Laminate for image display devices, image display device, and module

Abstract

This laminate for an image display device comprises: a wiring board having a board and a mesh wiring layer disposed on a first surface of the board; a first adhesive layer positioned on the first surface side of the board; a second adhesive layer positioned on a second surface side of the board; and an intermediate layer positioned between the wiring board and the first adhesive layer and / or between the wiring board and the second adhesive layer. The board is transparent. A partial region of the board is disposed in a partial region between the first adhesive layer and the second adhesive layer.

Description

[Technical Field]

[0001] The embodiments of this disclosure relate to a laminate for an image display device, an image display device, and a module. [Background technology]

[0002] Currently, mobile devices such as smartphones and tablets are becoming more sophisticated, smaller, thinner, and lighter. These mobile devices use multiple communication bands. Therefore, multiple antennas are required, corresponding to each communication band. For example, mobile devices are equipped with multiple antennas, such as antennas for telephone, WiFi (Wireless Fidelity), 3G (Generation), 4G (Generation), LTE (Long Term Evolution), Bluetooth (registered trademark), and NFC (Near Field Communication). However, with the miniaturization of mobile devices, the space available for antenna installation is limited, and the freedom of antenna design is narrowing. Furthermore, because antennas are built into a limited space, radio wave sensitivity is not always satisfactory.

[0003] Therefore, film antennas that can be mounted on the display area of ​​mobile devices are being developed. This film antenna is a transparent antenna in which an antenna pattern is formed on a transparent substrate. The antenna pattern is formed by a mesh-like conductive mesh layer. It includes a conductive portion as the part where the opaque conductive layer is formed, and a number of openings as the non-formed portion. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2011-66610 [Patent Document 2] Patent No. 5636735 specification [Patent Document 3] Patent No. 5695947 specification

[0005] This embodiment provides a laminate for an image display device, an image display device, and a module that make it difficult to see the presence of a wiring board inside the image display device.

[0006] Furthermore, in conventional film antennas, the conductive mesh layer is often fixed to other layers by a transparent adhesive layer such as OCA (Optical Clear Adhesive). Because OCA is a flexible material, it is difficult to maintain horizontal alignment between the conductive mesh layer and the ground layer. In this case, it is difficult to sufficiently improve the antenna characteristics.

[0007] This embodiment provides a laminate for an image display device and an image display device that can improve antenna characteristics. [Disclosure of the Invention]

[0008] A first aspect of the present disclosure is a laminate for an image display device, comprising: a substrate including a first surface and a second surface located opposite to the first surface; a mesh wiring layer disposed on the first surface of the substrate; a first adhesive layer located on the first surface side of the substrate; a second adhesive layer located on the second surface side of the substrate; and an intermediate layer located between the wiring substrate and the first adhesive layer and between the wiring substrate and the second adhesive layer, wherein the substrate is transparent, and a portion of the substrate is disposed in a portion of the region between the first adhesive layer and the second adhesive layer.

[0009] A second aspect of this disclosure is the laminate for an image display device according to the first aspect described above, wherein the intermediate layer is located between the wiring substrate and the first adhesive layer, and also between the wiring substrate and the second adhesive layer.

[0010] A third aspect of this disclosure is a laminate for an image display device according to the first or second aspect described above, wherein the thickness of the intermediate layer may be 1 μm or more and 50 μm or less.

[0011] A fourth aspect of this disclosure is a laminate for an image display device according to each of the first to third aspects described above, wherein the refractive index of the intermediate layer may be 1.40 or more and 1.60 or less.

[0012] A fifth aspect of this disclosure is a laminate for an image display device according to each of the first to fourth aspects described above, wherein the difference between the refractive index of the intermediate layer and the refractive index of the first adhesive layer is 0.1 or less, the difference between the refractive index of the intermediate layer and the refractive index of the substrate is 0.1 or less, and the difference between the refractive index of the intermediate layer and the refractive index of the second adhesive layer may be 0.1 or less.

[0013] A sixth aspect of this disclosure is a laminate for an image display device according to each of the first to fifth aspects described above, wherein the dielectric loss tangent of the substrate may be 0.002 or less.

[0014] A seventh aspect of this disclosure is a laminate for an image display device according to each of the first to sixth aspects described above, wherein the relative permittivity of the substrate may be 2 or more and 10 or less.

[0015] An eighth aspect of this disclosure is a laminate for an image display device according to each of the first to seventh aspects described above, wherein the wiring board may have a radio wave transmission and reception function.

[0016] A ninth aspect of the present disclosure is a laminate for an image display device according to each of the first to eighth aspects described above, wherein the wiring board may further have a power supply unit electrically connected to the mesh wiring layer, and the mesh wiring layer may include a transmission unit connected to the power supply unit and a transmitting / receiving unit connected to the transmission unit.

[0017] A tenth aspect of the present disclosure is an image display device comprising a laminate for an image display device according to any of the first to ninth aspects described above, and a display device laminated on the laminate for an image display device.

[0018] An eleventh aspect of the present disclosure is a laminate for an image display device, comprising: a substrate including a first surface, a second surface located opposite to the first surface, and a third surface located between the first surface and the second surface; a mesh wiring layer disposed on the first surface of the substrate; a first adhesive layer located on the first surface side of the substrate; and a second adhesive layer located on the second surface side of the substrate, wherein the substrate is transparent, a portion of the substrate is disposed in a portion of the region between the first adhesive layer and the second adhesive layer, the third surface of the substrate is covered by at least one of the first adhesive layer and the second adhesive layer, and the surface roughness Ra of the third surface is 0.005 μm or more and 0.5 μm or less.

[0019] A twelfth aspect of this disclosure is a laminate for an image display device according to the eleventh aspect described above, wherein the thickness of the substrate may be 2 μm or more and 50 μm or less.

[0020] A thirteenth aspect of this disclosure is a laminate for an image display device according to the eleventh or twelfth aspect described above, wherein the thickness of the first adhesive layer is 1.5 times or more the thickness of the substrate, and may be 300 μm or less.

[0021] A fourteenth aspect of this disclosure is a laminate for an image display device according to each of the eleventh to thirteenth aspects described above, wherein the thickness of the second adhesive layer may be 1.5 times or more the thickness of the substrate, or 300 μm or less.

[0022] A fifteenth aspect of this disclosure is a laminate for an image display device according to each of the eleventh to fourteenth aspects described above, wherein the first adhesive layer and the second adhesive layer may each contain an acrylic resin.

[0023] A sixteenth aspect of this disclosure is a laminate for an image display device according to each of the eleventh to fifteenth aspects described above, wherein a dummy wiring layer electrically independent from the mesh wiring layer is provided around the mesh wiring layer.

[0024] A 17th aspect of this disclosure is a laminate for an image display device according to each of the 11th to 16th aspects described above, wherein the dielectric loss tangent of the substrate may be 0.002 or less.

[0025] An eighteenth aspect of this disclosure is a laminate for an image display device according to each of the eleventh to seventeenth aspects described above, wherein the relative permittivity of the substrate may be 2 or more and 10 or less.

[0026] A 19th aspect of this disclosure is a laminate for an image display device according to each of the 11th to 18th aspects described above, wherein the wiring board may have a radio wave transmission and reception function.

[0027] A 20th aspect of the present disclosure is a laminate for an image display device according to each of the 11th to 19th aspects described above, wherein the wiring board further has a power supply unit electrically connected to the mesh wiring layer, and the mesh wiring layer may include a transmission unit connected to the power supply unit and a transmitting / receiving unit connected to the transmission unit.

[0028] A 21st aspect of the present disclosure is an image display device comprising a laminate for an image display device according to any of the 11th to 20th aspects described above, and a display device laminated on the laminate for an image display device.

[0029] A 22nd aspect of the present disclosure is a module comprising a substrate having a first surface, a second surface located opposite to the first surface, and a third surface located between the first surface and the second surface; a wiring board having a mesh wiring layer disposed on the first surface of the substrate and a power supply unit electrically connected to the mesh wiring layer; and a power supply line electrically connected to the power supply unit, wherein the surface roughness Ra of the third surface is 0.005 μm or more and 0.5 μm or less.

[0030] A 23rd aspect of the present disclosure is a wiring substrate having a substrate including a first surface, a second surface located opposite to the first surface, and a third surface located between the first surface and the second surface, and a mesh wiring layer disposed on the first surface of the substrate, and a first adhesive layer located on the first surface side of the substrate and a second adhesive layer located on the second surface side of the substrate, wherein the substrate is transparent, a portion of the substrate is disposed in a portion of the region between the first adhesive layer and the second adhesive layer, the third surface of the substrate is covered by at least the first adhesive layer, and at least a portion of the third surface is inclined outward as it moves from the first surface toward the second surface.

[0031] A 24th aspect of the present disclosure is a laminate for an image display device according to the 23rd aspect described above, wherein the length between the outermost portion of the third surface and the outermost portion of the first surface, along the direction perpendicular to the normal direction of the first surface, may be 0.15 times or more and 2 times or less the length between the outermost portion of the third surface and the outermost portion of the first surface, along the normal direction.

[0032] A 25th aspect of the present disclosure is a laminate for an image display device according to the 23rd or 24th aspect described above, wherein in a cross section along the normal direction of the first surface, the outermost portion of the third surface may be located between the first surface and the second surface, and the length between the outermost portion of the third surface and the outermost portion of the second surface, along the direction perpendicular to the normal direction, may be 0.15 to 2 times the length between the outermost portion of the third surface and the outermost portion of the second surface, along the normal direction.

[0033] A 26th aspect of the present disclosure is a laminate for an image display device according to each of the 23rd to 25th aspects described above, wherein the third surface may be curved in a cross-section along the normal direction of the first surface.

[0034] A 27th aspect of the present disclosure is a laminate for an image display device according to each of the 23rd to 26th aspects described above, wherein in a cross section along the normal direction of the first surface, the third surface may be directed outward as it approaches the interface between the first adhesive layer and the second adhesive layer.

[0035] A 28th aspect of this disclosure is a laminate for an image display device according to each of the 23rd to 27th aspects described above, wherein the thickness of the substrate may be 2 μm or more and 50 μm or less.

[0036] A 29th aspect of this disclosure is a laminate for an image display device according to each of the 23rd to 28th aspects described above, wherein the thickness of the first adhesive layer is 1.5 times or more the thickness of the substrate, and may be 300 μm or less.

[0037] A 30th aspect of this disclosure is a laminate for an image display device according to each of the 23rd to 29th aspects described above, wherein the thickness of the second adhesive layer is 1.5 times or more the thickness of the substrate, and may be 300 μm or less.

[0038] A 31st aspect of this disclosure is a laminate for an image display device according to each of the 23rd to 30th aspects described above, wherein the first adhesive layer and the second adhesive layer may each contain an acrylic resin.

[0039] A 32nd aspect of this disclosure is a laminate for an image display device according to each of the 23rd to 31st aspects described above, wherein the thickness of the first adhesive layer may be greater than the thickness of the second adhesive layer.

[0040] A 33rd aspect of this disclosure is a laminate for an image display device according to each of the 23rd to 32nd aspects described above, wherein the difference between the thickness of the first adhesive layer and the thickness of the second adhesive layer may be 100 μm or less.

[0041] A 34th aspect of this disclosure is a laminate for an image display device according to each of the 23rd to 33rd aspects described above, wherein a dummy wiring layer electrically independent from the mesh wiring layer is provided around the mesh wiring layer.

[0042] A 35th aspect of this disclosure is a laminate for an image display device according to each of the 23rd to 34th aspects described above, wherein the dielectric loss tangent of the substrate may be 0.002 or less.

[0043] A 36th aspect of this disclosure is a laminate for an image display device according to each of the 23rd to 35th aspects described above, wherein the relative permittivity of the substrate may be 2 or more and 10 or less.

[0044] A 37th aspect of this disclosure is a laminate for an image display device according to each of the 23rd to 36th aspects described above, wherein the wiring board may have a radio wave transmission and reception function.

[0045] A 38th aspect of the present disclosure is a laminate for an image display device according to each of the 23rd to 37th aspects described above, wherein the wiring board may further have a power supply unit electrically connected to the mesh wiring layer, and the mesh wiring layer may include a transmission unit connected to the power supply unit and a transmitting / receiving unit connected to the transmission unit.

[0046] A 35th aspect of this disclosure is an image display device comprising a laminate for an image display device according to any of the 20th to 34th aspects described above, and a display device laminated on the laminate for an image display device.

[0047] The 40th aspect of the present disclosure is a module including a substrate having a first surface, a second surface located on the opposite side of the first surface, and a third surface located between the first surface and the second surface, a mesh wiring layer disposed on the first surface of the substrate, a power supply unit electrically connected to the mesh wiring layer, and a power supply line electrically connected to the power supply unit. At least a part of the third surface is inclined outward as it goes from the first surface toward the second surface.

[0048] The 41st aspect of the present disclosure is a laminate for an image display device, including a substrate, a mesh wiring layer disposed on the substrate, a conductive layer, and an adhesive layer located between the conductive layer and the substrate. The substrate has transparency, the adhesive layer has transparency, and the shortest distance between the mesh wiring layer and the conductive layer in the normal direction of the conductive layer is defined as L , , , 1max ,

[0049] ,

[0050] , 1min , <​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​The minimum in-plane thickness of the adhesive layer is set to T. 2min In that case, T 2min ≥0.9T 2max That's fine.

[0052] A forty-fifth aspect of this disclosure is an image display device comprising a laminate for an image display device according to each of the forty-first to forty-fourth aspects described above, and a display device laminated on the laminate for an image display device.

[0053] According to the embodiments of this disclosure, the presence of a wiring board within an image display device can be made less visible.

[0054] Furthermore, according to the embodiments of this disclosure, antenna characteristics can be improved. [Brief explanation of the drawing]

[0055] [Figure 1] Figure 1 is a plan view showing an image display device according to the first embodiment. [Figure 2] Figure 2 is a cross-sectional view (cross-sectional view along line II-II in Figure 1) showing an image display device according to the first embodiment. [Figure 3] Figure 3 is a plan view showing a wiring board. [Figure 4] Figure 4 is an enlarged plan view showing the mesh wiring layer of the wiring board. [Figure 5] Figure 5 is a cross-sectional view of the wiring board (the VV line cross-section in Figure 4). [Figure 6] Figure 6 is a cross-sectional view of the wiring board (cross-sectional view along line VI-VI in Figure 4). [Figure 7] Figures 7(a)-(f) are cross-sectional views showing a method for manufacturing a laminate for an image display device according to the first embodiment. [Figure 8] Figures 8(a)-(c) are cross-sectional views showing a method for manufacturing a laminate for an image display device according to the first embodiment. [Figure 9] Figure 9 is a cross-sectional view showing a laminate for an image display device according to the first modified example. [Figure 10]Figure 10 is a cross-sectional view showing a laminate for an image display device according to a second modified example. [Figure 11] Figure 11 is a cross-sectional view showing a laminate for an image display device according to a third modified example. [Figure 12] Figure 12 is a plan view showing a wiring board according to the first modified example. [Figure 13] Figure 13 is an enlarged plan view showing a wiring board according to the first modified example. [Figure 14] Figure 14 is a plan view showing a wiring board according to a second modified example. [Figure 15] Figure 15 is an enlarged plan view showing a wiring board according to the second modified example. [Figure 16] Figure 16 is an enlarged plan view showing the mesh wiring layer of a wiring board according to the third modified example. [Figure 17] Figure 17 is a plan view showing an image display device according to the second embodiment. [Figure 18] Figure 18 is a cross-sectional view (cross-sectional view along line XVIII-XVIII in Figure 17) showing an image display device according to the second embodiment. [Figure 19] Figures 19(a)-(c) are cross-sectional views showing a method for manufacturing a laminate for an image display device according to a second embodiment. [Figure 20] Figure 20 illustrates the visibility evaluation test in the example. [Figure 21] Figure 21 illustrates the visibility evaluation test in the example. [Figure 22] Figure 22 is a cross-sectional view (corresponding to Figure 2) showing an image display device according to the third embodiment. [Figure 23] Figure 23 is a cross-sectional view (enlarged view of part XXIII in Figure 22) showing an image display device according to the third embodiment. [Figure 24] Figures 24(a)-(c) are cross-sectional views showing a method for manufacturing a laminate for an image display device according to a third embodiment. [Figure 25] Figure 25 is a cross-sectional view (corresponding to Figure 23) showing a laminate for an image display device according to the first modified example. [Figure 26] Figure 26 is a cross-sectional view (corresponding to Figure 23) showing a laminate for an image display device according to a second modified example. [Figure 27] Figure 27 is a cross-sectional view (corresponding to Figure 23) showing a laminate for an image display device according to a third modified example. [Figure 28] Figure 28 is a cross-sectional view (corresponding to Figure 23) showing a laminate for an image display device according to the fourth modified example. [Figure 29] Figure 29 is a cross-sectional view (corresponding to Figure 23) showing a laminate for an image display device according to the fifth modified example. [Figure 30] Figure 30 is a cross-sectional view (corresponding to Figure 23) showing a laminate for an image display device according to the sixth modified example. [Figure 31] Figure 31 is a cross-sectional view (corresponding to Figure 23) showing a laminate for an image display device according to the seventh modified example. [Figure 32] Figure 32 is a cross-sectional view (corresponding to Figure 23) showing a laminate for an image display device according to the eighth modified example. [Figure 33] Figure 33 is a schematic exploded perspective view showing an image display device according to the fourth embodiment. [Figure 34] Figure 34 is a cross-sectional view (corresponding to Figure 2) showing an image display device according to the fourth embodiment. [Figure 35] Figure 35 is a cross-sectional view showing an image display device according to a fourth embodiment. [Modes for carrying out the invention]

[0056] (First Embodiment) First, the first embodiment will be described with reference to Figures 1 to 8. Figures 1 to 8 are diagrams illustrating this embodiment.

[0057] The following figures are schematic representations. Therefore, the size and shape of each part are exaggerated as appropriate for ease of understanding. Furthermore, they can be modified as appropriate without departing from the technical concept. In the following figures, the same parts are denoted by the same reference numerals, and some detailed explanations may be omitted. Also, the numerical values ​​such as dimensions and material names of each component described in this specification are examples of embodiments and are not limiting; they can be selected and used as appropriate. In this specification, terms that specify shapes and geometric conditions, such as parallel, orthogonal, and perpendicular, are interpreted to include not only their strict meaning but also substantially equivalent states.

[0058] Furthermore, in the following embodiments, "X direction" refers to the direction parallel to one side of the image display device. "Y direction" refers to the direction perpendicular to the X direction and parallel to the other side of the image display device. "Z direction" refers to the direction perpendicular to both the X and Y directions and parallel to the thickness direction of the image display device. Also, "front surface" refers to the surface on the positive Z direction side, which is the light-emitting surface side of the image display device and faces the observer. "Back surface" refers to the surface on the negative Z direction side, which is the surface opposite to the light-emitting surface and the surface facing the observer of the image display device. In this embodiment, the explanation will be given as an example of a mesh wiring layer 20 having a radio wave transmission and reception function (function as an antenna), but the mesh wiring layer 20 does not have to have a radio wave transmission and reception function (function as an antenna).

[0059] [Image display device configuration] The configuration of the image display device according to this embodiment will be described with reference to Figures 1 and 2.

