Plating equipment

Abstract

The present invention provides a plating apparatus that can observe the plating film formed on a substrate. The plating apparatus comprises a plating tank, a substrate holder for holding a substrate, an anode disposed in the plating tank so as to face the substrate held by the substrate holder, a resistor disposed between the substrate holder and the anode for adjusting the electric field, the resistor having a plurality of through holes that communicate the substrate holder side and the anode side, a first detection electrode provided on the substrate holder side surface of the resistor, a second detection electrode provided on the anode side surface of the resistor, and a control module that measures the potential difference between the first detection electrode and the second detection electrode and estimates the plating current based on the potential difference.

Claims

1. Plating tank and A substrate holder for holding the substrate, an anode positioned in the plating bath so as to face the substrate held in the substrate holder, A resistor disposed between the substrate holder and the anode to adjust the electric field, the resistor having a plurality of through holes that communicate the substrate holder side and the anode side, A first detection electrode provided on the substrate holder side surface of the resistor, A second detection electrode provided on the anode-side surface of the resistor, A control module that measures the potential difference between the first detection electrode and the second detection electrode and estimates the plating current based on the potential difference, A plating apparatus equipped with the following features.

2. The system comprises a plurality of electrode pairs, each consisting of a first detection electrode and a second detection electrode. The first electrode pair among the plurality of electrode pairs is positioned at the first electrode position opposite the first position on the substrate. The second electrode pair among the plurality of electrode pairs is positioned at a second electrode position opposite to the second position, which is located on the outer periphery of the substrate than the first position on the substrate. The plating apparatus according to claim 1.

3. The system comprises a plurality of electrode pairs, each consisting of a first detection electrode and a second detection electrode. The third electrode pair among the plurality of electrode pairs is positioned at the third electrode position opposite the third position on the substrate. The fourth electrode pair among the plurality of electrode pairs is positioned at a fourth electrode position opposite to the third position on the substrate, which is spaced apart along the outer circumference of the substrate. The plating apparatus according to claim 1.

4. The resistor comprises a first wiring provided along the substrate holder side surface and coated with an insulating coating, wherein the region of the first wiring not coated with the insulating coating constitutes the first detection electrode. The resistor is provided with a second wiring that is provided along the anode-side surface and is insulated, and the region of the second wiring that is not insulated constitutes the second detection electrode. The plating apparatus according to claim 1.

5. The plating apparatus according to claim 4, wherein wiring grooves for accommodating the first wiring and the second wiring are formed on the substrate holder side surface and the anode side surface of the resistor.

6. The plating apparatus according to claim 1, wherein the first detection electrode and the second detection electrode have an elongated shape that extends along the outer circumference of the substrate.

7. The circuit board holder is further provided with a rotating mechanism for rotating the circuit board holder. The control module is configured to measure the potential difference between the first detection electrode and the second detection electrode while the substrate is being rotated by the rotation mechanism. The plating apparatus according to claim 1.

8. The plating apparatus according to any one of claims 1 to 7, wherein the control module adjusts the plating conditions based on the estimated plating current.

9. The device includes a shielding body that is movable between a first movable position interposed between the substrate and the anode, and a second movable position retracted from between the substrate and the anode. The control module adjusts the position of the shielding body as an adjustment of the plating conditions. The plating apparatus according to claim 8.

10. The anode mask is positioned between the anode and the resistor, has an anode opening that penetrates both the anode side and the resistor side, and is configured to allow adjustment of the size of the anode opening. The control module adjusts the size of the anode opening as an adjustment of the plating conditions. The plating apparatus according to claim 8.

11. Displaced on the outer periphery of the aforementioned substrate, and equipped with a sieve electrode, The control module adjusts the current applied to the sieve electrode as adjustment of the plating conditions. The plating apparatus according to claim 8.

12. The system includes a drive mechanism that can change the position of the resistor relative to the substrate, The control module changes the position of the resistor as an adjustment of the plating conditions. The plating apparatus according to claim 8.

13. The plating apparatus according to any one of claims 1 to 7, wherein the substrate holder is configured to hold the substrate in the plating bath with the surface to be plated facing downward.

14. The plating apparatus according to any one of claims 1 to 7, wherein the substrate holder is configured to hold the substrate in the plating bath with the surface to be plated facing sideways.

Images