Tape crimping device

Abstract

To provide a tape press-bonding device which does not break a wafer even when tape of a frame with tape is press-bonded to a rear surface of the wafer by a press roller.SOLUTION: A tape press-bonding device 2 comprises: an upper chamber 4; a lower chamber 6; a lifting mechanism 8 which generates a closed state in which the upper chamber 4 is lifted / lowered to be in contact with the lower chamber 6 and the open state in which the upper chamber is separated from the lower chamber 6; a vacuum part 10 which makes the upper chamber 4 and the lower chamber 6 vacuous in the closed state; and an atmosphere open part 12 which opens the upper chamber 4 and the lower chamber 6 to the atmosphere. The lower chamber 6 stores a wafer table 32 which has a holding surface 34 formed into the concave shape that supports only an outer periphery excessive region of a wafer and makes the device region non-contact. The tape press-bonding device 2 also comprises positive pressure generation means 48 which supplies the air to a region formed in the concave shape in the wafer table 32 to make the positive pressure with respect to the air pressure of the upper chamber 4 and the lower chamber 6.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a tape bonding device that bonds a tape adhered to a frame having an opening for accommodating a wafer at the center to the back surface of the wafer.

Background Art

[0002] A wafer having a device region partitioned by streets with a plurality of devices such as ICs and LSIs and an outer peripheral surplus region surrounding the device region formed on its surface is ground on the back surface to a desired thickness and then divided into individual device chips by a dicing device or a laser processing device, and each of the divided device chips is used in electric devices such as mobile phones and personal computers.

[0003] In order to facilitate the conveyance of the ground wafer, the applicant has left a ring-shaped reinforcing portion on the back surface corresponding to the outer peripheral surplus region, performed predetermined processing, and then bonded a dicing tape to the back surface of the wafer and supported the wafer with a frame, and proposed a technique for removing the ring-shaped reinforcing portion from the wafer (see, for example, Patent Document 1).

[0004] However, in the technique disclosed in Patent Document 1, it is difficult to bond a dicing tape to the back surface of a wafer having a ring-shaped reinforcing portion formed on the outer periphery and integrate it with a frame, and it is difficult to cut and remove the ring-shaped reinforcing portion from the wafer, resulting in poor productivity.

[0005] Therefore, the applicant has developed a processing device for removing a convex reinforcing portion from a wafer having a convex ring-shaped reinforcing portion formed on the back surface corresponding to the outer peripheral surplus region and filed a patent application on July 17, 2020 (Japanese Patent Application No. 2020-123301).

[0006] This processing device includes a wafer cassette table on which a wafer cassette containing a plurality of wafers is placed, A wafer unloading means for unloading wafers from wafer cassettes placed on a wafer cassette table, A wafer table that supports the surface side of the wafer that has been unloaded by the wafer unloading means, A frame housing means for housing multiple ring-shaped frames, each having an opening for housing wafers, A frame unloading means for unloading frames from a frame storage means, A frame table that supports the frame that has been removed by the frame removal means, A tape crimping means is positioned above the frame table and presses tape onto the frame, A tape-attached frame transport means that transports the frame with the tape attached to it to a wafer table, positions the opening of the frame on the back surface of the wafer supported on the wafer table, and places the tape-attached frame on the wafer table. A tape-pressing means for pressing the tape of a tape-attached frame onto the back surface of a wafer, A frame unit unloading means for unloading a frame unit from a wafer table, in which the tape of the tape-attached frame and the back surface of the wafer are pressed together by a tape-pressure means, A reinforcement removal means for cutting and removing a ring-shaped reinforcement from a wafer of a frame unit that has been unloaded by a frame unit unloading means, A ringless unit removal means for removing the ringless unit, from which the ring-shaped reinforcing part has been removed, from the reinforcing part removal means, The system includes a frame cassette table on which a frame cassette containing a ringless unit, which has been unloaded by a ringless unit unloading means, is placed.

