Flow guide structures and thermal shielding structures for deposition uniformity and process controllability, and related methods

Abstract

The present disclosure relates to a flow guide structure and a thermal shielding structure for deposition uniformity and process tunability, and related methods. In one embodiment, an apparatus for substrate processing includes a chamber body that includes a processing space. The apparatus includes one or more heat sources. The apparatus includes a flow guide structure positioned within the processing space. The flow guide structure includes one or more first flow dividers that divide the processing space into a plurality of flow levels, and one or more second flow dividers that intersect the one or more first flow dividers and are oriented to divide each of the plurality of flow levels into a plurality of flow sections. The flow guide structure includes one or more third flow dividers that intersect the one or more second flow dividers and are oriented to divide the plurality of flow sections into a plurality of flow zones.