Semiconductor device and axis adjustment method

Abstract

The present invention provides a semiconductor device including a base for placing a wafer, a shaft connected to the base, and a detection member disposed at the end of the shaft for detecting an external force acting on the shaft due to deviation from the center line, and a method for adjusting the shaft. The semiconductor device provided by the present invention is provided with a detection member that can detect an external force acting on the shaft when it deviates from the center line, thereby providing convenience when adjusting the position of the shaft.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor devices, and particularly to a detection member for the axis of a semiconductor device.

Background Art

[0002] In the field of semiconductors, the results of semiconductor processes are closely related to the state of the process airflow field in the process chamber of semiconductor devices. Taking the epitaxial growth process as an example, when placing a wafer on a base in an epitaxial growth chamber, the process gas related to the epitaxial growth layer to be grown is passed into the chamber, and in a specific temperature and air pressure environment, it is necessary to grow the corresponding epitaxial growth layer on the surface of the wafer. In order to improve the quality and utilization rate of the wafer, the epitaxial growth layer grown on the surface of the wafer needs to achieve the maximum uniformity. However, one of the uniformity problems is the irregular eccentricity phenomenon of the thickness of the epitaxial growth layer on the surface of the wafer. This eccentricity is caused by the axis connected to the base deviating from the center of the chamber. Therefore, during the rotation process of the base, the gap between the preheating ring centered on the base and the base changes randomly, the airflow field of the process gas becomes unstable, and furthermore, it affects the uniformity of film formation.

[0003] Therefore, in the prior art, engineers use an adjustment device to move the axis of the semiconductor device to coincide with the center of the chamber. However, in the prior art, the following problems exist when using the adjustment device.

[0004] In the prior art, during the process of using the adjustment device, engineers can only judge whether the axis has reached the desired position by observation. Therefore, the situation of excessive adjustment cannot be avoided. This phenomenon may cause excessive stress on the lower dome of the chamber installed around the axis. In a more serious case, cracks may occur in the lower dome.

[0005] In summary, it is necessary to provide a semiconductor device with a device that can determine whether the adjustment device is accurately installed. [Overview of the project]

[0006] The object of the present invention is to provide a semiconductor device and a method for adjusting an axis, wherein the semiconductor device is provided with a detection member that can detect the external force acting on the axis when it is misaligned with the center line, so when adjusting the position of the axis, it is possible to confirm whether the axis has reached the desired position by the external force detected by the detection member, and at the same time, it is possible to avoid excessive stress in the lower dome of the chamber of the semiconductor device which is arranged around the axis due to excessive adjustment.

[0007] To achieve the above objective, the present invention is realized by the following technical solutions.

[0008] Semiconductor equipment, A base for placing wafers, A shaft that is directly or indirectly connected to the base, The system includes a detection member positioned at the end of the shaft for detecting external forces acting on the shaft due to deviation from the center line.

[0009] Furthermore, it comprises a base having a position fixed to the position of the semiconductor device chamber, and a positioning member installed on the base, used to adjust the position of the axis on a horizontal plane, and connected to the detection member, The positioning member includes a fixing member for fixing the detection member to the positioning member.

[0010] Furthermore, the fixing member is provided above the detection member.

[0011] Furthermore, the detection member is annular in shape, including through holes that penetrate the upper and lower surfaces of the annular shape.

[0012] Furthermore, the end face of the shaft is provided within the through hole and interposed between the upper and lower surfaces of the detection member.

[0013] Furthermore, the end face of the shaft penetrates the through hole and extends beyond the annular lower surface.

[0014] Furthermore, the end face of the shaft is provided on the fixing member, and the end face of the shaft is located above the upper surface of the detection member.

[0015] Furthermore, the fixing member is provided with a hole for positioning the shaft.

[0016] Furthermore, the hole is either a through hole or a blind hole.

[0017] Furthermore, the diameter of the shaft is the same as the diameter of the through hole in the detection member, and the diameter of the shaft is the same as the diameter of the hole in the fixing member.

