Braking device

Abstract

To be able to efficiently break substrates by a simple device with a simple configuration.SOLUTION: First, second, and third blades 5a, 5b, and 5c with different blade lengths that fit inside a holding frame 21 are prepared, and each blade 5a to 5c is pressurized by a pressurizing cylinder, and among the first to third blades 5a to 5c with different blade lengths, a substrate 20 is moved by a drive mechanism to the lower position of the blade with the blade length corresponding to the first, second and third areas A1, A2 and A3 of the substrate 20, which are divided according to the length of the planned braking line to be braked, with the holding frame 21.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to a breaking device that breaks a substrate along a breaking planned line to be broken among a plurality of breaking planned lines formed vertically and horizontally on the lower surface side of the substrate.

Background Art

[0002] Conventionally, as a breaking device for breaking a substrate (wafer) into a plurality of semiconductor chips, there is one described in Patent Document 1. In this type of conventional breaking device, as shown in FIG. 8 which is a cutting front view with an enlarged periphery of the blade and FIG. 9 which is a plan view, grid-like ruled lines serving as breaking planned lines 50a are formed on the lower surface of a substantially circular substrate 50 by a diamond blade or the like. Thereby, a plurality of chip regions are formed on the substrate 50, a protective sheet 51 is attached to the lower surface of the substrate 50, while an adhesive sheet 52 is attached to the upper surface side of the substrate 50. The adhesive sheet 52 is stretched over a substantially annular holding frame 53 (see FIG. 9) having an inner dimension larger than that of the substrate 50, and the substrate 50 is held by the adhesive sheet 52, the protective sheet 51, and the holding frame 53.

[0003] Then, with the protective sheet 51 facing downward, the substrate 50 is placed on the receiving portion 54. As shown by the arrow in FIG. 8 from above the adhesive sheet 52, the blade 55 is pressed against the breaking planned line 50a to be broken of the substrate 50, and bending stress is applied. Thereby, the substrate 50 is cut along the breaking planned line 50a to be broken, and such cutting operations are repeated along all the breaking planned lines 50a, and the substrate 50 is broken into a plurality of semiconductor chips. At this time, the receiving portion 54 has a space below the blade 55 and is configured to support both sides of the breaking planned line 50a to be broken across the breaking planned line 50a to be broken.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

[0005] However, in conventional braking devices, as shown in Figure 9, it is necessary to use a blade 55 with a blade length that is larger than the diameter of the substrate 50 and smaller than the inner diameter of the retaining frame 53 so that the blade 55 does not interfere with the retaining frame 53 when cutting.

[0006] Therefore, as shown in Figure 10, when cutting and braking a substrate 50' with a larger diameter than the substrate 50 shown in Figure 9, it is necessary to use a blade 55' that matches the diameter of the substrate 50'. Furthermore, if the holding frame 53 is of a fixed size, interference between the blade 55' and the holding frame 53 may occur. As a result, a larger holding frame that does not interfere with the blade 55' must be used, which necessitates the extra step of switching the substrate to a larger holding frame than in other processes such as dicing before and after braking, increasing the risk of product defects such as chipping. Additionally, if the size of the holding frame is increased to accommodate braking in processes before and after braking, such as dicing or expanding, the equipment becomes larger, leading to increased costs.

[0007] This invention has been made in view of the above-mentioned problems, and aims to enable efficient braking of a substrate using a device with a simple configuration. [Means for solving the problem]

[0008] To solve the above-mentioned problems, the braking device according to the present invention is characterized by comprising: a substantially circular substrate having a grid of multiple braking target lines formed on its lower surface to form multiple chip regions, placed inside a retaining frame, the retaining frame and the upper surface of the substrate covered with an adhesive sheet, and a protective sheet attached to the lower surface of the substrate, and the substrate being braked along the braking target line to be braked, wherein the substrate is braked along the braking target line to be braked, and the device comprises: a plurality of splitting means of different lengths having upper and lower contact portions that are positioned above and below the braking target line to be braked and are able to contact and separate from the front and back surfaces of the substrate; a moving means for moving the substrate together with the retaining frame to the position of the splitting means; and a stress applying means for applying bending stress to the substrate on the braking target line to be braked by the contact of the upper and lower contact portions of the splitting means to brake the substrate.

