Tape distribution device

Abstract

To provide a tape disposing device which executes work for disposing a tape on a wafer and work for flattening the disposed tape.SOLUTION: A tape disposing device 2 includes: a carry-out mechanism 8 which carries out a wafer; a holding table 10 which holds the wafer; tape drawing means 64 by which a tape T is drawn, mounted on a tape mounting table 62 and cut, thereby forming a rectangular tape; release paper cutting means 94 which cuts only release paper; inversion means 96 by which the tape mounting table 62 is inverted and opposed to the wafer; release paper collecting means 118 which collects the cut release paper; tape positioning means by which the tape is received from the inversion means and positioned at a predetermined interval on a surface of the wafer; tape adhering means 138 which adheres the tape; tape cutting means 162 which performs cutting along an outer periphery of the water; a flattening mechanism 204 which flattens the tape; and a wafer carry-out part 12 as carry-in means for carrying the wafer, in which the tape is flattened, into a cassette 4.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a tape dispensing device for dispensing a tape on the surface of a wafer.

Background Art

[0002] A wafer on which a plurality of devices such as ICs and LSIs are partitioned by a dicing line and formed on the surface is ground on the back surface by a grinding device to form a desired thickness, and then diced into individual device chips by a dicing device or a laser processing device.

[0003] The grinding device includes at least a chuck table for holding a wafer, grinding means having a grinding wheel rotatably provided with a grinding stone for grinding the wafer held on the chuck table in an annular shape, and feeding means for feeding the grinding means in a grinding feed, and can finish the wafer to a desired thickness.

[0004] When grinding a wafer with a grinding device, in order to prevent damage to the devices on the surface of the wafer when the front surface side of the wafer is held by the chuck table, a protective tape is adhered to the surface of the wafer.

[0005] However, there are slight irregularities on the surface of the wafer, and the upper surface of the tape becomes irregular following the irregularities, and is no longer a flat surface. Therefore, when the back surface of the wafer is ground while holding the tape side by the chuck table, there is a problem that the back surface of the wafer cannot be uniformly flattened.

[0006] Therefore, the applicant of the present application has proposed a technique of turning and flattening the upper surface of the tape after adhering the tape to the surface of the wafer (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0007]

Patent Document 1

[0008] The tape placement device, which arranges the tape on the surface of the wafer, and the flattening device, which flattens the top surface of the tape, are independent of each other. As a result, the operator must transport the wafer from the tape placement device to the flattening device, and input work must be performed for each device to instruct it to start operating, which leads to poor productivity.

[0009] The object of the present invention is to provide a tape placement apparatus capable of performing the tasks of placing tape on a wafer and flattening the tape placed on the wafer. [Means for solving the problem]

[0010] According to the present invention, the following tape distribution device is provided that solves the above problems. That is, "A tape distribution device for arranging tape on the surface of a wafer, A cassette table on which a cassette containing a wafer is placed, A discharge mechanism for discharging wafers from cassettes placed on the cassette table, A holding table for holding the wafers discharged by the discharge mechanism, A tape dispensing means is provided on the top of the holding table to pull out the tape along with the release paper from a tape roll in which the tape is wound with release paper in between, place it on the tape placement table, and cut the tape together with the release paper into a rectangle to form a rectangular tape. A release paper cutting means for cutting only the release paper of the tape placed on the tape placement table in accordance with the shape of the wafer, A reversing means that inverts the tape placement table to face the wafer placed on the holding table, A release paper collection means for collecting the cut release paper from the tape placed on the inverted tape placement table, A tape positioning means is provided which a pair of tape receiving units are arranged to sandwich the holding table and receive the tape from the reversing means, and the tape is positioned on the surface of the wafer at a predetermined interval, A tape application means that applies tape positioned by the tape positioning means to the surface of a wafer held on the holding table, A tape cutting means comprising a cutter for cutting the tape attached by the tape attachment means along the outer circumference of the wafer, A flattening mechanism that flattens the upper surface of the tape attached to the wafer, A loading means for loading a flattened tape wafer into a cassette placed on the cassette table, A tape distribution device including the tape distribution device is provided.

[0011] Preferably, the tape cutting means includes a support table that supports a wafer to which a rectangular tape held on the holding table is attached, a transfer unit that moves the wafer from the holding table to the support table, and a pair of tape holding units that are arranged to sandwich the support table and hold two opposing sides of the rectangular tape, wherein the diameter of the support table is formed to be smaller than the diameter of the wafer, and as the pair of tape holding units move in a direction away from each other, the waste material cut by the cutter surrounds the support table and falls into storage.

[0012] The planarization mechanism preferably comprises a planarization table and a transport means for transporting a wafer supported on the support table to the planarization table.

[0013] The transport means preferably comprises a first transport unit for transporting wafers supported on the support table, a temporary storage unit for temporarily placing wafers transported by the first transport unit, and a second transport unit for transporting wafers temporarily placed in the temporary storage unit to the flattening table.

[0014] The planarization mechanism may include a turning means that flattens the upper surface of a tape disposed on a wafer held in the planarization table by turning it with a cutting tool.

[0015] The planarization mechanism may include grinding means for grinding and planarizing the upper surface of a tape disposed on a wafer held on the planarization table with a grinding wheel.

[0016] It is convenient to provide planarization table positioning means for positioning the planarization table at a receiving position for receiving a wafer conveyed by the conveying means and a processing position where the turning means is disposed.

[0017] The unloading mechanism may include a wafer unloading section for unloading a wafer from a cassette, a temporary placement table on which the wafer unloaded by the wafer unloading section is temporarily placed and rotated, a detection section for detecting the outer circumference of the wafer temporarily placed and rotated on the temporary placement table to obtain the center of the wafer, and a conveying section for conveying the wafer from the temporary placement table to the holding table.

[0018] It is preferable that at least three pins are disposed in the center of the holding table so as to be able to advance and retreat, and the holding table receives the wafer from the conveying section of the unloading mechanism.

[0019] The tape sticking means preferably includes a decompression chamber and a sticking roller disposed in the decompression chamber for pressing and sticking a tape to the surface of a wafer.

[0020] The loading means for loading a wafer into a cassette placed on the cassette table may be shared by the wafer unloading section for unloading a wafer from the cassette placed on the cassette table.

[0021] The holding table may be provided with holding table moving means for positioning the holding table with respect to the tape pulling-out means and the tape sticking means.

[0022] It is preferable to provide peeling paper recovery means moving means for positioning the peeling paper recovery means at an action position acting on the peeling paper cut from the tape and a retreat position.

[0023] It is convenient to provide a cleaning means for cleaning the wafer after the tape has been flattened by the flattening mechanism.

[0024] The tape may be an adhesive tape having a sheet and an adhesive layer laid on the upper surface of the sheet, and being attached to the surface of the wafer by the adhesive layer.

[0025] The tape may also be a heat-sensitive adhesive sheet that adheres to the wafer surface by heat. [Effects of the Invention]

[0026] The tape placement apparatus of the present invention can perform the tasks of placing tape on a wafer and flattening the tape placed on the wafer, thereby improving productivity. [Brief explanation of the drawing]

[0027] [Figure 1] An overall perspective view of a tape distribution device configured according to the present invention. [Figure 2] Figure 1 shows a perspective view of the cassette table and the unloading mechanism. [Figure 3] Figure 1 shows a perspective view of the discharge mechanism, holding table, and release paper collection means. [Figure 4] Figure 1 shows a perspective view of the holding table, tape dispensing means, release paper cutting means, and tape application means. [Figure 5] Figure 4 is a perspective view of the tape dispensing mechanism shown in Figure 4. [Figure 6] Figure 5 shows an exploded perspective view of the tape clamping section. [Figure 7] Figure 4 shows a perspective view of the release paper cutting means, tape placement table, and reversing means. [Figure 8] Figure 3 is a perspective view of the release paper collection mechanism shown in Figure 3. [Figure 9] Figure 4 is an exploded perspective view of the tape application mechanism shown. [Figure 10] Figure 9 is a schematic diagram showing the adhesive roller housed inside the pressure reduction chamber. [Figure 11]Figure 1 is a perspective view of the holding table, tape cutting means, and conveying means of the flattening mechanism shown in Figure 1. [Figure 12] A perspective view of the flattening mechanism shown in Figure 1. [Figure 13] A perspective view of a grinding means that may be included in a flattening mechanism. [Figure 14] Figure 1 shows a perspective view of the washing means, discharge mechanism, and cassette table. [Figure 15] A schematic diagram showing the state in which the tape is held by the tape pulling mechanism shown in Figure 4. [Figure 16] This schematic diagram shows the state in which the tape placement table has risen and is positioned in a predetermined location, as shown in Figure 15. [Figure 17] This schematic diagram shows the state in which the tape support and tape clamping parts have moved from the state shown in Figure 16 to the state in which the tape has been pulled out. [Figure 18] This schematic diagram shows the state in which the tape support has moved towards the auxiliary roller, as shown in Figure 17. [Figure 19] This schematic diagram shows the state in which the release paper cutting means descends from the state shown in Figure 18, and the tape is being held down by the tape pressing part. [Figure 20] This schematic diagram shows the state in which the release paper cutting means rises and the tape clamping part moves towards the auxiliary roller, starting from the state shown in Figure 19. [Figure 21] This schematic diagram shows the state in which the tape placement table is inverted and lowered to a predetermined position from the state shown in Figure 20, and then the peeling and retrieval means is moved from the retracted position toward the operating position. [Figure 22] This schematic diagram shows the state after the release paper collection means has been moved to the operating position, starting from the state shown in Figure 21. [Figure 23] This schematic diagram shows the state in which the release paper collection means is moved to the retracted position and the holding table is moved directly below the tape placement table, starting from the state shown in Figure 22. [Figure 24] This schematic diagram shows the state shown in Figure 23, where the tape placement table descends, and the tape held on the holding table faces the wafer on the holding table. [Figure 25]This schematic diagram shows the state in which the tape is transferred to the tape positioning means and the reversing table is raised, starting from the state shown in Figure 24. [Figure 26] This schematic diagram shows the state after the holding table has moved from the state shown in Figure 25 to directly below the tape application means. [Figure 27] This schematic diagram shows the state in which the tape application means descends from the state shown in Figure 26 and the tape is applied to the wafer. [Figure 28] A schematic diagram showing the process of flattening a tape attached to a wafer by the turning means of the flattening mechanism shown in Figure 12. [Figure 29] Figure 12 is a perspective view showing the process of transferring a tape-attached wafer from the flattening table to the spinner table shown in Figure 14. [Modes for carrying out the invention]

[0028] Hereinafter, preferred embodiments of a tape distribution device configured according to the present invention will be described with reference to the drawings.

