Light-emitting devices and lighting devices

Abstract

To provide a light emitting device and an illumination device that can increase luminous efficacy.SOLUTION: A light emitting device comprises: a substrate that has a first surface; a light emitting device that is mounted on the first surface of the substrate and emits excitation light; and a wavelength conversion member that is in contact with the entirety of at least an end of the first surface of the substrate. The wavelength conversion member has a portion that spreads to the outside beyond at least part of the end of the first surface of the substrate in plan view of the first surface of the substrate.SELECTED DRAWING: Figure 1

Description

Cross-reference to related applications

[0001] This application claims priority to Japanese Patent Application No. 2021-158465 (filed September 28, 2021), the entire disclosure of said application is incorporated herein by reference. [Technical Field]

[0002] This disclosure relates to a light-emitting device and a lighting device. [Background technology]

[0003] Optoelectronic devices are known in which a light-emitting semiconductor chip and a conversion member for wavelength conversion are arranged on a support (see, for example, Patent Document 1). [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2019-50359 [Overview of the project]

[0005] A light-emitting device according to one embodiment of the present disclosure comprises a substrate having a first surface, a light-emitting element positioned on the first surface of the substrate and emitting excitation light, and a wavelength conversion member in contact with at least the entire edge of the first surface of the substrate. In a plan view of the first surface of the substrate, the wavelength conversion member has a portion that extends outward beyond at least a portion of the edge of the first surface of the substrate.

[0006] An illumination device according to one embodiment of the present disclosure comprises the light-emitting device and a mounting board on which the light-emitting device is mounted. [Brief explanation of the drawing]

[0007] [Figure 1] This is a plan view showing an example configuration of a light-emitting device according to one embodiment. [Figure 2] This is a cross-sectional view AA in Figure 1. [Figure 3] This is a cross-sectional view showing an example of the circuit board configuration. [Figure 4] This is an enlarged view of the area enclosed by the dashed line in Figure 2. [Figure 5] This is a cross-sectional view showing an example configuration in which the upper surface of the wavelength conversion member is concave. [Figure 6] This is a cross-sectional view showing an example configuration in which the corners of the wavelength conversion member are chamfered. [Figure 7A] This is an example of a cross-sectional view taken along the YZ plane. [Figure 7B] This is an example of a cross-sectional view taken along the ZX plane. [Figure 8A] This figure shows a wavelength conversion component that deforms when pulled in the direction of the blade's rotation during dicing. [Figure 8B] This figure shows a wavelength conversion component that is compressed and deformed on the side of the blade during dicing. [Figure 9] This is a perspective view showing an example configuration of a lighting device according to one embodiment. [Modes for carrying out the invention]

[0008] (Example configuration of the light-emitting device 10) As shown in Figures 1, 2, and 3, the light-emitting device 10 comprises an element substrate 2, a light-emitting element 3, and a wavelength conversion member 6. The light-emitting element 3 is located on the positive Z-axis side of the element substrate 2. The wavelength conversion member 6 is located on the positive Z-axis side of both the element substrate 2 and the light-emitting element 3.

[0009] As shown in Figure 3, the element substrate 2 comprises a first surface 2A facing the positive direction of the Z-axis and a second surface 2B facing the negative direction of the Z-axis. The side of the element substrate 2 facing the positive direction of the Z-axis is also referred to as the front surface. The side of the element substrate 2 facing the negative direction of the Z-axis is also referred to as the back surface. The element substrate 2 further comprises a side surface 2C that intersects the first surface 2A and the second surface 2B. The side surface 2C of the element substrate 2 is also referred to as the substrate side surface. The first surface 2A has an edge that intersects with the side surface 2C. The edge of the first surface 2A, or an area within a predetermined distance from the edge, is also referred to as the end surface 2D of the first surface 2A.

[0010] The element substrate 2 has a first electrode 41 and a second electrode 42 on its front surface 2A. The first electrode 41 is located on the positive side of the X-axis than the second electrode 42. The first electrode 41 and the second electrode 42 are each located side by side along the Y-axis. The first electrode 41 and the second electrode 42 located on the positive side of the Y-axis are electrically connected. The first electrode 41 and the second electrode 42 located on the negative side of the Y-axis are electrically connected. In other words, the element substrate 2 has two electrodes, the first electrode 41 and the second electrode 42, which are connected. The element substrate 2 has two back electrodes 44 on its back surface 2B. The two electrodes located on the front surface and the two back electrodes 44 located on the back surface are electrically connected by wiring that penetrates the element substrate 2. Specifically, one electrode located on the positive side of the Y-axis on the front surface and one back electrode 44 located on the positive side of the Y-axis on the back surface are electrically connected. Furthermore, one electrode located on the negative Y-axis side of the front surface and one back surface electrode 44 located on the negative Y-axis side of the back surface are electrically connected.

