Frame system for holding the substrate

Abstract

The present invention relates to a frame system, which is configured to hold a substrate during chemical and / or electrolytic surface treatment of the substrate. The frame system comprises a frame body and a number of finger units arranged on the frame body. The frame body is configured to at least partially surround a lateral edge of the substrate and to make at least a first surface or a second surface of the substrate accessible for treatment of the substrate. Each finger unit comprises a first finger and a second finger. The first finger is configured to contact the first surface of the substrate and the second finger is configured to contact the second surface of the substrate opposite the first surface. The first finger is movable relative to the frame body to clamp the substrate between the first finger and the second finger.

Description

Technical Field

[0001] The present invention relates to a frame system for holding a substrate during chemical and / or electrolytic surface treatment of the substrate.

Background Art

[0002] Wet chemical treatment of a substrate or workpiece is one of the most widely used techniques in many different industries - particularly semiconductor-related industries - for cleaning or etching the surface of the substrate. Wet chemical treatment can provide high chemical selectivity. This high chemical selectivity can be achieved with various processing liquids (e.g., acids, bases, oxidizing agents, etc.) or simple or complex mixtures. In addition, wet chemical treatment enables the process to be inherently simplified, adapted to substrates of various types and sizes, and the operating costs to be reduced. An additional advantage of wet chemical treatment is that both sides, including the edges and sides of a flat substrate surface, or multiple sides of a substrate having a complex shape can be processed simultaneously. It is also possible to process multiple substrates simultaneously. Thus, wet chemical treatment is used to remove contaminants on a random surface and to selectively remove unintended portions of a material layer for further processing to create a device pattern on the substrate surface.

[0003] To achieve the desired surface quality and process uniformity, it is important to provide reliable substrate attachment and holding means during and after wet chemical treatment - for example, rinsing and drying processes at the end of wet chemical treatment. Conventional substrate holding frames or chucks are composed of two members, an upper half frame and a lower half frame. The substrate is placed between the two members by mechanical force. Depending on the frame, some are fixed together, and for particularly large substrates, some are manually screwed.

Summary of the Invention

Problems to be Solved by the Invention

[0004] Therefore, it is considered necessary to provide reliable means for mounting and holding substrates that improve the quality of substrate processing by assisting in the fixation of the substrates. [Means for solving the problem]

[0005] The above-mentioned problems are resolved by the scope of the independent claims of the present invention. Further embodiments are incorporated into the dependent claims.

[0006] A frame system is provided according to this disclosure. The frame system is configured to hold a substrate during chemical and / or electrolytic surface treatment of the substrate. The frame system comprises a frame body and a plurality of finger-like units disposed within the frame body. The frame body is configured to at least partially surround the side edges of the substrate and to allow access to at least a first or second surface of the substrate for processing. Each of the finger-like units comprises a first finger portion and a second finger portion. The first finger portion is configured to contact the first surface of the substrate, and the second finger portion is configured to contact the second surface of the substrate opposite to the first surface. The first finger portion is movable relative to the frame body to secure the substrate between the first finger portion and the second finger portion.

[0007] The frame system according to this disclosure enables simple, rapid, and reliable automatic or manual loading and unloading of the substrate. The frame system further prevents the risk of substrate damage and / or harmful electrostatic charge of the substrate during processing by ensuring excellent and stable fixing of the substrate and electrical contact with the substrate. In addition, the frame system enables highly efficient and effective chemical processing of the entire surface of the substrate by an aerodynamically optimized frame system.

[0008] The chemical and / or electrolytic surface treatment of the substrate may be material deposition, zinc plating coating, chemical or electrochemical etching, anodizing, metal separation process, etc. The frame system may be a substrate holder capable of holding the substrate in a fixed state. The substrate may include a conductive plate, a semiconductor substrate, a film substrate, a basically flat metal or metallized workpiece, etc. The substrate may be mounted to the frame system before the chemical and / or electrolytic surface treatment is performed in the processing system. The frame system thus enables safe and damage-free transport between the loading / unloading station and the processing system.

