Resin sheets and their uses

JP7874086B2Active Publication Date: 2026-06-15NITTO DENKO CORP
View PDF 21 Cites 0 Cited by

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
NITTO DENKO CORP
Filing Date
2022-02-28
Publication Date
2026-06-15

AI Technical Summary

⚠Technical Problem

Existing adhesive layers used in semiconductor processing are not sufficiently flexible and tough, leading to issues such as adhesive residue and low peel strength due to stringing phenomena, which are exacerbated by increased crosslinking density to prevent residue.

⚗Method used

A resin film with a double network structure, comprising a first and second mesh formed from specific polymers and polyfunctional monomers, achieving a stress integral value of 10-1000 MPa and elongation at break of 300%-4500%, ensuring flexibility and toughness.

🎯Benefits of technology

The resin film provides high peel strength with minimal adhesive residue, improved impact resistance, and balanced flexibility, suitable for adhesive sheets and components.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 0007874086000003
    Figure 0007874086000003
  • Figure 0007874086000004
    Figure 0007874086000004
  • Figure 0007874086000005
    Figure 0007874086000005
Patent Text Reader

Abstract

Provided is a resin film having a stress integral value of from 10 to 1000 MPa, inclusive, when uniaxially stretched to break at a tensioning rate of 300 mm / min at 25°C. A resin film that exhibits such properties is supple and tough.
Need to check novelty before this filing date? Find Prior Art