Dielectric thermal control fluid and method of use thereof

Abstract

There remains a need for improved dielectric thermal management systems, particularly those suitable for use in cooling lithium ion batteries. The present disclosure relates generally to thermal management fluids, and more specifically to dielectric thermal management fluids suitable for use in managing heat in battery systems via direct cooling, such as lithium ion batteries used in electric vehicles, electric motors, and power electronics, methods of using such thermal management fluids, and systems including such thermal management fluids.

Description

Technical Field

[0001] This invention generally relates to thermal management fluids. More specifically, the present disclosure relates to a dielectric thermal management fluid suitable for use in managing heat within a battery system through direct cooling, such as lithium-ion batteries used in electric vehicles, electric motors, and power electronics, methods of using such thermal management fluids, and systems including such thermal management systems.

Background Art

[0002] This application claims the benefit of priority of U.S. Provisional Patent Application No. 63 / 153,155, filed Feb. 24, 2021, the entire disclosure of which is incorporated herein by reference.

[0003] The worldwide sales of electric vehicles (i.e., vehicles that use electricity for all or part of their motive power, such as battery electric vehicles (BEV), hybrid electric vehicles (HEV), plug-in hybrid electric vehicles (PHEV), etc.) have been increasing over the past several years and are expected to continue to increase. Eventually, it is likely that the majority of vehicles will be electric. As electric vehicle technology continues to evolve, there is a need to provide improved power sources (e.g., battery systems or modules). For example, it is desirable to increase the distance such vehicles can travel without having to recharge the battery, improve the performance of such batteries, and reduce the costs and time associated with battery charging.

[0004] Most batteries generate heat when current is supplied to or drawn from them. Generally, as the amount of current flowing into or out of the battery increases, so does the amount of heat generated. If the generated heat is not dissipated, the battery temperature will rise. Most batteries have an effective operating temperature range, and if the battery exceeds its maximum operating temperature, it may become inoperable or even suffer thermal runaway and failure. In some cases, after a slight rise in temperature, the battery may be able to dissipate heat into its surroundings through a simple heatsink or without thermal management. In other cases, a more specific thermal management system is required to dissipate the heat generated by the battery.

[0005] Currently, battery-powered electric vehicles almost without exception use lithium-ion battery technology. While lithium-ion batteries offer many advantages over comparable nickel-metal hydride batteries, they are more susceptible to temperature fluctuations and therefore have more stringent thermal management requirements. For example, the optimal operating temperature for lithium-ion batteries is in the range of 10-35°C. As the temperature rises from 35°C to 70°C, operation becomes increasingly inefficient, and more importantly, operation at these temperatures can damage the battery over time. Temperatures above 70°C indicate an increased risk of thermal runaway. As a result, lithium-ion batteries require a specific thermal management system to regulate their temperature during vehicle operation. Also, during charging, up to 10% of the input power is converted into heat. As fast charging of lithium-ion batteries becomes more common, an efficient system for battery thermal management remains necessary.

[0006] Lithium-ion batteries can be cooled directly or indirectly using a thermal management fluid (i.e., a cooling fluid or coolant) to carry heat away from the battery components. Direct cooling is advantageous because it allows the thermal management fluid to come into direct contact with the hot components and carry heat away from them. In indirect cooling, the hot components are electrically shielded by an electrically insulating barrier, and the thermal management fluid carries away the heat that passes through this barrier. The most common thermal management fluids are based on a mixture of water and glycol. However, these fluids typically conduct electricity and cannot be used for the direct cooling of the electrical components of lithium-ion batteries. Indirect cooling allows the use of water-based coolants, but the requirement for electrical shielding can create a bottleneck in the heat flow in the cooling process. There are dielectric thermal management fluids that can be used for the direct cooling of electrical components due to their non-conductive properties, examples of which have been conventionally used for cooling transformers. However, the thermal properties of such dielectric thermal management fluids are typically inferior compared to water-glycol. [Overview of the Initiative] [Problems that the invention aims to solve]

[0007] Therefore, there is still a need for improved dielectric thermal management systems, particularly those suitable for use in cooling lithium-ion batteries. [Means for solving the problem]

[0008] One aspect of the present disclosure provides a thermal management fluid having a flash point of at least 100°C and a dielectric constant of at least 1.5 at 25°C, as measured according to ASTM D93. Such dielectric thermal management fluids include: One or more dielectric compounds of formula (1)

[0009] [ka] n is an integer 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, or 12; m is an integer, either 1, 2, or 3; R1 is a C1-C5 alkyl group; R2 is a C1-C5 alkyl group; Each of R3, R4, R5, and R6 is independently selected from H, C1-C8 alkyl, and R7O-(CH2)o-1, where R7 is a C1-C5 alkyl. However, two or fewer of R3, R4, R5, and R6 are R7O-(CH2)0-1-. A thermal management fluid in which the one or more dielectric compounds are present in a total amount ranging from 1% by weight to 100% by weight, based on the total weight of the thermal management fluid.

[0010] Another aspect of the present disclosure provides a battery system. The battery system includes a housing, one or more electrochemical cells disposed within the housing, a fluid path extending within the housing and substantially in thermal communication with the one or more electrochemical cells, and a thermal management fluid as described herein disposed within the fluid path.

[0011] In another embodiment, the Disclosure provides an electric vehicle comprising the battery system of the Disclosure described herein.

[0012] In another embodiment, the Disclosure provides a thermal management circuit comprising a fluid path extending around and / or through a heat source, and a thermal management fluid of the Disclosure, disposed within the fluid path, circulating within the fluid path, and configured to absorb thermal energy generated by the heat source, wherein the fluid is disposed within the fluid path, a heat exchanger, a pump, and connecting ducts.

[0013] Another aspect of the present disclosure provides a method comprising bringing the thermal management fluid of the present disclosure into contact with a surface having a temperature of at least 25°C (e.g., at least 30°C), wherein the surface is substantially in thermal communication with a heat source, and absorbing thermal energy from the heat source into the thermal management fluid through the surface.

[0014] Another aspect of the present disclosure provides a method for preparing the thermal management fluid of the present disclosure. Such a method involves a compound of formula (II)

[0015] [ka] n is an integer 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, or 12; m is an integer, either 1, 2, or 3; Each Ra, R4, R5, and R6 is independently selected from H, C1-C8 alkyl, and RB-(CH2)o-1-, where R7 is H or C1-C5 alkyl. However, two or fewer of Ra, R4, Rs, and Re are RB-(CH2)0-1-; A method comprising reacting a (C1-C5 alkyl)-L (wherein L is a leaving group) with a dielectric compound of the present disclosure. Embodiments of the present invention will be described below with reference to the drawings.

[0016] The accompanying drawings are included to provide a further understanding of the compositions and methods of this disclosure, are incorporated herein, and constitute part thereof. The drawings are not necessarily to a constant scale, and the sizes of various elements may be distorted for clarity. The drawings illustrate one or more embodiments of this disclosure and, together with the description, serve to illustrate the principles and operations of this disclosure. [Brief explanation of the drawing]

[0017] [Figure 1] This is a schematic cross-sectional view of a thermal management circuit according to one embodiment of the present disclosure. [Figure 2] Schematic cross-sectional view of a thermal management circuit according to another embodiment of the present disclosure. **DETAILED DESCRIPTION**

[0018] The inventors have noted that desirable thermal management fluids often have a high ability to carry away heat within the temperature range associated with the operation of a particular electrical device or system (e.g., a lithium-ion battery), and further have a sufficiently high dielectric constant to be suitable for use in direct cooling of the device or system. Importantly, since there is always a risk of oxygen entering the overall system, it is advantageous for the desirable thermal management fluid to have a high flash point to reduce the risk of ignition. Also, to provide more efficient heat transfer during operation, the desirable thermal management fluid preferably has a low viscosity that allows for better fluidity in a particular electrical device or system.

[0019] The inventors have identified a thermal management fluid composition that not only provides the desired low viscosity but also has a high flash point and can thus be easily pumped through a system with a low or no risk of ignition. Specifically, the inventors have recognized that conventional dielectric fluids (e.g., organic or silicone) typically have good thermal conductivity and specific heat capacity but have an undesirably high viscosity. However, typical low-viscosity dielectric fluids generally have an unacceptably low flash point (and other ignition characteristics) and are not suitable for use as a coolant in systems where there is a potential for a temperature rise where ignition is a risk. The inventors have found that the dielectric compounds of the present disclosure can provide a thermal management fluid that does not have a low flash point and preferably has a low viscosity. These properties of the thermal management fluid make them particularly suitable for, for example, the direct cooling of electrical devices and systems.

[0020] The thermal management fluids and methods of this disclosure may have several additional advantages over conventional fluids. In particular, the thermal management fluids of this disclosure may also, in various embodiments, provide one or more of the following: desirable high thermal conductivity, low ignition risk, high dielectric constant, and fast temperature response. The thermal management fluids of this disclosure may also, in various embodiments, have lower surface tension than conventional low-viscosity dielectric fluids.

[0021] Accordingly, one aspect of the present disclosure provides a thermal management fluid comprising one or more dielectric compounds of formula (I), wherein the one or more dielectric compounds are present in a total amount ranging from 1% by weight to 100% by weight. Such a thermal management fluid may have a flash point of at least 100°C, as measured according to ASTM D93 ("Standard Test Methods for Flash Point by Pensky-Martens Closed Cup Tester"), and a dielectric constant of at least 1.5 at 25°C.

[0022] Because there is always some risk that oxygen may enter the system, the thermal management fluids of this disclosure advantageously have a high flash point to prevent ignition. As described above, the thermal management fluids of this disclosure may have a flash point of at least 100°C as measured according to ASTM D93. For example, in various embodiments, the thermal management fluids separately described herein have a flash point of at least 110°C, e.g., at least 120°C, at least 125°C, at least 130°C, or at least 135°C as measured according to ASTM D93. In various embodiments, the thermal management fluids separately described herein have a flash point of at least 140°C, e.g., at least 145°C, at least 150°C, or at least 155°C as measured according to ASTM D93. Materials that do not have a flash point below 100°C are considered to have a flash point above 100°C for the purposes of this disclosure, even if the flash point cannot be measured for the material (i.e., due to the decomposition of the material at temperatures below the temperature at which the flash point can be measured).

