Resin compositions, resin coatings, dry films, and cured resin products

A resin composition with a specific polymer and epoxy curing accelerator addresses the need for low dielectric properties and adhesion in semiconductor encapsulating materials, achieving reduced transmission loss and improved reliability.

JP7856019B2Active Publication Date: 2026-05-11SHIN ETSU CHEMICAL CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
SHIN ETSU CHEMICAL CO LTD
Filing Date
2023-02-06
Publication Date
2026-05-11

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Abstract

To provide a resin composition giving a resin cured product high in adhesion force to a base material used particularly for a circuit board such as a substrate, an electronic component, and a semiconductor element, excellent in fidelity as a protective film for electric and electronic components, and low in dielectric constant and dielectric tangent, and small in warpage, a resin film, a support film, and a dry film provided with a resin film on the support film.SOLUTION: A resin composition includes: (A) a polymer having a main chain including a silphenylene skeleton, an epoxy group-containing isocyanuric acid skeleton, and a norbornane skeleton; and (B) an epoxy curing accelerator, and gives a resin cured product having a dielectric constant at 10 GHz of 2.5 or lower, and a dielectric tangent at 10 GHz of 0.005 or lower by heat curing.SELECTED DRAWING: None
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