[0009] With this configuration, a cutting means is provided that has a blade length smaller than the inner dimensions of the nearly circular holding frame and longer than the diameter of the substrate, so as not to interfere with the holding frame, and another cutting means has a blade length smaller than the inner dimensions of the holding frame and shorter than the diameter of the substrate, so as not to interfere with the holding frame. Since the substrate is moved to the position of the cutting means together with the holding frame by the moving means, even when braking substrates of different sizes, one size of holding frame can be used to brake substrates of different sizes. This eliminates the need to change the substrate to a larger size holding frame as in the conventional method, allowing the braking work to be performed in a single process, preventing an increase in the cost required for braking and improving the efficiency of the braking work.

[0010] Furthermore, the cutting means may further include a support having two contact surfaces that contact the lower surface of the substrate with respect to the planned braking line of the braking target, and the substrate may be moved by the moving means such that the upper contact portion is positioned above the planned braking line of the braking target, which is located between the two contact surfaces of the support.

[0011] In this configuration, with the two contact surfaces of the support unit in contact with the lower surface of the substrate, straddling the planned braking line of the object to be braked, the substrate is moved by the moving mechanism so that the upper contact portion is positioned above the planned braking line of the object to be braked, which is located between the two contact surfaces of the support unit. This allows the substrate to be supported at three points near the planned braking line of the object to be braked, thereby applying bending stress and enabling braking of the substrate by so-called three-point braking.

[0012] Furthermore, the upper contact portion of the splitting means is provided with a first upper contact portion that is smaller than the inner dimensions of the retaining frame and longer than the diameter of the substrate and does not interfere with the retaining frame, and a second upper contact portion that is smaller than the inner dimensions of the retaining frame and shorter than the diameter of the substrate and does not interfere with the retaining frame, and the length of the braking line is divided into a first region where the length is greater than or equal to a predetermined length shorter than the diameter of the substrate, and a second region where the length is shorter than the predetermined length, and the first upper contact portion is used for braking the braking line in the first region, and the second upper contact portion is used for braking the braking line in the second region. Furthermore, the lower contact portion of the splitting means may be provided with a first lower contact portion that is smaller than the inner dimensions of the retaining frame and longer than the diameter of the substrate and does not interfere with the retaining frame, and a second lower contact portion that is smaller than the inner dimensions of the retaining frame and shorter than the diameter of the substrate and does not interfere with the retaining frame, and the length of the planned braking line may be divided into a first region where the length is greater than or equal to a predetermined length shorter than the diameter of the substrate, and a second region where the length is shorter than the predetermined length, and the first lower contact portion may be used for braking the planned braking line in the first region, and the second lower contact portion may be used for braking the planned braking line in the second region.

[0013] In this case, the substrate is divided into a first region and a second region according to the length of the planned braking line, and the first upper contact portion and / or the first lower contact portion are used in the first region, and the second upper contact portion and / or the second lower contact portion are used in the second region. cutting meansSwitching between modes allows for more efficient braking.

[0014] Furthermore, the moving means may be equipped with a rotation function that rotates the substrate together with the holding frame. This allows the substrate to be moved relative to a grid of multiple braking lines.

[0015] Furthermore, it is preferable to place an elastic buffer layer between the lower contact portion and the substrate to absorb the excess stress generated in the substrate after braking by the bending stress applied by the stress-applying means. In this case, the elastic buffer layer placed between the lower contact portion of the cutting means and the substrate absorbs the excess stress generated in the substrate after braking, thus preventing chipping from occurring on the edges of the substrate that has been braked by excessive stress, as is the case in the conventional method. [Effects of the Invention]