[0007] The tape-pressing means described above comprises an upper chamber, a lower chamber housing a wafer table, a lifting mechanism that raises and lowers the upper chamber to create a closed state where it is in contact with the lower chamber and an open state where it is separated from the lower chamber, a vacuum section that creates a vacuum in the upper and lower chambers in the closed state, and an atmospheric opening section that opens the upper and lower chambers to the atmosphere. With the tape of the tape-attached frame positioned on the back surface of a wafer supported on the wafer table, the lifting mechanism is operated to create a vacuum in the upper and lower chambers while maintaining the closed state, and the tape of the tape-attached frame is pressed against the back surface of the wafer by a pressing roller disposed in the upper chamber, thereby ensuring that the tape adheres tightly to the back surface of the wafer. [Prior art documents] [Patent Documents]

[0008] [Patent Document 1] Japanese Patent Publication No. 2010-62375 [Overview of the Initiative] [Problems that the invention aims to solve]

[0009] However, since the wafer table is formed in a concave shape that supports only the outer periphery and excess area to avoid damaging the device area formed on the wafer surface, there is a problem that the wafer may be damaged when the tape of the tape-attached frame is pressed against the back surface of the wafer with the pressure roller.

[0010] The object of the present invention is to provide a tape crimping device that does not damage the wafer even when the tape of a tape-attached frame is pressed against the back surface of the wafer with a pressure roller. [Means for solving the problem]

[0011] According to the present invention, the following tape crimping device is provided that solves the above problems. That is, "a tape crimping device that crimps a tape, which is crimped to a frame having an opening in the center for housing a wafer, to the back surface of a wafer, The device comprises an upper chamber, a lower chamber housing a wafer table having a concave holding surface that supports only the excess outer region of the wafer and keeps the device region non-contacting, a lifting mechanism that raises and lowers the upper chamber to generate a closed state in contact with the lower chamber and an open state separated from the lower chamber, a vacuum section that creates a vacuum in the closed state of the upper chamber and the lower chamber, and an atmospheric opening section that opens the upper chamber and the lower chamber to the atmosphere, With the tape of the tape-attached frame positioned on the back surface of the wafer supported on the wafer table, the lifting mechanism is operated to maintain the closed state while creating a vacuum in the upper and lower chambers, and the tape of the tape-attached frame is pressed against the back surface of the wafer by a pressure roller disposed in the upper chamber. The wafer table includes a positive pressure generating means that supplies air to a concave region to create a positive pressure greater than the air pressure in the upper chamber and the lower chamber. By operating the lifting mechanism to close it, the pressing roller is brought into contact with the tape-attached frame, and the pressing roller is rolled to press the tape on the tape-attached frame against the back surface of the wafer, A tape crimping device is provided in which a positive pressure generating means is activated when a pressure roller presses the wafer through the tape. Furthermore, the present invention provides the following tape crimping device that solves the above problems. That is, A tape crimping device that crimps tape, which is crimped onto a frame having an opening in the center for housing a wafer, onto the back surface of a wafer, The device comprises an upper chamber, a lower chamber housing a wafer table having a circular concave holding surface that supports only the excess outer region of the wafer and keeps the device region non-contact, a lifting mechanism that raises and lowers the upper chamber to generate a closed state in contact with the lower chamber and an open state separated from the lower chamber, a vacuum section that reduces the pressure in the upper chamber and the lower chamber in the closed state, and an atmospheric vent section that opens the upper chamber and the lower chamber to the atmosphere, The holding surface of the wafer table has a ring member that is positioned along the periphery of a circularly concave region and attracts and holds the excess outer region of the wafer. With the tape of the tape-attached frame positioned on the back surface of the wafer supported on the wafer table, the lifting mechanism is operated to maintain the closed state and reduce the pressure in the upper and lower chambers to an extent that the suction holding state of the wafer by the ring member is maintained, and the tape of the tape-attached frame is pressed against the back surface of the wafer by a pressure roller disposed in the upper chamber. A tape crimping device is provided which includes a positive pressure generating means that supplies air to a concave region of the wafer table to create a positive pressure greater than the air pressure in the upper chamber and the lower chamber.

[0012] Preferably, the positive pressure generating means is activated when the pressing roller presses the wafer through the tape. A ring-shaped reinforcing portion may be formed in a convex shape on the back surface corresponding to the excess area on the outer periphery of the wafer. The ring member is preferably made of rubber. [Effects of the Invention]

