Method and apparatus for forming and preparing electronic components

Abstract

The present invention relates to methods and apparatus for forming and preparing electronic components.

Description

[Technical Field]

[0001] The present invention relates to a method and apparatus for forming and preparing electronic components.

[0002] Conventional technology includes several methods for interconnecting multiple substrates. In particular, there are several methods for bonding individual components, which can also be considered as substrates, to another larger substrate, such as a wafer. In many cases, it is necessary to ensure that the interfaces between substrates or between components are free from contaminants, especially oxides or nitrides. A cleaning step is performed to ensure a contaminant-free state.

[0003] Furthermore, after cleaning, surface modification is very frequently required to improve bonding between substrates and ensure the functionality of subsequent components. Such surface treatments are particularly important in direct bonding, where dielectric or semiconductor surfaces are bonded to each other. Of particular importance in this regard is the bonding of so-called hybrid surfaces, which consist of dielectric regions, especially oxide regions, and electrical regions for contact connections.

[0004] In conventional techniques, surface treatment is often performed after the substrate has been individualized into components, because the surface to be treated is damaged and contaminated during the individualization process. In this case, performing surface treatment on individualized components is not easy because the small surface size requires a high degree of accuracy and precision in the treatment method. Furthermore, other surfaces or the vacuum environment may be contaminated by the surface treatment.

[0005] In the prior art, these method steps are preferably performed in a vacuum environment. The drawback here is that in a vacuum environment, other method steps cannot be performed at all or can only be performed to a very limited extent.

[0006] One of the method steps that is difficult or impossible to perform in a vacuum environment is the individualization of a single substrate (component substrate) into individual components. Individualization of the substrate by mechanical, optical, or chemical means inevitably results in particle formation. Particles are undesirable in a vacuum environment because they contaminate the entire vacuum environment. It is certainly possible to make the vacuum environment consist of individual modules that are closed off from each other, thereby limiting contamination to only one module. However, it is even more advantageous if the substrate can be individualized into components outside of the vacuum environment.

[0007] After the substrate is individualized into individual components, these individualized components are surface-treated to ensure good bonding to the product substrate or to further components. In this regard, it is particularly important that the individualized components, especially the treated component surfaces, are prepared without contamination. An interface is formed or exists between the component and the product substrate, having specific properties in particular to ensure the functionality of the component.

[0008] Prior art describes apparatuses and methods capable of treating or cleaning component surfaces with oxygen and / or nitrogen compounds. Here, the treatment and cleaning of component surfaces are performed, in part, in separate apparatuses, each operating under vacuum. However, each component is subsequently removed from the apparatus and thus exposed to the atmosphere. This contaminates the freshly cleaned and activated surface of the individualized components. Subsequently, the components are bonded to a product substrate in a separate apparatus. Further contamination of the component surface may occur along this path. This contamination increases the number of defective components and the processing costs.

[0009] Therefore, an object of the present invention is to present a method and apparatus for forming and preparing parts that at least partially, and especially completely, eliminates the drawbacks described in the prior art. In particular, an object of the present invention is to present an improved method and apparatus for forming and preparing parts. In particular, an object of the present invention is to present a method and apparatus for forming and preparing parts that reduces the rejection rate of parts. Furthermore, an object of the present invention is to present a method and apparatus for forming and preparing parts that is particularly reliably executable or particularly reliably operates without contamination. Furthermore, an object of the present invention is to present a method and apparatus for forming and preparing parts that can protect the processed surface, in particular the part interface provided for bonding.

[0010] The above problems are solved by the features of multiple parallel independent claims. Advantageous developments of the present invention are described in each dependent claim. Furthermore, all combinations of at least two features described in the specification, claims, and / or drawings fall within the scope of the present invention. With respect to the numerical ranges described, values ​​within that range can also be considered disclosed as limit values, and any combination can be claimed.

[0011] Therefore, the present invention relates to a method for forming and preparing electronic components, comprising at least the following steps, namely, i) A step of preparing a first substrate having a first substrate surface and a second substrate surface, ii) A step of performing a surface treatment on the surface of the first substrate, and thereafter, iii) The step of applying a protective layer to the treated first substrate surface, and iv) Steps to separate the circuit board into components. Regarding a method that includes in that order.

[0012] The present invention further relates to an apparatus for forming electronic components, comprising at least a surface treatment means for surface treatment of a first substrate surface of a first substrate, a means for adhering a protective layer to the first substrate surface, and an individualization means for individualizing the first substrate into components, wherein the apparatus is configured such that the first substrate surface is first treatable by the surface treatment means, and then the protective layer can be adhered to the treated first substrate surface.

[0013] In this case, the protective layer does not necessarily have to be a polymer protective layer. The protective layer can be a polymer, oxide, nitride, metal, metal alloy, etc. That is, the protective layer may be conductive or dielectric and therefore have covalent, metallic, or ionic bonding properties. In this case, the protective layer is formed to be removable, preferably completely removable, so that it can be removed again later. The oxide protective layer can be removed, for example, by ion implantation.

[0014] As an example, the present invention will describe a polymer-based protective layer. The use of a polymer as the protective layer is particularly preferred.

[0015] The method and apparatus can advantageously protect the surface treatment or the treated surface. Specifically, the protective layer protects the treated surface from contaminants, particularly from particle contamination and atmospheric contamination that occurs when the substrate is individualized into components. Thus, the treated surface is advantageously preserved. Furthermore, the treated surface can be made fully functional again, advantageously at a later point, particularly immediately before bonding. This allows for a more flexible configuration of the process. Additionally, the first substrate can be transported more easily after the protective layer is applied. The treated surface can be advantageously protected when transporting the functionalized first substrate from the manufacturer to further processing, particularly during individualization and bonding to product substrates.

[0016] The surface to be protected on the substrate or component is preferably a hybrid bonding surface. A hybrid bonding surface is a surface primarily composed of oxides, within which metallic regions, particularly copper, are present. Copper is particularly preferred for the methods and apparatus described herein. The metallic regions are contact locations for electrical contact connections of the functional regions of the component. In this case, the removal of oxygen and / or nitrogen compounds by cleaning means stripping the compounds until the corresponding electrical regions are exposed or cleaned. The surface to be protected may also be a pure dielectric surface, particularly a pure oxide surface.