[0029] (Tape distribution device 2) The tape distribution device, shown as a whole by reference numeral 2 in Figure 1, comprises a cassette table 6 on which a cassette 4 containing wafers is placed, an unloading mechanism 8 for unloading wafers from the cassette 4 placed on the cassette table 6, and a holding table 10 (see Figure 3) for holding the wafers unloaded by the unloading mechanism 8.

[0030] (Cassette 4, Cassette Table 6) Referring to Figure 2, the cassette table 6 in the illustrated embodiment includes a first cassette table 6a on which a first cassette 4a is placed, and a second cassette table 6b on which a second cassette 4b is placed. The first cassette 4a contains a plurality of wafers W before tape is laid, and the second cassette 4b contains a plurality of wafers W with tape attached after tape has been laid.

[0031] Figure 2 also shows the wafers W housed in the first and second cassettes 4a and 4b. The surface Wa of the wafer W is divided into multiple rectangular regions by grid-like division lines L. A device D such as an IC or LSI is formed in each of the multiple rectangular regions. Notches N indicating the crystal orientation are formed on the periphery of the wafer W. A tape T is placed on the surface Wa of the wafer W housed in the second cassette 4b.

[0032] (Export mechanism 8) As shown in Figure 2, the unloading mechanism 8 includes a wafer unloading unit 12 that unloads wafers W from the first cassette 4a, a temporary placement table 14 on which the wafers W unloaded by the wafer unloading unit 12 are temporarily placed and rotated, a detection unit 16 that detects the outer circumference of the wafers W that are temporarily placed on the temporary placement table 14 and rotated to determine the center of the wafers W, and a transport unit 18 that transports wafers W from the temporary placement table 14 to the holding table 10 (see Figure 3).

[0033] (Wafer unloading section 12) The wafer unloading section 12 of the unloading mechanism 8 includes an X-axis movable member 20 that is movable in the X-axis direction, an X-axis moving means 22 for moving the X-axis movable member 20 in the X-axis direction, a Z-axis movable member 24 supported by the X-axis movable member 20 so as to be movable in the Z-axis direction, a Z-axis moving means (not shown) for moving the Z-axis movable member 24 in the Z-axis direction, an arm 26 attached to the upper surface of the Z-axis movable member 24, and a hand 28 mounted on the tip of the arm 26 so as to be reversible up and down.

[0034] The X-axis direction is indicated by arrow X in Figure 2, and the Z-axis direction is indicated by arrow Z in Figure 2; both are vertical directions perpendicular to the X-axis direction. The Y-axis direction, indicated by arrow Y in Figure 2, is perpendicular to both the X-axis and Z-axis directions, and the XY plane defined by the X-axis and Y-axis directions is essentially horizontal.

[0035] The X-axis moving means 22 of the wafer unloading unit 12 comprises a ball screw 30 connected to an X-axis movable member 20 and extending in the X-axis direction, and a motor 32 that rotates the ball screw 30. The X-axis moving means 22 converts the rotational motion of the motor 32 into linear motion using the ball screw 30 and transmits it to the X-axis movable member 20, moving the X-axis movable member 20 in the X-axis direction. Although not shown, the Z-axis moving means of the wafer unloading unit 12 may be configured to include a ball screw connected to a Z-axis movable member 24 and extending in the Z-axis direction, and a motor that rotates this ball screw.

[0036] The arm 26 of the wafer unloading unit 12 is operated by an appropriate operating means (not shown), such as a motor. The operation of the arm 26 positions the hand 28 at any position in each of the X, Y, and Z axis directions, and also causes the hand 28 to invert upside down. The hand 28 is provided with a plurality of suction holes 28a, which are connected to suction means (not shown).

[0037] In the wafer unloading section 12, a suction force is generated in the suction hole 28a of the hand 28, and the wafer W contained in the first cassette 4a is held by the hand 28 through suction. At the same time, the X and Z axis movable members 20 and 24 and the arm 26 are moved to unload the wafer W held by the hand 28 from the first cassette 4a.

[0038] (Temporary placement table 14) As shown in Figure 2, the temporary storage table 14 of the unloading mechanism 8 includes a circular top plate 34 for suction holding the wafer W, a support column 36 for supporting the top plate 34, and a motor 38 for rotating the support column 36. A cross-shaped suction groove 34a is provided on the upper surface of the top plate 34, and the suction groove 34a is connected to a suction means (not shown).

[0039] In the temporary storage table 14, a suction force is generated in the suction groove 34a of the top plate 34, and the wafer W discharged by the wafer discharge unit 12 is held in place by suction on the upper surface of the top plate 34, while the wafer W held in place by suction on the top plate 34 is rotated by the motor 38.

[0040] (Detection unit 16) The detection unit 16 of the unloading mechanism 8 is positioned close to the temporary storage table 14. The detection unit 16 includes a light-emitting element 40 and a camera 42, and the light-emitting element 40 and the camera 42 are positioned so as to sandwich the outer circumference of the wafer W, which is held in place by suction on the top plate 34, in the vertical direction. In the illustrated embodiment, the light-emitting element 40 is positioned on the lower side and the camera 42 is positioned on the upper side, but the opposite may also be true, with the camera 42 on the lower side and the light-emitting element 40 on the upper side.

[0041] In the detection unit 16, when the wafer W held on the temporary placement table 14 is rotated, the detection unit 16 illuminates the wafer W with light from the light-emitting element 40 and images the wafer W with the camera 42 to detect the outer edge of the wafer W. Next, the detection unit 16 determines the distance from the center of the top plate 34 of the temporary placement table 14 to the outer edge of the wafer W over the entire circumference of the wafer W. Then, the detection unit 16 determines the center position of the wafer W using the maximum and minimum values ​​of the above distance.

[0042] (Conveying section 18) Referring to Figure 2, the transport section 18 of the discharge mechanism 8 includes a guide member 44 extending in the Y-axis direction, an arm 46 supported by the guide member 44 so as to be movable in the Y-axis direction and the Z-axis direction, a Y-axis movement mechanism (not shown) for moving the arm 46 in the Y-axis direction, and a Z-axis movement mechanism (not shown) for moving the arm 46 in the Z-axis direction.

[0043] A C-shaped retaining piece 48 is attached to the tip of the arm 46 of the transport unit 18. Multiple suction holes 48a are formed on the upper surface of the retaining piece 48, and the suction holes 48a are connected to a suction means (not shown). The Y-axis movement mechanism and Z-axis movement mechanism of the transport unit 18 may be configured to include a ball screw connected to the arm 46 and a motor that rotates this ball screw.

[0044] In the transport unit 18, a suction force is generated in the suction hole 48a of the holding piece 48, and the lower surface of the wafer W temporarily placed on the temporary storage table 14 is held in place by the holding piece 48. The transport unit 18 also transports the wafer W, held in place by the holding piece 48, from the temporary storage table 14 to the holding table 10 (see Figure 3) by moving the arm 46 in the Y and Z axis directions.

[0045] (Holding Table 10) Referring to Figure 3, the holding table 10 is provided at a distance from the temporary storage table 14 in the Y-axis direction. At the center of the holding table 10, at least three pins 52 extending in the vertical direction are arranged to move back and forth (movable in the Z-axis direction), and a means for moving the three pins 52 back and forth (not shown) is provided. The means for moving the three pins 52 back and forth may consist of an appropriate actuator such as an air cylinder. In addition, a plurality of (three in the illustrated embodiment) annular suction grooves 54 are formed on the upper surface of the holding table 10, and the suction grooves 54 are connected to a suction means (not shown).

[0046] In the holding table 10, the tip of the pin 52 is positioned at a receiving position where it protrudes above the upper surface of the holding table 10, and the wafer W transported by the transport section 18 of the unloading mechanism 8 is received by the upper end of the pin 52. In this way, the holding table 10 receives the wafer W with the pin 52 raised to the receiving position, so the transport section 18 of the unloading mechanism 8 can transport the wafer W to the holding table 10 while the lower surface of the wafer W is held in place by the holding piece 48.

[0047] Furthermore, when the holding table 10 receives the wafer W with the pins 52, it lowers the pins 52 to place the wafer W on the upper surface of the holding table 10, and at the same time generates a suction force in the suction groove 54 to hold the wafer W in place by suction on the upper surface of the holding table 10.

[0048] (Holding table moving means 56) In the illustrated embodiment, a holding table moving means 56 is provided for moving the holding table 10. The holding table moving means 56 includes a Y-axis guide member 58 extending in the Y-axis direction, a rectangular container 60 supported by the Y-axis guide member 58 so as to be movable in the Y-axis direction, and a Y-axis moving mechanism 61 for moving the rectangular container 60 in the Y-axis direction.

[0049] As shown in Figure 3, the top of the rectangular container 60 is open, and the upper surface of the holding table 10 is exposed as the holding table 10 is housed in the rectangular container 60. The Y-axis moving mechanism 61 of the holding table moving means 56 may be configured to include a ball screw 61a extending in the Y-axis direction and a drive nut (not shown) that is screwed onto the ball screw 61a and connected to the rectangular container 60.

[0050] In the holding table moving means 56, the rectangular container 60 is moved in the Y-axis direction by the Y-axis moving mechanism 61, thereby positioning the holding table 10 directly below the tape dispensing means 64 (described later) and directly below the tape application means 138 (described later).

[0051] As shown in Figures 1 and 4, the tape dispensing device 2 is located on the upper part of the holding table 10 and includes a tape dispensing means 64 that pulls out the tape T together with the release paper from the tape roll R on which the tape T is wound with the release paper in between, places it on the tape placement table 62, and cuts the tape T together with the release paper into a rectangle to form a rectangular tape.

[0052] (Tape placement table 62) Referring to Figure 4, the rectangular tape placement table 62 is located above the holding table moving means 56, allowing the holding table 10 to move in the Y-axis direction and be positioned directly below the tape placement table 62. A pair of concentrically arranged annular suction grooves 62a and 62b are formed on one side of the tape placement table 62 (see Figures 4 and 7). The suction grooves 62a and 62b are connected to a suction means (not shown).

[0053] (Tape pull-out mechanism 64) As shown in Figure 4, the tape pulling mechanism 64 is positioned above the tape placement table 62. As shown in Figures 4 and 5, the tape pulling mechanism 64 includes a tape support section 66 for supporting the tape T, a tape clamping section 68 for gripping the tape T, and a Y-axis feed section 70 for moving the tape support section 66 and the tape clamping section 68 in the Y-axis direction.