[0011] The element substrate 2 further includes a reflective member 43 that extends over the portion of the first surface 2A on the surface side where no electrodes are located. The reflective member 43 extends to the edge 2D of the first surface 2A. In a plan view of the first surface 2A of the element substrate 2, the reflective member 43 is positioned to surround the light-emitting element 3.

[0012] The light-emitting element 3 is electrically connected to the first electrode 41. The light-emitting element 3 operates using power supplied from the back electrode 44 to the first electrode 41. The light-emitting element 3 emits light having a peak wavelength in the wavelength region of, for example, 360 nm or more and 430 nm or less. The wavelength region of 360 nm or more and 430 nm or less is also called the violet light region.

[0013] The wavelength conversion member 6 converts the light incident from the light emitting element 3 to the wavelength conversion member 6 into light having a peak wavelength in a wavelength region of, for example, 360 nm or more and 780 nm or less, and emits the converted light. The wavelength region of 360 nm or more and 950 nm or less is also referred to as the visible light region. The wavelength conversion member 6 is excited by the light emitted from the light emitting element 3, and emits a peak wavelength region in the visible light region. The light emitted from the light emitting element 3 is also referred to as excitation light. The light emitting element 3 included in the light emitting device 10 is also referred to as an excitation light emitting element.

[0014] The light emitting device 10 may further include an electronic component 7. The electronic component 7 may be, for example, a Schottky diode. The electronic component 7 is electrically connected to the second electrode 42. The electronic component 7 is configured to be able to control the voltage between two electrodes located on the surface side. The first electrode 41 and the second electrode 42 are connected by a connection conductor path 45.

[0015] Hereinafter, specific examples of each component of the light emitting device 10 will be described.

[0016] <Element substrate 2> The element substrate 2 is also simply referred to as a substrate. The element substrate 2 may be formed of, for example, a material having insulation properties. The element substrate 2 may be formed of, for example, a ceramic material such as aluminum oxide (alumina) or mullite, a glass-ceramic material, or a composite material in which a plurality of these materials are mixed. The element substrate 2 may also be formed of a polymer resin material in which metal oxide fine particles capable of adjusting thermal expansion are dispersed. The element substrate 2 may be configured to include aluminum nitride or silicon carbide. Thereby, the thermal conductivity of the element substrate 2 can be improved, and the heat dissipation performance of the light emitting device 10 is improved. In the present embodiment, it is assumed that the element substrate 2 is configured with aluminum nitride as a material.

[0017] The first electrode 41, the second electrode 42, and the back electrode 44, as well as the wiring penetrating the element substrate 2, may be formed from a conductive material such as tungsten, molybdenum, manganese, or copper. The reflective member 43 may be formed from a material obtained by adding a white material such as titanium oxide to a silicone resin-based material. The reflective member 43 is not limited to this example, and may be formed such that the reflectance of the reflective member 43 is higher than the reflectance of the first surface 2A. By positioning the reflective member 43 on the first surface 2A, the excitation light emitted from the light-emitting element 3 and the illumination light converted by the wavelength conversion member 6 are less likely to be absorbed by the first surface 2A. As a result, the excitation light and illumination light can be emitted to the outside of the light-emitting device 10 with high efficiency.

[0018] <hibi3> The light-emitting element 3 is assumed to be an LED (Light Emitting Diode). An LED emits light to the outside when electrons and holes recombine in a PN junction, where a P-type semiconductor and an N-type semiconductor are joined together. The light-emitting element 3 is not limited to an LED and may be other light-emitting devices.

[0019] The light-emitting element 3 is mounted on the first surface 2A of the element substrate 2. The light-emitting element 3 is electrically connected to the first electrode 41 located on the first surface 2A of the element substrate 2, for example, via brazing material or solder. The first electrode 41 is installed in pairs so as to be connected to the positive and negative electrodes of the light-emitting element 3. In a planar view of the first surface 2A of the element substrate 2, the light-emitting element 3 is positioned on the first electrode 41 so as to cover at least a portion of the first electrode 41. The light-emitting element 3 may be larger than the first electrode 41 in a planar view.

[0020] The light-emitting element 3 may be mounted on the element substrate 2 by flip-chip bonding. When the light-emitting element 3 is mounted by flip-chip bonding, the first electrode 41 and the brazing material or solder are positioned so as to be covered by the light-emitting element 3 in a plan view of the first surface 2A. Because the first electrode 41 and the brazing material or solder are covered by the light-emitting element 3, the excitation light emitted from the light-emitting element 3, or the illumination light converted by the wavelength conversion member 6, is less likely to enter the first electrode 41 and the brazing material or solder. As a result, the excitation light or illumination light is less likely to be absorbed by the first electrode 41 and the brazing material or solder. As a result, the luminous efficiency of the light-emitting device 10 can be further increased.

