Underfill material, semiconductor package, and method for manufacturing a semiconductor package

Abstract

To provide: an underfill material which has an excellent pot life and has excellent high-temperature adhesiveness to copper when formed into a cured product; a semiconductor package including a cured product of the underfill material; and a method for manufacturing the semiconductor package.SOLUTION: The underfill material contains: an epoxy resin; an aromatic amine curing agent; an inorganic filler; and a compound having a triazine ring and an alkoxysilyl group, or a compound having a triazine ring and a primary amino group and having a melting point of 200°C or lower.SELECTED DRAWING: None

Description

Technical Field

[0001] The present disclosure relates to an underfill material, a semiconductor package, and a method for manufacturing a semiconductor package.

Background Art

[0002] In the field of encapsulating various semiconductor elements used in semiconductor devices such as transistors and ICs (Integrated Circuits), resin encapsulation has become the mainstream in terms of productivity, manufacturing cost, etc. As the resin for encapsulation, epoxy resin is widely used. This is because epoxy resin has excellent balance in various properties such as workability, moldability, electrical properties, moisture resistance, heat resistance, mechanical properties, and adhesion to insert parts.

[0003] In recent years, in the field of semiconductor devices, in order to cope with the miniaturization and thinning of packages, semiconductor devices using so-called bare chip mounting, where a bare chip is directly mounted on a wiring board, have become the mainstream. Examples of semiconductor devices using bare chip mounting include COB (Chip on Board), COG (Chip on Glass), TCP (Tape Carrier Package), etc.

[0004] In a flip chip type semiconductor device in which a semiconductor element is bump-connected to a wiring board, a liquid resin composition is used as an underfill material to fill the gap (gap) between the bump-connected semiconductor element and the substrate. For example, Patent Document 1 describes an underfill material using a polyfunctional epoxy resin and a curing agent containing a phenolic compound and an acid anhydride. The underfill material plays a role of protecting electronic components from temperature, humidity, and mechanical external forces.

[0005] In flip-chip semiconductor devices, solder balls have traditionally been used to connect semiconductor elements to substrates. However, with the miniaturization and increased integration of semiconductor devices, leading to an increase in the number of terminals, copper pillars with solder caps at the tips are increasingly being used instead of conventional solder balls. As a result, during the reflow oven process, where semiconductor devices are connected at high temperatures (e.g., 260°C) to be mounted on motherboards and the like, defects such as the underfill material peeling off from the copper pillars are occurring.

[0006] As a method for improving the adhesion of epoxy resin compositions to copper, for example, Patent Documents 2 to 6 describe epoxy resin compositions containing compounds that exhibit excellent adhesion to copper. [Prior art documents] [Patent Documents]

[0007] [Patent Document 1] Japanese Patent Publication No. 2004-256646 [Patent Document 2] Japanese Patent Publication No. 2007-2170 [Patent Document 3] Japanese Patent Publication No. 2012-188629 [Patent Document 4] Japanese Patent Publication No. 2016-169300 [Patent Document 5] Japanese Patent Publication No. 2016-34906 [Patent Document 6] Japanese Patent Publication No. 2017-2289 [Overview of the project] [Problems that the invention aims to solve]

[0008] However, when compounds that generally exhibit excellent adhesion to copper are applied to underfill materials, they often react with resin components such as epoxy resins and hardeners, worsening the pot life, i.e., storage stability at room temperature. Furthermore, the adhesive strength of underfill materials to copper at high temperatures (e.g., 260°C) has not been investigated until now.

[0009] In view of the above circumstances, the object of this disclosure is to provide an underfill material that has excellent pot life and excellent high-temperature adhesion to copper when cured, as well as a semiconductor package comprising the cured underfill material and a method for manufacturing the same. [Means for solving the problem]

[0010] The following embodiments are included as means for solving the above problems. <1> An underfill material containing epoxy resin, an aromatic amine curing agent, an inorganic filler, and a compound having a triazine ring and an alkoxysilyl group. <2> The melting point of the compound having the triazine ring and the alkoxysilyl group is 200°C or lower. <1> The underfill material described above. <3> The compound having the triazine ring and the alkoxysilyl group further has a primary amino group. <1> or <2> The underfill material described above. <4> An underfill material containing an epoxy resin, an aromatic amine curing agent, an inorganic filler, and a compound having a triazine ring and a primary amino group, with a melting point of 200°C or less. <5> A substrate, a semiconductor element disposed on the substrate, and a encapsulation of the semiconductor element. <1> ~ <4> A semiconductor package having a cured underfill material as described in any one of the items. <6> The air gap between the substrate and the semiconductor element placed on the substrate <1> ~ <5> A method for manufacturing a semiconductor package, comprising the steps of filling with an underfill material described in any one of the items, and curing the underfill material. [Effects of the Invention]

[0011] This disclosure provides an underfill material that has excellent pot life and excellent high-temperature adhesion to copper when cured, as well as a semiconductor package comprising the cured underfill material and a method for manufacturing the same. [Modes for carrying out the invention]

[0012] The embodiments of this disclosure will be described in detail below. However, the embodiments of this disclosure are not limited to the embodiments described below. In the embodiments described below, the components (including elemental steps, etc.) are not essential unless otherwise specified. The same applies to numerical values ​​and their ranges, and do not limit the embodiments of this disclosure.

[0013] In this disclosure, the term "process" includes not only processes that are independent of other processes, but also processes that cannot be clearly distinguished from other processes, provided that the purpose of such process is achieved. In this disclosure, the numerical range indicated using "~" includes the numbers before and after "~" as the minimum and maximum values, respectively. In numerical ranges described in stages within this disclosure, the upper or lower limit of one numerical range may be replaced with the upper or lower limit of another numerical range described in stages. Furthermore, in numerical ranges described within this disclosure, the upper or lower limit of that range may be replaced with the values ​​shown in the examples. In this disclosure, each component may contain multiple types of the corresponding substance. If multiple types of the substance corresponding to each component are present in the composition, the content or amount of each component means the total content or amount of the multiple types of substances present in the composition, unless otherwise specified. In this disclosure, each component may contain multiple types of particles. If multiple types of particles corresponding to each component are present in the composition, the particle size of each component refers to the value for a mixture of such multiple types of particles present in the composition, unless otherwise specified.

[0014] Underfill material The underfill material according to the first embodiment of this disclosure contains an epoxy resin, an aromatic amine curing agent, an inorganic filler, and a compound having a triazine ring and an alkoxysilyl group (hereinafter also referred to as the "first triazine ring-containing compound"). The underfill material according to the second embodiment of the present disclosure contains an epoxy resin, an aromatic amine curing agent, an inorganic filler, and a compound having a triazine ring and a primary amino group and having a melting point of 200°C or lower (hereinafter also referred to as "the second triazine ring-containing compound"). Hereinafter, the underfill material according to the first embodiment and the underfill material according to the second embodiment may be collectively referred to as "the underfill material of the present disclosure" or simply "the underfill material".