[0016] According to the present invention, even when multiple cutting means of different lengths are prepared and substrates of different sizes are to be braked, substrates of different sizes can be braked using a single holding frame of one size. Therefore, as in the conventional method, there is no need to go to the trouble of switching substrates to a larger holding frame, and the braking work can be performed in a single process, preventing an increase in the cost required for braking and improving the efficiency of the braking work. [Brief explanation of the drawing]

[0017] [Figure 1] This is a front view of a first embodiment of the braking device according to the present invention. [Figure 2] This is a partial plan view of Figure 1. [Figure 3] Figure 2 is a front view. [Figure 4] This is a cross-sectional view, enlarged from a portion of Figure 3. [Figure 5]It is an operation explanatory diagram, and (a) to (c) are respectively plan views in different states. [Figure 6] It is a front view in a state where a part of the second embodiment of the present invention is present. [Figure 7] It is a front view in different states of FIG. 6. [Figure 8] It is a front view of a part of a conventional example. [Figure 9] It is a plan view of a conventional example. [Figure 10] It is a plan view of different states of a conventional example.

Embodiments for Carrying Out the Invention

[0018] (First Embodiment) The first embodiment of the braking device according to the present invention will be described with reference to FIGS. 1 to 5.

[0019] (Device Configuration) FIG. 1 shows the braking device 1 of the present embodiment, which includes a mounting table 2 on which a substrate is placed, a drive mechanism 4 for running the mounting table 2 along a pair of guide rails 3 that are long in the left - right direction, and first, second, and third supports 6a, 6b, 6 that support three types of first, second, and third blades 5a, 5b, 5c with different blade lengths in the front - rear direction up and down movably at three locations along the length direction of the guide rail 3. Here, the first to third blades 5a to 5c have different blade lengths in the front - rear direction and are arranged in parallel. The blade length of the first blade 5a is the longest, and the blade length of the third blade 5c is the shortest, corresponding to the "upper contact part" of the cutting means with different lengths in the present invention, and is located above the braking planned line of the braking target of the substrate to be described later and is in contact with and separable from the upper surface of the substrate.

[0020] As shown in Figures 1 and 2, the mounting base 2 comprises a pair of left and right traveling bodies 2a that travel along both guide rails 3, a base plate 2b having a substantially rectangular shape in plan view and installed across both traveling bodies 2a, a circular plate-shaped rotating plate 2c rotatably mounted on the base plate 2b, and a support table 2d fixed on the rotating plate 2c and supporting a holding frame described later. Here, as shown in Figure 2, the rotating plate 2c is rotated by a rotating mechanism comprising a gear 2c1 formed on its periphery, three gears 2c2 arranged on the base plate 2b around the rotating plate 2c at the three vertices of an equilateral triangle in plan view and meshing with the gear 2c1 on the periphery of the rotating plate 2c, and a motor (not shown) that rotates one of the gears 2c2. When the motor rotates, the gears 2c2 rotate, and the rotation of these gears 2c2 is transmitted to the gear 2c1 on the periphery of the rotating plate 2c, causing the rotating plate 2c to rotate. This rotating mechanism, together with the drive mechanism 4 described in detail below, constitutes the "means of movement" in this invention.

[0021] The drive mechanism 4 comprises a ball screw 11 that is elongated on both sides and rotatably supported at both ends by bearings 10a and 10b, a fixing part 12 fixed to the center of the lower surface of the base plate 2b and having a female thread into which the male thread on the outer circumference of the ball screw 11 is screwed, and a motor 14 whose rotation shaft is connected to the right end of the ball screw 11 via a coupling 13. The two traveling bodies 2a have, for example, a U-shape in side view, with their bases fixed to the lower surface of the base plate 2b, and legs hanging down from both the front and rear ends of the base arranged to engage with the left and right guide rails 3 so as to be movable. As the motor 14 rotates, the ball screw 11 rotates, causing rollers built into the legs of both traveling bodies 2a to roll along the guide rails 3, and the traveling bodies 2a and the base plate 2b travel together along the guide rails 3. In response to the bidirectional rotation of the motor 14, both traveling bodies 2a travel left and right together with the base plate 2b, moving the base plate, which will be described later, to a predetermined position below the blade.

