Heat dissipation device and cooling unit

Abstract

To provide a heat dissipation device and a cooling unit that efficiently cool a plurality of heat-generating components.SOLUTION: A cooling unit A includes a first heat dissipator 1, a second heat dissipator 2, a first tank 5, and a second tank 6. A coolant flows inside the first heat dissipator, the second heat dissipator, the first tank, and the second tank. The first tank includes a tank-side first outlet 5a through which the coolant flows out to a first cooling device 3, and a tank-side first inlet 5b through which the coolant from the first cooling device flows. The second tank includes a tank-side second outlet 6a through which the coolant flows out to the second cooling device, and a tank-side second inlet 6b through which the coolant from the second cooling device flows. In the first heat dissipator, the coolant that has flowed in from the tank-side first inlet flows from one side in the first direction to the other side in the first direction, and then flows out from the second tank-side outlet. In the second heat dissipator, the coolant that has flowed in from the second tank-side inlet flows from the other side in the first direction to the one side in the first direction, and then flows out from the first tank-side outlet.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a heat dissipation device and a cooling unit.

Background Art

[0002] Conventionally, in order to cool a heat generating element such as a semiconductor element, a cooling device is known in which a cooling plate, a radiator such as a capacitor, and a pump are connected, and a coolant flows through the cycle (for example, Patent Document 1). The cooling device of Patent Document 1 includes two cooling plates and two capacitors, and a refrigerant flow path is formed by connecting the two cooling plates, the two capacitors, and a refrigerant pump in series in order.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the cooling device of Patent Document 1, two cooling plates are directly connected. Therefore, after the refrigerant passes through one cooling plate and absorbs heat, it subsequently flows through the other cooling plate. For this reason, even if the refrigerant cooled in the capacitor can sufficiently cool the first cooling plate, it may not be able to sufficiently cool the second cooling plate.

[0005] The present invention has been made in view of the above problems, and an object thereof is to provide a heat dissipation device and a cooling unit suitable for efficiently cooling a plurality of heat generating components.

Means for Solving the Problems

[0006] An exemplary heat dissipation device of the present invention provides a coolant for the inflow and outflow of a coolant to a first cooling device and a second cooling device. The heat dissipation device includes a first heat sink, a second heat sink, a first tank connected to one side in a first direction of each of the first and second heat sinks, and a second tank connected to the other side in a first direction of each of the first and second heat sinks. The coolant flows inside the first heat sink, the second heat sink, the first tank, and the second tank. The first tank has a first outlet on the tank side for the coolant to flow out to the first cooling device and a first inlet on the tank side for the coolant to flow in from the first cooling device. The second tank has a second outlet on the tank side for the coolant to flow out to the second cooling device and a second inlet on the tank side for the coolant to flow in from the second cooling device. In the first heat sink, the coolant flowing in from the first inlet on the tank side flows from one side in the first direction to the other side in the first direction and flows out from the second outlet on the tank side. In the second heat sink, the coolant flowing in from the second inlet on the tank side flows from the other side in the first direction to one side in the first direction and flows out from the first outlet on the tank side.

[0007] An exemplary cooling unit of the present invention comprises the heat dissipation device described above, the first cooling device, and the second cooling device. The second heat dissipation device, the first heat dissipation device, and the first or second cooling device are arranged in that order with respect to a third direction orthogonal to the first and second directions. [Effects of the Invention]

[0008] According to an exemplary version of the present invention, it is possible to provide a heat dissipation device and a cooling unit suitable for efficiently cooling multiple heat-generating components. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a schematic diagram of a cooling unit equipped with the heat dissipation device of the present invention. [Figure 2] Figure 2 is a schematic diagram of a cooling unit equipped with the heat dissipation device of the present invention. [Figure 3]Figure 3 is an overall perspective view of a cooling unit equipped with a heat dissipation device according to an exemplary first embodiment of the present invention. [Figure 4A] Figure 4A is a partially transparent perspective view of the vicinity of the first tank in a heat dissipation device according to an exemplary first embodiment of the present invention. [Figure 4B] Figure 4B is a cross-sectional perspective view of the first tank of a heat dissipation device according to an exemplary first embodiment of the present invention, when cut along the second direction. [Figure 5A] Figure 5A is a partially transparent perspective view of the vicinity of the second tank in a heat dissipation device according to an exemplary first embodiment of the present invention. [Figure 5B] Figure 5B is a cross-sectional perspective view of the second tank of the heat dissipation device according to an exemplary first embodiment of the present invention, when cut along the second direction. [Figure 6] Figure 6 is a cross-sectional perspective view of a heat dissipation device according to an exemplary first embodiment of the present invention, when cut along the second direction. [Figure 7] Figure 7 is a schematic cross-sectional perspective view of a heat dissipation device according to an exemplary first embodiment of the present invention. [Figure 8A] Figure 8A is a schematic side view of a cooling unit according to an exemplary first embodiment of the present invention. [Figure 8B] Figure 8B is a schematic side view of a cooling unit according to an exemplary first embodiment of the present invention. [Figure 9] Figure 9 is an overall perspective view of a cooling unit equipped with a heat dissipation device according to an exemplary second embodiment of the present invention. [Figure 10] Figure 10 is a schematic cross-sectional view of a heat dissipation device according to an exemplary second embodiment of the present invention. [Figure 11A] Figure 11A is a partially transparent perspective view of the vicinity of the first tank in a heat dissipation device according to an exemplary second embodiment of the present invention. [Figure 11B] Figure 11B is a cross-sectional perspective view of a heat dissipation device according to an exemplary second embodiment of the present invention, when cut along a second direction. [Figure 12A] Figure 12A is a partially transparent perspective view of the vicinity of the second tank in a heat dissipation device according to an exemplary second embodiment of the present invention. [Figure 12B] FIG. 12B is a perspective view of the vicinity of the second tank in the heat dissipation device according to an exemplary second embodiment of the present invention. [Figure 13] FIG. 13 is a schematic partially enlarged perspective view of the cooling unit according to an exemplary second embodiment of the present invention. [Figure 14] FIG. 14 is a schematic perspective view of the first cooling device in the cooling unit according to an exemplary second embodiment of the present invention. [Figure 15A] FIG. 15A is a schematic plan view of the vicinity of the first cooling device in the cooling unit according to an exemplary second embodiment of the present invention. [Figure 15B] FIG. 15B is a schematic cross-sectional view taken along line B-B of FIG. 15A. [Figure 15C] FIG. 15C is a schematic cross-sectional view taken along line C-C of FIG. 15A. [Figure 16] FIG. 16 is an overall perspective view of the state in which various fixing parts are attached to the cooling unit according to an exemplary second embodiment of the present invention. [Figure 17] FIG. 17 is a cross-sectional perspective view when the heat dissipation device according to an exemplary second embodiment of the present invention is cut along the second direction.

Embodiments for Carrying Out the Invention

[0010] Hereinafter, exemplary embodiments of the present invention will be described with reference to the drawings. In this specification, for ease of understanding, the first direction X, the second direction Y, and the third direction Z that are orthogonal to each other are appropriately described. Here, the direction in which the heat dissipation device or the cooling pipe extends is referred to as the "first direction X". Further, the direction orthogonal to the first direction X is referred to as the "second direction Y". Furthermore, the direction orthogonal to the first direction X and the second direction Y is referred to as the "third direction Z".

[0011] Furthermore, one side of the first direction X is referred to as "first direction one side (-X direction)," and the other side as "first direction other side (+X direction)." One side of the second direction Y is referred to as "second direction one side (-Y direction)," and the other side as "second direction other side (+Y direction)." And one side of the third direction Z is referred to as "third direction one side (-Z direction)," and the other side as "third direction other side (+Z direction)."

[0012] Furthermore, for convenience, the second direction Y may sometimes be described as the up-down direction. For example, one side of the second direction Y (-Y direction) indicates the up direction, and the other side of the second direction Y (+Y direction) indicates the down direction. However, the up-down direction, up direction, and down direction are defined for the sake of explanation and do not need to coincide with the vertical direction. Moreover, the up-down direction is defined solely for the sake of explanation and does not limit the orientation of the heat dissipation device and cooling unit when in use according to the present invention. In this specification, "orthogonal directions" does not mean orthogonality in the strict sense, but includes cases where they are orthogonal to the extent that they produce the effects described in this disclosure.