[0021] As a comparative example, when the light-emitting element 3 is mounted on the element substrate 2 by wire bonding, at least a portion of the wire is not covered by the light-emitting element 3. In this case, excitation light or illumination light may be absorbed by the wire. In the light-emitting device 10 according to this embodiment, the light-emitting element 3 is mounted on the element substrate 2 by flip-chip bonding, which reduces the absorption of excitation light or illumination light compared to when it is wire-bonded as in the comparative example. As a result, the luminous efficiency of the light-emitting device 10 can be further increased.

[0022] The number of light-emitting elements 3 mounted on the first surface 2A of the element substrate 2 is one in Figure 1, etc., but is not particularly limited and may be two or more. When the number of light-emitting elements 3 is two or more, each light-emitting element 3 is positioned so as not to overlap with each other in a plan view of the first surface 2A.

[0023] The light-emitting element 3 may include a translucent substrate and an optoelectronic semiconductor layer formed on the translucent substrate. The translucent substrate includes a material on which an optoelectronic semiconductor layer can be grown using a chemical vapor deposition method such as metal-organic vapor deposition or molecular beam epitaxial deposition. The translucent substrate may be formed from, for example, sapphire, gallium nitride, aluminum nitride, zinc oxide, zinc selenide, silicon carbide, silicon (Si), or zirconium diboride. The thickness of the translucent substrate may be, for example, 50 μm or more and 1000 μm or less.

[0024] The optical semiconductor layer may include a first semiconductor layer formed on a translucent substrate, an emissive layer formed on the first semiconductor layer, and a second semiconductor layer formed on the emissive layer. The first semiconductor layer, the emissive layer, and the second semiconductor layer may be formed from, for example, a group III nitride semiconductor, a group III-V semiconductor such as gallium phosphorus or gallium arsenide, or a group III nitride semiconductor such as gallium nitride, aluminum nitride or indium nitride.

[0025] The thickness of the first semiconductor layer may be, for example, 1 μm or more and 5 μm or less. The thickness of the light-emitting layer may be, for example, 25 nm or more and 150 nm or less. The thickness of the second semiconductor layer may be, for example, 50 nm or more and 600 nm or less.

[0026] <Wavelength conversion component 6> The wavelength conversion member 6 is located on the first surface 2A of the element substrate 2. The wavelength conversion member 6 seals the light-emitting element 3 by filling the space above the light-emitting element 3. The wavelength conversion member 6 may be formed by applying it as a paste onto the first surface 2A of the element substrate 2 and then curing it. The wavelength conversion member 6 may also be formed by attaching it as a sheet onto the first surface 2A of the element substrate 2 and then curing it.

[0027] The excitation light emitted from the light-emitting element 3 is directly incident on the wavelength conversion member 6. The wavelength conversion member 6 converts the incident excitation light into light having a peak wavelength included in the wavelength region of, for example, 360 nm or more and 780 nm or less, and emits the converted light.

[0028] The wavelength conversion member 6 may comprise a light-transmitting member having light-transmitting properties and a phosphor.

[0029] The light-transmitting member may be made of, for example, a light-transmitting insulating resin material such as fluororesin, silicone resin, acrylic resin, or epoxy resin, or a light-transmitting glass material. The refractive index of the light-transmitting member may be set to, for example, 1.4 or higher and 1.6 or lower.

[0030] The phosphor is contained within the light-transmitting member. The phosphor may be dispersed substantially uniformly within the light-transmitting member. The phosphor converts the incident excitation light into light having various peak wavelengths.

[0031] The phosphor may convert the excitation light into light identified by a spectrum having a peak wavelength within the wavelength range of, for example, 400 nm to 500 nm, i.e., blue light. In this case, the phosphor may be, for example, BaMgAl 10 O 17 :Eu, or (Sr,Ca,Ba) 10 (PO4)6Cl2:Eu,(Sr,Ba) 10 (PO4)6Cl2:Eu may be included as a material.

[0032] The phosphor may convert the excitation light into light identified by a spectrum having a peak wavelength within the wavelength range of, for example, 450 nm to 550 nm, i.e., blue-green light. In this case, the phosphor may be, for example, (Sr,Ba,Ca)5(PO4)3Cl:Eu,Sr4Al 14 O 25 It may contain materials such as EU.

[0033] The phosphor may convert the excitation light into light specified by a spectrum having a peak wavelength in the wavelength range of, for example, 500 nm to 600 nm, i.e., green light. In this case, the phosphor may be, for example, SrSi2(O,Cl)2N2:Eu or (Sr,Ba,Mg)2SiO4:Eu 2+ Alternatively, it may contain materials such as ZnS:Cu,Al, Zn2SiO4:Mn, etc.

[0034] The phosphor may convert the excitation light into light specified by a spectrum having a peak wavelength in the wavelength range of, for example, 600 nm to 700 nm, i.e., red light. In this case, the phosphor may be, for example, Y2O2S:Eu, Y2O3:Eu, or SrCaClAlSiN3:Eu. 2+ It may contain materials such as CaAlSiN3:Eu or CaAlSi(ON)3:Eu.