[0023] In particular when relatively narrow passages are used, a low viscosity is often desirable for the thermal management fluid to facilitate the pumping of the thermal management fluid through the system. Those skilled in the art will, based on this disclosure, select components to provide a thermal management fluid having a desired viscosity so that it can be conveniently conducted through the system. Accordingly, in various embodiments, the thermal management fluids separately described herein have a kinematic viscosity measured according to ASTM D455 in the range of 1.5 to 10 cSt at 40°C, for example, 1.5 to 15 cSt, or 3 to 20 cSt, or 3 to 8 cSt, or 3 to 6 cSt, or 5 to 10 cSt, or 5 to 8 cSt, or 5 to 6 cSt, or 6 to 10 cSt, or 8 to 10 cSt. Therefore, in various embodiments, the thermal management fluids described herein separately have a kinematic viscosity at 40°C in the range of 1.5 to 10 cSt, for example, 1.5 to 8 cSt, or 1.5 to 6 cSt, or 3 to 10 cSt, or 3 to 8 cSt, or 3 to 6 cSt, or 5 to 10 cSt, or 5 to 8 cSt, or 5 to 6 cSt, or 6 to 10 cSt, or 8 to 10 cSt, when measured according to ASTM D455.

[0024] The thermal management fluids of this disclosure are preferably dielectric so that they can be used for direct cooling applications. Therefore, they have a dielectric constant of at least 1.5 when measured at 25°C. The dielectric constant is measured using the coaxial probe method according to ASTM D924. In various embodiments, the thermal management fluids of this disclosure have a dielectric constant of at least 1.75, e.g., at least 2.0, or at least 2.25 when measured at 25°C. In various embodiments, the thermal management fluids of this disclosure have a dielectric constant in the range of 1.5 to 10, e.g., 1.8 to 10, or 1.5 to 2.8, or 1.8 to 2.8.

[0025] In various embodiments of this disclosure, the thermal management fluid of this disclosure may have a density of 1.1 g / cm³ or less at 25°C. For example, in various embodiments of this disclosure, the thermal management fluid of this disclosure may have a density of 1 g / cm³ or less at 25°C.

[0026] In various embodiments of the present disclosure, the thermal management fluid of the present disclosure may have a heat capacity of at least 1 J / gK, or at least 1.2 J / gK, or even further at least 1.5 J / gK at 25°C. In various embodiments of the present disclosure, the thermal management fluid of the present disclosure may have a thermal conductivity in the range of 0.05 W / m·K to 1 W / m·K at 25°C. In various embodiments of the present disclosure, the thermal management fluid of the present disclosure may have a coefficient of thermal expansion of 1100 × 10⁻⁶ / K or less (e.g., 1050 × 10⁻⁶ / K or less, or 1000 × 10⁻⁶ / K or less).

[0027] As described above, the thermal management fluid of this disclosure comprises one or more dielectric compounds of formula (1).

[0028] In various embodiments described separately herein, the compounds of formula (1) are based on a diol central portion. For example, in various embodiments described separately herein, in the compounds of formula (I), n is an integer in the range of 5 to 12 (i.e., any of 5, 6, 7, 8, 9, 10, 11, and 12), and Ra is H or C1-C8 alkyl. In certain such embodiments, n is an integer in the range of 5 to 10, for example, 5 to 8. In certain such embodiments, n is an integer in the range of 6 to 12, for example, 6 to 10 or 6 to 8. In certain such embodiments, m is an integer in the range of 8 to 12, for example, 8 to 10. For example, in certain other embodiments described separately herein, in the compounds of formula (I), n is an integer in the range of 1 to 4 (i.e., any of 1, 2, 3, and 4), and Ra is H or C1-C8 alkyl. Those skilled in the art can use the diol chain length based on the disclosure herein to select the overall properties of the material, such as viscosity and flash point.

[0029] In various embodiments described separately herein, the diol compound of formula (I), in other embodiments, R3 is methyl or ethyl. In other embodiments, Ra in the diol compound of formula (I) is a C4-C8 alkyl, for example, a C5-C6 alkyl or a C6-C8 alkyl.

[0030] In various embodiments described separately herein, in the diol compound of formula (I), R4, R5, and R6 are each H.

[0031] For example, in various embodiments described separately herein, in the diol compound of formula (I), R3, R4, Rs, and Re are each H.

[0032] [ka] In the formula, R1, R2, n, and m are as described separately herein.

[0033] In various embodiments described separately herein, Ra of the diol compound of formula (I) is C1-C8 alkyl. Such diol compounds of formula (I) include (i.e., R1 and R2 substituted) 1,4-nonanediol, 3,6-nonanediol, 2,5-nonanediol, 7-methyl-1,4-octanediol, 2-pentyl-1,4-butanediol, 2-ethyl-1,4-heptanediol, 6,6-dimethyl-1,4-heptanediol, 4,7-decanediol, 6-methyl-1,4-octanediol, and 2-(3-methylbutyl)-1,4-butanediol. These can be derived from diols such as 1,4-decanediol, 3,6-decanediol, 2,5-decanediol, 2-hexyl-1,4-butanediol, 2,6-dimethyl-1,4-heptanediol, 1,4-undecanediol, 8-methyl-1,4-nonanediol, 2,5-undecanediol, 2-heptyl-1,4-butanediol, and 7-ethyl-1,4-nonanediol. In various embodiments, in the diol compounds of formula (1), Ra is a C1-C8 alkyl group (such as methyl or ethyl, or a C6-C8 alkyl group), and R4, R5, and R6 are each H.

[0034] [ka] In the formula, R1, R2, n, and m are as described separately herein.

[0035] In various embodiments described separately herein, in the diol compound of formula (I), m is 1. Such compounds have general formula (I),

[0036] [ka] In the formula, R1, R2, R3, R4, R5, R6 and n are as otherwise described herein. For example, certain such compounds have the structure:

[0037] [ka] It holds.

[0038] In various embodiments described separately herein, in the diol compound of formula (I), m is 1; n is an integer 6, 7, 8, 9, or 10; and R4, R5, and R6 are independently H. In certain such embodiments, R1 is a C3-C5 alkyl group; and R5 is a C3-C5 alkyl group. In certain such embodiments, R3 is H.

[0039] For example, in various embodiments described separately herein, the compound of formula (I) has formula (II),

[0040] [ka] In the formula, Ra and Rb are each independently methyl, and Rc and Ra are each independently methyl or ethyl.

[0041] This disclosure also intends to describe dielectric compounds based on a triol core portion. Thus, in various embodiments described separately herein, in the compound of formula (I), n is 1 and R3 is R7O-(CH2)0.1- such as R7O-CH2-.

[0042] In various embodiments described separately herein, in the triol compound of formula (1), each of R4, R5, and R6 is H. Such compounds have a glycerol core. In other embodiments described separately herein, each of R4, R5, and R6 is independently H, methyl, or ethyl, for example, H or methyl.

[0043] In various embodiments described separately herein, m is 1 in the triol compound of formula (1).

[0044] In various embodiments described separately herein, in the triol compound of formula (I), m is 1; R4, R5 and R6 are independently H. In certain such embodiments, R1 is a C3-C5 alkyl; R2 is a C3-C5 alkyl; and R7 is a C3-C5 alkyl.

[0045] For example, in various embodiments as otherwise described herein, the compound of formula (I) is

[0046] [ka] It has the formula (wherein Ra, Rb, Rd, Re, Rg, and Rh are each independently methyl, and Rc, Rf, and Ri are each independently methyl or ethyl).

[0047] This disclosure also intends to describe dielectric compounds based on the tetrol core portion. Thus, in various embodiments described separately herein, in the compound of formula (I), n is 2, and one R5 and one R6 are independently R7O-(CH2)o-1- such as R7O-CH2-.

[0048] In various embodiments described separately herein, Ra and R4 of the tetrol compound of formula (I) are independently H. In other embodiments described separately herein, Ra, R4, one of R5 and one of R6 are independently H, methyl or ethyl, for example, H or methyl.

[0049] In various embodiments described separately herein, m is 1 in the tetrol compound of formula (I).

[0050] In various embodiments described separately herein, in the tetrol compound of formula (I), m is 1, and one of Ra, R4, R5, and one of R8 is independently H. In certain such embodiments, R1 is a C3-C5 alkyl, R2 is a C3-C5 alkyl, and R7 is a C3-C5 alkyl.

[0051] For example, in various embodiments described separately herein, the compound of formula (I) has formula (II),

[0052] [ka] In the formula, Ra, Rb, Rd, Re, Rg, Rh, Re, Rj, and Rk are each independently methyl, and RC, Rf, Ri, and Ri are each independently methyl or ethyl.

[0053] Those skilled in the art can select the chain length and branching of R7 based on the disclosure herein to select the overall properties of the material, such as viscosity and flash point. In various embodiments described separately herein, in the triol or tetrol compound of formula (I), R7 is a C3-C5 alkyl. In various embodiments described separately herein, in the triol or tetrol compound of formula (1), R7 is a branched C1-C5 alkyl, such as a branched C3-C5 alkyl. The branching of R7 may be, for example, at the α-position relative to the oxygen atom to which R7 is bonded. In various embodiments described separately herein, in the triol or tetrol compound of formula (1), R7 is -C(Rg)(Rn)(R), where Rg, Rh, and R are each independently methyl or ethyl.

[0054] Those skilled in the art can select the chain length and branching of R1 based on the disclosures herein to select the overall properties of the material, such as viscosity and flash point. In various embodiments described herein, in one or more dielectric compounds of formula (I), R1 is a C3-C5 alkyl. In various embodiments described herein, in one or more dielectric compounds of formula (I), R is a branched C1-C5 alkyl, such as a branched C3-C5 alkyl. The branching may be, for example, at the α-position or β-position with respect to the oxygen atom to which R1 is bonded. In various embodiments, the branching is at the α-position with respect to the oxygen atom. For example, in various embodiments described herein, in one or more dielectric compounds of formula (I), R1 is an α-branched C1-C5 alkyl, such as t-butyl or t-pentyl. In various embodiments described separately herein, in one or more dielectric compounds of formula (I), R1 is -C(Ra)(Rb)(Rc), where each of Ra, Rb, and Rc is independently methyl or ethyl.

