Method for surface treatment of resin substrate, method for manufacturing conductive coated resin substrate, method for manufacturing waveguide, and method for manufacturing circuit board or antenna

A surface treatment method for fluororesin substrates using defluorination and functional group bonding enhances adhesive strength and reduces transmission loss, addressing the limitations of existing bonding techniques in high-frequency electronics.

JP7863962B2Active Publication Date: 2026-05-22HOKOSHA TECH CORP +1
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
HOKOSHA TECH CORP
Filing Date
2021-08-30
Publication Date
2026-05-22

AI Technical Summary

Technical Problem

Existing methods for bonding fluororesins to metals in electronic components result in insufficient adhesive strength and increased transmission loss, especially in high-frequency applications, due to the limitations of surface roughening techniques.

Method used

A surface treatment method for fluororesin substrates involving defluorination and application of a compound with specific functional groups that chemically bond with both the resin and conductor, followed by electroless plating or other conductor formation methods, to enhance adhesive strength without significant roughening.

Benefits of technology

The method significantly increases adhesive strength between fluororesin substrates and conductive coatings, enabling the production of components with high peel strength and low transmission loss, suitable for high-frequency electronics.

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Patent Text Reader

Abstract

To provide a surface processing method or the like of a resin base material, which can increase the adhesive strength between a resin base material and a conductor coating in forming the conductor coating on the surface of the resin base material containing a fluororesin.SOLUTION: A surface processing method of a resin base material includes a defluorination treatment step of immersing a resin base material containing a fluorine-based resin in an alkali metal solution to perform a defluorination treatment, and a support treatment step of applying a solution containing a compound α to the resin base material to support the compound α on the surface thereof after the defluorination treatment step, and the compound α includes a first functional group capable of chemically bonding to the resin base material subjected to the defluorination treatment by chemical reaction in one molecule, and a second functional group that can be chemically bonded to a conductor by chemical reaction.SELECTED DRAWING: Figure 1
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