[0035] The phosphor may convert excitation light into light specified by a spectrum having a peak wavelength within a wavelength range from, for example, 680 nm to 800 nm, that is, near-infrared light. The near-infrared light may include light within a wavelength range from 680 to 2500 nm. In this case, the phosphor may include, for example, a material such as 3Ga5O 12 :Cr or the like.

[0036] The combination of types of phosphors contained in the wavelength conversion member 6 is not particularly limited. The phosphor is not limited to the above-described materials and may include various other materials.

[0037] As described above, the excitation light incident from the light-emitting element 3 on the wavelength conversion member 6 is converted by the phosphor into light having different peak wavelengths. The peak wavelength of the converted light may be included in the visible light region. Depending on the combination of phosphors included in the wavelength conversion member 6, the converted light may have a plurality of peak wavelengths. For example, when the phosphor includes a material that emits blue fluorescence, a material that emits blue-green fluorescence, and a material that emits green fluorescence, the converted light has the wavelengths of blue, blue-green, and green as peak wavelengths, respectively. When the phosphor includes only one type of material, the converted light has the peak wavelength of that material. The phosphor is not limited to these examples and may include various combinations of materials. The color of the light emitted from the wavelength conversion member 6 is determined based on the types of materials included in the phosphor. That is, the converted light may have various spectra.

[0038] The light-emitting device 10 according to the present embodiment can emit light having various spectra depending on the combination of materials included in the phosphor. The light-emitting device 10 can emit, for example, light having a spectrum of direct sunlight from the sun, a spectrum of sunlight reaching a predetermined depth in the sea, a spectrum of light emitted from a candle flame, or light having a spectrum of light emitted from a firefly or the like. In other words, the light-emitting device 10 can emit light having various colors. Further, the light-emitting device 10 can emit light having various color temperatures.

[0039] The wavelength conversion member 6 is located on the first surface 2A of the element substrate 2, and in a plan view of the first surface 2A, it extends to the edge where the first surface 2A intersects with the side surface 2C. The wavelength conversion member 6 is in contact with at least a portion of the first surface 2A. In the portion of the first surface 2A where the reflecting member 43 is located, the wavelength conversion member 6 is in contact with the first surface 2A via the reflecting member 43. The wavelength conversion member 6 may be in direct contact with the first surface 2A of the element substrate 2, or it may be in contact with the first surface 2A via the reflecting member 43.

[0040] The wavelength conversion member 6 contacts at least the entire end 2D of the first surface 2A. The entire end 2D of the first surface 2A corresponds to the entire circumference of the edge where the first surface 2A intersects with the side 2C. By contacting the end 2D of the first surface 2A with the wavelength conversion member 6, the excitation light reflected by the first surface 2A or the reflecting member 43 is guaranteed to pass through the wavelength conversion member 6. As a result, the conversion efficiency of the excitation light can be increased. Furthermore, in a plan view of the first surface 2A, the wavelength conversion member 6 has a portion that extends outward beyond at least a part of the end 2D of the first surface 2A. Having a portion of the wavelength conversion member 6 that extends outward beyond the end 2D of the first surface 2A can increase the length over which the excitation light passes through the wavelength conversion member 6. As a result, the conversion efficiency of the excitation light can be increased.

[0041] The shape of the first surface 2A of the element substrate 2 may be rectangular. The shape of the first surface 2A is not limited to a rectangle and may be other polygons. The shape of the first surface 2A may be a figure with curved sides such as a circle or an ellipse. The wavelength conversion member 6 may extend outward beyond each side of the first surface 2A of the element substrate 2. If the shape of the first surface 2A of the element substrate 2 is rectangular, the three-dimensional shape of the wavelength conversion member 6 may be a rectangular parallelepiped. This may increase the length over which the excitation light passes through the wavelength conversion member 6. As a result, the conversion efficiency of the excitation light may be increased. Furthermore, the entire outer edge of the wavelength conversion member 6 may be located outside each side of the element substrate 2. This reduces the risk of the element substrate 2 being directly impacted and damaged when mechanical external pressure is applied to the light-emitting device 10 from the outside. Therefore, the occurrence of malfunctions in the light-emitting device 10 can be reduced. In addition, because the elastic modulus of the wavelength conversion member 6 is smaller than that of the element substrate 2, the risk of the light-emitting device 10 being damaged by external mechanical pressure can be reduced.

[0042] As shown in Figure 4, the wavelength conversion member 6 comprises an upper surface 6A facing the positive direction of the Z-axis, a lower surface 6B facing the negative direction of the Z-axis, and a side surface 6C intersecting the upper surface 6A and the lower surface 6B. The side surface 6C is also referred to as the wavelength conversion member side surface. The shape of the wavelength conversion member side surface may be convex outward when viewed in cross-section with at least one surface intersecting the first surface 2A of the element substrate 2. The convex shape of the wavelength conversion member side surface can increase the distance that the excitation light travels through the wavelength conversion member 6. As a result, the conversion efficiency of the excitation light can be increased.