[0013] The tape crimping device of the present invention is a tape crimping device that crimps a tape, which is crimped onto a frame having an opening in the center for housing a wafer, onto the back surface of a wafer, The device comprises an upper chamber, a lower chamber housing a wafer table having a concave holding surface that supports only the excess outer region of the wafer and keeps the device region non-contacting, a lifting mechanism that raises and lowers the upper chamber to generate a closed state in contact with the lower chamber and an open state separated from the lower chamber, a vacuum section that creates a vacuum in the closed state of the upper chamber and the lower chamber, and an atmospheric opening section that opens the upper chamber and the lower chamber to the atmosphere, With the tape of the taped frame positioned on the back surface of the wafer supported by the wafer table, the lifting mechanism is operated to evacuate the upper chamber and the lower chamber while maintaining the closed state, and the tape of the taped frame is configured to be crimped to the back surface of the wafer by a pressing roller disposed in the upper chamber. It includes a positive pressure generating means for supplying air to the region formed in the concave shape of the wafer table to make it a positive pressure higher than the air pressures of the upper chamber and the lower chamber. By operating the lifting mechanism to close it, the pressing roller is brought into contact with the tape-attached frame, and the pressing roller is rolled to press the tape on the tape-attached frame against the back surface of the wafer, When the pressing roller presses the wafer through the tape, the positive pressure generating means operates, so that even when the tape of the taped frame is crimped to the back surface of the wafer by the pressing roller, the wafer will not be damaged. Also, the tape crimping device of the present invention is a tape crimping device for crimping a tape crimped to a frame having an opening for accommodating a wafer at the center to the back surface of the wafer. An upper chamber, a lower chamber accommodating a wafer table having a holding surface formed in a circular concave shape that supports only the outer peripheral surplus region of the wafer and keeps the device region non-contact, and a lifting mechanism for raising and lowering the upper chamber to bring it into contact with the lower chamber to generate a closed state and separating it from the lower chamber to generate an open state, a vacuum unit for reducing the pressure of the upper chamber and the lower chamber in the closed state, and an atmospheric opening unit for opening the upper chamber and the lower chamber to the atmosphere. The holding surface of the wafer table has a ring member arranged along the periphery of the region formed in a circular concave shape and sucking and holding the outer peripheral surplus region of the wafer. With the tape of the taped frame positioned on the back surface of the wafer supported by the wafer table, the lifting mechanism is operated to lower the pressures of the upper chamber and the lower chamber while maintaining the closed state to such an extent that the sucking and holding state of the wafer by the ring member is maintained, and the tape of the taped frame is configured to be crimped to the back surface of the wafer by a pressing roller disposed in the upper chamber. ​Since it includes a positive pressure generating means for supplying air to the concave-formed region of the wafer table to make it a positive pressure higher than the air pressures in the upper chamber and the lower chamber, even if the tape of the tape-attached frame is pressed against the back surface of the wafer by the pressing roller, the wafer will not be damaged.

Brief Description of the Drawings

[0014] [Figure 1] Perspective view of a tape bonding device configured according to the present invention. [Figure 2] Exploded perspective view of the tape bonding device shown in FIG. 1. [Figure 3] Cross-sectional view of the tape bonding device shown in FIG. 1. [Figure 4] (a) Perspective view of a wafer with a reinforcing portion, (b) Perspective view of a wafer without a reinforcing portion. [Figure 5] Perspective view of a tape-attached frame. [Figure 6] Schematic diagram showing a state where the pressing of the tape is started. [Figure 7] Schematic diagram showing a state where the pressing of the tape is completed.

Embodiments for Carrying Out the Invention

[0015] Hereinafter, a preferred embodiment of a tape bonding device configured according to the present invention will be described with reference to the drawings.

[0016] (Tape Bonding Device 2) As shown in FIG. 1, the tape bonding device 2 includes an upper chamber 4, a lower chamber 6, a lifting mechanism 8 for lifting and lowering the upper chamber 4 to bring it into contact with the lower chamber 6 to generate a closed state and separating it from the lower chamber 6 to generate an open state, a vacuum unit 10 for evacuating the upper chamber 4 and the lower chamber 6 in the closed state, and an atmosphere release unit 12 for releasing the upper chamber 4 and the lower chamber 6 to the atmosphere.

[0017] (Upper Chamber 4) The upper chamber 4 includes a circular top plate 14 and cylindrical side walls 16 that hang down from the periphery of the top plate 14, with the lower part of the side walls 16 being open. Referring to Figures 2 and 3, the housing space defined by the lower surface of the top plate 14 and the inner circumferential surface of the side walls 16 contains a pressing roller 18 for pressing the tape of the tape-attached frame onto the wafer, a support piece 20 that rotatably supports the pressing roller 18, and an X-axis feed means 22 (see Figure 2) that moves the support piece 20 in the X-axis direction indicated by arrow X in Figure 2.

[0018] As shown in Figure 2, the X-axis feed mechanism 22 includes a ball screw 24 connected to the support piece 20 and extending in the X-axis direction, and a motor 26 that rotates the ball screw 24. The X-axis feed mechanism 22 converts the rotational motion of the motor 26 into linear motion using the ball screw 24 and transmits it to the support piece 20, moving the pressure roller 18 together with the support piece 20 along a pair of guide rails 28 that extend in the X-axis direction.