[0022] The substrate placed on the mounting table 2 is held in a holding frame as shown in Figures 3 and 4. Specifically, a nearly circular semiconductor substrate (wafer) 20, on which multiple chip regions are formed by a grid of planned breaking lines 20a on its lower surface, is placed inside a nearly annular holding frame 21. In particular, as shown in Figure 4, the upper surfaces of the holding frame 21 and the substrate 20 are covered with adhesive sheets 22, and a protective sheet 23 is attached to the lower surface of the substrate 20, with the substrate 20 being held in the holding frame 21. As shown in Figure 3, the peripheral edge of the holding frame 21 is placed on a support table 2d fixed on a rotating plate 2c and fixedly supported.

[0023] Here, the adhesive sheet 22 is preferably made of a permeable and stretchable synthetic resin such as polyvinyl chloride or polyolefin, and an acrylic adhesive is preferably applied to its adhesive surface. This makes it easier to see the braking line 20a from the surface (top) side. Also, the protective sheet 23 is preferably made of a transparent resin such as polyethylene, and it is desirable to form it into a nearly square shape when viewed from above.

[0024] Furthermore, the planned braking lines 20a on the substrate 20 are formed by, for example, irradiating the substrate 20 from the bottom side toward the interior with laser light, thereby forming a modified layer that will become the planned braking lines 20a in a grid pattern, before the adhesive sheet 22 and protective sheet 23 are attached. In addition, the planned braking lines 20a can be formed by processing scribing grooves using methods such as diamond scribing or dicing blades, but the method for forming the planned braking lines 20a is not limited to these.

[0025] Incidentally, below the substrate 20, as shown in Figure 1, a support 25 is positioned to support the substrate 20 from below as it moves along the guide rail 3 together with the traveling body 2a. This support 25 is connected to the traveling body 2a and the base plate 2b so as to be connectable and detachable. A straight groove 25a is formed on the upper surface of the support 25, and the surfaces on both sides of the groove 25a on the upper surface of the support 25 act as contact surfaces 25b, 25b, which contact the lower surface of the substrate 20. At this time, the groove 25a is formed parallel to the blade length direction of each blade 5a to 5c. This support 25 corresponds to the "lower contact portion" of the cutting means in this invention.

[0026] Furthermore, when the support 25, while connected to the traveling body 2a and the base plate 2b, moves together with the traveling body 2a and the base plate 2b to a position below one of the first to third blades 5a to 5c used for braking, the support 25 is released from the traveling body 2a and the base plate 2b at that position, and the support 25 is separated so that it does not move together with the traveling body 2a and the base plate 2b. At this time, when the support 25 is separated from the traveling body 2a and the base plate 2b, the direction of the groove 25a of the support 25 is arranged parallel to the blade's cutting edge direction at the position below the blade. Note that the support 25 that supports the lower surface of the substrate 20 is not limited to the above configuration; in short, it is sufficient if it has two contact surfaces that can provide two-point support on either side of the braking line 20a of the substrate 20.

[0027] Incidentally, the first, second, and third support parts 6a, 6b, and 6 that support the first, second, and third blades 5a, 5b, and 5c, respectively, are composed of fixed frames 30a, 30b, and 30c and vertical movement mechanisms 31a, 31b, and 31c provided on these frames 30a, 30b, and 30c, as shown in Figure 1.

[0028] As shown in Figure 1, the vertical movement mechanism 31a comprises two upper and lower guide bodies 31a1 and 31a2 that move up and down together with the rotation of the ball screw, and a pressurizing cylinder 32a attached to the lower guide body 31a2 that applies downward pressure to the first blade 5a, with the lower guide body 31a2 being configured to move up and down independently of the upper guide body 31a1. Similarly, the vertical movement mechanism 31b also comprises two upper and lower guide bodies 31b1 and 31b2 and a pressurizing cylinder 32b that applies downward pressure to the second blade 5b, as shown in Figure 1, and the vertical movement mechanism 31c also comprises two upper and lower guide bodies 31c1 and 31c2 and a pressurizing cylinder 32c that applies downward pressure to the third blade 5c, as shown in Figure 1. Here, the pressurizing cylinders 32a, 32b, and 32c correspond to the "stress-applying means" in the present invention, and apply bending stress to the braking target line 20a of the substrate 20.