[0009] The frame system may be immersed in an electrochemical deposition tank containing a processing fluid and / or electrolyte for current distribution. The frame portion may include at least one—preferably more—frames that, when combined, form a cavity that receives the substrate at its center. The frame portion may include rectangular, circular, or polygonal shapes and may at least partially include the substrate. The substrate may be substantially planar in shape so that the framework can be aligned with the lateral edges of the substrate. Thus, the first and second surfaces of the planar substrate can be exposed to the electrolyte for surface treatment.

[0010] The finger-like units may be manufactured integrally with the frame body, or they may be removably positioned within the frame body. In the latter case, the finger-like units may be fixed or screwed in to individually separate them from the frame body. The finger-like units may be positioned along the frame body or framework and facing toward the cavity. In other words, the finger-like units can hold the lateral edges of the substrate by protruding from the frame body toward the cavity. In other words, the finger-like units may also surround at least a portion of the substrate. The finger-like units may be configured to hold the substrate with the minimum force necessary to avoid causing breakage or unintended mechanical deformation. Each of the finger-like units may include a pair of fingers or pins, each consisting of a first finger-like portion and a second finger-like portion, corresponding to each.

[0011] The frame body may comprise a first surface or first frame portion and a second surface or second frame portion. The first frame portion and the second frame portion may be separated from each other. The first surface or first frame portion may at least partially surround the first surface of the substrate, and the second surface or second frame portion may at least partially surround the second surface of the substrate. The first frame portion may comprise at least one framework, and the second frame portion may also comprise at least one framework.

[0012] The first finger-shaped portion of the finger-shaped unit may be positioned on the first surface or first frame portion of the frame body, and the second finger-shaped portion of the finger-shaped unit may be positioned on the second surface or second frame portion of the frame body. Alternatively, the first finger-shaped portion may be positioned on the second surface or second frame portion, and the second finger-shaped portion may be positioned on the first surface or first frame portion. Furthermore, the first and second finger-shaped portions of the finger-shaped unit, positioned along the frame body, may be alternately provided on the first surface or first frame portion and the second surface or second frame portion.

[0013] The first finger portion of the finger-shaped unit may be movable or displaceable relative to the frame body, and the second finger portion of the finger-shaped unit may be fixed to the frame body. Alternatively, the first finger portion may be fixedly mounted to the frame body, and the second finger portion may be movable relative to the frame body. The term “movable” can be understood as the finger portion being displaceable along the frame body between a closed position and an open position so as to hold or release the substrate between the first finger portion and the second finger portion. Preferably, the first finger portion or the movable finger portion may be rotatably mounted to the frame body so as to apply a fixing force in the closed position.

[0014] In one embodiment, the finger-like unit is made of an electrically conductive polymer, an electrically conductive ceramic, or a metallic material. The finger-like unit may also be made of a non-conductive polymer, a non-conductive ceramic, or a non-conductive plastic material.

[0015] In some embodiments, the frame and / or the finger-like units are made of stainless steel, aluminum, or titanium. The frame and / or the finger-like units may also be made of chemically compatible or incompatible materials and further coated with a chemically compatible polymer. In some embodiments, the frame and / or the finger-like units may be coated with a polymer, perfluoroalkoxyalkane (PFA), ethylene chlorotrifluoroethylene copolymer (ECTFE), polytetrafluoroethylene (PTFE), ethylene tetrafluoroethylene (ETFE), or ethylene fluoride propylene (FEP). In some embodiments, the first and second finger-like portions may be made of the same material as the frame or of a different material.

[0016] In one embodiment, the second finger-like portion is immovable. In other words, the second finger-like portion of the finger-like unit is fixedly mounted to the frame, and only the first finger-like portion is movable relative to the frame and / or the second finger-like portion. In other words, the second finger-like portion is mounted in a fixed position on the frame, and the first finger-like portion is rotatable relative to the second finger-like portion to apply a fixing force to hold the substrate. During loading the substrate into the frame, the second surface of the substrate may be positioned on the second finger-like portion. The second finger-like portion may function as a reference position for the substrate.

