Mounting device and mounting method

Abstract

To provide a mounting device which can suppress the generation of a mounting failure and is in a compact, and provide a mounting method of them.SOLUTION: A mounting device 1 comprises: a first metal molding 1010 that is constructed by holding substrates SB1 and SB2 onto which electron components CH11, CH12, CH21, and CH22 are mounted; a second metal molding 20 arranged oppositely to the first metal molding 10; and a gas supply mechanism that supplies an inactive gas. The second metal molding 20 includes movable mechanisms 22A, 22B, 22C, and 22D, and elastic elements 23A, 23B, 23C, and 23D. In a state where the first metal molding 10 and the second metal molding 20 are closed in a molding, the electron components CH11, CH12, CH21, and CH22 are pressed in accordance with an elastic force of elastic elements 23A, 23B, 23C, and 23D by the movable mechanisms 22A, 22B, 22C, and 22D.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a mounting device and a mounting method.

Background Art

[0002] When mounting an electronic component on a substrate via a bonding material, a mounting device that simultaneously applies pressure to a plurality of electronic components with respect to at least one substrate is known. In such a mounting device, each of the plurality of electronic components may be individually pressurized so that mounting defects do not occur due to insufficient or excessive pressure on the electronic components caused by differences in the dimensions of the plurality of electronic components.

[0003] For example, Patent Document 1 discloses a semiconductor mounting device including a plurality of pressing blocks that individually press a plurality of semiconductor elements, a plurality of shafts for linearly moving the plurality of pressing blocks, a plurality of pressurizing blocks for pressurizing the plurality of blocks via the plurality of shafts, and an elastic body for collectively pressurizing the plurality of pressurizing blocks. Pressure by pneumatic pressure or compressed gas is supplied to a pressure valve, and the elastic body is expanded toward the plurality of pressurizing blocks to pressurize the plurality of pressurizing blocks.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, the semiconductor mounting device described in Patent Document 1 needs to include a compressor or a high-pressure tank for supplying the pressure of pneumatic pressure or compressed gas, and piping through which air or compressed gas passes. Therefore, the device may be enlarged.

[0006] The present invention has been made in view of these circumstances, and aims to provide a compact mounting device and a mounting method using the same that can suppress the occurrence of mounting defects. [Means for solving the problem]

[0007] A mounting apparatus according to one aspect of the present invention is a mounting apparatus for mounting one or more electronic components on at least one substrate, comprising: a first mold configured to hold a substrate on which electronic components are mounted; a second mold arranged opposite to the first mold; and a gas supply mechanism for supplying an inert gas to the space between the first mold and the second mold, wherein the second mold has a movable mechanism and an elastic element, and when the first mold and the second mold are closed, the electronic components are pressed by the movable mechanism in accordance with the elastic force of the elastic element.

[0008] Another aspect of the present invention relates to a mounting method using a mounting apparatus for mounting one or more electronic components on at least one substrate, comprising: providing a first mold configured to hold a substrate on which electronic components are mounted; and providing a second mold positioned opposite the first mold, wherein the second mold has a movable mechanism and an elastic element; and the mounting method further comprises: supplying an inert gas to the space between the first mold and the second mold; closing the first mold and the second mold; and, with the first mold and the second mold closed, pressurizing the electronic components by the movable mechanism in accordance with the elastic force of the elastic element. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide a compact mounting device and a mounting method using the same that can suppress the occurrence of mounting defects. [Brief explanation of the drawing]

[0010] [Figure 1] This figure shows an overall overview of the mounting device according to one embodiment of the present invention. [Figure 2] This is a flowchart showing part of the implementation method for one embodiment of the present invention. [Figure 3] This is a flowchart showing part of the implementation method for one embodiment of the present invention. [Figure 4] This graph shows the temperature profile of the implementation method according to one embodiment of the present invention. [Figure 5] This figure shows the mounting device in one step of the mounting method. [Figure 6] This figure shows the mounting device in one step of the mounting method. [Figure 7] This figure shows the mounting device in one step of the mounting method. [Figure 8] This figure shows the mounting device in one step of the mounting method. [Figure 9] This figure shows the mounting device in one step of the mounting method. [Modes for carrying out the invention]

[0011] Embodiments of the present invention are described below. In the following drawings, identical or similar components are represented by identical or similar reference numerals. The drawings are illustrative, and the dimensions, shapes, and numbers of each part are schematic; the technical scope of the present invention should not be limited to these embodiments.

[0012] <Mounting device> First, the configuration of the mounting device 1 according to one embodiment of the present invention will be described with reference to Figure 1. Figure 1 is a diagram showing an overall overview of the mounting device according to one embodiment of the present invention.

[0013] The mounting device 1 performs mounting processing on workpieces W1 and W2. Workpiece W1 includes electronic components CH11 and CH12, bonding materials SN11 and SN12, and a substrate SB1. Workpiece W2 includes electronic components CH21 and CH22, bonding materials SN21 and SN22, and a substrate SB2. Specifically, the mounting device 1 mounts electronic component CH11 to substrate SB1 via bonding material SN11, electronic component CH12 to substrate SB1 via bonding material SN12, electronic component CH21 to substrate SB2 via bonding material SN21, and electronic component CH22 to substrate SB2 via bonding material SN22. Inside the mounting device 1, workpiece W1 is positioned so that substrate SB1 faces the lower mold 10 and electronic components CH11 and CH12 face the upper mold 20, and workpiece W2 is positioned so that substrate SB2 faces the lower mold 10 and electronic components CH21 and CH22 face the upper mold 20. Before the mounting process by mounting device 1 is performed, electronic components CH11 and CH12 are placed on substrate SB1, and electronic components CH21 and CH22 are placed on substrate SB2. After the mounting process by mounting device 1 is performed, electronic components CH11 and CH12 are bonded to substrate SB1, and electronic components CH21 and CH22 are bonded to substrate SB2. In the following description, the side on which electronic components CH11, CH12, CH21, and CH22 are located will be referred to as the front surface of substrates SB1 and SB2, and the opposite side will be referred to as the back surface of substrates SB1 and SB2.