[0054] (Tape support section 66) As shown in Figure 5, the tape support portion 66 of the tape dispensing means 64 has a support plate 72 that supports the tape T pulled out from the tape roll R from below, and a front wall 74 that extends upward from the end of the support plate 72 (the end on the tape roll R side). The front wall 74 has a receiving opening 74a that receives the tape T pulled out from the tape roll R.

[0055] A rectangular cutting cutter 76 for cutting the tape T into a rectangular shape is mounted on the front wall 74 of the tape support section 66. The rectangular cutting cutter 76 has a case 76a supported on the front wall 74 so as to be movable in the X-axis direction, and a cutting blade (not shown) supported on the case 76a so as to be able to move up and down. The cutting blade of the rectangular cutting cutter 76 is positioned by a lifting mechanism (not shown) in a lower cutting position where it can cut the tape T, and an upper retracted position which is retracted upward from the lower cutting position.

[0056] Although not shown in the diagram, the X-axis movement mechanism for moving the case 76a of the rectangular cutting cutter 76 in the X-axis direction, and the lifting mechanism for raising and lowering the cutting blade of the rectangular cutting cutter 76, may each be composed of appropriate actuators such as air cylinders.

[0057] A support roller 78 is provided on one side of the tape support section 66 in the Y-axis direction (the front side in Figure 5) to support the tape roll R on which the tape T is wound, and an auxiliary roller 80 is positioned between the support roller 78 and the tape support section 66 to guide the tape T as it is pulled out from the tape roll R.

[0058] (Tape clamping section 68) As shown in Figures 5 and 6, the tape clamping portion 68 of the tape pulling means 64 includes a frame 82, a clamping plate 84 supported by the frame 82 so as to be vertically movable, and a clamping plate lifting mechanism 86 for raising and lowering the clamping plate 84. The clamping plate 84 is provided with a plurality of suction holes 84a, which are connected to a suction means (not shown). The clamping plate lifting mechanism 86 may consist of, for example, a pair of air cylinders.

[0059] Referring to Figure 6, the description of the tape clamping section 68 continues. The frame 82 of the tape clamping section 68 is supported so as to be movable in the Z-axis direction and rotatable about the X-axis direction, and a pressing roller lifting mechanism 90 is attached to raise and lower the pressing roller 88 (moves in the Z-axis direction). The pressing roller lifting mechanism 90 in the illustrated embodiment consists of a pair of air cylinders.

[0060] (Y-axis feed section 70) As shown in Figure 5, the Y-axis feeding section 70 of the tape pulling means 64 includes a Y-axis guide member 92 extending in the Y-axis direction. The Y-axis guide member 92 supports the tape support section 66 and the tape clamping section 68 so as to be movable in the Y-axis direction. Although not shown, the Y-axis guide member 92 is equipped with a tape support section feeding mechanism for moving the tape support section 66 in the Y-axis direction and a tape clamping section feeding mechanism for moving the tape clamping section 68 in the Y-axis direction.

[0061] The tape support feeding mechanism may have a configuration comprising a ball screw connected to the support plate 72 of the tape support section 66 and extending in the Y-axis direction, and a motor for rotating this ball screw. Similarly, the tape clamping section feeding mechanism may have a configuration comprising a ball screw connected to the frame 82 of the tape clamping section 68 and extending in the Y-axis direction, and a motor for rotating this ball screw.

[0062] In the tape pulling mechanism 64, when the tape support portion 66 and the tape clamping portion 68 are positioned adjacent to each other (as shown in Figure 4), the clamping plate 84 is positioned above the support plate 72, allowing the support plate 72 and the clamping plate 84 to work together to clamp the tape T from above and below. Then, the Y-axis feed portion 70 is activated to pull out the tape T clamped by the support plate 72 and the clamping plate 84, place it on the tape placement table 62, and then the rectangular cutting cutter 76 cuts the tape T into a rectangle to form a rectangular tape. The operation of the tape pulling mechanism 64 will be described in detail later with reference to the drawings.

[0063] (Tape T) Figure 5 also shows a cross-sectional view of the tape T being pulled out from the tape roll R by the tape pulling means 64. The tape T in the illustrated embodiment has a sheet S and an adhesive layer A laid on the upper surface of the sheet S, and is an adhesive tape that can be attached to the surface of the wafer W via the adhesive layer A. The adhesive layer A is fitted with release paper P, and when the tape is pulled out from the tape roll R by the tape pulling means 64, the sheet S is positioned on the bottom and the release paper P is positioned on the top.

[0064] The tape T may be a heat-adhesive sheet that can be attached to the surface of the wafer W by heat. The heat-adhesive sheet is made of a thermoplastic synthetic resin (for example, a polyolefin resin) and, when heated to a temperature near its melting point, softens or melts and exhibits adhesive properties, and does not have an adhesive layer. However, it is preferable that the adhesive surface of the heat-adhesive sheet (the surface that is attached to the wafer W) is provided with a release paper P to prevent foreign matter from adhering to the adhesive surface.

[0065] As shown in Figure 4, the tape placement device 2 further includes a release paper cutting means 94 that cuts only the release paper P of the tape T placed on the tape placement table 62 in accordance with the shape of the wafer W, and a reversing means 96 that inverts the tape placement table 62 so that it faces the wafer W placed on the holding table 10.

[0066] (Release paper cutting means 94) Referring to Figure 7, the release paper cutting means 94 includes a first Z-axis guide member 98 extending in the Z-axis direction, a first Z-axis movable member 100 supported by the first Z-axis guide member 98 so as to be movable in the Z-axis direction, and a first Z-axis moving mechanism (not shown) for moving the first Z-axis movable member 100 in the Z-axis direction. The first Z-axis moving mechanism may have a configuration comprising a ball screw connected to the first Z-axis movable member 100 and extending in the Z-axis direction, and a motor for rotating this ball screw.

[0067] A rectangular top plate 102 is connected to the first Z-axis movable member 100 of the release paper cutting means 94. The top plate 102 is positioned directly above the tape placement table 62. Four tape presser parts 104 extending downward are attached to the four corners of the underside of the top plate 102.

[0068] The release paper cutting means 94 further includes a second Z-axis guide member 106 attached to the upper surface of the top plate 102, a second Z-axis movable member 108 supported by the second Z-axis guide member 106 so as to be movable in the Z-axis direction, and a second Z-axis moving mechanism (not shown) for moving the second Z-axis movable member 108 in the Z-axis direction. The second Z-axis moving mechanism may consist of, for example, an air cylinder.

[0069] A motor 110 is connected to the second Z-axis movable member 108 of the release paper cutting means 94. The rotation shaft 110a of the motor 110 extends downward through a through hole 102a in the top plate 102, and an L-shaped support piece 112 is fixed to the lower end of the rotation shaft 110a. A circular rotary cutter 114 is mounted on the support piece 112 so as to be rotatable about an axis perpendicular to the Z-axis direction. The radial position of the rotary cutter 114 is between the suction grooves 62a and 62b of the tape placement table 62.

[0070] In the release paper cutting means 94, after the tape T is placed on the tape placement table 62 by the tape pulling means 64, the first Z-axis movable member 100 is lowered, and the tape pressing part 104 presses down on the tape T on the tape placement table 62.

[0071] Next, the release paper cutting means 94 lowers the second Z-axis movable member 108, causing the circular rotary cutter 114 to bite into the release paper P of the tape T. At this time, the rotary cutter 114 is positioned between the suction grooves 62a and 62b of the tape placement table 62. The Z-axis position of the rotary cutter 114 is also adjusted to completely cut only the release paper P of the tape T and not the sheet S of the tape T. Then, by rotating the rotary cutter 114 with the motor 110, only the release paper P of the tape T placed on the tape placement table 62 is cut in a circular shape corresponding to the shape of the wafer W.

[0072] (Reversal means 96) As shown in Figure 7, the reversing means 96 has a reversing motor 116 connected to the tape mounting table 62. The reversing motor 116 reverses the tape mounting table 62 by 180 degrees with the Y-axis as its axis, so that the rectangular tape held by attraction on the tape mounting table 62 faces the wafer W placed on the holding table 10.

[0073] Furthermore, the reversing motor 116 of the reversing means 96 in the illustrated embodiment is supported by the first Z-axis guide member 98 so as to be movable in the Z-axis direction, and is moved in the Z-axis direction by a Z-axis moving mechanism (not shown) attached to the first Z-axis guide member 98. The Z-axis moving mechanism may have a configuration comprising a ball screw connected to the reversing motor 116 and extending in the Z-axis direction, and a motor that rotates this ball screw.

[0074] As shown in Figures 3 and 4, the tape placement device 2 includes a release paper collection means 118 (see Figure 3) for collecting release paper P cut from rectangular tapes placed on an inverted tape placement table 62, and a tape positioning means 120 (see Figures 3 and 4) which is arranged to sandwich the holding table 10 and includes a pair of tape receiving units 120a that receive rectangular tapes from the inversion means 96, and positions the rectangular tapes on the surface of the wafer W at predetermined intervals.

[0075] (Release paper collection means 118) Referring to Figure 8, the release paper collection means 118 comprises a base 122 supported by the Y-axis guide member 58 so as to be movable in the Y-axis direction, and a pair of support walls 124 extending upward from the upper surface of the base 122 at intervals in the X-axis direction.

[0076] A pair of support walls 124 of the release paper collection means 118 are rotatably mounted on them: a lifting roller 126 that supports the release tape Tp pulled out from the release tape roll Tpr before use, and a winding roller 128 that winds up the used release tape Tp.

[0077] (Lifting roller 126) The lifting roller 126 of the release paper collection means 118 is supported by a pair of support walls 124 via a pair of oscillating pieces 130. Specifically, one end of the oscillating piece 130 is rotatably connected to the support wall 124, and the lifting roller 126 is rotatably attached to the other end of the oscillating piece 130. In addition, an oscillating means 132 (for example, an air cylinder) that oscillates the oscillating piece 130 is connected to the middle part of the oscillating piece 130.

[0078] (Winding roller 128) The winding roller 128 of the release paper collection means 118 is positioned below the lifting roller 126. The winding roller 128 is rotated by a winding motor (not shown) to pull the release tape Tp from the release tape roll Tpr before use and to wind up the used release tape Tp. A pair of guide rollers 134 that guide the release tape Tp are rotatably provided between the winding roller 128 and the lifting roller 126.