[0055] Those skilled in the art can select the chain length and branching of R2 based on the disclosure herein to select the overall properties of the material, such as viscosity and flash point. In various embodiments separately described herein, in one or more dielectric compounds of formula (I), R2 is a C3-C5 alkyl. In various embodiments separately described herein, in one or more dielectric compounds of formula (I), R2 is a branched C1-C5 alkyl, such as a branched C3-C5 alkyl. The branching may be, for example, at the α-position or β-position. R2 is at the 3-position relative to the oxygen atom to which it is bonded. In various embodiments, the branching is at the α-position relative to the oxygen atom. For example, in various embodiments separately described herein, in one or more dielectric compounds of formula (I), R2 is an α-branched C1-C5 alkyl, such as t-butyl or t-pentyl. In various embodiments described separately herein, in one or more dielectric compounds of formula (I), R2 is -C(Rd)(Rs)(Rf), where Ra, Rb, and Rc are independently methyl or ethyl.

[0056] In various embodiments described elsewhere herein, in one or more dielectric compounds of formula (I) where R3 is R7O(CH2)o 1-, R1, R2 and R7 are the same. In various embodiments described elsewhere herein, in one or more dielectric compounds of formula (I) where one R5 and one R6 are independently R7O-(CH2)0-1-, R1, R2 and each R7 are the same.

[0057] In various embodiments described herein, R1 and R2 are different in one or more dielectric compounds of formula (I). In various embodiments described herein, R1, R2 and R7 are different in one or more dielectric compounds of formula (I) where R3 is R7O(CH2)0-1-. In various embodiments described herein, R1, R2 and each R7 are different in one or more dielectric compounds of formula (I) where one R5 and one R6 are independently RB-(CH2)o-1-.

[0058] In various embodiments described separately herein, one or more dielectric compounds of formula (I) contain a total number of carbon atoms ranging from 10 to 50 (e.g., 10 to 40, 10 to 30, 10 to 20, 16 to 50, 16 to 40, 16 to 30, 16 to 20, 18 to 50, 18 to 40, 18 to 30, 18 to 20, 20 to 50, 20 to 40, or 20 to 30). For example, in various embodiments, one or more dielectric compounds of formula (I) contain a total number of carbon atoms ranging from 12 to 22. In various embodiments, one or more dielectric compounds of formula (I) contain a total number of carbon atoms ranging from 16 to 22. In various embodiments, one or more dielectric compounds of formula (I) contain a total number of carbon atoms ranging from 14 to 20.

[0059] Examples of compounds of formula (I) as disclosed herein include, but are not limited to, the following.

[0060] [ka]

[0061] [ka]

[0062] In various embodiments, one or more dielectric compounds of formula (1) are

[0063] [ka] That is the case.

[0064] In various embodiments described separately herein, one or more dielectric compounds of the thermal management fluid have a flash point of at least 100°C as measured according to ASTM D93. The inventors have advantageously determined that the use of dielectric compounds of the present disclosure having high flash points can provide an overall thermal management fluid with a high flash point, thereby reducing the risk of ignition. In various embodiments of the thermal management fluid described separately herein, one or more dielectric compounds have a flash point of at least 110°C (e.g., at least 120°C, at least 125°C, at least 130°C, or at least 135°C) or at least 140°C (e.g., at least 145°C, at least 150°C, or at least 155°C) as measured according to ASTM D93.

[0065] The inventors have advantageously determined that one or more dielectric compounds described herein have relatively low viscosity but a reduced risk of ignition. Accordingly, in various embodiments of the thermal management fluids described herein, one or more dielectric compounds have a kinematic viscosity at 40°C in the range of 1.5 to 10 cSt, as measured according to ASTM D455, for example, 1.5 to 8 cSt, or 3 to 20 cSt, or 3 to 8 cSt, or 3 to 6 cSt, or 5 to 10 cSt, or 5 to 8 cSt, or 5 to 6 cSt, or 6 to 10 cSt, or 8 to 10 cSt. Therefore, in various embodiments of the thermal management fluid described separately herein, one or more dielectric compounds have a kinematic viscosity at 40°C in the range of 1.5 to 10 cSt, for example, 1.5 to 8 cSt, or 1.5 to 6 cSt, or 3 to 10 cSt, or 3 to 8 cSt, or 3 to 6 cSt, or 5 to 10 cSt, or 5 to 8 cSt, or 5 to 6 cSt, or 6 to 10 cSt, or 8 to 10 cSt, as measured according to ASTM D455.

[0066] Those skilled in the art will understand that various combinations of the dielectric compounds of this disclosure can be used in the thermal management fluids of this disclosure. Accordingly, the embodiments of the dielectric compounds described above can be combined in any number and any combination in the thermal management fluids of this disclosure. When two or more dielectric compounds are used in the thermal management fluid, the relative amounts of the two can be varied according to the disclosures herein, depending on the desired effect. In various embodiments, the mass ratio of the first dielectric compound to the second dielectric compound is in the range of 1:9 to 9:1 (e.g., 1:5 to 5:1, or 1:5 to 1:1, or 1:1 to 5:1).

[0067] One or more dielectric compounds may be present in varying amounts in the thermal management fluid described herein. In various embodiments described separately herein, one or more dielectric compounds are present in a total amount ranging from 1% to 100% by weight (e.g., 5% to 100% by weight, or 10% to 100% by weight, or 20% to 100%) based on the total weight of the thermal management fluid. For example, in various embodiments of thermal management fluids as otherwise described herein, one or more dielectric compounds are present in a total amount ranging from 1% to 99.9% by weight (e.g., 5% to 99.9% by weight, or 10% to 99.9% by weight, or 20% to 99.9% by weight), or 50% to 99.9% by weight, for example, 75% to 99.9% by weight, or 85% to 99.9% by weight, or 90% to 99.9% by weight, or 95% to 99.9% by weight, or 98% to 99.9% by weight, based on the total weight of the thermal management fluid. In various embodiments of the thermal management fluid described separately herein, one or more dielectric compounds are present in a total amount ranging from 1% to 99% by weight (e.g., 5% to 99% by weight, or 10% to 99% by weight, or 20% to 99% by weight), or 50% to 99% by weight, for example, 75% to 99% by weight, or 85% to 99% by weight, or 90% to 99% by weight, or 95% to 99% by weight, based on the total weight of the thermal management fluid.In various embodiments of the thermal management fluid described herein, one or more dielectric compounds are present in a total amount ranging from 1% to 85% by weight (e.g., 5% to 85% by weight, or 10% to 85% by weight, or 20% to 85% by weight), or 50% to 85% by weight, e.g., 65% to 85% by weight, or 75% to 85% by weight, based on the total weight of the thermal management fluid. Those skilled in the art will provide, based on the disclosure herein, a dielectric compound in an amount that provides the thermal management fluid with a desired high flash point in addition to any other desired properties (e.g., viscosity).

[0068] As those skilled in the art will understand, the thermal management fluids of this disclosure may also include various other components, such as those conventional in compositions for thermal management applications. For example, the thermal management fluid may further include oils, such as mineral oils, synthetic oils, or silicone oils. For example, in various embodiments, the oils are low viscosity group II, III, IV, and IV. Alternatively, it may be a V base oil as defined by the American Petroleum Institute (API Publication 1509). These are shown in Table 1. Base Oil Stock API Guidelines

[0069] [Table 1]

[0070] Group II and Group III base oils (e.g., hydrocracking and hydrotreated base oils, as well as synthetic oils, e.g., hydrocarbon oils, polyalphaolefins, alkyl aromatic compounds, and synthetic esters), and Group IV base oils (e.g., polyalphaolefins (PAO)) are well known base oils. Oils suitable for use as transformer oils may, in many embodiments, be suitable for use in the compositions, systems, and methods of the Disclosure. For example, esters also form useful base oil raw materials, including synthetic esters, as well as GTL (gas-liquid) materials, particularly those derived from hydrocarbon sources. For example, esters of dibasic acids and monoalcohols, or polyol esters of monocarboxylic acids may be useful as base stocks of the Disclosure. Bio-derived oils, such as fatty acid methyl esters, may also be useful.

[0071] In various embodiments, the thermal management fluid of the Disclosure further comprises a base oil of Group II, Group III, Group IV, or Group V. For example, in various embodiments, the thermal management fluid of the Disclosure further comprises a base oil of Group II or Group III. In certain other embodiments, the thermal management fluid of the Disclosure further comprises a Group IV base oil such as polyalphaolefin (PAO). In some other embodiments, the thermal management fluid of the Disclosure further comprises an ester base oil stock.

[0072] In various embodiments, the thermal management fluid of this disclosure further comprises one or more of the following: corrosion inhibitors, antioxidants (such as phenolic and amine antioxidants), pour point depressants, defoamers, defoamers, viscosity index modifiers, preservatives, biocides, surfactants, seal swelling additives, and combinations thereof. In various embodiments, corrosion inhibitors and antioxidants (such as phenolic and amine antioxidants) may be used. For example, antioxidants (e.g., oxidizers), pour point depressants, defoamers, defoamers, viscosity index modifiers, preservatives, biocides, surfactants, seal swelling additives, and combinations thereof may be present in an amount of up to 5.0% by weight based on the total weight of the thermal management fluid. In certain such embodiments, one or more of the following are present based on the total weight of the thermal management fluid: corrosion inhibitors, antioxidants (such as phenolic and amine antioxidants), pour point depressants, defoamers, defoamers, viscosity index modifiers, preservatives, biocides, surfactants, seal swelling additives, and combinations thereof, in amounts ranging from 0.2% to 5.0% by weight, for example, 1.0% to 2.0% by weight, or 0.2% to 1.0% by weight, or 0.2% to 0.5% by weight, or 0.05% to 0.2% by weight. In various embodiments, the thermal management fluid of the present disclosure further includes one or more flame retardants in amounts up to 20% by weight, up to 10% by weight, or up to 5% by weight, for example, based on the total weight of the thermal management fluid. However, in other embodiments, flame retardant properties are absent.