[0015] The underfill material of the present disclosure is excellent in pot life and has excellent high-temperature adhesiveness to copper when cured. In the present disclosure, the high-temperature adhesiveness means the adhesiveness at 260°C. The detailed reason why the underfill material of the present disclosure is excellent in pot life and high-temperature adhesiveness to copper when cured is not necessarily clear, but is presumed as follows. The underfill material according to the first embodiment contains a compound having a triazine ring and an alkoxysilyl group (the first triazine ring-containing compound). The nitrogen atom in the triazine ring is considered to contribute to the high-temperature adhesiveness to copper. Further, due to the presence of the alkoxysilyl group, the first triazine ring-containing compound has excellent compatibility with the epoxy resin and is well dispersed in the underfill material. Therefore, it is considered that the high-temperature adhesiveness is good throughout the underfill material. Furthermore, when the first triazine ring-containing compound is used and an aromatic amine compound is used as the curing agent, the reactivity of the first triazine ring-containing compound and the aromatic amine compound with respect to the epoxy group is not too high, so the progress of gelation is relatively slow, and it is considered that an excellent pot life can be obtained. The underfill material according to the second embodiment contains a compound (second triazine ring-containing compound) having a triazine ring and a primary amino group and having a melting point of 200°C or lower. The nitrogen atom and the primary amino group in the triazine ring are considered to contribute to the high-temperature adhesiveness with copper. Further, since the melting point of the compound is 200°C or lower, it has excellent dispersibility in the epoxy resin during kneading (for example, about 25°C to 80°C), during filling into the gap between the element and the substrate (for example, about 100°C to 120°C), and during curing of the underfill material (for example, about 80°C to 200°C), and it is considered that the underfill material has good high-temperature adhesiveness throughout. Furthermore, when the second triazine ring-containing compound is used and an aromatic amine compound is used as the curing agent, the reactivity of the second triazine ring-containing compound and the aromatic amine compound with respect to the epoxy resin is not too high, so the progress of gelation is relatively slow, and it is considered that an excellent pot life can be obtained.

[0016] The underfill material is preferably liquid at 25°C. In the present disclosure, "liquid" means a substance that exhibits fluidity and viscosity and has a viscosity, which is a measure of viscosity, of 0.0001 Pa·s to 100 Pa·s. Also, "liquid state" means the state of being liquid.

[0017] In the present disclosure, the viscosity is defined as the measured value when an EHD type rotational viscometer (for example, manufactured by Tokyo Keiki Co., Ltd., VISCONIC EHD type (trade name)) is rotated at 10 revolutions per minute (10 rpm) for 1 minute at 25°C. The above measured value is obtained using an EHD type rotational viscometer equipped with a cone rotor having a cone angle of 3° and a cone radius of 14 mm for a liquid maintained at 25 ± 1°C.

[0018] The viscosity of the underfill material is not particularly limited. Especially from the viewpoint of high fluidity, the viscosity of the underfill material at 25°C is preferably 0.1 Pa·s to 100.0 Pa·s, more preferably 0.1 Pa·s to 50.0 Pa·s, and even more preferably 0.1 Pa·s to 30.0 Pa·s.

[0019] Furthermore, as an indicator of ease of filling when filling narrow gaps of several tens to several hundred micrometers in size with underfill material at around 100°C to 120°C, the viscosity of the underfill material at 110°C is preferably 0.20 Pa·s or less, and more preferably 0.15 Pa·s or less. The viscosity of the underfill material at 110°C is measured using a rheometer (for example, TA Instruments AR2000, cone radius 20 mm, shear rate 32.5 / sec).

[0020] The pot life of the underfill material after being left at 25°C for 24 hours, as measured by the following method, is preferably 100% or less, more preferably 90% or less, even more preferably 80% or less, and particularly preferably 60% or less. There is no particular lower limit to the pot life, and a lower value is preferable. After leaving the underfill material at 25°C for 24 hours, the viscosity at 25°C is measured using an E-type viscometer (for example, VISCONIC EHD model (product name) manufactured by Tokyo Keiki Co., Ltd.) (cone angle 3°, rotation speed 10 revolutions per minute (rpm)) (viscosity after standing). However, for samples that cannot be measured at 10 revolutions per minute (rpm) due to high viscosity, the measurement is performed at 2.5 revolutions per minute (rpm). The pot life (%) is calculated as the viscosity increase rate after 24 hours of standing using the following formula. Pot life (%) = {(Viscosity after standing - Initial viscosity) / Initial viscosity} × 100

[0021] The high-temperature adhesive strength of the underfill material to copper (Cu), as measured by the following method, is preferably 0.70 kgf or higher, more preferably 0.80 kgf or higher, and even more preferably 0.90 kgf or higher. A higher high-temperature adhesive strength is preferable.

[0022] The adhesive strength to copper can be measured, for example, as follows: A test piece is prepared by molding an underfill material to the surface of a copper plate with a diameter of 3 mm and a height of 3 mm. A bond tester (e.g., DAGE DS100 model) is used to apply shear stress at a head speed of 50 μm / sec, and the strength at which the molded product peels off from the copper plate is measured. Specifically, it can be measured by the method described in the examples.

[0023] <Epoxy resin> The type of epoxy resin is not particularly limited. Preferably, the epoxy resin has two or more epoxy groups in one molecule.

[0024] The epoxy resin may be solid or liquid at room temperature, and a combination of solid and liquid epoxy resins may be used. From the viewpoint of reducing the viscosity of the underfill material, it is preferable to use an epoxy resin that is liquid at room temperature. From the viewpoint of fluidity during molding, it is preferable that the content of solid epoxy resin be 20% by mass or less of the total amount of epoxy resin.