[0060] As shown in Figures 1 and 2, the image display device 60 according to this embodiment comprises an image display device laminate 70 and a display device (display) 61 laminated on the image display device laminate 70. The image display device laminate 70 comprises a first transparent adhesive layer (first adhesive layer) 95, a second transparent adhesive layer (second adhesive layer) 96, a wiring board 10, and an intermediate layer 80. The wiring board 10 comprises a substrate 11 including a first surface 11a and a second surface 11b located opposite the first surface 11a, and a mesh wiring layer 20 disposed on the first surface 11a of the substrate 11. The wiring board 10 may also further have a power supply unit 40 electrically connected to the mesh wiring layer 20. A communication module 63 is disposed on the Z-minus side relative to the display device 61. The image display device laminate 70, the display device 61, and the communication module 63 are housed in a housing 62.

[0061] In the image display device 60 shown in Figures 1 and 2, radio waves of a predetermined frequency can be transmitted and received via a communication module 63, enabling communication. The communication module 63 may include any of the following: a telephone antenna, a WiFi antenna, a 3G antenna, a 4G antenna, a 5G antenna, an LTE antenna, a Bluetooth® antenna, an NFC antenna, etc. Examples of such an image display device 60 include mobile terminal devices such as smartphones and tablets.

[0062] As shown in Figure 2, the image display device 60 has a light-emitting surface 64. The image display device 60 includes a wiring board 10 located on the side of the light-emitting surface 64 (positive Z-direction) relative to the display device 61, and a communication module 63 located on the opposite side of the light-emitting surface 64 (negative Z-direction) relative to the display device 61.

[0063] The display device 61 is, for example, an organic EL (Electro-Luminescence) display device. The display device 61 may include, for example, a metal layer (not shown), a support substrate, a resin substrate, a thin-film transistor (TFT), and an organic EL layer. A touch sensor (not shown) may be placed on the display device 61. A wiring board 10 is also placed on the display device 61 via a second transparent adhesive layer 96. Note that the display device 61 is not limited to an organic EL display device. For example, the display device 61 may be another display device that has the function of emitting light itself, or it may be a micro-LED display device that includes a micro-LED element (light-emitting element). Also, the display device 61 may be a liquid crystal display device that includes a liquid crystal. A cover glass (surface protective plate) 75 is also placed on the wiring board 10 via a first transparent adhesive layer 95. Note that a decorative film and a polarizing plate (not shown) may be placed between the first transparent adhesive layer 95 and the cover glass 75.

[0064] The first transparent adhesive layer 95 is an adhesive layer that directly or indirectly adheres the wiring board 10 to the cover glass 75. This first transparent adhesive layer 95 is located on the first surface 11a side of the substrate 11. The first transparent adhesive layer 95 has optical transparency and may be an OCA (Optical Clear Adhesive) layer. An OCA layer is a layer made, for example, as follows: First, a liquid curable adhesive layer composition containing a polymerizable compound is applied to a release film such as polyethylene terephthalate (PET), and this is cured using, for example, ultraviolet light (UV) to obtain an OCA sheet. After laminating this OCA sheet to the object, the release film is peeled off to obtain the OCA layer. The material of the first transparent adhesive layer 95 may be an acrylic resin, a silicone resin, or a urethane resin. In particular, the first transparent adhesive layer 95 may contain an acrylic resin. In this case, it is preferable that the second transparent adhesive layer 96 contains an acrylic resin. This effectively eliminates the difference in refractive index between the first transparent adhesive layer 95 and the second transparent adhesive layer 96, thereby more reliably suppressing the reflection of visible light at the interface B4 between the first transparent adhesive layer 95 and the second transparent adhesive layer 96.

[0065] Furthermore, the first transparent adhesive layer 95 may have a transmittance of 85% or more of visible light (light with a wavelength of 400 nm to 700 nm), and preferably 90% or more. There is no particular upper limit to the transmittance of visible light of the first transparent adhesive layer 95, but it may be, for example, 100% or less. By setting the transmittance of visible light of the first transparent adhesive layer 95 within the above range, the transparency of the laminate 70 for the image display device is increased, making the display device 61 of the image display device 60 easier to see.

[0066] As described above, the wiring board 10 is positioned on the light-emitting surface 64 side relative to the display device 61. In this case, the wiring board 10 is located between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. More specifically, a portion of the substrate 11 of the wiring board 10 is positioned in a portion of the area between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. In this case, the first transparent adhesive layer 95, the second transparent adhesive layer 96, the display device 61, and the cover glass 75 each have a larger area than the substrate 11 of the wiring board 10. By positioning the substrate 11 of the wiring board 10 in a portion of the image display device 60 rather than across its entire surface in a plan view, the overall thickness of the image display device 60 can be reduced.

[0067] The wiring board 10 comprises a transparent substrate 11 and a mesh wiring layer 20 disposed on the first surface 11a of the substrate 11. A power supply unit 40 is electrically connected to the mesh wiring layer 20. The power supply unit 40 is electrically connected to a communication module 63. Furthermore, a portion of the wiring board 10 is not positioned between the first transparent adhesive layer 95 and the second transparent adhesive layer 96, but protrudes outward (towards the negative side in the Y direction) from between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. Specifically, the region of the wiring board 10 on which the power supply unit 40 is provided protrudes outward. This facilitates the electrical connection between the power supply unit 40 and the communication module 63. On the other hand, the region of the wiring board 10 on which the mesh wiring layer 20 is provided is located between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. Details of the wiring board 10 will be described later.

[0068] The second transparent adhesive layer 96 is an adhesive layer that directly or indirectly adheres the display device 61 to the wiring board 10. This second transparent adhesive layer 96 is located on the second surface 11b side of the substrate 11. The second transparent adhesive layer 96, like the first transparent adhesive layer 95, has optical transparency and may be an OCA (Optical Clear Adhesive) layer. The material of the second transparent adhesive layer 96 may be an acrylic resin, silicone resin, or urethane resin, etc. In particular, the second transparent adhesive layer 96 may contain an acrylic resin. This substantially eliminates the difference in refractive index between the first transparent adhesive layer 95 and the second transparent adhesive layer 96, and more reliably suppresses the reflection of visible light at the interface B4 between the first transparent adhesive layer 95 and the second transparent adhesive layer 96.

[0069] Furthermore, the second transparent adhesive layer 96 may have a transmittance of 85% or more for visible light (light with a wavelength of 400 nm to 700 nm), and preferably 90% or more. There is no particular upper limit to the transmittance of visible light of the second transparent adhesive layer 96, but it may be, for example, 100% or less. By setting the transmittance of visible light of the second transparent adhesive layer 96 within the above range, the transparency of the laminate 70 for the image display device is increased, making the display device 61 of the image display device 60 easier to see.

[0070] In such a laminated image display device 70, the difference between the refractive index of the first transparent adhesive layer 95 and the refractive index of the second transparent adhesive layer 96 is preferably 0.1 or less, and more preferably 0.05 or less. This suppresses the reflection of visible light at the interface B4 between the first transparent adhesive layer 95 and the second transparent adhesive layer 96, making it difficult for the observer to see the first transparent adhesive layer 95 and the second transparent adhesive layer 96 with the naked eye. For example, if the material of the first transparent adhesive layer 95 is an acrylic resin (refractive index 1.49), the refractive index of the second transparent adhesive layer 96 should be 1.39 or more and 1.59 or less. Here, refractive index refers to the absolute refractive index, which can be determined based on Method A of JIS K-7142.

[0071] In particular, it is preferable that the material of the first transparent adhesive layer 95 and the material of the second transparent adhesive layer 96 are the same material. This makes it possible to further reduce the difference in refractive index between the first transparent adhesive layer 95 and the second transparent adhesive layer 96, and to suppress the reflection of visible light at the interface B4 between the first transparent adhesive layer 95 and the second transparent adhesive layer 96.

[0072] Furthermore, in Figure 2, the thickness of at least one of the thicknesses T3 of the first transparent adhesive layer 95 and T4 of the second transparent adhesive layer 96 may be 1.5 times or more the thickness T1 of the substrate 11, preferably 2 times or more, and more preferably 2.5 times or more. By making the thickness T3 of the first transparent adhesive layer 95 or the thickness T4 of the second transparent adhesive layer 96 sufficiently thicker than the thickness T1 of the substrate 11, the first transparent adhesive layer 95 or the second transparent adhesive layer 96 deforms in the thickness direction in the region overlapping with the substrate 11, absorbing the thickness of the substrate 11. This suppresses the occurrence of steps in the first transparent adhesive layer 95 or the second transparent adhesive layer 96 at the periphery of the substrate 11, making it difficult for observers to recognize the presence of the substrate 11.

[0073] Furthermore, the thickness T3 of the first transparent adhesive layer 95 and the thickness T4 of the second transparent adhesive layer 96 may be 10 times or less the thickness T1 of the substrate 11, and preferably 5 times or less. This prevents the thickness T3 of the first transparent adhesive layer 95 or the thickness T4 of the second transparent adhesive layer 96 from becoming too thick, thereby reducing the overall thickness of the image display device 60.

[0074] Furthermore, in Figure 2, the thickness T3 of the first transparent adhesive layer 95 may be thicker than the thickness T4 of the second transparent adhesive layer 96. As mentioned above, the first transparent adhesive layer 95 is located on the first surface 11a side of the substrate 11 of the wiring board 10. Also, the mesh wiring layer 20 is arranged on the first surface 11a of the substrate 11 of the wiring board 10. Therefore, there is a possibility that irregularities will be formed on the surface of the first transparent adhesive layer 95 due to the irregularities formed by the mesh wiring layer 20. In contrast, by making the thickness T3 of the first transparent adhesive layer 95 thicker than the thickness T4 of the second transparent adhesive layer 96, the formation of irregularities on the surface of the first transparent adhesive layer 95 can be suppressed, and the surface of the first transparent adhesive layer 95 can be made smooth.

[0075] The difference between the thickness T3 of the first transparent adhesive layer 95 and the thickness T4 of the second transparent adhesive layer 96 is preferably 100 μm or less. Here, as described above, the first transparent adhesive layer 95 and the second transparent adhesive layer 96 may be OCA layers. Therefore, due to residual stress that may be generated in the OCA layer when the OCA layer is manufactured, tensile stress may be generated in the first transparent adhesive layer 95 and the second transparent adhesive layer 96 that acts to shrink the first transparent adhesive layer 95 and the second transparent adhesive layer 96. This tensile stress may increase as the thickness T3 of the first transparent adhesive layer 95 or the thickness T4 of the second transparent adhesive layer 96 increases. If the difference between the tensile stress generated in the first transparent adhesive layer 95 and the tensile stress generated in the second transparent adhesive layer 96 becomes large, warping may occur in the wiring board 10. In contrast, by keeping the difference between the thickness T3 of the first transparent adhesive layer 95 and the thickness T4 of the second transparent adhesive layer 96 to 100 μm or less, the difference between the tensile stress generated in the first transparent adhesive layer 95 and the tensile stress generated in the second transparent adhesive layer 96 can be reduced. This reduces the warping of the wiring board 10 caused by the difference between the tensile stress generated in the first transparent adhesive layer 95 and the tensile stress generated in the second transparent adhesive layer 96.

[0076] Furthermore, in Figure 2, the thickness T3 of the first transparent adhesive layer 95 and the thickness T4 of the second transparent adhesive layer 96 may be the same. In this case, the thickness T3 of the first transparent adhesive layer 95 and the thickness T4 of the second transparent adhesive layer 96 may each be 1.5 times or more the thickness T1 of the substrate 11, and preferably 2.0 times or more. That is, the sum of the thickness T3 of the first transparent adhesive layer 95 and the thickness T4 of the second transparent adhesive layer 96 (T3 + T4) is 3 times or more the thickness T1 of the substrate 11. In this way, by making the sum of the thicknesses T3 and T4 of the first transparent adhesive layer 95 and the second transparent adhesive layer 96 sufficiently thick compared to the thickness T1 of the substrate 11, the first transparent adhesive layer 95 and the second transparent adhesive layer 96 deform (shrink) in the thickness direction in the region overlapping with the substrate 11, and absorb the thickness of the substrate 11. This prevents the formation of a step in the first transparent adhesive layer 95 or the second transparent adhesive layer 96 at the periphery of the substrate 11, making it difficult for observers to recognize the presence of the substrate 11.

[0077] Furthermore, when the thickness T3 of the first transparent adhesive layer 95 and the thickness T4 of the second transparent adhesive layer 96 are the same, the thickness T3 of the first transparent adhesive layer 95 and the thickness T4 of the second transparent adhesive layer 96 may each be 5 times or less the thickness T1 of the substrate 11, and preferably 3 times or less. This prevents the thicknesses T3 and T4 of both the first transparent adhesive layer 95 and the second transparent adhesive layer 96 from becoming too thick, and allows the overall thickness of the image display device 60 to be reduced.

[0078] Specifically, the thickness T1 of the substrate 11 may be, for example, 1 μm or more and 200 μm or less, 2 μm or more and 200 μm or less, 5 μm or more and 50 μm or less, 2 μm or more and 50 μm or less, 10 μm or more and 50 μm or less, and preferably 15 μm or more and 25 μm or less. By setting the thickness T1 of the substrate 11 to 1 μm or more, the strength of the wiring substrate 10 can be maintained and the first directional wiring 21 and second directional wiring 22 of the mesh wiring layer 20, which will be described later, can be made less likely to deform. In addition, by setting the thickness T1 of the substrate 11 to 200 μm or less, the occurrence of steps in the first transparent adhesive layer 95 and the second transparent adhesive layer 96 at the periphery of the substrate 11 can be suppressed and the presence of the substrate 11 can be made less likely for the observer to recognize. Furthermore, by setting the thickness T1 of the substrate 11 to 50 μm or less, the occurrence of steps between the first transparent adhesive layer 95 and the second transparent adhesive layer 96 at the periphery of the substrate 11 is further suppressed, making it more difficult for observers to recognize the presence of the substrate 11.

[0079] The thickness T3 of the first transparent adhesive layer 95 may be, for example, 1 μm or more and 500 μm or less, 15 μm or more and 500 μm or less, 15 μm or more and 300 μm or less, 20 μm or more and 250 μm or less, and preferably 10 μm or more and 250 μm or less. By having a thickness T3 of the first transparent adhesive layer 95 of 500 μm or less, the thickness T3 of the first transparent adhesive layer 95 does not become too thick, and the overall thickness of the image display device 60 can be reduced. Furthermore, by having a thickness T3 of the first transparent adhesive layer 95 of 300 μm or less, the overall thickness of the image display device 60 can be reduced even further.

[0080] The thickness T4 of the second transparent adhesive layer 96 may be, for example, 1 μm to 500 μm, 15 μm to 500 μm, 15 μm to 300 μm, 20 μm to 250 μm, and preferably 10 μm to 250 μm. By setting the thickness T4 of the second transparent adhesive layer 96 to 500 μm or less, the thickness T4 of the second transparent adhesive layer 96 will not become too thick, and the overall thickness of the image display device 60 can be reduced. Furthermore, by setting the thickness T4 of the second transparent adhesive layer 96 to 300 μm or less, the overall thickness of the image display device 60 can be further reduced.

[0081] As described above, the laminate 70 for the image display device includes an intermediate layer 80. The intermediate layer 80 is located between the wiring board 10 and the first transparent adhesive layer 95, and also between the wiring board 10 and the second transparent adhesive layer 96. In this way, the laminate 70 for the image display device includes an intermediate layer 80, making it difficult for the observer to see the wiring board 10 with the naked eye. In this embodiment, the wiring board 10 is covered by the intermediate layer 80.

[0082] The thickness T5 of the intermediate layer 80 is preferably 1 μm or more and 50 μm or less. A thickness T5 of 1 μm or more makes the wiring board 10 less visible to the naked eye. Furthermore, a thickness T5 of 50 μm or less prevents the intermediate layer 80 from becoming too thick, thus reducing the overall thickness of the image display device 60. In this specification, "thickness of the intermediate layer" refers to the distance from the first surface 11a of the substrate 11 to the Z-positive side of the intermediate layer 80 surface, or the distance from the second surface 11b of the substrate 11 to the Z-negative side of the intermediate layer 80 surface.

[0083] The refractive index of the intermediate layer 80 is preferably 1.40 or more and 1.60 or less, and more preferably 1.45 or more and 1.55 or less. By having a refractive index of 1.40 or more and 1.60 or less for the intermediate layer 80, the difference between the refractive index of the first transparent adhesive layer 95, the refractive index of the second transparent adhesive layer 96, or the refractive index of the substrate 11 and the refractive index of the intermediate layer 80 can be reduced.

[0084] The difference between the refractive index of the intermediate layer 80 and the refractive index of the first transparent adhesive layer 95 is preferably 0.1 or less. Furthermore, the difference between the refractive index of the intermediate layer 80 and the refractive index of the substrate 11 is preferably 0.1 or less. Moreover, the difference between the refractive index of the intermediate layer 80 and the refractive index of the second transparent adhesive layer 96 is preferably 0.1 or less.

[0085] In this way, by keeping the difference between the refractive index of the intermediate layer 80 and the refractive index of the first transparent adhesive layer 95 to 0.1 or less, the reflection of visible light at the interface B1 between the intermediate layer 80 and the first transparent adhesive layer 95 is suppressed, making it difficult for the observer to see the substrate 11 with the naked eye. Furthermore, by keeping the difference between the refractive index of the intermediate layer 80 and the refractive index of the substrate 11 to 0.1 or less, the reflection of visible light at the interface B2 between the intermediate layer 80 and the substrate 11 is suppressed, making it difficult for the observer to see the substrate 11 with the naked eye. In addition, by keeping the difference between the refractive index of the intermediate layer 80 and the refractive index of the second transparent adhesive layer 96 to 0.1 or less, the reflection of visible light at the interface B3 between the intermediate layer 80 and the second transparent adhesive layer 96 is suppressed, making it difficult for the observer to see the substrate 11 with the naked eye.

[0086] As described above, the laminate 70 for an image display device is composed of a wiring board 10, an intermediate layer 80, a first transparent adhesive layer 95 having a larger area than the substrate 11 of the wiring board 10, and a second transparent adhesive layer 96 having a larger area than the substrate 11. In this embodiment, such a laminate 70 for an image display device is also provided.

[0087] The cover glass (surface protective plate) 75 is disposed directly or indirectly on the first transparent adhesive layer 95. This cover glass 75 is a glass component that transmits light (visible light). The visible light transmittance of the cover glass 75 may be 85% or more, and preferably 90% or more. There is no particular upper limit to the visible light transmittance of the cover glass 75, but it may be, for example, 100% or less. The cover glass 75 is plate-shaped and may be rectangular in plan view. The thickness of the cover glass 75 may be, for example, 200 μm or more and 1000 μm or less, and preferably 300 μm or more and 700 μm or less. The length of the cover glass 75 in the longitudinal direction (Y direction) may be, for example, 20 mm or more and 500 mm or less, preferably 100 mm or more and 200 mm or less, and the length of the cover glass 75 in the short direction (X direction) may be 20 mm or more and 500 mm or less, preferably 50 mm or more and 100 mm or less. The planar shape of the cover glass 75 may be larger than the planar shapes of the wiring board 10 and the display device 61.

[0088] As shown in Figure 1, the image display device 60 is approximately rectangular in shape when viewed from above, with its longitudinal direction parallel to the Y direction and its transverse direction parallel to the X direction. The length L4 of the longitudinal direction (Y direction) of the image display device 60 can be selected within the range of, for example, 20 mm to 500 mm, preferably 100 mm to 200 mm, and the length L5 of the transverse direction (X direction) of the image display device 60 can be selected within the range of, for example, 20 mm to 500 mm, preferably 50 mm to 100 mm. The corners of the image display device 60 may also be rounded.