[0073] Another aspect of the present disclosure provides a method comprising bringing a thermal management fluid described herein into contact with a surface having a temperature of at least 25°C, wherein the surface is substantially in thermal communication with a heat source, and absorbing thermal energy in the thermal management fluid from the heat source through the surface.

[0074] Contact between the thermal management fluid and the surface can be dynamic or static (i.e., conductive). For example, in various embodiments, contact between the thermal management fluid and the surface can be achieved by circulating the fluid over the surface, for example, by pumping or by other means. In various embodiments, contact can also be achieved without circulation, for example, by bringing the thermal management fluid, which is a stationary fluid, into contact with the surface.

[0075] The surface temperature may vary; the thermal management fluid may be adapted for use at various temperatures. In various embodiments described separately herein, the surface temperature is in the range of 25°C to 150°C, for example, 25°C to 100°C, or 25°C to 90°C, or 25°C to 85°C, or 25°C to 80°C, or 25°C to 75°C, or 25°C to 70°C. In various embodiments described separately herein, the surface temperature is in the range of 30°C to 150°C, for example, 30°C to 100°C, or 30°C to 90°C, or 30°C to 85°C, or 30°C to 80°C, or 30°C to 75°C, or 30°C to 70°C. In various embodiments described separately herein, the surface temperature is in the range of 40°C to 150°C, for example, 50°C to 150°C, or 60°C to 150°C, or 70°C to 150°C, or 80°C to 150°C, or 90°C to 150°C, or 100°C to 150°C, or 110°C to 150°C. In various embodiments described separately herein, the surface temperature is in the range of 50°C to 150°C, for example, 50°C to 140°C, or 50°C to 130°C, or 50°C to 120°C, or 50°C to 110°C, or 50°C to 100°C, or 50°C to 90°C, or 50°C to 80°C. In various embodiments (and at specific times during the operation of the device or system), the surface temperature is below the boiling point of one or more dielectric compounds of formula (I) of the thermal management system. In various embodiments, through contact, each of the one or more dielectric compounds of formula (I) does not reach its boiling point.

[0076] Embodiments of the method of the present disclosure are shown with reference to Figure 1. 1. A thermal management circuit 100 is shown in a schematic side cross-sectional view of Figure 1. The thermal management circuit 100 includes a thermal management fluid 120 that circulates through the circuit and passes over a surface 142. The temperature of the surface 142 rises compared to the temperature of the thermal management fluid 120. As a result, thermal energy is absorbed from the surface 142 into the thermal management fluid 120.

[0077] In various embodiments, as otherwise described herein, the method includes generating thermal energy by operating electrical components. For example, a thermal management circuit 100 is associated with an electrical component 140 that generates heat during operation. In various embodiments, heat is generated as an element of charging and discharging of electrical components. As will be understood by those skilled in the art, inefficiencies in the operation of electrical components and resistance of circuits generate heat as current passes through the circuits and elements of the electrical components. For example, heat from the operation of electrical component 140 raises the temperature of the surface 142, resulting in the transfer of thermal energy to the thermal management fluid 120. In other embodiments, thermal energy is generated by chemical reactions, such as exothermic reactions, or by friction. In yet another embodiment, the thermal management fluid is cooled and absorbs thermal energy from its surface at ambient temperature or slightly higher.

[0078] In various embodiments as otherwise described herein, the electrical component includes a battery system, capacitors, inverters, electrical cables, fuel cells, motors, or computers. For example, in various embodiments, the electrical component is a battery system comprising one or more electrochemical cells arranged in a housing. In other embodiments, the electrical component is one or more capacitors, such as electrolytic capacitors or electric double-layer capacitors, e.g., supercapacitors. In yet another embodiment, the electrical component is one or more fuel cells, such as polymer electrolyte membrane fuel cells, direct methanol fuel cells, alkaline fuel cells, phosphoric acid fuel cells, molten carbonate fuel cells, solid oxide fuel cells, or reversible fuel cells. In various embodiments, the electrical component is an electric motor. In other embodiments, the electrical component is a computer, e.g., a personal computer or server. Furthermore, in yet another embodiment, the electrical component is a high-power charging device.

[0079] The electrical components of the present invention can operate on direct current (DC) or alternating current (AC). In various embodiments as separately described herein, the electrical components operate on DC or AC voltages greater than 48 V. In various embodiments as separately described herein, the electrical components operate on DC or AC voltages greater than 100 V, greater than 200 V, or greater than 300 V.

[0080] In various embodiments as otherwise described herein, the surface is the surface of an electrical component. For example, in Figure 1, the housing 150 of the electrical component 140 includes a reservoir of thermal management fluid 120. Elements of the electrical component, including certain circuits that generate heat, are immersed in the thermal management fluid 120, and the thermal management fluid directly absorbs thermal energy from the outer surface 142 of the electrical component 140.

[0081] In various embodiments described elsewhere in this specification, the surface is the inner surface of the conduit. For example, Figure 2 shows a thermal management circuit 200 including an electrical component 240 comprising a plurality of individual units 244. In particular, the electrical component 240 is a battery comprising a plurality of electrochemical cells 244. The electrical component 240 further includes a conduit 246 extending between the electrochemical cells 244 through the interior of the electrical component. When the electrical component generates thermal energy, the inner surface 242 of the conduit 246 is heated, and the thermal energy is absorbed by the thermal management fluid 220.

[0082] In various embodiments as otherwise described herein, the conduits pass through a housing surrounding electrical components. For example, a conduit 246 in a thermal management circuit 200 extends through an opening 252 in a housing 250 surrounding electrical components 240, thereby allowing the thermal management fluid 220 to be delivered to other elements of the thermal management circuit 200.

[0083] Another aspect of the present disclosure provides a battery system comprising a housing, one or more electrochemical cells disposed within the housing, a fluid path extending through the housing and substantially in thermal communication with one or more electrochemical cells, and a thermal management fluid disposed within the fluid path according to any of the embodiments described above. For example, the thermal management circuit 200 in Figure 2 includes a battery system 210. The battery system includes a plurality of electrochemical cells 244 disposed inside a housing 250. A conduit 246 forms a fluid path extending through the housing. A thermal management fluid 220 disposed within the conduit 246 is thereby arranged to be in thermal communication with the electrochemical cells 244. When the electrochemical cells 244 charge and discharge, they generate heat, which is absorbed by the thermal management fluid 220. In various embodiments, the electrochemical cells undergo rapid charging, which generates a large amount of heat. The high thermal capacity of the thermal management fluid allows it to absorb this large amount of heat as soon as it is generated.

[0084] In various embodiments as otherwise described herein, the fluid path is at least partially defined by a cavity in the housing. For example, in various embodiments, at least a portion of the fluid path is formed between the electrochemical cell and the inner wall of the housing, as is the fluid path 122 within component 140.

[0085] In various embodiments as otherwise described herein, the fluid path is at least partially defined by at least one conduit located within the housing. For example, in the battery system 210, conduit 246 provides a fluid path 222 through the housing 250.

[0086] In various embodiments described separately herein, the electrochemical cell is a lithium-ion electrochemical cell. In other embodiments, the electrochemical cell is a solid cell, a lithium sulfur cell, a lithium iron phosphate cell, a lithium-ion polymer cell, a sodium ion cell, an aluminum ion cell, a lead acid cell, or a magnesium ion cell.

[0087] In various embodiments as otherwise described herein, the battery system is a component of an electric vehicle. In some embodiments, the electric vehicle is a fully electric vehicle or a hybrid electric vehicle. In other embodiments, the battery system is a component of a power motor, such as an electric motor or a motor in power electronics. In other embodiments, the battery system is part of a home energy storage solution that works in conjunction with a stationary energy storage solution, such as a local renewable energy source like a solar panel or wind turbine.

[0088] Another aspect of the present disclosure provides a thermal management circuit including a fluid path extending around and / or through a heat source, and a thermal management fluid according to any of the embodiments described above, which is located within the fluid path, circulates within the fluid path, and is configured to absorb thermal energy generated by the heat source, the fluid being located within the fluid path, a heat exchanger, a pump, and a connecting duct. For example, the thermal management circuit 100 shown in Figure 1 includes a fluid path 122 extending around an electrical component 140. The thermal management fluid 120 flows through the path 122 and absorbs thermal energy from the electronic component 140. From the fluid path 122, the thermal management fluid 120 flows through a first duct 130 to a heat exchanger 160. The thermal energy stored in the thermal management fluid 120 is removed from the fluid in the heat exchanger 160 before the fluid flows through the second duct 132 to the pump 170. After the pump 170, the thermal management fluid 120 passes through the third duct 134 and returns to the fluid path 122 surrounding the electrical components 140. The circuit 100 shown in Figure 1 is a schematic diagram of a simple embodiment using the described thermal management fluid. In other embodiments, the thermal management circuit includes additional elements such as valves, pumps, heat exchangers, reservoirs, and any combination of ducts.

[0089] In various embodiments as otherwise described herein, the heat source is a battery comprising a plurality of electrochemical cells, and the fluid path passes between at least two of the electrochemical cells.

[0090] In various embodiments, as otherwise described herein, the fluid path is defined by a housing surrounding an electrical component. For example, the housing 150 in Figure 1 surrounds an electrical component 140 and provides a cavity for a thermal management fluid 120. The electrical component 140 is held within the housing at a certain distance from the walls of the housing 150, thereby enabling the formation of a path for the thermal management fluid 120 between the housing 150 and the electrical component 140. The housing 150 has a closed shape with a specific opening 152 that provides access for the thermal management fluid 120, but in other embodiments, the top of the housing is open and the thermal management fluid is held within the housing by gravity.

[0091] In various embodiments as otherwise described herein, the fluid path is configured to place a thermal management fluid that is substantially in thermal communication with the electrical components so as to absorb the thermal energy generated by the electrical components. For example, in thermal management circuit 100, the fluid path 122 extends around an electrical component 140 and is in direct contact with the surface of the electrical component 140. Furthermore, in thermal management circuit 200, the fluid path 222 passes through a conduit 246 that extends adjacent to an element of the electrical component 240. In both cases, the fluid path is configured to place the thermal management fluid in close proximity to the electrical components so that the thermal management fluid can easily absorb thermal energy from the components.