[0043] The shapes of both sides of the portion of the wavelength conversion member 6 that extends outward from the edge 2D of the first surface 2A of the element substrate 2 may differ in a cross-sectional view of the element substrate 2. In other words, the shapes of both sides of the portion of the wavelength conversion member 6 that extends outward from the edge 2D of the first surface 2A of the element substrate 2 may be asymmetrical with respect to a center line that passes through the center of the wavelength conversion member 6 and extends in the stacking direction of the element substrate 2 and the wavelength conversion member 6, in a cross-sectional view of at least one surface intersecting the first surface 2A of the element substrate 2. Specifically, the length of the outward projection of the wavelength conversion member 6 may differ. Also, the shape of the side surface 6C of the wavelength conversion member 6 may differ.

[0044] In the light-emitting device 10, the surface roughness of the side surface 6C (wavelength conversion member side surface) of the wavelength conversion member 6 may be greater than the surface roughness of the side surface 2C (substrate side surface) of the element substrate 2. When mechanical external pressure is applied to the light-emitting device 10 from the outside, the impact can be mitigated and the possibility of damage can be reduced. The surface roughness can be appropriately selected according to the standards, size, material, etc., using either a contact method or a non-contact method, provided that the measurement method and measurement standards for the surface roughness of the side surface 6C (wavelength conversion member side surface) of the wavelength conversion member 6 and the side surface 2C (substrate side surface) of the element substrate 2 are the same. If a contact method is used, for example, a scanning method using a stylus can be used, and if a non-contact method is used, for example, optical interferometry, image synthesis by focus shifting, confocal method, etc. can be used.

[0045] The reflective member 43 has a side surface 43C that extends from the side surface 2C of the element substrate 2. The side surface 43C of the reflective member 43 is also called the reflective member side surface. The reflective member side surface slopes inward toward the wavelength conversion member 6 from the edge where the first surface 2A of the element substrate 2 intersects with the side surface 2C. In other words, the reflective member side surface slopes inward toward the first surface 2A of the element substrate 2 as it moves away from the first surface 2A of the element substrate 2. The slope of the reflective member side surface increases the probability that the excitation light emitted from the bottom surface 6B of the wavelength conversion member 6 is reflected by the reflective member side surface and incident on the bottom surface 6B of the wavelength conversion member 6. As a result, the conversion efficiency of the excitation light can be increased.

[0046] As shown in Figure 5, the upper surface 6A of the wavelength conversion member 6 may be concave. In other words, the wavelength conversion member 6 may have a concave surface that is recessed toward the first surface 2A of the element substrate 2 in a plan view, at least in the portion that overlaps with the light-emitting element 3. The concave shape of the upper surface 6A of the wavelength conversion member 6 makes it easier for the illumination light emitted from the upper surface 6A of the wavelength conversion member 6 to converge toward the center of the concave surface.

[0047] As shown in Figure 6, a chamfered shape may be provided at the corner where the bottom surface 6B and the side surface 6C intersect in the portion of the wavelength conversion member 6 that extends outward from the edge 2D of the first surface 2A of the element substrate 2. In other words, the portion of the wavelength conversion member 6 that extends outward from the edge 2D of the first surface 2A of the element substrate 2 may have a chamfered shape at the corner on the side closer to the first surface 2A of the element substrate 2 in a cross-sectional view of at least one surface intersecting the first surface 2A of the element substrate 2. The chamfered shape may be a C-chamfer 6D or an R-chamfer, as shown in Figure 6. This reduces the risk that the portion of the wavelength conversion member 6 that extends outward from the element substrate 2 will sag downward due to the weight of the wavelength conversion member itself.

[0048] As shown in Figures 7A and 7B, the chamfered shape of the corners of the wavelength conversion member 6 may differ depending on the direction of the cross-sectional view. As shown in Figure 7A, in a cross-sectional view of the light-emitting device 10 along the YZ plane, the wavelength conversion member 6 does not have a chamfered shape at its corners. On the other hand, as shown in Figure 7B, in a cross-sectional view of the light-emitting device 10 along the ZX plane, the wavelength conversion member 6 has a chamfered shape at its corners. This allows for a balance between reducing the risk of the portion of the wavelength conversion member 6 that extends outward from the element substrate 2 sagging downwards due to the weight of the wavelength conversion member itself, and improving the luminous efficiency.

[0049] In a cross-sectional view along at least one plane intersecting the first surface 2A of the element substrate 2, the length of the portion of the wavelength conversion member 6 that extends outward from the edge 2D of the first surface 2A of the element substrate 2 may be 1% or more and 5% or less of the length of the element substrate 2 in the same cross-sectional view. By controlling the length in this way, the size of the light-emitting device 10 can be controlled. If it is 1% or more, the risk of the element substrate 2 being directly impacted and damaged when mechanical external pressure is applied to the light-emitting device 10 from the outside can be reduced. Also, if it is 5% or less, the risk of the portion of the wavelength conversion member 6 that extends outward from the element substrate 2 sagging downward due to the weight of the wavelength conversion member itself can be reduced. Note that the length referred to here is, for example, the maximum length of the portion of the wavelength conversion member 6 that extends outward from the edge 2D of the element substrate 2 in the direction along the first surface 2A.