[0089] [Wiring board configuration] Next, the configuration of the wiring board will be described with reference to Figures 3 to 6. Figures 3 to 6 are diagrams showing the wiring board according to this embodiment.

[0090] As shown in Figure 3, the wiring board 10 according to this embodiment is used in the image display device 60 (see Figures 1 and 2) described above, and is located on the light-emitting surface 64 side of the display device 61, and is positioned between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. Such a wiring board 10 comprises a transparent substrate 11 and a mesh wiring layer 20 disposed on the substrate 11. A power supply unit 40 is electrically connected to the mesh wiring layer 20.

[0091] The substrate 11 is approximately rectangular in shape when viewed from above, with its longitudinal direction parallel to the Y direction and its transverse direction parallel to the X direction. The substrate 11 is transparent and approximately flat, and its thickness is approximately uniform throughout. The length L1 in the longitudinal direction (Y direction) of the substrate 11 can be selected from, for example, a range of 2 mm to 300 mm, a range of 10 mm to 200 mm, or a range of 100 mm to 200 mm. The length L2 in the transverse direction (X direction) of the substrate 11 can be selected from, for example, a range of 2 mm to 300 mm, a range of 3 mm to 100 mm, or a range of 50 mm to 100 mm. The corners of the substrate 11 may also be rounded.

[0092] The material of the substrate 11 can be any material that has transparency in the visible light region and electrical insulation properties. As the material for the substrate 11, it is preferable to use organic insulating materials such as polyester resins such as polyethylene terephthalate, acrylic resins such as polymethyl methacrylate, polycarbonate resins, polyimide resins, or polyolefin resins such as cycloolefin polymers, cellulose resins such as triacetylcellulose, or fluororesin materials such as PTFE and PFA. Alternatively, as the material for the substrate 11, organic insulating materials such as cycloolefin polymers (e.g., ZF-16 manufactured by Nippon Zeon Co., Ltd.) or polynorbornene polymers (manufactured by Sumitomo Bakelite Co., Ltd.) may be used. Furthermore, glass, ceramics, etc. can be appropriately selected as the material for the substrate 11 depending on the application. Although the illustration shows an example in which the substrate 11 is composed of a single layer, it is not limited to this, and may have a structure in which multiple substrates or layers are laminated. Also, the substrate 11 may be in the form of a film or a plate.

[0093] Furthermore, the dielectric loss tangent of the substrate 11 may be 0.002 or less, and preferably 0.001 or less. There is no particular lower limit for the dielectric loss tangent of the substrate 11, but it may be greater than 0. By having the dielectric loss tangent of the substrate 11 within the above range, the loss of gain (sensitivity) associated with the transmission and reception of electromagnetic waves (e.g., millimeter waves) transmitted and received by the mesh wiring layer 20 can be reduced, especially when the electromagnetic waves transmitted and received by the mesh wiring layer 20 are at high frequencies. There is no particular lower limit for the dielectric loss tangent of the substrate 11.

[0094] The relative permittivity of the substrate 11 is preferably between 2 and 10. Having a relative permittivity of 2 or higher allows for a wider range of material choices for the substrate 11. Furthermore, having a relative permittivity of 10 or lower reduces the loss of gain (sensitivity) associated with the transmission and reception of electromagnetic waves. That is, when the relative permittivity of the substrate 11 is high, the influence of the substrate 11's thickness on electromagnetic wave propagation increases. Also, if there is an adverse effect on electromagnetic wave propagation, the dielectric loss tangent of the substrate 11 increases, potentially leading to a greater loss of gain (sensitivity) associated with the transmission and reception of electromagnetic waves. In contrast, having a relative permittivity of 10 or lower reduces the influence of the substrate 11's thickness on electromagnetic wave propagation. Therefore, the loss of gain (sensitivity) associated with the transmission and reception of electromagnetic waves can be reduced. In particular, when the electromagnetic waves (e.g., millimeter waves) transmitted and received by the mesh wiring layer 20 are high-frequency, the loss of gain (sensitivity) associated with the transmission and reception of electromagnetic waves can be reduced.

[0095] The dielectric loss tangent and relative permittivity of the substrate 11 can be measured in accordance with IEC 62562. Specifically, first, a test specimen is prepared by cutting out a portion of the substrate 11 where the mesh wiring layer 20 is not formed. The dimensions of the test specimen are 10 mm to 20 mm in width and 50 mm to 100 mm in length. Next, the dielectric loss tangent or relative permittivity is measured in accordance with IEC 62562.

[0096] Furthermore, the substrate 11 is transparent. In this specification, "transparent" means that the transmittance of visible light (light rays with wavelengths of 400 nm to 700 nm) is 85% or more. The substrate 11 may have a transmittance of visible light (light rays with wavelengths of 400 nm to 700 nm) of 85% or more, but it is preferable that it is 90% or more. There is no particular upper limit to the transmittance of visible light of the substrate 11, but it may be, for example, 100% or less. By setting the transmittance of visible light of the substrate 11 within the above range, the transparency of the wiring board 10 is increased, and the display device 61 of the image display device 60 can be made easier to see. Visible light refers to light rays with wavelengths of 400 nm to 700 nm. Furthermore, a visible light transmittance of 85% or higher means that when the absorbance of the substrate 11 is measured using a known spectrophotometer (for example, a spectrometer manufactured by JASCO Corporation: V-670), the transmittance is 85% or higher in the entire wavelength range from 400 nm to 700 nm.

[0097] In this embodiment, the mesh wiring layer 20 consists of an antenna pattern that functions as an antenna. In Figure 3, one mesh wiring layer 20 is formed on the substrate 11. Also, as shown in Figure 3, the mesh wiring layer 20 does not have to be present over the entire surface of the substrate 11, but may be present only in a part of the substrate 11. This mesh wiring layer 20 corresponds to a predetermined frequency band. That is, the mesh wiring layer 20 has a length (length in the Y direction) L a The length corresponds to a specific frequency band. Note that the lower the frequency band, the longer the mesh wiring layer L 20. aThe length will increase. The mesh wiring layer 20 may correspond to any of the following: a telephone antenna, a WiFi antenna, a 3G antenna, a 4G antenna, a 5G antenna, an LTE antenna, a Bluetooth® antenna, an NFC antenna, a millimeter wave antenna, etc. Multiple mesh wiring layers 20 may be formed on the substrate 11. In this case, the lengths of the multiple mesh wiring layers 20 may differ from each other, and each may correspond to a different frequency band. Alternatively, if the wiring board 10 does not have radio wave transmission and reception functions, each mesh wiring layer 20 may perform functions such as hovering (a function that allows operation without the user directly touching the display), fingerprint authentication, a heater, noise reduction (shielding), etc.

[0098] The mesh wiring layer 20 has a base end portion (transmission portion) 20a on the power supply unit 40 side and a tip end portion (transmitting / receiving portion) 20b connected to the base end portion 20a. The base end portion 20a and the tip end portion 20b each have a roughly rectangular shape in plan view. In this case, the length (Y-direction distance) of the tip end portion 20b is longer than the length (Y-direction distance) of the base end portion 20a, and the width (X-direction distance) of the tip end portion 20b is wider than the width (X-direction distance) of the base end portion 20a.

[0099] The mesh wiring layer 20 has its longitudinal direction parallel to the Y direction and its transverse direction parallel to the X direction. The length L of the longitudinal direction (Y direction) of the mesh wiring layer 20. a For example, it can be selected within a range of 2 mm to 100 mm, or a range of 3 mm to 100 mm. The width W in the short direction (X direction) of the mesh wiring layer 20 (tip end portion 20b) a For example, it can be selected within a range of 1 mm to 10 mm. In particular, the mesh wiring layer 20 may be a millimeter-wave antenna, and if the mesh wiring layer 20 is a millimeter-wave antenna, the length L of the mesh wiring layer 20 aThe mesh wiring layer can be selected within a range of 1 mm to 10 mm, more preferably 1.5 mm to 5 mm. Note that while Figure 3 shows the shape when the mesh wiring layer 20 functions as a monopole antenna, it is not limited to this and can also be shaped like a dipole antenna, loop antenna, slot antenna, microstrip antenna, patch antenna, etc.

[0100] Each mesh wiring layer 20 has metal wires formed in a grid or mesh shape, and has a repeating pattern in the X and Y directions. That is, the mesh wiring layer 20 has a pattern shape composed of a portion extending in the X direction (second direction wiring 22) and a portion extending in the Y direction (first direction wiring 21).

[0101] As shown in Figure 4, the mesh wiring layer 20 includes a plurality of first directional wirings (antenna wirings) 21 that function as antennas, and a plurality of second directional wirings (antenna connecting wirings) 22 that connect the plurality of first directional wirings 21. Specifically, the plurality of first directional wirings 21 and the plurality of second directional wirings 22 together form a grid or mesh shape. Each first directional wiring 21 extends in the direction corresponding to the antenna frequency band (longitudinal direction, Y direction), and each second directional wiring 22 extends in the direction perpendicular to the first directional wiring 21 (width direction, X direction). The first directional wiring 21 has a length L corresponding to a predetermined frequency band. a (See Figure 3 for the length of the mesh wiring layer 20 described above) it primarily functions as an antenna. On the other hand, the second directional wiring 22 connects these first directional wirings 21 to each other, thereby preventing problems such as the first directional wiring 21 being disconnected or the first directional wiring 21 losing electrical connection with the power supply unit 40.

[0102] In the mesh wiring layer 20, multiple openings 23 are formed by being surrounded by adjacent first-directional wirings 21 and adjacent second-directional wirings 22. Furthermore, the first-directional wirings 21 and second-directional wirings 22 are arranged at equal intervals from each other. That is, the multiple first-directional wirings 21 are arranged at equal intervals from each other, and their pitch P1 may be in the range of, for example, 0.01 mm to 1 mm. Similarly, the multiple second-directional wirings 22 are arranged at equal intervals from each other, and their pitch P2 may be in the range of, for example, 0.01 mm to 1 mm. In this way, because the multiple first-directional wirings 21 and multiple second-directional wirings 22 are arranged at equal intervals, there is no variation in the size of the openings 23 within the mesh wiring layer 20, making the mesh wiring layer 20 difficult to see with the naked eye. In addition, the pitch P1 of the first-directional wirings 21 is equal to the pitch P2 of the second-directional wirings 22. Therefore, each opening 23 is approximately square in plan view, and the transparent substrate 11 is exposed through each opening 23. Therefore, by increasing the area of ​​each opening 23, the overall transparency of the wiring board 10 can be increased. The length L3 of one side of each opening 23 may be, for example, in the range of 0.01 mm to 1 mm. Although each first directional wiring 21 and each second directional wiring 22 are orthogonal to each other, they are not limited to this and may intersect each other at an acute or obtuse angle. For example, the first directional wiring 21 and the second directional wiring 22 may intersect diagonally (not at a right angle), and each opening 23 may be formed in a rhombus shape in plan view. The first directional wiring 21 and the second directional wiring 22 do not have to be parallel to either the X direction or the Y direction. Alternatively, either the first directional wiring 21 or the second directional wiring 22 may be parallel to either the X direction or the Y direction. Furthermore, while it is preferable for the shape of the opening 23 to be the same shape and size across the entire surface, it is not necessary to make it uniform across the entire surface, for example, by varying it in different locations.

[0103] As shown in Figure 5, each first-directional wiring 21 has a roughly rectangular or roughly square cross-section perpendicular to its longitudinal direction (cross-section in the X direction). In this case, the cross-sectional shape of the first-directional wiring 21 is roughly uniform along its longitudinal direction (Y direction). Also, as shown in Figure 6, the shape of the cross-section perpendicular to the longitudinal direction (cross-section in the Y direction) of each second-directional wiring 22 is roughly rectangular or roughly square, and is roughly the same as the cross-sectional shape (cross-section in the X direction) of the first-directional wiring 21 described above. In this case, the cross-sectional shape of the second-directional wiring 22 is roughly uniform along its longitudinal direction (X direction). The cross-sectional shapes of the first-directional wiring 21 and the second-directional wiring 22 do not necessarily have to be roughly rectangular or roughly square; for example, they may be roughly trapezoidal in shape, where the front side (positive Z direction side) is narrower than the back side (negative Z direction side), or they may have curved sides on both sides in the longitudinal direction.

[0104] In this embodiment, the line width W1 (length in the X direction, see Figure 5) of the first direction wiring 21 and the line width W2 (length in the Y direction, see Figure 6) of the second direction wiring 22 are not particularly limited and can be appropriately selected depending on the application. For example, the line width W1 of the first direction wiring 21 can be selected in the range of 0.1 μm to 5.0 μm, and is preferably 0.2 μm to 2.0 μm. Similarly, the line width W2 of the second direction wiring 22 can be selected in the range of 0.1 μm to 5.0 μm, and is preferably 0.2 μm to 2.0 μm. Furthermore, the height H1 (length in the Z direction, see Figure 5) of the first direction wiring 21 and the height H2 (length in the Z direction, see Figure 6) of the second direction wiring 22 are not particularly limited and can be appropriately selected depending on the application. The height H1 of the first directional wiring 21 and the height H2 of the second directional wiring 22 can each be selected within a range of, for example, 0.1 μm to 5.0 μm, and preferably between 0.2 μm and 2.0 μm.

[0105] The material of the first directional wiring 21 and the second directional wiring 22 may be any conductive metallic material. In this embodiment, the material of the first directional wiring 21 and the second directional wiring 22 is copper, but it is not limited to this. For example, the material of the first directional wiring 21 and the second directional wiring 22 may be a metallic material (including alloys) such as gold, silver, copper, platinum, tin, aluminum, iron, or nickel. The first directional wiring 21 and the second directional wiring 22 may also be a plated layer formed by electroplating.

[0106] The overall aperture ratio At of the mesh wiring layer 20 may be, for example, in the range of 87% or more and less than 100%. By setting the overall aperture ratio At of the wiring substrate 10 within this range, the conductivity and transparency of the wiring substrate 10 can be ensured. The aperture ratio refers to the ratio (%) of the area of ​​the opening region (the area where there are no metal parts such as the first direction wiring 21 and the second direction wiring 22, and the substrate 11 is exposed) to a unit area of ​​a predetermined region (for example, the entire area of ​​the mesh wiring layer 20).

[0107] Although not shown in the figures, a protective layer may be formed on the first surface 11a of the substrate 11 so as to cover the mesh wiring layer 20. The protective layer protects the mesh wiring layer 20 and is formed so as to cover at least the mesh wiring layer 20 of the substrate 11. As the material for the protective layer, a colorless, transparent insulating resin such as polymethyl (meth)acrylate, polyethyl (meth)acrylate, acrylic resins and their modified resins and copolymers, polyester, polyvinyl alcohol, polyvinyl acetate, polyvinyl acetal, polyvinyl butyral, polyvinyl resins and their copolymers, polyurethane, epoxy resin, polyamide, or chlorinated polyolefin can be used.

[0108] Referring again to Figure 3, the power supply unit 40 is electrically connected to the mesh wiring layer 20. This power supply unit 40 consists of a roughly rectangular conductive thin plate-like member. The longitudinal direction of the power supply unit 40 is parallel to the X direction, and the short direction of the power supply unit 40 is parallel to the Y direction. The power supply unit 40 is located at the longitudinal end (negative Y-direction end) of the substrate 11. The material of the power supply unit 40 can be a metallic material (including alloys) such as gold, silver, copper, platinum, tin, aluminum, iron, or nickel. When the wiring board 10 is incorporated into the image display device 60 (see Figures 1 and 2), this power supply unit 40 is electrically connected to the communication module 63 of the image display device 60. Although the power supply unit 40 is provided on the first surface 11a of the substrate 11, it is not limited to this, and part or all of the power supply unit 40 may be located outside the periphery of the substrate 11. Furthermore, by flexibly forming the power supply unit 40, it may wrap around to the side or back of the image display device 60 and be electrically connected on the side or back.

[0109] [Manufacturing method for wiring boards] Next, a method for manufacturing the laminated image display device 70 according to this embodiment will be described with reference to Figures 7(a)-(f) and 8(a)-(c). Figures 7(a)-(f) and 8(a)-(c) are cross-sectional views showing the method for manufacturing the laminated image display device 70 according to this embodiment.

[0110] As shown in Figure 7(a), a transparent substrate 11 is prepared.

[0111] Next, a mesh wiring layer 20 is formed on the substrate 11, which includes a plurality of first directional wirings 21 and a plurality of second directional wirings 22 that connect the plurality of first directional wirings 21.

[0112] In this case, first, as shown in Figure 7(b), a metal foil 51 is laminated over substantially the entire surface 11a of the substrate 11. In this embodiment, the thickness of the metal foil 51 may be 0.1 μm or more and 5.0 μm or less. In this embodiment, the metal foil 51 may contain copper.

[0113] Next, as shown in Figure 7(c), a photocurable insulating resist 52 is supplied to substantially the entire surface of the metal foil 51. Examples of this photocurable insulating resist 52 include organic resins such as acrylic resin and epoxy resin.

[0114] Next, as shown in Figure 7(d), the insulating layer 54 is formed by photolithography. In this case, the photocurable insulating resist 52 is patterned by photolithography to form the insulating layer 54 (resist pattern). At this time, the insulating layer 54 is formed so that the metal foil 51 corresponding to the first directional wiring 21 and the second directional wiring 22 is exposed.

[0115] Next, as shown in Figure 7(e), the metal foil 51 located on the first surface 11a of the substrate 11, in the portion not covered by the insulating layer 54, is removed. In this process, the metal foil 51 is etched so that the first surface 11a of the substrate 11 is exposed by performing a wet treatment using ferric chloride, cupric chloride, strong acids such as sulfuric acid and hydrochloric acid, persulfates, hydrogen peroxide, aqueous solutions thereof, or combinations thereof.

[0116] Next, as shown in Figure 7(f), the insulating layer 54 is removed. In this case, the insulating layer 54 on the metal foil 51 is removed by wet treatment using a permanganate solution, N-methyl-2-pyrrolidone, an acid or alkaline solution, or by dry treatment using oxygen plasma.

[0117] In this way, a wiring board 10 is obtained, which has a substrate 11 and a mesh wiring layer 20 provided on the substrate 11. In this case, the mesh wiring layer 20 includes first-direction wiring 21 and second-direction wiring 22. Subsequently, the wiring board 10 is cut to the desired size.

[0118] Next, the first transparent adhesive layer 95, the wiring board 10, and the second transparent adhesive layer 96 are laminated together. First, as shown in Figure 8(a), an OCA sheet 90 is prepared, which includes, for example, a release film 91 made of polyethylene terephthalate (PET) and an OCA layer 92 (first transparent adhesive layer 95 or second transparent adhesive layer 96) laminated on the release film 91. At this time, the OCA layer 92 may be a layer obtained by coating the release film 91 with a liquid curable adhesive layer composition containing a polymerizable compound and curing it using, for example, ultraviolet light (UV). This curable adhesive layer composition contains a polar group-containing monomer.

[0119] Next, as shown in Figure 8(b), the OCA layer 92 of the OCA sheet 90 is bonded to the wiring board 10.

[0120] Subsequently, as shown in Figure 8(c), the release film 91 is peeled off from the OCA layer 92 of the OCA sheet 90 bonded to the wiring board 10, thereby obtaining the first transparent adhesive layer 95 (OCA layer 92), the wiring board 10, and the second transparent adhesive layer 96 (OCA layer 92) which are laminated together.