[0092] In various embodiments as otherwise described herein, the thermal management circuit further includes a fluid path and a heat exchanger in fluid communication, wherein the thermal management fluid is configured to circulate between the fluid path and the heat exchanger to dissipate heat through the heat exchanger. In various embodiments as otherwise described herein, the heat exchanger is configured to remove heat from the thermal management fluid, for example, in thermal management circuit 100. After the thermal management fluid 120 is pumped out of the housing 150, the thermal management fluid proceeds to the heat exchanger 160, where the thermal energy is transferred to a cooler fluid such as ambient air or a coolant.

[0093] In various embodiments described separately herein, the thermal management circuit includes a battery system according to any of the embodiments described above. For example, thermal management circuit 200 includes a battery system 210. In various embodiments described separately herein, the thermal management circuit includes a fixed desiccant material arranged according to any of the embodiments described above. For example, thermal management circuit 300 includes a battery desiccant material 360.

[0094] The details shown herein are, for illustrative purposes only, for the purpose of illustrating various embodiments of the invention and are presented to provide what is considered to be the most useful and readily understandable explanation of the principles and conceptual aspects of various embodiments of the invention. In this regard, no attempt has been made to show structural details of the invention in more detail than is necessary for a basic understanding of the invention, and the explanations provided with the drawings and / or examples will make it clear to those skilled in the art how some forms of the invention can actually be embodied. Therefore, before the processes and devices disclosed are described, it should be understood that the aspects described herein are not limited to specific embodiments, apparatus, or configurations, and are therefore naturally subject to change. It should also be understood that the terms used herein are intended solely to describe specific embodiments and are not intended to limit them unless specifically defined herein.

[0095] In the context describing the present invention (particularly in the context of the following embodiments and claims), the terms “a,” “an,” “the,” and similar reference subjects should be interpreted as encompassing both singular and plural unless otherwise indicated herein or unless the context clearly contradicts this interpretation.

[0096] As used herein, the term “alkyl” means a linear or branched hydrocarbon containing 1 to 12 carbon atoms, unless otherwise specified. Representative examples of alkyls include, but are not limited to, methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, isobutyl, tert-butyl, n-pentyl, isopentyl, neopentyl, n-hexyl, 3-methylhexyl, 2,2-dimethylpentyl, 2,3-dimethylpentyl, n-heptyl, n-octyl, n-nonyl, and n-decyl. When the “alkyl” group is a linking group between two other parts, it may be linear or branched; examples include, but are not limited to, -CH2-, -CH2CH2-, -CH2CH2CHC(CH3)-, and -CH2CH(CH2CH3)CH2-.

[0097] All methods described herein may be carried out in any preferred order of steps, unless otherwise indicated herein or unless the context clearly contradicts it. Any and all examples or exemplary language provided herein (e.g., "etc.") are intended solely to better illustrate the invention and not to impose any limitation on the scope of the claimed invention. No language herein should be construed as indicating any unclaimed element essential to the practice of the invention.

[0098] Unless the context clearly indicates otherwise, throughout this specification and the claims, words such as “comprise,” “comprising,” and similar terms should be interpreted in a comprehensive sense, as opposed to an exclusive or exhaustive sense; that is, “includes, but not limited to.” Words used in the singular or plural also include the plural and singular forms, respectively. Furthermore, the words “in this specification,” “above,” and “below,” and words of similar meaning, when used in this application, refer to the entire application and not to any particular part thereof.

[0099] As those skilled in the art will understand, each embodiment disclosed herein includes, essentially consists of, or may consist of, the specific described elements, steps, components, or constituents. Where used herein, the transitional clauses “comprise” or “comprises” mean “include,” but are not limited to, and allow for the inclusion of unspecified elements, steps, components, or constituents, even in large numbers. The transitional clause “consists of” excludes any unspecified elements, steps, components, or constituents. The transitional clause “essentially consists of” limits the scope of the embodiment to specific elements, steps, components, or constituents, and those that do not substantially affect the embodiment.

[0100] All percentages, ratios, and proportions in this specification are given by weight unless otherwise specified.

[0101] While the numerical ranges and parameters representing the broad scope of this disclosure are approximations, the numerical values ​​shown in specific examples are reported as accurately as possible. However, each numerical value inherently contains a certain degree of error that inevitably arises from the standard deviation found in their respective test measurements.

[0102] The grouping of alternative elements or embodiments of this disclosure should not be construed as limiting. Each member of each group may be referred to and claimed individually or in any combination with other members of the group or other elements found herein. It is anticipated that one or more members of a group may be included in or excluded from a group for convenience and / or patentability reasons. In the event of any such inclusion or exclusion, this specification shall be deemed to include the modified groups and thus satisfy the described descriptions of all Markush groups used in the appended claims.

[0103] Several embodiments of various aspects of this disclosure are described herein, including the best mode known to the inventors for carrying out the methods described herein. Naturally, variations of these described embodiments will be apparent to those skilled in the art by reading the foregoing description. Those skilled in the art will use such variations as appropriate, and therefore the methods of this disclosure can be carried out in ways other than those specifically described herein. Accordingly, the scope of this disclosure includes all modifications and equivalents of the subject matter described in the claims appended herein, as permitted by applicable law. Furthermore Unless otherwise indicated herein, or unless the context clearly contradicts it, the elements described above are encompassed by this disclosure in all possible forms thereof. Examples

[0104] The methods of this disclosure are further illustrated by the following examples, which should not be construed as limiting the scope or spirit of this disclosure to the specific procedures and compounds described therein. Preparation of the dielectric compound of formula (1)

[0105] The compounds of this disclosure can be readily prepared from inexpensive starting materials such as diols (e.g., 1,8-octanediol), triols (e.g., glycerol), and tetrols (pentaerythritol), as shown in Scheme 1. Scheme 1

[0106] [ka] Here, R3 to R6, m and n are as defined herein, R is R1 or R2 as defined herein, and L is a leaving group. Example 1

[0107] [ka]

[0108] Decane-1,10-diol (200 g, 1.15 mol, 1.0 equivalent) was placed in a 10 L jacketed vessel (equipped with a temperature probe, condenser, addition funnel, and argon line) purged with argon. SiO (1.4 L, 7.0 vol) was added, and the mixture was stirred while heating to 60°C. Meanwhile, BocO (1.76 kg, 8.03 mol, 7.0 equivalent) was added to a 5 L round-bottom flask, followed by SiO (1.2 L, 6.0 vol), and the mixture was stirred at room temperature until completely dissolved. Mg(ClO4)2 (14.2 g, 115 mmol, 0.1 equivalent) was added to the decane-1,10-diol solution in the reaction vessel, followed by the slow addition of the BocO solution over 4.5 hours. Vigorous carbon dioxide release was observed, and the vessel was carefully evacuated. The reaction mixture was heated overnight at 60°C. GC analysis of the aliquots revealed 1,10-diol (trace amount), monoether (10%), product (69%), and higher boiling point impurities (20%). The reaction mixture was cooled to room temperature and concentrated in a rotary evaporator (40°C, 170 mbar~20 mbar) to obtain 400 g of clear oil. This was diluted with heptane (1 L) and washed with HaO(H)2. A solution of dodecane-1,12-diol (1 g), HClO4 (0.005 equivalents), and t-butyl pivalate (12.5 vol) was sealed in a reaction vial and stirred at 30°C for 72 hours. The reaction mixture was washed with monoether (2%), diether product (2 × 100 mL), and brine (100 mL) by GC analysis and concentrated to obtain 380 g of a clear oily substance containing 80% dialkylation product. This substance was purified by passing it through a silica plug and moistened with heptane. The column was flushed with heptane and several-fold volumes of siRNA / heptane containing 1%, 2%, 5%, and 20% siRNA. The combined fractions were concentrated to obtain 323 g of a clear oily substance containing monoether (3%) and diether product (95%). The mixture was purified by fractional distillation, yielding 367 g (74%) of the product, which was then analyzed by GC to obtain oil with a purity of over 98%. ¹H-NMR (400 MHz, CDCl3): δ3.35 (4H, t, CH2O), 1.50 (4H, m, CH2CH2O), 1.27 (12H, m, CH2), 1.17 (18H, s, CHa). ¹³C-NMR (400 MHz, CDCl3): δ72.47, 61.75, 30.81, 29.66, 29.61, 27.67, 26.33. Example 2-1

[0109] [ka]

[0110] A solution of dodecane-1,12-diol (1 g), HClO 4 (0.005 equivalents), and tert-butyl acetate (12.5 vol) was sealed in a reaction vial and stirred at 30°C for 24 hours. GO analysis of the reaction mixture identified monoether (2.4%), diether product (74.7%), and bisacetate (20.3%) as a by-product. The reaction was quenched with Na2CO3, filtered, and the resulting oil was refluxed in a solution of NaOH in aqueous methanol to separate the organic phase. The product was isolated by distillation to a purity of more than 98%. ¹H-NMR (400 MHz, CDCl3): δ 3.34 (4H, t, CH2O), 1.51 (4H, m, CH2CH2O), 1.27-1.29 (14H, m, CH2), 1.16 (18H, s, CH3). 13C-NMR (400 MHz, CDCl3): δ72.29, 62.01, 30.19, 29.8, 29.82, 27.75, 26.75. Example 2-2

[0111] [ka]

[0112] A solution of dodecane-1,12-diol (1 g), HClO4 (0.005 equivalents), and t-butyl pivalate (12.5 vols) was sealed in a reaction vial and stirred at 30°C for 72 hours. GC analysis of the reaction mixture revealed monoether (2%), diether product (89%), and higher boiling point product (7.4%). The reaction was quenched with NazCO3, filtered, and the product was isolated by distillation to a purity of over 98%. Example 3

[0113] Table 2 provides some dielectric compounds of this disclosure and their modeled physical properties.

[0114] [Table 2]

[0115] [Table 3]

[0116] In addition to the values ​​mentioned above, 1,10-di-tert-butoxidedecane was also estimated to have a flash point of 156°C.

[0117] Other aspects of this disclosure are described with respect to the embodiments listed below, which may be combined in any form and in any number that are not technically or logically inconsistent.