[0018] Furthermore, the fixing member is connected to the positioning part via screw threads, bolts, or screws.

[0019] Furthermore, the positioning member includes a first directional positioning portion and a second directional positioning portion located on a horizontal plane, the first directional positioning portion and the second directional positioning portion are arranged to intersect, and the angle between the first direction and the second direction is α.

[0020] Furthermore, the semiconductor device is It includes a base and a positioning member, and an adjustment assembly to which each is connected. The adjustment assembly includes a first directional adjustment section and a second directional adjustment section located in the horizontal plane, the first directional adjustment section being used to adjust the position of the first directional positioning section relative to the base, and the second directional adjustment section being used to adjust the position of the second directional positioning section relative to the base.

[0021] Furthermore, the adjustment assembly further includes a connection part, the connection part is provided on the base and is used to fix the adjustment assembly to the base, and both the first-direction adjustment part and the second-direction adjustment part are micrometers. The micrometers are fixed to the connection part, and one end of each micrometer is connected to the first-direction positioning part and the second-direction positioning part.

[0022] Furthermore, the positioning member further includes a locking member for fixing the positioning member to the base at the adjusted position.

[0023] Furthermore, the base includes a central hole, the locking member includes a plate and a bolt, the plate is provided below the base, and the plate is provided with a threaded hole matching the bolt. After the positioning member is adjusted, the bolt is passed through the positioning member and the central hole of the base and connected to the threaded hole on the plate.

[0024] Furthermore, the shapes of both the first-direction positioning part and the second-direction positioning part are both "["-shaped. Here, a convex ring facing the direction of the base is provided in the middle part of the second-direction positioning part, and a storage groove matching the convex ring is provided in the middle part of the first-direction positioning part. The convex ring is inserted into the storage groove, and the first-direction positioning part and the second-direction positioning part can rotate oppositely with the center of the convex ring as the center of the circle.

[0025] Furthermore, the inner hole diameter of the convex ring is greater than or equal to the hole diameter of the through hole of the detection member.

[0026] Furthermore, when the end face of the shaft penetrates through the through hole and exceeds the annular lower surface, the inner hole diameter of the convex ring is larger than the hole diameter of the through hole of the detection member.

[0027] Furthermore, the detection member is a shear force sensor.

[0028] Furthermore, the angle α is greater than 0° and less than 180°.

[0029] The present invention further provides the above semiconductor device and a method for adjusting the shaft, a step S1 of adjusting the position of the shaft with respect to the center line, a step S2 of determining whether the force detected by the detection member exceeds a predetermined threshold value, and if it exceeds, returning to step S1, and if it does not exceed, executing the next step S3, and a step S3 of locking the position of the shaft.

[0030] Compared with the prior art, the present invention has the following advantages.

[0031] 1. In the semiconductor device provided by the present invention, a detection member is provided, and the detection member can detect the external force received by the shaft when it deviates from the center line. Therefore, when adjusting the position of the shaft, it can be determined whether the shaft has been adjusted to the desired position by the external force detected by the detection member, and the reproducibility and convenience can be improved.

[0032] 2. At the same time, it avoids the problem of cracks occurring in the lower dome due to excessive stress caused by excessive adjustment of the shaft.

[0033] 3. In addition, the detection member is provided at the end of the shaft, and the fixing member and the shaft are connected to provide higher-sensitivity force detection.