[0025] The type of epoxy resin is not particularly limited. Specifically, epoxy resins include novolac-type epoxy resins such as phenol novolac-type epoxy resins and cresol novolac-type epoxy resins; bisphenol-type epoxy resins such as bisphenol A-type epoxy resins and bisphenol F-type epoxy resins; glycidylamine-type epoxy resins such as N,N-diglycidylaniline, N,N-diglycidyltoluidine, diaminodiphenylmethane-type glycidylamine, and aminophenol-type glycidylamine; phenol aralkyl-type epoxy resins having at least one selected from the group consisting of a phenylene skeleton and a biphenylene skeleton; aralkyl-type epoxy resins such as naphthol aralkyl-type epoxy resins having at least one selected from the group consisting of a phenylene skeleton and a biphenylene skeleton; and Examples include hydroquinone-type epoxy resins; biphenyl-type epoxy resins; stilbene-type epoxy resins; triphenolmethane-type epoxy resins; triphenolpropane-type epoxy resins; alkyl-modified triphenolmethane-type epoxy resins; triazine-nucleus-containing epoxy resins; dicyclopentadiene-modified phenol-type epoxy resins; naphthol-type epoxy resins; naphthalene-type epoxy resins; alicyclic epoxy resins such as vinylcyclohexene dioxide, dicyclopentadiene oxide, and alicyclic diepoxy adipate; and difunctional aliphatic epoxy compounds having two epoxy groups in the molecule, such as alkylene glycol diglycidyl ether, poly(alkylene glycol) diglycidyl ether, and alkenylene glycol diglycidyl ether. Epoxy resins may be used individually or in combination of two or more types.

[0026] When using two or more epoxy resins, the two or more epoxy resins may be mixed beforehand before mixing with the other components, or they may be mixed with the other components without prior mixing.

[0027] The epoxy equivalent of the epoxy resin is not particularly limited. The epoxy equivalent of the epoxy resin may be 60 g / eq or more, 70 g / eq or more, or 90 g / eq or more. The epoxy equivalent of the epoxy resin may be 500 g / eq or less, 300 g / eq or less, or 200 g / eq or less. From the viewpoint of balancing various properties such as moldability, reflow resistance, and electrical reliability, it is preferable that it be between 60 g / eq and 500 g / eq, more preferably between 70 g / eq and 300 g / eq, and even more preferably between 90 g / eq and 200 g / eq. The epoxy equivalent of the epoxy resin shall be the value measured by the method in accordance with JIS K 7236:2009.

[0028] The epoxy resin content relative to the total mass of the underfill material is not particularly limited. The epoxy resin content relative to the total mass of the underfill material may be 0.5% by mass or more, or 2% by mass or more. The epoxy resin content relative to the total mass of the underfill material may be 50% by mass or less, or 40% by mass or less, or 30% by mass or less. From the viewpoint of viscosity, glass transition temperature, heat resistance, etc., the epoxy resin content is preferably 0.5% by mass to 50% by mass, more preferably 2% by mass to 40% by mass, and even more preferably 5% by mass to 30% by mass, relative to the total mass of the underfill material.

[0029] In one embodiment, from the viewpoint of improving injectability and reducing the coefficient of thermal expansion when cured, the underfill material preferably contains at least one selected from the group consisting of bisphenol-type epoxy resin, glycidylamine-type epoxy resin, and naphthalene-type epoxy resin. Furthermore, it is more preferable that the underfill material contains all of the bisphenol-type epoxy resin, glycidylamine-type epoxy resin, and naphthalene-type epoxy resin.

[0030] The type of bisphenol-type epoxy resin is not particularly limited, and examples include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD ​​type epoxy resin, etc. Bisphenol-type epoxy resin may be used alone or in combination of two or more types. From the viewpoint of using the underfill material in liquid form, it is preferable that the bisphenol-type epoxy resin is liquid at room temperature (25°C). From the viewpoint of reducing viscosity, it is preferable that the bisphenol-type epoxy resin is bisphenol F type epoxy resin.

[0031] When the underfill material contains a bisphenol-type epoxy resin, the content of the bisphenol-type epoxy resin is not particularly limited and can be selected according to the desired properties of the underfill material. For example, the content of bisphenol F-type epoxy resin may be 20% by mass or more, 30% by mass or more, or 40% by mass or more, relative to the total mass of the epoxy resin. The content of bisphenol F-type epoxy resin may be less than 90% by mass, 80% by mass or less, or 70% by mass or less, relative to the total mass of the epoxy resin. The content of bisphenol F-type epoxy resin may be 20% by mass or more and less than 90% by mass, 30% by mass to 80% by mass, or 40% by mass to 70% by mass, relative to the total mass of the epoxy resin.

[0032] The type of glycidylamine-type epoxy resin is not particularly limited. Glycidylamine-type epoxy resins are preferably bifunctional or more, and from the viewpoint of improving heat resistance after curing, trifunctional or more (i.e., having three or more epoxy groups in one molecule) glycidylamine-type epoxy resins are preferred. Examples of bifunctional glycidylamine-type epoxy resins include N,N-diglycidylaniline and N,N-diglycidyl-o-toluidine. Examples of trifunctional or more glycidylamine-type epoxy resins include triglycidyl-p-aminophenol and 4,4'-methylenebis[N,N-bis(oxyranylmethyl)aniline]. Glycidylamine-type epoxy resins may be used individually or in combination of two or more. Among these, triglycidyl-p-aminophenol is preferred from the viewpoint of viscosity at room temperature (25°C).

[0033] From the viewpoint of reducing the viscosity of the underfill material, it is preferable that the molecular weight of the glycidylamine-type epoxy resin be 300 or less.

[0034] When the underfill material contains a glycidylamine-type epoxy resin, the content of the glycidylamine-type epoxy resin is not particularly limited. For example, the content of the glycidylamine-type epoxy resin may be 10% by mass or more, 20% by mass or more, or 25% by mass or more, relative to the total mass of the epoxy resin. The content of the glycidylamine-type epoxy resin may be 60% by mass or less, 50% by mass or less, or 40% by mass or less, relative to the total mass of the epoxy resin. The content of the glycidylamine-type epoxy resin may be 10% to 60% by mass, 20% to 50% by mass, or 25% to 40% by mass, relative to the total mass of the epoxy resin.

[0035] The type of naphthalene-type epoxy resin is not particularly limited. From the viewpoint of reducing the coefficient of thermal expansion, 1,6-bis(glycidyloxy)naphthalene is preferred.

[0036] When the underfill material contains naphthalene-type epoxy resin, the content of naphthalene-type epoxy resin is not particularly limited. For example, the content of naphthalene-type epoxy resin may be 10% by mass or more, or 15% by mass or more, relative to the total mass of the epoxy resin. The content of naphthalene-type epoxy resin may be 30% by mass or less, or 25% by mass or less, relative to the total mass of the epoxy resin. The content of naphthalene-type epoxy resin may be 10% to 30% by mass, or 15% to 25% by mass, relative to the total mass of the epoxy resin.