[0013] <First Embodiment> An exemplary first embodiment of the present invention, consisting of a heat dissipation device B and a cooling unit A, will be described. Figure 1 is a schematic diagram of a cooling unit A equipped with the heat dissipation device B of the first embodiment. Figure 2 is a schematic diagram of a cooling unit A equipped with the heat dissipation device B of the first embodiment.

[0014] <Cooling Unit> As shown in Figures 1 and 2, cooling unit A includes a heat dissipation device B, a first cooling device 3, and a second cooling device 4. Heat dissipation device B includes a first heat sink 1, a second heat sink 2, a first tank 5, and a second tank 6. The first tank 5 is located on one side (-X direction) of the first heat sink 1 and the second heat sink 2 in the first direction, and the second tank 6 is located on the other side (+X direction) of the first heat sink 1 and the second heat sink 2 in the first direction.

[0015] Cooling unit A further includes a first pipe 71, a second pipe 72, a third pipe 73, and a fourth pipe 74. One side of the first heat sink 1 is connected to the first cooling device 3 by the first pipe 71. More specifically, one side of the first heat sink 1 is connected to the first cooling device 3 via the first tank 5 by the first pipe 71. Also, one side of the second heat sink 2 is connected to the first cooling device 3 by the second pipe 72. More specifically, one side of the second heat sink 2 is connected to the first cooling device 3 via the first tank 5 by the second pipe 72.

[0016] The other side of the first heat sink 1 and the second cooling device 4 are connected by the third pipe 73. More specifically, the other side of the first heat sink 1 and the second cooling device 4 are connected by the third pipe 73 via the second tank 6. Also, the other side of the second heat sink 2 and the second cooling device 4 are connected by the fourth pipe 74. More specifically, the other side of the second heat sink 2 and the second cooling device 4 are connected by the fourth pipe 74 via the second tank 6.

[0017] The coolant returns to heat dissipation device B from the second radiator 2 of heat dissipation device B through the second pipe 72, the first cooling device 3, and the first pipe 71, and then passes through the first radiator 1 of heat dissipation device B. Furthermore, the coolant returns to heat dissipation device B from the first radiator 1 of heat dissipation device B through the third pipe 73, the second cooling device 4, and the fourth pipe 74, and then passes through the second radiator 2 of heat dissipation device B. After that, it flows again from the second radiator 2 of heat dissipation device B through the second pipe 72.

[0018] In this embodiment, the coolant is a liquid. As the coolant, for example, an antifreeze such as an aqueous solution of ethylene glycol or propylene glycol, or pure water, is used.

[0019] As shown in Figure 2, the first cooling device 3 and the second cooling device 4 are in contact with the heat source, the first heat-generating component R1 and the second heat-generating component R2, and absorb heat from the first heat-generating component R1 and the second heat-generating component R2. Examples of heat-generating components include microprocessors used in computers and power semiconductors used in inverters, etc. The coolant that has absorbed heat in the first cooling device 3 and the second cooling device 4 flows through the first pipe 71 to the fourth pipe 74 to the first heat sink 1 and the second heat sink 2. As the coolant that has absorbed heat passes through the first heat sink 1 and the second heat sink 2, heat is dissipated from the coolant to the outside in the first heat sink 1 and the second heat sink 2.

[0020] More specifically, the coolant that has dissipated heat in the second heat sink 2 flows through the second pipe 72 to the first cooling device 3. The coolant that has absorbed heat from the first heat-generating component R1 in the first cooling device 3 flows through the first pipe 71 to the first heat sink 1. As the coolant flows through the first heat sink 1 along F1 in Figure 2, heat is dissipated from the coolant in the first heat sink 1. The coolant that has dissipated heat in the first heat sink 1 flows through the third pipe 73 to the second cooling device 4. The coolant that has absorbed heat from the second heat-generating component R2 in the second cooling device 4 flows through the fourth pipe 74 to the second heat sink 2. As the coolant flows through the second heat sink 2 along F2 in Figure 2, heat is dissipated from the coolant in the second heat sink 2.

[0021] In cooling unit A, the coolant flows in the above cycle, so that the coolant that has absorbed heat in the first cooling device 3 is released by the first heat sink 1, and the cooled coolant flows into the second cooling device 4. Therefore, it is possible to suppress any unevenness in cooling performance between the first cooling device 3 and the second cooling device 4.

[0022] The first tank 5 has a tank-side first outlet 5a and a tank-side first inlet 5b. In the first tank 5, the flow path opening of the second radiator 2 is in contact with the tank-side first outlet 5a. Also, in the first tank 5, the flow path opening of the first radiator 1 is in contact with the tank-side first inlet 5b. However, in the first tank 5, the tank-side first outlet 5a and the tank-side first inlet 5b are not directly connected. Also, in the first tank 5, the flow path opening of the first radiator 1 and the flow path opening of the second radiator 2 are not directly connected.

[0023] In detail, the first tank 5 has multiple tank chambers that are not directly connected to each other within the first tank 5. For example, the first tank 5 has a first tank chamber 51 and a second tank chamber 52. The first tank chamber 51 and the second tank chamber 52 are separated by a first partition 5p.

[0024] The first outlet 5a on the tank side is connected to the second tank chamber 52. The first outlet 5a on the tank side may be located in the second tank chamber 52. Alternatively, the first outlet 5a on the tank side may be connected to the second tank chamber 52 via the second piping 72.

[0025] The first inlet 5b on the tank side is connected to the first tank chamber 51. The first inlet 5b on the tank side may be provided in the first tank chamber 51. Alternatively, the first inlet 5b on the tank side may be connected to the first tank chamber 51 via the first piping 71.

[0026] The coolant from the first tank 5 flows out to the first cooling device 3 from the first outlet 5a on the tank side. For example, the coolant from the first tank 5 flows from the second tank chamber 52 through the second pipe 72 and flows out to the first cooling device 3 from the first outlet 5a on the tank side. The coolant that has flowed through the first cooling device 3 flows through the first pipe 71 and flows into the first tank chamber 51 from the first inlet 5b on the tank side. The coolant that has flowed into the first tank chamber 51 from the first inlet 5b on the tank side flows through the first heat sink 1.

[0027] The second tank 6 has a second outlet 6a on the tank side and a second inlet 6b on the tank side. In the second tank 6, the flow path opening of the first radiator 1 is in contact with the second outlet 6a on the tank side. Also, in the second tank 6, the flow path opening of the second radiator 2 is in contact with the second inlet 6b on the tank side. However, in the second tank 6, the second outlet 6a on the tank side and the second inlet 6b on the tank side are not directly connected. Also, in the second tank 6, the flow path opening of the first radiator 1 and the flow path opening of the second radiator 2 are not directly connected.

[0028] In detail, the second tank 6 has multiple tank chambers that are not directly connected to each other within the second tank 6. For example, the second tank 6 has a third tank chamber 61 and a fourth tank chamber 62. The third tank chamber 61 and the fourth tank chamber 62 are separated by a second partition 6p.

[0029] The second outlet 6a on the tank side is connected to the third tank chamber 61. The second outlet 6a on the tank side may be located in the third tank chamber 61. Alternatively, the second outlet 6a on the tank side may be connected to the third tank chamber 61 via the third piping 73.

[0030] The second inlet 6b on the tank side is connected to the fourth tank chamber 62. The second inlet 6b on the tank side may be provided in the fourth tank chamber 62. Alternatively, the second inlet 6b on the tank side may be connected to the fourth tank chamber 62 via the fourth piping 74.

[0031] The coolant from the second tank 6 flows out to the second cooling device 4 from the second outlet 6a on the tank side. For example, the coolant from the second tank 6 flows from the second outlet 6a on the tank side of the third tank chamber 61 through the third pipe 73 to the first cooling device 3. The coolant that has flowed through the first cooling device 3 flows from the second inlet 6b on the tank side through the fourth pipe 74 and into the fourth tank chamber 62. The coolant that has flowed into the fourth tank chamber 62 flows through the second heat sink 2.