[0079] Below one side of the lifting roller 126 of the release paper collection means 118 in the Y-axis direction (the front side in Figure 8), there is a support roller 136 that supports the release tape roll Tpr on which the release tape Tp is wound before use. The release tape Tp may be an adhesive tape, and when the release tape Tp is pulled out, it is supported by the lifting roller 126 with the adhesive side facing upwards.

[0080] Then, after the tape placement table 62 inverts and descends to a predetermined position, when the swinging mechanism 132 is activated, the swinging piece 130 swings with one end of the swinging piece 130 (the end connected to the support wall 124) as the pivot point, and the lifting roller 126 rises from the lower standby position to the upper peeling position where the release paper P positioned at the predetermined position can be peeled off.

[0081] As a result, the adhesive surface of the release tape Tp adheres to the release paper P. In this state, by rotating the winding roller 128 and moving the release paper collection means 118 in the Y-axis direction in synchronization with the rotation of the winding roller 128, the cut release paper P can be peeled off from the tape T placed on the inverted tape placement table 62 using the release tape Tp. The peeled release paper P is then wound onto the winding roller 128 together with the used release tape Tp.

[0082] (Release paper collection means, transport means) The release paper collection means 118 in the illustrated embodiment is movable in the Y-axis direction by a release paper collection means moving means (not shown), and can be positioned in an operating position (directly below the tape mounting table 62) that acts on the release paper P cut from the rectangular tape, and in a retracted position away from directly below the tape mounting table 62. The release paper collection means moving means may be configured to include a drive nut (not shown) that is screwed onto a ball screw 61a of the holding table moving means 56 and connected to the base 122 of the release paper collection means 118. Thus, the ball screw 61a can be shared between the holding table moving means 56 and the release paper collection means moving means.

[0083] (Tape positioning means 120) As shown in Figures 3 and 4, the tape positioning means 120 is arranged to sandwich the holding table 10 and includes a pair of tape receiving parts 120a that receive the rectangular tape from the reversing means 96. The pair of tape receiving parts 120a have a bottom plate 120b extending in the X-axis direction and a vertical plate 120c rotatably connected to the bottom plate 120b, and have an L-shaped cross-sectional shape that traverses the X-axis direction.

[0084] The rectangular container 60, which houses the holding table 10, is equipped with a motor (not shown) that rotates the vertical plate 120c by 90 degrees around an axis extending in the X-axis direction. The pair of tape receiving sections 120a are positioned by the motor in a receiving position (shown in Figures 3 and 4) where the rectangular tape from which the release paper P has been peeled off is received from the tape placement table 62, and in a clamping position where the vertical plates 120c of the pair of tape receiving sections 120a are tilted substantially horizontally.

[0085] As shown in Figure 4, the tape placement device 2 includes a tape attachment means 138 that faces the surface of the wafer W held on the holding table 10 and attaches the rectangular tape positioned by the tape positioning means 120.

[0086] (Tape application means 138) The tape application means 138 is located above the holding table moving means 56, and the holding table 10 can move in the Y-axis direction to be positioned directly below the tape application means 138.

[0087] Referring to Figure 9, the tape application means 138 includes a vacuum chamber 140 and an application roller 142 disposed within the vacuum chamber 140 for pressing and applying a rectangular tape to the surface of the wafer W.

[0088] (Depressurized chamber 140) The decompression chamber 140 of the tape application means 138 has a rectangular top plate 144 and side walls 146 that hang down from the periphery of the top plate 144, and the lower end of the decompression chamber 140 is open. A decompression means 148 for reducing the pressure inside the decompression chamber 140 is mounted on the upper surface of the top plate 144.

[0089] In the illustrated embodiment, the decompression chamber 140 is supported by a Z-axis guide member 150 extending in the Z-axis direction so as to be movable in the Z-axis direction, and is moved in the Z-axis direction by a Z-axis movement mechanism (not shown) attached to the Z-axis guide member 150. The Z-axis movement mechanism may have a configuration comprising a ball screw connected to the side wall 146 of the decompression chamber 140 and extending in the Z-axis direction, and a motor that rotates this ball screw.

[0090] As shown in Figures 9 and 10, the tape application means 138 comprises a fixing piece 152 fixed inside the pressure reduction chamber 140, a lifting piece 154 connected to the fixing piece 152 so as to be able to move up and down, and a lifting mechanism (not shown) for raising and lowering the lifting piece 154. The lifting mechanism may be composed of an appropriate actuator such as an air cylinder.

[0091] (Adhesive roller 142) A support plate 156 is attached to the lower surface of the lifting piece 154 of the tape application means 138, and the adhesive roller 142 is rotatably supported on the lower surface of the support plate 156 via a bracket 158. The support plate 156 is also provided with an adhesive roller moving mechanism (not shown) that moves the adhesive roller 142 in the Y-axis direction together with the bracket 158. The adhesive roller moving mechanism may consist of a ball screw connected to the bracket 158 ​​and extending in the Y-axis direction, and a motor that rotates this ball screw.

[0092] In the tape application means 138, the rectangular tape is positioned above the wafer W held on the holding table 10 by the tape positioning means 120, and after the holding table 10 is positioned directly below the tape application means 138, the decompression chamber 140 is lowered, and the lower end of the side wall 146 of the decompression chamber 140 is brought into close contact with the upper end of the rectangular container 60.

[0093] Next, the tape application means 138 activates the depressurization means 148 to reduce the pressure inside the depressurization chamber 140. Then, the lifting mechanism lowers the application roller 142, pressing the application surface of the rectangular tape against the wafer W. Then, the application roller moving mechanism moves the application roller 142 along the bracket 158 ​​in the Y-axis direction along a pair of guide rails 160 attached to the lower surface of the support plate 156. As a result, the rectangular tape is applied to the wafer W.

[0094] Furthermore, if the rectangular tape is a heat-sealable sheet, the adhesive roller 142 can be heated to a predetermined temperature using a heating means (not shown), and then the adhesive roller 142 can be rolled over the rectangular tape to heat-seal it to the wafer W.

[0095] As shown in Figures 1 and 11, the tape placement device 2 includes a tape cutting means 162 equipped with a cutter that cuts the rectangular tape attached by the tape attachment means 138 along the outer circumference of the wafer W.

[0096] (Tape cutting means 162) Referring to Figure 11, the tape cutting means 162 includes a support table 164 that supports a wafer W to which a rectangular tape held on the holding table 10 is attached, a transfer unit 166 that moves the wafer W from the holding table 10 to the support table 164, and a pair of tape holding units 168 that are arranged to sandwich the support table 164 and hold two opposing sides of the rectangular tape.

[0097] (Support table 164) The support table 164 of the tape cutting means 162 is positioned at a distance from the holding table 10 in the Y-axis direction. The support table 164 includes a cylindrical support column 172 fixed to the substrate 170 and a circular top plate 174 mounted on the upper end of the support column 172. The diameter of the top plate 174 is larger than the diameter of the support column 172, but slightly smaller than the diameter of the wafer W.

[0098] The upper surface of the top plate 174 of the support table 164 has a cross-shaped suction groove 174a and a pair of concentrically arranged annular suction grooves 174b. The suction grooves 174a and 174b are connected to a suction means (not shown). In the support table 164, the suction means generates a suction force in the suction grooves 174a and 174b, and holds the wafer W placed on the upper surface of the top plate 174 by suction.

[0099] (Relocation section 166) The relocation section 166 of the tape cutting means 162 includes a Y-axis guide member 176 extending in the Y-axis direction, a Y-axis movable member 178 supported by the Y-axis guide member 176 so as to be movable in the Y-axis direction, a Y-axis movement mechanism (not shown) for moving the Y-axis movable member 178 in the Y-axis direction, a Z-axis movable member 180 supported by the Y-axis movable member 178 so as to be movable in the Z-axis direction, and a Z-axis movement mechanism (not shown) for moving the Z-axis movable member 180 in the Z-axis direction.

[0100] The Y-axis movement mechanism of the relocation unit 166 may be configured to include a ball screw connected to the Y-axis movable member 178 and extending in the Y-axis direction, and a motor for rotating this ball screw. The Z-axis movement mechanism of the relocation unit 166 may be configured to include a ball screw connected to the Z-axis movable member 180 and extending in the Z-axis direction, and a motor for rotating this ball screw.

[0101] A disc 182 is attached to the tip of the Z-axis movable member 180 of the relocation section 166, and multiple arms 184 (four in the illustrated embodiment) are mounted on the periphery of the disc 182, projecting radially outward. A suction pad 186 is attached to the lower surface of the tip of each arm 184, and the suction pad 186 is connected to a suction means (not shown).

[0102] The relocation unit 166 generates suction force on the suction pad 186 using a suction means, and suction-holds the rectangular tape attached to the wafer W by the tape attachment means 138, while also moving the Y and Z axis movable members 178 and 180 to move the rectangular tape attached to the wafer W from the holding table 10 to the support table 164.

[0103] (Tape holding section 168) The pair of tape holding parts 168 of the tape cutting means 162 are mounted on the upper surface of the substrate 170 at intervals in the Y-axis direction. Each tape holding part 168 has a pair of support columns 188 mounted on the substrate 170 at intervals in the X-axis direction and movable in the Y-axis direction, a Y-axis movement mechanism (not shown) for moving the pair of support columns 188 in the Y-axis direction, and a beam 190 spanning between the upper ends of the pair of support columns 188.

[0104] The Y-axis movement mechanism of the tape holding section 168 can be composed of an appropriate actuator, such as an air cylinder. The pair of tape holding sections 168 are positioned in an inner holding position where the beams 190 are close to each other in the Y-axis direction, and in an outer dropping position where the beams 190 are further apart in the Y-axis direction than in the inner holding position, by moving the support column 188 with the Y-axis movement mechanism.

[0105] Multiple suction holes 190a are formed on the upper surface of the beam 190 of the tape holding section 168 at intervals in the X-axis direction, and the suction holes 190a are connected to a suction means (not shown). In the tape holding section 168, at the inner holding position, the suction means generates a suction force in the suction holes 190a, and holds two opposing sides of the rectangular tape (rectangular tape attached to the wafer W) placed on the upper surface of each beam 190 by suction.

[0106] (cutting section 192) The tape cutting means 162 further includes a cutting section 192 that cuts the rectangular tape attached by the tape attachment means 138 along the outer circumference of the wafer W. The cutting section 192 includes a Z-axis guide member 194 extending in the Z-axis direction, a Z-axis movable member 196 supported by the Z-axis guide member 194 so as to be movable in the Z-axis direction, and a Z-axis moving mechanism (not shown) for moving the Z-axis movable member 196 in the Z-axis direction.