[0017] Furthermore, surface treatment can be advantageously performed over the entire surface of the substrate, which should be individualized. Thus, more efficient formation of components is possible. Moreover, the method and apparatus for forming and preparing electronic components can be used to protect the surface from atmospheric contamination outside of a vacuum. Another advantageous aspect of the present invention is the protection of the surface of a first component from multiple components to be bonded to the substrate. In other words, by applying a protective layer to the surface of the first substrate, this surface is maintained after surface modification or surface treatment of the first substrate surface until the end of further method steps. This allows the method to be carried out with significantly greater flexibility. In this way, contamination during formation and preparation is reduced overall, and the error rate of electronic components is also reduced.

[0018] In a preferred embodiment of a method for forming and preparing electronic components, the surface treatment in step ii) includes at least one cleaning, plasma treatment, and / or coating of the surface of the first substrate. Preferably, at least two of the above-described surface treatments are performed. This is advantageous because all necessary method steps that should be performed for impeccable functionality and bonding can be protected by a protective layer. Therefore, further surface treatment of the component that would otherwise be performed later does not need to be performed before bonding. This makes the component more flexibly available and usable. Thus, the manufacturing and preparation of the component can be carried out with more efficient contamination reduction by cleaning, plasma treatment, and / or coating of the surface of the first substrate. In particular, the individualization of the substrate can also be advantageously carried out outside of a vacuum environment. In this way, the treated surface protected by the protective layer can be prepared advantageously immediately before bonding. Therefore, contamination by the cleaning, plasma treatment, or coating (surface treatment) itself is also eliminated.

[0019] In a preferred embodiment of a method for forming and preparing electronic components, the cleaning is configured to include at least one chemical cleaning and / or preferably a physical cleaning by sputtering. In this way, the surface can be prepared particularly purely without contamination. Particularly advantageous is the removal of all oxygen and / or nitrogen compounds. In this regard, the cleaning here is intended to ensure a suitable surface.

[0020] In a preferred embodiment of a method for forming and preparing an electronic component, a coating with water is performed for hydrophilization of the first substrate surface. Thus, the surface can be advantageously prepared for bonding with other components or product substrates. Preferably, first at least one chemical cleaning is performed, followed by at least one physical cleaning, particularly for the removal of oxygen compounds and / or nitrogen compounds, and subsequently at least one plasma treatment and / or coating, particularly a coating with water. Thereby, in particular, the semiconductor surface is prepared for subsequent direct bonding.

[0021] In a preferred embodiment of a method for forming and preparing an electronic component, after the singulation in step iv), the components each have one first component surface and one second component surface each, where a protective layer is deposited on each of the first component surfaces. By doing so, after singulation, it is possible to advantageously guarantee the functionality of the protected surface. Furthermore, the singulated components can be well transported and stored in this way, and can also be used flexibly in further processes.

[0022] In a preferred embodiment of a method for forming and preparing an electronic component, after the singulation in step iv), the components are configured to be fixed on a support substrate on the second component surface side. This fixing advantageously enables precise alignment and fixing positioning with respect to the product substrate. More preferably, a plurality of components can be transferred from the support substrate simultaneously. Thus, a regular arrangement of the individual components is guaranteed. In this way, efficient transfer between various modules can be performed. In this case, the processed component surface is protected by the protective layer on the first surface of the component.

[0023] In a preferred embodiment of the method for forming and preparing electronic components, before the singulation in step iv), the first substrate is configured to be prepared on the second substrate on the surface side of the second substrate. By positioning the substrate on the second substrate before singulation, advantageously, it can be ensured that each component is pre-positioned on the second substrate as desired after singulation. Also, subsequently, each component can be transferred together with the second substrate.

[0024] In a preferred embodiment of the method for forming and preparing electronic components, before the singulation in step iv), the first substrate is configured to be prepared on the second substrate on the surface side of the first substrate having a protective layer. In other words, the first substrate is present on the second substrate together with the protective layer before singulation. By doing so, the processed surface can be better protected during singulation. Because the singulation means acts on the first substrate particularly from the rear side of the first substrate, that is, from the side of the surface of the second substrate. Therefore, the processed surface is further kept away from the influence of the singulation means also. Also, the influence of the approach to the second substrate or the influence of the approach to the surface of the second substrate facing the first substrate is minimized.

[0025] In a preferred embodiment of the method for forming and preparing electronic components, the second substrate is configured to be a film. The film is particularly planned for the use here because a temporary fixation of the components singulated before bonding is desired. Note that the components can be easily removed from the film without much effort. Also, the film can be conveniently and appropriately selected according to individual applications. Such films can advantageously be purchased already coated. For example, the film can be coated appropriately in advance and can be optimally selected based on the predicted process parameters.

[0026] In a preferred embodiment of a method for forming and preparing electronic components, a film is configured to have an adhesive layer, and a first substrate is fixed onto the adhesive layer. In this case, the adhesive layer provides secure fixation of the first substrate or individualized components on the film. The adhesive layer is particularly suitable for easily detaching the individualized components from the film again. The adhesive layer also provides a bonding layer that minimizes contamination of the components compared to alternative fastening means.

[0027] In a preferred embodiment of a method for forming and preparing electronic components, the method is further configured to include, after individualization in step iv), step v) removing a protective layer from the first component surface of the component. By removing the protective layer, advantageously, the pre-treated surface can be prepared for bonding. Thus, further surface treatment after individualization, particularly cleaning, is unnecessary. In addition, the protective layer of each component can be removed individually and in a timely manner in relation to the treatment state of the surface to be bonded.

[0028] In a preferred embodiment of a method for forming and preparing electronic components, the removal of the protective layer in step v) is configured to be performed under vacuum. The pressure in the vacuum is less than 1 bar, preferably less than 1 mbar, and more preferably 10 mbar. -5 Less than mbar, and more preferably 10 -9 Less than mbar, most preferably 10 -12 The vacuum level is up to mbar. In this way, it is advantageous to prevent further contamination of the treated surface by the atmosphere. Furthermore, most of the methods described here can be advantageously performed under vacuum, although some surface treatments cannot be adequately performed under vacuum. Therefore, the treated part surface can be prepared with particular certainty without contamination.