[0032] <Detailed structure of the first embodiment> Next, with reference to Figure 3, the detailed structure of the heat dissipation device B and cooling unit A in an exemplary first embodiment of the present invention will be described. Figure 3 is an overall perspective view of the cooling unit A equipped with the heat dissipation device B according to an exemplary first embodiment of the present invention.

[0033] <Cooling Unit A> Cooling unit A includes a heat dissipation device B, a first cooling device 3, a second cooling device 4, a first pipe 71, a second pipe 72, a third pipe 73, and a fourth pipe 74. The first tank 5 and the first cooling device 3 are connected by the first pipe 71 and the second pipe 72. The second tank 6 and the second cooling device 4 are connected by the third pipe 73 and the fourth pipe 74.

[0034] <Heat dissipation device B> The heat dissipation device B includes a first heat sink 1, a second heat sink 2, a first tank 5, and a second tank 6. The first tank 5 is attached to one side of the first direction X (-X direction) of the first heat sink 1 and the second heat sink 2. The second tank 6 is attached to the other side of the first direction X (+X direction) of the first heat sink 1 and the second heat sink 2. The first tank 5 and the first cooling device 3 are connected by a first pipe 71 and a second pipe 72. The second tank 6 and the second cooling device 4 are connected by a third pipe 73 and a fourth pipe 74.

[0035] Here, the first heat sink 1 and the second heat sink 2 are arranged side by side in the third direction Z. The first heat sink 1 is located on one side of the third direction Z (-Z direction), and the second heat sink 2 is located on the other side of the third direction Z (+Z direction).

[0036] Furthermore, the first cooling device 3 and the second cooling device 4 are arranged side by side in the X direction. The first cooling device 3 is located on one side of the first direction X (-X direction), and the second cooling device 4 is located on the other side of the first direction X (+X direction). In addition, the first cooling device 3 and the second cooling device 4 are located on one side of the third direction Z (-Z direction) relative to the heat dissipation device B.

[0037] <First cooling device 3 and second cooling device 4> The first cooling device 3 includes a cold plate 31, a pump 32, and a casing 33. The pump 32 is located on one side of the casing 33 in the second direction (-Y direction). Here, the pump 32 is located on the other side of the casing 33 in the third direction (+Z direction) on the plane of the casing 33 in the second direction (-Y direction). The cold plate 31 is located on the other side of the casing 33 in the second direction (+Y direction).

[0038] The second cooling device 4 includes a cold plate 41, a pump 42, and a casing 43. The pump 42 is located on one side of the casing 43 in the second direction (-Y direction). Here, the pump 42 is located on the other side of the casing 43 in the third direction (+Z direction) on the plane of the casing 43 in the second direction (-Y direction). The cold plate 41 is located on the other side of the casing 43 in the second direction (+Y direction).

[0039] The surfaces of cold plates 31 and 41 on the other side of the second direction Y (+Y direction) are in contact with the first heat-generating component R1 and the second heat-generating component R2 (Figure 2), respectively. Coolant passes through the surfaces of cold plates 31 and 41 on one side of the second direction Y (-Y direction). Cold plates 31 and 41 are made of copper or aluminum plates. Cold plates 31 and 41 absorb heat from the heat-generating components (not shown in Figure 3) and transfer the heat to the coolant.

[0040] Pumps 32 and 42 circulate the coolant. Pumps 32 and 42 are centrifugal pumps that draw up coolant from the other side of the second direction Y (+Y direction) and discharge the coolant in a direction perpendicular to the second direction Y. In the first embodiment, pumps 32 and 42 are located on the side of the second direction Y (-Y direction) of casings 33 and 43. However, pumps 32 and 42 may be located in a different location from the first cooling device 3 and the second cooling device 4, and may be located in any of the first to fourth pipes 71 to 74. Here, pumps 32 and 42 are located in the first cooling device 3 and the second cooling device 4, respectively. This maintains redundancy in the cooling unit A and allows the coolant to continue circulating. The number of pumps may be one or three or more.

[0041] As shown in Figures 2 and 3, in the first cooling device 3, the casing 33 has a first inlet 331 and a first outlet 332. The first inlet 331 is connected to the second piping 72. The first outlet 332 is connected to the first piping 71. The casing 33 has a flow path inside. In the first cooling device 3, the coolant flowing in from the first inlet 331 flows through the flow path inside the casing 33 to the cold plate 31 and the pump 32, and flows out from the first outlet 332.

[0042] In the second cooling device 4, the casing 43 has a second inlet 431 and a second outlet 432. The second inlet 431 is connected to the third pipe 73. The second outlet 432 is connected to the fourth pipe 74. In the second cooling device 4, the coolant flowing in from the second inlet 431 flows through the passage in the casing 43 to the cold plate 41 and the pump 42, and flows out from the second outlet 432.

[0043] <First heat sink 1 and second heat sink 2> The structure of the heat dissipation device B will be described with reference to Figures 4A to 6. Figure 4A is a schematic partially enlarged perspective view showing the vicinity of the first tank 5 of the heat dissipation device B according to an exemplary first embodiment of the present invention. Figure 4B is a cross-sectional perspective view of the first tank 5 of the heat dissipation device according to an exemplary first embodiment of the present invention when cut along the second direction Y. Figure 5A is a schematic partially enlarged perspective view showing the vicinity of the second tank 6 of the heat dissipation device B according to an exemplary first embodiment of the present invention. Figure 5B is a cross-sectional perspective view of the second tank 6 of the heat dissipation device B according to an exemplary first embodiment of the present invention when cut along the second direction Y. Figure 6 is a cross-sectional perspective view of the heat dissipation device B according to an exemplary first embodiment of the present invention when cut along the second direction Y.

[0044] As shown in Figures 4A to 6, the first heat sink 1 has a first cooling tube 11 and a first fin 12. Here, the first heat sink 1 has a plurality of first cooling tubes 11 and a plurality of first fins 12. The first cooling tube 11 is a tubular component made of a metal material with excellent thermal conductivity, such as copper or aluminum, and extends in a first direction X.

[0045] The first fin 12 extends from the first cooling tube 11 in the second direction Y. Here, the first fin 12 is a plate-shaped component made of a metal material with excellent thermal conductivity, such as copper or aluminum. The first fin 12 is formed by extending in the second direction Y and also extending in a corrugated shape in the first direction X. By forming the first fin 12 in a corrugated shape, the surface area in contact with the air is increased, improving heat dissipation.

[0046] Multiple first cooling tubes 11 and multiple first fins 12 are stacked alternately in the second direction Y. The first fins 12 are in contact with the outer surface of each of the multiple first cooling tubes 11. More specifically, the first cooling tubes 11 and the first fins 12 are connected by brazing. As the heat-absorbing coolant passes through the inside of the first cooling tubes 11, the heat from the coolant is transferred from the first cooling tubes 11 to the first fins 12 and released to the outside through the first fins 12.

[0047] The second heat sink 2 has a second cooling tube 21 and a second fin 22. Here, the second heat sink 2 has multiple second cooling tubes 21 and multiple second fins 22. The second heat sink 2 has the same configuration as the first heat sink 1 except for its size and position, so a redundant explanation is omitted.

[0048] As shown in Figure 6, the first heat sink 1 and the second heat sink 2 each extend in the first direction X. The first heat sink 1 and the second heat sink 2 are arranged side by side in the third direction Z. Here, the size of the first heat sink 1 is larger than that of the second heat sink 2. More specifically, the length of the first heat sink 1 along the second direction Y is approximately equal to the length of the second heat sink 2 along the second direction Y, but the length of the first heat sink 1 along the third direction Z is larger than the length of the second heat sink 2 along the third direction Z. Therefore, when viewing the cross-sections of the first heat sink 1 and the second heat sink 2 cut along the second direction Y, the cross-sectional area of ​​the first heat sink 1 is larger than that of the second heat sink 2.

[0049] <First Tank 5 and Second Tank 6> Next, the structures of the first tank 5 and the second tank 6 will be described with reference to Figures 4A to 5B.