Brief Description of the Drawings

[0034] To more clearly illustrate the technical solution of the present invention, next, the attached drawings used in the description will be briefly described. Obviously, the drawings described below are one embodiment of the present invention, and those skilled in the art can obtain other drawings from these drawings on the premise of not spending creative labor. [Figure 1] It is a schematic structural diagram of the semiconductor device provided by the present invention. [Figure 2] It is a top view of the shaft adjusting device provided by the present invention. [Figure 3]This is a cross-sectional view of the axis adjustment device in the second direction provided by the present invention. [Figure 4] This is a schematic diagram of one structure of the shaft, positioning member, and detection member provided by the present invention. [Figure 5] This is another schematic diagram of the shaft, positioning member, and detection member provided by the present invention. [Figure 6] This is a schematic diagram of another structure of the shaft, positioning member, and detection member provided by the present invention. [Modes for carrying out the invention]

[0035] Next, the solutions provided by the present invention will be described in more detail, along with the drawings and embodiments for carrying out the invention. The following description will make the merits and features of the present invention clearer. It should be noted that the drawings are in a highly simplified form, all using inaccurate proportions, and are used solely to aid in the convenient and clear explanation of the objectives of the embodiments of the present invention. The drawings are referenced to make the objectives, features, and merits of the present invention clearer and easier to understand. The structures, proportions, sizes, etc., shown in the drawings attached to this specification are used solely to aid in the interpretation of the contents shown in the specification and are intended for understanding by those familiar with this art. They are not requirements that limit the implementation of the present invention and therefore have no substantial technical significance. Any changes in structure, proportions, or sizes should remain within the scope of the technical content revealed by the present invention without affecting the effects that the present invention may produce and the objectives that can be achieved.

[0036] Figure 1 shows a schematic diagram of the structure of a semiconductor device provided by the present invention. As shown in Figure 1, the present invention provides a semiconductor device. Optionally, the semiconductor device is at least one of an epitaxial growth device and a rapid heat treatment device. The present invention takes an epitaxial growth device as an example, which is used to deposit an epitaxial growth layer on the surface of a wafer, and the epitaxial growth layer may be a silicon epitaxial growth layer, a silicon germanium epitaxial growth layer, or a doped silicon germanium epitaxial growth layer.

[0037] As shown in Figure 1, the semiconductor device 100 provided by the present invention mainly comprises a chamber and a control device 200. The chamber is constructed by sealing and connecting an upper dome 104, a lower dome 107, and side walls 106, and the chamber 100 is installed symmetrically along the centerline 130 of the chamber, and the base is generally rotated around the centerline 130. The upper dome 104 is substantially convex and comprises a circular translucent portion and a flange positioned around the periphery of the translucent portion, and the lower dome 107 is substantially umbrella-shaped, and both the upper dome 104 and the lower dome 107 are made of quartz material, and the chamber fixes the upper dome 104 to the side walls 106 via an upper flange 103. An upper heating lamp group 102 is provided above the chamber, and a lower heating lamp group 108 is provided below the chamber. An intake port 116 is provided at one end of the chamber, and an exhaust port 105 is provided at the other end opposite the intake port 116. When the necessary process is carried out in the chamber, the process gas flows into the chamber from the intake port 116 and reaches the surface of the wafer 118. The upper heating lamp group 102 and the lower heating lamp group 108 heat the wafer 118 to the required temperature to react with the process gas, and the reacted process gas is then discharged from the chamber through the exhaust port 105. On the horizontal plane, the chamber is further provided with a wafer transport port in the vertical direction of the connection line between the intake port and the exhaust port for transporting the wafer 118 into the chamber and transporting it out of the chamber. To facilitate adjustment of the process temperature and to easily understand the process temperature status of the wafer 118 inside the chamber, the chamber is equipped with an upper thermometer 101 and a lower thermometer 112 that measure the process temperature of the wafer 118 in real time via an upper dome 104 and a lower dome 107, respectively.

[0038] As shown in Figure 1, the semiconductor device further comprises a base 117 for mounting a wafer 118, a rotary support shaft 114, support pins 115, a support frame 113, an axis 120, and a rotation mechanism 109. The base 117 is connected to the rotary support shaft 114 and drives the base 117 and the wafer 118 to rotate around the centerline 130, or drives the base 117 to move up and down, through the rotation of the rotary support shaft 114 and the vertical movement of the base 117. The wafer support pins 115 are movably provided within pin holes in the base. The rotary support shaft 114 is driven to move the support pins 115 downward, after which the support frame 113 pushes up the support pins 115, separating the wafer from the base 117. The rotation mechanism 109 is connected to the rotary support shaft 114 to rotate the rotary support shaft 114 during the process.