[0017] In one embodiment, the second finger-like portion is movable relative to the frame body. In other words, both the first and second finger-like portions are movable so as to be able to open relative to the frame body that can receive the substrate between the first and second finger-like portions. This can be particularly useful when two or more substrates can be attached to the frame body.

[0018] In one embodiment, a plurality of finger-like units are arranged along the frame body at a distance between adjacent finger-like units. The finger-like units may be arranged along the frame body—preferably the lateral framework of the frame body. The frame body is arranged parallel to the direction of immersion of the frame system into the deposit tank. The finger-like units may be spaced apart from each other along the frame body. The finger-like units may face each other with respect to the lateral direction of the frame body, or may be arranged to be offset from each other. They may be arranged relative to the lateral direction of the frame body. Thus, the finger-like units may be arranged to hold the substrate in an optimal and reliable manner without causing damage or unintended mechanical deformation.

[0019] In one embodiment, the frame system further includes an actuator configured to move the first finger-like unit between an open position for receiving and / or releasing the substrate and a closed position for holding the substrate. The actuator may also be configured to move the second finger-like unit between an open position for receiving and / or releasing the substrate and a closed position for holding the substrate. The actuator may be configured to move the plurality of first finger-like units so that a plurality of first finger-like units can move together between the open position and the closed position. The actuator may also be configured to move the plurality of second finger-like units so that a plurality of second fingers can move together between the open position and the closed position.

[0020] The actuation unit may include a cylinder mechanism that actsuates the movement of the finger-shaped unit between the open position and the closed position. The actuation unit may be located in the frame body—preferably inside the frame body, and more preferably on the upper part of the frame body that is not immersed in the deposit tank to protect the actuation unit. The actuation unit may be connected to a control unit that operates the cylinder mechanism that induces the movement of the finger-shaped unit and / or the frame body. The control unit may be electrically driven or by applied pneumatic pressure. Thus, the loading and unloading of the substrates can be fully automated.

[0021] In one embodiment, the frame system further comprises a pre-tensioning unit configured to hold the first finger-like portion in a stationary position—which is a closed position. The pre-tensioning unit may also be configured to hold the second finger-like portion in a stationary position—which is a closed position. The pre-tensioning unit can generate motion of the first finger-like portion by interconnecting with the frame body and the actuating unit. In other words, the pre-tensioning unit can be coupled with the actuating unit on one plane and with the frame body on the other plane. The pre-tensioning unit can also generate motion of the second finger-like portion by interconnecting with the frame body and the actuating unit.

[0022] The pre-tensioning section may include a spring section connected to the operating section or the cylinder mechanism on one surface and to a guide section connected to the frame on the other surface. The spring section can push or release the guide section in response to the movement of the cylinder mechanism.

[0023] A gear rack can be positioned between the spring portion and the guide portion. The guide portion may have a tooth structure on its surface. The tooth structure is in contact with the gear rack portion. Therefore, when the cylinder mechanism presses the spring portion, the spring portion can press the guide portion. As a result, the gear rack portion rotates. Therefore, the frame body coupled to the gear rack portion can rotate to open the finger-shaped unit.

[0024] Alternatively, the gear rack portion may be attached to a support portion that is inserted into the frame body and directly connected to the finger-shaped unit. Thus, when the gear rack portion is rotated, the support portion is rotated, and the finger-shaped unit can be opened without moving the frame body. The number of teeth in the gear rack portion, the length of the guide portion, and / or the cylinder stroke of the cylinder mechanism can enable controlled rotation of the frame body and / or the finger-shaped unit—preferably 180° rotation of the frame body and / or the finger-shaped unit.