[0029] In a preferred embodiment of a method for forming and preparing electronic components, in step v), before removing the protective layer, the component is picked up by a pick-and-place tool on the second component surface and fixed to the pick-and-place tool. In this case, the component is placed on the second substrate with a treated surface having a protective layer and is therefore particularly well protected. The pick-and-place tool advantageously allows for the individual pick-up and delivery of components. It also allows for particularly precise alignment of these components with respect to the surface to be bonded. In this case, specific components can be selectively picked up and fixed. For example, only components that have passed prior electrical testing, or only components that have specific characteristics required on the product substrate to be bonded, can be picked up. Here, the components are advantageously contacted on the second component surface. Therefore, contact on the treated first component surface is not required. Thus, the components can be particularly easily contacted and picked up by the pick-and-place tool with respect to the easily accessible second component surface. This approach advantageously eliminates the need to rotate the component for bonding the first component surface, particularly for bonding with the product substrate.

[0030] In a preferred embodiment of a method for forming and preparing electronic components, the removal of the protective layer is performed while the component is fixed to a pick-and-place tool. This allows the removal of the protective layer to be performed individually and without endangering adjacent components. Furthermore, the removal of the protective layer can be advantageously performed at another location. Thus, the second substrate is not endangered by the means for removing the protective layer or other components.

[0031] An advantageous aspect of the forming and preparation method is the protection of the surfaces of multiple components to be bonded to a substrate. A particularly advantageous aspect is that the surface-modified portion of the substrate is protected by coating the substrate with a protective layer. Surface modification is, for example, preferably plasma treatment. By applying a protective layer to the substrate surface after surface modification, the surface-modified portion is maintained until further method steps are completed. This allows the method to be executed with considerable flexibility. Thus, contamination during forming and preparation is reduced, and the error rate of electronic components is also reduced.

[0032] Therefore, another aspect of the forming and preparing methods and apparatus is that the method steps requiring surface treatment can be performed before the surface is coated with a protective layer. In particular, it is advantageous that the method steps required for the manufacture of the article can be performed at the start of the method.

[0033] parts In this specification, a component, in particular an electronic component, is understood to be a particularly functional object that is bonded to a substrate. A component is preferably a chip, MEMS, LED, microchip, or similar component. These are fabricated from a single substrate. The component may have its own component alignment marks, or geometric features such as corners, lines, or structural parts of the component may be used as component alignment marks.

[0034] First circuit board / component circuit board The first substrate or component substrate refers to a substrate used for manufacturing a component. The functional area of ​​the subsequent component is preferably formed by a wafer-level process. This process may require numerous method steps to form the functional part of the subsequent component. At the end of the process, the substrate is individualized. For example, components can be individualized from the substrate using a saw, wire, laser, or other auxiliary means.

[0035] Second substrate / support substrate The second substrate or support substrate refers to a substrate to which each component is relatively aligned and temporarily bonded. The second substrate or support substrate is used exclusively for temporarily housing components. The second substrate has, in particular, a plurality of alignment marks along the surface of the support substrate used to align components relative to the second substrate. These alignment marks are therefore also referred to as component alignment marks. Furthermore, the second substrate may have alignment marks that allow it to align itself relative to the third substrate. These alignment marks may therefore also be referred to as substrate alignment marks. The second substrate may consist of any material, in particular a film stretched over a frame.

[0036] Third substrate / product substrate The third substrate or product substrate is a substrate onto which components from the second substrate are transferred. The third substrate preferably has alignment marks to enable relative alignment with respect to the second substrate. These alignment marks are referred to as substrate alignment marks, similar to the marks on the second substrate. The product substrate or product substrate stack has a surface to which components are bonded, i.e., a surface having a surface treatment. The surface treatment optimizes the bonding characteristics between the surfaces to be bonded, particularly by optimally adjusting the first substrate surface or the first component surface to match the surface of the product substrate.

[0037] Module system A module system, sometimes also called a vacuum system or cluster, is understood to be a set of related modules. Each module has at least one device. A characteristic feature of the module system is that the substrate is not exposed to the atmosphere between the various method steps and therefore can always be operated under vacuum. A particularly preferred feature of the proposed module system is that components fixed on the substrate or a second substrate can be operated on consistently under vacuum without being exposed to the atmosphere between the various method steps. Once the substrate is located within the module system, it continues to be processed under a particularly optimal vacuum environment. More preferably, each module of the module system can be individually evacuated.

[0038] The following description will elaborate on several special modules, preferably part of a modular system, to enable the formation and preparation methods to be carried out. These modules will also be mentioned in the order of use in the manufacturing method.

[0039] Transport of substrates or substrate stacks in a module system is preferably carried out by a robot located in the center of the module system or movable along a rail system.

[0040] Therefore, a modular system can be considered as a device for forming and preparing things.

[0041] Coating module The module system or apparatus for forming and preparing includes a coating module, which allows a bonding layer and / or protective layer to be applied to the substrate. In this case, the coating module particularly preferably forms means for applying the protective layer. The bonding layer is particularly preferably applied to a second substrate surface or a second component surface for easier bonding. However, the coating module is an optional means. For example, it is also possible to coat the substrate with the bonding layer and / or protective layer outside the module system and only introduce it into the module system at the end. This is particularly advantageous when the manufacturer of the functionalized first substrate applies the protective layer to the first substrate immediately after functionalization or surface treatment.

[0042] Therefore, if it is desirable to have a coated module within the module system, at least one bonding layer can be applied. Unlike a protective layer, this bonding layer can be unnecessarily contaminated when the functionalized substrate is transported from the manufacturer to the module system.

[0043] Individualized module If a module system has individualized modules, the circuit board can be individualized within the module system. Similarly, individualization can be performed outside the module system, and the already individualized components can be supplied into the module system.

[0044] Pick and Place Module The pick-and-place module has the task of picking up individual components and aligning them on a support substrate or a second substrate. Furthermore, the pick-and-place module performs component alignment and contact connection relative to the product substrate. In particular, if the surface-treated first substrate surface is coated with a protective layer before individualization, the pick-and-place module can easily receive, align, position, and bond each component. If the support substrate itself is coated over its entire surface with a bonding layer, or if the second substrate has an adhesive layer, the components are bonded directly to the bonding layer on the support substrate or fixed to the adhesive layer.

[0045] Cleaning module The cleaning module forms a means for removing the protective layer from the component in particular. It is also possible that the cleaning module is located outside the module system. In this case, the component would be supplied to the module system without the protective layer. However, in a particularly preferred embodiment, the cleaning module is also part of the module system, and therefore advantageously, the protective layer is removed only under vacuum, so the treated surface does not come into contact with the atmosphere.

