Processing equipment

Abstract

To provide a processing device that can enhance cleaning effects while preventing an increase in a manufacturing process time and an increase in the size of the device.SOLUTION: A processing device includes a cleaning liquid supply nozzle (81) installed to intersect a movement path of a holding table (10) by a movement unit (40), a nitrogen supply nozzle (83) having a nitrogen supply port (84) that supplies nitrogen to the surface of a workpiece (Wa) held on a holding surface (11), which is installed to intersect the movement path of the holding table (10), and a UV irradiation unit (100) that is installed adjacent to the nitrogen supply nozzle (83) and irradiates an area from which oxygen has been removed by nitrogen with ultraviolet rays, improves the hydrophilicity of the workpiece (Wa), and increases the cleaning effect in a cleaning unit (60).SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a processing apparatus.

Background Art

[0002] In the semiconductor device manufacturing process, devices such as ICs and LSIs are formed in each of the regions partitioned by a plurality of division planned lines formed in a grid pattern on the surface of a semiconductor wafer (hereinafter simply referred to as "wafer"), and are divided into individual devices along the division planned lines by a processing apparatus such as a dicing apparatus.

[0003] After the wafer, which is a workpiece, is cut by a processing apparatus such as a dicing apparatus, processing chips adhere to the wafer. These processing chips are removed by, for example, a cleaning apparatus described in Patent Document 1.

[0004] In Patent Document 2 and Patent Document 3, an adhesive tape is used for wafer fixing, but a technique of irradiating ultraviolet rays to reduce the adhesive force of processing chips in order to sufficiently remove the processing chips of the adhesive tape made of ultraviolet curable paste adhering to the wafer surface is described.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0006] In semiconductor device manufacturing processes, there is a need for processing equipment that can achieve high cleaning effectiveness on workpieces while improving productivity. For example, when removing processing debris such as tape scraps that adhere to a workpiece after processing, one could consider extending the cleaning time, but this would decrease productivity. Furthermore, there is a problem in that allocating space within the equipment to install new mechanisms to improve cleaning effectiveness would increase the size of the equipment.

[0007] This invention has been made in view of the above, and aims to provide a processing apparatus that enhances cleaning effectiveness while preventing an increase in manufacturing process time and equipment size. [Means for solving the problem]

[0008] A processing apparatus according to one aspect of the present invention comprises: a holding table for holding a workpiece on a holding surface; a processing unit for processing the workpiece held on the holding surface; a moving unit for moving the holding table; a cleaning fluid supply nozzle installed so as to intersect the movement path of the holding table by the moving unit; a cleaning unit for cleaning the workpiece; a transport unit for transporting the workpiece from the holding table to the cleaning unit; a nitrogen supply nozzle installed so as to intersect the movement path of the holding table and having a nitrogen supply port for supplying nitrogen to the surface of the workpiece held on the holding surface; and an ultraviolet irradiation unit installed adjacent to the nitrogen supply nozzle, which irradiates ultraviolet light into the area from which oxygen has been removed by nitrogen, thereby improving the hydrophilicity of the workpiece and enhancing the cleaning effect in the cleaning unit. ru.

[0009] A processing apparatus according to one aspect of the present invention is characterized in that the cleaning liquid supply nozzle, the nitrogen supply nozzle, and the ultraviolet irradiation unit are arranged in that order from the processing unit side.

[0010] A processing apparatus according to one aspect of the present invention is characterized in that the workpiece is fixed to a tape whose adhesive strength is reduced by irradiation with ultraviolet light, the processing unit forms dividing grooves that divide the workpiece into a plurality of chips, and the ultraviolet irradiation unit hardens tape scraps that adhere to the sides of the chips during the processing process. [Effects of the Invention]

[0011] According to the processing apparatus of the present invention, it is possible to improve the cleaning effect while preventing an increase in the time required for the manufacturing process and an increase in the size of the apparatus. [Brief explanation of the drawing]

[0012] [Figure 1] This is a perspective view showing the processing apparatus according to this embodiment. [Figure 2] This is a cross-sectional view showing how a nozzle unit supplies cleaning solution and nitrogen to a workpiece in the processing apparatus according to this embodiment. [Figure 3] Figure 3A is a cross-sectional view showing the irradiation of ultraviolet light by the ultraviolet irradiation unit in the processing apparatus according to this embodiment. Figure 3B is a cross-sectional view showing the curing of tape scraps by the ultraviolet irradiation unit. [Figure 4] This is an explanatory diagram of cleaning by the cleaning unit in the processing apparatus according to this embodiment. [Modes for carrying out the invention]