[0025] When the cylinder mechanism returns to its original position, the spring portion becomes stationary and the guide portion can be released. This corresponds to the closed position of the finger-shaped unit. Because the spring portion is about to become stationary or released, the pre-tension portion can ensure that the finger-shaped unit self-closes when the cylinder mechanism is not operated. Therefore, the substrate held by the finger-shaped unit cannot escape from the frame body. In summary, the open position of the finger-shaped unit is achieved by operating the actuation portion or the cylinder mechanism, and the closed position of the finger-shaped unit can be achieved by releasing the pre-tension portion.

[0026] In one embodiment, the first finger portion and / or the second finger portion includes an elastic fingertip portion that contacts the substrate. The end surface or a remote position of the first finger portion and / or the second finger portion that directly contacts the substrate can include an elastomer portion. The elastomer material for the fingertip portion of the first finger portion and / or the second finger portion can be made chemically resistant so that the elastic fingertip portion is not adversely affected by the electrolyte or any other chemical solution used during the process. The fixing force applied by the finger unit and transmitted to the elastic fingertip portion of the first finger portion and / or the second finger portion can securely fix a large substrate in the closed position. The contact points between the surface of the substrate and the finger unit can also be configured to avoid an unintended etching pattern generated during the material removal process stage.

[0027] In one embodiment, the fingertip portion is made of rubber, ethylene-propylene-diene-monomer, fluoroelastomer (FPM / FKM), or perfluoroelastomer (FFKM). Such materials can reduce and even attenuate any mechanical adaptive stress or vibration that may be transmitted to the substrate. Further, such materials are chemically compatible with the processing environment so that the fingertip portion is not decomposed during the processing of the substrate - decomposition can risk losing the holding of the substrate.

[0028] In one embodiment, at least one of the finger units includes an electrically conductive installation path for electrical grounding of the substrate. Thus, the electrical grounding of the substrate can always be ensured to avoid or at least suppress the electrostatic charging of the substrate during the chemical and / or electrolytic surface treatment.

[0029] In one embodiment, the finger unit, the first finger portion, the second finger portion, and / or the fingertip portion are replaceable. Any part of the first finger portion or the finger unit - for example, the fingertip - can be manufactured separately and attached to the frame body or any other part of the finger unit. Thus, the finger unit can be individually and optimally combined according to the requirements or characteristics of the substrate or the chemical environment. In one embodiment, each finger unit disposed on the frame body can be arranged differently so that each first finger portion and / or second finger portion can have different shapes or fingertip portions made of different materials.

[0030] In one embodiment, the outer end of the frame body is made to be pointed, and the outer end is preferably directed towards the bottom of the frame system. The framework disposed at the bottom of the frame body first contacts the electrolyte when the frame system is immersed in the deposition tank and may have a tapered shape in the outer direction. Thus, the high-speed immersion and / or high-speed extraction of the frame system into / from the deposition tank are promoted, and the scattering of the electrolyte and / or chemical solution can be prevented. This can be particularly important in the case of a high-speed immersion etching process required to achieve high process throughput and the best etching uniformity from top to bottom. In addition, the pointed design of the frame body can enable the easy removal of residual droplets of the rinse fluid during the drying process.

[0031] In one embodiment, the frame body and / or the finger-like units include a fluid guide system configured to guide fluid away from the substrate—preferably towards the bottom of the frame system. The fluid guide system may include a gas flow unit configured to supply a dry gas. The dry gas preferably flows from the top to the bottom of the frame body such that the rinse fluid film or droplets can be removed downward and to the outside of the frame system. Thus, the rinse fluid, being transported away from the frame system or substrate, can never again come into contact with the substrate. For example, the rinse fluid may be deionized water, and the dry gas may be air or nitrogen gas. The drying process may be carried out by a heated gas—for example, air heated to 70°C or any other temperature optimized for the process.

[0032] In some embodiments, the frame and / or finger-like units are hydrophobic or hydrophilic. In other words, the frame and / or finger-like units may be coated with a hydrophobic or hydrophilic material to facilitate the drying process in order to completely remove any residual droplets.