[0014] Multiple electronic components CH11, CH12, CH21, CH22 are, for example, semiconductor chips. Substrates SB1, SB2 are, but are not limited to, DBA (Direct Bonded Aluminum) substrates (high heat dissipation ceramic insulating substrates with aluminum circuits) or DBC (Direct Bonded Copper) substrates (high heat dissipation ceramic insulating substrates with copper circuits). Bonding materials SN11, SN12, SN21, SN22 are, for example, sintering materials containing silver (Ag) nanoparticles. Mounting apparatus 1 is a sintering apparatus that heats and pressurizes the bonding materials SN11, SN12, SN21, SN22 to sinter them. The heights of substrates SB1, SB2 are, for example, different from each other, but may be the same height. The heights of electronic components CH11, CH12 are, for example, different from each other, but may be the same height. The heights of electronic components CH21, CH22 are, for example, different from each other, but may be the same height. The thicknesses of the bonding materials SN11, SN12, SN21, and SN22 may be the same. Also, the number of electronic components on a single substrate is at least one, but not limited to two.

[0015] Furthermore, the mounting apparatus according to one embodiment of the present invention is not limited to a sintering apparatus as long as it pressurizes the electronic components, but may be any suitable apparatus such as a flip-chip bonder. Also, the electronic components according to one embodiment of the present invention are not limited to semiconductor chips, but may be passive elements such as resistors, inductors, capacitors and crystal oscillators, or active elements such as diodes, transistors, thyristors or operational amplifiers.

[0016] The substrate according to an embodiment of the present invention is not limited to a ceramic substrate, and may be, for example, a semiconductor substrate such as a silicon substrate, a metal substrate such as a lead frame, or an insulator substrate such as a PCB (Printed Circuit Board) substrate. Although two electronic components are mounted on the substrate, the electronic components may be arranged in a matrix in multiple rows and multiple columns. Further, the substrate may be an electronic component. In this case, the mounting device according to an embodiment of the present invention is a device for joining electronic components to each other. The bonding material according to an embodiment of the present invention is not limited to a sintering material, and may be a semi-sintering material, a metal solder, an organic adhesive, or an inorganic adhesive. The form of the bonding material is, for example, an aggregate of powders, but may also be liquid, semi-solid, solid, or film-like.

[0017] The number of substrates according to an embodiment of the present invention is not limited to two, and at least one substrate is sufficient. Similarly, the number of electronic components is not limited to four, and at least one electronic component on one substrate is sufficient.

[0018] As shown in FIG. 1, the mounting device 1 includes a press device 3 and a mold 2 attached to the press device 3. In the illustrated example, the mounting device 1 further includes degassing chambers 31, 32. The press device 3 includes a pair of upper and lower platens 4, 5 connected by tie bars.

[0019] The mold 2 includes an upper mold base 21E fixed to the upper platen 5 and a lower mold base 11F fixed to the lower platen 4. Between the upper mold base 21E and the lower mold base 11F, main plates (support plates 21D, 21C, upper mold chase 21B, lower mold chase 11B, ejector pin plate 11C, retainer plate 11D, etc.) constituting the mold 2 are fixed.

[0020] In the following description, the various plates and their components fixed to the lower mold base 11F will be collectively referred to as the lower mold 10, and the various plates and their components fixed to the upper mold base 21E will be collectively referred to as the upper mold 20. The lower mold 10 is an example of the "first mold," and the upper mold 20 is an example of the "second mold."

[0021] The lower mold 10 mainly includes the lower mold base 11F, support pillars 11E, retainer plate 11D, ejector pin plate 11C, lower mold chase 11B, etc. It is fixed above the lower mold base 11F via multiple support pillars 11E that protrude columnarly from the lower mold base 11F.

[0022] Below the lower die chase 11B are the ejector pin plate 11C and the retainer plate 11D. The ejector pin plate 11C and the retainer plate 11D have holes through which the support pillar 11E passes. The ejector pin plate 11C and the retainer plate 11D are fixed to each other and are configured to slide vertically between the lower die chase 11B and the lower die base 11F.

[0023] Various components, including the cavity plate 11A, are fixed to the lower die chase 11B. In the illustrated example, the cavity plate 11A, the side block 18 that fixes the cavity plate 11A, the heat insulating member 15 that surrounds the bottom and sides of the cavity plate 11A, and the spring 17B and spring sleeve 17A are fixed to the lower die chase 11B.

[0024] The ejector pin plate 11C and the retainer plate 11D are fixed to a plurality of lifter pins 12A and 12B that can protrude from and retract from the cavity plate 11A, and a set pin 16 that contacts the upper mold 20 when the mold is clamped.

[0025] The cavity plate 11A is positioned closest to the upper mold 20 and is in contact with the space between the lower mold 10 and the upper mold 20 when the mold is opened. A heater 14 is provided inside the cavity plate 11A. When the lower mold 10 and the upper mold 20 are closed, the heater 14 heats the substrates SB1 and SB2 via the cavity plate 11A. This heats the bonding materials SN11, SN12, SN21, and SN22.

[0026] The heat insulating member 15 is provided between the cavity plate 11A and the lower mold chase 11B, and between the cavity plate 11A and the side block 18. The heat insulating member 15 suppresses direct heat conduction from the cavity plate 11A to the lower mold chase 11B and suppresses heat conduction from the cavity plate 11A to the lower mold chase 11B via the side block 18.

[0027] In other words, the insulating member 15 is positioned to separate the gas piping and heater 14 provided in the lower mold chase 11B, thereby suppressing the temperature rise of the nitrogen gas supplied from the gas supply port 13. Furthermore, the insulating member 15 is positioned to separate the spring 17B and heater 14, thereby suppressing the decrease in the elastic force of the spring 17B. In short, the insulating member 15 limits the target of heating to the cavity plate 11A, thereby accelerating the temperature rise by the heater 14 and making other components less susceptible to the effects of heat.

[0028] The side block 18 is located on the side of the lower mold chase 11B that faces the upper mold 20. When viewed from above from the upper mold 20, the side block 18 is located on the outside of the cavity plate 11A. The side block 18 contacts the upper mold 20 when the lower mold 10 and the upper mold 20 are closed.

[0029] The gas supply port 13 supplies gas such as nitrogen (N2) to the electronic components CH11, CH12, CH21, CH22 and the substrates SB1, SB2. In the illustrated example, the gas supply port 13 is provided on the side of the heat insulating member 15 outside the heater 14 of the cavity plate 11A to supply gas such as nitrogen (N2). The gas supply port 13 is provided on the surface of the cavity plate 11A facing the upper mold 20 and opens toward the upper mold 20. Therefore, the gas supply port 13 quickly removes oxidizing gases from around the workpieces W1, W2 during heating, and places the workpieces W1, W2 in a nitrogen atmosphere.

