Apparatus and method for removing impurities from aluminum plating solution, aluminum deposition apparatus, and method for manufacturing aluminum plated products

JP7865472B1Active Publication Date: 2026-05-26PROTERIAL LTD

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
PROTERIAL LTD
Filing Date
2025-09-12
Publication Date
2026-05-26

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Abstract

The objective is to provide an aluminum plating solution impurity removal apparatus and method, or aluminum deposition apparatus, that can efficiently remove water-derived impurities by decomposing and removing water in a non-aqueous aluminum plating solution. According to one aspect of the present invention, an impurity removal apparatus for an aluminum plating solution that removes water-derived impurities contained in the aluminum plating solution comprises an anode and a cathode immersed in the aluminum plating solution, and a power supply device that applies a voltage between the anode and the cathode, wherein the anode is made of metallic aluminum.
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