[0037] <Aromatic amine curing agent> The type of aromatic amine curing agent is not particularly limited, but it is preferably an aromatic amine compound having at least two or more groups selected from the group consisting of primary and secondary amino groups in one molecule, more preferably an aromatic amine compound having at least two to four groups selected from the group consisting of primary and secondary amino groups in one molecule, and even more preferably an aromatic amine compound having at least two groups selected from the group consisting of primary and secondary amino groups in one molecule. The aromatic amine curing agent is preferably liquid at 25°C.

[0038] Examples of aromatic amine curing agents include diethyltoluenediamines such as 3,5-diethyltoluene-2,4-diamine and 3,5-diethyltoluene-2,6-diamine; triethyldiaminobenzenes such as 1,3,5-triethyl-2,6-diaminobenzene; and diaminodiphenylmethanes such as 3,3'-diethyl-4,4'-diaminodiphenylmethane and 3,5,3',5'-tetramethyl-4,4'-diaminodiphenylmethane. Aromatic amine curing agents may be used individually or in combination of two or more.

[0039] In particular, from the viewpoint of storage stability, at least one selected from the group consisting of diaminodiphenylmethane and diethyltoluenediamine is preferred, and using them in combination is more preferred.

[0040] The active hydrogen equivalent of the aromatic amine curing agent is not particularly limited. The active hydrogen equivalent of the aromatic amine curing agent may be 20 g / eq or more, 30 g / eq or more, or 40 g / eq or more. The active hydrogen equivalent of the aromatic amine curing agent may be 200 g / eq or less, 100 g / eq or less, or 80 g / eq or less. From the viewpoint of achieving both a reduction in thermal stress of the cured product and a high glass transition temperature (Tg), it is preferable that it be between 20 g / eq and 200 g / eq, more preferably between 30 g / eq and 100 g / eq, and even more preferably between 40 g / eq and 80 g / eq.

[0041] The underfill material may contain other curing agents in addition to aromatic amine curing agents. Examples of curing agents other than aromatic amine curing agents include aliphatic amine curing agents, phenol curing agents, acid anhydride curing agents, imidazole compounds, imidazoline compounds, polymercaptan curing agents, polyaminoamide curing agents, isocyanate curing agents, and blocked isocyanate curing agents.

[0042] The content of aromatic amine curing agent relative to the total mass of the curing agent is not particularly limited, but from the viewpoint of particularly good pot life and high-temperature adhesion to copper when cured, it is preferably 50% by mass or more, more preferably 70% by mass or more, and even more preferably 80% by mass or more. In particular, the total content of at least one selected from the group consisting of diaminodiphenylmethane and diethyltoluenediamine is preferably 50% by mass or more, more preferably 70% by mass or more, and even more preferably 80% by mass or more, relative to the total mass of the curing agent.

[0043] The equivalent ratio of epoxy resin to curing agent (including aromatic amine curing agents), i.e., the ratio of the number of functional groups (active hydrogen in the case of amine curing agents) in the curing agent to the number of epoxy groups in the epoxy resin (number of functional groups in the curing agent / number of epoxy groups in the epoxy resin), is not particularly limited. From the viewpoint of minimizing unreacted components, it is preferable to set it in the range of 0.5 to 2.0, and more preferably in the range of 0.6 to 1.3. From the viewpoint of moldability and reflow resistance, it is even more preferable to set it in the range of 0.8 to 1.2.

[0044] From the viewpoint of making the underfill material liquid at room temperature (25°C), it is preferable to select a curing agent so that the entire curing agent becomes liquid at room temperature. That is, when using only one type of curing agent, it is preferable that the curing agent is liquid at room temperature. When using a combination of two or more types of curing agents, all of the two or more curing agents may be liquid at room temperature, or some may be solid at room temperature, and the combination may be such that the two or more curing agents become liquid at room temperature when mixed. When using a curing agent that is solid at room temperature, its content is preferably 20% by mass or less of the total mass of the curing agent, from the viewpoint of fluidity.

[0045] <Inorganic filler> The type of inorganic filler is not particularly limited and examples include silica, glass, alumina, calcium carbonate, zirconium silicate, calcium silicate, silicon nitride, aluminum nitride, boron nitride, beryllia, zirconia, zircon, fossterite, steatite, spinel, mullite, titania, talc, clay, mica, and other inorganic materials. Inorganic fillers with flame retardant properties may also be used. Examples of inorganic fillers with flame retardant properties include aluminum hydroxide, magnesium hydroxide, composite metal hydroxides such as magnesium and zinc hydroxide, and zinc borate. One type of inorganic filler may be used alone, or two or more types may be used in combination. Among these, silica is preferred from the viewpoint of reducing the coefficient of thermal expansion, and alumina is preferred from the viewpoint of improving thermal conductivity.

[0046] The content of inorganic filler is not particularly limited. The inorganic filler content may be 30% by mass or more, 40% by mass or more, or 50% by mass or more, relative to the total mass of the underfill material. The inorganic filler content may be 90% by mass or less, 80% by mass or less, or 75% by mass or less, relative to the total mass of the underfill material. From the viewpoint of achieving both good fluidity and the desired effect of the inorganic filler, the inorganic filler content is preferably 30% by mass to 90% by mass, more preferably 40% by mass to 80% by mass, and even more preferably 50% by mass to 75% by mass, relative to the total mass of the underfill material.

[0047] When the inorganic filler is particulate, its average particle size is not particularly limited. For example, the volume-average particle size of the inorganic filler may be 0.2 μm or more, or 0.5 μm or more. The volume-average particle size of the inorganic filler may be 20 μm or less, or 15 μm or less. The volume-average particle size of the inorganic filler is preferably 0.2 μm to 20 μm, and more preferably 0.5 μm to 15 μm. When the volume-average particle size is 0.2 μm or more, the increase in viscosity of the underfill material tends to be further suppressed. When the volume-average particle size is 20 μm or less, the ability to fill narrow gaps tends to be further improved. The volume-average particle size of the inorganic filler can be measured as the particle size (D50) when the cumulative volume from the small diameter side reaches 50% in the volume-based particle size distribution obtained by a laser scattering diffraction particle size distribution analyzer.

[0048] <Triadine ring-containing compound> -The first triazine ring-containing compound- The first triazine ring-containing compound has a triazine ring and an alkoxysilyl group. The position of nitrogen in the triazine ring is not particularly limited. That is, the triazine that forms the backbone may be 1,2,3-triazine, 1,2,4-triazine, or 1,3,5-triazine.

[0049] The first triazine ring-containing compound has a structure in which at least one of the hydrogen atoms bonded to the three carbon atoms on the triazine (C3H3N3) is substituted with a monovalent group having an alkoxysilyl group. The substitution position of the monovalent group may be any of the three carbon atoms. The number of substitutions of the monovalent group may be one to three, preferably one or two, and more preferably one.