[0046] Surface treatment module A surface treatment module is part of an apparatus for forming and preparing electronic components. The surface treatment module treats the surface of a first substrate. In this case, the first substrate surface is particularly cleaned, and its bonding properties are further improved, for example, by surface activation, plasma treatment, or deposition of another layer. Specifically, the treatment of the component surface involves the removal of oxygen and / or nitrogen compounds. Since the first component surface remains reactive after the removal of oxygen and / or nitrogen compounds and should not be exposed to the atmosphere, the surface treatment module is preferably part of a module system. The surface treatment module may be, for example, a plasma chamber or an ion beam chamber. Preferably, this is an ion beam chamber, such as the one described in International Publication No. 2015197112.

[0047] In particular, the surface treatment module includes means for activating the surface of a first component or the surface of a first substrate.

[0048] In the surface treatment module, it is also possible to make the surface of the first component or the surface of the first substrate hydrophilic.

[0049] In the surface treatment module, it is also possible to apply a special layer to further improve the bonding between the component and the product substrate.

[0050] Bonding module After the first component surface or the first substrate surface is treated in the surface treatment module, bonding is performed, in particular, between the component and the first component surface on the product substrate. In this case, the protective layer on the treated component surface is removed before bonding. At this time, the product substrate is aligned relative to the support substrate, or the component picked up by the pick-and-place tool is aligned relative to the product substrate. Subsequently, the bonding module bonds the aligned or positioned component onto the product substrate. Here, alignment is preferably performed via alignment marks present on the support substrate and the product substrate. Therefore, the bonding module preferably has an optical alignment device. Furthermore, the bonding module preferably has means for contacting the product substrate to the component.

[0051] Debonding module After contact connection between the product substrate and the component, the bond between the component and the support substrate can be weakened or completely eliminated. If the component is bonded to the support substrate, the adhesion between the second component surface and the support substrate can be reduced by debonding means. When the component is transferred to a second substrate, particularly a film, and especially when individualized, a pick-and-place tool can be used as a debonding means. Such a debonding means allows for selective transfer, advantageously, when only specific components are to be debonded.

[0052] The following exemplary methods have, in particular, the most important method steps essential to the method of forming and preparing. Those skilled in the art will understand that several other method steps not expressly mentioned may also be part of the present method.

[0053] Surface treatment Surface treatment refers to any action applied to a surface, particularly a substrate surface, that can create improved bonding properties for that substrate surface. Therefore, surface treatment specifically refers to: • Cleaning, especially • Chemical cleaning • Physical cleaning, especially • By sputtering, in particular • Removal of oxide compounds, • Removal of nitrogen compounds, Plasma processing, especially Plasma treatment for reservoir formation, • Plasma treatment to adjust surface roughness, • Coating, especially • Water-based coating for hydrophilicization of the substrate surface. This applies.

[0054] Surface roughness is described as average roughness, squared roughness, or average roughness depth. The values ​​calculated for average roughness, squared roughness, and average roughness depth generally differ for the same measurement interval or area, but are within the same order of magnitude. Therefore, the following numerical ranges for roughness should be understood as either average roughness, squared roughness, or average roughness depth. In this case, the roughness is less than 100 μm, preferably less than 10 μm, more preferably less than 1 μm, even more preferably less than 100 nm, and most preferably less than 10 nm.

[0055] The criterion for determining hydrophilicity or hydrophobicity is the contact angle formed between the test droplet, particularly water, and the measurement surface. On hydrophilic surfaces, the adhesive force between the liquid and the surface is dominant, exceeding the cohesive force of the liquid, resulting in a low contact angle and thus a flat droplet. On hydrophobic surfaces, the cohesive force of the liquid is dominant, exceeding the adhesive force between the liquid and the surface, resulting in a spherical droplet. For the method and apparatus, a hydrophilic substrate surface is preferred because it is particularly well suited for melt bonding. Therefore, the contact angle is preferably less than 90°, more preferably less than 45°, more preferably less than 20°, even more preferably less than 5°, and most preferably less than 1°.

[0056] The purity of the substrate surface is preferably described particularly by the number and size of organic residues. The size of the residues occurring on the substrate surface is particularly less than 100 nm, preferably less than 90 nm, more preferably less than 80 nm, very preferably less than 70 nm, and most preferably less than 60 nm. The number of residues found having the selected maximum size is particularly less than 1000 particles / wafer, preferably less than 500 particles / wafer, more preferably less than 250 particles / wafer, very preferably less than 100 particles / wafer, and most preferably less than 50 particles / wafer.

[0057] The surface treated by the surface treatment forms an interface with the product substrate after the bonding process.

[0058] Generally, the resulting interface can be said to be optically and / or mechanically and / or thermally and / or electrically ideal. In this case, being ideal means that the optical properties and / or mechanical properties and / or thermal properties and / or electrical properties that should be achieved as well as possible are achieved by the surface treatment, particularly by the removal of harmful oxides and / or nitrides.

[0059] Being mechanically ideal means that as efficient an adhesion as possible between the component and the product substrate is obtained by the mechanical properties of the interface, particularly the bonding strength. In particular, the bonding strength between the component and the product substrate for hydrophilic fusion bonding resulting from the contact connection of the oxide surface in the component and / or the oxide surface in the product substrate is 1 m 2 characterized by the surface energy required for the separation of the unit area. The bonding strength here is particularly more than 0.5 J / m 2 and preferably more than 1.0 J / m 2 and more preferably more than 1.5 J / m 2 and very preferably more than 2.5 J / m 2 and most preferably more than 2.5 J / m 2 and is.

[0060] Optically ideal means that electromagnetic radiation can pass through the interface as smoothly as possible, preferably with no or very little intensity loss. The transmittance here is particularly greater than 10%, preferably greater than 50%, more preferably greater than 75%, very preferably greater than 95%, and most preferably greater than 99%.

[0061] Thermally ideal means that heat flow can pass through the interface as smoothly as possible, preferably with no heat loss or very little heat loss. Here, the heat loss is particularly less than 50%, preferably less than 25%, more preferably less than 10%, very preferably less than 5%, and most preferably less than 1%.

