Epoxy resin composition, cured product, semiconductor device, and method for manufacturing a semiconductor device.

Abstract

Provided is an epoxy resin composition having a low viscosity and a short gap filling time.　This epoxy resin composition comprises (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) core-shell rubber particles, wherein the shell layer of the core-shell rubber particles (D) contains (meth)acrylic acid and butyl (meth)acrylate as constituent units.

Description

【Technical Field】 【0001】 The present invention relates to an epoxy resin composition, a cured product, a semiconductor device, and a method for manufacturing a semiconductor device. 【Background Art】 【0002】 There is a demand for high performance, multifunctionality, and power saving in semiconductor devices. Conventionally, a SoC (System on chip) that increases the integration density of transistors on one chip and has all functions has been the mainstream, but there are problems such as an increase in manufacturing cost and a decrease in yield due to the enlargement of the chip. In contrast, SiP (System in package), in which a system is divided into a plurality of chips and then integrated at high density, has emerged. In SiP, a substrate called a silicon interposer is introduced. The silicon interposer is placed on the package substrate, and a plurality of chips are arranged side by side in close proximity thereon. Further, a multilayer wiring circuit is formed on the upper side of the silicon interposer and connected to the lower resin substrate by TSV (Through-silicon via). Since active elements such as transistors are not formed on the silicon interposer, the difficulty of enlargement is lower than that of a chip. Therefore, it has become mainstream to enlarge the silicon interposer and mount more chips thereon. Further, for further enlargement, various interposers such as an interposer in which silicon is embedded in a mold resin are being studied. 【0003】 The interposer and the resin substrate are connected via bump electrodes. When thermal loads such as temperature cycles are applied, stress is placed on the bump electrodes due to differences in the linear thermal expansion coefficients of each component, which can cause defects such as cracks in the bump electrodes. For this reason, the gap between the interposer and the resin substrate is sealed with a liquid sealant called underfill to improve resistance to thermal loads (thermal cycle resistance) and the ability to protect the package from heat and external forces (package protection) (Patent Documents 1 and 2). In addition, a method is known in which rubber components (e.g., core-shell rubber particles) are added to the underfill to reduce the elastic modulus of the cured product (sealant) (Patent Document 3). [Prior art documents] [Patent Documents] 【0004】 [Patent Document 1] Japanese Patent Publication No. 2017-171754 [Patent Document 2] Japanese Patent Publication No. 2016-108358 [Patent Document 3] Japanese Patent Publication No. 2019-81816 [Overview of the Initiative] [Problems that the invention aims to solve] 【0005】 In recent years, interposers have become larger in order to improve the performance and functionality of semiconductor devices. As interposers become larger, the stress applied to the encapsulant also increases. Therefore, there is a need for underfill that can alleviate the stress applied to the encapsulant, suppress the occurrence of cracks in the encapsulant, and provide high bump protection. 【0006】 While adding core-shell rubber particles to the underfill can lower the elastic modulus of the sealant, increasing the amount of rubber added increases the viscosity of the underfill, leading to poor handling. Furthermore, it increases the time required to fill the gap between the interposer and the resin substrate with underfill (gap filling time). In this specification, the latter characteristic is described using the term "injectability." For example, a short gap filling time is described as having excellent injectability. 【0007】 Therefore, an object of the present invention is to provide an epoxy resin composition containing core-shell rubber particles that has low viscosity and excellent injectability. Another object is to provide a cured product of the epoxy resin composition, a semiconductor device equipped with the cured product, and a method for manufacturing the semiconductor device. [Means for solving the problem] 【0008】 The inventors of this invention, after diligent research to achieve the above objectives, found that the above problems can be solved by using an epoxy resin composition containing specific core-shell rubber particles. This invention was completed based on these findings. 【0009】 In other words, in the present invention, Epoxy resin (A) and, Hardener (B), Inorganic filler (C), An epoxy resin composition comprising core-shell rubber particles (D), The present invention provides an epoxy resin composition comprising core-shell rubber particles (D1) as core-shell rubber particles (D), the shell layer of which contains (meth)acrylic acid and butyl (meth)acrylate as constituent units. 【0010】 Preferably, the shell layer in the core-shell rubber particle (D1) further contains at least one selected from the group consisting of methyl (meth)acrylate and glycidyl (meth)acrylate as a constituent unit. 【0011】 The content of the core-shell rubber particles (D1) with respect to the total amount (100% by mass) of the epoxy resin (A) and the curing agent (B) is preferably 1 to 30% by mass. 【0012】 The average particle diameter of the core-shell rubber particles (D1) is preferably 0.03 to 1.0 μm. 【0013】 The content of the inorganic filler (C) with respect to the epoxy resin composition (100% by mass) is preferably 50% by mass or more. 【0014】 The above epoxy resin composition preferably contains silica with an average particle diameter of 100 nm or less as the inorganic filler (C). 【0015】 The epoxy resin (A) preferably contains at least one selected from the group consisting of bisphenol type epoxy resins, aminophenol type epoxy resins, and naphthalene type epoxy resins. 【0016】 The curing agent (B) is preferably an amine-based curing agent. 【0017】 The shell layer of the core-shell rubber particles (D1) preferably does not substantially contain styrene, acrylonitrile, and methacrylonitrile as constituent units. 【0018】 The above epoxy resin composition is preferably for semiconductor encapsulation. 【0019】 In the present invention, a cured product of the above epoxy resin composition is also provided. 【0020】 In the present invention, a substrate, a semiconductor element disposed on the above substrate, the above cured product that encapsulates the above semiconductor element, and a semiconductor device including the above are also provided. 【0021】 In the present invention, a substrate, A step of filling a gap with the epoxy resin composition between the semiconductor element disposed on the substrate and; A step of heating and curing the epoxy resin composition; A method for manufacturing a semiconductor device including these is also provided. 【Advantages of the Invention】 【0022】 Since the epoxy resin composition of the present invention has a low viscosity, it has good handleability. Also, because of its excellent injectability, even when manufacturing a semiconductor device using a substrate such as a large-sized interposer, the filling of the epoxy resin composition into the gap can be efficiently performed. Further, due to having the above characteristics, a larger amount of core-shell rubber particles can be contained compared to conventional epoxy resin compositions. For this reason, it is possible to adjust so that the cured product of the epoxy resin composition exhibits a low elastic modulus. Therefore, a semiconductor device provided with the cured product of the above epoxy resin composition can seal the semiconductor element with high accuracy by the cured product, and exhibits high reliability because the stress applied to the cured product of the epoxy resin composition is reduced. 【Brief Description of the Drawings】 【0023】 [Figure 1] (a) to (c) are diagrams for explaining "Evaluation 2: Gap Filling Test" in the examples. 【Modes for Carrying Out the Invention】 【0024】 (Epoxy Resin Composition) The epoxy resin composition described above comprises an epoxy resin (A), a curing agent (B), an inorganic filler (C), and core-shell rubber particles (D), wherein the core-shell rubber particles (D) include core-shell rubber particles (D1) in which the shell layer contains (meth)acrylic acid and butyl (meth)acrylate as constituent units. The epoxy resin composition may further contain a curing accelerator (E), a coupling agent (F), and other components (G) as described below. In this specification, "(meth)acrylic acid" is a concept that includes acrylic acid and methacrylic acid. Similarly, "(meth)acrylate" is a concept that includes acrylate and methacrylate. 