[0039] The shaft 120 is connected to the base directly or indirectly, and is selectably connected to the base 117 via the rotating mechanism 109 and the rotating support shaft 114.

[0040] The adjustment device 200 includes a detection member 301, which, as shown in Figure 1, is provided at the end of the shaft 120 and is used to detect the external force acting on the shaft 120 when it is misaligned with respect to the center line 130.

[0041] The detection member provided by the present invention can detect the external force acting on the shaft 120 when it is misaligned with respect to the center line 130. Therefore, when adjusting the shaft 120 using the adjustment device 200, the detection member can determine whether or not the shaft 120 has been adjusted to the desired position based on the external force detected, thus avoiding the instability and wasted time caused by adjusting the shaft position based on experience.

[0042] Figure 2 shows a top view of the adjustment device 200 provided by the present invention. Figure 3 shows a cross-sectional view of the adjustment device 200 provided by the present invention in a second direction. As shown in Figures 2 and 3, the adjustment device 200 further includes a base 205 and a positioning member. Here, the position of the base is fixed with respect to the position of the chamber of the semiconductor device, and the base 205 is fixedly connected to the chamber of the semiconductor device, or the base 205 is fixedly connected to a member fixed at another position, the positioning member is provided on the base 205 and used to adjust and position the position of the shaft 120 in a horizontal plane, the detection member is connected to the positioning member, and the positioning member is provided above the base 205, and at the same time the detection member 301 is provided on the positioning member, and the detection member 301 is provided on the upper surface of the positioning member, and the shaft 120 is provided on or above the positioning member. The positioning member includes a fixing member 240 for fixing the detection member 301 to the positioning member, and optionally the fixing member 240 is provided above the detection member 301 and is detachably connected to the positioning member, optionally the fixing member 240 is used to position the shaft 120, and optionally the fixing member 240 is used to receive the force of the shaft 120 when it is misaligned with respect to the center line 130.

[0043] As shown in Figures 2 and 3, the positioning member includes a first direction positioning section 211 and a second direction positioning section 209 located on a horizontal plane, the first direction positioning section 211 and the second direction positioning section 209 are arranged to intersect, the first direction positioning section 211 extends along a first direction, and the second direction positioning section 209 extends along a second direction, with an angle of α between the first and second directions. The positioning member can drive the shaft 120 to move in the first or second direction and fix the shaft in a desired position.

[0044] Optionally, the adjustment device 200 further comprises an adjustment assembly, each of which is connected to a base 205 and a positioning member, and the adjustment assembly includes a first directional adjustment section 203 and a second directional adjustment section 207 located in the horizontal plane, the first directional adjustment section 203 being used to adjust the position of the first directional positioning section 211 relative to the base 205, and the second directional adjustment section 207 being used to adjust the position of the second directional positioning section 209 relative to the base 205.

[0045] Optionally, the adjustment assembly further comprises a connector provided on a base and used to fix the adjustment assembly to the base 205, and both the first directional adjustment unit 203 and the second directional adjustment unit 207 are micrometers, which are fixed to the connector and have one end connected to the first directional positioning unit 211 and the second directional positioning unit 209. Selectively, the connection portion includes a first connection portion 204 and a second connection portion 206, the first direction adjustment portion 203 is connected to the first connection portion 204 and one end thereof is connected to the first direction positioning portion 211, the micrometer of the first direction adjustment portion 203 is driveable by screwing it in to move the first direction positioning portion 211 relative to the first connection portion in a first direction, and rotates slightly around the center 202 of the first connection portion when moved, the second direction adjustment portion 207 is fixed to the second connection portion 206 and one end thereof is connected to the second direction positioning portion 209, the micrometer of the second direction adjustment portion 207 is driveable by screwing it in to move the second direction positioning portion 209 relative to the second connection portion in a second direction, and rotates slightly around the center 208 of the second connection portion when moved. Here, the shapes of both the first directional positioning unit 211 and the second directional positioning unit 209 are "[ ] shape.