[0062] Electrically ideal means that the conductivity across the entire interface is as high as possible. Here, conductivity is greater than 1 S / m, preferably greater than 10 S / m, and more preferably 10 2 S / m greater than, and very preferably 10 4 S / m greater than, most preferably 10 6 A conductivity of more than S / m is desirable. Note that if the component surface and / or the area of ​​the product substrate to which each component is bonded is a hybrid surface, the reference to conductivity applies only to the electrical domain.

[0063] The listed surface treatments can be combined with each other. Preferably, at least one chemical cleaning is performed first, followed by at least one physical cleaning, particularly for the removal of oxygen and nitrogen compounds, followed by at least one plasma treatment and / or coating, particularly for cleaning with water. Particularly preferably, in the surface treatment, the first substrate surface is first cleaned and then activated, thereby optimizing the bonding properties of the surface to be bonded on the product substrate. This prepares the semiconductor surface, in particular, for subsequent direct bonding.

[0064] Furthermore, surface treatment of oxygen surfaces where oxides should be retained is also possible. In this case, (complete) removal of the oxides is omitted, and the oxides are treated to optimize bonding properties.

[0065] The method for forming and preparing parts proposed below has a particularly important method step. Those skilled in the art will understand that several other method steps not explicitly mentioned may also be part of this method.

[0066] Method 1 In the first method step of the exemplary first method, the first substrate surface of a prepared first substrate is treated. The surface treatment includes at least one of the enumerated surface treatments.

[0067] In a second method step of the exemplary first method, a protective layer is provided on the surface-treated first substrate surface. The protective layer prevents the surface treatment from deteriorating or degrading at least partially by the subsequent method steps. In particular, it is desirable that the deposition of the protective layer does not affect the surface treatment, especially the surface modification itself. In an extended form of the first method, a bonding layer can be deposited on the second substrate surface opposite to the first substrate surface. The bonding layer is preferably an adhesive layer, and preferably a polymer. Such bonding layers are commonly used in temporary bonding and are known to those skilled in the art.

[0068] In the third method step of the exemplary first method, the first substrate is individualized. Individualization yields individual components, in particular chips. In this case, a protective layer deposited on the surface of the first substrate prevents the surface treatment of the first substrate surface from being affected or degraded during individualization.

[0069] In the fourth method step of the exemplary first method, individual components are bonded to the first substrate surface of the second substrate on the second component surface side. The second substrate is a support substrate that temporarily houses the components in order to bond them to the first substrate surface of the third substrate simultaneously with the surface-treated first component surface in a later method step. The placement of the components on the second substrate is preferably performed using a pick-and-place tool. Particularly preferably, each component is aligned with respect to optical alignment marks distributed across the second substrate. These alignment marks are referred to as component alignment marks. The second substrate preferably has additional alignment marks that enable alignment between the second substrate and the third substrate in a later method step. These alignment marks are referred to as substrate alignment marks.

[0070] In the fifth step of the exemplary first method, a protective layer is removed from the first substrate surface of the first substrate. In this case, it is desirable that the removal of the protective layer has no effect on the surface treatment or has only a negligible effect. Very preferably, the removal of the protective layer is carried out in a vacuum environment.

[0071] In the sixth step of the exemplary first method, the second substrate is aligned relative to the third substrate and made into contact with the component surface of the component.

[0072] In the seventh step of the exemplary first method, each component is separated from the second substrate, in particular by a debonding means.

[0073] Method 2 In the first method step of the exemplary second method, the first substrate surface of the first substrate is treated. The surface treatment includes at least one of the enumerated surface treatments.

[0074] In the second method step of the exemplary second method, the first substrate is fixed onto the second substrate on the surface side of the second substrate. The second substrate is particularly a film. The film is preferably stretched over a frame. The film preferably already has an adhesive layer provided on it. Thus, the adhesive layer forms a bonding layer, particularly as in the first method.

[0075] The first and second method steps are interchangeable, allowing the first substrate to be fixed onto the film on the surface side of the second substrate first, and only then the surface treatment of the first substrate surface to be performed.

[0076] In the third step of the exemplary second method, a protective layer is provided on the surface-treated first substrate. In this case, the protective layer prevents the surface treatment from being adversely affected or degraded by subsequent method steps. In particular, it is desirable that the deposition of the protective layer itself does not affect the surface modification.

[0077] In the fourth method step of the exemplary second method, the first substrate is individualized. Individualization yields individual components, in particular chips. Here, a protective layer deposited on the surface of the first substrate prevents at least partial regression or degradation of the surface treatment of the first substrate surface during individualization. Individualization is performed only after the first substrate is fixed onto a film on the side of the second substrate surface located opposite the first substrate surface. The film preferably already has an adhesive layer, thereby eliminating the need to apply a bonding layer as in the second method step of the exemplary first method. Such films can be purchased already coated. The film corresponds to the second substrate in the exemplary first method and is specifically referred to as the second substrate. Here, in the second method, it is not necessary to optimally align the individual components with respect to the second substrate. If individualization of the first substrate is performed only after contact connection with the film, precise alignment can only be achieved inadequately. The film used here is particularly used as a second substrate for transferring components.

[0078] In the fifth step of the exemplary second method, the protective layer is removed from the individual parts. In this case, it is desirable that the removal of the protective layer has no effect on the surface treatment or has only a negligible effect. Very preferably, the removal of the protective layer is carried out in a vacuum environment.

[0079] In the sixth step of the exemplary second method, individual components can be picked up and secured from the second substrate using a corresponding pick-and-place tool. Each component is then bonded to a third substrate, another component, or another component stack. When the component is picked up by the pick-and-place tool, the surface of the first component is made into contact. In this regard, each component is rotated before bonding, because the surface-treated surface of each component should be bonded to the product substrate. The process of removing components from the film, in particular the process of possible component rotation (chip flip), is known to those skilled in the art and will not be described in detail here.

[0080] Third method In the first method step of the exemplary third method, the first substrate surface of the first substrate is treated. The surface treatment includes at least one of the enumerated surface treatments.

[0081] In the second step of the exemplary third method, a protective layer is provided on the surface-treated first substrate surface. In this case, the protective layer prevents the surface treatment from being adversely affected or degraded, at least partially, by the subsequent method steps. In particular, it is desirable that the deposition of the protective layer itself does not affect the surface modification.