【0025】 • Epoxy resin (A) The above epoxy resin composition, by containing epoxy resin (A), can form a cured product with high electrical insulation properties. The number of epoxy groups in epoxy resin (A) is not particularly limited as long as it is one or more, but it is preferable that it be two or more (i.e., a polyfunctional type epoxy resin). Epoxy resin (A) can be used alone or in combination of two or more types. 【0026】 The epoxy resin (A) may be liquid or solid at room temperature (25°C), but from the viewpoint of the viscosity of the epoxy resin composition, it is preferable that it be liquid. Even if it is a solid epoxy resin, it can preferably be used if it becomes liquid as a mixture when used in combination with a liquid epoxy resin. 【0027】 The epoxy resin (A) is not particularly limited, but examples include bisphenol type epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AF type epoxy resin, bixylenol type epoxy resin, cyclohexane type epoxy resin, dicyclopentadiene type epoxy resin, trisphenol type epoxy resin, naphthol novolac type epoxy resin, phenol novolac type epoxy resin, tert-butyl-catechol type epoxy resin, naphthalene type epoxy resin, naphthol type epoxy resin, anthracene type epoxy resin, glycidylamine type epoxy resin (glycidylamine type epoxy resin without an aromatic structure or glycidylamine type epoxy resin with an aromatic structure), glycidyl ester type epoxy resin (glycidyl ester type epoxy resin without an aromatic structure or glycidyl ester type epoxy resin with an aromatic structure), cresol novolac type epoxy resin, biphenyl type epoxy resin, and linear aliphatic epoxy resin (linear aliphatic epoxy resin without an aromatic structure). Examples include epoxy resins (linear aliphatic epoxy resins having an aromatic structure), epoxy resins having a butadiene structure (epoxy resins having a butadiene structure without an aromatic structure or epoxy resins having a butadiene structure with an aromatic structure), alicyclic epoxy resins (alicyclic epoxy resins having an aromatic structure or alicyclic epoxy resins having an aromatic structure), heterocyclic epoxy resins, spiroring-containing epoxy resins (spiroring-containing epoxy resins having an aromatic structure or spiroring-containing epoxy resins having an aromatic structure), cyclohexanedimethanol-type epoxy resins (cyclohexanedimethanol-type epoxy resins having an aromatic structure or cyclohexanedimethanol-type epoxy resins having an aromatic structure), naphthylene ether-type epoxy resins, trimethylol-type epoxy resins (trimethylol-type epoxy resins having an aromatic structure or trimethylol-type epoxy resins having an aromatic structure), tetraphenylmethane-type epoxy resins, aminophenol-type epoxy resins, and aromatic or aliphatic epoxy resins such as silicone-modified epoxy resins. 【0028】 Among these, epoxy resin (A) preferably contains at least one selected from the group consisting of bisphenol-type epoxy resin, naphthalene-type epoxy resin, aminophenol-type epoxy resin, cyclohexane-type epoxy resin, and glycidylamine-type epoxy resin; more preferably contains at least one selected from the group consisting of bisphenol F-type epoxy resin, naphthalene-type epoxy resin, aminophenol-type epoxy resin, and cyclohexane-type epoxy resin (particularly 1,4-glycidylcyclohexane); and even more preferably contains at least one selected from the group consisting of bisphenol-type epoxy resin, aminophenol-type epoxy resin, and naphthalene-type epoxy resin. 【0029】 The content of bisphenol-type epoxy resin relative to epoxy resin (A) (100% by mass) is not particularly limited, but is preferably, for example, 0 to 100% by mass. The content of naphthalene-type epoxy resin relative to epoxy resin (A) (100% by mass) is not particularly limited, but is preferably, for example, 0 to 50% by mass. The content of aminophenol-type epoxy resin relative to epoxy resin (A) (100% by mass) is not particularly limited, but is preferably, for example, 0 to 90% by mass. The content of cyclohexane-type epoxy resin relative to epoxy resin (A) (100% by mass) is not particularly limited, but is preferably, for example, 0 to 30% by mass. 【0030】 Specific examples of liquid epoxy resins include "YDF-8170" (bisphenol F type epoxy resin), "YDF-8125" (bisphenol A type epoxy resin), "ZX-1658", "ZX-1658GS" (liquid 1,4-glycidylcyclohexane) from Nippon Steel Chemical & Material Co., Ltd., "HP-4032", "HP-4032D", "HP-4032SS" (naphthalene type epoxy resin) from DIC Corporation, and "jER828US", "jER828EL" (bisphenol A type epoxy resin), "jER806", "jER807" (bisphenol A type epoxy resin) from Mitsubishi Chemical Corporation. Examples include phenol F type epoxy resin, "jER152" (phenol novolac type epoxy resin), "jER630", "jER630LSD", "EP3980S" (aminophenol type epoxy resin), "YX7400" (high-rebound epoxy resin), "ZX1059" (a mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin) from Nippon Steel Chemical & Material Co., Ltd., "EX-721" (glycidyl ester type epoxy resin) from Nagase ChemteX Corporation, and "Celoxide 2021P" (alicyclic epoxy resin) from Daicel Corporation. 【0031】 Specific examples of solid epoxy resins include DIC Corporation's "HP-4032H" (naphthalene-type epoxy resin), "HP-4700", "HP-4710" (naphthalene-type tetrafunctional epoxy resin), "N-690" (cresol novolac-type epoxy resin), "N-695" (cresol novolac-type epoxy resin), "HP-7200", "HP-7200L", "HP-7200HH", "HP-7200H", "HP-7200HHH" (dicyclopentadiene-type epoxy resin), "EXA7311", and "EXA7311-G3". "EXA7311-G4", "EXA7311-G4S", "HP6000" (naphthylene ether type epoxy resin), "EPPN-502H" (trisphenol type epoxy resin), "NC-7000-L" (naphthol novolac type epoxy resin), "NC-3000-H", "NC-3000", "NC-3000-L", "NC-3100" (biphenyl type epoxy resin), "ESN475V" (naphthol type epoxy resin), "ESN485" (naphthol novolac type epoxy resin) from Nippon Steel Chemical & Material Co., Ltd. (Type 3 epoxy resin), Mitsubishi Chemical Corporation's "YX4000H", "YL6121" (biphenyl type epoxy resin), "YX4000HK" (bixylenol type epoxy resin), "YL7760" (bisphenol AF type epoxy resin), "YX8800" (anthracene type epoxy resin), Osaka Gas Chemical Co., Ltd.'s "PG-100", "CG-500", Mitsubishi Chemical Corporation's "YL7800" (fluorene type epoxy resin), Mitsubishi Chemical Corporation's "jER1010" (solid bisphenol A type epoxy resin), Examples include "jER1031S" (tetraphenylethane type epoxy resin), "jER157S70" (bisphenol novolac type epoxy resin), "YX4000HK" (bixylenol type epoxy resin) and "YX8800" (anthracene type epoxy resin) from Mitsubishi Chemical Corporation, "PG-100" and "CG-500" from Osaka Gas Chemical Co., Ltd., "YL7800" (fluorene type epoxy resin) from Mitsubishi Chemical Corporation, and "jER1031S" (tetraphenylethane type epoxy resin) from Mitsubishi Chemical Corporation. 【0032】 The epoxy equivalent of epoxy resin (A) is not particularly limited, but is preferably 30 to 1000 g / eq, more preferably 40 to 500 g / eq, and even more preferably 50 to 300 g / eq. 【0033】 The content of epoxy resin (A) in the above epoxy resin composition (100% by mass) is not particularly limited, but is preferably 5% by mass or more, more preferably 8% by mass or more, even more preferably 10% by mass or more, and particularly preferably 12% by mass or more. Alternatively, it is preferably 60% by mass or less, more preferably 50% by mass or less, even more preferably 45% by mass or less, and particularly preferably 40% by mass or less. When the content of epoxy resin (A) is within the above range, the thermal expansion of the cured product tends to be reduced and the toughness tends to be improved. In addition, the epoxy resin composition tends to have low viscosity and excellent pourability. 【0034】 • Hardener (B) The curing agent (B) is not particularly limited as long as it initiates, promotes, or accelerates the polymerization of the epoxy resin, but examples include amine-based curing agents, acid anhydride-based curing agents, and phenol-based curing agents. The curing agent (B) may be solid or liquid at room temperature (25°C), but it is preferably liquid. The curing agent (B) may be used alone or in combination of two or more types. 