[0107] A cutter motor 198 is connected to the Z-axis movable member 196 of the cutting section 192, and a support piece 200 is fixed to the rotating shaft 198a of the cutter motor 198. A cutter 202 extending downward is mounted on the lower surface of the tip of the support piece 200.

[0108] In the cutting section 192, when the wafer W is held by suction to the support table 164 and the rectangular tape is held by suction to a pair of tape holding sections 168, the Z-axis movable member 196 is lowered, causing the cutting edge of the cutter 202 to cut into the rectangular tape outside the wafer W. Then, the cutter motor 198 causes the cutter 202 to rotate along the outer circumference of the wafer W, thereby cutting the rectangular tape attached to the wafer W by the tape attachment means 138 in a circular shape along the outer circumference of the wafer W.

[0109] Furthermore, after the rectangular tape is cut along the outer circumference of the wafer W, the suction force of the suction hole 190a of the beam 190 is released, and the pair of tape holding parts 168 move in a direction away from each other to the outer drop position. At this point, the waste material of the rectangular tape that is not attached to the wafer W (the rectangular tape with a circular opening formed on it) falls with the circular opening surrounding the support table 164 and is stored on the substrate 170. Since the release paper P remains on the waste material of the rectangular tape, the waste material has stiffness, and it falls onto the substrate 170 while maintaining its original shape (rectangular).

[0110] (Flattening mechanism 204) As shown in Figures 1 and 11, the tape distribution device 2 further includes a flattening mechanism 204 for flattening the upper surface of the circular tape T attached to the wafer W. The flattening mechanism 204 in the illustrated embodiment comprises a flattening table 206 and a transport means 208 for transporting the wafer W, which is supported by the support table 164 of the tape cutting means 162, to the flattening table 206.

[0111] (Flattening Table 206) The flattening table 206 of the flattening mechanism 204 is fixed to the upper surface of the base 210. A porous, circular suction chuck 212 connected to a suction means (not shown) is positioned at the upper end of the flattening table 206. The flattening table 206 generates a suction force on the upper surface of the suction chuck 212 using the suction means, and holds the wafer W (tape-attached wafer W) placed on the upper surface of the suction chuck 212 by suction.

[0112] (Conveying means 208) In the illustrated embodiment, as shown in Figure 11, the transport means 208 of the flattening mechanism 204 includes a first transport unit 214 for transporting wafers W supported on a support table 164, a temporary storage unit 216 for temporarily placing wafers W transported by the first transport unit 214, and a second transport unit 218 for transporting wafers W temporarily placed in the temporary storage unit 216 to the flattening table 206.

[0113] (First transport section 214) Referring to Figures 11 and 12, the first transport section 214 of the transport means 208 includes a support base 220, a lifting shaft 222 supported on the support base 220 so as to be able to move up and down, a lifting mechanism (not shown) for raising and lowering the lifting shaft 222, a swivel arm 224 supported on the lifting shaft 222 so as to be able to rotate about the Z-axis direction as its axis, and a swivel motor (not shown) for swiveling the swivel arm 224. The lifting mechanism of the first transport section 214 may be composed of an appropriate actuator such as an air cylinder.

[0114] A holding pad 226 is attached to the lower surface of the tip of the swivel arm 224 of the first transport unit 214. Multiple suction holes (not shown) are formed on the lower surface of the holding pad 226, and these suction holes are connected to a suction means (not shown).

[0115] In the first transport unit 214, a suction force is generated on the lower surface of the holding pad 226 by a suction means, and the upper surface of the wafer W supported on the support table 164 is held in place by the holding pad 226. The first transport unit 214 also moves the lifting shaft 222 up and down and rotates the swivel arm 224 to transport the wafer W held in place by the holding pad 226 from the support table 164 to the temporary storage unit 216.

[0116] (Temporary placement section 216) The temporary storage section 216 of the transport means 208 is supported at the upper end of a support column 228 extending in the Z-axis direction. A pair of concentrically arranged annular grooves 216a are formed on the upper surface of the temporary storage section 216, and the annular grooves 216a are connected to a suction means (not shown). In the temporary storage section 216, the suction means generates a suction force in the annular grooves 216a, and the wafer W placed on the upper surface of the temporary storage section 216 is held in place by suction.

[0117] (Second transport section 218) The second transport section 218 of the transport means 208 includes a Y-axis guide member 230 extending in the Y-axis direction, a Y-axis movable member 232 supported by the Y-axis guide member 230 so as to be movable in the Y-axis direction, a Y-axis movement mechanism (not shown) for moving the Y-axis movable member 232 in the Y-axis direction, a Z-axis movable member 234 supported by the Y-axis movable member 232 so as to be movable in the Z-axis direction, and a Z-axis movement mechanism (not shown) for moving the Z-axis movable member 234 in the Z-axis direction.

[0118] The Y-axis movement mechanism of the second transport unit 218 may be configured to include a ball screw connected to a Y-axis movable member 232 and extending in the Y-axis direction, and a motor for rotating this ball screw. The Z-axis movement mechanism of the second transport unit 218 may be configured to include a ball screw connected to a Z-axis movable member 234 and extending in the Z-axis direction, and a motor for rotating this ball screw.

[0119] A retaining pad 236 is attached to the lower end of the Z-axis movable member 234 of the second transport section 218. Multiple suction holes (not shown) are formed on the lower surface of the retaining pad 236, and these suction holes are connected to a suction means (not shown).

[0120] In the second transport unit 218, a suction force is generated on the lower surface of the holding pad 236 by a suction means, and the upper surface of the wafer W held in the temporary storage unit 216 is held in place by the holding pad 236. The second transport unit 218 also transports the wafer W, held in place by the holding pad 236, from the temporary storage unit 216 to the flattening table 206 by moving the Y and Z axis movable members 232 and 234.

[0121] As shown in Figure 12, the planarization mechanism 204 further includes a turning means 238 that flattens the upper surface of a tape T disposed on a wafer W held on a planarization table 206 by turning it with a cutting tool, and a planarization table positioning means 240 that positions the planarization table 206 at a receiving position for receiving the wafer W transported by the transport means 208 and at a processing position where the turning means 238 is located.

[0122] (Turning means 238) The turning means 238 of the flattening mechanism 204 includes a Z-axis guide member 242 extending in the Z-axis direction, a Z-axis movable member 244 supported by the Z-axis guide member 242 so as to be movable in the Z-axis direction, and a Z-axis moving mechanism (not shown) for moving the Z-axis movable member 244 in the Z-axis direction. The Z-axis moving mechanism may be configured to include a ball screw connected to the Z-axis movable member 244 and extending in the Z-axis direction, and a motor for rotating the ball screw.

[0123] A motor 246 is mounted on the Z-axis movable member 244 of the turning mechanism 238. A spindle 248 extending downwards is connected to the motor 246, and a disc-shaped mount 250 is fixed to the lower end of the spindle 248. A cutting tool 252 is attached to the outer peripheral edge of the lower surface of the mount 250.

[0124] (Flattening table positioning means 240) The flattening table positioning means 240 of the flattening mechanism 204 includes a base 254 extending in the Y-axis direction, a pair of guide rails 256 provided on the upper surface of the base 254, and a Y-axis moving mechanism (not shown) that moves the base 210 supporting the flattening table 206 along the pair of guide rails 256 in the Y-axis direction.

[0125] A pair of guide rails 256 extend in the Y-axis direction with a gap in the X-axis direction. The Y-axis movement mechanism may consist of a ball screw connected to the base 210 and extending in the Y-axis direction, and a motor that rotates this ball screw.

[0126] In the flattening table positioning means 240, the base 210 is moved in the Y-axis direction by the Y-axis movement mechanism to position the flattening table 206 at least at a receiving position (the position shown in Figure 12) where the wafer W conveyed by the conveying means 208 can be received, and at a processing position (the position below the cutting tool 252) where the turning means 238 is located.

[0127] When the flattening table positioning means 240 positions the flattening table 206 to the machining position, the turning means 238 activates the motor 246 to rotate the cutting tool 252 together with the spindle 248. Next, the Z-axis movable member 244 is lowered to position the cutting tool 252 at a predetermined turning height.

[0128] Then, the planarization table positioning means 240 moves the planarization table 206 in the Y-axis direction, thereby moving the wafer W toward the rotating cutting tool 252. This allows the upper surface of the tape T attached to the wafer W held by the planarization table 206 to be turned and flattened by the cutting tool 252.

[0129] Furthermore, when turning tape T with tool bit 252, it is preferable to supply water to the turning area because this allows for better removal of turning chips and cools the turning area, thereby improving turning accuracy. Alternatively, water may be supplied only to tool bit 252. Or, dry turning may be performed without supplying water.

[0130] The flattening mechanism 204 in the illustrated embodiment includes a turning means 238 that flattens the upper surface of the tape T by turning it with a cutting tool 252, but it may also include a grinding means 258 (see Figure 13) that flattens the upper surface of the tape T disposed on the wafer W held in the flattening table 206 by grinding it with a grinding wheel.

[0131] The grinding means 258 may have the same configuration as the turning means 238, except that a grinding wheel 262 having a plurality of grinding wheels 260 arranged in a ring at intervals in the circumferential direction is fixed to the lower surface of the mount 250.

[0132] In the grinding means 258, once the flattening table 206 is positioned at the processing position (below the grinding wheel 260) by the flattening table positioning means 240, the grinding wheel 260 is rotated together with the spindle 248. Next, while moving the flattening table 206 in the Y-axis direction, the Z-axis movable member 244 is lowered to position the grinding wheel 260 at a predetermined grinding height.

[0133] Then, the wafer W is moved toward the rotating grinding wheel 260, and water is supplied to the grinding area. This allows the upper surface of the tape T, which is placed on the wafer W held by the flattening table 206, to be flattened by grinding with the grinding wheel 260. Alternatively, while rotating the flattening table 206, the grinding wheel 260 may be positioned so that it passes through the center of rotation of the tape T, and the Z-axis movable member 244 may be lowered to grind the tape T.

[0134] (Cleaning method 264) As shown in Figures 1 and 14, the tape placement device 2 of the illustrated embodiment includes a cleaning means 264 for cleaning the wafer W on which the tape T has been flattened by the flattening mechanism 204.

[0135] Referring to Figure 14, the cleaning means 264 includes a spinner table 266 on which the tape T holds the flattened wafer W, a fluid injection means 268 fixed by an appropriate bracket for injecting fluid onto the wafer W held on the spinner table 266, and a transfer means 270 for transferring the wafer W from the flattening table 206 to the spinner table 266.