[0033] In one embodiment, the frame and / or finger-like units are designed without undercuts. In other words, the frame and / or finger-like units do not have hidden corners or areas where chemicals or electrolytes may collect or droplets of the rinsing fluid may be retained. Such aerodynamically optimized geometry of the frame and / or finger-like units may enable effective and efficient rinsing and drying of the frame system and / or substrate.

[0034] In one embodiment, the frame system further comprises one or two finger-like units per 500 mm of substrate length. The frame system may have a minimum number of finger-like units that contact the substrate surface to fix the substrate in place, particularly for high-speed movement. The minimum number of required finger-like units may depend on the dimensions of the substrate. For example, for a 500 × 500 mm substrate, only two finger-like units may be positioned on each side of the frame body. The frame body is parallel to the direction of immersion of the frame system in the storage tank.

[0035] In one embodiment, the frame further comprises at least one stationary section positioned at the bottom of the frame and configured to support the substrate. The stationary section may have a stationary surface that receives the lower end of the substrate. Thus, the substrate can be held in a reliable position in the vertical direction. The stationary surface may be formed very thin and / or tapered toward the substrate to avoid back-splashing of the electrolyte and / or droplets. The stationary section may be integrally formed with the frame or manufactured separately and releasably attached to the frame. Furthermore, the stationary section may function as a reference position for automatic loading of the substrate into and / or automatic unloading of the substrate from the frame.

[0036] In one embodiment, the frame system further comprises only one single frame body. In other words, all the frameworks of the frame body and / or the first and second frame members may be arranged to be integrated to constitute a single frame body. Thus, the loading and unloading of the substrate into the frame system can be facilitated by the assembly of the frame system.

[0037] The present disclosure illustrates the use of the above-described frame system for chemical and / or electrochemical treatment of substrates—particularly large substrates. The chemical and / or electrochemical treatment is applicable to high-speed plating (HSP) technology. In an HSP system, at least one substrate is immersed in a deposition tank containing an electrolyte and treated chemically and / or electrochemically.

[0038] Please note that the embodiments described above can be combined with each other, regardless of the specific aspects included.

[0039] The above and other aspects of the present invention will become apparent from the embodiments described below. [Brief explanation of the drawing]

[0040] Herein, a typical embodiment of the present invention will be described with reference to the following drawings. [Figure 1A] Embodiments of the frame system of the present invention are shown schematically and illustratively. [Figure 1B] Embodiments of the frame system of the present invention are shown schematically and illustratively. [Figure 2] An embodiment of the frame system according to the present invention is shown schematically and illustratively. [Figure 3A] An embodiment of the finger-shaped unit of the present invention is shown schematically and illustratively. [Figure 3B] An embodiment of the finger-shaped unit of the present invention is shown schematically and illustratively. [Figure 4] An embodiment of the frame system according to the present invention is shown schematically and illustratively. [Figure 5A] An embodiment of the finger-shaped unit of the present invention is shown schematically and illustratively. [Figure 5B] An embodiment of the finger-shaped unit of the present invention is shown schematically and illustratively. [Figure 5C] An embodiment of the finger-shaped unit of the present invention is shown schematically and illustratively. [Figure 5D] An embodiment of the finger-shaped unit of the present invention is shown schematically and illustratively. [Figure 5E] An embodiment of the finger-shaped unit of the present invention is shown schematically and illustratively. [Figure 5F] An embodiment of the finger-shaped unit of the present invention is shown schematically and illustratively. [Figure 6] An embodiment of the stationary part according to the present invention is shown schematically and illustratively. [Modes for carrying out the invention]

[0041]

[0041] Figure 1A shows a frame system 10 for holding the substrate 20 during chemical and / or electrolytic surface treatment of the substrate 20. The substrate 20 can be mounted in the frame system 10 before the treatment is carried out. The frame system 10 allows for easy, quick, and reliable loading and unloading of the substrate 20, either automatically or manually.