[0046] Optionally, the positioning member further comprises a locking member for fixing the positioning member to the base 205 in the adjusted position.

[0047] Further options include the base 205 including a central hole 212, the locking member including a plate 221 and a bolt 219, the plate 221 being located below the base 205 and having a screw hole that fits the bolt 219, and after the positioning member is adjusted, the bolt 219 is passed through the positioning member and the central hole 212 of the base and connected to the screw hole on the plate.

[0048] Selectively, the second directional positioning section 209 is provided with a convex ring 210 facing the direction of the base 205 in its intermediate portion, and the first directional positioning section 211 is provided with a storage groove 225 that fits the convex ring 210 in its intermediate portion, and the convex ring is inserted into the storage groove, so that the first directional positioning section 211 and the second directional positioning section 209 can rotate opposite each other with the center of the convex ring 210 as the center.

[0049] The connection method between the shaft and the positioning member will be described as follows. Specifically, a mounting groove is provided on the upper surface of the positioning member, and the illustrated detection member 301 and fixing member 240 are provided in the illustrated mounting groove, the shape of the illustrated mounting groove matches the outer shapes of the illustrated detection member 301 and fixing member 240, the illustrated mounting groove is a cylindrical groove, a stepped portion is provided in the cylindrical groove, the detection member 301 is annular, and the annular detection member 301 further includes a through hole that penetrates the upper and lower surfaces of the annular shape. Selectively, the fixing member 240 is annular or annular-like in shape, the lower surface of the fixing member 240 is bonded to the upper surface of the detection member 301, the fixing member 240 includes a hole, the shaft 120 is provided in the hole to position the shaft, and the hole is a through hole or a blind hole. The detection member 301 is provided at the bottom of the cylindrical groove, and the fixing member 240 is provided at the stepped portion of the cylindrical groove. Preferably, the radius of the fixing member 240 is larger than the radius of the detection member 301 to provide a more stable stress contact surface. Naturally, the radius of the fixing member 240 may be optionally the same as the radius of the detection member 301. Preferably, the upper surface of the fixing member 240 is higher than the upper surface of the positioning portion to help the detection member 301 detect force. Naturally, the upper surface of the fixing member 240 may be at the same height as the upper surface of the positioning portion or lower. To help detect force, the diameter of the shaft 120 is the same as the diameter of the through hole in the detection member, and to position the shaft 120, the diameter of the shaft 120 is the same as the diameter of the hole in the fixing member. A vertical hole is provided at the bottom of the mounting groove, the diameter of which is greater than or equal to the diameter of the shaft 120, and the vertical hole can be optionally positioned at the location of the convex ring, that is, forming the inner hole of the convex ring, and of course, the vertical hole can be optionally not positioned within the convex ring but at another location on the positioning member, in which case the convex ring is a projection, specifically as described below.

[0050] Figures 4-6 show schematic diagrams of the structures of various embodiments of the shaft, positioning member, and detection member provided by the present invention.

[0051] In one embodiment, as shown in Figure 4, the end face of the shaft 120 is located within the through hole and interposed between the annular upper and lower surfaces, and the hole in the fixing member 240 is a through hole. The end face of the shaft 120 first passes through the hole in the fixing member 240, and then extends downward into the through hole of the detection member 301. In this embodiment, the hole in the fixing member 240 allows the shaft 120 to be positioned within the hole, the inner surface of the through-hole in the detection member 301 contacts the shaft 120, and at the same time, the inner surface of the hole in the fixing member 240 also contacts the shaft 120 as shown in the figure. When the shaft 120 is misaligned with respect to the center line 130, the shaft simultaneously applies a horizontal force to the inner surface of the hole in the fixing member 240 and the inner surface of the through-hole in the detection member 301. The detection member 301 as shown can detect the force the shaft experiences when it is misaligned with respect to the center line, and the greater the misalignment of the shaft 120 with respect to the center line, the greater the detection value of the detection member 301 as shown in the figure.