[0050] In the first triazine ring-containing compound, if the number of substitutions of the monovalent group having an alkoxysilyl group is 1 or 2, the carbon atoms on the triazine ring that are not bonded to the monovalent group having an alkoxysilyl group may have substituents other than the monovalent group having an alkoxysilyl group bonded to them, or they may not have substituents bonded to them.

[0051] A monovalent group having an alkoxysilyl group may be the alkoxysilyl group itself, or a monovalent group formed by a linking group being bonded to the silicon atom of the alkoxysilyl group. When the monovalent group having an alkoxysilyl group is a monovalent group formed by a linking group being bonded to the silicon atom of the alkoxysilyl group, the linking group may be, for example, a hydrocarbon group, or a hydrocarbon group having heteroatoms such as a nitrogen atom or an oxygen atom. The length of the linking group, that is, the number of atoms (excluding hydrogen atoms, branched chains, or substituents) on the atomic chain between the silicon atom of the alkoxysilyl group and the carbon atom on the triazine ring, may be, for example, 2 to 13 or 3 to 11.

[0052] The alkoxysilyl group has a structure represented as -Si(OR)3. Here, each R independently represents either a hydrogen atom or an alkyl group, and at least one of the three Rs is an alkyl group. Preferably, two or more of the three Rs are alkyl groups, and more preferably, all three are alkyl groups. The alkyl groups represented by R are preferably alkyl groups having 1 to 4 carbon atoms, more preferably ethyl or methyl groups, and even more preferably ethyl groups.

[0053] Other substituents besides monovalent groups having an alkoxysilyl group, which may be bonded to the triazine ring, are not particularly limited and include halogen atoms, amino groups, hydroxyl groups, arylamino groups, alkylamino groups, etc. Among these, amino groups are preferred, primary amino groups or secondary amino groups are more preferred, and primary amino groups are even more preferred. The number of substituents other than monovalent groups having an alkoxysilyl group is not particularly limited, but it is preferable that the total number of monovalent groups having an alkoxysilyl group and the number of substituents other than monovalent groups having an alkoxysilyl group is 3.

[0054] A preferred example of the first triazine ring-containing compound is the compound represented by the following general formula (I).

[0055] [ka]

[0056] In formula (I), X represents a monovalent group having an alkoxysilyl group. The details of the monovalent group having an alkoxysilyl group in X are the same as in the embodiment described above.

[0057] The molecular weight of the triazine ring-containing compound is not particularly limited and may be, for example, 100 to 800, 200 to 700, or 300 to 600.

[0058] The melting point of the first triazine ring-containing compound is not particularly limited, but from the viewpoint of high-temperature adhesion and pot life, it is preferably 200°C or lower, more preferably 175°C or lower, and even more preferably 150°C or lower. From the viewpoint of handling and dispersibility, the melting point of the first triazine ring-containing compound is preferably 0°C or higher, more preferably 10°C or higher, and even more preferably 25°C or higher. From the above viewpoints, the melting point of the first triazine ring-containing compound is preferably 0°C to 200°C, more preferably 10°C to 175°C, and even more preferably 25°C to 150°C.

[0059] From the viewpoint of achieving both high-temperature adhesion to copper and excellent pot life, the content of the first triazine ring-containing compound relative to the total mass of the underfill material is preferably 0.05% by mass or more, more preferably 0.10% by mass or more, and even more preferably 0.20% by mass or more. Furthermore, from the viewpoint of suppressing an increase in the viscosity of the underfill material itself, the content of the first triazine ring-containing compound relative to the total mass of the underfill material is preferably 3.0% by mass or less, more preferably 2.0% by mass or less, and even more preferably 1.5% by mass or less. From the above viewpoint, the content of the first triazine ring-containing compound relative to the total mass of the underfill material is preferably 0.05% to 3.0% by mass, more preferably 0.10% to 2.0% by mass, and even more preferably 0.20% to 1.5% by mass.

[0060] -Second triazine ring-containing compound- The second triazine ring-containing compound has a triazine ring and a primary amino group, and its melting point is 200°C or lower.

[0061] From the viewpoint of high-temperature adhesion and pot life, the melting point of the second triazine ring-containing compound is preferably 175°C or lower, and more preferably 150°C or lower. From the viewpoint of handling and dispersibility, the melting point of the second triazine ring-containing compound is preferably 0°C or higher, more preferably 10°C or higher, and even more preferably 25°C or higher. From the above viewpoints, the melting point of the second triazine ring-containing compound is preferably 0°C to 200°C, more preferably 10°C to 175°C, and even more preferably 25°C to 150°C. The melting point of a triazine ring-containing compound can be measured using a melting point analyzer or similar device.

[0062] The position of nitrogen in the triazine ring is not particularly limited. That is, the triazine that forms the backbone may be 1,2,3-triazine, 1,2,4-triazine, or 1,3,5-triazine.

[0063] The second triazine ring-containing compound has a structure in which at least one hydrogen atom bonded to the three carbon atoms on the triazine (C3H3N3) is substituted with a monovalent group having a primary amino group. The substitution position of the monovalent group may be any of the three carbon atoms. The number of substitutions by the monovalent group may be one to three.

[0064] In the second triazine ring-containing compound, if the number of substitutions of the monovalent group having a primary amino group is 1 or 2, the carbon atoms on the triazine ring to which the monovalent group having a primary amino group is not attached may have substituents other than the monovalent group having a primary amino group attached, or they may not have substituents attached.

[0065] A monovalent group having a primary amino group may be the primary amino group itself, or it may be a monovalent group formed by a linking group being bonded to the nitrogen atom of the primary amino group. When the monovalent group having a primary amino group is a monovalent group formed by a linking group being bonded to the nitrogen atom of the primary amino group, the linking group may be, for example, a hydrocarbon group, or a hydrocarbon group having heteroatoms such as a nitrogen atom and an oxygen atom. The length of the linking group, that is, the number of atoms (excluding hydrogen atoms, branched chains, or substituents) on the atomic chain between the nitrogen atom of the primary amino group and the carbon atom on the triazine ring, may be, for example, 1 to 10 or 1 to 5. It is preferable that the monovalent group having a primary amino group is the primary amino group itself.

[0066] Other substituents besides the monovalent group having a primary amino group, which may be bonded to the triazine ring, are not particularly limited and include halogen atoms, amino groups, hydroxyl groups, arylamino groups, alkylamino groups, monovalent groups having alkoxysilyl groups, etc. From the viewpoint of pot life, monovalent groups having alkoxysilyl groups are preferred. Details of the monovalent group having alkoxysilyl groups are the same as those described for the monovalent group having alkoxysilyl groups in the first triazine ring-containing compound. The number of substituents other than the monovalent group having a primary amino group is not particularly limited, but it is preferable that the total number of monovalent groups having a primary amino group and the number of substituents other than the monovalent group having a primary amino group is 3.