[0029] Incidentally, the most distinctive feature of this invention is that, as shown in Figure 5, the planned braking line 20a of the substrate 20 is divided into three regions A1, A2, and A3 according to its length, and the first, second, and third blades 5a, 5b, and 5c, each with a different cutting length, are used for braking in each region A1, A2, and A3.

[0030] Specifically, the region is divided into three areas: a first region A1 in the shaded area of ​​Figure 5(a) (corresponding to the "first region" in the present invention), which includes a braking line 20a having a length of at least a first reference length which is a predetermined length shorter than the diameter of the substrate 20; a second region A2 in the shaded area of ​​Figure 5(b) (corresponding to the "second region" in the present invention), which includes a braking line 20a having a length longer than the first reference length; and a third region A3 in the shaded area of ​​Figure 5(c) (corresponding to the "second region" in the present invention), which includes a braking line 20a having a length shorter than the second reference length.

[0031] Then, according to the first, second, and third regions A1, A2, and A3 shown in Figures 5(a), (b), and (c), the first, second, and third blades 5a, 5b, and 5c are used, with their blade lengths decreasing in order. As shown in Figure 5(a), the blade length of the first blade 5a is smaller than the inner dimensions of the approximately circular retaining frame 21 and longer than the outer dimensions of the substrate 20 within the range of the first region A1, and corresponds to the "first upper contact portion" in the present invention.

[0032] Furthermore, as shown in Figure 5(c), the third blade 5c has a blade length smaller than the inner dimensions of the substantially circular retaining frame 21 and shorter than the outer dimensions of the substrate 20 within the range of the third region A3, and corresponds to the "second upper contact portion" in the present invention. In addition, as shown in Figure 3(b), the second blade 5b has a blade length smaller than the inner dimensions of the substantially circular retaining frame 21 and shorter than the outer dimensions of the substrate 20, and this also corresponds to the "second upper contact portion" in the present invention.

[0033] (Braking action) Next, the braking operation of the substrate 20 will be described. As described above, the support 25 is moved to a position below one of the first to third blades 5a to 5c that will be used for braking. Once the movement to the predetermined position is complete, the support 25 is separated from the traveling body 2a and the base plate 2b. As shown in Figure 4, the substrate 20 held in the holding frame 21 is positioned between the blade of the first to third blades 5a to 5c and the support 25. In this state, the position of the substrate 20 is finely adjusted by moving the traveling body 2a and the base plate 2b, and by rotating the rotating plate 2c by the rotating mechanism described above, so that the braking line 20a, which is the target of braking, is positioned below the blade and above the groove 25a of the support 25. The lower surface of the substrate 20 is supported at two support points, the contact surfaces 25b, 25b, which are the upper surfaces of the support 25 on both sides of the groove 25a.

[0034] Thus, with the lower surface of the substrate 20 supported at the two support points of the contact surfaces 25b, 25b, when braking the planned braking line 20a in the first region A1 shown in Figure 5(a), the guide body 31a2 below the vertical movement mechanism 31a of the support part 6a moves downward, causing the lower end of the first blade 5a to contact the upper surface of the adhesive sheet 22 covering the substrate 20. Furthermore, the downward movement of the guide body 31a2 applies a predetermined small pressure, and in this state, the cylinder 32a is activated, applying bending stress to the substrate 20, and the first blade 5a is suddenly pressed downward.

[0035] At this time, as shown in Figure 4, the substrate 20 is supported with two upper contact surfaces 25b, 25b of the support 25 in contact with the lower surface of the substrate 20, sandwiching the planned braking line 20a of the substrate 20. When a pressing force is applied by the pressurizing cylinder as shown by the arrow in Figure 4, a bending stress is applied to the substrate 20 at the planned braking line 20a, causing the planned braking line 20a of the substrate 20 to break, and so-called three-point braking is performed.