[0118] Embodiment 1 relates to a thermal management fluid comprising one or more dielectric compounds of formula (I).

[0119] [ka] n is an integer 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, or 12; m is an integer, either 1, 2, or 3; R1 is a C1-C5 alkyl group; R2 is a C1-C5 alkyl group; Each of R3, R4, R5, and R6 is independently selected from H, C1-C8 alkyl, and R7O-(CH2)oi-, where R7 is a C1-C5 alkyl. However, two or fewer of R3, R4, R5, and R6 are R7O-(CH2)0.1-; The one or more dielectric compounds are present in a total amount ranging from 1% by weight to 100% by weight, based on the total weight of the thermal management fluid. The thermal management fluid is a thermal management fluid having a flash point of at least 100°C as measured according to ASTM D93, and having a dielectric constant of at least 1.5 at 25°C.

[0120] Embodiment 2 relates to the thermal management fluid of Embodiment 1, wherein each of one or more compounds contains a total number of carbon atoms of 10 to 50 (for example, 10 to 40, 10 to 30, 10 to 20, 16 to 50, 16 to 40, 16 to 30, 16 to 20, 18 to 50, 18 to 40, 18 to 30, 18 to 22, 18 to 20, 20 to 50, 20 to 40, or 20 to 30).

[0121] Embodiment 3 relates to the thermal management fluid of Embodiment 1, and each of the one or more compounds contains a total of 12 to 22 carbon atoms.

[0122] Embodiment 4 relates to any of Embodiments 1 to 3, wherein n is an integer in the range of 5 to 12 (e.g., 5 to 10 or 5 to 8) and Ra is H or C1 to C6 alkyl (e.g., C1 to C6 alkyl).

[0123] Embodiment 5 relates to the thermal management fluid of Embodiment 4, wherein n is an integer in the range of 6 to 12, for example, 6 to 10 or 6 to 8, or an integer in the range of 8 to 12, for example, 8 to 10.

[0124] Embodiment 6 relates to the thermal management fluid of Embodiment 4 or Embodiment 5, wherein Ra is H.

[0125] Embodiment 7 relates to the thermal management fluid of Embodiment 4 or Embodiment 5, wherein R3 is methyl or ethyl.

[0126] Embodiment 8 relates to a thermal management fluid according to any of Embodiments 1 to 3, wherein n is an integer in the range of 1 to 4 (e.g., 1 or 2, or 1 to 3), and R3 is H or C1 to C8 alkyl (e.g., C4 to C8 alkyl, or C5 to C8 alkyl, or C6 to C8 alkyl).

[0127] Embodiment 9 relates to a thermal management fluid according to any of Embodiments 4 to 8, wherein R4, R5, and R6 are each H.

[0128] Embodiment 10 relates to any of the thermal management fluids of Embodiments 4 to 9, wherein R3, R4, R5, and R6 are each H, i.e., the compound has formula (II).

[0129] [ka]

[0130] Embodiment 11 is a thermal management fluid of any of Embodiments 4 to 9, in which R4, R5, and R6 are each H, and Ra is C1-C8 alkyl (methyl or ethyl, or C6-C8 alkyl, etc.), i.e., the compound has formula (I).

[0131] [ka]

[0132] Embodiment 12 relates to any of the thermal management fluids of Embodiments 4 to 11, where m is 1, i.e., one or more dielectric compounds have formula (III).

[0133] [ka]

[0134] Embodiment 13 applies the thermal management fluid of Embodiment 12, and the formula is:

[0135] [ka] It holds.

[0136] Embodiment 14 relates to the thermal management fluids of Embodiments 4-7, where m is 1, n is an integer of 6, 7, 8, 9, or 10, and R4, R5, and R6 are independently H.

[0137] Embodiment 15 applies to the thermal management fluid of Embodiment 14, wherein R1 is a C3-C5 alkyl group and R2 is a C3-C5 alkyl group.

[0138] Embodiment 16 relates to a thermal management fluid of Embodiment 14 or Embodiment 15, wherein Ra is H.

[0139] Embodiment 17 relates to any of the thermal management fluids of Embodiments 1 to 6, wherein one or more compounds of formula (I) have formula (II).

[0140] [ka] In the formula, Ra and Rb are each independently methyl, and Rc and Rd are each independently methyl or ethyl.

[0141] Embodiment 18 relates to a thermal management fluid of any of Embodiments 1 to 3, wherein n is 1 and Ra is R7O-(CH2)0-1- such as R7O-CH2-.

[0142] Embodiment 19 applies to the thermal management fluid of Embodiment 18, wherein R4, R5, and R6 are each H.

[0143] Embodiment 20 relates to the thermal management fluid of Embodiment 18 or 20, wherein m is 1.

[0144] Embodiment 21 relates to the thermal management fluid described in Embodiment 18, wherein m is 1 and R4, R5, and R6 are independently H.

[0145] Embodiment 22 applies to the thermal management fluid of Embodiment 21, wherein R1 is a C3-C5 alkyl, R2 is a C3-C5 alkyl, and R7 is a C3-C5 alkyl.

[0146] Embodiment 23 relates to a thermal management fluid according to any of Embodiments 1 to 3, wherein n is 2, and one R8 and one R6 are independently R7O-(CH2)O-1- such as R7OCH2-.

[0147] Embodiment 24 applies to the thermal management fluid of Embodiment 23, wherein Ra and R4 are both H.

[0148] Embodiment 25 relates to the thermal management fluid described in Embodiment 23 or 24, wherein m is 1.

[0149] Embodiment 26 relates to the thermal management fluid of Embodiment 23, where m is 1 and one of R3, R4, R5, and one of R6 are independently H.

[0150] Embodiment 27 relates to the thermal management fluid of Embodiment 26, wherein R1 is a C3-C5 alkyl group; R2 is a C3-C5 alkyl group; and R7 is a C3-C5 alkyl group.

[0151] Embodiment 28 applies to any of the thermal management fluids of Embodiments 18 to 27, wherein R7 is a C3-C5 alkyl group.

[0152] Embodiment 29 applies to any of the thermal management fluids of Embodiments 18 to 27, wherein R7 is a branched C1 to C5 alkyl such as a branched C3 to C5 alkyl.

[0153] Embodiment 30 relates to the thermal management fluid of Embodiment 29, wherein the branching of R7 is located at the α-position relative to the oxygen atom to which R7 is bonded.

[0154] Embodiment 31 relates to a thermal management fluid according to any one of Embodiments 18 to 27, wherein R7 is -C(Rg)x(R'')(R''), and each of Rg, Rh, and Ri is independently methyl or ethyl.

[0155] Embodiment 32 relates to any of the thermal management fluids of Embodiments 1 to 3, wherein one or more compounds of formula (I) have formula (II).

[0156] [ka] In the formula, Ra, Rb, Rd, Re, Rg, and Rh are each independently methyl, and Rc, Rf, and Ri are each independently methyl or ethyl.

[0157] Embodiment 33 relates to a thermal management fluid according to any of Embodiments 1 to 33. The method according to any one of claims 1 to 3, wherein one or more compounds of formula (I) have formula (III).

[0158] [ka] In the formula, Ra, Rb, Rd, Re, Rg, Rh, Re, Ri, and Rk are each independently methyl, and RC, Rf, Ri, and Rl are each independently methyl or ethyl.

[0159] Embodiment 34 relates to a thermal management fluid according to any of Embodiments 1-14, 16, 18-21, 23-26, and 28-31, wherein R1 is a C3-C5 alkyl group.

[0160] Embodiment 35 relates to a thermal management fluid according to any of Embodiments 1-14, 16, 18-21, 23, 26, and 28-31, wherein R1 is a branched C1-C5 alkyl such as a branched C3-C5 alkyl.

[0161] Embodiment 36 relates to the thermal management fluid of Embodiment 35, wherein the branching of R1 is located at the α-position relative to the oxygen atom to which R1 is bonded.

[0162] Embodiment 37 relates to a thermal management fluid according to any of Embodiments 1-14, 16, 18-21, 23-26, and 28-31, wherein R1 is -C(Ra)(Rb)(Rc), and each of Ra, Rb, and RC is independently methyl or ethyl.

[0163] Embodiment 38 relates to a thermal management fluid according to any of Embodiments 1-14, 16, 18-21, 23-26, and 28-37, wherein R2 is a C3-C5 alkyl group.

[0164] Embodiment 39 applies to any of Embodiments 1 to 14, 16, 18, 21, 23 to 26, and 28 to 37, wherein R2 is a branched C1 to C5 alkyl such as a branched C3 to C5 alkyl.

[0165] Embodiment 40 applies to the thermal management fluid of Embodiment 39, wherein the branching of R2 is located at the α position relative to the oxygen atom to which R2 is bonded.

[0166] Embodiment 41 relates to a thermal management fluid according to any of Embodiments 1-14, 16, 18-21, 23-26, and 28-37, wherein R2 is -C(Rd)(Re)(Rf), and each of Rd, Re, and R is independently methyl or ethyl.

[0167] Embodiment 42 applies to the thermal management fluid of Embodiment 1. The one or more dielectric compounds

[0168] [ka]

[0169] [ka]

[0170] Embodiment 43 applies to the thermal management fluid of Embodiment 1. The dielectric compound

[0171] [ka] That is the case.

[0172] Embodiment 44 relates to a thermal management fluid of any of Embodiments 1 to 43. The method according to claim 1, wherein the one or more dielectric compounds have a flash point of at least 100°C, for example, at least 110°C (e.g., at least 120°C, 125°C, 130°C, or 135°C), or at least 140°C (e.g., at least 145°C, 150°C, or 155°C), as measured according to ASTM D93.

[0173] Embodiment 45 relates to a thermal management fluid according to any of Embodiments 1 to 44, wherein one or more dielectric compounds have a kinematic viscosity at 40°C in the range of 1.5 to 20 cSt, for example, 1.5 to 15 cSt, or 3 to 20 cSt, or 3 to 15 cSt, or 5 to 20 cSt, or 5 to 15 cSt, as measured according to ASTM D455.