[0050] As shown in Figures 4A and 4B, a first tank 5 is positioned on one side of the first direction X (-X direction) of the first heat sink 1 and the second heat sink 2. The first tank 5 is divided into a first tank chamber 51 and a second tank chamber 52 by a first partition 5p. Here, the first partition 5p extends in the second direction Y, separating the first tank 5 in the third direction Z. The first tank chamber 51 is located on one side of the third direction (-Z direction), and the second tank chamber 52 is located on the other side of the third direction (+Z direction). The first tank chamber 51 is connected to one side of a plurality of first cooling pipes 11 and to the first outlet 332 of the first cooling device 3 shown in Figures 2 and 3. The second tank chamber 52 is connected to one side of a plurality of second cooling pipes 21 and to the first inlet 331 of the first cooling device 3. The first pipe (connecting pipe) 71 is connected to the first tank chamber 51. The second pipe (connecting pipe) 72 is connected to the second tank chamber 52. A portion of the second pipe 72 passes through the first tank chamber 51. By arranging a portion of the second pipe 72 to pass through the first tank chamber 51, the width of the cooling unit A in the first direction X can be reduced.

[0051] As shown in Figures 5A and 5B, a second tank 6 is positioned on the other side of the first direction X (+X direction) of the first heat sink 1 and the second heat sink 2. The second tank 6 is divided into a third tank chamber 61 and a fourth tank chamber 62 by a second partition 6p. Here, the second partition 6p extends in the second direction Y, separating the second tank 6 in the third direction Z. The third tank chamber 61 is located on one side of the third direction (-Z direction), and the fourth tank chamber 62 is located on the other side of the third direction (+Z direction). The third tank chamber 61 is connected to the other side of the plurality of first cooling pipes 11 and to the second inlet 431 of the second cooling device 4 shown in Figures 2 and 3. The fourth tank chamber 62 is connected to the other side of the plurality of second cooling pipes 21 and to the second outlet 432 of the second cooling device 4. The third pipe (connecting pipe) 73 is connected to the third tank chamber 61. The fourth pipe (connecting pipe) 74 is connected to the fourth tank chamber 62. A portion of the fourth pipe 74 passes through the third tank chamber 61. By arranging a portion of the fourth pipe 74 to pass through the third tank chamber 61, the width of the cooling unit A in the first direction X can be reduced.

[0052] By providing the first tank 5 and the second tank 6, the capacity of the coolant in the cooling unit A can be increased. The coolant in the cooling unit A gradually decreases as it evaporates from pipe connections and other points. This decrease in coolant can reduce the cooling capacity of heat-generating components. In contrast, by providing the first tank 5 and the second tank 6, the amount of coolant can be ensured, and the decrease in cooling capacity can be reduced.

[0053] In this embodiment, the heat dissipation device B flows coolant into and out of the first cooling device 3 and the second cooling device 4. The heat dissipation device B includes a first heat sink 1, a second heat sink 2, a first tank 5, and a second tank 6. The first tank 5 is connected to one side (-X direction) of the first heat sink 1 and the second heat sink 2, respectively. The second tank 6 is connected to the other side (+X direction) of the first heat sink 1 and the second heat sink 2, respectively. The coolant flows inside the first heat sink 1, the second heat sink 2, the first tank 5, and the second tank 6.

[0054] The first tank 5 has a tank-side first outlet 5a from which coolant flows out to the first cooling device 3, and a tank-side first inlet 5b from which coolant flows in from the first cooling device 3. The second tank 6 has a tank-side second outlet 6a from which coolant flows out to the second cooling device 4, and a tank-side second inlet 6b from which coolant flows in from the second cooling device 4. In the first radiator 1, the coolant flowing in from the tank-side first inlet 5b flows from one side of the first direction (-X direction) to the other side of the first direction (+X direction) and flows out from the tank-side second outlet 6a. In the second radiator 2, the coolant flowing in from the tank-side second inlet 6b flows from the other side of the first direction (+X direction) to one side of the first direction (-X direction) and flows out from the tank-side first outlet 5a.

[0055] According to the heat dissipation device B of this embodiment, the first cooling device 3 can be cooled by the coolant dissipated by the second heat sink 2, and the second cooling device 4 can be cooled by the coolant dissipated by the first heat sink 1. As a result, the circulation of the coolant allows the first heat sink 1 and the second heat sink 2 to efficiently dissipate heat and efficiently cool the first cooling device 3 and the second cooling device 4. Furthermore, since the inflow and outflow of coolant to the first cooling device 3 is performed from the first tank 5, and the inflow and outflow of coolant to the second cooling device 4 is performed from the second tank 6, a shortage of circulating coolant due to evaporation is suppressed. In addition, the complexity of the configuration of the first piping 71 to the fourth piping 74 connecting the heat dissipation device B to the first cooling device 3 and the second cooling device 4 can be suppressed.

[0056] The first heat sink 1 has a first cooling tube 11 and a first fin 12. The first cooling tube 11 extends in a first direction X. Coolant passes through the first cooling tube 11. The first fin 12 is in contact with the outer surface of the first cooling tube 11. The first fin 12 extends in a second direction Y which is perpendicular to the first direction X.

[0057] The second heat sink 2 has a second cooling tube 21 and a second fin 22. The second cooling tube 21 extends in a first direction X. Coolant passes through the second cooling tube 21. The second fin 22 is in contact with the outer surface of the second cooling tube 21. The second fin 22 extends in a second direction Y.

[0058] The first heat sink 1 and the second heat sink 2 are arranged in a third direction Z that is perpendicular to the first direction X and the second direction Y. The first tank 5 is divided into a first tank chamber 51 and a second tank chamber 52 by a first partition 5p. The first tank chamber 51 is connected to the first inlet 5b on the tank side. The second tank chamber 52 is connected to the first outlet 5a on the tank side.

[0059] The second tank 6 is divided into a third tank chamber 61 and a fourth tank chamber 62 by a second partition 6p. The third tank chamber 61 is connected to the second outlet 6a on the tank side. The fourth tank chamber 62 is connected to the second inlet 6b on the tank side.

[0060] By arranging the first heat sink 1 and the second heat sink 2 in a direction (Z direction) perpendicular to the direction (Y direction) in which the first fin 12 and the second fin 22 extend from the first cooling tube 11 and the second cooling tube 21, respectively, the cooling performance can be adjusted according to the cross-sectional area of ​​the first heat sink 1 and the second heat sink 2.

[0061] Cooling unit A further includes a first pipe 71, a second pipe 72, a third pipe 73, and a fourth pipe 74. The first pipe 71 connects the first tank chamber 51 to the first cooling device 3. The second pipe 72 connects the second tank chamber 52 to the first cooling device 3. The third pipe 73 connects the third tank chamber 61 to the second cooling device 4. The fourth pipe 74 connects the fourth tank chamber 62 to the second cooling device 4. As a result, the coolant can efficiently circulate through the heat dissipation device B, the first cooling device 3, and the second cooling device 4.

[0062] The second pipe 72 passes through the first tank chamber 51 and through the first partition 5p to connect to the second tank chamber 52. This allows the overall size of the heat dissipation device B to be reduced, even when the second pipe 72 is connected to the second tank chamber 52, which is located on the side away from the first cooling device 3, because the second pipe 72 passes through the first tank chamber 51 to connect. Similarly, the fourth pipe 74 passes through the third tank chamber 61 and through the second partition 6p to connect to the fourth tank chamber 62. This allows the overall size of the heat dissipation device B to be reduced, even when the fourth pipe 74 is connected to the fourth tank chamber 62, which is located on the side away from the second cooling device 4, because the fourth pipe 74 passes through the third tank chamber 61 to connect.

[0063] Next, an exemplary heat dissipation device B according to the first embodiment of the present invention will be described with reference to Figure 7. Figure 7 is a schematic cross-sectional view of an exemplary heat dissipation device B according to the first embodiment of the present invention.

