Frame unit processing method
By forming grooves in the sheet between the wafer and frame, the method ensures consistent wafer protrusion from the frame, addressing issues with varying sheet materials and improving ejection efficiency.
JP7873987B2Active Publication Date: 2026-06-15DISCO CORP
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Patent Information
- Application Number
- JP2022072248
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2022-04-26
- Publication Date
- 2026-06-15
- Estimated Expiration
- 2042-04-26
AI Technical Summary
Technical Problem
Existing methods face challenges in properly pushing down the frame of a frame unit supported by a frame support portion due to varying elongation rates of different sheet materials, leading to improper wafer protrusion.
Method used
A method involving a groove forming step to create grooves in the sheet positioned between the wafer and frame, allowing for proper wafer protrusion regardless of sheet material type, using laser or cutting apparatus to form grooves in a lattice, annular, or radial patterns.
Benefits of technology
The grooves relieve tensile stress, enabling consistent wafer protrusion from the frame even with sheets of low elongation, facilitating efficient ejection and processing.
✦ Generated by Eureka AI based on patent content.
Abstract
To provide a processing method of a frame unit that can push down a frame of the frame unit supported on a frame support part so that a wafer projects upward irrespective of a kind of a sheet.SOLUTION: A processing method of a frame unit according to the present invention that is the processing method of the frame unit in which a wafer is positioned in an opening of a frame having the opening accommodating the wafer provided at the middle to be integrally formed with the frame by a sheet comprises a trench forming step that forms a trench on the sheet being positioned between the wafer and the frame.SELECTED DRAWING: Figure 2
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