[0174] Embodiment 46 relates to any of the thermal management fluids of Embodiments 1 to 44, wherein one or more dielectric compounds have a kinematic viscosity at 40°C in the range of 1.5 to 10 cSt, for example, 1.5 to 8 cSt, or 1.5 to 6 cSt, or 3 to 10 cSt, or 3 to 8 cSt, or 3 to 6 cSt, or 5 to 10 cSt, or 5 to 8 cSt, or 5 to 6 cSt, or 6 to 10 cSt, or 8 to 10 cSt, as measured according to ASTM D455.

[0175] Embodiment 47 relates to a thermal management fluid according to any one of Embodiments 1 to 44, wherein one or more dielectric compounds have a kinematic viscosity at 40°C in the range of 1.5 to 5 cSt, or 1.5 to 4 cSt, or 1.5 to 3 cSt, or 3 to 5 cSt, or 3 to 4 cSt, or 4 to 5 cSt, as measured according to ASTM D455.

[0176] Embodiment 48 relates to a thermal management fluid according to any one of Embodiments 1 to 47, wherein one or more dielectric compounds are present in an amount ranging from 5% to 100% by weight, or 10% to 100% by weight, or 20% to 100% by weight, based on the total weight of the thermal management fluid.

[0177] Embodiment 49 relates to a thermal management fluid according to any of Embodiments 1 to 47, wherein one or more dielectric compounds are present in an amount ranging from 50% to 100% by weight, for example, 75% to 100% by weight, or 85% to 100% by weight, or 90% to 100% by weight, or 95% to 100% by weight, or 98% to 100% by weight, based on the total weight of the thermal management fluid.

[0178] Embodiment 50 relates to a thermal management fluid according to any one of Embodiments 1 to 47, wherein one or more dielectric compounds are present in an amount ranging from 1% to 99.9% by weight (e.g., 5% to 99.9% by weight, or 10% to 99.9% by weight, or 20% to 99.9% by weight), or 50% to 99.9% by weight, for example, 75% to 99.9% by weight, or 85% to 99.9% by weight, or 90% to 99.9% by weight, or 95% to 99.9% by weight, or 98% to 99.9% by weight, based on the total weight of the thermal management fluid.

[0179] Embodiment 51 relates to a thermal management fluid according to any one of Embodiments 1 to 47, wherein one or more dielectric compounds are present in an amount ranging from 1% to 99% by weight (e.g., 5% to 99% by weight, or 10% to 99% by weight, or 20% to 99% by weight), or 50% to 99% by weight, for example, 80% to 99% by weight, or 85% to 99% by weight, or 90% to 99% by weight, or 95% to 99% by weight, based on the total weight of the thermal management fluid.

[0180] Embodiment 52 relates to any of the thermal management fluids of Embodiments 1 to 47, wherein one or more dielectric compounds are present in an amount ranging from 1% to 95% by weight (e.g., 5% to 95% by weight, or 10% to 95% by weight, or 20% to 95%), or 50% to 95% by weight, e.g., 75% to 95%, or 85% to 95%, based on the total weight of the thermal management fluid; or 1% to 85% by weight (e.g., 5% to 85%, or 10% to 85%, or 20% to 85%), or 50% to 85%, e.g., 65% to 85%, or 75% to 85%).

[0181] Embodiment 53 relates to any of the thermal management fluids of Embodiments 1 to 52 and further comprises a base oil of Group II, Group III, Group IV, or Group V.

[0182] Embodiment 54 relates to any of the thermal management fluids of Embodiments 1 to 52 and further comprises a base oil of Group II or Group III.

[0183] Embodiment 55 is a thermal management fluid of any of Embodiments 1 to 52, and further comprises a Group IV base oil (such as polyalphaolefin (PAO)).

[0184] Embodiment 56 relates to a thermal management fluid according to any one of Embodiments 1 to 52, further comprising an ester base oil stock.

[0185] Embodiment 57 relates to a thermal management fluid according to any of Embodiments 1 to 56, further comprising, for example, up to 0.5% by weight, up to 1.0% by weight, or up to 5.0% by weight, one or more of the following: corrosion inhibitors, antioxidants (such as phenolic and amine-based antioxidants), pour point depressants, defoaming agents, viscosity index modifiers, preservatives, biocides, surfactants, seal swelling additives, flame retardants, and combinations thereof, in amounts up to 0.5% by weight, up to 1.0% by weight, or up to 5.0% by weight.

[0186] Embodiment 58 relates to a thermal management fluid according to any of Embodiments 1 to 57, further comprising one or more flame retardants in amounts, for example, up to 20% by weight, up to 10% by weight, or up to 5% by weight.

[0187] Embodiment 59 relates to any of the thermal management fluids of Embodiments 1 to 58, wherein the thermal management fluid has a flash point of at least 110°C, for example, at least 120°C, at least 125°C, at least 130°C, or at least 135°C, as measured according to ASTM D93.

[0188] Embodiment 60 relates to any of the thermal management fluids of Embodiments 1 to 58, wherein the thermal management fluid has a flash point of at least 140°C, for example, at least 145°C, at least 150°C, or at least 150°C, as measured according to ASTM D93.

[0189] Embodiment 61 relates to a thermal management fluid according to any of Embodiments 1 to 60, having a kinematic viscosity in the range of 1.5 to 20 cSt at 40°C, for example, 1.5 to 15 cSt, or 3 to 20 cSt, or 3 to 15 cSt, or 5 to 20 cSt, when measured according to ASTM D455.

[0190] Embodiment 62 relates to any of Embodiments 1 to 60 having a kinematic viscosity in the range of 1.5 to 10 cSt at 40°C, for example, 1.5 to 8 cSt, or 1.5 to 6 cSt, or 3 to 10 cSt, or 3 to 8 cSt, or 3 to 6 cSt, or 5 to 10 cSt, or 5 to 8 cSt, or 5 to 6 cSt, or 6 to 10 cSt, or 8 to 10 cSt, when measured according to ASTM D455.

[0191] Embodiment 63 relates to a thermal management fluid according to any of Embodiments 1 to 60, having a kinematic viscosity in the range of 1.5 to 5 cSt, or 1.5 to 4 cSt, or 1.5 to 3 cSt, or 3 to 5 cSt, or 3 to 4 cSt, or 4 to 5 cSt, when measured according to ASTM D455, at 40°C.

[0192] Embodiment 64 relates to a thermal management fluid according to any of Embodiments 1 to 63, having a dielectric constant of at least 1.75, for example, at least 2.0, or at least 2.25 when measured at 25°C.

[0193] Embodiment 65 relates to a thermal management fluid according to any of Embodiments 1 to 63, having a dielectric constant in the range of 1.5 to 10, or 1.8 to 10, or 1.5 to 2.8, or 1.8 to 2.8.

[0194] Embodiment 66 applies to any of Embodiments 1 to 65, having a density of 1.1 g / cm³ or less at 25°C (for example, 1 g / cm³ or less at 25°C).

[0195] Embodiment 67 applies to any of Embodiments 1 to 66, having a thermal conductivity in the range of 0.05 W / m·K to 1 W / m·K at 25°C.

[0196] Embodiment 68 relates to a thermal management fluid according to any of Embodiments 1 to 67, having a specific heat capacity of at least 1 J / g·K (for example, at least 1.2 J / g·K or at least 1.5 J / g·K at 25°C).

[0197] Embodiment 69 relates to a thermal management fluid of any of Embodiments 1 to 68 having a thermal expansion coefficient of 1100 × 10⁻⁶ / K or less (for example, 1050 × 10⁻⁶ / K or less, or 1000 × 10⁻⁶ / K or less).

[0198] Embodiment 70 covers a method that includes the following: The thermal management fluid of Embodiments 1 to 69 is brought into contact with a surface having a temperature of at least 25°C, wherein the surface is in substantially thermal communication with a heat source. The thermal energy of the heat management fluid is absorbed from the heat source through the aforementioned surface.

[0199] Embodiment 71 relates to the method of Embodiment 70, wherein the surface has a temperature of at least 30°C, for example, at least 40°C.

[0200] Embodiment 72 relates to the method of Embodiment 70, wherein the surface has a temperature in the range of 25°C to 150°C, for example, 25°C to 100°C, or 25°C to 90°C, or 25°C to 85°C, or 25°C to 80°C, or 25°C to 75°C, or 25°C to 70°C.

[0201] Embodiment 73 relates to the method of Embodiment 70, wherein the surface has a temperature in the range of 30°C to 150°C, for example, 30°C to 100°C, or 30°C to 90°C, or 30°C to 85°C, or 30°C to 80°C, or 30°C to 75°C, or 30°C to 70°C.

[0202] Embodiment 74 relates to the method of Embodiment 70, wherein the surface has a temperature in the range of 40°C to 150°C, for example, 50°C to 150°C, or 60°C to 150°C, or 70°C to 150°C, or 80°C to 150°C, or 90°C to 150°C, or 100°C to 150°C, or 110°C to 150°C.

[0203] Embodiment 75 relates to the method of Embodiment 70, wherein the surface has a temperature in the range of 50°C to 150°C, for example, 50°C to 140°C, or 50°C to 130°C, or 50°C to 120°C, or 50°C to 110°C, or 50°C to 100°C, or 50°C to 90°C, or 50°C to 80°C.

[0204] Embodiment 76 relates to the method according to any of Embodiments 70 to 75, wherein the thermal management fluid is a mass of stationary (i.e., non-circulating) fluid.

[0205] Embodiment 77 relates to the method of any one of Embodiments 70 to 75, wherein the contact step is carried out by circulating a heat management fluid over the surface.

[0206] Embodiment 78 relates to the method of any one of Embodiments 70 to 75, wherein the contact step is performed by circulating a heat management fluid between the heat exchanger and the surface.

[0207] Embodiment 79 relates to a method according to any one of Embodiments 70 to 78, wherein the heat source is an operating electrical component.

[0208] Embodiment 80 relates to the method according to any one of Embodiments 70 to 78, wherein the heat source is a battery pack, capacitor, inverter, electrical cable, fuel cell, motor, computer, or high-power charging device.

[0209] Embodiment 81 relates to a method according to any one of Embodiments 70 to 78, wherein the heat source is an electrochemical cell.