[0019] (Lower chamber 6) As shown in Figures 2 and 3, the lower chamber 6 has a cylindrical side wall 30. The upper part of the side wall 30 is open, and the lower part of the side wall 30 is closed. Inside the side wall 30 is a wafer table 32 that holds the wafer and frame.

[0020] The wafer table 32 has a concave holding surface 34 that holds only the excess outer peripheral region of the wafer, leaving the device region in contact. The holding surface 34 has an annular holding portion 36 that holds the excess outer peripheral region and frame of the wafer, and a circular recess 38 corresponding to the device region. A rubber ring 40 is arranged on the annular holding portion 36 along the periphery of the circular recess 38, and the rubber ring 40 is provided with a plurality of suction holes 40a spaced apart in the circumferential direction. Each suction hole 40a is connected to a suction means 44 (see Figure 2) via a flow path 42.

[0021] (Lifting mechanism 8, vacuum section 10, atmospheric vent section 12) The lifting mechanism 8 may consist of an appropriate actuator such as an air cylinder mounted on the upper surface of the top plate 14 of the upper chamber 4. The vacuum section 10 may consist of an appropriate vacuum pump. The vacuum section 10 is connected to the lower chamber 6 via a flow path 46. The flow path 46 is also provided with an atmospheric vent 12, which may consist of an appropriate valve that can open the flow path 46 to the atmosphere.

[0022] (Positive pressure generation means 48) Continuing the explanation with reference to Figures 2 and 3, the tape crimping device 2 of the illustrated embodiment includes a positive pressure generating means 48 that supplies air to a concave region (circular recess 38) of the wafer table 32 to create a positive pressure greater than the atmospheric pressure in the upper chamber 4 and the lower chamber 6. The positive pressure generating means 48 has a supply hole 50 formed in the circular recess 38 and an air supply means 54 (see Figure 2) connected to the supply hole 50 via a flow path 52.

[0023] (Waha W) Figure 4(a) shows a disc-shaped wafer W being pressed onto the tape of a tape-attached frame by a tape crimping device 2. The wafer W can be formed from a suitable semiconductor material such as silicon (Si) or silicon carbide (SiC). The surface Wa of the wafer W has a circular device region Rd and an outer peripheral surplus region Rs surrounding the device region Rd. The device region Rd is divided into multiple rectangular regions by a grid-like street S, and a device D such as an IC or LSI is formed in each of the multiple rectangular regions. For convenience, the boundary B between the device region Rd and the outer peripheral surplus region Rs is shown by a dashed line, but in reality, there is no line indicating boundary B.

[0024] In the wafer W shown in Figure 4(a), a ring-shaped reinforcing portion R is formed in a convex shape on the back surface Wb corresponding to the outer peripheral excess region Rs. Therefore, the thickness of the outer peripheral excess region Rs is greater than the thickness of the device region Rd.

[0025] Furthermore, the wafer to be pressed onto the tape of the tape-attached frame by the tape pressing device 2 may be one that does not have a ring-shaped reinforcing portion on its back surface Wb', as shown in wafer W' in Figure 4(b). The following description mainly focuses on the case where tape is pressed onto a wafer W having a reinforcing portion R.

[0026] (Frame with tape FT) Figure 5 shows a tape-attached frame FT to which the wafer W described above is pressed. The tape-attached frame FT comprises an annular frame F having an opening Fo for housing the wafer W, and a circular adhesive tape T pressed onto the frame F.

[0027] Next, we will explain the operation of the tape crimping device 2 as described above.

[0028] In the illustrated embodiment, first, the lifting mechanism 8 is activated to open the upper chamber 4, separating it from the lower chamber 6. Next, as shown in Figure 2, the wafer W is placed on the holding surface 34 of the wafer table 32 with the surface Wa on which the device D is formed facing downwards.

[0029] When placing a wafer W on the holding surface 34, the excess outer region Rs of the wafer W is positioned on the rubber ring 40 of the annular holding portion 36, and the device region Rd of the wafer W is positioned on the circular recess 38. As a result, even when the wafer W is placed on the holding surface 34 of the wafer table 32 with the surface Wa on which the device D is formed facing downwards, the device D in the device region Rd does not come into contact with the holding surface 34, thereby preventing damage to the device D.