[0050] As shown in Figure 1, in a plan view of the first surface 2A of the element substrate 2, the area of ​​the light-emitting element 3 may be larger than the area of ​​the first electrode 41. By making the light-emitting element 3 larger than the first electrode 41, the amount of light incident on the first electrode 41, which has low light reflectivity, can be reduced. As a result, the luminous efficiency of the light-emitting device 10 can be improved. In a plan view of the first surface 2A of the element substrate 2, the light-emitting element 3 may cover the entire first electrode 41. By having the light-emitting element 3 cover the first electrode 41, the amount of light incident on the first electrode 41, which has low light reflectivity, can be reduced. As a result, the luminous efficiency of the light-emitting device 10 can be improved.

[0051] In a plan view of the first surface 2A of the element substrate 2, the area of ​​the electronic component 7 may be larger than the area of ​​the second electrode 42. The electronic component 7 may cover the entire second electrode 42. The wiring connecting the first electrode 41 and the second electrode 42 may be covered at least in part by the light-emitting element 3 or the electronic component 7, or it may be exposed in a plan view of the first surface 2A of the element substrate 2.

[0052] As described above, in the light-emitting device 10 according to this embodiment, the wavelength conversion member 6 can be configured in various shapes. By controlling the shape of the wavelength conversion member 6, the conversion efficiency of the excitation light in the wavelength conversion member 6, or the luminescence efficiency of the light-emitting device 10, can be increased.

[0053] (Influence of dicing on the shape of the wavelength conversion member 6) The light-emitting device 10 according to this embodiment is formed in multiples on a wafer, for example, and manufactured by dividing the wafer by dicing. The shape of the side surface 6C of the wavelength conversion member 6, or the side surface 2C of the element substrate 2, can be controlled by the dicing conditions.

[0054] Dicing is performed by rotating a disc-shaped blade 80 and inserting it toward the object. As shown in Figure 8A, the wavelength conversion member 6 may be dragged in the direction of rotation of the dicing blade 80. After the blade 80 passes the wavelength conversion member 6, the wavelength conversion member 6, which was dragged in the direction of rotation of the blade 80, returns to its original position. On the other hand, the element substrate 2 is less likely to be dragged in the direction of rotation of the blade 80 because it has a larger elastic modulus than the wavelength conversion member 6. As a result, the width of the portion of the wavelength conversion member 6 cut by dicing may be narrower than the width of the portion of the element substrate 2 cut by dicing.

[0055] Alternatively, as shown in Figure 8B, the dicing blade 80 can advance while pressing the wavelength conversion member 6 against its side surface as it cuts the wavelength conversion member 6. In this case, the wavelength conversion member 6 is compressed in the direction normal to the side surface of the blade 80. After the blade 80 has passed the wavelength conversion member 6, the wavelength conversion member 6, which was pressed against the side surface of the blade 80, returns to its original position. On the other hand, the element substrate 2 is less likely to be dragged in the rotational direction of the blade 80 because it has a larger elastic modulus than the wavelength conversion member 6. As a result, the width of the portion of the wavelength conversion member 6 cut by dicing may be narrower than the width of the portion of the element substrate 2 cut by dicing.

[0056] As the width of the portion of the wavelength conversion member 6 cut by dicing is narrowed, the wavelength conversion member 6 is formed to have a portion that extends outward from the edge 2D of the first surface 2A of the element substrate 2. The difference between the width of the portion of the wavelength conversion member 6 cut by dicing and the width of the portion of the element substrate 2 cut by dicing can be controlled by the difference between the elastic modulus of the wavelength conversion member 6 and the elastic modulus of the element substrate 2. The length of the portion of the wavelength conversion member 6 that extends outward from the edge 2D of the first surface 2A of the element substrate 2 can be controlled by the difference between the elastic modulus of the wavelength conversion member 6 and the elastic modulus of the element substrate 2. By making the elastic modulus of the wavelength conversion member 6 smaller than the elastic modulus of the element substrate 2, the wavelength conversion member 6 can be controlled to have a portion that extends outward from the edge 2D of the first surface 2A of the element substrate 2.

