Circuit board container with door gasket
The gasket design with a heel and tip configuration addresses the degradation issue of existing gaskets by ensuring consistent sealing force and reduced particle generation, improving contamination prevention in wafer containers.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- ENTEGRIS INC
- Filing Date
- 2023-05-10
- Publication Date
- 2026-05-22
AI Technical Summary
Existing wafer container gaskets degrade over time, leading to reduced elastic or flexural strength, which compromises their ability to form a seal and prevent gas or particulate contamination, and can generate particle debris during use.
A gasket design with a sealing segment that includes a heel and a tip, where the heel contacts a recess on the container surface, allowing for greater compression and reduced travel distance, thereby minimizing particle generation and maintaining seal effectiveness over multiple cycles.
The gasket design maintains consistent sealing force and reduces dimensional changes over many door opening and closing cycles, minimizing particulate debris and enhancing contamination prevention.
Smart Images

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