[0036] When braking of one braking line 20a is completed, the traveling body 2a and base plate 2b are moved so that the next braking line 20a is positioned below the first blade 5a, and the braking operation described above is repeated. Furthermore, when cutting of, for example, the horizontal braking lines 20a of the grid-like braking lines 20a is completed and braking of the vertical braking lines 20a is to be performed, the rotating plate 2c is rotated by 90° by the rotation mechanism described above so that the vertical braking lines 20a are positioned parallel to the cutting length direction of the first blade 5a and braking is performed.

[0037] Furthermore, when braking is performed on the braking lines 20a of the other second and third regions A2 and A3, the traveling body 2a and base plate 2b are moved appropriately to a position below the second blade 5b and third blade 3c, and braking is repeatedly performed on the braking lines 20a of each region A2 and A3 in the same manner as the braking of the first region A1 described above. After braking is completed on all the braking lines 20a, the substrate 20 is cut and separated into multiple chip regions, and the chips that have been cut and separated are peeled off from the adhesive sheet 22 and protective sheet 23 and collected.

[0038] In this process, blades with different cutting lengths are switched and used to perform braking along the planned braking lines 20a in each region A1 to A3 of the substrate 20. Therefore, even when braking substrates 20 of different sizes, it is possible to brake substrates of different sizes using a single holding frame 21, eliminating the need to switch to a larger holding frame to hold the substrate, as was done in the past.

[0039] Therefore, according to the above-described embodiment, first to third blades 5a, 5b, and 5c of different blade lengths are provided to fit inside the retaining frame 21, and each blade 5a to 5c is pressurized by pressurizing cylinders 32a to 32c, and the substrate 20 is moved together with the retaining frame 21 by the drive mechanism 4, which is a moving means, to a position below the blade with a blade length corresponding to the length of the planned braking line 20a to be braked. Thus, even when braking substrates 20 of different sizes, it is possible to brake substrates 20 of different sizes using a retaining frame 21 of the same size.

[0040] Therefore, unlike in the past, there is no longer a need to reposition the circuit board in a larger holding frame, allowing the braking process to be performed in a single step. This prevents an increase in the cost of braking and improves the efficiency of the braking process.

[0041] Furthermore, with the two contact surfaces 25b, 25b of the support 25 in contact with the lower surface of the substrate 20, with the braking line 20a of the target to be braked in between, the braking line 20a is positioned above the groove 25a between the two contact surfaces 25b, 25b of the support 25, and the substrate 20 is moved together with the holding frame 21 so that the blade to be used is positioned above the braking line 20a. As a result, the vicinity of the braking line 20a of the target to be braked on the substrate 20 can be supported at three points and bending stress can be applied, making it possible to easily brake the substrate 20 by so-called three-point braking.

[0042] Furthermore, the substrate 20 is divided into three regions, A1 to A3, according to the length of the planned braking line 20a, and braking is performed using blades with different cutting lengths depending on the region. By switching the blades used, the braking work can be performed efficiently.

[0043] Furthermore, when braking the grid-like braking lines 20a, the rotation of the rotating plate 2c rotates the substrate 20 together with the holding frame 21, thereby enabling braking of both the vertical and horizontal braking lines 20a.

[0044] (Second Embodiment) A second embodiment of the braking device according to the present invention will be described with reference to Figures 6 and 7. Since the device configuration in this embodiment is substantially the same as that of the first embodiment described above, the following description will mainly focus on the differences from the first embodiment, with reference to Figures 1 to 5 as well.

