Crystal oscillator chip

The crystal vibration chip with recessed side surfaces and conductive silver pastes enhances vibration characteristics and production yield by suppressing secondary waves, addressing the issues of combined waves and tight tolerances in current chips.

JP7864168B2Active Publication Date: 2026-05-22TXC CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
TXC CORP
Filing Date
2024-10-14
Publication Date
2026-05-22

AI Technical Summary

Technical Problem

Current crystal vibration chips face issues with secondary waves combining with the main wave, deteriorating vibration characteristics, and tighter dimensional design tolerances lead to decreased production yield.

Method used

A crystal vibration chip design featuring a planar substrate with recesses on its side surfaces and conductive silver pastes connecting the substrate to a housing, effectively suppressing secondary waves while maintaining the main wave, allowing for larger manufacturing tolerances.

Benefits of technology

The design improves vibration characteristics and increases production yield by effectively suppressing secondary waves, enabling more efficient chip development.

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Patent Text Reader

Abstract

To provide a quartz oscillator chip that can improve vibration characteristics. [Solution] The quartz crystal oscillator chip includes a housing and a quartz crystal oscillator. The quartz crystal oscillator is installed inside the housing. The quartz crystal oscillator includes a planar substrate, two electrodes, and two conductive silver pastes, the two electrodes being installed on two opposing main surfaces of the planar substrate. The planar substrate has at least one recess, which is located on the side of the planar substrate, perpendicular to the side, and recessed in a direction toward the interior of the planar substrate. The height of the recess is the same as the thickness of the planar substrate, and the two conductive silver pastes connect the planar substrate to the housing.
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