[0136] (Spinner Table 266) The spinner table 266 of the cleaning means 264 is housed in a housing 272 that is positioned in conjunction with the end of the base 254 of the flattening table positioning means 240. The spinner table 266 is rotated about the Z-axis by a motor (not shown).

[0137] A porous, circular suction chuck 274 connected to a suction means (not shown) is positioned at the upper end of the spinner table 266. The spinner table 266 generates a suction force on the upper surface of the suction chuck 274 using the suction means, and holds the wafer W placed on the upper surface of the suction chuck 274 by suction.

[0138] (Fluid injection means 268) The fluid injection means 268 of the cleaning means 264 includes a nozzle 276 positioned above the spinner table 266 and a rocking motor 278 that rocks the nozzle 276 with the Z-axis as its axis. The nozzle 276 is connected to a cleaning fluid supply means (not shown) and a compressed air supply means (not shown).

[0139] Then, in the fluid injection means 268, the nozzle 276 is oscillated by the oscillating motor 278, and cleaning fluid is supplied to the nozzle 276 from the cleaning fluid supply means, and the cleaning fluid is sprayed from the nozzle 276 toward the wafer W which is held by suction on the spinner table 266. This allows the wafer W to be cleaned.

[0140] After spraying cleaning solution onto the wafer W, the fluid injection means 268 supplies compressed air from the compressed air supply means to the nozzle 276 and sprays the compressed air from the nozzle 276 towards the wafer W which is held by suction on the spinner table 266. This removes the cleaning solution from the wafer W and dries the wafer W.

[0141] (Transfer means 270) The transfer means 270 of the cleaning means 264 includes a Y-axis guide member 280 extending in the Y-axis direction, a Y-axis movable member 282 supported by the Y-axis guide member 280 so as to be movable in the Y-axis direction, a Y-axis moving mechanism (not shown) for moving the Y-axis movable member 282 in the Y-axis direction, a Z-axis movable member 284 supported by the Y-axis movable member 282 so as to be movable in the Z-axis direction, and a Z-axis moving mechanism (not shown) for moving the Z-axis movable member 284 in the Z-axis direction.

[0142] The Y-axis movement mechanism of the transfer means 270 may be configured to include a ball screw connected to the Y-axis movable member 282 and extending in the Y-axis direction, and a motor that rotates this ball screw. The Z-axis movement mechanism of the transfer means 270 may be configured to include a ball screw connected to the Z-axis movable member 284 and extending in the Z-axis direction, and a motor that rotates this ball screw.

[0143] A retaining pad 286 is attached to the lower end of the Z-axis movable member 284 of the transfer means 270. Multiple suction holes (not shown) are formed on the lower surface of the retaining pad 286, and these suction holes are connected to a suction means (not shown).

[0144] In the transfer means 270, a suction force is generated on the lower surface of the holding pad 286 by the suction means, and the upper surface of the wafer W held on the flattening table 206 is held in place by the holding pad 286. The transfer means 270 also moves the Y and Z axis movable members 282 and 284 to transfer the wafer W, which is held in place by the holding pad 286, from the flattening table 206 to the spinner table 266.

[0145] (Means of delivery) The tape distribution device 2 includes a loading means for loading the wafer W, on which the tape T has been flattened, into the second cassette 4b, which is placed on the second cassette table 6b. Referring to Figure 14, in the illustrated embodiment, the loading means for loading the wafer W into the second cassette 4b placed on the second cassette table 6b is also used by the wafer unloading unit 12 for unloading the wafer W from the first cassette 4a placed on the first cassette table 6a.

[0146] The wafer unloading unit 12, acting as a loading mechanism, generates suction force in the suction hole 28a of the hand 28 to hold the wafer W, which is held on the spinner table 266, with the hand 28. The wafer unloading unit 12, acting as a loading mechanism, also moves the X and Z axis movable members 20 and 24 and the arm 26 to load the wafer W, which is held by the hand 28, from the spinner table 266 into the second cassette 4b.

[0147] (Tape placement method / Tape flattening method) Next, a method for laying tape T on the surface of wafer W using the tape placement device 2 described above, and for flattening the tape T laid on wafer W, will be explained.

[0148] (Cassette placement process) In the illustrated embodiment, first, a cassette placement step is performed in which a first cassette 4a containing the wafer W is placed on a first cassette table 6a, and an empty second cassette 4b for containing the wafer W on which the tape T is laid is placed on a second cassette table 6b. At this time, the wafer W is placed in the first cassette 4a with its surface Wa facing upwards, before the tape is laid on it.

[0149] (Export process) After the cassette placement process is carried out, an unloading process is performed to unload the wafer W from the first cassette 4a placed on the first cassette table 6a.

[0150] Referring to Figure 2, in the unloading process, first, the hand 28 of the wafer unloading section 12 of the unloading mechanism 8 is moved to position the hand 28 on the bottom surface (back surface) of the wafer W housed in the first cassette 4a. Next, suction force is generated in the suction hole 28a of the hand 28, and the wafer W is held in place by the hand 28. Then, the hand 28 is moved to unload the wafer W, which is held in place by the hand 28, from the first cassette 4a.

[0151] After the wafer W is unloaded, the hand 28 is moved toward the temporary storage table 14 of the unloading mechanism 8, and the underside (back) of the wafer W is brought into contact with the upper surface of the top plate 34 of the temporary storage table 14. Next, a suction force is generated in the suction groove 34a of the top plate 34, and the wafer W is held in place by the top plate 34, while the suction force of the hand 28 is released. In this way, the wafer W is transferred from the hand 28 of the wafer unloading unit 12 to the temporary storage table 14.

[0152] Next, the wafer W is rotated together with the top plate 34 by the motor 38. Then, while illuminating the wafer W with light from the light-emitting element 40 of the detection unit 16, the wafer W is imaged by the camera 42 and the outer circumference of the wafer W is detected. Next, based on the detected outer circumference of the wafer W, the distance from the center of the top plate 34 to the outer circumference of the wafer W is determined over the entire circumference of the wafer W. Then, the center position of the wafer W is determined using the maximum and minimum values ​​of the above distance.

[0153] Once the center position of the wafer W is determined, the retaining piece 48 of the transport section 18 of the unloading mechanism 8 is moved so that the upper surface of the retaining piece 48 comes into contact with the lower surface (back surface) of the wafer W which is being held by suction on the temporary storage table 14. Next, a suction force is generated in the suction hole 48a of the retaining piece 48, and the wafer W is held by the retaining piece 48 by suction, while the suction force of the temporary storage table 14 is released. Then, the retaining piece 48 is moved toward the holding table 10.

[0154] (holding process) After the unloading process is performed, a holding process is carried out in which the wafer W unloaded by the unloading mechanism 8 is held by the holding table 10.

[0155] Referring to Figure 3, in the holding process, first, the holding table 10 is moved by the holding table moving means 56 to position the holding table 10 in a location where it can receive the wafer W from the holding piece 48 of the transport unit 18. Also, the pins 52 of the holding table 10 are raised and positioned in the receiving position (the position shown in Figure 3).

[0156] Once the wafer W, which has been transported by the transport section 18 of the unloading mechanism 8, is received by the pin 52 of the holding table 10, the pin 52 is lowered and the wafer W is placed on the upper surface of the holding table 10. Then, a suction force is generated in the suction groove 54 of the holding table 10, and the wafer W is held in place by suction on the upper surface of the holding table 10.

[0157] (Tape extraction process) After the holding process is performed, the tape T is pulled out from the tape roll R, which is wound with the release paper P in between, along with the release paper P, and placed on the tape placement table 62. The tape T is then cut into a rectangle along with the release paper P to form a rectangular tape.

[0158] In the tape dispensing process, first, as shown in Figure 5, the tape support portion 66 of the tape dispensing means 64 is positioned on the tape roll R side. Next, the tape T is inserted into the receiving opening 74a of the front wall 74 of the tape support portion 66, and the tip of the tape T is positioned above the support plate 72 of the tape support portion 66.

[0159] Once the tape T is inserted into the receiving opening 74a, the tape clamping portion 68 is positioned adjacent to the tape support portion 66, as shown in Figure 15 (combining the tape clamping portion 68 and the tape support portion 66). Next, the clamping plate 84 of the tape clamping portion 68 is lowered, and the tip of the tape T is clamped vertically by the support plate 72 of the tape support portion 66 and the clamping plate 84 of the tape clamping portion 68. Then, a suction force is generated in the suction hole 84a of the clamping plate 84, and the tip of the tape T is held in place by the clamping plate 84.

[0160] Furthermore, as shown in Figure 16, the tape placement table 62 is raised to a position where the tape T pulled out by the tape pulling means 64 can be placed, bringing the tape placement table 62 close to the tape support part 66 and the tape clamping part 68. Next, as shown in Figure 17, the tape support part 66 and the tape clamping part 68 are moved in the Y-axis direction (away from the tape roll R), thereby pulling the tape T from the tape roll R and placing the tape T on the tape placement table 62. Note that on the tape T placed on the tape placement table 62, the release paper P is on the upper side and the sheet S is on the lower side (see Figure 3).

[0161] Next, as shown in Figure 18, without moving the tape clamping section 68, the tape support section 66 is moved to the tape roll R side, positioning the tape support section 66 at the Y-axis end of the tape placement table 62. Then, the cutting blade of the rectangular cutting cutter 76 is lowered from the upper retracted position to the lower cutting position, and the rectangular cutting cutter 76 is moved in the X-axis direction to cut the tape T into a rectangle together with the release paper P, forming a rectangular tape Tr.

[0162] (Release paper cutting process) After the tape extraction process is performed, a release paper cutting process is carried out to cut only the release paper P of the rectangular tape Tr placed on the tape placement table 62 in accordance with the shape of the wafer W.

[0163] As shown in Figure 19, in the release paper cutting process, first, the first Z-axis movable member 100 of the release paper cutting means 94 is lowered, and the rectangular tape Tr on the tape placement table 62 is pressed down by the tape pressing part 104.

[0164] Next, the second Z-axis movable member 108 of the release paper cutting means 94 is lowered, and the circular rotary cutter 114 is driven into the release paper P of the rectangular tape Tr. At this time, the Z-axis position of the rotary cutter 114 is adjusted so that only the upper release paper P is completely cut and the lower sheet S is not cut.

