Meat defect inspection system, meat defect inspection method

Abstract

To contribute to simplifying the inspection system while ensuring the ability to detect missing meat. [Solution] The support system 10 includes a chuck device 11 for removing the molded product 90 from the mold 80. An inspection module 35 having an inspection pin 51 is mounted on the movable base 21 of the chuck device 11, and when removing the molded product 90 from the mold 80, the inspection pin 51 moves toward the molded product 90 together with the movable base 21. The support system 10 also includes an inspection circuit 71 that includes the mold 80 and the inspection pin 51 as contact points. The inspection circuit 71 is maintained in an open state when the inspection pin 51 is moved toward a specific part behind the corner CP of the molded product 90 in the mold 80 and the inspection pin 51 makes contact with the specific part, and switches to a closed state when the inspection pin 51 makes contact with the mold 80. The controller 51 determines that a defect has occurred in the molded product 90 when the inspection circuit 71 is in a closed state.

Claims

[Claim 1] A defect inspection system for inspecting whether or not a defect has occurred in a predetermined part of a molded product formed using a mold, A conductive test pin, A moving means for moving the inspection pin from in front of the molded product toward a specific part behind the predetermined part of the mold, while the molded product remains in the mold, An inspection circuit including the mold and the inspection pin as contact points. Equipped with, When the inspection pin is moved toward the specified part, the electrical state of the inspection circuit differs depending on whether the inspection pin contacts the specified part or the mold. A meat defect inspection system characterized by comprising a determination means for determining the presence or absence of meat defects from the electrical state of the inspection circuit. [Claim 2] A defect inspection system for inspecting whether or not a defect has occurred in a predetermined part of a molded product formed using a mold, A conductive test pin, A moving means for moving the inspection pin from in front of the molded product toward a specific part behind the predetermined part of the mold, while the molded product remains in the mold, An inspection circuit including the mold and the inspection pin as contact points. Equipped with, The inspection circuit is configured such that when the inspection pin is moved toward the specific part, it remains open when the inspection pin comes into contact with a predetermined part of the molded product, and switches to a closed state when the inspection pin comes into contact with a specific part of the mold. A material defect inspection system characterized by comprising a determination means for determining that material defects have occurred in the molded product when the inspection circuit is in the closed state. [Claim 3] The aforementioned means of transport is An inspection module having the inspection pin and a holder that holds the inspection pin so as to be displaceable between a standby position and a protruding position where the amount of protrusion is greater than that of the standby position, A movable base on which the inspection module is mounted, A first drive unit moves the movable base closer to the specific part with the tip of the pin pointed towards the specific part. When the movable base is moved toward the specific part, a first drive unit displaces the inspection pin from the standby position to the protruding position, Includes, The defect inspection system according to claim 2, characterized in that, after the inspection pin is positioned in the protruding position, the first drive unit is stopped from operating, thereby suppressing the reaction force when the inspection pin comes into contact with a specific part of the mold or a predetermined part of the molded product. [Claim 4] The defect inspection system according to claim 3, characterized in that when the inspection pin is positioned at a contact position that contacts either a specific part of the mold or a predetermined part of the molded product, the inspection pin is configured to be located between the protruding position and the standby position. [Claim 5] The defective material inspection system according to claim 4, characterized in that the movable base includes a holding portion for holding the molded product and constitutes a removal means for removing the molded product from the mold. [Claim 6] The defect inspection system according to claim 5, characterized in that, before the molded product is held by the holding part, the inspection pin is moved to a contact position that contacts either a specific part of the mold or a predetermined part of the molded product. [Claim 7] A method for inspecting whether or not there is a defect in a predetermined part of a molded product formed using a mold, The first step is to place a conductive inspection pin in front of the molded product while the molded product remains in the mold, After positioning the inspection pin in the first step, the second step involves moving the inspection pin toward a specific part behind the predetermined part of the mold, A method for inspecting for material defects, comprising: a third step of monitoring an inspection circuit in which the electrical state differs depending on whether the inspection pin contacts the specific part or the mold, and determining the presence or absence of material defects from the electrical state of the inspection circuit.

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