[0030] Furthermore, the gas supply port 13 cools the workpieces W1 and W2 by applying nitrogen gas to them during cooling. When viewed from above from the upper mold 20, multiple gas supply ports 13 are provided on the outside of the workpieces W1 and W2. The gas piping that passes the nitrogen gas supplied by the gas supply ports 13 is provided in the lower mold chase 11B. The gas supply port 13 is an example of a "gas supply mechanism" that supplies inert gas to the space between the lower mold 10 and the upper mold 20.

[0031] The inert gas supplied by the gas supply port is not limited to nitrogen gas; for example, it may be carbon dioxide, fluorocarbon, or a noble gas. The gas supply port may also open toward the electronic components, bonding material, or substrate, and the inert gas may be blown directly onto the electronic components, bonding material, or substrate. The gas supply port may be provided on the upper mold, or on both the lower and upper molds. The gas supply port may be provided on at least one of the side blocks 18, 28 of the lower and upper molds, or in the degassing chamber described later. Note that the inert gas and degassing are not necessarily required.

[0032] Spring 17B biases the ejector pin plate 11C and retainer plate 11D toward the lower die chase 11B (upward movement). The spring sleeve 17A has a stepped bolt (or washer, sleeve, and bolt) at its base end (upper end) and is fixed to the lower surface of the lower die chase 11B. The tip (lower end) of the spring sleeve 17A is provided with a flange (enlarged nail head shape).

[0033] The retainer plate 11D has a through hole that is larger than the tip of the spring sleeve 17A. The ejector pin plate 11C has a counterbore that is larger than the tip of the spring sleeve 17A and a through hole that is larger than the base of the spring sleeve 17A. The spring sleeve 17A is inserted through the through hole in the retainer plate 11D and the through hole in the ejector pin plate 11C.

[0034] The spring 17B is spirally positioned around the spring sleeve 17A between the flange of the spring sleeve 17A and the counterbore of the ejector pin plate 11C. In other words, the spring sleeve 17A is inserted into the spiral spring 17B. The spring 17B acts as an elastic force that separates the ejector pin plate 11C and the flange at the tip of the spring sleeve 17A from each other.

[0035] In other words, the spring 17B biases the ejector pin plate 11C and the retainer plate 11D toward the lower die chase 11B via the spring sleeve 17A. The spring 17B is an example of an elastic member, and the elastic member is not limited to a spring as long as it can exert the above-mentioned elastic force. The elastic member may be, for example, rubber or a leaf spring.

[0036] The lifter pins 12A and 12B are inserted into through holes that penetrate the cavity plate 11A, the lower die chase 11B, the ejector pin plate 11C, and the heat insulating member 15. The lifter pins 12A and 12B are the same length, and three or more pins are used to hold the workpiece W1 in parallel. The end on the upper die 20 side is the tip, and the end on the lower die base 11F side is the base. The base ends of the lifter pin 12B and the set pin 16 are sandwiched between the ejector pin plate 11C and the retainer plate 11D and secured with screws. The lifter pin 12B and the set pin 16 move up and down in conjunction with the ejector pin plate 11C and the retainer plate 11D.

[0037] Lifter pin 12A supports substrate SB1 by contacting its tip to the back surface of substrate SB1, and lifter pin 12B supports substrate SB2 by contacting its tip to the back surface of substrate SB2. Lifter pins 12A and 12B are configured to adjust the distance between substrates SB1 and SB2 and cavity plate 11A, thereby moving substrates SB1 and SB2 and cavity plate 11A closer together or further apart.

[0038] Specifically, the lifter pins 12A and 12B are configured to move forward and backward relative to the upper mold 20 from the cavity plate 11A. When the lifter pins 12A and 12B are advanced into the space between the lower mold 10 and the upper mold 20 (mold opening), the workpieces W1 and W2 supported by the lifter pins 12A and 12B move away from the cavity plate 11A. When the lifter pins 12A and 12B are retracted from the space between the lower mold 10 and the upper mold 20 (mold closing), the workpieces W1 and W2 are supported in contact with the cavity plate 11A.

[0039] When the ejector pin plate 11C and retainer plate 11D move towards (upward from) the cavity plate 11A, the tips of the lifter pins 12A and 12B protrude from the cavity plate 11A. In other words, the lifter pins 12A and 12B advance into the space between the lower mold 10 and the upper mold 20.

[0040] When the ejector pin plate 11C and retainer plate 11D move away from (downward from) the cavity plate 11A, the tips of the lifter pins 12A and 12B are retracted into the cavity plate 11A. That is, the lifter pins 12A and 12B exit the space between the lower mold 10 and the upper mold 20. The lifter pins 12A and 12B are examples of "holding parts". Note that the holding part is not limited to lifter pins. The holding part may be an elongated plate-shaped member that holds the end of the workpiece.

[0041] The set pin 16 is inserted through a through hole that penetrates the side block 18, the lower mold chase 11B, and the ejector pin plate 11C. The set pin 16 has its tip end on the upper mold 20 side and its base end on the lower mold base 11F side. The base end of the set pin 16 is sandwiched between the ejector pin plate 11C and the retainer plate 11D. The tip of the set pin 16 faces the side block 28 of the upper mold 20.

[0042] When the lower mold 10 and upper mold 20 are closed, the set pins 16 are pressed against the side blocks 28, pushing down the ejector pin plate 11C and the retainer plate 11D. By pushing down the ejector pin plate 11C and the retainer plate 11D, the lifter pins 12B are pushed down in conjunction, causing the substrates SB1 and SB2 on the lifter pins 12B to move downward. Furthermore, in order to push down the ejector pin plate 11C and the retainer plate 11D in parallel, it is preferable to arrange about four set pins 16 at the four corners of the workpiece.

[0043] The upper mold 20 mainly includes the upper mold base 21E, upper support plate 21D, lower support plate 21C, upper mold chase 21B, pressure regulating mechanism 9, etc. The upper support plate 21D and lower support plate 21C are fixed to the upper mold base 21E. The upper mold chase 21B is fixed to the upper mold base 21E via the upper support plate 21D and lower support plate 21C.

[0044] Various components, including the cavity plate 21A, are fixed to the upper chase 21B. In the illustrated example, the upper chase 21B is provided with the cavity plate 21A, side blocks 28 for fixing the cavity plate 21A, heat insulating members 25 arranged to surround the top and sides of the cavity plate 21A, and a part of the pressure regulating mechanism 9.