[0067] A preferred example of a second triazine ring-containing compound is the compound represented by the general formula (I) described above.

[0068] From the viewpoint of achieving both high-temperature adhesion to copper and excellent pot life, the content of the second triazine ring-containing compound relative to the total mass of the underfill material is preferably 0.05% by mass or more, more preferably 0.10% by mass or more, and even more preferably 0.20% by mass or more. Furthermore, from the viewpoint of suppressing an increase in the viscosity of the underfill material itself, the content of the second triazine ring-containing compound relative to the total mass of the underfill material is preferably 3.0% by mass or less, more preferably 2.0% by mass or less, and even more preferably 1.5% by mass or less. From the above viewpoint, the content of the second triazine ring-containing compound relative to the total mass of the underfill material is preferably 0.05% to 3.0% by mass, more preferably 0.10% to 2.0% by mass, and even more preferably 0.20% to 1.5% by mass.

[0069] <Various additives> In addition to the components described above, the underfill material may contain various additives such as curing accelerators, stress relievers, coupling agents, ion trapping agents, bleed inhibitors, and colorants. The underfill material may also contain various additives known in the art, as needed, in addition to the additives exemplified below.

[0070] (Curing accelerator) The underfill material may contain a curing accelerator. The type of curing accelerator is not particularly limited and can be selected according to the type of epoxy resin and curing agent, the desired properties of the underfill material, etc. Specifically, cycloamidine compounds such as 1,8-diaza-bicyclo[5.4.0]undecene-7, 1,5-diaza-bicyclo[4.3.0]nonene, 5,6-dibutylamino-1,8-diaza-bicyclo[5.4.0]undecene-7; cycloamidine compounds with maleic anhydride, 1,4-benzoquinone, 2,5-tholquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy- Compounds with intramolecular polarization obtained by adding quinone compounds such as 1,4-benzoquinone and phenyl-1,4-benzoquinone, diazophenylmethane, and phenolic resins that have π bonds; tertiary amine compounds such as benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris(dimethylaminomethyl)phenol; derivatives of tertiary amine compounds; 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-ethyl-4-methylimidazole Examples include imidazole compounds such as 2-phenyl-4-methyl-5-hydroxymethylimidazole and 2-phenyl-4,5-dihydroxymethylimidazole; derivatives of imidazole compounds; organic phosphine compounds such as tributylphosphine, methyldiphenylphosphine, triphenylphosphine, tris(4-methylphenyl)phosphine, diphenylphosphine, and phenylphosphine; phosphorus compounds having intramolecular polarization obtained by adding compounds having π bonds such as maleic anhydride, the above quinone compounds, diazophenylmethane, and phenolic resins to organic phosphine compounds; tetraphenylborate salts such as tetraphenylphosphonium tetraphenylborate, triphenylphosphonium tetraphenylborate, 2-ethyl-4-methylimidazolium tetraphenylborate, and N-methylmorpholinium tetraphenylborate; derivatives of tetraphenylborate salts; and tetraphenylborane complexes such as triphenylphosphine-triphenylborane complex and morpholine-triphenylborane complex.The hardening accelerator may be used individually or in combination of two or more types.

[0071] If the underfill material contains a curing accelerator, the amount of the curing accelerator is not particularly limited, but is preferably 0.1 to 15 parts by mass, more preferably 0.5 to 10 parts by mass, and even more preferably 0.8 to 5 parts by mass per 100 parts by mass of epoxy resin.

[0072] (Stress reliever) The underfill material may contain a stress-relieving agent. The type of stress-relieving agent is not particularly limited and examples include thermoplastic elastomers, NR (natural rubber), NBR (acrylonitrile-butadiene rubber), acrylic rubber, urethane rubber, silicone rubber particles, etc. The stress-relieving agent may be used alone or in combination of two or more types.

[0073] If the underfill material contains a stress-relieving agent, the amount of stress-relieving agent is not particularly limited, but is preferably 0.1 to 30 parts by mass, and more preferably 1 to 15 parts by mass, per 100 parts by mass of epoxy resin.

[0074] (Coupling agent) The underfill material may contain a coupling agent. The type of coupling agent is not particularly limited and includes silane compounds such as epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane, and vinylsilane; titanium compounds; aluminum chelate compounds; and aluminum / zirconium compounds. The coupling agent may be used alone or in combination of two or more types.

[0075] If the underfill material contains a coupling agent, the amount of the coupling agent is not particularly limited, but is preferably 0.01 to 5 parts by mass, and more preferably 0.02 to 2.5 parts by mass, per 100 parts by mass of epoxy resin.

[0076] (Ion trapping agent) The underfill material may contain an ion trap agent. The type of the ion trap agent is not particularly limited, and examples thereof include compounds represented by the following general formula (VI-1) or the following general formula (VI-2).

[0077] Mg 1-a Al a (OH)2(CO3) a / 2 ·uH2O (VI-1) (In general formula (VI-1), a is 0 < a ≤ 0.5, and u is a positive number.) BiO b (OH) c (NO3) d (VI-2) (In general formula (VI-2), b is 0.9 ≤ b ≤ 1.1, c is 0.6 ≤ c ≤ 0.8, and d is 0.2 ≤ d ≤ 0.4.)

[0078] The ion trap agent is available as a commercial product. As the compound represented by the general formula (VI-1), for example, "DHT-4A" (trade name, manufactured by Kyowa Chemical Industry Co., Ltd.) is available as a commercial product. Further, as the compound represented by the general formula (VI-2), for example, "IXE500" (trade name, manufactured by Toagosei Co., Ltd.) is available as a commercial product.

[0079] [[ID=--31]]In addition, as the ion trap agent other than the above, examples include hydrated oxides of elements selected from magnesium, aluminum, titanium, zirconium, antimony, etc. The ion trap agent may be used alone or in combination of two or more.

[0080] When the underfill material contains an ion trapping agent, the amount of the ion trapping agent is not particularly limited. From the viewpoint of achieving sufficient moisture resistance reliability, it is preferable that the amount be 1 part by mass or more, and more preferably 2 parts by mass or more, per 100 parts by mass of epoxy resin. From the viewpoint of fully exhibiting the effects of other components, the amount of the ion trapping agent is preferably 15 parts by mass or less, more preferably 10 parts by mass or less, and even more preferably 5 parts by mass or less, per 100 parts by mass of epoxy resin. From the above viewpoints, the amount of the ion trapping agent is preferably 1 to 15 parts by mass, more preferably 1 to 10 parts by mass, and even more preferably 2 to 5 parts by mass, per 100 parts by mass of epoxy resin.