[0064] As shown in Figure 7, when wind W blows toward the heat dissipation device B, it is preferable that the wind W blows from the other side of the third direction Z (+Z direction) of the heat dissipation device B. In this case, the other side of the third direction Z (+Z direction) of the heat dissipation device B is located upwind of the wind W. In the heat dissipation device B, the first heat sink 1 and the second heat sink 2 are arranged side by side in the third direction Z. The first heat sink 1 is located on one side of the third direction Z (-Z direction), and the second heat sink 2 is located on the other side of the third direction Z (+Z direction).

[0065] In this case, because the cross-sectional area of ​​the first heat sink 1 is larger than that of the second heat sink 2, even if the temperature of the air that passes through the first heat sink 1, which releases the heat absorbed by the first cooling device 3, is higher than the temperature of the air that passes through the second heat sink 2, which releases the heat absorbed by the second cooling device 4, the heat dissipation performance of the first heat sink 1 and the second heat sink 2 can be adjusted to be roughly the same.

[0066] The heat dissipation performance of the first heat sink 1 and the second heat sink 2 is affected by the temperature and strength of the air or wind flowing around them, so the heat dissipation performance of the first heat sink 1 and the second heat sink 2 may differ depending on their position. In the first embodiment, wind W flows from the second heat sink 2 in the third direction Z. Therefore, air carrying heat released from the second heat sink 2 flows through the first heat sink 1. Since the air flowing through the first heat sink 1 carries heat released from the second heat sink, if the first heat sink 1 and the second heat sink 2 are the same size, even if air passes through the first heat sink 1, it may not release heat to the same extent as the second heat sink 2. For this reason, by making the size of the first heat sink 1 larger than that of the second heat sink 2, the surface area in contact with the first heat sink 1 by the outside air becomes larger, thus improving the heat dissipation performance of the first heat sink 1. Therefore, coolant at the same temperature as the coolant flowing into the first cooling device 3 flows into the second cooling device 4, making it possible to equalize the cooling performance in the first cooling device 3 and the second cooling device 4.

[0067] Thus, when the cross-sections obtained by cutting the first heat sink 1 and the second heat sink 2 along the second direction Y are viewed from the first direction X, the cross-sectional area of ​​the first heat sink 1 is larger than the cross-sectional area of ​​the second heat sink 2. By making the cross-sectional area of ​​the first heat sink 1 larger than that of the second heat sink 2, the cooling performance of the first heat sink 1 and the second heat sink 2 can be made uniform.

[0068] Next, an exemplary first embodiment of the present invention, the cooling unit A, will be described with reference to Figures 1 to 8B. Figure 8A is a schematic side view of the exemplary first embodiment of the present invention, the cooling unit A. Figure 8B is a schematic side view of the exemplary first embodiment of the present invention, the cooling unit A. Although the second cooling device 4 has a similar configuration to the first cooling device 3, the first cooling device 3 will be described here with reference to Figures 8A and 8B.

[0069] As described above, in cooling unit A, one side of the first heat sink 1 and the first cooling device 3 are connected by a first pipe 71 via the first tank 5. One side of the second heat sink 2 and the first cooling device 3 are connected by a second pipe 72 via the first tank 5.

[0070] <Pipe 1, 71-74> As described above, the pumps 32 and 42 mounted on the first cooling device 3 and the second cooling device 4 are centrifugal pumps. Centrifugal pumps are pumps that draw up cooling water from the other side of the second direction Y (+Y direction) to one side of the second direction Y (-Y direction) and discharge the cooling water in the centrifugal direction (first direction X or third direction Z).

[0071] In the first cooling device 3, the first inlet 331 and the first outlet 332 are located on the other side of the third direction Z (+Z direction) relative to the casing 33. Also, in the first cooling device 3, the first inlet 331 is located on one side of the second direction Y (-Y direction) relative to the first outlet 332. Therefore, the position of the second pipe 72 connected to the first inlet 331 is located on the other side of the second direction Y relative to the position of the first pipe 71 connected to the first outlet 332.

[0072] Figures 8A and 8B show the configuration of the first cooling device 3 in cooling unit A, but the second cooling device 4 has a similar configuration to the first cooling device 3. Therefore, in the second cooling device 4, the second inlet 431 is located on the other side of the second direction Y than the second outlet 432. The position of the third pipe 73 connected to the second inlet 431 is located on the other side of the second direction Y than the position of the fourth pipe 74 connected to the second outlet 432.

[0073] The first cooling device 3 includes a cold plate 31, a pump 32, and a casing 33. The pump 32 is located on one side of the second direction (-Y direction) relative to the casing 33. The pump 32 is a centrifugal pump. In the first cooling device 3, the first piping 71 is located on one side of the second direction (-Y direction) relative to the second piping 72.

[0074] In accordance with the configuration of a centrifugal pump that draws up coolant from the other side of the second direction (+Y direction) and flows it in the circumferential direction, the flow path of the coolant within the first cooling device 3 can be simplified by positioning the first pipe 71, from which the coolant flows out of the first cooling device 3, to one side of the second direction (-Y direction) than the second pipe 72, from which the coolant flows into the first cooling device 3.

[0075] In cooling unit A, the second heat sink 2, the first heat sink 1, and the first cooling device 3 are arranged in that order with respect to the third direction Z, which is orthogonal to the first direction X and the second direction Y.

[0076] Cooling unit A includes a heat dissipation device B, a first cooling device 3, and a second cooling device 4. In cooling unit A, the second heat dissipation device 2, the first heat dissipation device 1, and the first cooling device 3 or the second cooling device 4 are arranged in that order with respect to a third direction Z that is orthogonal to the first direction X and the second direction Y. This allows air to flow efficiently to the first fin 12 and the second fin 22 while avoiding obstruction of the airflow by the first cooling device 3 or the second cooling device 4.

[0077] In the heat dissipation device B shown in Figures 2 to 8B, the first heat sink 1 and the second heat sink 2 are positioned side by side in the third direction Z, but this embodiment is not limited to this. The first heat sink 1 and the second heat sink 2 may be positioned side by side in the second direction Y.

[0078] Furthermore, in the heat dissipation device B and / or cooling unit A shown in Figures 2 to 8B, the first partition 5p separates the first tank 5 in the third direction Z, and the first tank chamber 51 and the second tank chamber 52 are located side by side in the Y direction, but this embodiment is not limited to this. Also, in the second partition 6p separates the second tank 6 in the third direction Z, and the third tank chamber 61 and the fourth tank chamber 62 are located side by side in the Y direction, but this embodiment is not limited to this.

[0079] Furthermore, in the first cooling device 3 of the cooling unit A shown in Figures 8A and 8B, the first outlet 332 is positioned on the other side of the second direction (+Y direction) from the first inlet 331, and in the second cooling device 4, the second outlet 432 is positioned on the other side of the second direction (+Y direction) from the second inlet 431. However, this embodiment is not limited to this. In the first cooling device 3, the first outlet 332 may be positioned at the same height as the first inlet 331 in the second direction Y, and in the second cooling device 4, the second outlet 432 may be positioned at the same height as the second inlet 431 in the second direction Y.

[0080] <Second Embodiment> Next, an exemplary second embodiment of the present invention, consisting of a heat dissipation device B and a cooling unit A, will be described. First, with reference to Figure 9, a cooling unit A equipped with an exemplary second embodiment of the present invention, consisting of a heat dissipation device B, will be described. Figure 9 is an overall perspective view of a cooling unit A equipped with an exemplary second embodiment of the present invention, consisting of a heat dissipation device B.

[0081] As shown in Figure 9, cooling unit A includes a heat dissipation device B, a first cooling device 3, and a second cooling device 4. Heat dissipation device B includes a first heat sink 1A, a second heat sink 2A, a first tank 5A, and a second tank 6A. The first heat sink 1A and the second heat sink 2A ​​are arranged in the second direction Y. Here, the first heat sink 1A is stacked relative to the second heat sink 2A ​​in the second direction Y. The first tank 5A is located on one side of the first direction (-X direction) of the first heat sink and the second heat sink 2A, and the second tank 6A is located on the other side of the first direction (+X direction) of the first heat sink and the second heat sink 2A.