【0035】 Examples of the above-mentioned amine-based curing agents include aromatic amines such as 4,4'-methylenebis(2-ethylaniline), ethyltoluenediamine, diethyltoluenediamine (3,5-diethyltoluene-2,4-diamine and 3,5-diethyltoluene-2,6-diamine, etc.), 1-methyl-3,5-diethyl-2,4-diaminobenzene, 1-methyl-3,5-diethyl-2,6-diaminobenzene, 1,3,5-triethyl-2,6-diaminobenzene, 3,3'-diethyl-4,4'-diaminodiphenylmethane, 3,5,3',5'-tetramethyl-4,4'-diaminodiphenylmethane, and dimethylthiotoluenediamine. Examples of the above-mentioned acid anhydride-based curing agents include alkylated tetrahydrophthalic anhydrides such as methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, phthalic anhydride, dodecenyl succinic anhydride, and methylnadoic anhydride. Examples of the phenolic curing agents mentioned above include phenol novolac resins, cresol novolac resins, naphthol-modified phenolic resins, dicyclopentadiene-modified phenolic resins, and p-xylene-modified phenolic resins. Examples of the imidazole-based curing agents mentioned above include 2-methylimidazole, 2-undecylimidazole, 1-cyanoethyl-2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-ethyl-4-imidazole, 2-phenylimidazole, and 2-phenyl-4-methylimidazole. Microencapsulated imidazole-based curing agents are also examples of imidazole-based curing agents. The curing agent (B) is preferably the above-mentioned amine-based curing agent from the viewpoint of temperature cycling resistance, humidity resistance, and reliability of the semiconductor device, more preferably an aromatic amine, and even more preferably a liquid aromatic amine. 【0036】 The equivalent amount (molecular weight per functional group) of the curing agent (B) is not particularly limited, but is preferably 10 to 300 g / eq, more preferably 20 to 160 g / eq, and even more preferably 30 to 100 g / eq. 【0037】 The amount of curing agent (B) is not particularly limited, but it is preferably such that the stoichiometric equivalent ratio (curing agent equivalent / epoxy group equivalent) with the epoxy resin (A) is, for example, 0.5 to 1.5, and more preferably such that the equivalent ratio is 0.8 to 1.2. 【0038】 The content of the curing agent (B) in the epoxy resin composition (100% by mass) of the present invention is not particularly limited, but is preferably 2% by mass or more, more preferably 4% by mass or more, and even more preferably 5% by mass or more. Also, is preferably 30% by mass or less, more preferably 20% by mass or less, even more preferably 15% by mass or less, and particularly preferably 12% by mass or less. When the content of the curing agent (B) is within the above range, the thermal expansion of the cured product is reduced and the toughness tends to improve. In addition, the epoxy resin composition tends to have low viscosity and excellent pourability. 【0039】 ·Inorganic filler (C) The inorganic filler (C) is not particularly limited, but it is preferable that it (1) has the property of suppressing volume shrinkage (curing shrinkage) caused by the curing reaction of the epoxy resin composition, (2) has the property of suppressing volume change (thermal shrinkage) due to heating of the cured product, that is, has the effect of lowering the coefficient of linear expansion when added, or (3) has both of these properties. 【0040】 Examples of inorganic fillers (C) include silica (silicon dioxide), silicon carbide, silicon nitride, alumina (aluminum oxide), aluminum nitride, aluminum hydroxide, aluminum silicate, magnesium silicate, calcium silicate, calcium carbonate, barium sulfate, barium carbonate, titanium oxide, lime sulfate, potassium titanate, magnesium carbonate, zinc oxide, boron nitride, zirconia (zirconium oxide), and inorganic particles of these materials with treated surfaces. Among these, silica is preferred from the viewpoint of achieving a high filler content, and it is more preferable to include silica with an average particle size of 100 nm or less (sometimes referred to as "nanosilica"). Alumina is also preferred from the viewpoint of achieving a high thermal conductivity. One type of inorganic filler (C) can be used alone, or two or more types can be used in combination. 【0041】 The inorganic filler (C) is preferably surface-treated with a coupling agent having a functional group such as an epoxy group, a (meth)acryloyl group, or an amino group (especially a phenylamino group) from the viewpoint of setting the viscosity of the epoxy resin composition within an appropriate range. Examples of the coupling agent include silane coupling agents such as 3-glycidoxypropyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, and N-phenyl-3-aminopropyltrimethoxysilane. One of the above coupling agents can be used alone for surface treatment of the inorganic filler (C), or two or more can be used in combination. 【0042】 The shape of the inorganic filler (C) is not particularly limited, but examples include spherical (perfectly spherical, nearly spherical, etc.), polyhedral, rod-shaped (cylindrical, prismatic, etc.), plate-shaped, flake-shaped, and irregularly shaped. Among these, a spherical shape is preferred from the viewpoint of achieving a high filling capacity. 【0043】 The average particle size of the inorganic filler (C) is not particularly limited, but is preferably 1 nm to 10 μm, preferably 0.1 to 8 μm, and more preferably 0.3 to 5 μm. When the average particle size of the inorganic filler (C) is within the above range, the viscosity of the epoxy resin composition is within an appropriate range, and a decrease in the gap filling rate tends to occur. In addition, two or more fillers with different average particle sizes may be used in combination to adjust the viscosity of the epoxy resin composition. In this specification, the method for measuring the average particle size of the inorganic filler (C) is not particularly limited, but can be measured using, for example, a laser diffraction / scattering particle size distribution analyzer (product name: LS 13 320, manufactured by Beckman Coulter). 【0044】 The content of inorganic filler (C) relative to the above epoxy resin composition (100% by mass) is not particularly limited, but is preferably 20% by mass or more, more preferably 30% by mass or more, even more preferably 40% by mass or more, and particularly preferably 50% by mass or more. Alternatively, it is preferably 90% by mass or less, more preferably 80% by mass or less, and even more preferably 70% by mass or less. By having the inorganic filler (C) content within the above range, it is possible to reduce the thermal expansion coefficient of the epoxy resin composition while maintaining good workability such as low viscosity and excellent injectability. If nanosilica is included, its content is not particularly limited, but is preferably 0.1 to 30% by mass, more preferably 0.1 to 20% by mass, even more preferably 0.1 to 10% by mass, and particularly preferably 0.3 to 5% by mass relative to the inorganic filler (C) (100% by mass). 【0045】 • Core-shell rubber particles (D) Core-shell rubber particles (D) have the effect of suppressing the occurrence and propagation of fillet cracks when an epoxy resin composition is used as an underfill. Specifically, the inclusion of core-shell rubber particles (D) results in a lower modulus of elasticity in the cured epoxy resin composition, which reduces the stress generated in the fillet area and suppresses the occurrence of fillet cracks. Furthermore, if a fillet crack does occur, the core-shell rubber particles (D) act as a stress reliever, suppressing the propagation of the fillet crack. 【0046】 Core-shell rubber particles (D) refer to rubber particles composed of a core portion and one or more shell layers covering the core portion. Core-shell rubber particles (D) can exhibit good dispersibility in the epoxy resin composition and achieve a low modulus of elasticity in the cured product by composing the core portion of a material with excellent flexibility and the shell layers of a material with excellent affinity for components contained in the epoxy resin composition, particularly epoxy resin (A). 【0047】 In the core-shell rubber particles (D), examples of materials constituting the core include silicone-based rubber such as polydimethylsiloxane, butadiene-based rubber, styrene-based rubber, acrylic-based rubber, polyolefin-based rubber, and silicone / acrylic-based composite rubber. 【0048】 Materials constituting the shell layer include monomers having epoxy groups and monomers not having epoxy groups. In other words, the shell layer contains monomers having epoxy groups and / or monomers not having epoxy groups as constituent units. 【0049】 Examples of monomers having the epoxy group mentioned above include glycidyl group-containing (meth)acrylates such as glycidyl (meth)acrylate, glycidyl methyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate glycidyl ether; and glycidyl group-containing vinyl monomers such as allyl glycidyl ether. 【0050】 Examples of monomers that do not have the epoxy group include unsaturated carboxylic acids, (meth)acrylates that do not have an epoxy group, aromatic vinyl compounds, and vinyl cyanide compounds. Examples of unsaturated carboxylic acids include (meth)acrylic acid, itaconic acid, crotonic acid, and maleic anhydride. Examples of (meth)acrylates that do not have an epoxy group include methyl (meth)acrylate, ethyl (meth)acrylate, and butyl (meth)acrylate. 1-5 Examples include alkyl (meth)acrylates. Examples of the above aromatic vinyl compounds include vinylbenzenes such as styrene, α-methylstyrene, p-methylstyrene, and divinylbenzene. Examples of the above vinyl cyanide compounds include acrylonitriles and methacrylonitriles. 