[0165] Next, the rotary cutter 114 of the release paper cutting means 94 is rotated to cut only the release paper P of the rectangular tape Tr placed on the tape placement table 62 into a circular shape corresponding to the shape of the wafer W. At this time, the diameter of the circular cut portion of the release paper P is made slightly larger than the diameter of the wafer W (for example, about 1 to 2 mm). After the release paper P is cut, the release paper cutting means 94 is raised.

[0166] Next, the suction force of the suction hole 84a of the clamping plate 84 of the tape clamping section 68 is released, and the clamping plate 84 is raised. Also, the cutting blade of the rectangular cutting cutter 76 of the tape support section 66 is raised from the lower cutting position to the upper retracted position.

[0167] Next, the pressure roller 88 (see Figure 6) of the tape clamping section 68 is lowered and pressed against the rectangular tape Tr placed on the tape mounting table 62. Then, as shown in Figure 20, the tape clamping section 68 is moved in the Y-axis direction (towards the tape roll R), and the pressure roller 88 is rolled in the Y-axis direction while pressing the rectangular tape Tr against the tape mounting table 62 with the pressure roller 88. This causes the rectangular tape Tr to be in close contact with the tape mounting table 62. In addition, the leading edge of the tape T of the tape roll R is clamped between the support plate 72 of the tape support section 66 and the clamping plate 84 of the tape clamping section 68.

[0168] (Release paper collection process) After the release paper cutting process is performed, the tape placement table 62 is inverted, and a release paper recovery process is performed to recover the cut release paper P from the rectangular tape Tr placed on the inverted tape placement table 62.

[0169] In the release liner retrieval process, first, suction force is generated in the suction grooves 62a and 62b of the tape mounting table 62, and the rectangular tape Tr is held in place by the tape mounting table 62. Next, as shown in Figure 21, the reversing motor 116 of the reversing means 96 reverses the tape mounting table 62 by 180 degrees. As a result, in the rectangular tape Tr held in place by the tape mounting table 62, the sheet S is positioned on the upper side and the release liner P is positioned on the lower side.

[0170] Next, the tape placement table 62 is lowered, positioning the release paper P cut by the release paper cutting means 94 in a location where the release paper collection means 118 can collect it. Furthermore, as shown in Figures 21 and 22, by operating the release paper collection means moving means, the release paper collection means 118 is moved from a retracted position (shown in Figure 21) located away in the Y-axis direction from directly below the tape placement table 62 to an operating position (shown in Figure 22) where it acts on the release paper P cut from the rectangular tape Tr.

[0171] Next, the swinging piece 130 of the release paper collection means 118 is oscillated by the swinging means 132 (see Figure 21), with one end of the swinging piece 130 (the end connected to the support wall 124) as the pivot point. This raises the lifting roller 126 to the upper peeling position where the release paper P positioned at a predetermined position can be peeled off, and the adhesive surface of the release tape Tp is attached to one end of the release paper P in the Y-axis direction.

[0172] Then, while rotating the winding roller 128, the release paper collection means 118 is moved toward the other end of the release paper P in the Y-axis direction in synchronization with the rotation of the winding roller 128, thereby allowing the release paper P, which has been cut into a circular shape corresponding to the shape of the wafer W, to be peeled off from the rectangular tape Tr. The peeled release paper P is wound up by the winding roller 128 together with the used release tape Tp. In this way, the release paper P cut from the rectangular tape Tr is collected.

[0173] (Tape positioning process) After the release paper collection process is performed, a tape positioning process is carried out in which rectangular tapes Tr are positioned at predetermined intervals on the surface of the wafer W held on the holding table 10.

[0174] In the tape positioning process, first, the tape placement table 62 is raised. Next, the release paper collection means moving means is activated to move the release paper collection means 118 to a retracted position away from directly below the tape placement table 62 in the Y-axis direction. Then, as shown in Figure 23, the holding table 10 is moved by the holding table moving means 56 to position the holding table 10 directly below the tape placement table 62.

[0175] Next, as shown in Figure 24, the tape placement table 62 is lowered, bringing both ends of the rectangular tape Tr in the Y-axis direction into contact with the tape receiving section 120a of the tape positioning means 120. At this time, the tape receiving section 120a of the tape positioning means 120 is positioned at the receiving position (the position shown in Figure 24) for receiving the rectangular tape Tr from which the release paper P has been peeled off, from the tape placement table 62. Then, the suction force on the suction grooves 62a and 62b of the tape placement table 62 is released, and the rectangular tape Tr is transferred from the tape placement table 62 to the tape positioning means 120.

[0176] In this way, the rectangular tape Tr is positioned at a predetermined interval on the surface of the wafer W held by the holding table 10 (in the illustrated embodiment, the surface Wa of the wafer W). In this state, the portion from which the circular release paper P has been peeled off the rectangular tape Tr (the portion where the sheet S is exposed) is located directly above the wafer W.

[0177] (Tape application process) After performing the tape positioning process, a tape application process is carried out in which a rectangular tape Tr is attached to the surface of the wafer W held on the holding table 10.

[0178] In the tape application process, the tape placement table 62 is raised, and the vertical plates 120c of the pair of tape receiving sections 120a are rotated by 90 degrees to position the pair of tape receiving sections 120a in a clamping position (shown in Figure 25) where the vertical plates 120c are substantially horizontal. As a result, the bottom plate 120b and vertical plates 120c of the pair of tape receiving sections 120a clamp both ends of the rectangular tape Tr in the Y-axis direction.

[0179] Next, as shown in Figure 26, the holding table 10 is moved by the holding table moving means 56 to position the holding table 10 directly below the tape application means 138. Then, as shown in Figure 27, the vacuum chamber 140 of the tape application means 138 is lowered, and the lower end of the side wall 146 of the vacuum chamber 140 is brought into close contact with the upper end of the rectangular container 60.

[0180] Next, the depressurization means 148 is activated to reduce the pressure inside the depressurization chamber 140. Then, the adhesive roller 142 is lowered, and the adhesive surface (exposed portion of the sheet S) of the rectangular tape Tr is pressed against the surface Wa of the wafer W. Then, the adhesive roller moving mechanism rolls the adhesive roller 142 in the Y-axis direction. This allows the rectangular tape Tr to be adhered to the surface Wa of the wafer W.

[0181] In the illustrated embodiment, when the rectangular tape Tr is attached to the wafer W, the pressure inside the vacuum chamber 140 is reduced, so that no air enters between the rectangular tape Tr and the wafer W, and the entire surface Wa of the wafer W can be tightly adhered to the rectangular tape Tr.

[0182] If the rectangular tape Tr is a heat-press sheet, the adhesive roller 142 is heated to a predetermined temperature by a heating means (not shown), and then the adhesive roller 142 is rolled over the rectangular tape Tr to heat-press it onto the surface Wa of the wafer W.

[0183] (Tape cutting process) After the tape application process is performed, a tape cutting process is carried out to cut the rectangular tape Tr attached to the wafer W along the outer circumference of the wafer W.

[0184] Referring to Figure 11, in the tape cutting process, first the reduced pressure chamber 140 is raised, and then the rectangular tape Tr attached to the wafer W is moved to the support table 164 of the tape cutting means 162 by the transfer unit 166.

[0185] Specifically, the Y- and Z-axis movable members 178 and 180 of the relocation unit 166 are moved to bring the suction pads 186 into contact with the four corners of the upper surface of the rectangular tape Tr attached to the wafer W. Next, a suction force is generated in the suction pads 186, and the rectangular tape Tr is held in place by the suction pads 186.

[0186] Next, the Y- and Z-axis movable members 178 and 180 of the relocation section 166 are moved to bring the wafer W into contact with the upper surface of the support table 164, and the Y-axis ends of the rectangular tape Tr into contact with the upper surface of the beam 190 of the tape holding section 168. Then, suction force is generated in the suction grooves 174a and 174b of the support table 164, and the wafer W is held in place by suction on the upper surface of the support table 164. In addition, suction force is generated in the suction hole 190a of the beam 190, and the two opposing sides (Y-axis ends) of the rectangular tape Tr are held in place by suction on the upper surface of the beam 190.

[0187] Next, after releasing the suction force of the suction pad 186 of the relocation unit 166, the Y-Z axis movable members 178 and 180 are moved to move the suction pad 186 away from above the rectangular tape Tr attached to the wafer W. Preferably, the arm 184 can be rotated and folded in the direction indicated by arrow A1 in Figure 11.

[0188] Next, the Z-axis movable member 196 of the cutting section 192 is lowered, causing the cutting edge of the cutter 202 to cut into the rectangular tape Tr on the outer side of the wafer W. Then, the cutter motor 198 rotates the cutter 202 along the outer circumference of the wafer W, thereby cutting the rectangular tape Tr attached to the wafer W by the tape attachment means 138 along the outer circumference of the wafer W.

[0189] Next, the suction force of the suction hole 190a of the beam 190 is released, and the pair of tape holding parts 168 are moved in a direction that separates them from each other, positioning them in the outer drop position. As a result, the waste rectangular tape Tr (rectangular tape Tr with a circular opening formed on it) that is not attached to the wafer W falls with the circular opening surrounding the support table 164 and is stored on the substrate 170. Since the release paper P remains on the waste rectangular tape Tr, the waste has stiffness, and the waste falls onto the substrate 170 while maintaining its original shape (rectangular).

[0190] (Conveying process) After the tape cutting process is performed, a transport process is carried out to transport the wafer W, which is supported on the support table 164, to the flattening table 206.

[0191] Continuing the explanation with reference to Figure 11, in the transport process, first, the lifting shaft 222 of the first transport unit 214 is raised and lowered, and the swivel arm 224 is rotated to bring the holding pad 226 into contact with the upper surface (tape T side) of the tape-attached wafer W supported by the support table 164. Next, a suction force is generated on the lower surface of the holding pad 226, and the tape-attached wafer W is held in place by the holding pad 226. At the same time, the suction force of the suction grooves 174a and 174b of the support table 164 is released.

[0192] Next, the lifting shaft 222 of the first transport unit 214 is raised and lowered, and the swivel arm 224 is rotated to move the tape-attached wafer W held by the holding pad 226, bringing the lower surface of the tape-attached wafer W into contact with the upper surface of the temporary storage unit 216. Then, a suction force is generated in the annular groove 216a of the temporary storage unit 216, and the tape-attached wafer W is held by the temporary storage unit 216. At the same time, the suction force of the holding pad 226 is released, and the tape-attached wafer W is transferred from the holding pad 226 to the temporary storage unit 216.