[0057] The dicing conditions include the rotational speed of the dicing blade 80, the speed at which the blade 80 is inserted into the wavelength conversion member 6 and the element substrate 2, and the shape of the blade 80. The shape of the blade 80 is specified, for example, by the diameter, width, or surface roughness of the blade 80. The dicing conditions are also specified by whether the X-axis direction or the Y-axis direction is cut first to cut out the light-emitting device 10 from the wafer. The shape of the side surface 2C of the wavelength conversion member 6, the shape of the side surface 43C of the reflecting member 43, or the shape of the side surface 2C of the element substrate 2 can be controlled by the dicing conditions. For example, the surface roughness of the side surface 6C of the wavelength conversion member 6 or the surface roughness of the side surface 2C of the element substrate 2 can be controlled. The convex shape of the side surface 6C of the wavelength conversion member 6 can also be controlled. Furthermore, the chamfer shape of the corner of the wavelength conversion member 6 on the side closer to the first surface 2A of the element substrate 2 can be controlled.

[0058] (Example of the configuration of the lighting device 100) As shown in Figure 9, an illumination device 100 according to one embodiment includes at least one light-emitting device 10, and emits light emitted by the light-emitting device 10 as illumination light. If the illumination device 100 includes multiple light-emitting devices 10, the intensity of the light emitted by each light-emitting device 10 may be controlled independently or in association with each other. The spectra of the light emitted by each light-emitting device 10 may be the same or different from each other. The illumination device 100 may control the spectrum of the light synthesized from the light emitted by each light-emitting device 10 by controlling the intensity of the light emitted by each light-emitting device 10 in association with each other. The light synthesized from the light emitted by each light-emitting device 10 is also called synthesized light. The illumination device 100 may emit the synthesized light as illumination light. The illumination device 100 may select at least some of the multiple light-emitting devices 10 to emit illumination light.

[0059] The lighting device 100 may further include a mounting board 110 on which light-emitting devices 10 are mounted. The lighting device 100 may further include a housing 120 having a groove-shaped portion for housing the mounting board 110, and a pair of end plates 130 that close the short-side ends of the housing 120. The number of light-emitting devices 10 mounted on the mounting board 110 may be one or two or more. The light-emitting devices 10 may be mounted on the mounting board 110 in a single row, or in a grid or staggered pattern. The light-emitting devices 10 are not limited to these patterns and may be mounted on the mounting board 110 in various arrangement patterns.

[0060] The mounting board 110 may include a circuit board having a wiring pattern. The circuit board may include, for example, a printed circuit board such as a rigid board, a flexible board, or a rigid-flexible board. The circuit board may also include a drive circuit for controlling the light-emitting device 10.

[0061] The mounting plate 110 has the function of dissipating the heat emitted by the light-emitting device 10 to the outside. The mounting plate 110 may be made of, for example, a metal material such as aluminum, copper or stainless steel, an organic resin material, or a composite material containing these.

[0062] The mounting plate 110 may have an elongated rectangular shape in plan view. The shape of the mounting plate 110 is not limited to this and may have various other shapes.

[0063] The lighting device 100 may further include a lid portion 140 that seals the mounting plate 110 and the light-emitting device 10 housed inside the housing 120. The lid portion 140 may be made of a light-transmitting material so that the illumination light emitted by the light-emitting device 10 can be transmitted to the outside of the lighting device 100. The lid portion 140 may be made of, for example, a resin material such as acrylic resin or glass. The lid portion 140 may have an elongated rectangular shape in plan view. The shape of the lid portion 140 is not limited to this and may have various other shapes. The lighting device 100 may further include a sealing member between the lid portion 140 and the housing 120. This makes it difficult for water or dust to enter the inside of the housing 120. As a result, the reliability of the lighting device 100 can be improved regardless of the environment in which the lighting device 100 is installed. The lighting device 100 may further include a desiccant inside the housing 120.

[0064] The diagrams illustrating the embodiments described herein are schematic. Dimensions and proportions shown in the drawings do not necessarily correspond to actual dimensions.

[0065] While embodiments relating to this disclosure have been described based on the drawings and examples, this disclosure is not limited to the embodiments described above. Furthermore, it should be noted that those skilled in the art can make various modifications or alterations based on this disclosure. Therefore, it should be noted that these modifications or alterations fall within the scope of this disclosure. For example, the functions included in each component can be rearranged in a logically consistent manner, and multiple components can be combined into one or separated. Other modifications are also possible as long as they do not depart from the spirit of this disclosure.

[0066] In this disclosure, the designations "First," "Second," etc., are identifiers used to distinguish the configurations. Configurations distinguished by the designations "First," "Second," etc., in this disclosure may have their numbers swapped. For example, the first surface 2A may swap the identifiers "First" and "Second" with the second surface 23. The swapping of identifiers occurs simultaneously. The configurations remain distinguishable even after the swapping of identifiers. Identifiers may be deleted. Configurations from which identifiers have been deleted are distinguished by codes. The designations "First," "Second," etc., in this disclosure should not be used alone to interpret the order of the configurations or to justify the existence of smaller numbered identifiers.