[0030] Next, the suction means 44 is activated to generate suction force in each suction hole 40a of the rubber ring 40, thereby suctioning and holding the excess region Rs on the outer periphery of the wafer W. The pressure in the suction holes 40a at this time can be, for example, about 100 Pa absolute pressure.

[0031] Once the wafer W is held in place by suction on the wafer table 32, the tape-attached frame FT is placed on the annular holding portion 36 of the wafer table 32 (see Figure 2). At this time, the tape T of the tape-attached frame FT is positioned on the back surface Wb of the wafer W supported by the wafer table 32, and the adhesive side of the tape T is facing downwards so that the adhesive side of the tape T faces the back surface Wb of the wafer W.

[0032] After placing the tape-attached frame FT on the wafer table 32, the upper chamber 4 is lowered by the lifting mechanism 8, bringing the lower end of the side wall 16 of the upper chamber 4 into contact with the upper end of the side wall 30 of the lower chamber 6 (see Figure 3). This closes the upper chamber 4 and the lower chamber 6. As shown in Figure 6, the pressure roller 18 then comes into contact with the tape-attached frame FT, and the adhesive surface of the tape T comes into contact with the upper end of the reinforcing portion R of the wafer W.

[0033] Next, with the atmospheric vent 12 closed, the vacuum unit 10 is activated to create a vacuum inside the upper and lower chambers 4 and 6. However, the pressure inside the upper and lower chambers 4 and 6 is made greater than the pressure at the suction hole 40a (for example, an absolute pressure of about 200 Pa). This slightly weakens the force that sucks the wafer W, but even with a vacuum inside the upper and lower chambers 4 and 6, the wafer table 32 can maintain the state in which the wafer W is held by suction.

[0034] Next, as shown in Figures 6 and 7, the pressure roller 18 disposed in the upper chamber 4 is rolled in the X-axis direction by the X-axis feed means 22, and the tape T of the tape-attached frame FT is pressed against the back surface Wb of the wafer W by the pressure roller 18. At this time, the wafer W is pressed downward by the pressure roller 18 via the tape T. As a result, since only the outer peripheral excess region Rs of the wafer W is supported by the rubber ring 40 of the annular holding portion 36, and the device region Rd is positioned in the circular recess 38, the wafer W may bend downward due to the pressure from the pressure roller 18, and there is a risk that the wafer W may be damaged.

[0035] However, the tape crimping device 2 in the illustrated embodiment is equipped with a positive pressure generating means 48 that supplies air to the circular recess 38 to create a positive pressure greater than the atmospheric pressure in the upper and lower chambers 4 and 6. This prevents the wafer W from bending and being damaged by the pressure applied by the pressing roller 18.

[0036] Specifically, when the pressing roller 18 presses the wafer W through the tape T, the air supply means 54 of the positive pressure generating means 48 is activated to supply air to the circular recess 38 from the supply hole 50, making the circular recess 38 a positive pressure compared to the air pressure in the upper and lower chambers 4 and 6. At this time, the air pressure in the circular recess 38 is made slightly higher than the air pressure in the upper and lower chambers 4 and 6 to the extent that the deflection of the wafer W due to the pressing by the pressing roller 18 is suppressed. For example, if the air pressure in the upper and lower chambers 4 and 6 is about 200 Pa absolute pressure, the air pressure in the circular recess 38 can be about 300 Pa absolute pressure.

[0037] Thus, in the tape crimping device 2 of the illustrated embodiment, the positive pressure generating means 48 makes the circular recess 38 more positive than the upper and lower chambers 4 and 6. Therefore, when the wafer W is pressed through the tape T by the pressing roller 18, the deflection of the wafer W can be suppressed, and damage to the wafer W can be prevented.

[0038] When pressing the tape T onto the wafer W with the pressure roller 18, if the inside of the upper and lower chambers 4 and 6 is evacuated, the suction force of the wafer W by the wafer table 32 weakens, as described above. However, in the illustrated embodiment, the excess outer region Rs of the wafer W is positioned within the rubber ring 40 of the annular holding portion 36. Therefore, when pressing the tape T onto the wafer W with the pressure roller 18, the frictional force between the rubber ring 40 and the wafer W prevents the wafer W from shifting position.

[0039] In the illustrated embodiment, since a ring-shaped reinforcing portion R is formed on the back surface Wb of the wafer W, even when the tape T is pressed against the back surface Wb of the wafer W with the pressing roller 18, there may be areas where the tape T does not adhere closely to the base of the ring-shaped reinforcing portion R.