[0013] The wafer processing apparatus according to this embodiment will now be described with reference to the attached drawings. Figure 1 is a perspective view showing the processing apparatus according to this embodiment. Figure 2 is a cross-sectional view showing the supply of cleaning solution and nitrogen to the workpiece by a nozzle unit in the processing apparatus according to this embodiment. Figure 3A is a cross-sectional view showing the irradiation of ultraviolet light by an ultraviolet irradiation unit in the processing apparatus according to this embodiment. Figure 3B is a cross-sectional view showing the hardening of tape scraps by the ultraviolet irradiation unit. Figure 4 is an explanatory diagram of cleaning by a cleaning unit in the processing apparatus according to this embodiment.

[0014] The X, Y, and Z axes shown in each diagram are perpendicular to each other. The X and Y axes are approximately horizontal, while the Z axis is vertical. In each diagram, of the two arrows indicating the X axis, the side with the letter X is forward, and the side without the letter X is backward. Of the two arrows indicating the Y axis, the side with the letter Y is to the right, and the side without the letter Y is to the left. Of the two arrows indicating the Z axis, the side with the letter Z is upward, and the side without the letter Z is downward.

[0015] Figure 1 is a perspective view showing a processing apparatus according to this embodiment. The processing apparatus 1 shown in Figure 1 performs cutting on a workpiece W to divide the workpiece W into individual chips D.

[0016] The workpiece W is a disc-shaped semiconductor wafer or optical device wafer made from materials such as silicon, sapphire, or gallium. Alternatively, the workpiece W may be various plate-shaped processing materials, such as ceramic, glass, or sapphire-based plate-shaped inorganic substrates, or plate-shaped ductile materials such as metals or resins.

[0017] The workpiece W has an adhesive tape T attached to its back surface WR (see Figures 2-3), and an annular frame F is attached to the adhesive tape T, so the workpiece W is attached to the annular frame F via the adhesive tape T. The adhesive layer of the adhesive tape T is made of an ultraviolet-curing adhesive made of a resin that hardens when exposed to ultraviolet light. Therefore, the workpiece W is provided to the processing apparatus 1 while fixed to the adhesive tape T, whose adhesive strength decreases when exposed to ultraviolet light.

[0018] The processing device 1 includes a holding table 10 that holds the workpiece W on the holding surface 11, a processing unit (cutting unit) 20 that performs processing (cutting) while supplying a processing fluid (cutting fluid) to the workpiece W held on the holding table 10, a moving unit 30 that relatively moves the holding table 10 and the processing unit 20 in the X-axis direction (processing feed direction), a moving unit 40 that relatively moves the holding table 10 and the processing unit 20 in the Y-axis direction (indexing feed direction), a moving unit 50 that relatively moves the holding table 10 and the processing unit 20 in the Z-axis direction (cutting feed direction), a cleaning unit 60 that supplies a cleaning fluid to the workpiece W after processing and cleans it, a nozzle unit 80, an ultraviolet irradiation unit 100, and a control unit 120.

[0019] The cassette 110 houses a plurality of workpieces W before and after processing. A loading / unloading unit (not shown) transports the workpiece W between the cassette 110 and the holding table 10. The transport unit 70 transports the workpiece W between the cleaning unit 60 and the holding table 10.

[0020] The holding table 10 holds the workpiece W adhered to the opening of the annular frame F via the adhesive tape T. The portion of the holding table 10 that constitutes the holding surface 11 is in a disk shape formed from porous ceramic or the like. Also, the holding table 10 is connected to a vacuum suction source (not shown) and sucks and holds the workpiece W placed on the holding surface 11. A plurality of clamp portions 1 are provided around the holding table 10 to sandwich the annular frame F around the workpiece W.

[0021] The holding table 10 is disposed on the upper surface of the apparatus main body 2 so as to be movable in the X-axis direction and is provided rotatably around the central axis (parallel to the Z-axis) by a rotation drive source (not shown).

[0022] The holding table 10 is moved along the X-axis direction by the moving unit 30 between the processing region 4 where the processing unit 20 processes the workpiece W and the loading / unloading region 5 where the workpiece W is loaded and unloaded between the cassette 110.