[0045] In this embodiment, as shown in Figure 6, instead of the support 25 in the first embodiment described above, a support 25' having one contact surface on its upper surface is used, and an elastic cushioning sheet SA is attached to the upper surface of the support 25' to form a cushioning layer. A substrate 20 held by a holding frame 21 is placed between one of the blades 5a, 5b, or 5c used for braking and the support 25', and the position of the substrate 20 is finely adjusted by moving the traveling body 2a and the base plate 2b, and by rotating the rotating plate 2c by the rotating mechanism described above, so that the braking target line 20a is positioned between the tip of one of the blades 5a, 5b, or 5c used for braking and the support 25', and braking is performed while supporting the substrate 20 at the braking target line 20a with two support points: one lower point by the support 25' and one upper point by the blade. This is the difference from the first embodiment described above.

[0046] The cushioning sheet SA is formed by forming an adhesive layer, for example, an acrylic adhesive with a thickness of 180 μm on the lower surface of a PET (polyethylene terephthalate) base material with a thickness of 100 μm, and the adhesive layer is attached to the upper surface of the support 25'. Preferably, the cushioning sheet SA is made by forming an adhesive layer on a rubber sheet such as silicone rubber, nitrile rubber, chloroprene rubber, EPDM, fluororubber, urethane rubber, or acrylic rubber, or by forming an adhesive layer on a resin base plate such as PP (polypropylene), PVC (polyvinyl chloride), PE (polyethylene), polyolefin, acrylic, or polyimide.

[0047] In this embodiment, when braking, an elastic cushioning sheet SA is placed between the support 25' and the substrate 20. As a result, the excess stress generated in the braked substrate 20 is absorbed by the cushioning sheet SA, and consequently, it is possible to prevent chipping from occurring on the edges of the substrate 20 after braking due to excessive stress caused by the pressure applied by any of the pressurizing cylinders 32a, 32b, or 32c used for braking.

[0048] Furthermore, when braking a braking line 20a close to the periphery of the substrate 20 among the grid-like braking lines 20a, as shown in Figure 7, the braking line 20a close to the periphery of the substrate 20 is positioned parallel to the length direction of the blades 5a, 5b, 5c, and is positioned between the tip of one of the blades 5a, 5b, or 5c used for braking and the support 25', and braking is performed. At this time, the left contact body 27b does not shift outward and protrude from the substrate 20, the support 25' is positioned below the braking line 20a on the substrate 20 to support the substrate 20 from below, and braking is performed with an elastic cushioning sheet SA positioned between the support 25' and the substrate 20.

[0049] Therefore, even when braking a braking line 20a close to the periphery of the substrate 20, it is possible to prevent chipping from occurring on the edge of the substrate 20 after braking due to excessive stress caused by the pressure applied by any of the pressurizing cylinders 32a, 32b, or 32c used for braking.

[0050] Therefore, according to the second embodiment, in addition to the effects achieved by the first embodiment described above, the elastic cushioning sheet SA interposed between the support 25' and the substrate 20 can absorb the excess stress generated at the edge of the substrate 20 after braking, thus preventing chipping from occurring at the edge of the substrate due to excessive stress, as in the conventional method.

[0051] It should be noted that the present invention is not limited to the embodiments described above, and various modifications other than those described above can be made without departing from the spirit of the invention.

[0052] For example, in the embodiment described above, the substrate 20 was divided into three regions A1 to A3 according to the length of the planned braking line 20a, but it may also be divided into two regions or four or more regions. Accordingly, it is advisable to prepare two or four or more types of blades with different cutting lengths.

[0053] Furthermore, the support 25, which serves as the lower contact portion and is the cutting means of the present invention, may have multiple different lengths, such as the blade lengths of the first to third blades 5a, 5b, and 5c described above. In this case, the first blade 5a corresponds to the "first upper contact portion," and the second and third blades 5b and 5c correspond to the "second upper contact portion," with each support corresponding to the "first lower contact portion" and the "second lower contact portion" depending on its length.

[0054] Furthermore, in the embodiments described above, the stress-applying means for applying bending stress to the braking target line 20a of the substrate 20 was described as pressurizing cylinders 32a, 32b, and 32c, but the stress-applying means is not limited to such pressurizing cylinders 32a, 32b, and 32c.

[0055] Furthermore, the drive mechanism 4, which is a means of moving the substrate 20 together with the retaining frame 21, is not limited to the configuration described.