[0045] The cavity plate 21A is located closest to the lower mold 10. A heater 24 is provided inside the cavity plate 21A. The heater 24 heats the movable pieces 22Ab, 22Bb, 22Cb, and 22Db, which will be described later, via the cavity plate 21A. When the lower mold 10 and the upper mold 20 are closed, the heater 24 heats the electronic components CH11, CH12, CH21, and CH22 via the movable pieces 22Ab, 22Bb, 22Cb, and 22Db and the film F. This heats the bonding materials SN11, SN12, SN21, and SN22.

[0046] The side block 28 is located on the side of the upper mold chase 21B that faces the lower mold 10. When viewed from above from the upper mold 20, the side block 28 is located on the outside of the cavity plate 21A. The side block 28 is the part of the upper mold 20 that contacts the lower mold 10 when the lower mold 10 and the upper mold 20 are closed. In other words, when the lower mold 10 and the upper mold 20 are closed, the side block 28 contacts the set pin 16.

[0047] The heat insulating member 25 is provided between the cavity plate 21A and the upper mold chase 21B, and between the cavity plate 21A and the side block 28. The heat insulating member 25 suppresses direct heat conduction from the cavity plate 21A to the upper mold chase 21B, and suppresses heat conduction from the cavity plate 21A to the upper mold chase 21B via the side block 28.

[0048] The heat insulating member 25 separates the heater 24 from the upper mold chase 21B, thereby suppressing the thermal degradation of the springs 23A, 23B, 23C, and 23D, which will be described later. In other words, the heat insulating member 25 limits the target of heating to the cavity plate 21A, thereby accelerating the temperature rise by the heater 24 and making other components less susceptible to the effects of heat.

[0049] During the assembly process, a film F is stretched across the surface of the cavity plate 21A facing the lower mold 10. A suction hole (not shown) is provided on the lower surface of the cavity plate to attract the film F. The suction hole is connected to an external vacuum suction pump for on / off control of the suction.

[0050] Examples of film F include film materials with excellent heat resistance, ease of peeling, flexibility, and stretchability, such as PTFE (polytetrafluoroethylene), ETFE (ethylene-tetrafluoroethylene copolymer), PET (polyethylene terephthalate), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), fluorine-impregnated glass cloth, PP (polypropylene), and PVDC (polyvinyl chloride).

[0051] Film F prevents powder and gas generated from the bonding materials SN11, SN12, SN21, and SN22 from entering the gaps in the upper mold 20, thereby suppressing malfunctions of the upper mold 20. In addition, film F functions as a buffer between the movable pieces 22Ab, 22Bb, 22Cb, and 22Db and the electronic components CH11, CH12, CH21, and CH22, and has the effect of suppressing damage to the electronic components CH11, CH12, CH21, and CH22 when pressurized.

[0052] The pressure regulating mechanism 9 absorbs the differences in thickness between substrates SB1 and SB2, the differences in height between electronic components CH11, CH12, CH21, and CH22, and the differences in thickness between bonding materials SN11, SN12, SN21, and SN22, and pressurizes the bonding materials SN11, SN12, SN21, and SN22 with approximately uniform pressure. The pressure regulating mechanism 9 includes movable mechanisms 22A, 22B, 22C, and 22D, and springs 23A, 23B, 23C, and 23D.

[0053] Movable mechanism 22B is located closest to movable mechanism 22A. Movable mechanism 22D is located closest to movable mechanism 22C. Similarly, spring 23B is located closest to spring 23A. Spring 23D is located closest to spring 23C.

[0054] Movable mechanism 22A is connected to spring 23A and is configured to move up and down. Similarly, movable mechanism 22B is connected to spring 23B and is configured to move up and down, movable mechanism 22C is connected to spring 23C and is configured to move up and down, and movable mechanism 22D is connected to spring 23D and is configured to move up and down.

[0055] For rod-shaped members such as the movable mechanisms 22A, 22B, 22C, and 22D in the upper mold 20, the upper mold base 21E side is the base end and the lower mold 10 side is the tip end. The base end of the movable mechanism 22A receives the elastic force of the spring 23A, and the tip end of the movable mechanism 22A pressurizes the electronic component CH11 based on the elastic force of the spring 23A. As a result, the bonding material SN11 is pressurized by the movable mechanism 22A via the electronic component CH11. Similarly, the movable mechanism 22B pressurizes the electronic component CH12 based on the elastic force of the spring 23B, and the bonding material SN12 is pressurized by the movable mechanism 22B via the electronic component CH12. The movable mechanism 22C pressurizes the electronic component CH21 based on the elastic force of the spring 23C, and the bonding material SN21 is pressurized by the movable mechanism 22C via the electronic component CH21. The movable mechanism 22D pressurizes the electronic component CH22 by the elastic force of the spring 23D, and the bonding material SN22 is pressurized by the movable mechanism 22D via the electronic component CH22.

[0056] Movable mechanism 22A has a rod 22Aa and a movable piece 22Ab. Movable mechanism 22B has a rod 22Ba and a movable piece 22Bb. Movable mechanism 22C has a rod 22Ca and a movable piece 22Cb. Movable mechanism 22D has a rod 22Da and a movable piece 22Db.

[0057] Rod 22Aa is provided at the base end of the movable mechanism 22A. Rod 22Aa is slidably mounted relative to the cavity plate 21A, the upper mold chase 21B, the heat insulating member 25, and the lower support plate 21C. The base end of rod 22Aa is located inside a recess in the lower support plate 21C that opens towards the upper mold chase 21B, and is shaped like a nail head with a larger diameter than the tip of rod 22Aa. The base end of rod 22Aa is configured to slide relative to the lower support plate 21C, and its downward movement limit is defined by the upper mold chase 21B. The tip of rod 22Aa is located inside a through hole that penetrates the cavity plate 21A, the upper mold chase 21B, and the heat insulating member 25, and the very tip of the tip of rod 22Aa is rounded in a bullet shape. The base end of rod 22Aa is connected to the spring 23A, and the very tip of the tip makes point contact with the movable piece 22Ab. The rod 22Aa transmits the vertical movement of the movable piece 22Ab to the spring 23A, and transmits the elastic force generated in the spring 23A to the movable piece 22Ab.

[0058] The movable piece 22Ab is located at the tip of the movable mechanism 22A. The movable piece 22Ab is slidably mounted relative to the cavity plate 21A. The tip of the movable piece 22Ab protrudes from the cavity plate 21A. The base end of the movable piece 22Ab is located inside the cavity plate 21A and is connected to the tip of the rod 22Aa. The movable piece 22Ab is a drop-proof, movable nest that moves up and down. When the lower mold 10 and upper mold 20 are closed, the tip of the movable piece 22Ab contacts the upper surface of the electronic component CH11 via a film, applying pressure from the spring 23A transmitted via the rod 22Aa to the electronic component CH11.