[0082] The first heat sink 1A has a portion 1Aa and a portion 1Ab separated from portion 1Aa. In the first heat sink 1A, portions 1Aa and 1Ab are arranged side by side in the third direction Z. Portion 1Aa is located on one side of the third direction (-Z direction), and portion 1Ab is located on the other side of the third direction (+Z direction).

[0083] The second heat sink 2A ​​has a portion 2Aa and a portion 2Ab separated from portion 2Aa. In the second heat sink 2A, portions 2Aa and 2Ab are arranged side by side in the third direction Z. Portion 2Aa is located on one side of the third direction (-Z direction), and portion 2Ab is located on the other side of the third direction (+Z direction).

[0084] Part 1Aa of the first heat sink 1A is positioned alongside part 2Aa of the second heat sink 2A ​​in the second direction Y. Also, part 1Ab of the first heat sink 1A is positioned alongside part 2Ab of the second heat sink 2A ​​in the second direction Y.

[0085] Here, the dimensions of sections 1Aa and 2Aa are larger than those of sections 1Ab and 2Ab. More specifically, the lengths of sections 1Aa and 2Aa along the second direction Y are approximately equal to the lengths of sections 1Ab and 2Ab along the second direction Y, but the lengths of sections 1Aa and 2Aa along the third direction Z are larger than the lengths of sections 1Ab and 2Ab along the third direction Z. Therefore, when viewing the cross-sections of the first heat sink 1A and the second heat sink 2A ​​cut along the second direction Y, the cross-sectional area of ​​the first heat sink 1A is larger than the cross-sectional area of ​​the second heat sink 2A.

[0086] Cooling unit A further includes a first pipe 71, a second pipe 72, a third pipe 73, and a fourth pipe 74. One side of the first radiator 1A is connected to the first cooling device 3 by the first pipe 71. More specifically, one side of the first radiator 1A is connected to the first cooling device 3 via the first tank 5A and the first pipe 71. Also, one side of the second radiator 2A is connected to the first cooling device 3 by the second pipe 72. More specifically, one side of the second radiator 2A is connected to the first cooling device 3 via the first tank 5A and the second pipe 72.

[0087] The other side of the first heat sink 1A and the second cooling device 4 are connected by the third pipe 73. More specifically, the other side of the first heat sink 1A and the second cooling device 4 are connected by the third pipe 73 via the second tank 6A. Also, the other side of the second heat sink 2A ​​and the second cooling device 4 are connected by the fourth pipe 74. More specifically, the other side of the second heat sink 2A ​​and the second cooling device 4 are connected by the fourth pipe 74 via the second tank 6A.

[0088] Next, an exemplary second embodiment of the heat dissipation device B and cooling unit A of the present invention will be described with reference to Figures 9 and 10. Figure 10 is a schematic cross-sectional view of the heat dissipation device B of the exemplary second embodiment of the present invention. In this embodiment, the first heat sink 1A and the second heat sink 2A ​​are arranged side by side in the second direction Y.

[0089] The first tank 5A is positioned on one side of the first direction X (-X direction) of the first heat sink 1A and the second heat sink 2A. The first tank 5A has a first tank chamber 51A and a second tank chamber 51B. The first tank chamber 51A and the second tank chamber 51B are arranged side by side in the second direction Y, and the first tank chamber 51A is located on one side of the second direction (-Y direction) of the second tank chamber 51B. The first tank chamber 51A is located on one side of the first direction X (-X direction) of parts 1Aa and 1Ab of the first heat sink 1A. The second tank chamber 51B is located on one side of the first direction X (-X direction) of parts 2Aa and 2Ab of the second heat sink 2A.

[0090] Similarly, the second tank 6A is positioned on the other side of the first direction X (+X direction) of the first heat sink 1A and the second heat sink 2A. The second tank 6A has a third tank chamber 61A and a fourth tank chamber 61B. The third tank chamber 61A and the fourth tank chamber 61B are provided in the second direction Y, and the third tank chamber 61A is located on one side of the second direction (-Y direction) of the fourth tank chamber 61B. The third tank chamber 61A is located on the other side of the first direction X (+X direction) of parts 1Aa and 1Ab of the first heat sink 1A. The fourth tank chamber 61B is located on the other side of the first direction X (+X direction) of parts 2Aa and 2Ab of the second heat sink 2A.

[0091] In this embodiment as well, the cooling performance of the first cooling device 3 and the second cooling device 4 can be made uniform.

[0092] Next, an exemplary second embodiment of the present invention, heat dissipation device B, will be described with reference to Figures 9 to 11B. Figure 11A is a partially transparent perspective view of the vicinity of the first tank 5A in the exemplary second embodiment of the present invention, heat dissipation device B. Figure 11B is a cross-sectional perspective view of the exemplary second embodiment of the present invention, cut along the second direction Y.

[0093] As shown in Figures 11A and 11B, the first heat sink 1A has a portion 1Aa and a portion 1Ab. Each of the portions 1Aa and 1Ab has a first cooling tube 11 and a first fin 12.

[0094] The second heat sink 2A ​​has a portion 2Aa and a portion 2Ab. Each of the portions 2Aa and 2Ab has a second cooling tube 21 and a second fin 22. In the exemplary second embodiment of the present invention, the first cooling tube 11, the first fin 12, the second cooling tube 21 and the second fin 22 are the same as in the exemplary first embodiment of the present invention, and redundant explanations are omitted.

[0095] As shown in Figure 11A, a first tank 5A is positioned on one side of the first direction X (-X direction) of the first heat sink 1A and the second heat sink 2A. The first tank 5A is divided into a first tank chamber 51A and a second tank chamber 51B by a first partition 5p. Here, the first partition 5p extends in the third direction Z, separating the first tank 5A in the second direction Y. The first tank chamber 51A is located on one side of the second direction (-Y direction), and the second tank chamber 51B is located on the other side of the second direction (+Y direction). The first tank chamber 51A is connected to one side of the multiple first cooling pipes 11 in parts 1Aa and 1Ab of the first heat sink 1A. The second tank chamber 52 is connected to one side of the multiple second cooling pipes 21 in parts 2Aa and 2Ab of the second heat sink 2A. The first pipe 71 is connected to the first tank chamber 51A. The second pipe 72 is connected to the second tank chamber 51B.

[0096] As shown in Figure 11B, here, the first pipe 71 and the second pipe 72 each extend in the first direction X, similar to the first radiator 1A and the second radiator 2A.

[0097] Next, an exemplary second embodiment of the heat dissipation device B of the present invention will be described with reference to Figures 12A and 12B. Figure 12A is a partially transparent perspective view of the vicinity of the second tank 6A in the exemplary second embodiment of the heat dissipation device B of the present invention. Figure 12B is a perspective view of the vicinity of the second tank 6A in the exemplary second embodiment of the heat dissipation device B of the present invention. In Figure 12B, the first heat sink 1A of the heat dissipation device B is covered from one side in the second direction (-Y direction).

[0098] As shown in Figures 12A and 12B, a second tank 6A is located on the other side of the first direction X (+X direction) of the first heat sink 1A and the second heat sink 2A. The second tank 6A is divided into a third tank chamber 61A and a fourth tank chamber 61B by a second partition 6p. Here, the second partition 6p extends in the third direction Z, separating the second tank 6A in the second direction Y. The third tank chamber 61A is located on one side of the second direction (-Y direction), and the fourth tank chamber 61B is located on the other side of the second direction (+Y direction). The third tank chamber 61A is connected to the other side of the plurality of first cooling pipes 11 in parts 1Aa and 1Ab of the first heat sink 1A. The fourth tank chamber 62 is connected to the other side of the plurality of second cooling pipes 21 in parts 2Aa and 2Ab of the second heat sink 2A. The third pipe 73 is connected to the third tank chamber 61A. The fourth pipe 74 is connected to the fourth tank chamber 61B.

[0099] As shown in Figure 12B, here, the third pipe 73 and the fourth pipe 74, respectively, extend in the first direction X, similar to the first radiator 1A and the second radiator 2A.