[0056] Furthermore, the cutting means, consisting of blades 5a, 5b, 5c and support 25, is not limited to the above-described configuration. It may have upper and lower contact portions positioned above and below the braking target line 20a and capable of contacting and separating from the upper and lower surfaces of the substrate 20, and can be configured to apply bending stress to the substrate by a stress-applying means.

[0057] Furthermore, although the second embodiment described above described a case in which a drying sheet SA (buffer layer) is provided on the upper surface of the support 25', the buffer sheet SA may also be attached to the lower surface of the substrate 20 to which the protective sheet 23 is not attached.

[0058] Furthermore, the present invention can be applied to a braking device that brakes a substrate along a predetermined braking line, selected from a plurality of predetermined braking lines formed vertically and horizontally on the lower surface of the substrate. [Explanation of Symbols]

[0059] 1. Braking device 2c1, 2c2…Giya (Returning Mechanism) 4 …Motor mechanism (means of movement) 5a, 5b, 5c …the first, second, and third breaks (cutting methods, deception). 20…Substrate 20a…ブレーキングpredetermined route 25,25' …Support body (severance means, lower part) A1, A2, A3… First, second, and third domains SA …buffer layer (buffer layer)

Claims

1. In a braking device in which a circular substrate having multiple planned braking lines formed in a grid pattern on its lower surface and multiple chip regions formed thereon is placed inside a retaining frame, the retaining frame and the upper surface of the substrate are covered with an adhesive sheet, and a protective sheet is attached to the lower surface of the substrate, the substrate is braked along the planned braking lines to be braked, A plurality of cutting means, including upper and lower contact portions, are positioned above and below the braking line of the braking target and are in contact with the upper and lower surfaces of the substrate so as to be able to move toward and away from it. A moving means for sequentially moving the substrate together with the holding frame to the respective positions of the plurality of cutting means, The upper and lower contact portions contact the substrate as it is sequentially moved by each of the plurality of cutting means, and a stress applying means applies bending stress to the braking target on the substrate along the planned braking line to be braked, thereby braking the substrate. Equipped with, The braking device comprises the upper and lower contact portions, each having a different length, included in the plurality of cutting means.

2. Each of the aforementioned multiple cutting means is The lower contact portion further comprises a support having two contact surfaces that contact the lower surface of the substrate, with the braking target's planned braking line in between. The aforementioned substrate is The upper contact portion is moved by the moving means so that it is positioned above the braking line of the braking target located between the two contact surfaces of the support. The braking device according to feature 1.

3. The first cutting means having a first upper contact portion that is smaller than the inner dimensions of the retaining frame and longer than the diameter of the substrate and does not interfere with the retaining frame, The second cutting means has a second upper contact portion which is smaller than the inner dimensions of the retaining frame and shorter than the diameter of the substrate and does not interfere with the retaining frame. Equipped with, The braking line is divided into a first region where the length is greater than or equal to a predetermined length shorter than the diameter of the substrate, and a second region where the length is shorter than the predetermined length. The first upper contact portion is used for braking the braking line in the first region. The braking device according to claim 1, wherein the second upper contact portion is used for braking the braking line of the second region.

4. The first cutting means has a first lower contact portion that is smaller than the inner dimensions of the retaining frame and longer than the diameter of the substrate and does not interfere with the retaining frame, The second cutting means has a second lower contact portion that is smaller than the inner dimensions of the retaining frame and shorter than the diameter of the substrate, and does not interfere with the retaining frame. The first lower contact portion is used for braking the braking line in the first region. The braking device according to claim 3, wherein the second lower contact portion is used for braking the braking line of the second region.

5. The braking device according to any one of claims 1 to 4, wherein the moving means has a rotation function for rotating the substrate together with the holding frame.

6. Between the lower contact portion and the substrate, The braking device according to any one of claims 1 to 4, wherein an elastic buffer layer is provided to absorb the excess stress generated in the substrate after braking by the bending stress provided by the stress-applying means.

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