[0121] As described above, the curable adhesive layer composition constituting the OCA layer 92 contains a polar group-containing monomer. Therefore, when the OCA layer 92 of the OCA sheet 90 is bonded to the wiring board 10, a portion of the OCA layer 92 and a portion of the substrate 11 of the wiring board 10 melt together, forming an intermediate layer 80 that covers the wiring board 10.

[0122] In this way, a laminate 70 for an image display device is obtained, comprising a first transparent adhesive layer 95, a second transparent adhesive layer 96, a wiring substrate 10, and an intermediate layer 80.

[0123] Subsequently, by stacking the display device 61 on the image display device laminate 70, an image display device 60 is obtained, comprising the image display device laminate 70 and the display device 61 stacked on the image display device laminate 70.

[0124] [Operation of this embodiment] Next, we will describe the operation of this embodiment, which has the above configuration.

[0125] As shown in Figures 1 and 2, the wiring board 10 is incorporated into an image display device 60 having a display device 61. At this time, the wiring board 10 is placed on the display device 61. The mesh wiring layer 20 of the wiring board 10 is electrically connected to the communication module 63 of the image display device 60 via the power supply unit 40. In this way, radio waves of a predetermined frequency can be transmitted and received via the mesh wiring layer 20, and communication can be performed using the image display device 60.

[0126] In this embodiment, a portion of the substrate 11 is positioned in a portion of the area between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. Furthermore, the intermediate layer 80 is located between the wiring board 10 and the first transparent adhesive layer 95, and also between the wiring board 10 and the second transparent adhesive layer 96. This makes it possible to suppress the reflection of visible light at the interface between the substrate 11 and the first transparent adhesive layer 95, and at the interface between the substrate 11 and the second transparent adhesive layer 96. As a result, when an observer observes the image display device 60 from the light-emitting surface 64 side, the substrate 11 of the wiring board 10 becomes difficult to see with the naked eye. In particular, when the first transparent adhesive layer 95 and the second transparent adhesive layer 96 each have a larger area than the substrate 11, the outer edge of the substrate 11 can be made difficult to see with the naked eye, and the observer can avoid recognizing the presence of the substrate 11.

[0127] Furthermore, according to this embodiment, the wiring board 10 comprises a substrate 11 and a mesh wiring layer 20 disposed on the substrate 11. The substrate 11 is transparent. In addition, the mesh wiring layer 20 has a conductive portion that forms an opaque conductive layer and a mesh-like pattern with numerous openings. Therefore, the transparency of the wiring board 10 is ensured. As a result, when the wiring board 10 is placed on the display device 61, the display device 61 can be viewed through the openings 23 of the mesh wiring layer 20, and the visibility of the display device 61 is not obstructed.

[0128] [Differentiation] Next, a modified example of the laminated image display device 70 will be described.

[0129] (First variation) Figure 9 shows a first modified example of the laminate for an image display device. The modified example shown in Figure 9 differs in that the intermediate layer 80 is not located between the wiring substrate 10 and the second transparent adhesive layer 96, but the other components are substantially the same as those shown in Figures 1 to 8 described above. In Figure 9, the same reference numerals are used for parts that are the same as those shown in Figures 1 to 8, and detailed explanations are omitted.

[0130] In the first modified example shown in Figure 9, the intermediate layer 80 is not located between the wiring substrate 10 and the second transparent adhesive layer 96. In this modified example, the intermediate layer 80 is located only between the wiring substrate 10 and the first transparent adhesive layer 95. In this case, for example, by using a curable adhesive layer composition that does not contain polar group-containing monomers in the OCA layer 92 constituting the second transparent adhesive layer 96, it is possible to avoid providing the intermediate layer 80 between the wiring substrate 10 and the second transparent adhesive layer 96.

[0131] In this modified example, the reflection of visible light at the interface between the substrate 11 and the first transparent adhesive layer 95 can be suppressed. As a result, when an observer views the image display device 60 from the light-emitting surface 64 side, the substrate 11 of the wiring board 10 becomes difficult to see with the naked eye.

[0132] (Second variation) Figure 10 shows a first modified example of the laminate for an image display device. The modified example shown in Figure 10 differs in that the intermediate layer 80 is not located between the wiring substrate 10 and the first transparent adhesive layer 95, but the other configurations are substantially the same as those shown in Figures 1 to 9 described above. In Figure 10, the same reference numerals are used for parts that are the same as those shown in Figures 1 to 9, and detailed explanations are omitted.

[0133] In the second modified example shown in Figure 10, the intermediate layer 80 is not located between the wiring substrate 10 and the first transparent adhesive layer 95. In this modified example, the intermediate layer 80 is located only between the wiring substrate 10 and the second transparent adhesive layer 96. In this case, for example, by using a curable adhesive layer composition that does not contain polar group-containing monomers in the OCA layer 92 constituting the first transparent adhesive layer 95, it is possible to avoid providing the intermediate layer 80 between the wiring substrate 10 and the first transparent adhesive layer 95.

[0134] In this modified example, the reflection of visible light at the interface between the substrate 11 and the second transparent adhesive layer 96 can be suppressed. This makes it difficult to see the substrate 11 of the wiring board 10 with the naked eye.

[0135] (Third variation) Figure 11 shows a modified example of a laminate for an image display device. The modified example shown in Figure 11 differs in that the interface B1 between the intermediate layer 80 and the first transparent adhesive layer 95 is absent, but the other components are substantially the same as those shown in Figures 1 to 10 described above. In Figure 11, the same reference numerals are used for parts that are the same as those shown in Figures 1 to 10, and detailed explanations are omitted.

[0136] In the modified example shown in Figure 11, the interface B1 between the intermediate layer 80 and the first transparent adhesive layer 95, the interface B2 between the intermediate layer 80 and the substrate 11, and the interface B3 between the intermediate layer 80 and the second transparent adhesive layer 96 are absent. This suppresses the reflection of visible light between the first transparent adhesive layer 95, the substrate 11, the second transparent adhesive layer 96, and the intermediate layer 80, making it difficult to see the substrate 11 with the naked eye. In this specification, "absence of an interface" means that the interface cannot be seen when observed using an electron microscope (for example, a transmission electron microscope (TEM)).

[0137] As described above, the intermediate layer 80 is formed by the melting of a portion of the OCA layer 92 and a portion of the substrate 11 of the wiring board 10. Therefore, by mixing a portion of the OCA layer 92 and a portion of the substrate 11 of the wiring board 10 in a gradient manner, an intermediate layer 80 is obtained in which the aforementioned interfaces B1 to B3 do not exist.

[0138] In this modified example, the refractive index of the intermediate layer 80 is changed such that the difference between the refractive index of the intermediate layer 80 and the refractive index of the first transparent adhesive layer 95 gradually decreases as it approaches the first transparent adhesive layer 95. Furthermore, the refractive index of the intermediate layer 80 is changed such that the difference between the refractive index of the intermediate layer 80 and the refractive index of the substrate 11 gradually decreases as it approaches the substrate 11. In addition, the refractive index of the intermediate layer 80 is changed such that the difference between the refractive index of the intermediate layer 80 and the refractive index of the second transparent adhesive layer 96 gradually decreases as it approaches the second transparent adhesive layer 96. This suppresses the reflection of visible light between the first transparent adhesive layer 95 and the intermediate layer 80, between the substrate 11 and the intermediate layer 80, and between the second transparent adhesive layer 96 and the intermediate layer 80, making it difficult for the observer to see the substrate 11 with the naked eye.

[0139] In this way, the absence of interfaces B1 to B3 suppresses the reflection of visible light between the first transparent adhesive layer 95 and the intermediate layer 80, between the substrate 11 and the intermediate layer 80, and between the second transparent adhesive layer 96 and the intermediate layer 80, making it difficult for the observer to see the substrate 11 with their naked eye.

[0140] Next, we will describe a modified example of a wiring board.

[0141] (First variation) Figures 12 and 13 show a first modified example of the wiring board. The modified example shown in Figures 12 and 13 differs in that a dummy wiring layer 30 is provided around the mesh wiring layer 20, while the other configurations are substantially the same as those shown in Figures 1 to 11 described above. In Figures 12 and 13, the same reference numerals are used for parts that are the same as those shown in Figures 1 to 11, and detailed explanations are omitted.

[0142] In the wiring board 10 shown in Figure 12, a dummy wiring layer 30 is provided around the mesh wiring layer 20. Unlike the mesh wiring layer 20, this dummy wiring layer 30 does not substantially function as an antenna.

[0143] As shown in Figure 12, the dummy wiring layer 30 is composed of repeating dummy wiring 30a having a predetermined unit pattern shape. That is, the dummy wiring layer 30 contains multiple dummy wiring 30a of the same shape, and each dummy wiring 30a is electrically independent from the mesh wiring layer 20 (first direction wiring 21 and second direction wiring 22). Furthermore, the multiple dummy wiring 30a are regularly arranged throughout the entire area of ​​the dummy wiring layer 30. The multiple dummy wiring 30a are spaced apart from each other in the planar direction and are arranged to protrude from the substrate 11. That is, each dummy wiring 30a is electrically independent from the mesh wiring layer 20, the power supply unit 40, and other dummy wiring 30a. Each dummy wiring 30a is approximately L-shaped in plan view.

[0144] In this case, the dummy wiring 30a has a shape in which a part of the unit pattern shape of the mesh wiring layer 20 (see Figure 4) described above is missing. This makes it difficult to visually recognize the difference between the mesh wiring layer 20 and the dummy wiring layer 30, and makes the mesh wiring layer 20 placed on the substrate 11 less visible. The aperture ratio of the dummy wiring layer 30 may be the same as or different from that of the mesh wiring layer 20, but it is preferable that it is close to the aperture ratio of the mesh wiring layer 20.

[0145] In this way, by arranging a dummy wiring layer 30 electrically independent of the mesh wiring layer 20 around the mesh wiring layer 20, the outer edge of the mesh wiring layer 20 can be obscured. As a result, the mesh wiring layer 20 can be made less visible on the surface of the image display device 60, making it difficult for users of the image display device 60 to recognize the mesh wiring layer 20 with the naked eye.

[0146] (Second variation) Figures 14 and 15 show a second modified example of the wiring board. The modified examples shown in Figures 14 and 15 differ in that multiple dummy wiring layers 30A and 30B with different aperture ratios are provided around the mesh wiring layer 20, while the other configurations are substantially the same as those shown in Figures 1 to 13 described above. In Figures 14 and 15, the same reference numerals are used for parts that are the same as those shown in Figures 1 to 13, and detailed explanations are omitted.

[0147] In the wiring board 10 shown in Figure 14, multiple (in this case, two) dummy wiring layers 30A and 30B (first dummy wiring layer 30A and second dummy wiring layer 30B) with different aperture ratios are provided around the mesh wiring layer 20. Specifically, the first dummy wiring layer 30A is arranged around the mesh wiring layer 20, and the second dummy wiring layer 30B is arranged around the first dummy wiring layer 30A. Unlike the mesh wiring layer 20, these dummy wiring layers 30A and 30B do not substantially function as antennas.

[0148] As shown in Figure 15, the first dummy wiring layer 30A is composed of repeating dummy wiring 30a1 having a predetermined unit pattern shape. The second dummy wiring layer 30B is composed of repeating dummy wiring 30a2 having a predetermined unit pattern shape. That is, dummy wiring layers 30A and 30B each contain multiple dummy wirings 30a1 and 30a2 of the same shape, and each dummy wiring 30a1 and 30a2 is electrically independent from the mesh wiring layer 20. Furthermore, the dummy wirings 30a1 and 30a2 are regularly arranged throughout the entire area of ​​dummy wiring layers 30A and 30B, respectively. Each dummy wiring 30a1 and 30a2 is spaced apart from each other in the planar direction and is positioned protruding from the substrate 11. Each dummy wiring 30a1 and 30a2 is electrically independent from the mesh wiring layer 20, the power supply unit 40, and other dummy wirings 30a1 and 30a2. Furthermore, each dummy wiring 30a1 and 30a2 is roughly L-shaped in plan view.

[0149] In this case, the dummy wiring 30a1 and 30a2 have a shape in which a part of the unit pattern shape of the mesh wiring layer 20 (see Figure 4) described above is missing. This makes it difficult to visually recognize the difference between the mesh wiring layer 20 and the first dummy wiring layer 30A, and the difference between the first dummy wiring layer 30A and the second dummy wiring layer 30B, thereby making the mesh wiring layer 20 placed on the substrate 11 less visible. The aperture ratio of the first dummy wiring layer 30A is greater than that of the mesh wiring layer 20, and the aperture ratio of the first dummy wiring layer 30A is greater than that of the second dummy wiring layer 30B.

[0150] Furthermore, the area of ​​each dummy wire 30a1 in the first dummy wiring layer 30A is larger than the area of ​​each dummy wire 30a2 in the second dummy wiring layer 30B. In this case, the line width of each dummy wire 30a1 is the same as the line width of each dummy wire 30a2, but this is not limited to this, and the line width of each dummy wire 30a1 may be thicker than the line width of each dummy wire 30a2. In addition, three or more dummy wiring layers with different aperture ratios may be provided. In this case, it is preferable that the aperture ratio of each dummy wiring layer gradually increases from those closer to the mesh wiring layer 20 to those further away.

[0151] In this way, by arranging dummy wiring layers 30A and 30B that are electrically independent from the mesh wiring layer 20, the outer edge of the mesh wiring layer 20 can be made more indistinct. As a result, the mesh wiring layer 20 can be made less visible on the surface of the image display device 60, making it difficult for users of the image display device 60 to recognize the mesh wiring layer 20 with the naked eye.

[0152] (Third variation) Figure 16 shows a third modified example of the wiring board. The modified example shown in Figure 16 differs in the planar shape of the mesh wiring layer 20, but the other components are substantially the same as those shown in Figures 1 to 15 described above. In Figure 16, the same reference numerals are used for parts that are the same as those shown in Figures 1 to 15, and detailed explanations are omitted.

[0153] Figure 16 is an enlarged plan view showing a modified mesh wiring layer 20. In Figure 16, the first directional wiring 21 and the second directional wiring 22 intersect diagonally (not at a right angle), and each opening 23 is formed in a rhombus shape in plan view. Neither the first directional wiring 21 nor the second directional wiring 22 are parallel to either the X or Y direction, but either one of the first directional wiring 21 or the second directional wiring 22 may be parallel to either the X or Y direction.

[0154] [Examples] Next, a specific example of this embodiment will be described.

[0155] (Example A1) A laminate for an image display device having the configuration shown in Figure 2 was fabricated. In this case, a polyethylene terephthalate substrate with a thickness of 50 μm was used as the substrate for the wiring board. Furthermore, an acrylic resin OCA layer with a thickness of 50 μm was used as the first transparent adhesive layer and the second transparent adhesive layer. Here, the acrylic resin used for the OCA layer contained 0.1% or more by weight of ethylhexyl acrylate monomer.

[0156] Furthermore, the refractive index of the intermediate layer was 1.555. The refractive index of the first transparent adhesive layer was 1.55. The refractive index of the substrate was 1.57. Furthermore, the refractive index of the second transparent adhesive layer was 1.55. In this case, the refractive index was measured using a refractometer (a so-called Abbe refractometer) (NAR-1T SOLID, manufactured by Atago Co., Ltd.) based on Method A of JIS K-7142.

[0157] Next, an invisibility test was conducted. In the invisibility test, when observed at angles of 30°, 60°, and 90° relative to the surface of the substrate in a typical visual inspection environment, substrates whose outer edges could not be visually identified at all were judged as "A (excellent)". Furthermore, when observed at angles of 30°, 60°, and 90° relative to the surface of the substrate in a typical visual inspection environment, substrates whose outer edges could not be visually identified were judged as "B (good)". In addition, when observed at angles of 30°, 60°, and 90° relative to the surface of the substrate in a typical visual inspection environment, substrates whose outer edges could be visually identified were judged as "C (poor)".

[0158] (Example A2) An image display device laminate was fabricated in the same manner as in Example A1, except that the laminate had the configuration shown in Figure 9, and an invisibility test was performed.

[0159] (Example A3) An image display device laminate was fabricated in the same manner as in Example A1, except that the laminate had the configuration shown in Figure 10, and an invisibility test was performed.

[0160] (Example A4) An image display device laminate was fabricated in the same manner as in Example A1, except that the laminate had the configuration shown in Figure 11, and after laminating the substrate with the first transparent adhesive layer and the second transparent adhesive layer, the image display device laminate was placed in a 60°C oven and left for 72 hours. An invisibility test was then performed.

[0161] (Reference example A1) A laminate for an image display device was fabricated in the same manner as in Example A1, except that the refractive index of the intermediate layer was 1.64, and acrylic resin OCA layers with a refractive index of 1.65 were used as the first and second transparent adhesive layers, and an invisibility test was performed.

[0162] The results are shown in Tables 1 and 2.

[0163] [Table 1]

[0164] [Table 2]

[0165] As a result, as shown in Table 1, the laminates for image display devices according to Examples A1 to A4 could not be visually identified at all when observed at angles of 30°, 60°, and 90° relative to the substrate surface in a typical visual inspection environment, and the outer edge of the wiring board could not be visually identified. Similarly, in the laminate for image display devices according to Reference Example A1, the outer edge of the wiring board could not be visually identified when observed at angles of 30°, 60°, and 90° relative to the substrate surface in a typical visual inspection environment. Therefore, it was found that the laminates for image display devices according to this embodiment can be made difficult to see with the naked eye.

[0166] (Second Embodiment) Next, a second embodiment will be described with reference to Figures 17 to 19. Figures 17 to 19 show the second embodiment. In Figures 17 to 19, the same reference numerals are used for parts that are the same as those in the first embodiment shown in Figures 1 to 16, and detailed descriptions may be omitted.

[0167] [Image display device configuration] First, the configuration of the image display device according to this embodiment will be described with reference to Figures 17 and 18.

[0168] As shown in Figures 17 and 18, the image display device 60 according to this embodiment comprises an image display device laminate 70 and a display device (display) 61 laminated on the image display device laminate 70. The image display device laminate 70 comprises a first transparent adhesive layer (first adhesive layer) 95, a second transparent adhesive layer (second adhesive layer) 96, and a wiring board 10. The wiring board 10 comprises a substrate 11 and a mesh wiring layer 20. The substrate 11 includes a first surface 11a, a second surface 11b located opposite the first surface 11a, and a third surface 11c located between the first surface 11a and the second surface 11b. The mesh wiring layer 20 is arranged on the first surface 11a of the substrate 11. A power supply unit 40 is electrically connected to the mesh wiring layer 20. A communication module 63 is arranged on the negative Z-direction side relative to the display device 61. The image display device laminate 70, the display device 61, and the communication module 63 are housed within the housing 62. Furthermore, in this embodiment, module 80A is composed of a wiring board 10 and a power supply line 85 electrically connected to the wiring board 10. In other words, module 80A comprises the aforementioned wiring board 10 and a power supply line 85 electrically connected to the power supply unit 40. When module 80A is incorporated into the image display device 60 having the display device 61, the power supply unit 40 of the wiring board 10 is electrically connected to the communication module 63 of the image display device 60 via the power supply line 85.