[0023] Along the movement path of the holding table 10, a cover member 6 is provided that covers the table movement base supporting the holding table 10 from above in the vertical direction (Z-axis direction), and bellows members 7 are attached to both ends of the cover member 6. The movement unit 30 is composed of a ball screw mechanism and the like, which is provided inside the main body of the device 2, and in Figure 1, the movement unit 30 is covered by the cover member 6 and the bellows members 7.

[0024] The processing unit 20 has a spindle 22 equipped with a cutting blade 21 that cuts the workpiece W held on the holding table 10. The processing unit 20 divides the workpiece W into multiple chips D and forms dividing grooves Da (see Figure 3B). The processing unit 20 also has a processing fluid supply nozzle 24 (see Figure 2) that supplies processing fluid (cutting fluid) to the workpiece W during processing. The processing fluid supplied from the processing fluid supply nozzle 24 removes processing chips from the cutting blade 21 and cools the area around the cutting blade 21. As shown in Figure 1, the processing unit 20 is installed on a column section 3 that is erected from the main body of the apparatus 2 via a moving unit 40, a moving unit 50, etc.

[0025] Furthermore, the depth to which the cutting blade 21 cuts the workpiece W can be set arbitrarily. For example, as shown in Figure 3B, it may cut to a depth that cuts into the adhesive tape T.

[0026] The machining unit 20 is provided so as to be movable in the Y-axis direction by a moving unit 40 and so as to be movable in the Z-axis direction by a moving unit 50 relative to the workpiece W held on the holding table 10. The machining unit 20 can position the cutting blade 21 at any position on the surface of the holding table 10 by moving units 40 and 50.

[0027] The cutting blade 21 is an extremely thin cutting wheel with a roughly ring shape. The spindle 22 is housed in the spindle housing 23 and cuts the workpiece W by rotating the cutting blade 21.

[0028] The nozzle unit 80 removes the processing fluid containing processing debris generated when the workpiece W is cut by the processing unit 20 using a cleaning solution and nitrogen.

[0029] As shown in Figure 1, the nozzle unit 80 includes a cleaning solution supply nozzle 81 that sprays a cleaning solution (e.g., pure water) Wa toward the workpiece W after processing, and a nitrogen supply nozzle 83 that sprays nitrogen A toward the workpiece W after processing.

[0030] The cleaning fluid supply nozzle 81 is a tubular member through which the cleaning fluid Wa flows. The cleaning fluid supply nozzle 81 is installed between the processing area 4 and the loading / unloading area 5 so as to intersect with the movement path of the holding table 10, which is moved in the X-axis direction by the moving unit 30.

[0031] The nitrogen supply nozzle 83 is a tubular member through which nitrogen A flows. The nitrogen supply nozzle 83 is installed between the processing area 4 and the loading / unloading area 5 so as to intersect with the movement path of the holding table 10, which is moved in the X-axis direction by the moving unit 30.

[0032] Furthermore, it is preferable that the nitrogen supply direction of the nitrogen supply nozzle 83 be directed towards the ultraviolet irradiation range of the ultraviolet irradiation unit 100. This allows oxygen present in the ultraviolet irradiation range of the ultraviolet irradiation unit 100 to be removed by the supplied nitrogen A.

[0033] The ultraviolet irradiation unit 100 is installed between the processing area 4 and the loading / unloading area 5, adjacent to the loading / unloading area 5 side relative to the nitrogen supply nozzle 83, and intersects with the movement path of the holding table 10, which is moved in the X-axis direction by the moving unit 30. The ultraviolet irradiation unit 100 irradiates the surface of the workpiece W with ultraviolet light U.

[0034] More specifically, the ultraviolet irradiation unit 100 irradiates the area from which oxygen has been removed by nitrogen A supplied from the nitrogen supply nozzle 83 with ultraviolet U, thereby improving the hydrophilicity of the workpiece W and enhancing the cleaning effect in the cleaning unit 60.

[0035] Furthermore, the ultraviolet light U emitted by the ultraviolet irradiation unit 100 reduces the adhesive strength of the adhesive tape T. This hardens the tape debris that adheres to the side surface of the chip D generated during the processing or cutting process, making it easier to remove the tape debris adhering to the side surface of the workpiece W using the cleaning unit 60.

[0036] In the X-axis direction, the cleaning fluid supply nozzle 81, nitrogen supply nozzle 83, and ultraviolet irradiation unit 100 are arranged in the order of cleaning fluid supply nozzle 81, nitrogen supply nozzle 83, and ultraviolet irradiation unit 100, moving from the processing area 4 side where the processing unit 20 is located toward the loading / unloading area 5 side.

