Laser processing equipment

Abstract

To provide a laser processing device capable of realizing high productivity even when formation of a peeling band and inspection of the peeling band are performed simultaneously.SOLUTION: A laser processing device includes: a first reflected light detection unit which has a first photodetector detecting inspection light reflected by a crack in an inspection region located on one side of a focal point in the direction along an X axis; and a second reflected light detection unit which has a second photodetector detecting the inspection light reflected by the crack in an inspection region located on the other side of the focal point in the direction along the X axis. When irradiating laser beam and forming a release band to an irradiation planned area of laser beam from an outer peripheral edge located on one side of a processed workpiece in the direction along the X axis to an outer peripheral edge located on the other side of a workpiece to be processed in the direction along the X axis, information about the inspection light reflected by the crack is acquired in the whole formation planned area of the release band from the outer peripheral edge located on one side of the workpiece processed in the direction along the X axis to the outer peripheral edge position on the other side of the workpiece to be processed in the direction along the X axis.SELECTED DRAWING: Figure 1

Claims

1. A laser processing device, A holding unit having a holding surface for holding a workpiece, A laser beam irradiation unit comprising a laser oscillator that generates a laser beam of a wavelength that penetrates the workpiece, and a focuser that focuses the laser beam generated by the laser oscillator to a focal point, wherein the laser beam is irradiated into the workpiece held by the holding unit so as to focus the laser beam into the workpiece, thereby forming a delamination zone inside the workpiece that includes a modified portion and cracks extending from the modified portion, A feed mechanism that moves the holding unit and the focusing point of the laser beam relative to each other along the X-axis and the Y-axis intersecting the X-axis, An inspection light irradiation unit having a light source that generates inspection light of a wavelength that penetrates the workpiece, and irradiating the inspection area including the peeled band formed on the workpiece with the inspection light, A first reflected light detection unit having a first light-receiving element that detects the inspection light reflected by the crack in the inspection area located on one side of the focal point in the direction along the X axis, A second reflected light detection unit having a second light-receiving element that detects the inspection light reflected by the crack in the inspection area located on the other side of the light-gathering point in the direction along the X-axis, A control unit comprising a processing unit and a storage device, which controls each component according to a program stored in the storage device, The control unit, in accordance with the program, When forming the peeling band by irradiating the laser beam into the area to be irradiated, from the outer peripheral edge located on one side of the workpiece in the direction along the X-axis to the outer peripheral edge located on the other side of the workpiece in the direction along the X-axis, In a first detection range extending from a first region outside the outer peripheral edge located on one side of the workpiece in the direction along the X-axis to a second region inside the outer peripheral edge located on the other side of the workpiece in the direction along the X-axis, the inspection light reflected by the crack is detected by the first light-receiving element. In a second detection range extending from a third region inside the outer peripheral edge on one side of the workpiece in the direction along the X-axis to a fourth region outside the outer peripheral edge on the other side of the workpiece in the direction along the X-axis, the inspection light reflected by the crack is detected by the second light-receiving element. A laser processing apparatus that acquires information of the inspection light reflected by the crack over the entire area in which the delamination band is to be formed, from the outer peripheral edge located on one side of the workpiece in the direction along the X-axis to the outer peripheral edge located on the other side of the workpiece in the direction along the X-axis.

2. The control unit, in accordance with the program, The laser processing apparatus according to claim 1, which uses the acquired information to calculate the ratio of the area in which the peeling band is deemed to have actually been formed to the area in which it is to be formed.

3. The control unit, in accordance with the program, The laser processing apparatus according to claim 2, wherein if the ratio does not reach a threshold, the laser beam is irradiated again to the region where the ratio has not reached the threshold.

4. The control unit, in accordance with the program, The laser processing apparatus according to claim 2, wherein the processing conditions are adjusted when the ratio does not reach a threshold.

5. The first light-receiving element and the second light-receiving element are, A laser processing apparatus according to any one of claims 1 to 4, configured to detect the inspection light reflected by the crack located on one side of the focusing point in the direction along the Y axis.

6. The first light-receiving element and the second light-receiving element are, A laser processing apparatus according to any one of claims 1 to 4, configured to detect the intensity of the inspection light reflected by the crack.

7. The first light-receiving element and the second light-receiving element are, A laser processing apparatus according to any one of claims 1 to 4, configured to generate an image of the inspection area using the inspection light reflected from the inspection area including the crack.

8. A laser processing device, A holding unit having a holding surface for holding a workpiece, A laser beam irradiation unit comprising a laser oscillator that generates a laser beam of a wavelength that penetrates the workpiece, and a focuser that focuses the laser beam generated by the laser oscillator to a focal point, wherein the laser beam is irradiated into the workpiece held by the holding unit so as to focus the laser beam into the workpiece, thereby forming a delamination zone inside the workpiece that includes a modified portion and cracks extending from the modified portion, A feed mechanism that moves the holding unit and the focusing point of the laser beam relative to each other along the X-axis and the Y-axis intersecting the X-axis, An inspection light irradiation unit having a light source that generates inspection light of a wavelength that penetrates the workpiece, and irradiating the inspection area including the peeled band formed on the workpiece with the inspection light, A reflected light detection unit having a light-receiving element that detects the inspection light reflected from the crack in the inspection area, which includes a region on a straight line parallel to the Y-axis and passing through the focal point, A control unit comprising a processing unit and a storage device, which controls each component according to a program stored in the storage device, The control unit, in accordance with the program, When forming the peeling band by irradiating the laser beam into the area to be irradiated, from the outer peripheral edge located on one side of the workpiece in the direction along the X-axis to the outer peripheral edge located on the other side of the workpiece in the direction along the X-axis, A laser processing apparatus that acquires information on the inspection light reflected by the cracks by having a light-receiving element detect the inspection light reflected by the cracks in the entire area where the delamination band is to be formed, from the outer peripheral edge located on one side of the workpiece in the direction along the X-axis to the outer peripheral edge located on the other side of the workpiece in the direction along the X-axis.

9. The control unit, in accordance with the program, The laser processing apparatus according to claim 8, which uses the acquired information to calculate the ratio of the area in which the peeling band is deemed to have actually been formed to the area in which it is to be formed.

10. The control unit, in accordance with the program, The laser processing apparatus according to claim 9, wherein if the ratio does not reach a threshold, the laser beam is irradiated again to the region where the ratio has not reached the threshold.

11. The control unit, in accordance with the program, The laser processing apparatus according to claim 9, which adjusts the processing conditions when the ratio does not reach a threshold.

12. The control unit shall, in accordance with the program, When irradiating the area to be irradiated with the laser beam to form the delamination zone, A laser processing apparatus according to any one of claims 8 to 11, wherein the inspection light reflected by the crack is detected by the light-receiving element in the area to be formed which does not overlap with the area to be irradiated.

13. The light-receiving element is, A laser processing apparatus according to any one of claims 8 to 11, configured to detect the intensity of the inspection light reflected by the crack.

14. The light-receiving element is, A laser processing apparatus according to any one of claims 8 to 11, configured to generate an image of the inspection area using the inspection light reflected from the inspection area including the crack.

Images