[0169] In this embodiment, in the laminate 70 for image display devices, the difference between the refractive index of the substrate 11 and the refractive index of the first transparent adhesive layer 95 is 0.1 or less, and preferably 0.05 or less. Furthermore, the difference between the refractive index of the second transparent adhesive layer 96 and the refractive index of the substrate 11 is 0.1 or less, and preferably 0.05 or less. Moreover, the difference between the refractive index of the first transparent adhesive layer 95 and the refractive index of the second transparent adhesive layer 96 is preferably 0.1 or less, and more preferably 0.05 or less. For example, if the material of the first transparent adhesive layer 95 and the material of the second transparent adhesive layer 96 are acrylic resins (refractive index 1.49), the refractive index of the substrate 11 is set to 1.39 or more and 1.59 or less. Examples of such materials include fluororesins, silicone resins, polyolefin resins, polyester resins, acrylic resins, polycarbonate resins, polyimide resins, cellulose resins, and the like.

[0170] In this way, by keeping the difference between the refractive index of the substrate 11 and the refractive index of the first transparent adhesive layer 95 to 0.1 or less, the reflection of visible light at the interface B5 between the substrate 11 and the first transparent adhesive layer 95 is suppressed, making it difficult for the observer to see the substrate 11 with the naked eye. Furthermore, by keeping the difference between the refractive index of the second transparent adhesive layer 96 and the refractive index of the substrate 11 to 0.1 or less, the reflection of visible light at the interface B6 between the second transparent adhesive layer 96 and the substrate 11 is suppressed, making it difficult for the observer to see the substrate 11 with the naked eye. Moreover, by keeping the difference between the refractive index of the first transparent adhesive layer 95 and the refractive index of the second transparent adhesive layer 96 to 0.1 or less, the reflection of visible light at the interface B4 between the first transparent adhesive layer 95 and the second transparent adhesive layer 96 is suppressed, making it difficult for the observer to see the first transparent adhesive layer 95 and the second transparent adhesive layer 96 with the naked eye.

[0171] As described above, the substrate 11 includes a first surface 11a, a second surface 11b located opposite the first surface 11a, and a third surface 11c located between the first surface 11a and the second surface 11b. In this case, as shown in Figure 18, the third surface 11c of the substrate 11 is covered by a first adhesive layer 95 and a second adhesive layer 96.

[0172] In this embodiment, the surface roughness Ra of the third surface 11c is 0.005 μm or more and 0.5 μm or less. Here, surface roughness Ra refers to the arithmetic mean roughness and is measured according to JIS B 0601-2013. By having a surface roughness Ra of 0.005 μm or more for the third surface 11c, the adhesion between the OCA layer 92 and the third surface 11c can be improved. Furthermore, by having a surface roughness Ra of 0.5 μm or less for the third surface 11c, it is possible to suppress the entry of air between the first transparent adhesive layer 95 or the second transparent adhesive layer 96 and the third surface 11c. That is, as will be described later, when the wiring board 10 is sandwiched by the OCA layer 92 (see Figure 19(b)), it is possible to easily release the air that has entered between the OCA layer 92 and the third surface 11c to the outside. The surface roughness Ra of the third surface 11c can be measured, for example, using a laser microscope (VK-X250, manufactured by Keyence Corporation).

[0173] As described above, the laminate 70 for an image display device is composed of a wiring board 10, a first transparent adhesive layer 95 having a larger area than the substrate 11 of the wiring board 10, and a second transparent adhesive layer 96 having a larger area than the substrate 11. In this embodiment, such a laminate 70 for an image display device is also provided.

[0174] [Manufacturing method for laminated material for image display device] Next, a method for manufacturing the laminated image display device 70 according to this embodiment will be described.

[0175] First, the wiring board 10 is manufactured, for example, by the method shown in Figures 7(a)-(f). Then, the wiring board 10 is cut to the desired size. At this time, the wiring board 10 may be cut to the desired size by, for example, a blade heated to 100°C or more and 300°C or less, a laser, or etching. This makes it possible to suppress the increase in surface roughness Ra of the cut surface (i.e., the third surface 11c) compared to, for example, when the wiring board 10 is cut using an unheated blade.

[0176] Next, the first transparent adhesive layer 95, the wiring board 10, and the second transparent adhesive layer 96 are laminated together. First, as shown in Figure 19(a), an OCA sheet 90 is prepared, which includes, for example, a release film 91 made of polyethylene terephthalate (PET) and an OCA layer 92 (first transparent adhesive layer 95 or second transparent adhesive layer 96) laminated on the release film 91. At this time, the OCA layer 92 may be a layer obtained by coating the release film 91 with a liquid curable adhesive layer composition containing a polymerizable compound and curing it using, for example, ultraviolet light (UV). This curable adhesive layer composition contains a polar group-containing monomer.

[0177] Next, as shown in Figure 19(b), the OCA layer 92 of the OCA sheet 90 is bonded to the wiring board 10. At this time, first, the power supply line 85 is electrically connected to the power supply unit 40. In this case, for example, the power supply line 85 is pressed to the wiring board 10 via an anisotropic conductive film (not shown). At this time, pressure and heat are applied to the power supply line 85 to press it to the wiring board 10. In this way, the power supply line 85 is electrically connected to the power supply unit 40. In this way, a module 80A is obtained that includes the wiring board 10 and the power supply line 85 electrically connected to the power supply unit 40.

[0178] Next, the OCA layer 92 of the OCA sheet 90 is bonded to the wiring board 10. This sandwiches the wiring board 10 between the OCA layer 92.

[0179] Subsequently, as shown in Figure 19(c), the release film 91 is peeled off from the OCA layer 92 of the OCA sheet 90 bonded to the wiring board 10, thereby obtaining the first transparent adhesive layer 95 (OCA layer 92), the wiring board 10, and the second transparent adhesive layer 96 (OCA layer 92) which are laminated together.

[0180] In this way, a laminate 70 for an image display device is obtained, comprising a first transparent adhesive layer 95, a second transparent adhesive layer 96, and a wiring substrate 10.

[0181] Subsequently, by stacking the display device 61 on the image display device laminate 70, an image display device 60 is obtained, comprising the image display device laminate 70 and the display device 61 stacked on the image display device laminate 70.

[0182] [Operation of this embodiment] Next, we will describe the operation of this embodiment, which has the above configuration.

[0183] As shown in Figures 17 and 18, the wiring board 10 is incorporated into an image display device 60 having a display device 61. At this time, the wiring board 10 is placed on the display device 61. The mesh wiring layer 20 of the wiring board 10 is electrically connected to the communication module 63 of the image display device 60 via the power supply unit 40. In this way, radio waves of a predetermined frequency can be transmitted and received via the mesh wiring layer 20, and communication can be performed using the image display device 60.

[0184] In this embodiment, a portion of the substrate 11 is positioned in a portion of the region between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. Furthermore, the third surface 11c of the substrate 11 is covered by the first adhesive layer 95 and the second adhesive layer 96. In addition, the surface roughness Ra of the third surface 11c is between 0.005 μm and 0.5 μm. Thus, by having a surface roughness Ra of 0.005 μm or more for the third surface 11c, the adhesion between the OCA layer 92 and the third surface 11c can be improved. Furthermore, by having a surface roughness Ra of 0.5 μm or less for the third surface 11c, it is possible to suppress the entry of air between the first transparent adhesive layer 95 or the second transparent adhesive layer 96 and the third surface 11c.

[0185] As described above, the wiring board 10 is cut to a desired size after the mesh wiring layer 20 is provided on the substrate 11. At this time, the surface roughness Ra of the cut surface of the substrate 11 (i.e., the third surface) may increase. When the surface roughness Ra of the cut surface increases, air may get trapped between the cut surface and the first transparent adhesive layer 95 or the second transparent adhesive layer 96. In this case, the trapping of air between the cut surface and the first transparent adhesive layer 95, etc., may create a minute gap between them, making the cut surface of the substrate 11 more visible to the naked eye.

[0186] In contrast, according to this embodiment, the surface roughness Ra of the third surface 11c is 0.5 μm or less. This prevents air from entering between the first transparent adhesive layer 95 or the second transparent adhesive layer 96 and the third surface 11c. Therefore, when an observer observes the image display device 60 from the light-emitting surface 64 side, the substrate 11 of the wiring board 10 is difficult to see with the naked eye. In particular, when the first transparent adhesive layer 95 and the second transparent adhesive layer 96 each have a larger area than the substrate 11, the outer edge of the substrate 11 is difficult to see with the naked eye, and the observer is prevented from recognizing the presence of the substrate 11.

[0187] Furthermore, according to this embodiment, the wiring board 10 comprises a substrate 11 and a mesh wiring layer 20 disposed on the substrate 11. The substrate 11 is transparent. In addition, the mesh wiring layer 20 has a conductive portion that forms an opaque conductive layer and a mesh-like pattern with numerous openings. Therefore, the transparency of the wiring board 10 is ensured. As a result, when the wiring board 10 is placed on the display device 61, the display device 61 can be viewed through the openings 23 of the mesh wiring layer 20, and the visibility of the display device 61 is not obstructed.

[0188] Furthermore, according to this embodiment, the first transparent adhesive layer 95 and the second transparent adhesive layer 96 each contain an acrylic resin. This substantially eliminates the difference in refractive index between the first transparent adhesive layer 95 and the second transparent adhesive layer 96, and more reliably suppresses the reflection of visible light at the interface B4 between the first transparent adhesive layer 95 and the second transparent adhesive layer 96.

[0189] [Examples] Next, a specific example of this embodiment will be described.

[0190] (Example B1) A laminate for an image display device having the configuration shown in Figure 18 was fabricated. In this case, a polyethylene terephthalate substrate with a thickness of 40 μm was used as the substrate for the wiring board. In addition, an acrylic resin OCA layer with a thickness of 50 μm was used as the first transparent adhesive layer and the second transparent adhesive layer.

[0191] Furthermore, the surface roughness Ra of the third surface was 0.45 μm. The surface roughness Ra of the third surface was measured using a laser microscope (VK-X250, manufactured by Keyence Corporation) in accordance with JIS B 0601-2013.

[0192] Next, a visibility evaluation test was conducted. In the visibility evaluation test, 10 experimenters confirmed the visibility of the wiring board in the laminate for image display devices. During this test, the effect of transmitted light on the visibility of the wiring board was examined.

[0193] When examining the effect of transmitted light on the visibility of the wiring board, first, as shown in Figure 20, the brightness is 150 cd / m². 2 A light source (white light source) S1 was prepared. Next, a laminate for image display device 70 was placed on the light source S1 such that the second transparent adhesive layer 96 faced the light source S1.

[0194] Next, the visibility of the wiring board 10 was checked. First, light was shone from the light source S1 onto the laminated image display device 70. Then, the visibility of the wiring board 10 was checked while the light was shone on it. At this time, the visibility of the wiring board 10 was checked when the laminated image display device 70 was viewed at a viewing angle of 150°.

[0195] Here, the viewing angle is defined as the normal N perpendicular to the first surface 11a of the substrate 11, as shown in Figure 20. L And, normal N LThe intersection point O of the first surface 11a of the substrate 11 Z Gaze directed towards L D If the angle between two points is θ11, then this refers to the angle that is 2 × θ11.

[0196] We also investigated the effect of reflected light on the visibility of the wiring board.

[0197] To confirm the effect of transmitted light on the visibility of the wiring board, first, a black drawing paper Pap was prepared as shown in Figure 21. Next, the laminate for the image display device 70 was placed on the drawing paper Pap so that the second transparent adhesive layer 96 faced the drawing paper Pap.

[0198] Furthermore, a light source S2 with a luminous intensity of 10,000 cd was prepared. The light source S2 was then positioned so that it faced the first transparent adhesive layer 95.

[0199] Next, the visibility of the wiring board 10 was checked. First, light was shone from the light source S2 onto the image display device laminate 70. Then, the visibility of the wiring board 10 was checked while the light was shone on it. At this time, the visibility of the wiring board 10 was checked when the image display device laminate 70 was viewed at a 150° viewing angle. At this time, the direction of light irradiation from the light source S2 and the normal N were checked. L The angle θ12 formed by the circuit board was set to 30°, 60°, and 90°, and the visibility of the wiring board 10 was checked in each case.

[0200] (Example B2) A laminate for an image display device was fabricated in the same manner as in Example B1, except that the substrate thickness was 25 μm, the thickness of the first and second transparent adhesive layers was 40 μm each, and the surface roughness Ra of the third surface was 0.025 μm. A visibility evaluation test was then performed.

[0201] (Example B3) A laminate for an image display device was fabricated in the same manner as in Example B1, except that the substrate thickness was 5 μm, the thickness of the first and second transparent adhesive layers was 25 μm each, and the surface roughness Ra of the third surface was 0.1 μm, and a visibility evaluation test was performed.

[0202] (Example B4) A laminate for an image display device was fabricated in the same manner as in Example B1, except that the substrate thickness was 60 μm, the thickness of the first transparent adhesive layer and the second transparent adhesive layer were each 50 μm, and the surface roughness Ra of the third surface was 0.45 μm. A visibility evaluation test was then performed.

[0203] (Comparative Example B1) A laminate for an image display device was fabricated in the same manner as in Example B1, except that the substrate thickness was 25 μm, the thickness of the first and second transparent adhesive layers was 40 μm each, and the surface roughness Ra of the third surface was 1.2 μm, and a visibility evaluation test was performed.

[0204] The results are shown in Table 3. In the transmitted light column of Table 3, "A (excellent)" means that 2 or fewer out of 10 experimenters were able to visually identify the outline of the wiring board. "B (good)" means that 3 to 7 out of 10 experimenters were able to visually identify the outline of the wiring board. "C (poor)" means that 8 or more out of 10 experimenters were able to visually identify the outline of the wiring board.

[0205] In addition, in the column of reflected light in Table 3, "A (excellent)" means that in any of the cases where the angle θ12 is 30°, 60°, and 90°, the number of experimenters who could visually identify the outer shape of the wiring board was 2 or less out of 10. "B (good)" means that in any of the cases where the angle θ12 is 30°, 60°, and 90°, the number of experimenters who could visually identify the outer shape of the wiring board was 3 or more and 7 or less out of 10. Also, "C (poor)" means that in the case where the angle θ12 is 30°, 60°, or 90°, the number of experimenters who could visually identify the outer shape of the wiring board was 8 or more out of 10.

[0206] [Table 3]

[0207] As a result, as shown in Table 3, in the laminate for an image display device according to Comparative Example B1, the outer shape of the wiring board was in a state where it was easy to visually identify. On the other hand, the laminates for image display devices according to Examples B1 to B4 were in a state where it was difficult to visually identify the outer shape of the wiring board. In particular, in the laminates for image display devices according to Examples B1 to B3, in any of the cases where the angle θ12 was 30°, 60°, and 90°, the number of experimenters who could visually identify the outer shape of the wiring board was 2 or less out of 10. Therefore, it was found that the laminate for an image display device according to the present embodiment can make the wiring board difficult to visually recognize with the naked eye.

[0208] (Third Embodiment) Next, the third embodiment will be described with reference to FIGS. 22 to 24. FIGS. 22 to 24 are diagrams showing the third embodiment. In FIGS. 22 to 24, the same parts as those in the first embodiment shown in FIGS. 1 to 16 or the same parts as those in the second embodiment shown in FIGS. 17 to 21 may be denoted by the same reference numerals and detailed description may be omitted.

[0209] [Configuration of Image Display Device] First, the configuration of the image display device according to the present embodiment will be described with reference to FIGS. 22 and 23.

[0210] As shown in FIGS. 22 and 23, the image display device 60 according to the present embodiment includes a laminate 70 for an image display device and a display device (display) 61 laminated on the laminate 70 for an image display device. Among these, the laminate 70 for an image display device includes a first transparent adhesive layer (first adhesive layer) 95, a second transparent adhesive layer (second adhesive layer) 96, and a wiring board 10. The wiring board 10 has a substrate 11 and a mesh wiring layer 20. The substrate 11 includes a first surface 11a, a second surface 11b located on the opposite side of the first surface 11a, and a third surface 11c located between the first surface 11a and the second surface 11b. The mesh wiring layer 20 is disposed on the first surface 11a of the substrate 11. Also, a power supply unit 40 is electrically connected to the mesh wiring layer 20. Further, a communication module 63 is disposed on the minus Z direction side with respect to the display device 61. The laminate 70 for an image display device, the display device 61, and the communication module 63 are housed in a housing 62. Furthermore, in the present embodiment as well, a module 80A is constituted by the wiring board 10 and a power supply line 85 electrically connected to the wiring board 10. In other words, the module 80A includes the above-described wiring board 10 and a power supply line 85 electrically connected to the power supply unit 40. When the module 80A is incorporated into the image display device 60 having the display device 61, the power supply unit 40 of the wiring board 10 is electrically connected to the communication module 63 of the image display device 60 via the power supply line 85.

[0211] Here, as described above, the substrate 11 includes the first surface ¹¹a, the second surface 11b located on the opposite side of the first surface 11a, and the third surface 11c located between the first surface 11a and the second surface 11b. In this case, as shown in FIG. 23, the third surface 11c of the substrate 11 is covered with the first adhesive layer 95.

[0212] In this embodiment, in a cross-section along the normal direction (Z direction) of the first surface 11a, the third surface 11c is inclined with respect to the first surface 11a. In this embodiment, the third surface 11c is inclined outward as it moves from the first surface 11a towards the second surface 11b. In the illustrated example, the third surface 11c is inclined towards the positive side of the Y direction as it moves towards the negative side of the Z direction. Furthermore, the third surface 11c is inclined with respect to the first surface 11a at a predetermined inclination angle θ1 from the first surface 11a to the second surface 11b. In this way, because the third surface 11c is inclined with respect to the first surface 11a in a cross-section along the normal direction (Z direction) of the first surface 11a, it is possible to suppress the entry of air between the first transparent adhesive layer 95 and the third surface 11c. In other words, as will be described later, when the wiring board 10 is sandwiched by the OCA layer 92 (see Figure 24(b)), air that has entered between the OCA layer 92 and the third surface 11c can be easily released to the outside. Therefore, it is possible to suppress air from entering between the first transparent adhesive layer 95 and the third surface 11c. In this specification, "outside" refers to the side away from the center of the first surface 11a in the X or Y direction.

[0213] Here, in a cross-section along the normal direction (Z direction) of the first surface 11a, the outermost portion P of the third surface 11c is defined. c And the outermost part P of the first surface 11a. a The length L along the direction perpendicular to the normal direction (Y direction) between them. c1 is part P c and part P a The length T along the normal direction between [point 1] and [point 2]. c1 It may be between 0.15 and 2 times the length. c1 is length T c1 By being 0.15 times or more, the inclination angle θ1 of the third surface 11c relative to the first surface 11a can be reduced. Therefore, the entry of air between the first transparent adhesive layer 95 and the third surface 11c can be suppressed even more effectively. Also, the length L c1 is length T c1By keeping it at or below twice the length, the moldability of the substrate 11 can be improved. Here, as will be described later, in the process of manufacturing the wiring board 10, the substrate 11 is cut to the desired size. Then, the third surface 11c is formed by the cut surface when the substrate 11 is cut. Therefore, the length L c1 is length T c1 By keeping it at or below twice the length, it is possible to suppress the difficulty in cutting the substrate 11. As a result, the moldability of the substrate 11 can be improved. In this case, the inclination angle θ1 is preferably 26.5° or more and 81.5° or less. As described above, the third surface 11c is inclined at a predetermined inclination angle with respect to the first surface 11a from the first surface 11a to the second surface 11b. For this reason, in the illustrated example, length T c1 This is equal to the thickness T1 of the substrate 11.

[0214] Furthermore, in a cross-section along the normal direction (Z direction) of the first surface 11a, the third surface 11c is angled outward as it approaches the interface B4 between the first adhesive layer 95 and the second adhesive layer 96. This further effectively suppresses the entry of air between the first transparent adhesive layer 95 and the third surface 11c. In other words, when the wiring board 10 is sandwiched between the OCA layer 92, any air that enters between the OCA layer 92 and the third surface 11c can be released to the outside more easily.