[0210] Embodiment 82 relates to the method of Embodiment 81, wherein the electrochemical cell is selected from a solid electrochemical cell, a lithium-sulfur electrochemical cell, a lithium iron phosphate electrochemical cell, a lithium-ion polymer electrochemical cell, a sodium-ion electrochemical cell, an aluminum-ion cell, a lead-acid cell, and a magnesium-ion cell.

[0211] Embodiment 83 relates to the method according to any one of Embodiments 70 to 82, wherein the surface is the inner surface of a conduit that is substantially in thermal communication with a heat source.

[0212] Embodiment 84 relates to the method described in Embodiment 83, wherein the conduit passes through a housing surrounding an electrical component.

[0213] Embodiment 85 relates to a battery system that includes the following: Housing and One or more electrochemical cells arranged within the housing and A fluid path extending within the housing and substantially in thermal communication with one or more electrochemical cells A thermal management fluid from any of Embodiments 1 to 69 arranged in the fluid path and

[0214] Embodiment 86 relates to the battery system of Embodiment 85, wherein the electrochemical cell is a lithium-ion electrochemical cell.

[0215] Embodiment 87 relates to the battery system of Embodiment 85, and the electrochemical cell is a solid electrochemical cell, a lithium sulfur electrochemical cell, a lithium iron phosphate electrochemical cell, a lithium ion polymer electrochemical cell, a sodium ion electrochemical cell, an aluminum ion cell, a lead acid cell, or a magnesium ion cell.

[0216] Embodiment 88 relates to an electric vehicle equipped with a battery system according to any of embodiments 85 to 87.

[0217] Embodiment 89 includes a fluid path extending around and / or through the heat source. A thermal management fluid according to any one of Embodiments 1 to 69, which is disposed within the fluid path, circulates within the fluid path, and is configured to absorb thermal energy generated by the heat source, and The fluid is placed within the fluid path, the heat exchanger, the pump, and the connecting duct.

[0218] Embodiment 90 relates to a method for preparing a thermal management fluid according to any of Embodiments 1 to 69, and this method is Contact the compound of formula (II).

[0219] [ka] n is an integer 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, or 12; m is an integer, either 1, 2, or 3; Each Ra, R4, R5, and R6 is independently selected from H, C1-C6 alkyl, and RB-(CH2)0-1-, where R7 is either H or C1-C6 alkyl. However, two or fewer of R3, R4, R5, and R6 are RB-(CH2)0-1-; The method includes reacting (C1-C5 alkyl)-L (wherein L is a leaving group) with a dielectric compound of formula (I).

[0220] Embodiment 91 relates to the method of Embodiment 90, wherein the contact between the compound of formula (II) and (C1-C5 alkyl)-L is carried out in the presence of a catalyst.

[0221] Embodiment 92 relates to the method of Embodiment 90 or 91, further comprising mixing a dielectric compound in an amount ranging from 1% to 99.9% by weight based on the total weight of the thermal management fluid with one or more of the following: base oil, corrosion inhibitors, antioxidants (such as phenolic and amine-based antioxidants), pour point depressants, defoaming agents, viscosity index modifiers, preservatives, biocides, surfactants, seal swelling additives, flame retardants, and combinations thereof.

[0222] Finally, it should be understood that the various embodiments described herein are illustrative of the methods of the disclosure. Other modifications that may be adopted are within the scope of the disclosure. Therefore, alternative configurations of the methods may be used, not as an example but as an example, in accordance with the teachings herein. Therefore, the methods of this disclosure are not limited to those shown or described.

Claims

1. A thermally controlled fluid is brought into contact with a surface having a temperature of at least 25°C, and the surface is in substantially thermal communication with the heat source. A method for causing a heat-controlled fluid to absorb thermal energy from a heat source through a surface, The thermal management fluid is, It comprises one or more dielectric compounds represented by formula (I), 【Chemistry 1】 Here, n is an integer 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, or 12. R 1 C 1 ~C 5 It is alkyl, R 2 C 1 ~C 5 It is alkyl, R 3 、R 4 、R 5 、and R 6 are each independently H, C 1 to C 8 alkyl, and R 7 O-(CH 2 ) 0-1 -selected from, R 7 is C 1 to C 5 alkyl, However, R 3 , R 4 , R 5 , and R 6 Two or fewer of these are R 7 O-(CH 2 ) 0-1 -and, One or more dielectric compounds are present in a total amount ranging from 1% to 100% by weight based on the total weight of the thermally controlled fluid. The thermal control fluid is characterized by having a flash point of at least 100°C as measured according to ASTM D93, and the thermal control fluid has a dielectric constant of at least 1.5 at 25°C.

2. The method according to claim 1, wherein each of one or more compounds has a total number of carbon atoms of 10 to 50, or each of one or more compounds has a total number of carbon atoms of 12 to 22.

3. n is an integer in the range of 5 to 12, R 3 is H or C 1 ~C 8 It is alkyl, or n is an integer in the range of 1 to 4, R 3 is H or C 1 ~C 8 The method according to claim 1 or 2, wherein the alkyl group is used.

4. R 4 , R 5 , and R 6 The method according to claim 3, wherein each of the is H.

5. n is 1, R 3 is R 7 O-(CH 2 ) 0-1 - The method according to claim 1 or 2.

6. n is 2, and one R 5 and one R 6 R is independent 7 O-(CH 2 ) 0-1 - The method according to claim 1 or 2.

7. R 1 C 3 ~C 5 alkyl, or R 1 is branch C 1 ~C 5 alkyl, or R 1 is -C(Ra)(Rb)(Rc), where Ra, Rb, and Rc are independently methyl or ethyl, and / or R 2 C 3 ~C 5 alkyl, or R 2 is branch C 1 ~C 5 alkyl, or R 2 is -C(Ra)(Rb)(Rc), where Ra, Rb, and Rc are independently methyl or ethyl, and / or If present, R 7 C 3 ~C 5 alkyl, or R 7 is branch C 1 ~C 5 alkyl, or R 7 The method according to any one of claims 1 to 6, wherein is -C(Rg)(Rh)(Ri), and Rg, Rh, and Ri are each independently methyl or ethyl.

8. One or more compounds represented by formula (I) have the following formula: 【Chemistry 2】 Here, Ra and Rb are independently methyl, and Rc, Rd, Re, and Rf are independently methyl or ethyl. One or more compounds represented by formula (I) have the following formula: 【Transformation 3】 Here, Ra, Rb, Rd, Re, Rg, and Rh are each independently methyl, and Rc, Rf, and Ri are each independently methyl or ethyl, and / or One or more compounds represented by formula (I) have the following formula: 【Chemistry 4】 The method according to claim 1 or 2, wherein Ra, Rb, Rd, Re, Rg, Rh, Re, Rj, and Rk are each independently methyl, and Rc, Rf, Ri, and Rl are each independently methyl or ethyl.

9. One or more dielectric compounds, independently, 【Transformation 5】 【Transformation 6】 The method according to claim 1, selected from among.

10. The method according to any one of claims 1 to 9, wherein one or more dielectric compounds are present in an amount ranging from 50% by weight to 99.9% by weight.

11. The method according to any one of claims 1 to 10, wherein the thermally controlled fluid has a flash point of at least 100°C as measured according to ASTM D93 and a kinematic viscosity at 40°C as measured according to ASTM D455 in the range of 1.5 to 20 cSt.

12. The method according to any one of claims 1 to 11, wherein the heat source is an operating electrical component.

13. It is a battery system, Housing and One or more electrochemical cells arranged within the housing, A fluid path extending within the housing and substantially in thermal communication with one or more electrochemical cells, A thermal management fluid is placed within the fluid path, The thermal management fluid is, It comprises one or more dielectric compounds represented by formula (I), 【Transformation 7】 Here, n is an integer 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, or 12. m is an integer 1, R 1 C 1 ~C 5 It is alkyl, R 2 C 1 ~C 5 It is alkyl, R 3 , R 4 , R 5 , and R 6 These are H and C, respectively, independently. 1 ~C 8 alkyl, and R 7 O-(CH 2 ) 0-1 - Selected from, R 7 C 1 ~C 5 It is alkyl, However, R 3 , R 4 , R 5 , and R 6 Two or fewer of these are R 7 O-(CH 2 ) 0-1 -and, One or more dielectric compounds are present in a total amount ranging from 1% to 100% by weight based on the total weight of the thermally controlled fluid. A battery system in which the thermal control fluid has a flash point of at least 100°C as measured according to ASTM D93, and the thermal control fluid has a dielectric constant of at least 1.5 at 25°C.

14. It is a thermal management circuit. A fluid path extending around and / or through the heat source, The system comprises a thermal management fluid that is placed within a fluid path, circulates within the fluid path, and is configured to absorb thermal energy generated by a heat source, The fluid is located within the fluid path, heat exchanger, pump, and connecting duct. The thermal management fluid is, It comprises one or more dielectric compounds represented by formula (I), 【Transformation 8】 Here, n is an integer 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, or 12. m is an integer 1, R 1 is C 1 to C 5 alkyl, and R 2 C 1 ~C 5 It is alkyl, R 3 、R 4 、R 5 、and R 6 are each independently H, C 1 to C 8 alkyl, and R 7 O-(CH 2 ) 0-1 -selected from, R 7 is C 1 to C 5 alkyl, However, R 3 , R 4 , R 5 , and R 6 Two or fewer of these are R 7 O-(CH 2 ) 0-1 -and, One or more dielectric compounds are present in a total amount ranging from 1% to 100% by weight based on the total weight of the thermal management fluid. A thermal control fluid has a flash point of at least 100°C as measured according to ASTM D93, and the thermal control fluid has a dielectric constant of at least 1.5 at 25°C in a thermal control circuit.

15. A thermal management fluid It contains one or more dielectric compounds represented by the following formula, 【Chemistry 9】 Here, n is an integer 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, or 12. Ra and Rb are independently methyl, and Rc, Rd, Re, and Rf are independently methyl or ethyl. One or more dielectric compounds are present in a total amount ranging from 1% to 100% by weight based on the total weight of the thermally controlled fluid. The thermal control fluid is a thermal control fluid having a flash point of at least 100°C as measured according to ASTM D93, and having a dielectric constant of at least 1.5 at 25°C.

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