Tape application device

JP7874027B2Active Publication Date: 2026-06-15DISCO CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
DISCO CORP
Filing Date
2022-10-26
Publication Date
2026-06-15

AI Technical Summary

⚠Technical Problem

The existing adhesive mechanism for applying tape to a wafer and parallel frames experiences uneven load distribution, leading to indentations on the adhesive roller, which can cause the tape to fail to adhere to the parallel frames.

⚗Method used

A tape application device with a load adjustment unit that adjusts the load applied to the adhesive roller, ensuring uniform pressure distribution whether it presses against the parallel frames alone or both the frames and the wafer, preventing indentations and ensuring consistent adhesion.

🎯Benefits of technology

The load adjustment unit maintains consistent pressure, preventing indentations on the adhesive roller and ensuring the tape adheres uniformly to both the wafer and parallel frames, thereby maintaining effective application.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

To provide a tape adhering device capable of preventing a tape from being adhered to a parallel frame.SOLUTION: A tape adhering device (18) comprises a holding table (21) holding a wafer (100), a base (26) on the center of which the holding table is arranged, a rectangular frame (28) surrounding the holding table and arranged on the base at an interval, an adhesion roller (34), a movement mechanism (40) for relatively moving the adhesion roller, the holding table and the base, and a load adjustment part (29) for adjusting a load pressing the adhesion roller to the wafer and the rectangular frame, and adheres a rectangular tape (7) to the wafer and the rectangular frame. The rectangular frame comprises a pair of parallel frames (281), and a pair of orthogonal frames (282) extending in a direction orthogonal to the parallel frame. The load adjustment part makes a load per unit area uniform when the adhesion roller is pressed only to the parallel frame, and when the adhesion roller is pressed to the parallel frame and the wafer.SELECTED DRAWING: Figure 8
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