[0082] In the third step of the exemplary third method, a first substrate is fixed to a second substrate with the surface side of the first substrate. The second substrate is particularly a film. The film is preferably stretched over a frame. The film preferably already has an adhesive layer. Thus, unlike the second method, the first substrate is fixed to the second substrate with the surface-treated substrate surface side. In this case, the adhesive layer of the film on the second substrate can also serve as a protective layer.

[0083] In the fourth method step of the exemplary third method, the first substrate is individualized. Individualization yields individual components, in particular chips. In this case, a protective layer and / or adhesive layer deposited on the surface of the first substrate prevents at least partial regression or degradation of the surface treatment of the first substrate surface during individualization. Additionally advantageous in this case, the orientation of the components prevents damage to the surface of the first component facing the second substrate. In other words, the treated surface is protected by the component itself or by the first substrate itself. Individualization is performed, in particular, only after the first substrate has been fixed onto the film on the first substrate surface side opposite the surface of the second substrate. At this point, the protective layer is in contact with the second substrate. The film preferably already has an adhesive layer, thereby eliminating the need for bonding layers as in the second method step of the first method. Such films can be purchased already coated. The film here corresponds to the second substrate in the first method, and is therefore also referred to as the second substrate in the second method. In this case, in the third method, it is not necessary, nor is it desirable, to optimally align the individual components with respect to the second substrate. If the individualization of the first substrate is performed only after the contact connections on the film, this can only be done insufficiently.

[0084] In the fifth step of the exemplary third method, individual components can be removed from the second substrate by a corresponding pick-and-place tool. The advantage of the third method is that the pick-and-place tool can make contact connections to the second component surface, i.e., the previously untreated second substrate surface. This leaves the first component surface, i.e., the previously treated first substrate surface, freely accessible. Chip flipping is not required in this preferred method.

[0085] In the sixth step of the exemplary third method, the protective layer is removed from the individual component. If the second step is omitted, cleaning can be performed because the surface treatment was in contact with the adhesive layer of the film on the second substrate. In this case, it is desirable that the removal of the protective layer and / or adhesive layer has no effect on the surface treatment, or only a negligible effect. Preferably, the removal of the protective layer and / or adhesive layer is performed in a vacuum environment. In this case, the surface of the first component having the surface treatment can be quickly supplied after being picked up by the pick-and-place tool and used directly for the bonding process. In particular, this way the protective layer can be removed advantageously while the component remains fixed to the pick-and-place tool. In this way, adjacent components or the second substrate are not exposed to risk during removal. Furthermore, the particles of the protective layer can be removed in a vacuum environment, as intended, particularly in a separate module. Thus, contamination of the second substrate or adjacent components by particles of the protective layer is reduced.

[0086] Further advantages, features, and details of the present invention can be derived from the following description of preferred embodiments based on the drawings. The drawings schematically illustrate the following: [Brief explanation of the drawing]

[0087] [Figure 1a] This figure shows the first method step of an exemplary first method. [Figure 1b]This figure shows the second method step of the first method as an example. [Figure 1c] This figure shows the third method step of the first example method. [Figure 1d] This figure shows the fourth step of the first exemplary method. [Figure 1e] This figure shows the fifth step of the first example method. [Figure 1f] This figure shows the sixth step of the exemplary first method. [Figure 1g] This figure shows the seventh step of the exemplary first method. [Figure 2a] This figure shows the first method step of the second method as an example. [Figure 2b] This figure shows the second step of the second example method. [Figure 2c] This figure shows the third step of the second example method. [Figure 2d] This figure shows the fourth step of the second exemplary method. [Figure 2e] This figure shows the fifth step of the second example method. [Figure 2f] This figure shows the sixth step of the exemplary second method. [Figure 3a] This figure shows the first method step of an exemplary third method. [Figure 3b] This figure shows the second step of the third exemplary method. [Figure 3c] This figure shows the third step of an exemplary third method. [Figure 3d] This figure shows the fourth step of the exemplary third method. [Figure 3e] This figure shows the fifth step of the third method as an example. [Figure 3f] This figure shows the sixth step of the exemplary third method. [Figure 4] This is a top view showing the second substrate containing the most important components and features. [Figure 5] This is a top view showing the modular system.

[0088] In the figure, identical parts or parts with the same function are given the same reference numeral. The figure is a schematic diagram. In particular, the proportions of individual parts are not accurate. The thin layer 13 is selected as a graphic representation of the treated substrate surface, i.e., the surface treatment area 13. Here, the surface treatment area 13 as a whole represents a collection of various treatment areas on the substrate surface 1o. For example, since the surface treatment may consist of cleaning, the cleaned surface is represented. Alternatively, the surface treatment area 13 may be another thin layer, such as a water layer. However, to cover all possibilities, the surface treatment area 13 is depicted as a thin layer in the figure.

[0089] Figure 1a shows a first method step of an exemplary first method for treating the first substrate surface 1o of the first substrate 1. For example, the surface treatment 13 refers not only to the state of the first substrate surface 1o, but also to layers such as the first substrate surface 1o that has been cleaned, plasma-treated, or has a reservoir. Overall, component alignment marks 5 are present on the first substrate 1 for aligning the component 4 (see Figure 1c), which will be individually assembled later, relative to the support substrate 6.

[0090] Figure 1b shows a second method step of an exemplary first method, illustrating the protection of the surface treatment area 13 by the protective layer 2. Here, the first substrate 1 may have a bonding layer 3 on the second substrate surface 1u opposite to the first substrate surface 1o, which allows for the subsequent fixing of individualized components 4 (see Figure 1c) on the support substrate 6.

[0091] Figure 1c shows a third method step of an exemplary first method that allows for the individualization of the first substrate 1 (see Figure 1b) into individual components 4. In this case, the surface treatment 13 is protected in particular by the protective layer 2.

[0092] Figure 1d shows an exemplary fourth method step of the first method, in which individual components 4 are aligned and bonded to a second substrate 6, preferably to the second substrate surface 1u on which a bonding layer 3 is present. Preferably, in this case, alignment marks 5 on the components 4, also referred to as component alignment marks, are used to enable the alignment of the components 4 relative to the alignment marks 5' on the second substrate 6. The second substrate 6 preferably further has alignment marks 5'', also referred to as substrate alignment marks, which can be used in a later sixth method step to align the third substrate 8 relative to the second substrate 6. After this method step, the mounted second substrate 6 can be transported to a module system 9 (see Figure 5). Here, a surface treatment unit 13 is already present, and subsequent surface treatment of the first component surfaces has also been performed, but the individualization of the first substrate 1 to individual components 4 is preferably performed outside the module system 9.