[0067] In this disclosure, the X, Y, and Z axes are provided for explanatory purposes and may be interchanged. The configurations relating to this disclosure have been described using a Cartesian coordinate system composed of the X, Y, and Z axes. The positional relationships of the configurations relating to this disclosure are not limited to being orthogonal. [Explanation of symbols]

[0068] 10 Light-emitting device 2 element board (2A: 1st surface, 2B: 2nd surface, 2C: side surface, 2D: end) 3 Light-emitting elements 6 Wavelength conversion components (6A: top surface, 6B: bottom surface, 6C: side surface, 6D: chamfered edge) 7 Electronic Components 41 1st electrode 42 2nd electrode 43 Reflective material 44 Backside electrodes 45 Connecting conductors 80 Dicing Blades 100 Lighting device (110: mounting board, 120: housing, 130: end plate, 140: lid)

Claims

1. A substrate having a first surface, A light-emitting element located on the first surface of the substrate, A reflective member located on the first surface of the substrate, A wavelength conversion member located above the first surface of the substrate via the reflective member Equipped with, The wavelength conversion member has a portion that extends outward beyond at least a part of the edge of the first surface of the substrate, The reflective member has a reflective member side that extends from the side of the substrate, The reflective member surrounds the light-emitting element on the first surface, A light-emitting device wherein the side surface of the reflective member is inclined so that it moves inward from the first surface of the substrate as it moves away from the first surface of the substrate.

2. A substrate having a first surface, A light-emitting element located on the first surface of the substrate, A reflective member located on the first surface of the substrate, A wavelength conversion member located above the first surface of the substrate via the reflective member Equipped with, The wavelength conversion member has a portion that extends outward beyond at least a part of the edge of the first surface of the substrate, The reflective member has a reflective member side that extends from the side of the substrate, The wavelength conversion member has a rectangular parallelepiped shape in this light-emitting device.

3. The light-emitting device according to claim 1 or 2, wherein the wavelength conversion member has a portion that extends outward from each side of the first surface of the substrate.

4. The light-emitting device according to claim 3, wherein the entire outer edge of the wavelength conversion member is located outside the outer edge of the first surface of the substrate.

5. The light-emitting device according to claim 2, wherein the reflective member surrounds the light-emitting element on the first surface.

6. The light-emitting device according to claim 5, wherein the side surface of the reflective member is inclined to move inward from the first surface of the substrate as it moves away from the first surface of the substrate.

7. The light-emitting device according to claim 1 or 2, wherein, in a cross-sectional view of the substrate with respect to at least one surface intersecting the first surface of the substrate, the shapes on both sides of the portion of the wavelength conversion member that extends outward from the edge of the first surface of the substrate are different.

8. The substrate has a substrate side surface that intersects the first surface, The wavelength conversion member has a wavelength conversion member side surface that intersects with the surface along the first surface of the substrate, The light-emitting apparatus according to claim 1 or 2, wherein the surface roughness of the substrate side surface is smaller than the surface roughness of the wavelength conversion member side surface.

9. The light-emitting device according to claim 1 or 2, wherein the wavelength conversion member has a concave surface that is recessed in a direction toward the first surface of the substrate, at least in a portion that overlaps with the light-emitting element in a plan view of the first surface of the substrate.

10. The light-emitting device according to claim 1 or 2, wherein the wavelength conversion member has an R-chamfer shape or a C-chamfer shape on the side of the substrate closest to the first surface.

11. The light-emitting device according to claim 1, wherein the three-dimensional shape of the wavelength conversion member is a rectangular parallelepiped.

12. The light-emitting device according to claim 1 or 2, wherein the elastic modulus of the wavelength conversion member is smaller than the elastic modulus of the substrate.

13. The light-emitting device according to claim 1 or 2, wherein, in a cross-sectional view of the substrate with respect to at least one surface intersecting the first surface of the substrate, the length of the portion of the wavelength conversion member that extends outward from the edge of the first surface of the substrate is 1% or more and 5% or less of the length of the substrate in the cross-sectional view of the substrate.

14. The wavelength conversion member has a wavelength conversion member side surface that intersects with the surface along the first surface of the substrate, The light-emitting device according to claim 1 or 2, wherein the shape of the side surface of the wavelength conversion member in a cross-sectional view of the substrate with respect to at least one surface intersecting the first surface of the substrate is convex outward.

15. The substrate is provided with a first electrode on its first surface for supplying power to the light-emitting element, The light-emitting device according to claim 1 or 2, wherein, in a plan view of the first surface of the substrate, the area of ​​the light-emitting element is larger than the area of ​​the first electrode.

16. The substrate is provided with a first electrode on its first surface for supplying power to the light-emitting element, The reflective member, on the first surface, surrounds the first electrode. The light-emitting device according to claim 1 or 2.

17. The substrate has a substrate side surface that intersects the first surface, The wavelength conversion member has a wavelength conversion member side surface that intersects with the surface along the first surface of the substrate, The side surface of the reflective member is connected at one end to the side surface of the substrate and at the other end to the side surface of the wavelength conversion member. The light-emitting device according to claim 1 or 2.

18. A lighting device comprising a light-emitting device according to claim 1 or 2, and a mounting board on which the light-emitting device is mounted.

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