[0037] Furthermore, it is preferable that the distance between the nitrogen supply nozzle 83 and the ultraviolet irradiation unit 100 be such that the nitrogen A supplied from the nitrogen supply nozzle 83 is blown into the irradiation range of the ultraviolet irradiation unit 100.

[0038] The cleaning unit 60 has a spinner table 61 for holding the workpiece W after processing. The cleaning unit 60 also has a cleaning fluid supply device and a gas supply device for cleaning the workpiece W. The cleaning fluid supply device supplies cleaning fluid to the workpiece W after processing from a cleaning fluid supply nozzle 62. The gas supply device supplies gas to the workpiece W after processing from a gas supply nozzle (not shown).

[0039] The transport unit 70 transports the processed workpiece W from the holding table 10 to the washing unit 60 using a transport arm 71. The transport arm 71 has a vacuum suction pad 72 at the tip of an H-shaped bracket formed at its end, which suctions and holds the workpiece W and transports it onto the spinner table 61 of the washing unit 60. The transport unit 70 is fixed to a drive unit (not shown) which includes a guide extending in the Y direction, a ball screw, and a motor that rotates the ball screw, and is moved in the Y direction. The transport unit 70 is also fixed to a lifting unit (not shown) which includes a ball screw extending in the Z direction and a motor that rotates the ball screw, and is moved in the Z direction.

[0040] The control unit 120 controls the aforementioned components that make up the processing device 1, causing the processing device 1 to perform processing operations on the workpiece W. The control unit 120 is mainly composed of a microprocessor equipped with a processing unit such as a CPU, ROM, RAM, etc. The control unit 120 is connected to a display unit (not shown) that displays the status of the processing operation, and an input unit (not shown) used by the operator to register processing content information, etc.

[0041] The cleaning process after cutting in the processing apparatus 1 configured as described above will be explained using Figures 2, 3, and 4.

[0042] Conventional processing equipment has problems with productivity when removing processing debris such as tape scraps that adhere to the workpiece after processing, such as decreased productivity if the cleaning time is extended, and problems when the equipment becomes larger if a new mechanism is installed to improve the cleaning effect.

[0043] In the processing apparatus according to this embodiment, by arranging the ultraviolet irradiation unit 100, which improves the hydrophilicity of the workpiece W, at an intersection with the movement path of the holding table 10, the processed workpiece W can be irradiated with ultraviolet U while passing below the ultraviolet irradiation unit 100, thereby preventing a significant increase in processing time and the need for a larger apparatus.

[0044] Furthermore, irradiating the workpiece W with ultraviolet light U makes the surface of the workpiece W hydrophilic, thereby enhancing the cleaning effect of the cleaning unit. However, if oxygen is present in the irradiation area, the cleaning effect will decrease due to the inhibitory effect of oxygen.

[0045] Let's explain the principle by which oxygen reduces the cleaning effect. The resin used in the adhesive layer of adhesive tape is an ultraviolet-curing resin. In ultraviolet-curing resins, the electrons of the photopolymerization initiator contained in the resin become unstable (radical) due to ultraviolet light and harden by bonding with other components of the resin. However, if oxygen is present in the ultraviolet irradiation range, the unstable photopolymerization initiator will bond with the oxygen and become stable, preventing the resin from hardening. As a result, the resin does not harden, the adhesive strength is maintained, and it becomes difficult to clean.

[0046] In this embodiment, by supplying nitrogen to the ultraviolet irradiation area, oxygen can be removed from the irradiation area, preventing a decrease in the cleaning effect due to oxygen, and consequently improving the cleaning effect of the cleaning unit.

[0047] Figure 2 is a cross-sectional view showing how cleaning fluid and nitrogen are supplied to a workpiece by a nozzle unit in the processing apparatus according to this embodiment. The operation of the nozzle unit will be explained using Figure 2.

[0048] The cleaning fluid supply nozzle 81 is supplied with cleaning fluid Wa from a cleaning fluid supply source (not shown). A cleaning fluid flow rate adjustment valve (not shown) is connected between the cleaning fluid supply nozzle 81 and the cleaning fluid supply source to adjust the flow rate of the cleaning fluid Wa supplied from the cleaning fluid supply nozzle 81.

[0049] The cleaning fluid supply nozzle 81 has a cleaning fluid supply port 82 that supplies cleaning fluid Wa toward the workpiece W. Multiple cleaning fluid supply ports 82 are formed on the lower surface of the cleaning fluid supply nozzle 81, spaced apart from each other along the longitudinal direction. The cleaning fluid Wa is supplied to an area covering the holding table 10, including the clamp portion 12, and is sprayed onto the entire workpiece W and the holding table 10 in the Y-axis direction.

