Emulsion-type epoxy resin curing agent composition and aqueous epoxy resin composition

JP7865468B2Active Publication Date: 2026-05-26MITSUBISHI GAS CHEM CO INC
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
MITSUBISHI GAS CHEM CO INC
Filing Date
2025-04-28
Publication Date
2026-05-26

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Abstract

Provided is an emulsion-type epoxy resin curing agent composition that contains component (A): a reaction composition containing a reaction product of xylylenediamine and styrene, component (B): a nonionic emulsifier having an HLB value of 14.0 or more and having an aromatic ring, component (C): a cosolvent, and water. Also provided is an aqueous epoxy resin composition that includes said composition.
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