[0100] The first heat sink 1A has a first cooling tube 11 and a first fin 12. The first cooling tube 11 extends in a first direction X. Coolant passes through the first cooling tube 11. The first fin 12 is in contact with the outer surface of the first cooling tube 11. The first fin 12 extends in a second direction Y that is perpendicular to the first direction X with respect to the first cooling tube 11.

[0101] The second heat sink 2A ​​has a second cooling tube 21 and a second fin 22. The second cooling tube 21 extends in a first direction X. Coolant passes through the second cooling tube 21. The second fin 22 is in contact with the outer surface of the second cooling tube 21. The second fin 22 extends in a second direction Y.

[0102] The first radiator 1A and the second radiator 2A are arranged in the second direction Y. The first tank 5A is divided into a first tank chamber 51A and a second tank chamber 51B by a first partition 5p. The first tank chamber 51A is connected to the first inlet 5b on the tank side. The second tank chamber 51B is connected to the first outlet 5a on the tank side.

[0103] The second tank 6 is divided into a third tank chamber 61A and a fourth tank chamber 61B by a second partition 6p. The third tank chamber 61A is connected to the second outlet 6a on the tank side. The fourth tank chamber 61B is connected to the second inlet 6b on the tank side.

[0104] The first fin 12 extends in the Y direction from the first cooling tube 11. The second fin 22 extends in the Y direction from the second cooling tube 21. By arranging the first heat sink 1A and the second heat sink 2A ​​in the direction (Y direction) from the first cooling tube 11 and the second cooling tube 21 to the first fin 12 and the second fin 22, respectively, the cooling performance of the first heat sink 1A and the second heat sink 2A ​​can be easily made uniform.

[0105] Next, the first cooling device 3 and the second cooling device 4 in the exemplary second embodiment of the present invention will be described with reference to Figures 13 and 14. Figure 13 is a schematic partially enlarged perspective view of the exemplary second embodiment of the present invention. Figure 14 is a schematic perspective view of the first cooling device 3 in the exemplary second embodiment of the present invention. Since the second cooling device 4 has the same configuration as the first cooling device 3, a redundant explanation will be omitted.

[0106] As shown in Figures 13 and 14, the first cooling device 3 includes a cold plate 31, a pump 32, and a casing 33. The pump 32 is located on one side of the casing 33 in the second direction (-Y direction). Here, the pump 32 is located approximately in the center of the third direction on the plane of the casing 33 on one side in the second direction (-Y direction). The cold plate 31 is located on the other side of the casing 33 in the second direction (+Y direction).

[0107] In the first cooling device 3, the casing 33 has a first inlet 331 and a first outlet 332. The first inlet 331 is connected to the second pipe 72. The first outlet 332 is connected to the first pipe 71. The casing 33 has a flow path inside. In the first cooling device 3, the coolant flowing in from the first inlet 331 flows through the flow path inside the casing 33 to the cold plate 31 and the pump 32, and flows out from the first outlet 332. In the first cooling device 3, the second pipe 72 connected to the first inlet 331 and the first pipe 71 connected to the first outlet 332 are located at the same height in the second direction (Y direction).

[0108] Next, the first cooling device 3 and the second cooling device 4 in the cooling unit A according to an exemplary second embodiment of the present invention will be described with reference to Figures 15A to 15C. Figure 15A is a schematic plan view of the first cooling device 3 in the cooling unit A according to an exemplary second embodiment of the present invention. Figure 15B is a schematic cross-sectional view along line BB in Figure 15A. Figure 15C is a schematic cross-sectional view along line CC in Figure 15A. Here again, the second cooling device 4 has the same configuration as the first cooling device 3, so a redundant explanation will be omitted.

[0109] As shown in Figures 15A to 15C, a cooling device tank chamber 34 is provided inside the casing 33. The cooling device tank chamber 34 is located in the flow path connecting the first inlet 331 and the cold plate 31.

[0110] When the coolant that has flowed through the second pipe 72 enters the first inlet 331 of the first cooling device 3, it flows into the cooling device tank chamber 34. The cross-sectional area of ​​the cooling device tank chamber 34 is larger than the cross-sectional area of ​​the flow path of the first inlet 331. The coolant that has passed through the cooling device tank chamber 34 flows in the other direction of the second direction (+Y direction) and comes into contact with the cold plate 31. The coolant flows along the cold plate 31 in the third direction (-Z direction) to the other side of the second direction Y (+Y direction) of the pump 32. The coolant is then sucked up by the pump 32 in the second direction Y (-Y direction), flows in a direction perpendicular to the second direction Y, and flows out of the first outlet 332 of the first cooling device 3 through the first pipe 71.

[0111] Thus, the first cooling device 3 includes a pump 32, a casing 33, and a cooling device tank chamber 34. The cooling device tank chamber 34 is located inside the casing 33. The pump 32 is located on one side of the second direction (-Y direction) relative to the casing 33. The pump 32 is a centrifugal pump. In the first cooling device 3, the first piping 71 and the second piping 72 are located at the same height in the second direction (Y direction).

[0112] The first cooling device 3 can be made thinner by positioning the first pipe 71, from which the coolant flows out of the first cooling device 3, at the same height in the second direction (Y direction) as the second pipe 72, from which the coolant flows into the first cooling device 3.

[0113] <Fixed structure> Next, with reference to Figure 16, the fixing structures of the heat dissipation device B, the first cooling device 3, and the second cooling device 4 will be described. Figure 16 is an overall perspective view of the cooling unit A according to an exemplary second embodiment of the present invention with various fixing parts attached.

[0114] The first heat sink 1A and the second heat sink 2A ​​are fixed to each other by a heat sink fixing component 81. If the first heat sink 1A and the second heat sink 2A ​​are separate components, the first heat sink 1A and the second heat sink 2A ​​are fixed to the heat sink fixing component 81, making it easier to transport the first heat sink 1A and the second heat sink 2A.

[0115] The heat sink fixing component 81 extends in the first direction X. Here, the heat sink fixing component 81 covers the heat sink B from both sides, one side in the second direction (-Y direction) and the other side in the second direction (+Y direction). For example, the heat sink fixing component 81 is welded to the first fin 12 of the first heat sink 1A and the second fin 22 of the second heat sink 2A.

[0116] The first cooling device 3 and the second cooling device 4 are fixed to the heat sink by a cooling device fixing component 82 which connects to the heat sink fixing component 81. For example, the cooling device fixing component 82 is a plate member of a metal with excellent thermal conductivity, such as copper or aluminum.

[0117] The cooling device fixing component 82 fixes the first cooling device 3 to the heat sink fixing component 81. The cooling device fixing component 82 extends from the heat sink fixing component 81 in one third direction (-Z direction) and supports the first cooling device 3 from one second direction (-Y direction). Similarly, the cooling device fixing component 82 fixes the second cooling device 4 to the heat sink fixing component 81. The cooling device fixing component 82 extends from the heat sink fixing component 81 in one third direction (-Z direction) and supports the second cooling device 4 from one second direction (-Y direction).

[0118] The cooling device fixing component 82 facilitates the transport of the separate components, namely the first heat sink 1A, the second heat sink 2A, the first cooling device 3, and the second cooling device 4. It also allows for the determination of the relative positions of each component. For example, the cooling device fixing component 82 is a plate member made of a metal with excellent thermal conductivity, such as copper or aluminum.

[0119] The cooling device fixing component 82 is positioned in contact with the surface of the heat sink fixing component 81 on the other side in the second direction (+Y direction), and the two are fixed together. As a result, when the length of the cooling unit A in the second direction Y is determined, the position of the heat sink fixing component 81 is determined based on the length of the first heat sink 1A and the second heat sink 2A ​​in the second direction Y, so that the length of the first heat sink 1A and the second heat sink 2A ​​in the second direction Y can be made to the maximum extent possible.

[0120] Thus, the cooling unit A further includes a heat sink fixing component 81 for fixing the first heat sink 1A and the second heat sink 2A. Since the heat sink fixing component 81 can fix the first heat sink 1A and the second heat sink 2A, which are separate components, the transport of the first heat sink 1A and the second heat sink 2A ​​can be facilitated.