[0093] Figure 1e shows a fifth method step of an exemplary first method, which involves removing the protective layer 2 (no longer visible in the figure). Here, the removal of the protective layer 2 is preferably carried out in a module system 9 (see Figure 5), in which all modules 10, 10', 10'', 10''', 10'''' are interconnected, thereby enabling the creation and maintenance of a vacuum throughout the module system 9. Thus, the surface treatment 13 is advantageously no longer in contact with the atmosphere.

[0094] Figure 1f shows an exemplary sixth method step of the first method, in which the third substrate 8 is aligned relative to the second substrate 6 based on the provided alignment marks 5''.

[0095] The surface treatment 13 enables particularly efficient bonding between component 4 and the third substrate 8. Figure 1f shows how component 4 on the second substrate 6 is directly connected to the third substrate 8.

[0096] Figure 1g shows a seventh method step of an exemplary first method for separating the first substrate 6 from the third substrate 8. Here, the second component surface 4u of component 4 is debonded from the second substrate 6. Such separation is referred to as debonding. Debonding can be performed mechanically and / or thermally and / or chemically and / or using electromagnetic radiation, particularly lasers. Preferably, the component surface 4u and / or the first substrate surface 6o of the second substrate 6 are subsequently cleaned. The second substrate 6 is then preferably reusable.

[0097] In a special extended form of the exemplary first method of formation and preparation, another component may already be present on the third substrate or product substrate 8 from the sixth method step in Figure 1f. Thus, a contact connection is made between the component 4 on the second substrate 6 and the other component 4 on the third substrate 8. This makes it possible to form or prepare multiple component-to-component stacks, particularly chip-to-chip stacks, particularly efficiently. Regarding such component-to-component stacks, only multiple component stacks are mentioned below.

[0098] For example, a second substrate 6A (not shown) on which a component 4, which is a logic circuit such as a microprocessor, is mounted can be used. Alternatively, a second substrate 6B on which a memory component, such as a random access memory component 4, is mounted can be manufactured. Here, for example, first, a second substrate having code A is bonded to a third substrate 8, which will be the final product substrate. Then, a second substrate having code B is aligned relative to the third substrate 8, and the component 4 of the second substrate having code B is bonded to the first component 4 already located on the third substrate 8. This results in a third substrate 8 having a large component stack consisting of multiple components, each having a different function. Those skilled in the art will understand that such a process involving multiple components can be repeated to form a component stack of any number of components. In this case, preferably, each new component layer having component 4 from the second substrate 6 has one surface treatment area 13, which allows for particularly efficient bonding to the last layer on which the component 4 located on the third substrate 8 has been transferred.

[0099] Figure 2a shows the first method step of an exemplary second method. A surface treatment area 13 is provided on the first substrate surface 1o of the first substrate 1o.

[0100] Figure 2b shows an exemplary second method step of the second method, in which the first substrate 1 is fixed onto the second substrate 6' on the side of the second substrate surface 1u opposite to the first substrate surface 1o. The second substrate 6' is particularly a film 14, on which a pre-deposited adhesive layer 3', which can similarly be called a bonding layer, is provided. Most film manufacturers already provide the adhesive layer 3' on the film 14 during manufacturing. In this case, the film 14 is commercially available together with the adhesive layer 3'. The film 14 is preferably stretched over a frame 15.

[0101] It is also possible to swap the two preceding method steps, namely, first fixing substrate 1 onto the film 14 of the second substrate 6' and then forming the surface treatment 13. This is advantageous because it eliminates the need to make contact connections to the first substrate 1, and handling and transport are performed by the second substrate 6'. However, it is undesirable for the film 14 to be negatively affected by some of the surface treatment 13. Therefore, the order here is preferably determined according to each individual case.

[0102] Figure 2c shows a third method step of an exemplary second method, demonstrating the protection of surface 13 by depositing a protective layer 2 onto the treated surface 1o. The protective layer 2 is deposited onto the surface-treated first substrate surface 1o or the surface-treated area 13. In this case as well, the coating with the protective layer 2 can be performed before fixing substrate 1 onto the second substrate 6'.

[0103] Figure 2d shows a fourth method step of an exemplary second method for individualizing the first substrate 1 into individual components 4. Here, the surface treatment 13 is protected by a protective layer 2. Individualization is preferably performed outside the module system 9. However, the second substrate 6' can be transported to the module system 9 (see Figure 5) at the latest after individualization.

[0104] Figure 2e shows a fifth method step of an exemplary second method, in which the protective layer 2 (no longer visible in the figure) is removed from the first part surface 4o of part 4. Here, the removal of the protective layer 2 is preferably carried out within the module system 9, where all modules 10, 10', 10'', 10''', 10'''' are interconnected and a consistent vacuum can be generated and maintained throughout the module system 9. Thus, the surface treatment area 13 is preferably no longer in contact with the atmosphere.

[0105] Figure 2f shows a sixth method step of an exemplary second method, in which parts 4 are individually removed and further processed. Here, a pick-and-place tool 16 is in contact with each part on the processed part surface 4o.

[0106] In an alternative embodiment of the exemplary second method, instead of the individual removal of component 4 in Figure 2f, the third substrate 8 is aligned relative to the second substrate 6' and contact-connected to component 4, similar to the sixth method step of the exemplary first method in Figure 1f.

[0107] Figure 3a shows the first method step of an exemplary third method. A surface treatment area 13 is provided on the first substrate surface 1o of the first substrate 1o.

[0108] Figure 3b shows a second method step of an exemplary third method, in which the protective layer 2 is directly applied to the surface 13 of the first substrate surface 1o of the first substrate 1 before the first substrate 1 is fixed to the second substrate 6'.

[0109] Figure 3c shows an exemplary third method step of the third method, in which the first substrate 1 is fixed onto the second substrate 6' on the first substrate surface 1o side where the surface treatment 13 and protective layer 2 are formed. Here, the protective layer 2 is in contact with the adhesive layer 3' of the film 14.

