Temperature control device

Abstract

The present invention suppresses creep deformation due to weighted load over time. This temperature adjustment device comprises: a pair of flow path plates 40 each including an upper surface 40A and a flow path groove 42 provided in at least a part of the upper surface 40A; a pair of heat conduction plates 11 opposing the flow path grooves 42 provided in respective ones of the pair of flow path plates 40; seal members 47 sealing a boundary between the upper surfaces 40A of the flow path plates 40 and the heat conduction plates 11; spacer members 41 disposed opposite back surfaces 40B of the flow path plates 40 and disposed in at least a part of a region under the seal members 47; and bolts 60 and nuts 61 fastening the pair of flow path plates 40 and the pair of heat conduction plates 11 overlapped with each other. The compressive strength of the spacer members 41 is greater than that of the flow path plates 40.

Description

【Technical Field】 【0001】 The present invention relates to a temperature control device. 【Background Art】 【0002】 Semiconductor devices are manufactured through a plurality of processes such as a cleaning process for cleaning a semiconductor wafer, a coating process for applying a photoresist to the semiconductor wafer, an exposure process for exposing the semiconductor wafer coated with the photoresist, and an etching process for etching the exposed semiconductor wafer. In the cleaning process, the semiconductor wafer is cleaned with a temperature-controlled liquid. Patent Document 1 discloses an example of a temperature control device for adjusting the temperature of a liquid. 【Prior Art Documents】 【Patent Documents】 【0003】 【Patent Document 1】 Japanese Unexamined Patent Application Publication No. 2020-087979 【Summary of the Invention】 【Problems to be Solved by the Invention】 【0004】 When applying the technology described in Patent Document 1 and using a resin for the flow path plate, which is a heat exchange block of the temperature control device, and the resin is a material that is prone to creep deformation, there is a risk of large creep deformation due to long-term heavy loading. 【0005】 An aspect of the present invention aims to suppress creep deformation due to long-term heavy loading. 【Means for Solving the Problems】 【0006】 According to an aspect of the present invention, a temperature control device is provided comprising: a pair of flow path plates each having a surface and a flow path groove provided on at least a portion of the surface; a pair of heat transfer plates provided on each of the pair of flow path plates and facing the flow path groove; a sealing member that seals the boundary between the surface of the flow path plate and the heat transfer plate; a spacer member disposed facing the back surface of the flow path plate and positioned in at least a portion of the area directly below the sealing member; and a fastening member that fastens the pair of flow path plates and the pair of heat transfer plates in an overlapping state, wherein the spacer member has a compressive strength greater than that of the flow path plate. [Effects of the Invention] 【0007】 According to an aspect of the present invention, creep deformation due to load over time can be suppressed. [Brief explanation of the drawing] 【0008】 [Figure 1] Figure 1 is a schematic diagram showing an example of a cleaning system according to the first embodiment. [Figure 2] Figure 2 is a schematic side view showing an example of a temperature control device according to the first embodiment. [Figure 3] Figure 3 is an enlarged cross-sectional view of a portion of the thermoelectric module board according to the first embodiment. [Figure 4] Figure 4 is a perspective view showing an example of the main body of a temperature control device according to the first embodiment. [Figure 5] Figure 5 is a plan view showing an example of the main body of a temperature control device according to the first embodiment. [Figure 6] Figure 6 is a cross-sectional view showing an example of the main body of a temperature control device according to the first embodiment. [Figure 7] Figure 7 is a partially enlarged view of an example of a spacer member according to the first embodiment. [Figure 8] Figure 8 is a diagram illustrating the assembly method of the main body of the temperature control device according to the first embodiment. [Figure 9] Figure 9 is a diagram illustrating the assembly method of the main body of the temperature control device according to the first embodiment. [Figure 10]FIG. 10 is a diagram for explaining a method of assembling the main body of the temperature control device according to the first embodiment. [Figure 11] FIG. 11 is a diagram for explaining a method of assembling the main body of the temperature control device according to the first embodiment. [Figure 12] FIG. 12 is a diagram for explaining a method of assembling the temperature control device according to the first embodiment. [Figure 13] FIG. 13 is a partially enlarged view of a modified example of the spacer member according to the first embodiment. [Figure 14] FIG. 14 is a partially enlarged view of a modified example of the spacer member according to the first embodiment. [Figure 15] FIG. 15 is a partially enlarged view of a modified example of the spacer member according to the first embodiment. [Figure 16] FIG. 16 is a partially