[0052] In one embodiment, as shown in Figure 5, the end face of the shaft 120 penetrates the through hole and extends beyond the annular lower surface, and the hole in the fixing member 240 is a through hole. Here, the diameter of the vertical hole at the bottom of the mounting groove is larger than the diameter of the through hole in the detection member, that is, the diameter of the inner hole of the convex ring is larger than the diameter of the through hole in the detection member. The end face of the shaft first penetrates the hole in the fixing member 240, and then extends downward until the end face of the shaft 120 is lower than the lower surface of the detection member 301, and penetrates the through hole in the detection member 301. In this embodiment, the hole in the fixing member 240 allows the shaft 120 to be positioned within the hole, and the inner surface of the through-hole in the detection member 301 and the inner surface of the hole in the fixing member 240 are in contact with the shaft 120. When the shaft 120 is misaligned with respect to the center line 130, the shaft simultaneously applies a horizontal force to the inner surface of the hole in the fixing member 240 and the inner surface of the through-hole in the detection member 301. The illustrated detection member 301 can detect the force the shaft experiences when it is misaligned with respect to the center line, and the greater the misalignment of the shaft 120 with respect to the center line, the greater the detection value of the illustrated detection member 301. In this embodiment, since the shaft extends deeper from below, the hole in the positioning member provides a better positioning effect on the shaft. Furthermore, since the diameter of the vertical hole (inner hole of the convex ring) is larger than the diameter of the shaft, the shaft does not come into contact with the inner surface of the vertical hole, and the detection member 301 can detect a larger and more sensitive force.

[0053] In another embodiment, as shown in Figure 6, the end face of the shaft is provided on the fixing member 240, and the end face of the shaft is located above the upper surface of the detection member. Specifically, the shaft is located in a hole in the fixing member 240 and is interposed between the upper and lower surfaces of the fixing member 240. In this embodiment, the hole in the fixing member 240 may be a through hole or a blind hole. The end face of the shaft 120 first penetrates the upper surface of the fixing member 240, and then extends downward into the hole in the fixing member 240. In this embodiment, the hole in the fixing member 240 allows the shaft 120 to be positioned within the hole, and the inner surface of the hole in the fixing member 240 contacts the shaft 120, but the inner surface of the detection member 301 does not contact the shaft 120. When the shaft 120 is misaligned with respect to the center line 130, the shaft applies a horizontal force to the inner surface of the hole in the fixing member 240. Due to the balance and interaction of forces, the detection member 301 receives a force from the fixing member 240. Therefore, the illustrated detection member 301 can detect the force the shaft receives when it is misaligned with respect to the center line, and the greater the misalignment of the shaft 120 with respect to the center line, the greater the detection value of the illustrated detection member 301.

[0054] The fixing member 240 is optionally connected to the positioning member via threads, bolts, or screws. Specifically, to enable a detachable connection between the fixing member 240 and the positioning member, the side wall of the fixing member 240 is provided with male threads, the mounting groove of the positioning member is provided with female threads that match the male threads, or a hole or threaded hole is provided around or at another location on the fixing member 240, and the fixing member is detachably fixed to the positioning member by screwing a bolt or screw into the hole or threaded hole. The connection methods are merely examples and are not specifically limited herein.

[0055] Selectively, the detection member 301 is a shear force sensor.

[0056] Selectively, the angle α between the first direction and the second direction is greater than 0° and less than 180°, preferably, the angle α is greater than 80° and less than 100°.

[0057] In addition, the semiconductor device further comprises a controller and an interactive terminal, the controller being electrically connected to the detection member and the interactive terminal, the detection member transmitting a stress-related signal to the controller, the controller processing the received signal and transmitting the processed signal to the interactive terminal, the interactive terminal displaying the processed signal, and the technician being able to verify the processed signal via the interactive terminal. Optionally, the controller is a host system, and the interactive terminal in the illustration is a display.