[0059] Rod 22Ba is provided at the base end of the movable mechanism 22B. Rod 22Ba is slidably mounted relative to the cavity plate 21A, the upper mold chase 21B, the heat insulating member 25, the lower support plate 21C, and the upper support plate 21D. The base end of rod 22Ba is located inside a recess in the upper support plate 21D that opens towards the lower support plate 21C, and is shaped like a nail head with a larger diameter than the tip of rod 22Ba. The base end of rod 22Ba is configured to slide relative to the upper support plate 21D, and its downward movement limit is defined by the lower support plate 21C. The tip of rod 22Ba is located inside a through hole that penetrates the cavity plate 21A, the upper mold chase 21B, the heat insulating member 25, and the lower support plate 21C, and the very tip of the tip of rod 22Ba is rounded in a bullet shape. The rod 22Ba has its base end connected to the spring 23B, and its tip end making point contact with the movable piece 22Bb. The rod 22Ba transmits the vertical movement of the movable piece 22Ab to the spring 23B, and transmits the elastic force generated in the spring 23B to the movable piece 22Ab.

[0060] The structure and function of rod 22Ca are the same as those of rod 22Aa. The structure and function of rod Da are the same as those of rod 22Ba. The structure and function of movable pieces 22Bb, 22Cb, and 22Db are the same as those of movable piece 22Ab. Therefore, the descriptions of rods 22Ca, 22Da and movable pieces 22Bb, 22Cb, and 22Db are omitted.

[0061] During the mounting process, the sides of the movable pieces 22Ab, 22Bb, 22Cb, and 22Db that come into contact with the electronic components CH11, CH12, CH21, and CH22 are covered with a continuous film F. The film F prevents dust generated from the bonding materials SN11, SN12, SN21, and SN22 from adhering to and contaminating the upper mold 20, and also mitigates damage to the chips CH11, CH12, CH21, and CH22.

[0062] The movable piece 22Ab, which has contact with the electronic component CH11 via the film F, is pushed up based on the thickness of the substrate SB1, the bonding material SN11, and the electronic component CH11. The pushed-up movable piece 22Ab pushes up the rod 22Aa, compressing the spring 23A and generating an elastic force. The elastic force generated in the spring 23A is transmitted by the rod 22Aa and applied to the electronic component CH11 by the movable piece 22Ab. Similarly, the movable piece 22Bb is pushed up based on the thickness of the substrate SB1, the bonding material SN12, and the electronic component CH12, and applies the elastic force generated in the spring 23B to the electronic component CH12. The movable piece 22Cb is pushed up based on the thickness of the substrate SB2, the bonding material SN21, and the electronic component CH21, and applies the elastic force generated in the spring 23C to the electronic component CH21. The movable piece 22Db is pushed up based on the thickness of the substrate SB2, the bonding material SN22, and the electronic component CH22, and applies the elastic force generated by the spring 23D to the electronic component CH22.

[0063] Springs 23A, 23B, 23C, and 23D act independently of each other. Therefore, the pressure applied to electronic component CH11 is not affected by springs 23B, 23C, and 23D, and is determined solely by the elastic force of spring 23A. The pressure applied to electronic component CH12 is not affected by springs 23A, 23C, and 23D, and is determined solely by the elastic force of spring 23B. The pressure applied to electronic component CH21 is not affected by springs 23A, 23B, and 23D, and is determined solely by the elastic force of spring 23C. The pressure applied to electronic component CH22 is not affected by springs 23A, 23B, and 23C, and is determined solely by the elastic force of spring 23D. The differences in thickness between substrates SB1 and SB2, the differences in height between electronic components CH11, CH12, CH21, and CH22, and the differences in thickness between bonding materials SN11, SN12, SN21, and SN22 are absorbed by springs 23A, 23B, 23C, and 23D, and bonding materials SN11, SN12, SN21, and SN22 are pressurized with approximately uniform pressure.

[0064] Springs 23A, 23B, 23C, and 23D generate an elastic force that pushes down the movable mechanisms 22A, 22B, 22C, and 22D when compressed in the vertical direction. Springs 23A, 23B, 23C, and 23D are coil springs made of metal material. Springs 23A and 23C are located inside recesses that open on the upper mold chase 21B side of the lower support plate 21C. Springs 23B and 23D are located inside recesses that open on the lower support plate 21C side of the upper support plate 21D. There is a gap between spring 23A and spring 23B in the opening and closing direction of the lower mold 10 and upper mold 20. Also, there is a gap between spring 23C and spring 23D in the opening and closing direction of the lower mold 10 and upper mold 20. In other words, the base ends of springs 23A and 23C are located closer to the lower mold 10 than the tip ends of springs 23B and 23D. When viewed from above from the lower mold 10, parts of springs 23A and 23B overlap each other, while parts of springs 23C and 23D overlap each other with a gap between them. Springs 23A, 23B, 23C, and 23D move the movable mechanisms 22A, 22B, 22C, and 22D based on their elastic force. Springs 23A, 23B, 23C, and 23D are examples of "elastic elements".

[0065] Furthermore, the elastic element is not limited to a coil spring, as long as it is capable of generating an elastic force in the direction that compresses the movable mechanisms 22A, 22B, 22C, and 22D. The elastic element may be, for example, rubber or a leaf spring.

[0066] The degassing chambers 31 and 32 are openable and closable vacuum chambers surrounding the lower mold 10 and the upper mold 20. Degassing chamber 31 is connected to the lower mold base 11F of the lower mold 10. When viewed from above from the upper mold 20, the degassing chamber 31 is located outside the side block 18. A degassing path 33 is provided between the degassing chamber 31 and the lower mold chase 11B, ejector pin plate 11C, retainer plate 11D, support pillar 11E, and side block 18 through which the degassing gas passes. Degassing chamber 32 is connected to the upper mold base 21E of the upper mold 20. When viewed from above from the lower mold 10, the degassing chamber 32 is located outside the side block 28. A degassing path 34 is provided between the degassing chamber 32 and the upper mold chase 21B, lower support plate 21C, upper support plate 21D, and side block 28 through which the degassing gas passes. The degassing path 34 is connected to the degassing path 27 provided in the upper mold base 21E. The degassing path 27 is connected to the degassing port 29 provided in the upper mold base 21E. The degassing port 29 is connected to a vacuum pump outside the mold. The atmosphere inside the lower mold 10 and upper mold 20 in the degassing chambers 31 and 32 is degassed by the degassing port 29.