【0051】 The epoxy resin composition of the present invention includes core-shell rubber particles (D1) as core-shell rubber particles (D), wherein the shell layer contains (meth)acrylic acid and butyl (meth)acrylate as constituent units. The epoxy resin composition may also contain core-shell rubber particles (D2) other than core-shell rubber particles (D1). One type of core-shell rubber particle (D) may be used alone, or two or more types may be used in combination. 【0052】 The inclusion of core-shell rubber particles (D1) in the epoxy resin composition allows for a lower viscosity, resulting in improved handling. Furthermore, the improved injectability of the epoxy resin composition enables efficient gap filling. Additionally, because core-shell rubber particles (D1) possess the aforementioned properties, they can be added to the epoxy resin composition in larger quantities compared to conventional core-shell rubber particles. Therefore, it is possible to adjust the cured epoxy resin composition to exhibit a lower elastic modulus. 【0053】 The core-shell rubber particles (D1) may further contain methyl (meth)acrylate and glycidyl group-containing (meth)acrylate (e.g., glycidyl (meth)acrylate) as constituent units in the shell layer. On the other hand, it is preferable that the constituent units are substantially free of styrene, acrylonitrile, and methacrylonitrile. When the core-shell rubber particles (D1) adopt the above configuration, the epoxy resin composition tends to have low viscosity and excellent injectability. 【0054】 The average particle size of the core-shell rubber particles (D) (preferably core-shell rubber particles (D1)) is not particularly limited, but is preferably 0.03 to 1.0 μm, more preferably 0.04 to 0.8 μm, and even more preferably 0.05 to 0.7 μm. A method for measuring the average particle size of the core-shell rubber particles (D) is, for example, to observe a cross-section of a cured product obtained by curing the epoxy resin composition using a scanning electron microscope (SEM). Specifically, any 100 μm 2By observing the area using SEM, the particle size of the core-shell rubber particles (D) or the diameter of the recess where the core-shell rubber particles (D) have fallen out can be arbitrarily selected at 10 locations, and the average value of these values ​​can be taken as the average particle size of the core-shell rubber particles (D). 【0055】 The content of core-shell rubber particles (D) in the epoxy resin composition (100% by mass) is not particularly limited, but is preferably 30% by mass or less, more preferably 25% by mass or less, even more preferably 20% by mass or less, particularly preferably 15% by mass or less, and most preferably 10% by mass or less. Also, is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, even more preferably 1.0% by mass or more, and particularly preferably 1.5% by mass or more. 【0056】 The content of core-shell rubber particles (D1) in the epoxy resin composition (100% by mass) is not particularly limited, but is preferably 30% by mass or less, more preferably 25% by mass or less, even more preferably 20% by mass or less, particularly preferably 15% by mass or less, and most preferably 10% by mass or less. Also, is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, even more preferably 1.0% by mass or more, and particularly preferably 1.5% by mass or more. When the content of core-shell rubber particles (D1) is within the above range, the epoxy resin composition tends to have low viscosity and excellent injectability. 【0057】 The content of core-shell rubber particles (D) relative to the total amount (100% by mass) of epoxy resin (A) and curing agent (B) is not particularly limited, but is preferably 1 to 60% by mass, more preferably 1 to 45% by mass, and even more preferably 1 to 30% by mass. 【0058】 The content of core-shell rubber particles (D1) relative to the total amount (100% by mass) of epoxy resin (A) and curing agent (B) is not particularly limited, but is preferably 1 to 60% by mass, more preferably 1 to 45% by mass, and even more preferably 1 to 30% by mass. When the content of core-shell rubber particles (D1) is within the above range, the epoxy resin composition tends to have low viscosity and excellent injectability. 【0059】 Core-shell rubber particles (D) can be manufactured using known or conventional means, for example, by the following core-forming and shell-forming steps. • Core formation process: This is the process of forming the material that will form the core described above. For example, this may include forming a polysiloxane by emulsion polymerization, or forming an acrylic rubber by polymerizing a monomer containing alkyl (meth)acrylate in the presence of an emulsifier or initiator. • Shell layer formation process: This process involves forming a shell layer by copolymerizing monomers having epoxy groups and / or monomers not having epoxy groups, as needed, with initiators, etc., in the presence of the core particles, to a system containing the core particles obtained in the core formation process. 【0060】 • Curing accelerator (E) The curing accelerator (E) has the property of accelerating the curing of the epoxy resin. The curing accelerator is not particularly limited, but examples include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, and 2-phenyl-4-methylimidazole. Commercially available products include 2-phenyl-4-methylimidazole (manufactured by Shikoku Chemicals Co., Ltd., product name "2P4MZ"), 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine (manufactured by Shikoku Chemicals Co., Ltd., product name "2MZA"), and dicyandiamide. In addition, encapsulated imidazoles called microcapsule-type imidazoles or epoxy adduct-type imidazoles may be used. Examples include "HX3941HP", "HXA3942HP", "HXA3922HP", "HXA3792", "HX3748", "HX3721", "HX3722", "HX3088", "HX3741", "HX3742", "HX3613" (all manufactured by Asahi Kasei Chemicals Corporation), "PN-23J", "PN-40J", "PN-50" (manufactured by Ajinomoto Fine Techno Co., Ltd.), and "FXR-1121" (manufactured by Fuji Kasei Kogyo Co., Ltd.). The curing accelerator (E) can be used alone or in combination of two or more types. 【0061】 The content of the curing accelerator (E) in the above epoxy resin composition (100% by mass) is not particularly limited, but is preferably 0.01% by mass or more, more preferably 0.02% by mass or more. Also, although not particularly limited, is preferably 5.0% by mass or less, more preferably 3.0% by mass or less, even more preferably 1.0% by mass or less, and particularly preferably 0.5% by mass or less. 【0062】 • Coupling agent (F) The coupling agent (F) is not particularly limited, but examples include silane coupling agents such as vinyl, glycidoxy, methacrylic, amino, mercapto, or imidazole; titanium coupling agents such as alkoxide, chelate, or acylate; and long-chain spacer type coupling agents such as glycidoxyoctyltrimethoxysilane or methacrylooctyltrimethoxysilane. The coupling agent (F) can be used alone or in combination of two or more. 【0063】 Examples of the silane coupling agents mentioned above include 3-glycidoxypropyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and 3-methacryloxypropyltrimethoxysilane. 【0064】 The content of the coupling agent (F) relative to the epoxy resin composition (100% by mass) is not particularly limited, but is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, and even more preferably 0.2% by mass or more. Furthermore, the content is not particularly limited, but is preferably 5.0% by mass or less, more preferably 3.0% by mass or less, and even more preferably 1.0% by mass or less. 【0065】 Other ingredients (G) The epoxy resin composition described above may contain components other than epoxy resin (A), curing agent (B), inorganic filler (C), core-shell rubber particles (D), curing accelerator (E), and coupling agent (F) (hereinafter referred to as "other components (G)"). Examples of other components (G) include curable compounds other than epoxy resin (A), thermoplastic resins such as acrylic resin, polyethylene resin, polyester resin, polyurethane resin, and polyamide resin, ion trapping agents, surfactants, antioxidants, defoaming agents, flame retardants, colorants, reactive diluents, and solvents. Other components (G) may be used individually or in combination of two or more. 【0066】 The content of other components (G) relative to the above epoxy resin composition (100% by mass) is not particularly limited as long as it does not impair the effects of the present invention, but is preferably 10% by mass or less, more preferably 5% by mass or less, and even more preferably 3% by mass or less. Also, although not particularly limited, is preferably 0.001% by mass or more, more preferably 0.01% by mass or more, and even more preferably 0.1% by mass or more. 