[0215] As described above, the laminate 70 for an image display device is composed of a wiring board 10, a first transparent adhesive layer 95 having a larger area than the substrate 11 of the wiring board 10, and a second transparent adhesive layer 96 having a larger area than the substrate 11. In this embodiment, such a laminate 70 for an image display device is also provided.

[0216] [Manufacturing method for laminated material for image display device] Next, a method for manufacturing the laminated image display device 70 according to this embodiment will be described.

[0217] First, the wiring board 10 is manufactured, for example, by the method shown in Figures 7(a)-(f). Then, the wiring board 10 is cut to the desired size. At this time, the wiring board 10 may be cut to the desired size by, for example, a blade heated to 100°C or more and 300°C or less, a laser, or etching. This makes it possible to suppress the increase in surface roughness of the cut surface (i.e., the third surface 11c) compared to, for example, when the wiring board 10 is cut using an unheated blade.

[0218] Next, the first transparent adhesive layer 95, the wiring board 10, and the second transparent adhesive layer 96 are laminated together. First, as shown in Figure 24(a), an OCA sheet 90 is prepared, which includes, for example, a release film 91 made of polyethylene terephthalate (PET) and an OCA layer 92 (first transparent adhesive layer 95 or second transparent adhesive layer 96) laminated on the release film 91. At this time, the OCA layer 92 may be a layer obtained by coating the release film 91 with a liquid curable adhesive layer composition containing a polymerizable compound and curing it using, for example, ultraviolet light (UV). This curable adhesive layer composition contains a polar group-containing monomer.

[0219] Next, as shown in Figure 24(b), the OCA layer 92 of the OCA sheet 90 is bonded to the wiring board 10. At this time, first, the power supply line 85 is electrically connected to the power supply unit 40. In this case, for example, the power supply line 85 is pressed to the wiring board 10 via an anisotropic conductive film (not shown). At this time, pressure and heat are applied to the power supply line 85 to press it to the wiring board 10. In this way, the power supply line 85 is electrically connected to the power supply unit 40. In this way, a module 80A is obtained that includes the wiring board 10 and the power supply line 85 electrically connected to the power supply unit 40.

[0220] Next, the OCA layer 92 of the OCA sheet 90 is bonded to the wiring board 10. This sandwiches the wiring board 10 between the OCA layer 92.

[0221] Subsequently, as shown in Figure 24(c), the release film 91 is peeled off from the OCA layer 92 of the OCA sheet 90 bonded to the wiring board 10, thereby obtaining the first transparent adhesive layer 95 (OCA layer 92), the wiring board 10, and the second transparent adhesive layer 96 (OCA layer 92) which are laminated together.

[0222] In this way, a laminate 70 for an image display device is obtained, comprising a first transparent adhesive layer 95, a second transparent adhesive layer 96, and a wiring substrate 10.

[0223] Subsequently, by stacking the display device 61 on the image display device laminate 70, an image display device 60 is obtained, comprising the image display device laminate 70 and the display device 61 stacked on the image display device laminate 70.

[0224] [Operation of this embodiment] Next, we will describe the operation of this embodiment, which has the above configuration.

[0225] As shown in Figures 22 and 23, the wiring board 10 is incorporated into an image display device 60 having a display device 61. At this time, the wiring board 10 is placed on the display device 61. The mesh wiring layer 20 of the wiring board 10 is electrically connected to the communication module 63 of the image display device 60 via the power supply unit 40. In this way, radio waves of a predetermined frequency can be transmitted and received via the mesh wiring layer 20, and communication can be performed using the image display device 60.

[0226] In this embodiment, a portion of the substrate 11 is positioned in a portion of the region between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. Furthermore, the third surface 11c of the substrate 11 is covered by the first adhesive layer 95. In addition, the third surface 11c is inclined outward as it moves from the first surface 11a to the second surface 11b. This inclination of the third surface 11c outward as it moves from the first surface 11a to the second surface 11b prevents air from entering between the first transparent adhesive layer 95 and the third surface 11c.

[0227] As described above, the wiring board 10 is cut to a desired size after the mesh wiring layer 20 is provided on the substrate 11. At this time, the surface roughness of the cut surface (i.e., the third surface) of the substrate 11 may increase. If the surface roughness of the cut surface increases, air may get trapped between the cut surface and the first transparent adhesive layer 95. In this case, the trapping of air between the cut surface and the first transparent adhesive layer 95 may create a minute gap, making the cut surface of the substrate 11 more visible to the naked eye.

[0228] In contrast, according to this embodiment, the third surface 11c is inclined outward as it moves from the first surface 11a to the second surface 11b. This makes it easier for air that has entered between the OCA layer 92 and the third surface 11c to escape when the wiring board 10 is sandwiched between the OCA layer 92. As a result, it is possible to suppress the entry of air between the first transparent adhesive layer 95 and the third surface 11c. Consequently, when an observer observes the image display device 60 from the light-emitting surface 64 side, it becomes difficult to see the substrate 11 of the wiring board 10 with the naked eye. In particular, when the first transparent adhesive layer 95 and the second transparent adhesive layer 96 each have a larger area than the substrate 11, the outer edge of the substrate 11 can be made difficult to see with the naked eye of the observer, preventing the observer from recognizing the presence of the substrate 11.

[0229] Furthermore, according to this embodiment, the wiring board 10 comprises a substrate 11 and a mesh wiring layer 20 disposed on the substrate 11. The substrate 11 is transparent. In addition, the mesh wiring layer 20 has a conductive portion that forms an opaque conductive layer and a mesh-like pattern with numerous openings. Therefore, the transparency of the wiring board 10 is ensured. As a result, when the wiring board 10 is placed on the display device 61, the display device 61 can be viewed through the openings 23 of the mesh wiring layer 20, and the visibility of the display device 61 is not obstructed.

[0230] Further, according to the present embodiment, in a cross section along the normal direction (Z direction) of the first surface 11a, the third surface 11c faces outward as it approaches the interface B4 between the first adhesive layer 95 and the second adhesive layer 96. Thereby, it is possible to more effectively suppress air from entering between the first transparent adhesive layer 95 and the third surface 11c. That is, when the wiring board 10 is sandwiched by the OCA layer 92, the air that has entered between the OCA layer 92 and the third surface 11c can be more easily released to the outside.

[0231] Further, according to the present embodiment, the first transparent adhesive layer 95 and the second transparent adhesive layer 96 each contain an acrylic resin. Thereby, the difference in refractive index between the first transparent adhesive layer 95 and the second transparent adhesive layer 96 can be substantially eliminated, and reflection of visible light at the interface B4 between the first transparent adhesive layer 95 and the second transparent adhesive layer 96 can be more reliably suppressed.

[0232] Furthermore, according to the present embodiment, the thickness T3 of the first transparent adhesive layer 95 is greater than the thickness T4 of the second transparent adhesive layer 96. Thereby, it is possible to suppress the formation of irregularities on the surface of the first transparent adhesive layer 95 due to the mesh wiring layer 20, and the surface of the first transparent adhesive layer 95 can be made smooth.

[0233] [Modified Example] Next, a modified example of the laminate 70 for an image display device will be described.

[0234] (First Modified Example) FIG. 25 shows a modified example of the laminate for an image display device. The modified example shown in FIG. 25 is different in that the third surface 11c is curved in a cross section along the normal direction of the first surface 11a, and other configurations are substantially the same as those shown in FIGS. 22 to 24 described above. In FIG. 25, the same parts as those shown in FIGS. 22 to 24 are denoted by the same reference numerals, and detailed description thereof is omitted.

[0235] In the modified example shown in Figure 25, the third surface 11c is curved in a cross-section along the normal direction (Z direction) of the first surface 11a. In this modified example, the third surface 11c includes a first curved portion 11d that is convex outward and a second curved portion 11e that is convex inward. The first curved portion 11d and the second curved portion 11e are connected to each other. Furthermore, the first curved portion 11d is connected to the first surface 11a, and the second curved portion 11e is connected to the second surface 11b.

[0236] The first curved portion 11d and the second curved portion 11e each curve outward as they approach the interface B4 between the first adhesive layer 95 and the second adhesive layer 96. This further effectively suppresses the entry of air between the first transparent adhesive layer 95 and the third surface 11c. When forming such a third surface 11c, it is preferable that the wiring board 10 be cut to the desired size using a laser or a heated metal blade.

[0237] Here, if the third surface 11c is curved, the inclination angle θ1 of the third surface 11c with respect to the first surface 11a is, in a cross section along the normal direction (Z direction) of the first surface 11a, part P c and part P a This can also be defined as the angle between the imaginary line X1 connecting the two points and the first surface 11a.

[0238] In this modified example, it is possible to suppress the entry of air between the first transparent adhesive layer 95 and the third surface 11c. This makes it difficult to see the substrate 11 of the wiring board 10 with the naked eye.

[0239] (Second variation) Figure 26 shows a second modified example of the laminate for an image display device. The modified example shown in Figure 26 differs in that, in a cross-section along the normal direction of the first surface 11a, the third surface 11c does not include the first curved portion 11d and the second curved portion 11e, respectively. The other configurations are substantially the same as those shown in Figure 25. In Figure 26, the same reference numerals are used for parts that are the same as those shown in Figure 25, and detailed explanations are omitted.

[0240] In the second modified example shown in Figure 26, the third surface 11c is curved in a cross-section along the normal direction (Z direction) of the first surface 11a. In this modified example, the third surface 11c is curved so as to be convex inward. Even in this case, when the wiring board 10 is sandwiched between the OCA layer 92, it is possible to easily release the air that has entered between the OCA layer 92 and the third surface 11c to the outside. Therefore, it is possible to suppress the entry of air between the first transparent adhesive layer 95 and the third surface 11c.

[0241] (Third variation) Figure 27 shows a third modified example of the laminate for an image display device. The modified example shown in Figure 27 differs in that the third surface 11c is curved outward in a cross-section along the normal direction of the first surface 11a, but the other configurations are substantially the same as the embodiment shown in Figure 26 described above. In Figure 27, the same reference numerals are used for parts that are the same as those in the embodiment shown in Figure 26, and detailed explanations are omitted.

[0242] In the third modified example shown in Figure 27, the third surface 11c is curved so as to be convex outward in a cross-section along the normal direction (Z direction) of the first surface 11a. In this case as well, when the wiring board 10 is sandwiched between the OCA layer 92, it is possible to easily release the air that has entered between the OCA layer 92 and the third surface 11c to the outside. Therefore, it is possible to suppress the entry of air between the first transparent adhesive layer 95 and the third surface 11c.

[0243] (Fourth variation) Figure 28 shows a fourth modified example of the laminate for image display devices. The modified example shown in Figure 28 differs in that the third surface 11c includes a first portion 11f connected to the first surface 11a and a second portion 11g connected to the second surface 11b, while the other configurations are substantially the same as those shown in Figures 22 to 24 described above. In Figure 28, the same reference numerals are used for parts that are the same as those shown in Figures 22 to 24, and detailed explanations are omitted.

[0244] In the fourth modified example shown in Figure 28, the third surface 11c includes a first portion 11f connected to the first surface 11a and a second portion 11g connected to the second surface 11b. The first portion 11f is covered with a first transparent adhesive layer 95. On the other hand, the second portion 11g is covered with a second transparent adhesive layer 96. The first portion 11f and the second portion 11g are connected to each other.

[0245] The first part 11f and the second part 11g each extend linearly in a cross-section along the normal direction (Z direction) of the first surface 11a. Furthermore, the first part 11f and the second part 11g are non-parallel in a cross-section along the normal direction (Z direction) of the first surface 11a. In a cross-section along the normal direction (Z direction) of the first surface 11a, the first part 11f and the second part 11g each incline outward as they approach the interface B4 between the first adhesive layer 95 and the second adhesive layer 96. In the illustrated example, the first part 11f inclines towards the positive Y direction as it moves toward the negative Z direction. Conversely, the second part 11g inclines towards the positive Y direction as it moves toward the positive Z direction. Thus, in a cross-section along the normal direction (Z direction) of the first surface 11a, the first portion 11f and the second portion 11g are directed outward as they approach the interface B4 between the first adhesive layer 95 and the second adhesive layer 96. This further effectively suppresses the entry of air between the first transparent adhesive layer 95 or the second transparent adhesive layer 96 and the third surface 11c. When forming such a third surface 11c, it is preferable that the wiring board 10 be cut to the desired size using a laser or a heated metal blade.

[0246] In this modified example, in the cross-section along the normal direction (Z direction) of the first surface 11a, the outermost portion P of the third surface 11c is shown. c It is located between the first surface 11a and the second surface 11b. In this case, the outermost part P of the third surface 11c. c And the outermost part P of the second surface 11b. b The length L along the direction perpendicular to the normal direction (Y direction) between them. c2 is part P c and part P bThe length T along the normal direction between [point 1] and [point 2]. c2 It may be between 0.15 and 2 times the length. c2 is length T c2 By being 0.15 times or more, the inclination angle θ2 of the third surface 11c relative to the second surface 11b can be reduced. Therefore, the entry of air between the second transparent adhesive layer 96 and the third surface 11c can be suppressed even more effectively. Also, the length L c2 is length T c2 By keeping it at or below twice the length, the moldability of the substrate 11 can be improved. In this case, the inclination angle θ2 is preferably 26.5° or more and 81.5° or less. In this modified example, the length L c2 The length L mentioned above is c1 It is equal to this.

[0247] According to this modified example, it is possible to suppress the entry of air between the first transparent adhesive layer 95 or the second transparent adhesive layer 96 and the third surface 11c. This makes it difficult to see the substrate 11 of the wiring board 10 with the naked eye.

[0248] (Fifth variation) Figure 29 shows a fifth modified example of the laminate for image display devices. The modified example shown in Figure 29 has a length L c1 and length L c2 These two configurations differ from each other in several ways, but the other configurations are substantially the same as those shown in Figure 28. In Figure 29, the same reference numerals are used for parts identical to those shown in Figure 28, and detailed explanations are omitted.

[0249] In the fifth modified example shown in Figure 29, the length L c1 and length L c2 These are different from each other. In this modified example, length L c2 is, length L c1 It is shorter than that. Therefore, the inclination angle θ1 of the third surface 11c relative to the first surface 11a is smaller than the inclination angle θ2 of the third surface 11c relative to the second surface 11b.

[0250] In this modified example, it is possible to suppress the entry of air between the first transparent adhesive layer 95 or the second transparent adhesive layer 96 and the third surface 11c. This makes it difficult to see the substrate 11 of the wiring board 10 with the naked eye.

[0251] (Sixth variation) Figure 30 shows a sixth modified example of the laminate for an image display device. The modified example shown in Figure 30 differs in that the first portion 11f and the second portion 11g are curved in a cross-section along the normal direction of the first surface 11a, while the other configurations are substantially the same as the embodiment shown in Figure 28 described above. In Figure 30, the same reference numerals are used for parts that are the same as those in the embodiment shown in Figure 28, and detailed explanations are omitted.

[0252] In the sixth modified example shown in Figure 30, the first portion 11f and the second portion 11g are curved in a cross-section along the normal direction (Z direction) of the first surface 11a. In this modified example, the first portion 11f and the second portion 11g are curved so as to be convex inward in a cross-section along the normal direction (Z direction) of the first surface 11a. Even in this case, when the wiring board 10 is sandwiched by the OCA layer 92, it is possible to easily release the air that has entered between the OCA layer 92 and the third surface 11c to the outside. Therefore, it is possible to suppress the entry of air between the first transparent adhesive layer 95 or the second transparent adhesive layer 96 and the third surface 11c.

[0253] (Seventh variation) Figure 31 shows a seventh modified example of the laminate for an image display device. The modified example shown in Figure 31 differs in that the first portion 11f and the second portion 11g are curved so as to be convex outward in a cross-section along the normal direction (Z direction) of the first surface 11a, while the other configurations are substantially the same as the embodiment shown in Figure 30 described above. In Figure 31, the same reference numerals are used for parts that are the same as those in the embodiment shown in Figure 30, and detailed explanations are omitted.

[0254] In the seventh modified example shown in Figure 31, the first portion 11f and the second portion 11g are curved so as to be convex outward in a cross-section along the normal direction (Z direction) of the first surface 11a.

[0255] In this modified example, it is possible to suppress the entry of air between the first transparent adhesive layer 95 or the second transparent adhesive layer 96 and the third surface 11c. This makes it difficult to see the substrate 11 of the wiring board 10 with the naked eye.

[0256] (Variation 8) Figure 32 shows an eighth modified example of the laminate for image display devices. The modified example shown in Figure 32 differs in that the first portion 11f includes a third curved portion 11h that is convex outward and a fourth curved portion 11i that is convex inward in a cross-section along the normal direction (Z direction) of the first surface 11a, while the other configurations are substantially the same as the embodiment shown in Figure 30 described above. In Figure 32, the same reference numerals are used for parts that are the same as those in the embodiment shown in Figure 30, and detailed explanations are omitted.

[0257] In the modified example shown in Figure 32, in a cross-section along the normal direction (Z direction) of the first surface 11a, the first portion 11f includes a third curved portion 11h that is convex outward and a fourth curved portion 11i that is convex inward. The third curved portion 11h is connected to the first surface 11a, and the fourth curved portion 11i is connected to the third curved portion 11h.

[0258] Furthermore, the second portion 11g includes a fifth curved portion 11j that is convex outward and a sixth curved portion 11k that is convex inward. The fifth curved portion 11j is connected to the second surface 11b, and the sixth curved portion 11k is connected to the fourth curved portion 11i and the fifth curved portion 11j.

[0259] The third curved portion 11h, the fourth curved portion 11i, the fifth curved portion 11j, and the sixth curved portion 11k each curve outward as they approach the interface B4 between the first adhesive layer 95 and the second adhesive layer 96. This further effectively suppresses the entry of air between the first transparent adhesive layer 95 or the second transparent adhesive layer 96 and the third surface 11c.

[0260] In this modified example, it is possible to suppress the entry of air between the first transparent adhesive layer 95 or the second transparent adhesive layer 96 and the third surface 11c. This makes it difficult to see the substrate 11 of the wiring board 10 with the naked eye.

[0261] [Examples] Next, a specific example of this embodiment will be described.

[0262] (Example C1) A laminate for an image display device was fabricated having the configuration shown in Figure 22. In this case, a polyethylene terephthalate substrate with a thickness of 40 μm was used as the substrate for the wiring board. In addition, an acrylic resin OCA layer with a thickness of 50 μm was used as the first transparent adhesive layer. Furthermore, an acrylic resin OCA layer with a thickness of 25 μm was used as the second transparent adhesive layer. At this time, the inclination angle θ1 of the third surface relative to the first surface was 75°.

[0263] Next, a visibility evaluation test was conducted. In the visibility evaluation test, 10 experimenters confirmed the visibility of the wiring board in the laminate for image display devices. During this test, the effect of transmitted light on the visibility of the wiring board was examined.

[0264] When examining the effect of transmitted light on the visibility of the wiring board, first, as shown in Figure 20 above, the brightness is 150 cd / m². 2 A light source (white light source) S1 was prepared. Next, a laminate for image display device 70 was placed on the light source S1 such that the second transparent adhesive layer 96 faced the light source S1.

[0265] Next, the visibility of the wiring board 10 was checked. First, light was shone from the light source S1 onto the laminated image display device 70. Then, the visibility of the wiring board 10 was checked while the light was shone on it. At this time, the visibility of the wiring board 10 was checked when the laminated image display device 70 was viewed at a viewing angle of 150°.