[0121] Furthermore, the cooling unit A further includes a cooling device fixing component 82 that fixes the first cooling device 3 and the second cooling device 4 to the heat sink fixing component 81. The cooling device fixing component 82 allows the separate components of the first heat sink 1A, the second heat sink 2A, the first cooling device 3, and the second cooling device 4 to be fixed together, thus facilitating the transport of the cooling unit A.

[0122] Although an exemplary second embodiment of the cooling unit A having a heat sink fixing component 81 and a cooling device fixing component 82 has been described with reference to Figure 16, it goes without saying that the exemplary first embodiment of the cooling unit A may also have a heat sink fixing component 81 and a cooling device fixing component 82. In this case, the heat sink fixing component 81 may support the first heat sink 1 and the second heat sink 2 of the heat dissipation device B from at least one of the second direction side (-Y direction) and the other second direction side (+Y direction).

[0123] In the heat dissipation device B shown in Figures 9, 11A, 11B, and 13, the first heat sink 1A and the second heat sink 2A ​​are stacked in the second direction Y, and the first heat sink 1A is separated into a portion 1Aa and a portion 1Ab located on the other side of the third direction Z (+Z direction) relative to portion 1Aa, and the second heat sink 2A ​​is separated into a portion 2Aa and a portion 2Ab located on the other side of the third direction Z (+Z direction) relative to portion 2Aa. However, this embodiment is not limited to this. The first heat sink 1A does not have to be separated into a portion 1Aa and a portion 1Ab, and the second heat sink 2A ​​does not have to be separated into a portion 2Aa and a portion 2Ab.

[0124] Next, an exemplary second embodiment of the present invention, heat dissipation device B, will be described with reference to Figure 17. Figure 17 is a cross-sectional perspective view of the exemplary second embodiment of the present invention, cut along the second direction Y.

[0125] As shown in Figure 17, the first heat sink 1A extends in the first direction X. The first heat sink 1A has a plurality of first cooling tubes 11 and a plurality of first fins 12. The second heat sink 2A ​​has a plurality of second cooling tubes 22 and a plurality of second fins 22. Here again, the first heat sink 1A and the second heat sink 2A ​​are arranged in the second direction Y. For example, the first heat sink 1A and the second heat sink 2A ​​are stacked in the second direction Y. Thus, the first heat sink 1A and the second heat sink 2A ​​may be stacked in the second direction Y without being separated in the third direction Z.

[0126] Embodiments of the present invention have been described above with reference to the drawings. However, the above embodiments are merely illustrative of the present invention, and the present invention is not limited to the above embodiments, and can be implemented in various forms without departing from the spirit of the invention. The drawings schematically show each component in order to facilitate understanding, and the thickness, length, number, etc. of each component shown may differ from the actual dimensions due to the convenience of drawing creation. Furthermore, the material, shape, dimensions, etc. of each component shown in the above embodiments are examples and are not particularly limited, and various modifications are possible without substantially departing from the effects of the present invention. The configuration of the embodiments may be modified as appropriate without exceeding the technical idea of ​​the present invention. Also, embodiments may be combined to the extent possible.

[0127] For example, in the cooling unit A shown in Figure 2, the first heat-generating component R1 and the second heat-generating component R2 were separate, but this embodiment is not limited to this. The first heat-generating component R1 and the second heat-generating component R2 may be different components within a single device that is configured as an integral part. [Explanation of Symbols]

[0128] A... Cooling unit B...Heat dissipation device 1...1st radiator 2...Second heat sink 3...1st cooling device 4...Second cooling device 5. Tank No. 1 51... Tank Room 1 52... Second Tank Room 6. Second Tank 61...Third Tank Room 62... Tank Room No. 4 7. Piping 71...First piping 72...Second pipe 73.. Third pipe 74...4th pipe 81... Heat sink fixing parts 82. Cooling device fixing parts

Claims

1. A heat dissipation device that flows coolant into and out of a first cooling device and a second cooling device, First heat sink and, The second heat sink, A first tank connected to one side in the first direction of each of the first heat sink and the second heat sink, A second tank connected to the other side in the first direction of each of the first and second heat sinks, It has, The coolant flows through the first heat sink, the second heat sink, the first tank, and the second tank. The first tank has a tank-side first outlet for discharging the coolant to the first cooling device and a tank-side first inlet for the coolant from the first cooling device. The second tank has a tank-side second outlet for discharging the coolant to the second cooling device and a tank-side second inlet for the coolant to flow in from the second cooling device. In the first heat sink, the coolant flowing in from the first inlet on the tank side flows from one side in the first direction to the other side in the first direction and flows out from the second outlet on the tank side. In the second heat sink, the coolant flowing in from the second inlet on the tank side flows from the other side in the first direction to the one side in the first direction and flows out from the first outlet on the tank side.

2. The first heat sink is, A first cooling pipe through which the cooling liquid passes and which extends in a first direction, A first fin that is in contact with the outer surface of the first cooling tube and extends in a second direction perpendicular to the first direction, It has, The second heat sink is, A second cooling pipe through which the aforementioned cooling liquid passes and which extends in the first direction, A second fin that contacts the outer surface of the second cooling tube and extends in the second direction It has, The first heat sink and the second heat sink are arranged in the second direction. The first tank comprises a first tank chamber connected to the first inlet on the tank side, The first outlet on the tank side and the second tank chamber connected thereto are separated by a first partition. The heat dissipation device according to claim 1, wherein the second tank is divided by a second partition into a third tank chamber connected to the second outlet on the tank side and a fourth tank chamber connected to the second inlet on the tank side.

3. The first heat sink is, A first cooling pipe through which the cooling liquid passes and which extends in a first direction, A first fin that is in contact with the outer surface of the first cooling tube and extends in a second direction perpendicular to the first direction, It has, The second heat sink is, A second cooling pipe through which the aforementioned cooling liquid passes and which extends in the first direction, A second fin that contacts the outer surface of the second cooling tube and extends in the second direction It has, The first heat sink and the second heat sink are arranged in a third direction perpendicular to the first and second directions. The first tank is divided by a first partition into a first tank chamber connected to the first inlet on the tank side and a second tank chamber connected to the first outlet on the tank side. The heat dissipation device according to claim 1, wherein the second tank is divided by a second partition into a third tank chamber connected to the second outlet on the tank side and a fourth tank chamber connected to the second inlet on the tank side.

4. The heat dissipation device according to claim 3, wherein when the cross-sectional surfaces obtained by cutting the first heat sink and the second heat sink along the second direction are viewed from the first direction, the cross-sectional area of ​​the first heat sink is larger than the cross-sectional area of ​​the second heat sink.

5. A heat dissipation device according to claim 3 or claim 4, The first cooling device and, The second cooling device and It has, A cooling unit in which the second heat sink, the first heat sink, and the first cooling device or the second cooling device are arranged in that order with respect to a third direction perpendicular to the first and second directions.

6. A first piping connecting the first tank chamber and the first cooling device, A second pipe connecting the second tank chamber and the first cooling device, A third pipe connecting the third tank chamber and the second cooling device, The fourth piping connecting the fourth tank chamber and the second cooling device The cooling unit according to claim 5, further comprising the above.

7. The second piping passes through the first tank chamber and through the first partition to connect with the second tank chamber. The cooling unit according to claim 6, wherein the fourth pipe passes through the third tank chamber, penetrates the second partition, and connects to the fourth tank chamber.

8. The first cooling device is Casing and, A centrifugal pump located on one side of the casing in the second direction, It has, The cooling unit according to claim 6 or 7, wherein the first piping is located on one side in the second direction relative to the second piping in the first cooling device.

9. The first cooling device is Casing and, A cooling system tank chamber located inside the casing, A centrifugal pump located on one side of the casing in the second direction, It has, The cooling unit according to claim 6 or 7, wherein the first piping and the second piping are located at the same height in the second direction.

10. The cooling unit according to any one of claims 5 to 9, further comprising a heat sink fixing component for fixing the first heat sink and the second heat sink.

11. The cooling unit according to claim 10, further comprising a cooling device fixing component for fixing the first cooling device and the second cooling device to the heat sink fixing component.

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