【0067】 (Physical properties and manufacturing method of epoxy resin composition) The viscosity of the epoxy resin composition at 25°C is not particularly limited, but is preferably 0.1 to 100 Pa·s, more preferably 1 to 60 Pa·s, even more preferably 3 to 50 Pa·s, and most preferably 5 to 40 Pa·s. A viscosity within this range tends to facilitate filling gaps. The viscosity can be measured using a Brookfield viscometer (model number: HBDV-1, manufactured by Brookfield Corporation) at a liquid temperature of 25°C, rotated at 50 rpm for 1 minute, as described in the examples below. 【0068】 The epoxy resin composition described above can be prepared by known and conventional methods. For example, the epoxy resin composition can be obtained by simultaneously or separately introducing at least one selected from the group consisting of epoxy resin (A), curing agent (B), inorganic filler (C), and core-shell rubber particles (D), and optionally a curing accelerator (E), coupling agent (F), and other components (G), into a suitable mixer and stirring and mixing while melting by heating as needed. If the epoxy resin (A) is solid, it is preferable to liquefy or fluidize it by heating before mixing. If it is difficult to uniformly disperse the inorganic filler (C) in the epoxy resin composition, the epoxy resin (A) and inorganic filler (C) may be heated and mixed to uniformly disperse the inorganic filler (C) in the epoxy resin (A), then cooled as needed, and further mixing in components such as the curing agent (B) to prepare the epoxy resin composition. 【0069】 The above-mentioned mixer is not particularly limited, but examples include a roll mill equipped with a stirring device and a heating device, a Leikai mill, a Henschel mixer, a tumbler, a self-rotating mill, a planetary mixer, etc. The mixing ratio of each component is appropriately set according to the content ratio of each component in the epoxy resin composition. 【0070】 The above epoxy resin composition can be preferably used as a material (epoxy resin composition for semiconductor encapsulation) for encapsulating materials arranged on a substrate, such as semiconductor elements, wiring, and solder (solder bumps), in semiconductor devices. By using the above epoxy resin composition as an epoxy resin composition for semiconductor encapsulation, highly reliable semiconductor devices can be manufactured. Furthermore, the above epoxy resin composition can be preferably used as a material (epoxy resin composition for flip-chip semiconductor encapsulation) for encapsulating semiconductor elements, etc., arranged on a substrate in flip-chip type semiconductor devices. Specifically, by filling the gap between the semiconductor element, etc., and the substrate with the above epoxy resin composition and applying heat curing, the bump electrodes present in the gap are encapsulated, while the semiconductor element and the substrate are fixed to each other as an encapsulated body, thereby improving reliability. 【0071】 The above-mentioned epoxy resin composition for semiconductor encapsulation can be used, for example, as an underfill such as capillary underfill, liquid mold underfill, secondary underfill, or pre-filled underfill, as well as a grab-top material and a liquid compression mold material. The above-mentioned epoxy resin composition is not limited to its use as an epoxy resin composition for semiconductor encapsulation as described above, and can be used, for example, as an adhesive for fixing, joining, or protecting components that constitute electronic components. 【0072】 (Cured epoxy resin composition) A cured product is formed by curing the above epoxy resin composition. The curing method is not particularly limited, but for example, it can be carried out by heat treatment of the epoxy resin composition. The temperature of the heat treatment is not particularly limited, but for example, 60 to 200°C is preferred, and 80 to 180°C is more preferred. The duration of the heat treatment is not particularly limited, but for example, 0.1 to 5 hours is preferred, and 0.5 to 3 hours is more preferred. 【0073】 (Semiconductor device) The semiconductor device of the present invention comprises a substrate, a semiconductor element disposed on the substrate, and a cured product of the epoxy resin composition that encapsulates the semiconductor element. Preferably, the semiconductor device is a flip-chip type semiconductor device. The flip-chip type semiconductor device has a structure in which an electrode portion on the substrate and the semiconductor element are connected via bump electrodes. In the semiconductor device, the gap between the semiconductor element and the substrate is sealed by the cured product (encapsulant) of the epoxy resin composition. 【0074】 A semiconductor device can be manufactured by filling the gap between the substrate and the semiconductor element placed on the substrate with the epoxy resin composition (filling step), and then heating and curing the epoxy resin composition (sealing step). The method of filling the gap with the epoxy resin composition is not particularly limited, but for example, by heating the substrate to 50 to 120°C and applying the epoxy resin composition to one end of the substrate or semiconductor element, the epoxy resin composition is filled into the gap between the substrate and the semiconductor element by capillary action. After filling the gap with the epoxy resin composition, the gap is sealed by heating the substrate at a predetermined temperature for a predetermined time, specifically at the temperature and time described in the heat treatment for forming the cured product. [Examples] 【0075】 The present invention will be described in more detail below based on examples, but the present invention is not limited to these examples. 【0076】 The epoxy resin compositions of Examples 1-6 and Comparative Example 1 were prepared by appropriately selecting and mixing epoxy resin (A), curing agent (B), inorganic filler (C), and core-shell rubber particles (D), as well as at least one component selected from the group consisting of a curing accelerator (E), a coupling agent (F), and other components (G) as needed, in the proportions shown in Table 1. The numerical values ​​for each composition in Table 1 represent parts by mass. 【0077】 The following is a description of each component in Table 1. • Epoxy resin (A) YDF-8170 (Product Name): Bisphenol F type epoxy resin, epoxy equivalent 160 g / eq, liquid at 25°C, manufactured by Nippon Steel Chemical & Material Co., Ltd. HP-4032D (Product Name): Naphthalene-type epoxy resin, epoxy equivalent 140 g / eq, liquid at 25°C, manufactured by DIC Corporation. jER630 (product name): Aminophenol-type epoxy resin, epoxy equivalent 98 g / eq, liquid at 25°C, manufactured by Mitsubishi Chemical Corporation. ZX-1658GS (Product Name): 1,4-Glycidylcyclohexane, epoxy equivalent 135 g / eq, liquid at 25°C, manufactured by Nippon Steel Chemical & Material Co., Ltd. • Hardener (B) HD AA: Product name / KAYAHARD AA, 4,4'-methylenebis(2-ethylaniline), active hydrogen equivalent 63g / eq, manufactured by Nippon Kayaku Co., Ltd. EH-105L (Product Name): Modified aromatic amine-based curing agent, active hydrogen equivalent: 61g / eq, manufactured by ADEKA Corporation. EtaCure 100plus (product name): Diethyltoluenediamine, manufactured by Albemar Co., Ltd. ·Inorganic filler (C) YA010A-JGP (Product Name): A masterbatch of nanosilica with an average particle size of 10 nm and bisphenol F type epoxy resin (mass ratio: former:latter = 25:75), surface-treated with 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, manufactured by Admatex Co., Ltd. The values ​​in Table 1 represent the mass of nanosilica, and the mass of bisphenol F type epoxy resin is added to YDF-8170. SE5050-SEJ (Product Name): Silica with an average particle size of 1.5 μm, surface-treated with 3-glycidoxypropyltrimethoxysilane, manufactured by Admatex Co., Ltd. • Core-shell rubber particles (D) Rubber particle 1: Core / silicone-based rubber (polydimethylsiloxane), shell layer / core-shell rubber particle containing methacrylic acid, butyl acrylate, methyl methacrylate, and glycidyl methacrylate as constituent units (corresponding to core-shell rubber particle (D1)), average particle size: 0.3 μm Rubber particle 2: Core / silicone-based rubber (polydimethylsiloxane), shell layer / core-shell rubber particle containing methyl methacrylate, glycidyl methacrylate, styrene, and acrylonitrile as constituent units (corresponding to core-shell rubber particle (D2)), average particle size: 0.3 μm • Curing accelerator (E) CG-1400 / Product name: "AMICURE CG-1400": Dicyandiamide, manufactured by Evonik Japan Co., Ltd. • Coupling agent (F) KBM-403 (Product Name): 3-Glycidoxypropyltrimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd. Other ingredients (G) CB: Special Black 4 powder (product name), carbon black, manufactured by Orion Engineered Carbon. TPP (Product Name): Triphenylphosphine, Thickening Inhibitor, Manufactured by Hokko Chemical Co., Ltd. Irganox 1010 (product name): Pentaerythritol tetrakis[3-[3,5-di(tert-butyl)-4-hydroxyphenyl]propionate], antioxidant, manufactured by BASF Japan Ltd. KF-6013: Polyether-modified silicone, surfactant, manufactured by Shin-Etsu Chemical Co., Ltd. 