[0081] Furthermore, the average particle size of the ion trapping agent is preferably 0.1 μm to 3.0 μm, and the maximum particle size is preferably 10 μm or less. The average particle size of the ion trapping agent can be measured in the same manner as in the case of inorganic fillers.

[0082] (Bleed inhibitor) The underfill material may contain a bleed inhibitor. The type of bleed inhibitor is not particularly limited and examples include nonionic surfactants and silicone-modified epoxy resins. The bleed inhibitor may be used alone or in combination of two or more types.

[0083] The amount of bleed inhibitor is not particularly limited, but is preferably 0.1 to 5 parts by mass, more preferably 0.2 to 2 parts by mass, and even more preferably 0.3 to 1 part by mass per 100 parts by mass of epoxy resin.

[0084] (Coloring agent) The underfill material may contain a coloring agent. The type of coloring agent is not particularly limited and includes carbon black, organic dyes, organic pigments, titanium dioxide, red lead, and red iron oxide. The coloring agent may be used alone or in combination of two or more types.

[0085] If the underfill material contains a coloring agent, the amount of coloring agent is not particularly limited, but is preferably 0.001 to 1 part by mass, and more preferably 0.02 to 0.5 parts by mass, relative to the total amount of underfill material.

[0086] [Method for preparing underfill material] Underfill material can be obtained, for example, by stirring, melting, mixing, dispersing, etc., of each component, either together or separately, while applying heat treatment as necessary. The apparatus for mixing, stirring, and dispersing these components is not particularly limited and includes crushing machines equipped with stirring devices, heating devices, etc., three-roll mills, ball mills, planetary mixers, bead mills, etc. Underfill material can be obtained by mixing and kneading each component using these apparatuses and degassing as necessary.

[0087] [Uses of underfill material] The underfill material can be used in various mounting technologies. In particular, the underfill material of this disclosure is suitably used as an underfill material for flip-chip mounting technology, that is, for filling the gap between a semiconductor element joined by bumps, etc., and a substrate. Furthermore, the underfill material of this disclosure can be suitably used as an underfill material for flip-chip mounting technology using copper pillars.

[0088] The types of semiconductor elements and substrates are not particularly limited and can be appropriately selected from those commonly used in the field of semiconductor packaging. The method of filling the gap between the semiconductor element and the substrate using underfill material is not particularly limited.

[0089] Semiconductor Packages The semiconductor package of this disclosure comprises a substrate, a semiconductor element disposed on the substrate, and a cured underfill material of this disclosure that encapsulates the semiconductor element.

[0090] In semiconductor packages, the types of semiconductor elements and substrates are not particularly limited and can be appropriately selected from those commonly used in the field of semiconductor packaging. From the viewpoint that the underfill material of this disclosure is particularly useful, the semiconductor package is preferably a flip-chip type semiconductor package, and more preferably a flip-chip type semiconductor package using copper pillars as bumps to connect the semiconductor elements and the substrate.

[0091] ≪Methods for manufacturing semiconductor packages≫ A method for manufacturing a semiconductor package according to the present disclosure comprises the steps of filling the gap between a substrate and a semiconductor element disposed on the substrate with an underfill material according to the present disclosure, and curing the underfill material.

[0092] Details of the semiconductor package are as described above. The method of filling the gap between the semiconductor element and the substrate using underfill material, and the method of curing the underfill material after filling, are not particularly limited. For example, there is a post-filling method in which, after connecting the semiconductor element and the substrate, underfill material is applied to the gap between the semiconductor element and the substrate using capillary action, and then the curing reaction of the underfill material is carried out. There is also a pre-coating method in which underfill material is applied to at least one surface of the semiconductor element and the substrate in advance, and when the semiconductor element is connected to the substrate by thermal compression bonding, the connection of the semiconductor element and the substrate and the curing reaction of the underfill material are carried out in one step. Methods for applying the underfill material include casting, dispensing, and printing.

[0093] The curing conditions for the underfill material are not particularly limited, but it is preferable to heat it at 80°C to 200°C for 1 minute to 150 minutes. [Examples]

[0094] The embodiments described above will be explained in detail below with reference to examples, but the scope of the embodiments of this disclosure is not limited to these examples.

[0095] [Preparation of underfill material] The underfill material was prepared by mixing the components shown in Tables 1 and 2 in the proportions indicated in those tables. Details of each component are as follows. In Tables 1 and 2, blank spaces indicate that the component was not included.

[0096] Epoxy resin 1…Liquid bisphenol F type epoxy resin, epoxy equivalent: 160g / eq, product name "Epotote YDF-8170C", Nippon Steel Chemical & Material Co., Ltd. Epoxy resin 2… Triglycidyl-p-aminophenol, epoxy equivalent: 95g / eq, product name "jER 630", Mitsubishi Chemical Corporation Epoxy resin 3…1,6-bis(glycidyloxy)naphthalene, epoxy equivalent: 143g / eq, product name "Epiclon HP-4023D", DIC Corporation

[0097] Hardener 1: Diethyltoluenediamine, product name "jER Cure W", active hydrogen equivalent: 45g / eq, Mitsubishi Chemical Corporation Hardening agent 2: 3,3'-diethyl-4,4'-diaminodiphenylmethane, trade name "Kayahard AA", active hydrogen equivalent: 63g / eq, Nippon Kayaku Co., Ltd. Hardening agent 3: 3,4-dimethyl-6-(2-methyl-1-propenyl)-4-cyclohexene-1,2-dicarboxylic acid anhydride, trade name "YH-306", acid equivalent of anhydride: 234 g / eq, Mitsubishi Chemical Corporation Hardening agent 4…2-allylphenol-formaldehyde polycondensate, product name "MEH-8000H", active hydrogen equivalent: 140g / eq, Meiwa Kasei Co., Ltd.

[0098] Curing accelerator 1… Triphenylphosphine Curing accelerator 2…2-phenyl-4-methyl-5-hydroxymethylimidazole Ion trapping agent…a compound represented by general formula (VI-2), trade name: "IXE500", manufactured by Toagosei Co., Ltd. Coloring agent: Carbon black, product name "MA-100", Mitsubishi Chemical Corporation Inorganic filler: Spherical silica with a surface treated with an epoxysilane coupling agent, product name "SE2200-SEJ", volume average particle size 0.6 μm, manufactured by Admatex Co., Ltd.

[0099] The following commercially available compounds were used as test compounds.