[0067] <Implementation Method> Next, a mounting method using the mounting apparatus 1 according to this embodiment will be described with reference to Figures 2 to 9. Figures 2 and 3 are flowcharts showing a part of the mounting method according to one embodiment of the present invention. Figure 4 is a graph showing the temperature profile of the mounting method according to one embodiment of the present invention. Figures 5 to 9 are diagrams showing the mounting apparatus in one step of the mounting method. In the graph of Figure 4, the horizontal axis represents time, and the vertical axis represents the temperature of the workpiece.

[0068] First, the lower mold 10 and the upper mold 20 are prepared (S11), and preheating of the lower mold 10 and the upper mold is started (S12). As shown in Figure 4, the temperature of the workpieces W1 and W2 at this time is room temperature (RT).

[0069] Next, workpieces W1 and W2 are placed on the lifter pins 12A and 12B (S13). In workpiece W1, electronic components CH11 and CH12 are placed on substrate SB1. In workpiece W2, electronic components CH21 and CH22 are placed on substrate SB2. Next, the degassing chambers 31 and 32 are closed to start degassing (S14), and nitrogen gas is supplied (S15). By degassing the bonding materials SN11, SN12, SN21, and SN22 before raising them to the sintering temperature and creating a nitrogen gas atmosphere around the bonding materials SN11, SN12, SN21, and SN22, oxidation of the bonding materials SN11, SN12, SN21, and SN22 is suppressed. As shown in Figure 5, when the degassing chambers 31 and 32 are closed, the tips of the set pins 16 come into contact with the side blocks 28 of the upper mold 20. The side blocks 18 and 28 of the lower mold 10 and upper mold 20 are spaced apart from each other, and the workpieces W1 and W2 are spaced apart from the cavity plate 11A. The substrates SB1 and SB2 are heated by thermal radiation from the cavity plate 11A of the lower mold 10, and the electronic components CH11, CH12, CH21, and CH22 are heated by thermal radiation from the movable pieces 22Ab, 22Bb, 22Cb, and 22Db of the upper mold 20. As shown in Figure 4, the temperature of the workpieces W1 and W2 at this time is approximately 100°C to 150°C.

[0070] Next, the mold closes a little further, lowering the lifter pins 12A and 12B and bringing the substrates SB1 and SB2 into contact with the cavity plate 11A of the upper mold 20 (S16). As shown in Figure 6, as the lower mold 10 and the upper mold 20 move closer to each other, the set pin 16 is pushed down by the side block 28 of the upper mold 20. The pushed-down set pin 16 pushes down the ejector pin plate 11C and retainer plate 11D, which are connected to the base end of the set pin 16. The pushed-down ejector pin plate 11C and retainer plate 11D push down the lifter pins 12A and 12B, whose base ends are connected to the ejector pin plate 11C and retainer plate 11D. As a result, the workpieces W1 and W2 come into contact with the cavity plate 11A. The substrates SB1 and SB2 are heated by heat conduction from the cavity plate 11A of the lower mold 10, and the electronic components CH11, CH12, CH21, and CH22 are heated by thermal radiation from the movable pieces 22Ab, 22Bb, 22Cb, and 22Db of the upper mold 20. As shown in Figure 4, the temperature of the workpieces W1 and W2 at this time is raised from the preheating temperature of 100°C to 150°C to the sintering temperature of 250°C to 300°C.

[0071] The movable mechanisms 22A, 22B, 22C, and 22D come into contact with the electronic components CH11, CH12, CH21, and CH22 via the film F, improving the adhesion between the cavity plate 11A of the lower mold 10 and the substrates SB1 and SB2. As a result, the efficiency of heat conduction from the lower mold 10 to the substrates SB1 and SB2 is improved compared to step S16, when the substrates SB1 and SB2 were placed on the cavity plate 11A, and the heating efficiency of the bonding materials SN11, SN12, SN21, and SN22 by the lower mold 10 is improved. In addition, the electronic components CH11, CH12, CH21, and CH22 are heated by heat conduction from the movable pieces 22Ab, 22Bb, 22Cb, and 22Db of the upper mold 20. Therefore, compared to steps S13 to S16 in which the electronic components CH11, CH12, CH21, CH22 were heated by thermal radiation, the heating efficiency of the bonding materials SN11, SN12, SN21, SN22 by the upper mold 20 is improved. As shown in Figure 4, the temperature of the workpieces W1, W2 at this time is raised from the preheating temperature of 100°C to 150°C to the sintering temperature of 250°C to 300°C. (S22) .

[0072] The bonding materials SN11, SN12, SN21, and SN22 are sintered by heating and pressurizing. The sintered bonding material SN11 bonds and electrically connects electronic component CH11 to substrate SB1, the sintered bonding material SN12 bonds and electrically connects electronic component CH12 to substrate SB1, the sintered bonding material SN21 bonds and electrically connects electronic component CH21 to substrate SB2, and the sintered bonding material SN22 bonds and electrically connects electronic component CH22 to substrate SB2. In other words, electronic components CH11 and CH12 are mounted on substrate SB1, and electronic components CH21 and CH22 are mounted on substrate SB2. (S23) .

[0073] Next, by opening the mold, the lifter pins 12A and 12B are raised, separating the substrates SB1 and SB2 from the cavity plate 11A of the lower mold 10 (S2 4As shown in Figure 8, the side block 28 of the upper mold 20 is separated from the side block 18 of the lower mold 10. The spring 17B applies an elastic force to the lower mold chase 11B, to which the base end (the side that is screwed in by the stepped bolt, the upper side) of the spring sleeve 17A is screwed, in a direction that brings the ejector pin plate 11C closer. Since the lower mold chase 11B is fixed in position by the support pillar 11E, the ejector pin plate 11C and the retainer plate 11D connected to the ejector pin plate 11C are pushed upward. As a result, the ejector pin plate 11C and the retainer plate 11D are pulled up, and the lifter pins 12A and 12B, whose base ends are sandwiched between the ejector pin plate 11C and the retainer plate 11D, are also pulled up. The tips of the lifter pins 12A and 12B protrude from the cavity plate 11A and contact the back surfaces of the substrates SB1 and SB2, and the workpieces W1 and W2 are separated from the cavity plate 11A. The gas supply port 13 supplies nitrogen gas to the workpieces W1 and W2. Cooling of the workpieces W1 and W2 begins when they are separated from the cavity plate 11A, which is the heat source, and receive nitrogen gas. As shown in Figure 4, the temperature of the workpieces W1 and W2 at this time is approximately 250°C to 300°C, which is the sintering temperature.