[0050] The cleaning fluid supply nozzle 81 is controlled by the control unit 120. As shown by the white arrow in Figure 2, after the processing of the workpiece W is completed, the moving unit 30 moves the holding table 10 from the processing area 4 to the loading / unloading area 5.

[0051] When the holding table 10 begins to move, the cleaning fluid flow rate adjustment valve of the nozzle unit 80 opens, and cleaning fluid Wa is supplied from the cleaning fluid supply nozzle 81 toward the surface of the workpiece W. As a result, the cleaning fluid Wa supplied from the cleaning fluid supply port 82 is sprayed over the entire surface WS of the workpiece W as the holding table 10 moves in the X-axis direction, washing away any processing fluid containing processing debris remaining on the surface WS.

[0052] The nitrogen supply nozzle 83 is connected to a nitrogen supply source (not shown). A nitrogen flow control valve (not shown) is connected between the nitrogen supply nozzle 83 and the nitrogen supply source to adjust the flow rate of nitrogen A supplied from the nitrogen supply nozzle 83.

[0053] The nitrogen supply nozzle 83 has nitrogen supply ports 84 that supply nitrogen A toward the surface WS of the workpiece W. Multiple nitrogen supply ports 84 are formed on the lower surface of the nitrogen supply nozzle 83 along the longitudinal direction, spaced apart from each other. It is preferable that the nitrogen A is supplied to the ultraviolet irradiation range of the ultraviolet irradiation unit 100. This allows for efficient removal of oxygen from the ultraviolet irradiation range.

[0054] The nitrogen supply nozzle 83 is controlled by the control unit 120. When the holding table 10 starts to move, the nitrogen flow rate adjustment valve is opened and nitrogen A is supplied from the nitrogen supply nozzle 83 towards the workpiece W. The supply interval of nitrogen A may be intermittent or intermittent.

[0055] In this embodiment, oxygen inhibition during ultraviolet irradiation can be prevented by supplying nitrogen A through the nitrogen supply nozzle 83. Furthermore, nitrogen supply can also remove processing fluid that could not be completely removed by the cleaning fluid Wa alone, as well as cleaning fluid Wa remaining on the workpiece W.

[0056] Figure 3A is a cross-sectional view showing the irradiation of ultraviolet light by the ultraviolet irradiation unit in the processing apparatus according to this embodiment. Figure 3B is a cross-sectional view showing the curing of tape scraps by the ultraviolet irradiation unit. The ultraviolet irradiation process will be explained using Figure 3.

[0057] As shown in Figure 3A, the ultraviolet irradiation unit 100 has multiple UV lamps 102 arranged in parallel inside a case 101. Ultraviolet U light emitted from the UV lamps 102 is irradiated downwards from an opening 103 on the bottom surface of the case 101.

[0058] The ultraviolet irradiation unit 100 is controlled by the control unit 120. When the holding table 10 starts moving, the ultraviolet irradiation unit 100 starts irradiating ultraviolet U downwards from its UV lamp 102, and stops irradiating ultraviolet U when it has moved to the loading / unloading area 5. At the same time, the supply of cleaning solution Wa from the cleaning solution supply nozzle 81 and the supply of nitrogen from the nitrogen supply nozzle 83 are also stopped.

[0059] In this embodiment, by irradiating the workpiece W with ultraviolet light U, the hydrophilicity of the surface WS of the workpiece W is increased, thereby improving the cleaning effect of the cleaning unit 60. By increasing the hydrophilicity of the surface WS of the workpiece W, the cleaning unit 60 can prevent watermarks left by the cleaning solution Wa, and water can penetrate more easily into even minute grinding scratches, thereby improving the cleaning effect.

[0060] In this embodiment, nitrogen A is supplied by the nitrogen supply nozzle 83, thereby preventing oxygen inhibition during ultraviolet irradiation. This efficiently increases the hydrophilicity of the workpiece W, and enhances the cleaning effect of the cleaning unit 60.

[0061] Furthermore, it is preferable that the distance between the nitrogen supply nozzle 83 and the ultraviolet irradiation unit 100 be such that the nitrogen A supplied from the nitrogen supply nozzle 83 is blown into the irradiation range of the ultraviolet irradiation unit 100.