【0078】 (Evaluation 1: Measurement of viscosity at 25°C) The viscosity (Pa·s) of the epoxy resin compositions of Examples 1-6 and Comparative Example 1 at 25°C immediately after preparation was measured using a Brookfield viscometer (model: HBDV-1, manufactured by Brookfield) after rotating at 50 rpm for 1 minute at a liquid temperature of 25°C. The results are listed in the "25°C Viscosity" column of the evaluation results in Table 1. 【0079】 (Evaluation 2: Gap filling test) • Preparation of test specimens A test specimen was obtained by sandwiching tape between two glass slides so that the gap between them was 50 μm, and then shifting the glass slides by 1 cm to secure the area where the evaluation sample was applied. 【0080】 • Testing and evaluation The above test specimens were placed on a hot plate set to 110°C, and approximately 1 g each of the epoxy resin compositions from Examples 1-6 and Comparative Example 1 was applied to the sample application area. The time taken until the filling distance reached 20 mm was measured. 【0081】 The gap-filling test will be explained using Figure 1. In Figure 1, 1 represents the test specimen. 2 and 2' are glass slides. 3 is tape. 4 is the gap. 5 is the evaluation sample. (a) is a plan view of test specimen 1, with the longitudinal direction of test specimen 1 as vertical and the transverse direction as transverse. (b) is a side view of test specimen 1 from the longitudinal direction. (c) is a side view of test specimen 1 from the transverse direction. Glass slide 2 is laminated with the other glass slide 2' via tape 3. As shown in (b), glass slides 2 and 2' are laminated so that there is a 1 cm misalignment in the longitudinal direction. This misalignment is the coated area (sample coated area) of evaluation sample 5. Gap 4 is a space enclosed by glass slide 2 on its top surface, glass slide 2' on its bottom surface, and two tapes 3 on its sides. In gap 4, the distance between glass slide 2 and glass slide 2' is 50 μm, and the distance between the two tapes 3 is 10 mm. The longitudinal distance of gap 4 is 70 mm. Test specimen 1 is placed on a hot plate (not shown), and evaluation sample 5 is applied to the sample application area. The applied evaluation sample 5 moves downwards towards (a) through gap 4 by capillary action. The time it takes for evaluation sample 5 to reach the edge of slide glass 2' is measured and recorded in "Gap Filling Time" in Table 1. The unit is seconds (s). A shorter gap filling time indicates better injection performance. 【0082】 (Rating 3: Modulus of elasticity) • Preparation of test specimens A glass plate (120 mm x 120 mm, the silicone resin release agent was a mixture of toluene and KS841 (manufactured by Shin-Etsu Chemical Co., Ltd.) in a mass ratio of 5:1, and further mixed with CAT-PL-50T (curing agent, manufactured by Shin-Etsu Chemical Co., Ltd.)) treated with a silicone resin release agent. The epoxy resin compositions of Example 1 and Comparative Example 1 were applied to a surface of 50 mm x 10 mm or larger to form a coating film. Then, another glass plate was prepared, and the applied epoxy resin composition was sandwiched between them. A 2.0 mm copper plate was used as a spacer, and the glass plates were secured with 25 mm wide double clips. The coating film was cured by leaving it at 165°C for 2 hours. The cured coating film was peeled off the glass plate, and test specimens were obtained by cutting it to the specified dimensions (50 mm x 10 mm x 2.0 mm) using a precision cutting machine. 【0083】 • Testing and evaluation The storage modulus (GPa) of the above test specimen was measured using the DCB method with a Hitachi High-Tech Science DMA7100. The frequency was 1 Hz and the heating rate was 3°C / min. The storage modulus (GPa) at 30°C is listed in the "Modulus (GPa)" column of the evaluation results in Table 2. 【0084】 [Table 1] 【0085】 [Table 2] 【0086】 Based on the evaluation results, the following conclusions can be drawn. (1) The shell layer of the core-shell rubber particles is preferably composed of butyl (meth)acrylate as a constituent unit, from the viewpoint of viscosity and injectability of the epoxy resin composition. This is thought to be because, compared to cases where methyl (meth)acrylate or ethyl (meth)acrylate is included as a constituent unit, the number of carbon atoms in the side chains (acrylic groups) is greater, which improves the wettability between the core-shell rubber particles and the epoxy resin (A). The reason for the improved wettability is not clear, but the following reasons are possible: (a) The longer side chains of the shell layer make the shell layer more hydrophobic, improving compatibility with the epoxy resin; (b) Even if there is a part of the core that is not covered by the shell layer (referred to as the "exposed part"), the long side chains of the shell layer can cover the exposed part, so the core-shell rubber particles and the epoxy resin can exhibit high compatibility, similar to (a). (2) From the viewpoint of compatibility with epoxy resin (A), it is preferable that the shell layer of the core-shell rubber particles does not contain aromatic vinyl compounds such as styrene or vinyl cyanide compounds such as acrylonitrile as constituent units. In particular, because the molecular skeleton derived from aromatic vinyl compounds is large, it is possible that the liquid properties will be inferior due to steric hindrance (for example, viscosity will increase). 【0087】 It can be said that there is a certain correlation between low viscosity and excellent injectability of an epoxy resin composition. However, injectability is affected not only by the viscosity of the epoxy resin composition but also by factors such as contact angle, surface tension, and reactivity, so reducing viscosity does not necessarily lead to improved injectability. From this perspective, the epoxy resin composition of the present invention can be said to have an effective effect because it is characterized by being both low viscosity and having excellent injectability. 【0088】 In summary, the structure of this disclosure and its variations are listed below. [1] Epoxy resin (A) and, Hardener (B), Inorganic filler (C), An epoxy resin composition comprising core-shell rubber particles (D), An epoxy resin composition comprising core-shell rubber particles (D1) as core-shell rubber particles (D), wherein the shell layer contains (meth)acrylic acid and butyl (meth)acrylate as constituent units. [2] The epoxy resin composition according to [1], wherein the epoxy resin (A) comprises at least one selected from the group consisting of bisphenol-type epoxy resins, naphthalene-type epoxy resins, aminophenol-type epoxy resins, cyclohexane-type epoxy resins, and glycidylamine-type epoxy resins, or comprises at least one selected from the group consisting of bisphenol F-type epoxy resins, naphthalene-type epoxy resins, aminophenol-type epoxy resins, and cyclohexane-type epoxy resins (particularly 1,4-glycidylcyclohexane), or comprises at least one selected from the group consisting of bisphenol-type epoxy resins, aminophenol-type epoxy resins, and naphthalene-type epoxy resins. [3] The epoxy resin composition according to [1] or [2], wherein the content of bisphenol-type epoxy resin relative to epoxy resin (A) (100% by mass) is 0 to 100% by mass. [4] An epoxy resin composition according to any one of [1] to [3], wherein the content of naphthalene-type epoxy resin relative to epoxy resin (A) (100% by mass) is 0 to 50% by mass. [5] An epoxy resin composition according to any one of [1] to [4], wherein the content of aminophenol-type epoxy resin relative to epoxy resin (A) (100% by mass) is 0 to 90% by mass. [6] An epoxy resin composition according to any one of [1] to [5], wherein the content of cyclohexane-type epoxy resin relative to epoxy resin (A) (100% by mass) is 0 to 30% by mass. [7] The epoxy resin composition according to any one of [1] to [6], wherein the epoxy equivalent of epoxy resin (A) is 30 to 1000 g / eq, 40 to 500 g / eq, or 50 to 300 g / eq. [8] An epoxy resin composition according to any one of [1] to [7], wherein the content of epoxy resin (A) is 5% by mass or more, 8% by mass or more, 10% by mass or more, or 12% by mass or more, and / or 60% by mass or less, 50% by mass or less, 45% by mass or less, or 40% by mass or less. [9] The epoxy resin composition according to any one of [1] to [8], wherein the curing agent (B) is at least one selected from the group consisting of amine-based curing agents, acid anhydride-based curing agents, and phenol-based curing agents, or is an amine-based curing agent.