[0058] The present invention further provides a method for adjusting the axis of the above-mentioned semiconductor device.

[0059] S1, adjust the position of the axis with respect to the center line.

[0060] Specifically, the first direction adjustment unit 203 and / or the second direction adjustment unit 207 are controlled, that is, the micrometer is twisted to adjust the positions of the first direction positioning unit 211 and the second direction positioning unit 209 relative to the base 205, and thus the shaft 120 is driven to move in the first direction and / or the second direction until the shaft 120 aligns with the center line.

[0061] In step S2, it is determined whether the force detected by the detection member exceeds a predetermined threshold. If it exceeds the threshold, the process returns to step S1. If it does not exceed the threshold, the next step S3 is executed.

[0062] Specifically, the controller compares the force the shaft experiences when it deviates from the center line detected by the detection member with a predetermined threshold value and processes the results by observing the processing results displayed on the interactive terminal. If the force the shaft experiences still exceeds the predetermined force threshold value, the controller continues step S1, that is, continues adjusting the position of the shaft. If the force the shaft experiences does not exceed the predetermined force threshold value, the controller stops the adjustment.

[0063] S3, the position of the shaft is locked.

[0064] Specifically, after the adjustment is complete, the bolt 219 is passed through the central hole 212 of the positioning member and the base and connected to the screw hole in the plate, thereby fixing the positioning member to the base 205, that is, it is used to fix the position of the shaft 120 relative to the position of the base 205.

[0065] The semiconductor device provided by the present invention is equipped with a detection member, which detects the force acting on the shaft when it deviates from the center line. Therefore, when adjusting the position of the shaft, the detection member can determine whether or not the shaft has been adjusted to the desired position based on the external force detected, thereby increasing convenience and avoiding the problem of cracking of the lower dome due to excessive stress caused by over-adjustment.

[0066] It should be noted that, within this text, relational terms such as "First" and "Second" are used solely to distinguish one entity or operation from another, and do not necessarily require or suggest any actual relationship or order between those entities or operations. Furthermore, the terms "includes," "contains," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus containing a set of elements includes not only those elements but also other elements not explicitly enumerated, or other elements specific to such a process, method, article, or apparatus. Unless otherwise specified, an element limited by the statement "includes one..." does not preclude the presence of other identical elements in a process, method, article, or apparatus containing the said element. Furthermore, the term "connection" within this text means that A and B are directly connected, or A and B are indirectly connected, and an indirect connection such as A and B is connected via C, or via more members such as C and D, and the connection between A and B may be integrated, separate, detachable, or fixed. In this book, the term "selectable" means that the technical feature can be combined with or not combined with any of the features in the text.

[0067] While the present invention has been described in detail with reference to preferred embodiments, it should be recognized that the above description should not be considered a limitation of the invention. Those skilled in the art will see various modifications and substitutions of the invention after reading the above description. Therefore, the scope of protection of the present invention should be limited by the appended claims.

Claims

1. A chamber and A wafer base housed in the aforementioned chamber for placing wafers, A shaft that is directly or indirectly connected to the wafer base, A detection member is positioned at the end of the shaft to detect the external force acting on the shaft due to the misalignment with the center line of the chamber, A base located in a position fixed to the position of the chamber, A positioning member is installed on the base and used to adjust the position of the axis on a horizontal plane, and is connected to the detection member, Rotation mechanism and The rotating mechanism comprises a rotating support shaft connected to the aforementioned rotating mechanism, The positioning member further comprises a fixing member for fixing the detection member to the positioning member, The detection member is annular, and the annular shape includes through holes that penetrate the upper and lower surfaces of the annular shape. The fixing member is provided with a hole for positioning the shaft, The shaft is connected to the wafer base via the rotation mechanism and the rotation support shaft. The shaft detects when the shaft is misaligned with the center line by applying a horizontal force to the inner surface of the through hole in the detection member or the inner surface of the hole in the fixing member. A semiconductor device characterized by the following features.

