Circuit board container with door gasket

The gasket design with a heel and tip configuration addresses the degradation issue of existing gaskets by ensuring consistent sealing force and reduced particle generation, improving contamination prevention in wafer containers.

JP7864204B2Active Publication Date: 2026-05-22ENTEGRIS INC
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
ENTEGRIS INC
Filing Date
2023-05-10
Publication Date
2026-05-22

AI Technical Summary

Technical Problem

Existing wafer container gaskets degrade over time, leading to reduced elastic or flexural strength, which compromises their ability to form a seal and prevent gas or particulate contamination, and can generate particle debris during use.

Method used

A gasket design with a sealing segment that includes a heel and a tip, where the heel contacts a recess on the container surface, allowing for greater compression and reduced travel distance, thereby minimizing particle generation and maintaining seal effectiveness over multiple cycles.

Benefits of technology

The gasket design maintains consistent sealing force and reduces dimensional changes over many door opening and closing cycles, minimizing particulate debris and enhancing contamination prevention.

✦ Generated by Eureka AI based on patent content.

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Abstract

A substrate container is described that includes an opening, a door for closing the opening, and a gasket for sealing the opening when the door is placed across the opening. The gasket includes a gasket body that contacts a flat portion, and a sealing segment attached to the gasket body, the sealing segment having a heel and a tip, and when the door is positioned to cover the opening and press the sealing segment between an outer peripheral surface of the opening and an outer peripheral surface of the door, the heel contacts a surface of a recess.
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