[0062] This allows the processed workpiece W to be irradiated with ultraviolet light U while passing beneath the ultraviolet irradiation unit 100, preventing a significant increase in processing time and the need for larger equipment, and also enabling efficient removal of oxygen from the ultraviolet irradiation area.

[0063] Furthermore, as shown in Figure 3B, the workpiece W is divided into individual chips D. Tape residue S, including processing debris that could not be completely removed by the nozzle unit 80, remains on the surface of the chips D. This tape residue S adheres to the surface of the chips D, including the sides of the dividing grooves Da, by adhesive force. However, it hardens due to ultraviolet light U irradiated from the ultraviolet irradiation unit 100, reducing its adhesive strength. This makes it possible to easily clean the tape residue with the cleaning unit 60.

[0064] Figure 4 is an explanatory diagram of cleaning by the cleaning unit in the processing apparatus according to this embodiment.

[0065] Once the cleaning by the nozzle unit 80 and the UV irradiation by the UV irradiation unit 100 are complete, the transport unit 70 transports the workpiece W from the holding table 10 to the cleaning unit 60.

[0066] The transported workpiece W is held on the spinner table 61 of the washing unit 60. The spinner table 61 is rotated by a rotary drive source, and the workpiece W is washed by supplying washing liquid from the washing liquid supply nozzle 62. The washing unit 60 also dries the workpiece W after washing by supplying gas from a gas supply device to the workpiece W.

[0067] The processing apparatus described in this embodiment is a cutting apparatus that cuts a workpiece W having an adhesive tape T, generating tape scraps S. However, it is not limited to the cutting apparatus described, and includes any processing apparatus. For example, the processing apparatus in this embodiment may be a cutting apparatus that forms a half-cut groove without cutting the adhesive tape T layer, or a laser processing apparatus that processes the workpiece W using a laser. [Industrial applicability]

[0068] As described above, the processing apparatus according to this embodiment can improve cleaning effectiveness while preventing an increase in manufacturing process time and equipment size. It is particularly useful in semiconductor manufacturing fields, including processes that involve cutting wafers. [Explanation of symbols]

[0069] 1: Processing equipment 2: Main unit of the device 3: Pillar part 4: Processing area 5: Loading / unloading area 6: Cover component 7: Bellows member 10: Holding Table 11: Holding surface 12: Clamp section 20: Processing Unit 21: Cutting blade 22: Spindle 23: Spindle Housing 24: Processing fluid supply nozzle 30: Mobile Unit 40: Mobile Unit 50: Mobile Unit 60: Washing Unit 61: Spinner Table 62: Cleaning fluid supply nozzle 70: Conveyor Unit 71: Transport arm 72: Transport pad 80: Nozzle Unit 81: Cleaning fluid supply nozzle 82: Cleaning fluid supply port 83: Nitrogen supply nozzle 84: Nitrogen supply port 100: UV irradiation unit 101: Case 102: UV lamp 103: Opening 110: Cassette 120: Control Unit A: Nitrogen D: Chip Da: Division groove F: Circular frame S: Tape scraps T: Adhesive tape U: Ultraviolet light W: Workpiece WR: Reverse side WS: Surface Wa: Cleaning solution

Claims

1. A holding table that holds the workpiece on the holding surface, A processing unit for processing a workpiece held on the holding surface, A moving unit for moving the holding table, A cleaning fluid supply nozzle is installed so as to intersect the movement path of the holding table by the moving unit, A cleaning unit for cleaning the workpiece, A conveying unit that transports the workpiece from the holding table to the washing unit, A nitrogen supply nozzle is installed so as to intersect the movement path of the holding table and has a nitrogen supply port that supplies nitrogen to the surface of the workpiece held on the holding surface, The system includes an ultraviolet irradiation unit installed adjacent to the nitrogen supply nozzle, which irradiates the area from which oxygen has been removed by nitrogen with ultraviolet light to improve the hydrophilicity of the workpiece and enhance the cleaning effect in the cleaning unit. A processing apparatus characterized in that the cleaning solution supply nozzle, the nitrogen supply nozzle, and the ultraviolet irradiation unit are arranged in that order from the processing unit side.

2. The workpiece is fixed to a tape whose adhesive strength is reduced by ultraviolet light irradiation. The processing unit forms dividing grooves that divide the workpiece into multiple chips, The ultraviolet irradiation unit is, This method is characterized by hardening tape scraps that adhere to the side surface of the chip during the processing. The processing apparatus according to claim 1.

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