[0074] Next, the supply of nitrogen gas is stopped and degassing is stopped (S2 5 As shown in Figure 4, once the workpieces W1 and W2 have cooled to approximately 100°C to 150°C, the supply of nitrogen gas from the gas supply port 13 is stopped, and then degassing from the degassing port 29 is stopped. This completes the cooling of the workpieces W1 and W2 within the mounting device 1.

[0075] Finally, by further opening the mold, the degassing chambers 31 and 32 are opened and the workpieces W1 and W2 are removed (S2 6 As shown in Figure 9, the degassing chamber 31 and the degassing chamber 32 are separated, and the workpieces W1 and W2 are released. The workpieces W1 and W2 are recovered from above the lifter pins 12A and 12B.

[0076] Next, the supply of nitrogen gas is stopped and degassing is stopped (S23). As shown in Figure 4, when the workpieces W1 and W2 have cooled to approximately 100°C to 150°C, the supply of nitrogen gas from the gas supply port 13 is stopped, and then degassing from the degassing port 29 is stopped. This completes the cooling of the workpieces W1 and W2 within the mounting device 1.

[0077] Finally, by further opening the mold, the degassing chambers 31 and 32 are opened and the workpieces W1 and W2 are removed (S24). As shown in Figure 9, the degassing chambers 31 and 32 are separated and the workpieces W1 and W2 are released. The workpieces W1 and W2 are recovered from above the lifter pins 12A and 12B.

[0078] In this embodiment, a configuration in which one electronic component is pressurized by one movable mechanism and one movable mechanism is moved by one elastic element was described as an example, but the embodiments of the present invention are not limited to this.

[0079] For example, multiple electronic components may be pressurized by a single movable mechanism. In such a configuration, if the heights of the multiple electronic components are different, the tip surface of the movable piece may be provided with irregularities corresponding to the heights of the multiple electronic components. This allows multiple electronic components of different heights to be pressurized with substantially uniform pressure by a single movable mechanism. Alternatively, one electronic component may be pressurized by multiple movable mechanisms. This allows the entire electronic component to be pressurized with substantially uniform pressure by pressurizing each part with a different movable mechanism, even if the electronic component contains parts of different heights. Furthermore, for example, one movable mechanism may be moved by multiple elastic elements, or multiple movable mechanisms may be moved by a single elastic element. Multiple movable mechanisms may be arranged side by side on the plane of a drawing, for example, but may also be arranged side by side in the depth direction of the drawing. Multiple movable mechanisms may be arranged in a matrix so as to pressurize each of multiple electronic components arranged in a matrix relative to the substrate.

[0080] Furthermore, in this embodiment, a configuration in which the upper mold has two support plates (a lower support plate and an upper support plate) and the two closest elastic elements are provided on different support plates was described as an example, but the embodiments of the present invention are not limited to this.

[0081] If the two closest elastic elements can be provided on a single support plate, the upper mold may have only one support plate. In this case, the two closest elastic elements may be arranged side by side in a direction intersecting the opening and closing directions of the lower and upper molds, or they may be arranged so that parts of them overlap in the opening and closing directions of the lower and upper molds. For example, an upper recess opening on the upper surface and a lower recess opening on the lower surface may be provided on one support plate, with parts of the upper and lower recesses overlapping in the vertical direction, and elastic elements placed inside the upper and lower recesses, respectively. Alternatively, the upper mold may have three or more support plates, with elastic elements provided on each support plate. This allows for a more dense arrangement of elastic elements and movable mechanisms compared to a configuration with two support plates on the upper mold, enabling each of the densely arranged electronic components to be pressed simultaneously and individually with appropriate pressure.

[0082] Some or all embodiments of the present invention are described below. However, the present invention is not limited to the embodiments described below.

[0083] [Note 1] A mounting apparatus for mounting one or more electronic components onto at least one substrate, comprising: a first mold configured to hold a substrate on which electronic components are mounted; a second mold positioned opposite the first mold; and a gas supply mechanism for supplying an inert gas to the space between the first mold and the second mold, wherein the second mold has a movable mechanism and an elastic element, and when the first mold and the second mold are closed, the movable mechanism pressurizes the electronic components according to the elastic force of the elastic element.

[0084] In this embodiment, the upward movement of the movable mechanism according to the height of the electronic component and substrate generates an elastic force in the elastic element, and this elastic force pressurizes the electronic component. In other words, an elastic force suitable for pressurizing the electronic component is naturally generated within the mold. For this reason, it is possible to miniaturize the device compared to mounting devices that pressurize electronic components via a fluid supplied from outside the second mold. Furthermore, the gas supply mechanism eliminates oxidizing gases from around the electronic component and substrate, creating an inert gas atmosphere around them. This suppresses bonding defects caused by oxidation of the bonding material used to join the electronic component to the substrate, and allows bonding treatment to be performed at high temperatures. In addition, when cooling the electronic component and substrate after the bonding treatment, they can be gas-cooled with an inert gas.

[0085] [Note 2] The mounting device described in [Appendix 1], wherein the second mold has a plurality of movable mechanisms and a plurality of elastic elements, and each of the plurality of movable mechanisms moves independently by different elastic elements.

[0086] According to this embodiment, the elastic force of one elastic element is determined based on the thickness and desired pressure of one electronic component, and is largely unaffected by the thickness and desired pressure of other electronic components. Therefore, insufficient or excessive pressure on the one electronic component due to the influence of the thickness and desired pressure of other electronic components is suppressed. In other words, each of multiple electronic components can be pressurized simultaneously and individually with the appropriate pressure.

[0087] [Note 3] The mounting apparatus as described in [Appendix 2], wherein the second mold has a plurality of support plates, and at least two of the plurality of elastic elements are provided on different support plates.

[0088] According to this embodiment, the two elastic elements can be arranged such that parts of each elastic element overlap with a gap in the opening and closing direction of the first and second molds. In other words, multiple elastic elements can be arranged closely together. Therefore, even when multiple electronic components are arranged closely together, each of the multiple electronic components can be pressed simultaneously and individually with appropriate pressure.

[0089] [Note 4] The mounting apparatus according to any one of [Appendix 1] to [Appendix 3], wherein the gas supply mechanism is a gas supply port provided in at least one of the first mold and the second mold, and has a gas supply port for supplying inert gas to the electronic components and the substrate.