[0042] The frame system 10 comprises a frame body 30 and a plurality of finger-shaped units 60 arranged on the frame body 30 (see also Figures 3A, 3B, and 4). The frame body 30 is configured to at least partially surround the lateral edges 23 of the substrate 20 and to allow access to at least a first surface 21 or a second surface 22 of the substrate 20 for surface treatment (see also Figures 5A to 5E). The plurality of finger-shaped units 60 are arranged along the frame body 30, with spacing between adjacent finger-shaped units 60. The frame body 30 may comprise a first frame member 31 and a second frame member 32. The first frame member 31 may at least partially surround the first surface 21 of the substrate 20, and the second frame member 32 may at least partially surround the second surface 22 of the substrate 20.

[0043] The frame system 10, especially in the case of a high-speed plating (HSP) system, may include a minimum number of finger-like units 60 that contact the substrate surfaces 21 and 22 to fix the substrate 20 in place. The minimum number of finger-like units 60 required may depend not only on their dimensions and weight, but also on the chemical and physical properties of the substrate material and the surface properties of the substrate 20.

[0044] The finger-shaped units 60 may be manufactured integrally with the frame body 30, or they may be removably attached to the frame body 30. As shown in Figure 3A, each finger-shaped unit 60 includes a first finger-shaped portion 61 and a second finger-shaped portion 62. The first finger-shaped portion 61 is configured to contact a first surface 21 of the substrate 20, and the second finger-shaped portion 62 is configured to contact a second surface 22 of the substrate 20 opposite to the first surface 21 (see also Figures 5A to 5E). Thus, the first finger-shaped portion 61 may be located on the first frame member 31, and the second finger-shaped portion 62 may be located on the second frame member 32. The first finger-shaped portion 61 is movable relative to the frame body 30 in order to secure the substrate 20 between the first finger-shaped portion 61 and the second finger-shaped portion 62.

[0045] The frame body 10 and / or finger-shaped units 60 may be made of stainless steel, aluminum, or titanium. The frame body 10 and / or finger-shaped units 60 may be made of chemically compatible or chemically incompatible materials, and may further be coated with a chemically compatible polymer.

[0046] The frame body 30 and / or finger-shaped units 60 are designed without undercuts (see Figure 3B). In other words, the frame body 30 and / or finger-shaped units 60 do not have hidden corners or areas where chemicals or electrolytes may accumulate or droplets of rinse fluid may be retained.

[0047] The frame body 30 further comprises a bottom framework 33, the outer edge of which is pointed (see Figure 1B). The framework 33 located at the bottom of the frame body 30, which is the first to come into contact with the electrolyte when the frame system 10 is immersed in the deposit tank, may be tapered outwards. This facilitates faster immersion of the frame system 10 into and / or removal from the deposit tank, and helps to avoid splashing of the electrolyte and / or chemicals. Furthermore, the pointed design of the frame body 30 allows for easy removal of residual droplets of the rinse fluid during the drying process.

[0048] The bottom framework 33 of the frame body 30 includes at least one resting portion 70 configured to support the substrate 20 (see Figure 6). The resting portion 70 includes a resting surface 71 that receives the lower end of the substrate 20. Thus, the substrate 20 can be reliably held in a predetermined position in the vertical direction. The resting surface 71 is formed to be very thin and / or tapered in the direction of the substrate 20 in order to avoid back splashing of the electrolyte.

[0049] As shown in Figure 2, the frame system 10 further comprises an actuation unit 40 configured to move a movable finger between an open position for receiving and / or releasing the substrate 20 and a closed position for holding the substrate 20 (see also Figures 3A and 4). The actuation unit 40 comprises a cylinder mechanism 41 that actsuates the movement of the finger-like unit 60 between the open and closed positions. The actuation unit 40 is located inside the frame body 30, preferably on the upper part of the frame body 30 that is not immersed in the electrolyte.

