Semiconductor equipment

The semiconductor device addresses current handling and manufacturing efficiency issues by using conductive plates with overlapping bonding portions and connecting portions, eliminating the need for individual wires, thereby enhancing current capacity and manufacturing speed.

JP7866110B2Active Publication Date: 2026-05-26ROHM CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
ROHM CO LTD
Filing Date
2025-04-23
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

Existing semiconductor devices face limitations in handling larger currents and suffer from decreased manufacturing efficiency due to the use of individual wires for conduction between switching elements and metal patterns, which are time-consuming to join.

Method used

A semiconductor device design featuring a first and second conductive plate with semiconductor elements mounted on their main surfaces, connected by a conductive member with overlapping bonding portions and connecting portions, allowing for direct electrical bonding without individual wires, enhancing manufacturing efficiency and current handling capacity.

Benefits of technology

The design improves manufacturing efficiency while enabling the handling of larger currents by eliminating the need for individual wire connections, thus optimizing the semiconductor device's performance.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

To provide a semiconductor device capable of handling a larger current and having improved manufacturing efficiency.SOLUTION: A semiconductor device A20 includes a first conductive plate 11, a second conductive plate 12, a plurality of semiconductor elements 20, and a conductive member (first conductive member 31). The conductive member includes a main body unit 311, a plurality of first junction portions 312, a second junction portion 314, a first connection portion 313, and a second connection portion 315. The plurality of first junction portions 312 each include an overlapping area that overlaps with an electrode (second electrode 212) of one of the plurality of semiconductor elements 20, as viewed along a thickness direction. The plurality of semiconductor elements 20 are arranged along a second direction y. The main body unit 311 extends along the second direction y. The first connection portion 313 includes a plurality of connection areas 313A located apart from each other in the second direction y. The plurality of connection areas 313A are individually connected to the plurality of first junction portions 312.SELECTED DRAWING: Figure 25
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