[0193] Next, the Y-Z axis movable members 232 and 234 of the second transport unit 218 are moved to bring the holding pad 236 into contact with the upper surface of the tape-attached wafer W supported by the temporary storage unit 216. Then, a suction force is generated on the lower surface of the holding pad 236, and the tape-attached wafer W is held in place by the holding pad 236. At the same time, the suction force of the temporary storage unit 216 is released.

[0194] Next, by moving the Y·Z axis movable members 232 and 234 of the second transport unit 218, the tape-attached wafer W held by the holding pad 236 is moved, and the lower surface of the tape-attached wafer W is brought into contact with the upper surface of the flattening table 206. At this time, the flattening table 206 is positioned at a receiving position (the position shown in Figures 11 and 12) where it can receive the tape-attached wafer W transported by the transport means 208.

[0195] Next, suction force is generated in the suction chuck 212 of the flattening table 206, and the tape-attached wafer W is held in place by suction on the upper surface of the flattening table 206. Then, the suction force of the holding pad 236 is released, and the tape-attached wafer W is transferred from the holding pad 236 to the flattening table 206. When the tape-attached wafer W is transferred to the flattening table 206, the tape T is positioned on the upper side and the wafer W is positioned on the lower side.

[0196] (flattening process) After the transport process is completed, a flattening process is performed to flatten the upper surface of the tape T attached to the wafer W.

[0197] In the planarization process, first, the planarization table 206 is moved by the planarization table positioning means 240 to position it at the machining location where the turning means 238 is installed. Next, as shown in Figure 28, the motor 246 of the turning means 238 rotates the cutting tool 252 together with the spindle 248 in the direction indicated by arrow R1. Then, the Z-axis movable member 244 (see Figure 12) of the turning means 238 is lowered to position the cutting tool 252 at a predetermined turning height.

[0198] Then, the tape-attached wafer W is moved toward the rotating cutting tool 252, and while supplying water to the turning area, the upper surface of the tape T attached to the wafer W held on the flattening table 206 is turned and flattened by the cutting tool 252.

[0199] (Washing process) In the illustrated embodiment, after the planarization process is performed, a cleaning process is carried out in which the tape T cleans the wafer W that has been planarized.

[0200] Referring to Figure 29, in the cleaning process, first, the flattening table 206 is positioned by the transfer means 270 of the cleaning means 264 to a position where the tape-attached wafer W can be transferred from the flattening table 206 to the spinner table 266 of the cleaning means 264.

[0201] Next, the Y-Z axis movable members 282 and 284 of the transfer means 270 are moved to bring the holding pad 286 into contact with the upper surface of the tape-attached wafer W held on the flattening table 206. Then, a suction force is generated on the lower surface of the holding pad 286, and the upper surface of the tape-attached wafer W is held in place by the holding pad 286. At the same time, the suction force of the suction chuck 212 of the flattening table 206 is released.

[0202] Next, by moving the Y and Z axis movable members 282 and 284 of the transfer means 270, the tape-attached wafer W held by the holding pad 286 is moved, and the lower surface of the tape-attached wafer W is brought into contact with the upper surface of the spinner table 266. Then, suction force is generated in the suction chuck 274 of the spinner table 266, and the tape-attached wafer W is held by suction on the upper surface of the spinner table 266. Finally, the suction force of the holding pad 286 is released, and the tape-attached wafer W is transferred from the holding pad 286 to the spinner table 266.

[0203] Next, the holding pad 286 is moved away from above the tape-attached wafer W, and then the spinner table 266 is rotated. Then, while the nozzle 276 is oscillated by the oscillating motor 278 of the fluid injection means 268, cleaning fluid is sprayed from the nozzle 276 toward the tape-attached wafer W that is held by suction on the spinner table 266. This allows the tape-attached wafer W to be cleaned.

[0204] After cleaning the tape-attached wafer W, compressed air is supplied from the compressed air supply means to the nozzle 276, and the compressed air is sprayed from the nozzle 276 toward the tape-attached wafer W which is held by suction on the rotating spinner table 266. This removes the cleaning solution from the tape-attached wafer W and allows the tape-attached wafer W to be dried.

[0205] (Carry-in process) After the cleaning process is performed, a loading process is carried out in which the wafer W, with the tape T flattened, is loaded into a second cassette 4b placed on a second cassette table 6b. In the illustrated embodiment, the loading process is carried out by the wafer unloading section 12 of the unloading mechanism 8, which is also used as a loading means.

[0206] Referring to Figure 14, in the loading process, first, the hand 28 of the wafer loading section 12 of the loading mechanism 8 is moved to position the hand 28 on the upper surface of the tape-attached wafer W held on the spinner table 266. Next, a suction force is generated in the suction hole 28a of the hand 28, and the wafer W is held by the hand 28 through suction. Then, the suction force of the suction chuck 274 of the spinner table 266 is released. Finally, the hand 28 is moved, and the tape-attached wafer W held by the hand 28 is loaded into the second cassette 4b.

[0207] As described above, the tape placement device 2 of the illustrated embodiment can perform the work of placing tape T on the wafer W and the work of flattening the tape T placed on the wafer W, thereby improving productivity. [Explanation of symbols]

[0208] 2: Tape distribution device 4: Cassette 4a: First cassette 4b: Second cassette 6: Cassette Table 6a: First cassette table 6b: Second cassette table 8: Unloading mechanism 10: Holding Table 12: Wafer Removal Section 14: Temporary Table 16: Detection unit 18: Conveyor Department 52: Pin 56: Holding table moving means 62: Tape placement table 64: Tape pull-out mechanism 94: Release paper cutting means 96: Reversal method 118: Release paper collection method 120: Tape positioning means 120a: Tape receiving section 138: Tape application method 140: Reduced pressure chamber 142: Adhesive roller 162: Tape cutting means 164: Support Table 166: Relocation section 168: Tape holding section 204: Flattening mechanism 206: Flattening Table 208: Conveying means 214: First transport section 216: Temporary placement section 218: Second transport section 238: Turning means 240: Flattening table positioning means 252:bytes 258: Grinding means 260: Grinding wheel 264: Washing methods W: Waha T: Tape Tr: Rectangular Tape R: Tape Roll S: Seat A: Adhesive layer P: Release paper

Claims

1. A tape distribution device for arranging tape on the surface of a wafer, A cassette table on which a cassette containing a wafer is placed, A discharge mechanism for discharging wafers from cassettes placed on the cassette table, A holding table for holding the wafers discharged by the discharge mechanism, A tape dispensing means is provided on the top of the holding table to pull out the tape along with the release paper from a tape roll in which the tape is wound with release paper in between, place it on the tape placement table, and cut the tape together with the release paper into a rectangle to form a rectangular tape. A release paper cutting means for cutting only the release paper of the tape placed on the tape placement table in accordance with the shape of the wafer, A reversing means that inverts the tape placement table to face the wafer placed on the holding table, A release paper collection means for collecting the cut release paper from the tape placed on the inverted tape placement table, A tape positioning means is provided which a pair of tape receiving units are arranged to sandwich the holding table and receive the tape from the reversing means, and the tape is positioned on the surface of the wafer at a predetermined interval, A tape application means that applies tape positioned by the tape positioning means to the surface of a wafer held on the holding table, A tape cutting means comprising a cutter for cutting the tape attached by the tape attachment means along the outer circumference of the wafer, A flattening mechanism that flattens the upper surface of the tape attached to the wafer, A loading means for loading a flattened tape wafer into a cassette placed on the cassette table, Tape distribution device including tape distribution device.

2. The tape cutting means comprises a support table that supports a wafer to which a rectangular tape held on the holding table is attached, a transfer unit that moves the wafer from the holding table to the support table, and a pair of tape holding units that are arranged to sandwich the support table and hold two opposing sides of the rectangular tape, wherein the diameter of the support table is formed to be smaller than the diameter of the wafer, and as the pair of tape holding units move in a direction away from each other, the waste material cut by the cutter surrounds the support table and falls and is stored, as described in claim 1.

3. The tape distribution device according to claim 2, further comprising a flattening table and a transport means for transporting a wafer supported on the support table to the flattening table.

4. The tape distribution device according to claim 3, comprising: a first transport unit for transporting wafers supported on a support table; a temporary storage unit for temporarily placing wafers transported by the first transport unit; and a second transport unit for transporting wafers temporarily placed in the temporary storage unit to a flattening table.

5. The tape placement device according to claim 3, further comprising a turning means for flattening the upper surface of a tape disposed on a wafer held in the flattening table by turning it with a cutting tool.

6. The tape placement device according to claim 3, further comprising a grinding means for flattening the upper surface of a tape disposed on a wafer held in the flattening table by grinding it with a grinding wheel.

7. The tape distribution device according to claim 5, further comprising a flattening table positioning means for positioning the flattening table at a receiving position for receiving wafers conveyed by the conveying means and at a processing position where the turning means is installed.

8. The tape distribution apparatus according to claim 1, wherein the discharge mechanism includes a wafer discharge unit for dischargeing wafers from a cassette, a temporary placement table on which wafers discharged by the wafer discharge unit are temporarily placed and rotated, a detection unit for detecting the outer circumference of the wafer temporarily placed on the temporary placement table and determining the center of the wafer, and a transport unit for transporting the wafer from the temporary placement table to the holding table.

9. The tape distribution device according to claim 8, wherein at least three pins are arranged in the center of the holding table so as to be able to move back and forth, and the device receives wafers from the transport section of the discharge mechanism.

10. The tape application device according to claim 1, further comprising a vacuum chamber and an application roller disposed within the vacuum chamber for pressing and applying the tape to the surface of a wafer.

11. The tape distribution device according to claim 8, wherein the loading means for loading wafers into a cassette placed on the cassette table is also used by the wafer unloading unit for unloading wafers from a cassette placed on the cassette table.

12. The tape distribution device according to claim 1, further comprising a holding table moving means for positioning the holding table on the tape pulling means and the tape attaching means.

13. The tape installation device according to claim 1, further comprising a release paper collection means moving means for positioning the release paper collection means at an action position that acts on the release paper cut from the tape and at a retracted position.

14. The tape distribution device according to claim 1, wherein a cleaning means is provided for cleaning the wafer on which the tape has been flattened by the flattening mechanism.

15. The tape placement device according to claim 1, wherein the tape is an adhesive tape having a sheet and an adhesive layer laid on the upper surface of the sheet, and is attached to the surface of a wafer by the adhesive layer.

16. The tape placement device according to claim 1, wherein the tape is a heat-sensitive adhesive sheet that is attached to the surface of a wafer by heat.

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