[10] The epoxy resin composition according to any one of [1] to [9], wherein the amine-based curing agent is an aromatic amine, or at least one selected from the group consisting of 4,4'-methylenebis(2-ethylaniline), ethyltoluenediamine, diethyltoluenediamine (such as 3,5-diethyltoluene-2,4-diamine and 3,5-diethyltoluene-2,6-diamine), 1-methyl-3,5-diethyl-2,4-diaminobenzene, 1-methyl-3,5-diethyl-2,6-diaminobenzene, 1,3,5-triethyl-2,6-diaminobenzene, 3,3'-diethyl-4,4'-diaminodiphenylmethane, 3,5,3',5'-tetramethyl-4,4'-diaminodiphenylmethane, and dimethylthiotoluenediamine.

[11] The epoxy resin composition according to any one of [1] to

[10] , wherein the equivalent amount (molecular weight per functional group) of the curing agent (B) is 10 to 300 g / eq, 20 to 160 g / eq, or 30 to 100 g / eq.

[12] The epoxy resin composition according to any one of [1] to

[11] , wherein the amount of curing agent (B) is such that the stoichiometric equivalent ratio (curing agent equivalent / epoxy group equivalent) with epoxy resin (A) is 0.5 to 1.5, or 0.8 to 1.2.

[13] The epoxy resin composition according to any one of [1] to

[12] , wherein the content of the curing agent (B) is 2% by mass or more, 4% by mass or more, or 5% by mass or more, and / or 30% by mass or less, 20% by mass or less, 15% by mass or less, or 12% by mass or less.

[14] An epoxy resin composition according to any one of [1] to

[13] , comprising silica with an average particle size of 100 nm or less as an inorganic filler (C).

[15] The epoxy resin composition according to any one of [1] to

[14] , wherein the content of inorganic filler (C) relative to the epoxy resin composition (100% by mass) is 20% by mass or more, 30% by mass or more, 40% by mass or more, or 50% by mass or more, and / or 90% by mass or less, 80% by mass or less, or 70% by mass or less.