[0050] As the finger-shaped unit 60 opens and closes, the first finger-shaped portion 61 may be movable between a closed position and an open position to hold or release the substrate 20 between the first finger-shaped portion 61 and the second finger-shaped portion 62, as shown in Figure 4. On the other hand, the second finger-shaped portion 62 is immovable and is fixedly positioned on the frame body 30. When loading the substrate 20 into the frame system 10, the second surface 22 of the substrate 20 is placed on the second finger-shaped portion 62, and the first finger-shaped portion 61 can apply a clamping force to the substrate 20 to fix it in place.

[0051] The frame system 10 further includes a pre-tension section 50 configured to maintain the movable first finger-shaped section 61 in a closed, stationary position. The pre-tension section 50 includes a spring section 51, one end of which is connected to an actuation section 40 or a cylinder mechanism 41, and the other end of which is connected to a guide section 52 connected to the frame body 30 or a first frame member 31 of the frame body 30. The spring section 51 can push or release the guide section 52 in response to the movement of the cylinder mechanism 41. The guide section 52 includes a gear rack section 53 coupled to the frame body 30 or a first frame member 31 of the frame body 30.

[0052] When the cylinder mechanism 41 presses the spring portion 51, the spring portion 51 presses the guide portion 52, causing the gear rack portion 53 to rotate. The guide portion 52 can have a tooth structure on the surface that contacts the gear rack portion 53. Therefore, when the guide portion 52 is pressed by the spring portion 51, it rotates the gear rack portion 53, which in turn rotates the frame body 30 or the first frame member 31 of the frame body 30 connected to the gear rack portion 53, allowing the finger-shaped unit 60 to open.

[0053] When the cylinder mechanism 41 returns to its original position, the spring portion 51 comes to rest and the guide portion 52 can be released. This corresponds to the closed position of the finger-shaped unit 60. Because the spring portion 51 tends to come to rest or be released, the pre-tension portion 50 can ensure that the finger-shaped unit 60 self-closes when the cylinder mechanism is not in operation.

[0054] Figures 5A to 5F show various embodiments of the finger unit 60. The finger unit 60, the first finger portion 61, the second finger portion 62, and / or the fingertip portion 63 are interchangeable. The first finger portion 61 and the second finger portion 62 may be arranged symmetrically (see Figure 5A), or at least one of the first finger portion 61 and the second finger portion 62 may have an elastic fingertip portion 63 made of an elastomer material (see Figure 5B). Such materials can reduce or dampen mechanical stress or vibration on the substrate 20.

[0055] In Figure 5C, the first finger portion 61 has a spring portion 64, and in Figure 5D, the first finger portion 61 has an inclined finger portion. As shown in Figure 5E, the first finger portion 61 may also include a grounding pin 65 for providing an electrically conductive grounding path for the electrical grounding of the substrate 20. In that case, the second finger portion 62 may include an elastic fingertip portion 63. However, the first finger portion 61 may include an electrically conductive elastic fingertip portion, which does not require the second finger portion 62 to have an elastic fingertip portion. The first finger portion 61 and / or the second finger portion 62 may also include a teardrop-shaped fingertip portion 63 (see Figure 5F). Various embodiments of the finger unit 60 allow the substrate 20 to be securely held by the frame body without damage, and the substrate 20 can be processed efficiently.

[0056] The frame system 10 may further include a fluid guide system (not shown) configured to guide the fluid away from the substrate 20, preferably towards the bottom of the frame system 10. The fluid guide system may include a gas flow unit configured to supply dry gas flowing preferably from the top to the bottom of the frame body 30 so that the rinse fluid film or droplets can be removed downward and to the outside of the frame system 10.

[0057] It should be noted that embodiments of this disclosure are described with reference to different subjects. However, those skilled in the art will understand from the above and below descriptions that, unless otherwise specified, any combination of features belonging to one type of subject, as well as any combination of features relating to different subjects, are disclosed in this application. However, all features can be combined in a way that provides a synergistic effect greater than the simple sum of the features.