[0266] Here, as mentioned above, the viewing angle is defined as the normal N perpendicular to the first surface 11a of the substrate 11, as shown in Figure 20. L And, normal N L The intersection point O of the first surface 11a of the substrate 11 Z Gaze directed towards L D If the angle between two points is θ11, then this refers to the angle that is 2 × θ11.

[0267] We also investigated the effect of reflected light on the visibility of the wiring board.

[0268] To confirm the effect of transmitted light on the visibility of the wiring board, first, a black drawing paper Pap was prepared as shown in Figure 21 above. Next, the laminate for the image display device 70 was placed on the drawing paper Pap so that the second transparent adhesive layer 96 faced the drawing paper Pap.

[0269] Furthermore, a light source S2 with a luminous intensity of 10,000 cd was prepared. The light source S2 was then positioned so that it faced the first transparent adhesive layer 95.

[0270] Next, the visibility of the wiring board 10 was checked. First, light was shone from the light source S2 onto the image display device laminate 70. Then, the visibility of the wiring board 10 was checked while the light was shone on it. At this time, the visibility of the wiring board 10 was checked when the image display device laminate 70 was viewed at a 150° viewing angle. At this time, the direction of light irradiation from the light source S2 and the normal N were checked. L The angle θ12 formed by the circuit board was set to 30°, 60°, and 90°, and the visibility of the wiring board 10 was checked in each case.

[0271] (Example C2) A laminate for an image display device was fabricated in the same manner as in Example C1, except that the substrate thickness was 25 μm, the thickness of the first transparent adhesive layer was 40 μm, the thickness of the second transparent adhesive layer was 20 μm, and the tilt angle θ1 was 30°, and its visibility was confirmed.

[0272] (Example C3) A laminate for an image display device was fabricated in the same manner as in Example C1, except that the substrate thickness was 5 μm, the thickness of the first transparent adhesive layer was 25 μm, the thickness of the second transparent adhesive layer was 12.5 μm, and the tilt angle θ1 was 45°, and its visibility was confirmed.

[0273] (Comparative Example C1) A laminate for an image display device was fabricated in the same manner as in Example C1, except that the substrate thickness was 25 μm, the thickness of the first transparent adhesive layer was 40 μm, the thickness of the second transparent adhesive layer was 20 μm, and the tilt angle θ1 was 82°, and its visibility was confirmed.

[0274] (Comparative Example C2) A laminate for an image display device was fabricated in the same manner as in Example C1, except that the substrate thickness was 50 μm, the thickness of the first transparent adhesive layer was 50 μm, the thickness of the second transparent adhesive layer was 25 μm, and the tilt angle θ1 was 88°, and its visibility was confirmed.

[0275] The results are shown in Table 4. In the transmitted light column of Table 4, "A (good)" means that 2 or fewer out of 10 experimenters were able to visually identify the outline of the wiring board. "C (poor)" means that 8 or more out of 10 experimenters were able to visually identify the outline of the wiring board.

[0276] Furthermore, in the column for reflected light in Table 4, "A (good)" means that in all cases where the angle θ12 is 30°, 60°, or 90°, two or fewer out of ten experimenters were able to visually identify the outline of the wiring board. Conversely, "C (poor)" means that in all cases where the angle θ12 is 30°, 60°, or 90°, eight or more out of ten experimenters were able to visually identify the outline of the wiring board.

[0277] [Table 4]

[0278] As a result, as shown in Table 4, the laminates for image display devices according to Comparative Examples C1 and C2 allowed for easy visual identification of the wiring board's outline. In contrast, the laminates for image display devices according to Examples C1 to C3 made it difficult to visually identify the wiring board's outline. Therefore, it was found that the laminate for image display devices according to this embodiment makes it difficult to visually identify the wiring board.

[0279] (Fourth embodiment) Next, a fourth embodiment will be described with reference to Figures 33 to 35. Figures 33 to 35 show the fourth embodiment. In Figures 33 to 35, the same reference numerals are used for parts identical to those of the first embodiment shown in Figures 1 to 16, parts identical to those of the second embodiment shown in Figures 17 to 21, or parts identical to those of the third embodiment shown in Figures 22 to 32, and detailed descriptions may be omitted.

[0280] [Configuration of image display device and image display device laminate] Referring to Figures 33 to 35, the configuration of the image display device and the laminate for the image display device according to this embodiment will be described.

[0281] As shown in Figures 33 to 35, the image display device 60 according to this embodiment comprises an image display device laminate 70 and a display device (display) 61 laminated on the image display device laminate 70. The image display device laminate 70 comprises a wiring board 10, a conductive layer 76, and a third adhesive layer 950. The third adhesive layer 950 is located between the wiring board 10 and the conductive layer 76. The wiring board 10 has a transparent substrate 11 and a mesh wiring layer 20 disposed on the substrate 11. A power supply unit 40 is electrically connected to the mesh wiring layer 20. In this embodiment, the shortest distance between the mesh wiring layer 20 and the conductive layer 76 in the direction normal to the conductive layer 76 is L zmin Furthermore, the longest distance between the mesh wiring layer 20 and the conductive layer 76 in the normal direction of the conductive layer 76 is L. zmax Let's assume that L zmin ≥0.9L zmax That's how it is.

[0282] Furthermore, a communication module 63 is positioned on the negative Z-direction side relative to the display device 61 (see Figure 34). The image display device laminate 70, the display device 61, and the communication module 63 are all housed within the housing 62.

[0283] The display device 61 is, for example, an organic EL (Electro-Luminescence) display device. The display device 61 includes, in order from the opposite side of the light-emitting surface 64 (negative Z-direction side), a metal layer 66, a support substrate 67, a resin substrate 68, a thin-film transistor (TFT) 69, and an organic EL layer 71. A touch sensor 73 is placed on the display device 61. A polarizing plate 72 is placed on the touch sensor 73 via a fifth adhesive layer 970. A wiring board 10 is placed on the polarizing plate 72 via a third adhesive layer 950. A decorative film 74 and a cover glass (surface protective plate) 75 are placed on the wiring board 10 via a fourth adhesive layer 960.

[0284] The metal layer 66 is located on the opposite side (negative Z-direction) of the light-emitting surface 64 from the organic light-emitting layer (light-emitting body) 86 of the organic EL layer 71. This metal layer 66 protects the display device 61 from electromagnetic waves emitted by other electronic devices (not shown) located outside the display device 61. The metal layer 66 may be made of a metal with good conductivity, such as copper. The thickness of the metal layer 66 may be, for example, 1 μm to 100 μm, and preferably 10 μm to 50 μm.

[0285] The support substrate 67 is placed on the metal layer 66. The support substrate 67 supports the entire display device 61 and may be made of, for example, a flexible film. As the material for the support substrate 67, polyethylene terephthalate can be used. The thickness of the support substrate 67 may be, for example, 75 μm or more and 300 μm or less, and is preferably 100 μm or more and 200 μm or less.

[0286] The resin substrate 68 is placed on the support substrate 67. The resin substrate 68 supports the thin-film transistor 69 and the organic EL layer 71, etc., and consists of a flexible, flat layer. The resin substrate 68 may be formed by coating using methods such as die coating, inkjet coating, spray coating, plasma CVD or thermal CVD, capillary coating, slit and spin coating, or central dropping coating. For example, a colored polyimide can be used as the resin substrate 68. The thickness of the resin substrate 68 may be, for example, 7 μm to 30 μm, and is preferably 10 μm to 20 μm.

[0287] The thin-film transistor (TFT) 69 is arranged on a resin substrate 68. The thin-film transistor 69 is for driving the organic EL layer 71 and controls the voltage applied to the first electrode 850 and second electrode 870 of the organic EL layer 71, which will be described later. The thin-film transistor 69 may have an insulating layer, a gate electrode, a source electrode, and a drain electrode, which are not shown.

[0288] The thin-film transistor 69 has an insulating layer 81 and a gate electrode 82, a source electrode 83, and a drain electrode 84 embedded within the insulating layer 81. The insulating layer 81 is constructed, for example, by laminating electrically insulating materials, and any known organic or inorganic material can be used. For example, silicon oxide (SiO2) and silicon nitride (SiN) can be used as materials for the insulating layer 81. x ), silicon oxynitride (SiON), silicon nitride (SiN), or aluminum oxide (AlO x ) may be used. For the gate electrode 82, for example, a molybdenum-tungsten alloy, a titanium-aluminum laminate, etc. can be used. For the source electrode 83 and drain electrode 84, for example, a titanium-aluminum laminate, a copper-manganese, copper-molybdenum laminate, etc. can be used.

[0289] The organic EL layer 71 is arranged on a thin-film transistor 69 and is electrically connected to the thin-film transistor 69. The organic EL layer 71 has a first electrode (reflective electrode, anode electrode) 850 arranged on a resin substrate 68, an organic light-emitting layer (light-emitting body) 86 arranged on the first electrode 850, and a second electrode (transparent electrode, cathode electrode) 870 arranged on the organic light-emitting layer 86. A bank 88 is formed on the thin-film transistor 69 so as to cover the edge of the first electrode 850. By being surrounded by this bank 88, an opening corresponding to each pixel is formed, and the aforementioned organic light-emitting layer 86 is arranged within this opening. Furthermore, the first electrode 850, the organic light-emitting layer 86, the second electrode 870, and the bank 88 are sealed by a sealing resin 89. Here, the first electrode 850 constitutes the anode electrode, and the second electrode 870 constitutes the cathode electrode. However, the polarity of the first electrode 850 and the second electrode 870 is not particularly limited.

[0290] The first electrode 850 is formed on a resin substrate 68 by methods such as sputtering, vapor deposition, ion plating, or CVD. The material of the first electrode 850 is preferably one that allows for efficient hole injection, such as metallic materials like aluminum, chromium, molybdenum, tungsten, copper, silver, or gold, and their alloys.

[0291] The organic light-emitting layer (light-emitting body) 86 has the function of emitting light when an excited state is generated by the injection and recombination of holes and electrons. The organic light-emitting layer 86 is formed on the first electrode 850 by a vapor deposition method, a nozzle coating method in which a coating solution is applied from a nozzle, or a printing method such as inkjet. The organic light-emitting layer 86 preferably contains a fluorescent organic substance configured to emit light when a predetermined voltage is applied, and examples include quinolinol complexes, oxazole complexes, various laser dyes, and poly(p-phenylenevinylene). The multiple organic light-emitting layers 86 are one of a red light-emitting layer, a green light-emitting layer, and a blue light-emitting layer, and the red light-emitting layer, green light-emitting layer, and blue light-emitting layer are formed in a repeating arrangement.

[0292] The second electrode 870 is formed on the organic light-emitting layer 86. The second electrode 870 may be formed by methods such as sputtering, vapor deposition, ion plating, or CVD. It is preferable to use a material for the second electrode 870 that is easy to inject electrons into and has good light transmittance. Specifically, examples include indium tin oxide (ITO), indium zinc oxide (IZO), lithium oxide, and cesium carbonate.

[0293] Bank 88 is formed using an insulating organic material such as resin. Examples of organic materials used to form Bank 88 include acrylic resins, polyimide resins, and novolac-type phenolic resins.

[0294] The sealing resin 89 is placed on the bank 88 and the second electrode 870. This sealing resin 89 protects the organic light-emitting layer 86. For example, silicone resin or acrylic resin can be used as the sealing resin 89. The thickness of the sealing resin 89 may be, for example, 7 μm to 30 μm, and preferably 10 μm to 20 μm.

[0295] The light emitted in the organic EL layer 71 is extracted from above the sealing resin 89. Thus, the display device 61 in this embodiment is a so-called top-emission type display device.

[0296] The touch sensor 73 is arranged on the organic EL layer 71. This touch sensor 73 detects and outputs contact position data when a finger or the like is brought into contact with the display device 61 from above the image display device 60. The thickness of the touch sensor 73 may be, for example, 0.1 μm or more and 3.0 μm or less, and is preferably 0.2 μm or more and 1.5 μm or less.

[0297] The touch sensor 73 may include a conductive layer 76. The conductive layer 76 is grounded and electrically connected to a GND electrode, which is at ground potential. The conductive layer 76 may define a reference potential for measuring the capacitance between it and the sensing electrode of the touch sensor 73. In this case, a sensing electrode layer may be provided on the display device 61 side of the conductive layer 76 via an insulating layer. The conductive layer 76 may be formed by methods such as sputtering, vapor deposition, ion plating, or CVD. It is preferable to use a material with good light transmittance for the conductive layer 76. Specifically, examples include indium tin oxide (ITO), indium zinc oxide (IZO), lithium oxide, and cesium carbonate. The conductive layer 76 may also be a metal mesh. The visible light transmittance of the conductive layer 76 may be 85% or more, and preferably 90% or more. There is no particular upper limit to the visible light transmittance of the conductive layer 76, but it may be, for example, 100% or less.

[0298] The conductive layer 76 is located on the display device 61 side in the thickness direction when viewed from the mesh wiring layer 20. The conductive layer 76 is the conductor layer closest to the mesh wiring layer 20 in the thickness direction. There is substantially no conductor layer between the mesh wiring layer 20 and the conductive layer 76. Each layer between the mesh wiring layer 20 and the conductive layer 76 constitutes a dielectric layer. The conductive layer in this embodiment does not necessarily have to be the conductive layer 76 of the touch sensor 73. If there is a conductor layer closer to the mesh wiring layer 20 than the conductive layer 76, that conductor layer constitutes the conductive layer.

[0299] The fifth adhesive layer 970 is an adhesive layer that adheres the polarizing plate 72 to the touch sensor 73. The fifth adhesive layer 970 may be an OCA (Optical Clear Adhesive) layer. The fifth adhesive layer 970 made of an OCA layer has optical transparency. The thickness of the fifth adhesive layer 970 may be, for example, 10 μm or more and 50 μm or less, and is preferably 15 μm or more and 30 μm or less. The fifth adhesive layer 970 may be made of the same material as the fourth adhesive layer 960 and / or the third adhesive layer 950 described later.

[0300] The polarizing plate 72 is placed on the touch sensor 73 via the fifth adhesive layer 970. This polarizing plate 72 filters the light from the organic EL layer 71. The polarizing plate 72 may be a circular polarizer. The polarizing plate 72 may have a polarizer and a pair of light-transmitting protective films bonded to both sides of the polarizer. The thickness of the polarizing plate 72 may be, for example, 15 μm or more and 200 μm or less, and is preferably 50 μm or more and 150 μm or less.

[0301] The third adhesive layer 950 is an adhesive layer that directly or indirectly adheres the display device 61 to the wiring board 10. The third adhesive layer 950 is optically transparent. The third adhesive layer 950 has a larger area than the substrate 11 of the wiring board 10. The visible light transmittance of the third adhesive layer 950 may be 85% or more, and preferably 90% or more. There is no particular upper limit to the visible light transmittance of the third adhesive layer 950, but it may be, for example, 100% or less. Visible light refers to light rays with a wavelength of 400 nm or more and 700 nm or less. Furthermore, a visible light transmittance of 85% or more means that when the absorbance of the third adhesive layer 950 is measured using a known spectrophotometer (for example, a spectrometer manufactured by JASCO Corporation: V-670), the transmittance is 85% or more in the entire wavelength range from 400 nm to 700 nm.

[0302] The third adhesive layer 950 may be an OCA (Optical Clear Adhesive) layer. The OCA layer is a layer prepared, for example, as follows: First, a liquid curable adhesive layer composition containing a polymerizable compound is applied to a release film such as polyethylene terephthalate (PET). Next, the curable adhesive layer composition is cured using, for example, ultraviolet light (UV) to obtain an OCA sheet. After laminating this OCA sheet to the object, the release film is peeled off to obtain the OCA layer. The material of the third adhesive layer 950 may be an acrylic resin, polyester resin, silicone resin, or urethane resin, etc.

[0303] The storage modulus of the third adhesive layer 950 at 25°C is 1 × 10⁻⁶ 4It may be Pa or higher. 4 It is preferable that it be Pa or higher. There is no particular upper limit to the storage modulus of the third adhesive layer 950 at 25°C, but for example, 1 × 10 10 It may be set to Pa or less. By increasing the storage modulus of the third adhesive layer 950 in this way, the third adhesive layer 950 becomes harder. In this case, the horizontality between the wiring board 10 and the conductive layer 76 can be increased. As a result, when the wiring board 10 is used as an antenna, the deterioration of antenna characteristics can be suppressed. For example, if the third adhesive layer 950 is an OCA layer, the storage modulus at 25°C is 1 × 10⁻⁶. 4 Examples of materials with a storage modulus of Pa or higher include acrylic resins and silicone resins. The storage modulus of the third adhesive layer 950 can be measured using a Pheogel-E4000 or equivalent device manufactured by UBM Co., Ltd. Samples with a thickness of 1.0 ± 0.1 mm, a width of 5.0 ± 0.5 mm, and a length of 30 mm or more should be used. The measurement conditions for the storage modulus are: measurement mode: temperature dependent, measurement temperature range: 0 to 101°C, step temperature: 4°C, heating rate: 4°C / min, frequency: 10 Hz, strain waveform: sine wave, measurement jig: tensile, strain control: 3 μm, and the value at 25 ± 1°C is read.

[0304] In-plane average thickness T of the third adhesive layer 950 12 The thickness may be, for example, 15 μm or more and 500 μm or less, and is preferably 20 μm or more and 250 μm or less. In-plane average thickness T of the third adhesive layer 950 12 T is the average in-plane thickness of the third adhesive layer 950, and refers to the distance in the direction normal to the surface of the third adhesive layer 950. Furthermore, T is the maximum in-plane thickness of the third adhesive layer 950. 2max The minimum in-plane thickness of the third adhesive layer 950 is set to T. 2min (≦T 2max When T is set to ), 2min ≥0.9T 2max It is also acceptable if it is T 2min ≥0.95T 2max It is preferable that this happens, T 2min ≥0.99T 2maxIt is more preferable that it becomes so. Thus, by making the thickness of the third adhesive layer 950 uniform in the plane, the flatness between the wiring substrate 10 and the conductive layer 76 can be enhanced. Thereby, when the wiring substrate 10 is used as an antenna, the antenna characteristics can be sufficiently improved. The maximum in-plane thickness T 2max and the minimum in-plane thickness T 2min refer to the maximum value and the minimum value of the thickness of the third adhesive layer 950 in the plane, respectively, and refer to the distance in the normal direction of the surface of the third adhesive layer 950. The maximum in-plane thickness T 2max and the minimum in-plane thickness T 2min are obtained from SEM photographs after forming a cross-section of the third adhesive layer 950 with a microtome.

[0305] As described above, the wiring substrate 10 is disposed on the light-emitting surface 64 side with respect to the display device 61. In this case, the wiring substrate 10 is positioned between the third adhesive layer 950 and the fourth adhesive layer 960. More specifically, a partial region of the substrate 11 of the wiring substrate 10 is disposed in a partial region between the third adhesive layer 950 and the fourth adhesive layer 960. In a region where the wiring substrate 10 does not exist, the third adhesive layer 950 and the fourth adhesive layer 960 are directly adhered. In this case, the third adhesive layer 950, the fourth adhesive layer 960, the display device 61, the decorative film 74, and the cover glass 75 each have an area larger than that of the substrate 11 of the wiring substrate 10. Thus, by disposing the substrate 11 of the wiring substrate 10 in a partial region rather than the entire surface of the image display device 60 in plan view, the thickness of the image display device 60 as a whole can be reduced.