[0100] Compound 1… Triazine derivative (Trade name: VD-5, Shikoku Chemicals Co., Ltd., see compound below, R is a divalent linking group)

[0101] [ka]

[0102] Compound 2…Melamine (see compound below)

[0103] [ka]

[0104] Compound 3…6-phenyl-1,3,5-triazine-2,4-diamine (see compound below)

[0105] [ka]

[0106] Compound 4…3-amino-1,2,4-triazole (see compound below)

[0107] [ka]

[0108] Compound 5…5-amino-1H-tetrazole (see compound below)

[0109] [ka]

[0110] Compound 6…1,2,3-benzotriazole (Trade name: BT-120, Johoku Chemical Industry Co., Ltd., see compound below)

[0111] [ka]

[0112] Compound 7…1-[N,N-bis(2-ethylhexyl)aminomethyl]benzotriazole (Trade name: BT-LX, Johoku Chemical Industry Co., Ltd., see compound below)

[0113] [ka]

[0114] [Table 1]

[0115] [Table 2]

[0116] In Tables 1 and 2, the amount of curing agent is shown as a mass ratio with the total mass of the curing agent set to 100. The amounts of colorants, inorganic fillers, and test compounds are shown as their content (mass%) relative to the total mass of the underfill material. The amounts of curing accelerators and ion trappers are shown as parts by mass of each component relative to 100 parts by mass of the total epoxy resin. In the above underfill material, the ratio of the number of active hydrogens in the curing agent to the number of epoxy groups in the epoxy resin (number of active hydrogens in the curing agent / number of epoxy groups in the epoxy resin) is 1.0.

[0117] [Evaluation of viscosity] The viscosity (Pa·s) of the underfill material at 25°C was measured using an E-type viscometer (manufactured by Tokyo Keiki Co., Ltd., VISCONIC EHD model (product name)) (cone angle 3°, rotation speed: 10 revolutions / minute) at revolutions per minute (rpm).

[0118] [PotLife's evaluation] The underfill material was left at 25°C for 24 hours, and its viscosity at 25°C was measured using an E-type viscometer (Tokyo Keiki Co., Ltd., VISCONIC EHD model (product name)) (cone angle 3°, rotation speed 10 revolutions per minute (rpm)) (viscosity after standing). However, for samples with high viscosity that could not be measured at 10 revolutions per minute (rpm), the measurement was performed at 2.5 revolutions per minute (rpm). Pot life (%) was calculated as the viscosity increase rate after 24 hours of standing using the following formula. Pot life (%) = {(Viscosity after standing - Initial viscosity) / Initial viscosity} × 100

[0119] [Evaluation of adhesive strength at 25°C or 260°C] Adhesion to copper (Cu) Test specimens were prepared by forming an underfill material to a diameter of 3 mm and a height of 3 mm on the surface of a copper plate. Using a Bond Tester DS100 (manufactured by DAGE), shear stress was applied under conditions of a head speed of 50 μm / sec and 25°C or 260°C, and the strength at which the formed product peeled off from the copper plate was measured.

[0120] The evaluation results are shown in Tables 3 and 4. In Tables 3 and 4, "-" indicates that the result is not applicable. In the evaluation of pot life, "unmeasurable" means that the thickening was so significant that measurement was not possible.

[0121] [Table 3]

[0122] [Table 4]

[0123] As shown in Tables 3 and 4, the underfill materials of Examples 1 to 6 containing test compound 1 exhibited excellent pot life and adhesion to copper at 260°C. On the other hand, the underfill material of Comparative Example 1, which did not contain test compound 1, had slightly higher adhesion to copper at 25°C, but inferior adhesion to copper at 260°C. The underfill materials of Comparative Examples 2 to 7, which contained various test compounds, had significantly inferior pot life or inferior adhesion to copper at 260°C. Furthermore, the underfill materials of Comparative Examples 8 or 9, which contained test compound 1 but had the curing agent replaced with curing agent 3 or 4, also had inferior pot life and adhesion to copper at 260°C.

[0124] The disclosure of Japanese Patent Application No. 2020-009238 is incorporated herein by reference in its entirety. All documents, patent applications, and technical standards described herein are incorporated by reference to the same extent as if each individual document, patent application, and technical standard were specifically and individually noted as being incorporated by reference.

Claims

1. Epoxy resin and A curing agent containing an aromatic amine curing agent, Inorganic fillers and A compound having a triazine ring and an alkoxysilyl group, It contains, An underfill material in which the inorganic filler content is 30% by mass or more relative to the total mass of the underfill material.

2. The underfill material according to claim 1, wherein the compound having the triazine ring and the alkoxysilyl group has a melting point of 200°C or less.

3. The underfill material according to claim 1 or claim 2, wherein the compound having the triazine ring and the alkoxysilyl group further has a primary amino group.

4. The underfill material according to any one of Claims 1 to 3, wherein the content of the compound having a triazine ring and an alkoxysilyl group is 0.05% by mass to 1.5% by mass with respect to the total mass of the underfill material.

5. The underfill material according to any one of Claims 1 to 4, wherein the ratio of the number of functional groups in the curing agent to the number of epoxy groups in the epoxy resin (number of functional groups in the curing agent / number of epoxy groups in the epoxy resin) is 0.5 to 2.

0.

6. The underfill material according to any one of Claims 1 to 5, wherein the adhesive strength to copper at 260°C is greater than 0.80 kgf.

7. Epoxy resin and A curing agent containing an aromatic amine curing agent, Inorganic fillers and A compound having a triazine ring and a primary amino group, and having a melting point of 200°C or less, It contains, An underfill material in which the inorganic filler content is 30% by mass or more relative to the total mass of the underfill material.

8. The underfill material according to claim 7, wherein the content of the compound having a triazine ring and a primary amino group and having a melting point of 200°C or less is 0.05% by mass to 1.5% by mass with respect to the total mass of the underfill material.

9. The underfill material according to claim 7 or claim 8, wherein the ratio of the number of functional groups in the curing agent to the number of epoxy groups in the epoxy resin (number of functional groups in the curing agent / number of epoxy groups in the epoxy resin) is 0.5 to 2.

0.

10. The underfill material according to any one of claims 7 to 9, wherein the adhesive strength to copper at 260°C is greater than 0.80 kgf.

11. A semiconductor package comprising a substrate, a semiconductor element disposed on the substrate, and a cured underfill material according to any one of claims 1 to 10 that encapsulates the semiconductor element.

12. A method for manufacturing a semiconductor package, comprising the steps of: filling the gap between a substrate and a semiconductor element disposed on the substrate with an underfill material according to any one of claims 1 to 10; and curing the underfill material.

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