Explanation of symbols]

[0084] 1… Resin encapsulation device 10…Work supply unit 11…Work storage section 13…Work Transfer Section 14…Pickup device 20, 30… Resin molding units 21…Resin sealing mold 40… Resin supply unit 50…Functional component supply unit 60...1st Loader 70... Second loader 90…Molded product recovery unit 60R…First conveyor line 70R…Second conveyor line W...work R…Resin H... Functional component WM…Work Magazine MG... Magazine Guide ep... Retrieval position MP1, MP2, MP3... Measurement Unit EM…Lifting mechanism em1…motor em2... screw shaft em3...nut em4... Lifting platform WS...Work support section WI... Rail section PC...Piston component CP... Chuck cc... Chuck jaws ia…internal area EC...Elastic material SC...Base

Claims

1. A resin sealing apparatus for resin sealing an electronic component of a workpiece including a substrate and an electronic component, A resin encapsulation mold for molding a resin material onto the workpiece to resin-encapsulate the electronic component, A workpiece housing section capable of accommodating at least one of the aforementioned workpieces, A transport line for transporting the workpiece supplied from the workpiece storage unit to the resin sealing mold, A measuring unit is provided in the workpiece storage section for measuring the weight of the workpiece, A resin encapsulation device equipped with the following features.

2. The resin sealing apparatus according to claim 1, further comprising a resin quantity calculation unit that calculates the amount of resin material to be supplied to the workpiece on a workpiece-by-workpiece basis based on the weight of the workpiece obtained by the measurement unit.

3. The measuring unit is provided in the workpiece storage section. The resin sealing apparatus according to claim 1, wherein the measuring unit measures the weight of the workpiece based on the difference in weight of the workpiece storage unit before and after the workpiece is removed from the workpiece storage unit.

4. A resin sealing apparatus for resin sealing an electronic component of a workpiece including a substrate and an electronic component, A resin encapsulation mold for molding a resin material onto the workpiece to resin-encapsulate the electronic component, A transport line for transporting the workpiece to the resin sealing mold, A workpiece housing section capable of accommodating at least one of the aforementioned workpieces, A work support section is provided between the work storage section and the transport line, and supports the work, A pickup device that holds the workpiece supplied from the workpiece storage section onto the workpiece support section and transports it to the transport line, The pickup device is provided with a measuring unit for measuring the weight of the workpiece, A resin encapsulation device equipped with the following features.

5. A resin sealing method for a workpiece including a substrate and electronic components, wherein the electronic components are sealed in resin, (a) A step of supplying a workpiece from a workpiece housing section capable of accommodating at least one workpiece onto a workpiece support section, (b) A step of transporting the workpiece supplied from the workpiece storage unit onto the workpiece support unit to a transport line using a pickup device, (c) A step of transporting the workpiece to a resin sealing mold via the transport line, (d) A step of resin-encapsulating the electronic component by molding a resin material onto the workpiece using the resin-encapsulating mold, Includes, The resin sealing method, wherein (a) or (b) above includes the step of calculating the weight of the workpiece using a measuring unit provided in at least one of the workpiece storage unit or the pickup device.

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