[0306] The wiring board 10 comprises a transparent substrate 11 and a mesh wiring layer 20 disposed on the substrate 11. A power supply unit 40 is electrically connected to the mesh wiring layer 20. The power supply unit 40 is electrically connected to a communication module 63. Furthermore, a portion of the wiring board 10 is not positioned between the third adhesive layer 950 and the fourth adhesive layer 960, but protrudes outward (towards the negative side in the Y direction) from between the third adhesive layer 950 and the fourth adhesive layer 960. Specifically, the region of the wiring board 10 on which the power supply unit 40 is provided protrudes outward. This facilitates the electrical connection between the power supply unit 40 and the communication module 63. On the other hand, the region of the wiring board 10 on which the mesh wiring layer 20 is provided is located between the third adhesive layer 950 and the fourth adhesive layer 960. Details of the wiring board 10 will be described later.

[0307] The fourth adhesive layer 960 is an adhesive layer that directly or indirectly adheres the wiring board 10 to the cover glass 75. The fourth adhesive layer 960 has a larger area than the substrate 11 of the wiring board 10. The fourth adhesive layer 960 is optically transparent, similar to the third adhesive layer 950. The visible light transmittance of the fourth adhesive layer 960 may be 85% or more, and preferably 90% or more. There is no particular upper limit to the visible light transmittance of the fourth adhesive layer 960, but it may be, for example, 100% or less. The fourth adhesive layer 960 may be an OCA (Optical Clear Adhesive) layer. The material of the fourth adhesive layer 960 may be an acrylic resin, polyester resin, silicone resin, or urethane resin, etc. Thickness T of the fourth adhesive layer 960 13 For example, the thickness may be between 15 μm and 500 μm, and preferably between 20 μm and 250 μm. The fourth adhesive layer 960 may be composed of the same material as the third adhesive layer 950.

[0308] The storage modulus of the fourth adhesive layer 960 at 25°C is 1 × 10⁻⁶ 4 It may be Pa or higher. 4 It is preferable that it be Pa or higher. There is no particular upper limit to the storage modulus of the fourth adhesive layer 960 at 25°C, but for example, 1 × 10 10It may be below Pa. The storage elastic modulus of the fourth adhesive layer 960 can be measured in the same manner as the storage elastic modulus of the third adhesive layer 950.

[0309] In the present embodiment, the distance Lz between the mesh wiring layer 20 and the conductive layer 76 in the normal direction of the conductive layer 76 is substantially uniform in the plane. Therefore, the flatness of the mesh wiring layer 20 with respect to the conductive layer 76 is uniform in the plane. Specifically, the shortest distance between the mesh wiring layer 20 and the conductive layer 76 in the normal direction of the conductive layer 76 is L zmin and the longest distance between the mesh wiring layer 20 and the conductive layer 76 is L zmax (≧L zmin ), when L zmin ≧0.9L zmax the relationship holds. Also L zmin ≧0.95L zmax is preferably satisfied, and L zmin ≧0.97L zmax is more preferably satisfied, and L zmin ≧0.99L zmax is even more preferably satisfied. Thus, by making the distance Lz between the mesh wiring layer 20 and the conductive layer 76 substantially uniform in the plane, the flatness between the wiring substrate 10 and the conductive layer 76 can be improved. Thereby, when the wiring substrate 10 is used as an antenna, the antenna characteristics can be improved. In this case, stable transmission and reception of radio waves as designed using the wiring substrate 10 becomes possible.

[0310] The longest distance L zmax and the shortest distance L zmin respectively refer to the maximum value and the minimum value of the distance Lz between the mesh wiring layer 20 and the conductive layer 76 measured in the normal direction of the conductive layer 76 (see FIG. 35). In general, the locations where the distance between the mesh wiring layer 20 and the conductive layer 76 is maximum and minimum exist on the outer periphery of the mesh wiring layer 20. Also, when there is a region where the mesh wiring layer 20 and the conductive layer 76 do not overlap as viewed from the normal direction of the conductive layer 76, the longest distance L zmax and the shortest distance L zmin are defined in the overlapping region of the mesh wiring layer 20 and the conductive layer 76. The longest distance L zmaxand shortest distance L zmin Each of these is measured as follows: First, a sample including a cross-section of the laminate 70 for the image display device, including the outermost periphery of the mesh wiring layer 20, is formed by microtome. Next, the distance Lz between the mesh wiring layer 20 and the conductive layer 76 is determined from the SEM image using this sample. The maximum value of this distance Lz is used to determine the longest distance L zmax Let the minimum distance Lz be the shortest distance L zmin Let's assume that.

[0311] As described above, the laminate 70 for the image display device is composed of at least a wiring board 10, a third adhesive layer 950, and a conductive layer 76. In this embodiment, such a laminate 70 for the image display device is also provided.

[0312] The decorative film 74 is placed on the fourth adhesive layer 960. This decorative film 74 has an opening in the portion that overlaps with the display area of ​​the display device 61 as viewed from the observer's side, and blocks light from the portion other than the display area. In other words, the decorative film 74 is positioned to cover the edge of the display device 61 as viewed from the observer's side.

[0313] [Wiring board configuration] Next, the configuration of the wiring board will be described with reference to Figures 33 and 34.

[0314] As shown in Figures 33 and 34, in this embodiment, the wiring board 10 is positioned on the light-emitting surface 64 side of the display device 61, and is located between the third adhesive layer 950 and the fourth adhesive layer 960.

[0315] The material of the substrate 11 may be any material that is transparent in the visible light region and electrically insulating. In this embodiment, the material of the substrate 11 is polyethylene terephthalate, but it is not limited to this.

[0316] Furthermore, the substrate 11 may be in the form of a film or a plate. Therefore, there are no particular restrictions on the thickness of the substrate 11, and it can be appropriately selected according to the application. For example, the average in-plane thickness T1 of the substrate 11 (see Figures 2 and 5) may be in the range of 10 μm to 200 μm. Preferably, the average in-plane thickness T1 of the substrate 11 is 10 μm to 50 μm, and more preferably 15 μm to 25 μm. By setting the average in-plane thickness T1 of the substrate 11 to 10 μm or more, the strength of the wiring substrate 10 can be maintained, and the first direction wiring 21 and second direction wiring 22 of the mesh wiring layer 20, which will be described later, can be made less prone to deformation. Also, by setting the average thickness T1 of the substrate 11 to 200 μm or less, the occurrence of steps in the third adhesive layer 950 and the fourth adhesive layer 960 at the periphery of the substrate 11 can be suppressed, making it difficult for observers to recognize the presence of the substrate 11.

[0317] Furthermore, the maximum in-plane thickness of the substrate 11 is T 1max The minimum in-plane thickness of the substrate 11 is set to T. 1min (≦T 1max When T is set to ), 1min ≥0.9T 1max That would be fine. Furthermore, T 1min ≥0.95T 1max It is preferable that this happens, T 1min ≥0.99T 1max It is even more preferable that this be the case. In this way, by making the thickness of the substrate 11 uniform in plane, the horizontality between the wiring board 10 and the conductive layer 76 can be increased. As a result, when the wiring board 10 is used as an antenna, the antenna characteristics can be sufficiently improved. Maximum in-plane thickness T of the substrate 11 1max and minimum in-plane thickness T 1min These refer to the maximum and minimum in-plane thickness of the substrate 11, respectively. Maximum in-plane thickness T of the substrate 11 1max and minimum in-plane thickness T 1min These values ​​are determined from SEM images after forming a cross-section of the third adhesive layer 950 with a microtome.

[0318] [Manufacturing method for wiring boards] The wiring board according to this embodiment can be manufactured, for example, by the method shown in Figures 7(a)-(f).

[0319] [Operation of this embodiment] Next, we will describe the operation of this embodiment, which has the above configuration.

[0320] As shown in Figures 33 to 35, the wiring board 10 is incorporated into an image display device 60 having a display device 61. The wiring board 10 is placed on the display device 61 via a touch sensor 73, a fifth adhesive layer 970, a polarizing plate 72, and a third adhesive layer 950. At this time, the wiring board 10 is positioned so that the mesh wiring layer 20 and the conductive layer 76 are held horizontally. Specifically, the shortest distance L between the mesh wiring layer 20 and the conductive layer 76 is... zmin and longest distance L zmax And, L zmin ≥0.9L zmax The wiring board 10 is arranged to satisfy the following relationship. The mesh wiring layer 20 of the wiring board 10 is electrically connected to the communication module 63 of the image display device 60 via the power supply unit 40. In this way, radio waves of a predetermined frequency can be transmitted and received via the mesh wiring layer 20, and communication can be performed using the image display device 60.

[0321] By the way, when transmitting and receiving radio waves using the mesh wiring layer 20 of the wiring board 10, if the mesh wiring layer 20 and the conductive layer 76 are not arranged horizontally to each other, the antenna characteristics of the mesh wiring layer 20 may deteriorate.

[0322] According to this embodiment, as described above, the shortest distance between the mesh wiring layer 20 and the conductive layer 76 in the normal direction of the conductive layer 76 is L zmin The longest distance between the mesh wiring layer 20 and the conductive layer 76 in the direction normal to the conductive layer 76 is L. zmax When L zmin ≥0.9L zmaxIn this configuration, the mesh wiring layer 20 and the conductive layer 76, which is the metal layer closest to the mesh wiring layer 20, are arranged parallel to each other. This prevents the conductive layer 76 and the mesh wiring layer 20 from being strongly electrically coupled, thereby suppressing a decrease in the radiation of radio waves to the outside of the housing 62. As a result, when the wiring board 10 is used as an antenna, a decrease in the antenna characteristics of the mesh wiring layer 20 can be suppressed.

[0323] In this embodiment, the storage modulus of the third adhesive layer 950 at 25°C is 1 × 10⁻⁶. 4 The pressure may be Pa or higher. This hardens the third adhesive layer 950, thereby increasing the horizontality between the wiring board 10 and the conductive layer 76. As a result, when the wiring board 10 is used as an antenna, the deterioration of the antenna characteristics can be suppressed.

[0324] Furthermore, in this embodiment, the maximum in-plane thickness of the substrate 11 is set to T. 1max The minimum in-plane thickness of the substrate 11 is set to T. 1min In that case, T 1min ≥0.9T 1max This is also acceptable. In this way, by making the thickness of the substrate 11 uniform, the horizontality between the wiring board 10 and the conductive layer 76 can be increased. As a result, when the wiring board 10 is used as an antenna, the deterioration of the antenna characteristics can be suppressed.

[0325] Furthermore, in this embodiment, the maximum in-plane thickness of the third adhesive layer 950 is set to T 2max The minimum in-plane thickness of the third adhesive layer 950 is set to T. 2min In that case, T 2min ≥0.9T 2max This is also acceptable. In this way, by making the thickness of the third adhesive layer 950 uniform, the horizontality between the wiring board 10 and the conductive layer 76 can be increased. As a result, when the wiring board 10 is used as an antenna, the deterioration of antenna characteristics can be suppressed.

[0326] Furthermore, in this embodiment, the polarizing plate 72 may be located between the wiring substrate 10 and the touch sensor 73. This allows the gap between the substrate 11 and the touch sensor 73 to be formed using a polarizing plate 72 that is substantially free of metal. As a result, compared to the case where the polarizing plate 72 is located between the touch sensor 73 and the display device 61, it is possible to suppress a decrease in the antenna performance of the mesh wiring layer 20 while keeping the overall thickness of the image display device 60 from increasing.

[0327] It is also possible to combine the multiple components disclosed in each of the above embodiments and variations as needed. Alternatively, some components may be removed from all the components shown in each of the above embodiments and variations.

Claims

1. A wiring substrate having a substrate including a first surface and a second surface located opposite to the first surface, and a mesh wiring layer disposed on the first surface of the substrate, A first adhesive layer located on the first surface side of the substrate, A second adhesive layer located on the second surface side of the substrate, The intermediate layer is located between the wiring board and the first adhesive layer and between the wiring board and the second adhesive layer, The substrate is transparent, A laminate for an image display device, wherein a portion of the substrate is disposed in a portion of the region between the first adhesive layer and the second adhesive layer.

2. The laminate for an image display device according to claim 1, wherein the intermediate layer is located between the wiring substrate and the first adhesive layer, and is located between the wiring substrate and the second adhesive layer.

3. The laminate for an image display device according to claim 1, wherein the thickness of the intermediate layer is 1 μm or more and 50 μm or less.

4. The laminate for an image display device according to claim 1, wherein the refractive index of the intermediate layer is 1.4 or more and 1.6 or less.

5. The laminate for an image display device according to claim 1, wherein the difference between the refractive index of the intermediate layer and the refractive index of the first adhesive layer is 0.1 or less, the difference between the refractive index of the intermediate layer and the refractive index of the substrate is 0.1 or less, and the difference between the refractive index of the intermediate layer and the refractive index of the second adhesive layer is 0.1 or less.

6. The laminate for an image display device according to claim 1, wherein the dielectric loss tangent of the substrate is 0.002 or less.

7. The laminate for an image display device according to claim 1, wherein the relative permittivity of the substrate is 2 or more and 10 or less.

8. The wiring board is a laminate for an image display device according to claim 1, having a radio wave transmission and reception function.

9. The laminate for an image display device according to claim 1, wherein the wiring board further has a power supply unit electrically connected to the mesh wiring layer, and the mesh wiring layer includes a transmission unit connected to the power supply unit and a transmitting / receiving unit connected to the transmission unit.

10. A laminate for an image display device according to any one of claims 1 to 9, An image display device comprising a display device formed by stacking the aforementioned image display device laminates.

11. A wiring substrate having a substrate including a first surface, a second surface located opposite the first surface, and a third surface located between the first surface and the second surface, and a mesh wiring layer disposed on the first surface of the substrate, A first adhesive layer located on the first surface side of the substrate, The substrate comprises a second adhesive layer located on the second surface side, The substrate is transparent, A portion of the substrate is placed in a portion of the region between the first adhesive layer and the second adhesive layer. The third surface of the substrate is covered by at least one of the first adhesive layer and the second adhesive layer. A laminate for an image display device, wherein the surface roughness Ra of the third surface is 0.005 μm or more and 0.5 μm or less.

12. The laminate for image display device according to claim 11, wherein the thickness of the substrate is 2 μm or more and 50 μm or less.

13. The laminate for an image display device according to claim 11, wherein the thickness of the first adhesive layer is 1.5 times or more the thickness of the substrate and 300 μm or less.

14. The laminate for an image display device according to claim 11, wherein the thickness of the second adhesive layer is 1.5 times or more the thickness of the substrate and 300 μm or less.

15. The laminate for an image display device according to claim 11, wherein the first adhesive layer and the second adhesive layer each contain an acrylic resin.

16. The laminate for an image display device according to claim 11, wherein a dummy wiring layer is provided around the mesh wiring layer, electrically independent from the mesh wiring layer.

17. The laminate for an image display device according to claim 11, wherein the dielectric loss tangent of the substrate is 0.002 or less.

18. The laminate for an image display device according to claim 11, wherein the relative permittivity of the substrate is 2 or more and 10 or less.

19. The wiring board has a radio wave transmission and reception function, as described in claim 11, for the laminated image display device.

20. The laminate for an image display device according to claim 11, wherein the wiring board further has a power supply unit electrically connected to the mesh wiring layer, and the mesh wiring layer includes a transmission unit connected to the power supply unit and a transmitting / receiving unit connected to the transmission unit.

21. A laminate for an image display device according to any one of claims 11 to 20, An image display device comprising a display device formed by stacking the aforementioned image display device laminates.

22. A wiring board having a substrate including a first surface, a second surface located opposite the first surface, and a third surface located between the first surface and the second surface, a mesh wiring layer disposed on the first surface of the substrate, and a power supply unit electrically connected to the mesh wiring layer, The power supply unit is equipped with a power supply line electrically connected to the power supply unit, The module has a surface roughness Ra of the third surface of 0.005 μm or more and 0.5 μm or less.

23. A wiring substrate having a substrate including a first surface, a second surface located opposite the first surface, and a third surface located between the first surface and the second surface, and a mesh wiring layer disposed on the first surface of the substrate, A first adhesive layer located on the first surface side of the substrate, The substrate comprises a second adhesive layer located on the second surface side, The substrate is transparent, A portion of the substrate is placed in a portion of the region between the first adhesive layer and the second adhesive layer. The third surface of the substrate is covered with at least the first adhesive layer. A laminate for an image display device, wherein at least a portion of the third surface is inclined outward as it moves from the first surface toward the second surface.

24. The laminate for an image display device according to claim 23, wherein the length between the outermost portion of the third surface and the outermost portion of the first surface, along a direction perpendicular to the normal direction of the first surface, is 0.15 times or more and 2 times or less the length between the outermost portion of the third surface and the outermost portion of the first surface, along the normal direction.

25. In a cross-section along the normal direction of the first surface, the outermost portion of the third surface is located between the first surface and the second surface, and the length between the outermost portion of the third surface and the outermost portion of the second surface, along a direction perpendicular to the normal direction, is 0.15 to 2 times the length between the outermost portion of the third surface and the outermost portion of the second surface, according to claim 23.

26. The laminate for an image display device according to claim 23, wherein the third surface is curved in a cross-section along the normal direction of the first surface.

27. The laminate for an image display device according to claim 23, wherein in a cross-section along the normal direction of the first surface, the third surface is directed outward as it approaches the interface between the first adhesive layer and the second adhesive layer.

28. The laminate for image display device according to claim 23, wherein the thickness of the substrate is 2 μm or more and 50 μm or less.

29. The laminate for an image display device according to claim 23, wherein the thickness of the first adhesive layer is 1.5 times or more the thickness of the substrate and 300 μm or less.

30. The laminate for an image display device according to claim 23, wherein the thickness of the second adhesive layer is 1.5 times or more the thickness of the substrate and 300 μm or less.

31. The laminate for an image display device according to claim 23, wherein the first adhesive layer and the second adhesive layer each contain an acrylic resin.

32. The laminate for an image display device according to claim 23, wherein the thickness of the first adhesive layer is greater than the thickness of the second adhesive layer.

33. The laminate for an image display device according to claim 23, wherein the difference between the thickness of the first adhesive layer and the thickness of the second adhesive layer is 100 μm or less.

34. The laminate for an image display device according to claim 23, wherein a dummy wiring layer is provided around the mesh wiring layer, electrically independent from the mesh wiring layer.

35. The laminate for an image display device according to claim 23, wherein the dielectric loss tangent of the substrate is 0.002 or less.

36. The laminate for an image display device according to claim 23, wherein the relative permittivity of the substrate is 2 or more and 10 or less.

37. The wiring board is a laminate for an image display device according to claim 23, having a radio wave transmission and reception function.

38. The laminate for an image display device according to claim 23, wherein the wiring board further has a power supply unit electrically connected to the mesh wiring layer, and the mesh wiring layer includes a transmission unit connected to the power supply unit and a transmitting / receiving unit connected to the transmission unit.

39. A laminate for an image display device according to any one of claims 23 to 38, An image display device comprising a display device formed by stacking the aforementioned image display device laminates.

40. A wiring board having a substrate including a first surface, a second surface located opposite the first surface, and a third surface located between the first surface and the second surface, a mesh wiring layer disposed on the first surface of the substrate, and a power supply unit electrically connected to the mesh wiring layer, The power supply unit is equipped with a power supply line electrically connected to the power supply unit, A module in which at least a portion of the third surface is inclined outward as it moves from the first surface toward the second surface.

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