[0040] In this regard, in the illustrated embodiment, the tape T is pressed onto the wafer W by the pressure roller 18 while the insides of the upper and lower chambers 4 and 6 are under vacuum. Therefore, when the atmospheric pressure is released from the atmospheric pressure vent 12 after the pressure roller 18 has been moved, the tape T is pressed down by atmospheric pressure, and the tape T can be made to adhere tightly to the wafer W along the base of the reinforcing portion R.

[0041] In the illustrated embodiment, the case where tape T is an adhesive tape has been described, but tape T may also be a heat-sealable tape in which an adhesive layer is laid on the sheet. A heat-sealable tape is a tape made of a thermoplastic synthetic resin (for example, a polyolefin resin) that softens or melts and exhibits adhesive force when heated to a temperature near its melting point.

[0042] If the tape T is a heat-sealable sheet, the tape T can be heat-pressed onto the back surface Wb of the wafer W by the pressure roller 18 by heating at least one of the pressure roller 18 or the wafer table 32 to a temperature at which the tape T softens or melts. [Explanation of Symbols]

[0043] 2: Tape crimping device 4: Upper Chamber 6: Lower Chamber 8: Lifting mechanism 10: Vacuum section 12: Opening to the atmosphere 18: Pressure roller 32: Wafer Table 34: Holding surface 48: Positive pressure generation means W: Waha Wa: Wafer surface Wb: Back side of the wafer Rd: Device area Rs: Outer perimeter surplus area R: Reinforcement part FT: Frame with tape F: Frame Fo: opening T: Tape

Claims

1. A tape crimping device for crimping tape, which is crimped onto a frame having a central opening for housing a wafer, onto the back surface of a wafer, The device comprises an upper chamber, a lower chamber housing a wafer table having a concave holding surface that supports only the excess outer region of the wafer and keeps the device region non-contacting, a lifting mechanism that raises and lowers the upper chamber to generate a closed state in contact with the lower chamber and an open state separated from the lower chamber, a vacuum section that creates a vacuum in the closed state of the upper chamber and the lower chamber, and an atmospheric opening section that opens the upper chamber and the lower chamber to the atmosphere, With the tape of the tape-attached frame positioned on the back surface of the wafer supported on the wafer table, the lifting mechanism is operated to maintain the closed state while creating a vacuum in the upper and lower chambers, and the tape of the tape-attached frame is pressed against the back surface of the wafer by a pressure roller disposed in the upper chamber. The wafer table includes a positive pressure generating means that supplies air to a concave region to create a positive pressure greater than the air pressure in the upper chamber and the lower chamber. A tape crimping device in which, by operating the lifting mechanism to close it, the pressing roller is brought into contact with the tape-attached frame, and when the pressing roller rolls to press the tape on the tape-attached frame against the back surface of the wafer, the positive pressure generating means is activated when the pressing roller presses the wafer through the tape.

2. A tape crimping device for crimping tape, which is crimped onto a frame having a central opening for housing a wafer, onto the back surface of a wafer, The device comprises an upper chamber, a lower chamber housing a wafer table having a circular concave holding surface that supports only the excess outer region of the wafer and keeps the device region non-contact, a lifting mechanism that raises and lowers the upper chamber to generate a closed state in contact with the lower chamber and an open state separated from the lower chamber, a vacuum section that reduces the pressure in the upper chamber and the lower chamber in the closed state, and an atmospheric vent section that opens the upper chamber and the lower chamber to the atmosphere, The holding surface of the wafer table has a ring member that is positioned along the periphery of a circularly concave region and attracts and holds the excess outer region of the wafer. With the tape of the tape-attached frame positioned on the back surface of the wafer supported on the wafer table, the lifting mechanism is operated to maintain the closed state and reduce the pressure in the upper and lower chambers to an extent that the suction holding state of the wafer by the ring member is maintained, and the tape of the tape-attached frame is pressed against the back surface of the wafer by a pressure roller disposed in the upper chamber. A tape crimping apparatus including a positive pressure generating means that supplies air to a concave region of the wafer table to create a positive pressure greater than the air pressure in the upper chamber and the lower chamber.

3. The tape crimping device according to claim 2, wherein the positive pressure generating means is activated when the pressing roller presses the wafer through the tape.

4. The tape crimping device according to claim 1 or 2, wherein a ring-shaped reinforcing portion is formed in a convex shape on the back surface corresponding to the excess area on the outer edge of the wafer.

5. The tape crimping device according to claim 2, wherein the ring member is made of rubber.

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