[16] The epoxy resin composition according to

[14] , wherein the content of silica with an average particle size of 100 nm or less relative to the inorganic filler (C) (100% by mass) is 0.1 to 30% by mass, 0.1 to 20% by mass, 0.1 to 10% by mass, or 0.3 to 5% by mass.

[17] The epoxy resin composition according to any one of [1] to

[16] , wherein the shell layer in the core-shell rubber particles (D1) further comprises at least one selected from the group consisting of methyl (meth)acrylate and glycidyl (meth)acrylate as a constituent unit.

[18] An epoxy resin composition according to any one of [1] to

[17] , wherein the average particle size of the core-shell rubber particles (D1) is 0.03 to 1.0 μm, 0.04 to 0.8 μm, or 0.05 to 0.7 μm.

[19] An epoxy resin composition according to any one of [1] to

[18] , wherein the content of core-shell rubber particles (D) is 30% by mass or less, 25% by mass or less, 20% by mass or less, 15% by mass or less, or 10% by mass or less, and / or 0.1% by mass or more, 0.5% by mass or more, 1.0% by mass or more, or 1.5% by mass or more.

[20] An epoxy resin composition according to any one of [1] to

[19] , wherein the content of core-shell rubber particles (D1) is 30% by mass or less, 25% by mass or less, 20% by mass or less, 15% by mass or less, or 10% by mass or less, and / or 0.1% by mass or more, 0.5% by mass or more, 1.0% by mass or more, or 1.5% by mass or more. [twenty one] The epoxy resin composition according to any one of [1] to

[20] , wherein the content of core-shell rubber particles (D) relative to the total amount (100% by mass) of epoxy resin (A) and curing agent (B) is 1 to 60% by mass, 1 to 45% by mass, or 1 to 30% by mass. [twenty two] The epoxy resin composition according to any one of [1] to

[21] , wherein the content of core-shell rubber particles (D1) relative to the total amount (100% by mass) of epoxy resin (A) and curing agent (B) is 1 to 60% by mass, 1 to 45% by mass, or 1 to 30% by mass. [twenty three] The epoxy resin composition according to any one of [1] to

[22] , wherein the shell layer of the core-shell rubber particles (D1) substantially does not contain styrene, acrylonitrile, and methacrylonitrile as constituent units. [twenty four] An epoxy resin composition for semiconductor encapsulation, as described in any one of [1] to

[23] . [twenty five] A cured product of an epoxy resin composition described in any one of [1] to

[24] .

[26] circuit board and A semiconductor element disposed on the aforementioned substrate, A semiconductor device comprising a cured product described in

[25] for sealing the semiconductor element.

[27] circuit board and A step of filling the gap between the semiconductor element placed on the substrate with any one of the epoxy resin compositions described in [1] to

[24] , A step of heating and curing the epoxy resin composition, A method for manufacturing a semiconductor device containing [a specific component]. [Industrial applicability] 【0089】 The epoxy resin composition of the present invention has low viscosity, making it easy to handle. Furthermore, its excellent injectability allows for efficient filling of gaps with the epoxy resin composition, even when manufacturing semiconductor devices using substrates such as enlarged interposers. Additionally, due to these properties, it can contain a larger amount of core-shell rubber particles compared to conventional epoxy resin compositions. Therefore, it is possible to adjust the cured epoxy resin composition to exhibit a low elastic modulus. Consequently, semiconductor devices equipped with the cured epoxy resin composition can encapsulate semiconductor elements with high precision, and exhibit high reliability due to the reduced stress on the cured epoxy resin composition. [Explanation of Symbols] 【0090】 1 Test specimen 2. Microscope slides 2' microscope slides 3 tapes 4 gaps 5 Evaluation Samples

Claims

[Claim 1] Epoxy resin (A) and Hardener (B), Inorganic filler (C), An epoxy resin composition comprising core-shell rubber particles (D), The epoxy resin (A) is a liquid epoxy resin. The inorganic filler (C) includes silica with an average particle size of 100 nm or less, which may have a treated surface, and an inorganic filler with an average particle size of 0.3 to 10 μm. The core-shell rubber particles (D) include core-shell rubber particles (D1) in which the shell layer contains (meth)acrylic acid and butyl (meth)acrylate as constituent units. The epoxy resin (A) content relative to the epoxy resin composition (100% by mass) is 5 to 60% by mass. The content of the curing agent (B) relative to the epoxy resin composition (100% by mass) is 2 to 30% by mass. The inorganic filler (C) content relative to the epoxy resin composition (100% by mass) is 20 to 90% by mass. An epoxy resin composition in which the content of core-shell rubber particles (D) is 1 to 30% by mass relative to the total amount (100% by mass) of epoxy resin (A) and curing agent (B). [Claim 2] The epoxy resin composition according to claim 1, wherein the inorganic filler having an average particle size of 0.3 to 10 μm is silica, which may have a treated surface. [Claim 3] The epoxy resin composition according to claim 1 or 2, wherein the content of silica, which may have an average particle size of 100 nm or less and whose surface is treated, relative to the inorganic filler (C) (100% by mass), is 0.1 to 30% by mass. [Claim 4] The epoxy resin composition according to claim 1 or 2, comprising dicyandiamide as a curing accelerator. [Claim 5] The epoxy resin composition according to claim 1 or 2, wherein the shell layer in the core-shell rubber particles (D1) further comprises at least one selected from the group consisting of methyl (meth)acrylate and glycidyl (meth)acrylate as a constituent unit. [Claim 6] The epoxy resin composition according to claim 1 or 2, wherein the content of core-shell rubber particles (D1) relative to the total amount (100% by mass) of epoxy resin (A) and curing agent (B) is 1 to 30% by mass. [Claim 7] The epoxy resin composition according to claim 1 or 2, wherein the average particle size of the core-shell rubber particles (D1) is 0.03 to 1.0 μm. [Claim 8] The epoxy resin composition according to claim 1 or 2, wherein the content of inorganic filler (C) relative to the epoxy resin composition (100% by mass) is 50 to 90% by mass. [Claim 9] The epoxy resin composition according to claim 1 or 2, wherein the epoxy resin (A) comprises at least one selected from the group consisting of bisphenol-type epoxy resins, aminophenol-type epoxy resins, and naphthalene-type epoxy resins. [Claim 10] The epoxy resin composition according to claim 1 or 2, wherein the curing agent (B) is an amine-based curing agent. [Claim 11] The epoxy resin composition according to claim 1 or 2, wherein the shell layer of the core-shell rubber particles (D1) substantially does not contain styrene, acrylonitrile, and methacrylonitrile as constituent units. [Claim 12] The epoxy resin composition according to claim 1 or 2, for use in semiconductor encapsulation. [Claim 13] A cured product of the epoxy resin composition according to claim 1 or 2. [Claim 14] circuit board and A semiconductor element disposed on the aforementioned substrate, A semiconductor device comprising a cured product according to claim 13 for sealing the semiconductor element. [Claim 15] circuit board and A step of filling the gap between the semiconductor element disposed on the substrate with the epoxy resin composition according to claim 1 or 2, A step of heating and curing the epoxy resin composition, A method for manufacturing a semiconductor device containing [a specific component].

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