[0090] According to this embodiment, inert gas can be directly blown onto the electronic components and substrate from a gas supply port facing the electronic components and substrate. When heating the electronic components and substrate, an inert gas atmosphere can be efficiently created around them. Therefore, bonding defects due to oxidation of the bonding material can be suppressed. Furthermore, when cooling the electronic components and substrate, the area around them can be efficiently cooled by applying inert gas to the electronic components and substrate. As the cooling rate of the mounted products is improved, the time required to remove the mounted products from the mounting equipment is shortened, and production efficiency can be improved.

[0091] [Note 5] The mounting apparatus according to any one of [Appendix 1] to [Appendix 4] further comprises an openable and closable degassing chamber surrounding the first mold and the second mold.

[0092] According to this embodiment, the area around the electronic components and substrate can be kept in a vacuum or inert gas atmosphere, thereby suppressing oxidation. Consequently, multiple electronic components and at least one substrate can be heated to a high temperature.

[0093] [Note 6] The mounting apparatus according to any one of [Appendix 1] to [Appendix 5], wherein the movable mechanism has a movable piece that applies an elastic force transmitted from an elastic element to an electronic component, and the second mold further has a heater for heating the movable piece and a heat insulating member that separates the heater from the elastic element.

[0094] According to this embodiment, when the heater heats the movable piece, the temperature rise of the elastic element can be suppressed. Therefore, changes in the properties of the elastic element due to heat and damage can be suppressed.

[0095] [Note 7] The elastic element is a coil spring formed using a metallic material, as described in any one of the mounting devices described in [Appendix 1] to [Appendix 6].

[0096] [Note 8] The mounting device is a sintering device, the mounting device described in any one of [Appendix 1] to [Appendix 7].

[0097] [Note 9] A mounting method using a mounting apparatus for mounting one or more electronic components on at least one substrate, comprising: providing a first mold configured to hold a substrate on which electronic components are mounted; and providing a second mold positioned opposite the first mold, wherein the second mold has a movable mechanism and an elastic element; and the mounting method further comprises: supplying an inert gas to the space between the first mold and the second mold; closing the first mold and the second mold; and, with the first mold and the second mold closed, pressurizing the electronic components by the movable mechanism according to the elastic force of the elastic element.

[0098] In this embodiment, the upward movement of the movable mechanism according to the height of the electronic component and substrate generates an elastic force in the elastic element, and this elastic force pressurizes the electronic component. In other words, an elastic force suitable for pressurizing the electronic component is naturally generated within the mold. For this reason, it is possible to miniaturize the device compared to mounting devices that pressurize electronic components via a fluid supplied from outside the second mold. Furthermore, the gas supply mechanism eliminates oxidizing gases from around the electronic component and substrate, creating an inert gas atmosphere around them. This suppresses bonding defects caused by oxidation of the bonding material used to join the electronic component to the substrate, and allows bonding treatment to be performed at high temperatures. In addition, when cooling the electronic component and substrate after the bonding treatment, they can be gas-cooled with an inert gas.

[0099] As explained above, it is possible to provide a compact mounting device and a mounting method using the same that can suppress the occurrence of mounting defects.

[0100] The embodiments described above are provided to facilitate understanding of the present invention and are not intended to limit its interpretation. The elements, arrangement, materials, conditions, shapes, and sizes of the embodiments are not limited to those exemplified and can be modified as appropriate. Furthermore, it is possible to partially substitute or combine the configurations shown in different embodiments. [Explanation of symbols]

[0101] 1…Implementation device 10…Lower mold 11A... Cavity Plate 11B... Lower type chase 11C…Ejector pin plate 11D…Retainer plate 11E...Support pillar 11F…Lower base 12A, 12B... Lifter pins 13...Gas supply port 14… Heater 15…Insulation material 16…Set pins 17A... Spring sleeve 17B... Spring 18…Side block 20…Upper mold 21A... Cavity Plate 21B... Upper type chase 21C... Lower support plate 21D…Upper support plate 21E… Upper base 22A, 22B, 22C, 22D…Movable mechanism 22Aa, 22Ba, 22Ca, 22Da… Rod 22Ab, 22Bb, 22Cb, 22Db…Movable piece 23A, 23B, 23C, 23D… Springs 24... Heater 25…Insulation material 27… Degassing pathway 28... Side Block 29...Ventilation vent 31, 32… Degassing chamber 33,34… Degassing pathways

Claims

1. A mounting device for mounting one or more electronic components onto at least one substrate, A first mold configured to hold the substrate on which the aforementioned electronic components are mounted, A second mold is positioned opposite the first mold, A gas supply mechanism that supplies inert gas to the space between the first mold and the second mold, A degassing chamber that can be opened and closed surrounds the first mold and the second mold. Equipped with, The second mold has a movable mechanism and an elastic element, With the first mold and the second mold closed, the movable mechanism pressurizes the electronic component in accordance with the elastic force of the elastic element. Mounting device.

2. The second mold has a plurality of the movable mechanisms and a plurality of the elastic elements, Each of the aforementioned multiple movable mechanisms moves independently by different elastic elements. The mounting device according to claim 1.

3. The second mold has a plurality of support plates, At least two of the aforementioned elastic elements are provided on different support plates. The mounting device according to claim 2.

4. The gas supply mechanism has a gas supply port provided in at least one of the first mold and the second mold, which supplies the inert gas toward the electronic component and the substrate. The mounting device according to claim 1.

5. The movable mechanism has a movable piece that applies the elastic force transmitted from the elastic element to the electronic component, The second mold is, A heater for heating the aforementioned movable piece, The heater and the heat insulating member separating the elastic element It further possesses, The mounting device according to claim 1.

6. The elastic element is a coil spring formed using a metal material. The mounting device according to claim 1.

7. The aforementioned mounting device is a sintering device. The mounting device according to any one of claims 1 to 6.

8. A mounting method using a mounting device for mounting one or more electronic components on at least one substrate, A first mold is prepared which is configured to hold the substrate on which the aforementioned electronic components are mounted, A second mold is prepared, which is positioned opposite the first mold. Includes, The second mold has a movable mechanism and an elastic element, The aforementioned implementation method is, The process involves closing the openable and closable degassing chamber surrounding the first mold and the second mold to remove air, Supplying an inert gas to the space between the first mold and the second mold, Closing the first mold and the second mold, With the first mold and the second mold closed, the movable mechanism pressurizes the electronic component in accordance with the elastic force of the elastic element. Further including, Implementation method.

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