[0058] While this disclosure is illustrated and described in detail in the drawings and description, such illustrations and descriptions are illustrative or illustrative and not restrictive. This disclosure is not limited to the embodiments disclosed. Other variations of the embodiments disclosed can be understood and achieved by a person skilled in the art who practices the disclosure described in the claims from a study of the drawings, this disclosure, and the dependent claims.

[0059] In the claims, the words “comprising,” “having,” and “including” do not preclude other components or steps, and the indefinite article (“a” or “an”) does not preclude plural. A single processor or other unit may perform the functions of multiple items described in the claims. The mere fact that certain means are rereferenced in different dependent claims does not imply that combinations of these means cannot be used advantageously. No reference numeral in the claims should be construed as limiting its scope.

Claims

1. A frame system for holding a substrate during chemical and / or electrolytic surface treatment of the substrate, Frame body and Multiple finger-shaped units arranged on the frame body, The operating part, Equipped with a pre-tensioning section, The frame body is configured to at least partially surround the lateral edges of the substrate and to expose at least the first or second surface of the substrate to the electrolyte for processing the substrate. Each of the aforementioned finger-shaped units comprises a first finger-shaped portion and a second finger-shaped portion. The first finger-shaped portion is configured to contact the first surface of the substrate, and the second finger-shaped portion is configured to contact the second surface of the substrate opposite to the first surface. The first finger-shaped portion is movable relative to the frame body so as to fix the substrate between the first finger-shaped portion and the second finger-shaped portion. The pre-tensioning section is coupled to the operating section on one surface and to the frame body on the other surface. The operating part is configured to move the first finger-shaped part between an open position for receiving and / or releasing the substrate and a closed position for holding the substrate by moving the pre-tensioning part and rotating the frame body. Frame system.

2. A frame system according to claim 1, wherein the second finger-shaped portion is immovable.

3. A frame system according to claim 1, wherein the second finger-shaped portion is movable relative to the frame body.

4. A frame system according to any one of claims 1 to 3, wherein the plurality of finger-shaped units are arranged along the frame body at a distance between adjacent finger-shaped units.

5. A frame system according to claim 1, wherein the pre-tensioning portion is configured to maintain the first finger-shaped portion in the resting position which is the closed position.

6. A frame system according to any one of claims 1 to 5, wherein the first finger-shaped portion and / or the second finger-shaped portion comprises an elastic fingertip portion that contacts the substrate.

7. A frame system according to any one of claims 1 to 6, wherein at least one of the finger-shaped units is provided with an electrically conductive installation path for electrical grounding of the substrate.

8. A frame system according to claim 6, wherein the elastic fingertip portion is replaceable.

9. A frame system according to any one of claims 1 to 8, wherein at least one finger-shaped unit, the first finger-shaped portion, and / or the second finger-shaped portion are interchangeable.

10. A frame system according to any one of claims 1 to 9, wherein the outer end of the frame body is pointed, and the outer end is preferably directed toward the bottom of the frame system.

11. A frame system according to any one of claims 1 to 10, wherein the frame body and / or the finger-shaped unit comprises a fluid guide system configured to guide fluid away from the substrate, preferably toward the bottom of the frame system, the fluid guide system comprising a gas flow unit configured to supply dry gas.

12. A frame system according to any one of claims 1 to 11, wherein the frame body and / or finger-shaped units are designed without undercuts.

13. A frame system according to any one of claims 1 to 12, wherein the frame body and / or finger-shaped units are hydrophobic or hydrophilic.

14. A frame system according to any one of claims 1 to 13, wherein the frame system comprises one or two finger-shaped units per 500 mm of substrate length.

15. A frame system according to any one of claims 1 to 14, wherein the frame body further comprises at least one stationary part disposed at the bottom end of the frame body and configured to support the substrate.

16. A frame system according to any one of claims 1 to 15, comprising only one single frame body.

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