2. The semiconductor device according to claim 1, characterized in that the fixing member is provided above the detection member.

3. The semiconductor device according to claim 2, characterized in that the end face of the shaft is provided within the through hole and interposed between the upper and lower surfaces of the detection member.

4. The semiconductor device according to claim 2, characterized in that the end face of the shaft penetrates the through hole and extends beyond the annular lower surface.

5. The semiconductor device according to claim 2, characterized in that the end face of the shaft is provided on the fixing member, and the end face of the shaft is located above the upper surface of the detection member.

6. The semiconductor device according to claim 5, characterized in that the aforementioned hole is a through hole or a blind hole.

7. The semiconductor device according to claim 6, characterized in that the diameter of the shaft is the same as the diameter of the through hole in the detection member, and the diameter of the shaft is the same as the diameter of the hole in the fixing member.

8. The semiconductor device according to any one of claims 1 to 7, characterized in that the fixing member is connected to the positioning member via a screw thread, bolt, or screw.

9. The semiconductor device according to any one of claims 1 to 7, characterized in that the positioning member includes a first directional positioning portion and a second directional positioning portion located on a horizontal plane, the first directional positioning portion and the second directional positioning portion are arranged to intersect, and the angle between the first direction and the second direction is α.

10. The aforementioned semiconductor device is It further includes an adjustment assembly that connects to the base and the positioning member, respectively. The semiconductor device according to claim 9, wherein the adjustment assembly includes a first direction adjustment unit and a second direction adjustment unit located in a horizontal plane, the first direction adjustment unit is used to adjust the position of the first direction positioning unit with respect to the base, and the second direction adjustment unit is used to adjust the position of the second direction positioning unit with respect to the base.

11. The semiconductor device according to claim 10, wherein the adjustment assembly further comprises a connecting portion, the connecting portion being provided on a wafer base and used to fix the adjustment assembly to the base, and both the first direction adjustment portion and the second direction adjustment portion are micrometers, the micrometers being fixed to the connecting portion and one end of each connected to the first direction positioning portion and the second direction positioning portion.

12. The semiconductor device according to claim 11, wherein the positioning member further comprises a locking member for fixing the positioning member to the base in the adjusted position.

13. The semiconductor device according to claim 12, characterized in that the base includes a central hole, the locking member includes a plate and a bolt, the plate is provided below the base and the plate is provided with a screw hole that matches the bolt, and after the positioning member is adjusted, the bolt is passed through the positioning member and the central hole of the base and connected to the screw hole on the plate.

14. The semiconductor device according to claim 9, wherein the shapes of the first directional positioning portion and the second directional positioning portion are both concave, and a convex ring facing the base is provided in the middle of the second directional positioning portion, and a storage groove matching the convex ring is provided in the middle of the first directional positioning portion, the convex ring is inserted into the storage groove, and the first directional positioning portion and the second directional positioning portion can rotate opposite each other with the center of the convex ring as the center of the circle.

15. The semiconductor device according to claim 14, characterized in that the diameter of the inner hole of the convex ring is greater than or equal to the diameter of the through hole of the detection member.

16. The semiconductor device according to claim 15, characterized in that, when the end face of the shaft penetrates the through hole and exceeds the annular lower surface, the diameter of the inner hole of the convex ring is larger than the diameter of the through hole of the detection member.

17. The semiconductor device according to any one of claims 1 to 7, characterized in that the detection member is a shear force sensor.

18. The semiconductor device according to claim 9, characterized in that the angle α is greater than 0° and less than 180°.

19. Step S1 of adjusting the position of the axis with respect to the center line of the chamber, Step S2 determines whether the force detected by the detection member exceeds a predetermined threshold. If it exceeds the threshold, the process returns to step S1; if it does not exceed the threshold, the next step S3 is executed. The semiconductor device according to claim 1, further comprising step S3 for locking the position of the shaft.

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