[0110] Figure 3d shows a fourth method step of an exemplary third method for individualizing the first substrate 1 (see Figure 3c) into individual components 4. Here, the surface treatment 13 is protected on the one hand by the protective layer 2 and on the other hand by the orientation of the first substrate 1. In this case, the means for individualizing the substrate preferably acts first on the opposite substrate surface 1u. Thus, the influence of the individualizing means on the treated surface 13 is minimized. Individualization is preferably performed outside the module system 9.

[0111] Figure 3e shows a fifth method step of the exemplary third method, in which part 4 is individually removed and further processed. Removal of part 4 by contacting the part surface 4u with the pick-and-place tool 16 is particularly advantageous. On the other hand, no contact is made with the first part surface 1o. Therefore, degradation of the processed surface due to contact is avoided. Furthermore, there is no need to rotate the part for bonding the first part surface to the product substrate. After the corresponding part is picked up at the part surface 1u easily accessible by the pick-and-place tool 16, the part 4 is advantageously released from the housing of the pick-and-place tool 16 along with the processed surface to be bonded. In contrast to the exemplary second method, no modification or destruction of the surface treatment 13 can occur by the pick-and-place tool 16 because part 4 is contacted with the part surface 4u opposite to the surface treatment 13.

[0112] Figure 3f shows a sixth method step of an exemplary third method, preferably in which the protective layer 2 is removed while the component 4 is held by a pick-and-place tool 16. Here, the pick-and-place tool 16 can bond the surface-treated side 13 of component 4 to another component 4 or to a third substrate 8 (not shown).

[0113] Figure 4 shows a top view of the second substrate 6,6'. Multiple alignment marks 5' are present, distributed across the second substrate 6,6'. Sixteen alignment marks 5' are shown as an example. The first alignment mark 5' is covered by a component 4 having one alignment mark 5. The second substrate 6 has two more alignment marks 5'', which are used to align the second substrate 6 with the product substrate 8 (not shown here; see Figure 1e). For clarity, alignment marks 5 (white), 5' (black), and 5'' (gray) are shown in different colors. Component 4 is positioned and bonded exclusively within the component placement area 12.

[0114] Figure 5 shows a top view of an exemplary module system 9 consisting of multiple modules 10, 10', 10'', 10''', 10''''. The number of modules is arbitrary. For example, modules 10, 10', 10'', 10''', 10'''' are configured as follows: Module 10 is a coating module to which a bonding layer 3 and / or a protective layer 2 can be applied (see Figure 1a). Module 10' constitutes an individualization module that can individualize the substrate 1 (see Figure 1b). Module 10'' is an alignment and bonding module that can align and position individual components 4 on the second substrate 6. Therefore, this module is preferably provided with a pick-and-place device. Module 10'''' is a cleaning module that can remove the protective layer 2. Module 10'''' is an alignment and bonding module that can align and bond substrates, in particular the second substrate 6 and the third substrate 8 on which components 4 are mounted, to each other.

[0115] Here, one task can be handled by one module if the necessary means are present within the module. The module system 9 may also have other modules. In particular, coating and individualization can be performed outside the module system 9, thereby allowing only already individualized parts 4 to be introduced into the module system 9. In this case, the two modules 10, 10' described above can be omitted. Here, the module system 9 can preferably perform the transfer of parts 4 and substrates 6, 8, particularly between individual modules, without exposure to the atmosphere. Thus, the entire module system 9 can be suitably evaluated and closed off from the surrounding atmosphere.

[0116] Preferably, all necessary loading and unloading of objects is performed via the airlock 11, thereby allowing the internal space of the module system 9 to remain ventilated for as long as possible. The module system 9 or individual modules 10, 10', 10'', 10''', 10'''' are operated at a pressure of less than 1 bar, preferably less than 1 mbar, and more preferably 10 -5 Pressure less than mbar, very preferably 10 -9 Pressure less than mbar, most preferably 10 -12 It is possible to exhaust pressures down to mbar. [Explanation of symbols]

[0117] 1. First substrate 1o,1u board surface 2 protective layer 3,3' Bonding layer 4,4' parts 4o,4u component surface 5,5',5'' Alignment Marks 6,6' Transfer substrate, second substrate 6o Substrate surface 7. Surface treatment means 8. Third substrate / product substrate 9 Module System 10,10',10'',10''',10'''' module 11 Airlock 12. Component placement area 13 Surface treatment 14 film 15 frames 16 Pick and Place Tools

Claims

1. A method for forming and preparing an electronic component (4), i) A step of preparing a first substrate (1) having a first substrate surface (1o) and a second substrate surface (1u), ii) The step of performing a surface treatment (13) on the first substrate surface (1o), and further thereafter, iii) The step of applying a protective layer (2) to the processed first substrate surface (1o), iv) The step of individualizing the first substrate (1) into components (4), It includes at least the following in that order: Prior to the individualization in step iv), the first substrate (1) is prepared on the second substrate (6') on the side of the first substrate surface (1o) having the protective layer (2), The method described above, after the individualization in step iv), v) further comprising the step of removing the protective layer (2) from the first part surface (4o) of the part (4), Prior to the removal of the protective layer (2) in step v), the part (4) is picked up by the pick-and-place tool (16) on the second part surface (4u) side and fixed to the pick-and-place tool (16). method.

2. The method according to claim 1, wherein the surface treatment (13) in step ii) includes at least one cleaning, plasma treatment and / or coating of the first substrate surface (1o).

3. The method according to claim 2, wherein the cleaning comprises at least one chemical cleaning and / or preferably a physical cleaning by sputtering.

4. The method according to any one of claims 1 to 3, wherein a water-based coating is performed to make the first substrate surface (1o) hydrophilic.

5. The method according to any one of claims 1 to 4, wherein the component (4), after the individualization in step iv), each has one first component surface (4o) and one second component surface (4u), and the protective layer (2) is applied to each of the first component surfaces (4o).

6. The method according to claim 5, wherein, after the individualization in step iv), the component (4) is fixed onto the support substrate (6) on the second component surface (4u) side.

7. The method according to any one of claims 1 to 6, wherein the second substrate (6') is a film (14).

8. The method according to claim 7, wherein the film (14) has an adhesive layer (3'), and the first substrate (1) is fixed on the adhesive layer (3').

9. The removal of the protective layer (2) in step v) is performed under vacuum, according to any one of claims 1 to 8.

Images