enlarged view of a modified example of the spacer member according to the first embodiment. [Figure 17] FIG. 17 is a partially enlarged view of a modified example of the spacer member according to the first embodiment. [Figure 18] FIG. 18 is a partially enlarged view of a modified example of the spacer member according to the first embodiment. [Figure 19] FIG. 19 is a cross-sectional view showing an example of the main body of a conventional temperature control device. [Figure 20] FIG. 20 is a cross-sectional view showing an example of the main body of the temperature control device according to the second embodiment. [Figure 21] FIG. 21 is a perspective view showing an example of the temperature control device according to the third embodiment. [Figure 22] FIG. 22 is a side view showing an example of the temperature control device according to the third embodiment. [Figure 23] FIG. 23 is a schematic cross-sectional view showing an example of the main body of the temperature control device according to the third embodiment. [Figure 24] FIG. 24 is a schematic cross-sectional view showing a modified example of the main body of the temperature control device according to the third embodiment. [Figure 25] FIG. 25 is a schematic cross-sectional view showing a modified example of the main body of the temperature control device according to the third embodiment. [Figure 26]FIG. 26 is a schematic cross-sectional view showing a modified example of the main body of the temperature control device according to the third embodiment. [Figure 27] FIG. 27 is a perspective view showing a modified example of the temperature control device according to the third embodiment. [Figure 28] FIG. 28 is a schematic cross-sectional view showing a modified example of the main body of the temperature control device according to the third embodiment. 【MODE FOR CARRYING OUT THE INVENTION】 【0009】 Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. The components of the embodiments described below can be combined as appropriate. Also, some components may not be used. 【0010】 In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described while referring to this XYZ orthogonal coordinate system. The direction parallel to the X-axis in a predetermined plane is defined as the X-axis direction. The direction parallel to the Y-axis orthogonal to the X-axis in the predetermined plane is defined as the Y-axis direction. The direction parallel to the Z-axis orthogonal to the predetermined plane is defined as the Z-axis direction. The XY plane including the X-axis and the Y-axis is parallel to the predetermined plane. The YZ plane including the Y-axis and the Z-axis is orthogonal to the XY plane. The XZ plane including the X-axis and the Z-axis is orthogonal to each of the XY plane and the YZ plane. In the embodiment, the XY plane is parallel to the horizontal plane. The Z-axis direction is the vertical direction. The +Z direction (+Z side) is the upward direction (upper side). The -Z direction (-Z side) is the downward direction (lower side). Note that the XY plane may be inclined with respect to the horizontal plane. 【0011】 [First Embodiment] <Washing System> An embodiment will be described. FIG. 1 is a diagram schematically showing an example of a washing system 1 according to the first embodiment. The washing system 1 washes a substrate W to be washed using a washing liquid LQ. The substrate W includes, for example, a semiconductor wafer. The liquid LQ is, for example, pure water or a chemical solution. The chemical solution is, for example, ammonia peroxide, hydrochloric acid peroxide, or sulfuric acid peroxide. 【0012】 The cleaning system 1 comprises a storage tank 2, a temperature control device 3, a substrate holding member 4, a nozzle 5, a first connecting pipe 6, a pump 7, and a second connecting pipe 8. The storage tank 2 stores liquid LQ. The temperature control device 3 adjusts the temperature of the liquid LQ supplied from the storage tank 2. The substrate holding member 4 holds the substrate W. The nozzle 5 supplies the liquid LQ, whose temperature has been adjusted by the temperature control device 3, to the substrate W. The first connecting pipe 6 connects the storage tank 2 and the temperature control device 3. The pump 7 is located in the first connecting pipe 6. The second connecting pipe 8 connects the temperature control device 3 and the nozzle 5. In the cleaning system 1 configured in this way, when the pump 7 is driven, the liquid LQ stored in the storage tank 2 is supplied to the temperature control device 3 via the first connecting pipe 6. The liquid LQ, whose temperature has been adjusted by the temperature control device 3, is supplied to the nozzle 5 via the second connecting pipe 8. The substrate W is cleaned by the supply of liquid LQ from nozzle 5. 【0013】 <Temperature control device> Figure 2 is a schematic side view showing an example of a temperature control device 3 according to the first embodiment. As shown in Figure 2, the temperature control device 3 comprises a main body 10, a pair of heat transfer plates 11, a thermoelectric module plate 12, and a pair of heat exchange plates 13. 【0014】 The main body 10 has a flow path 20 through which liquid LQ flows. The flow path 20 is provided on the upper and lower surfaces of the main body 10. The flow path 20 faces the heat transfer plate 11. The main body 10 is made of, for example, polytetrafluoroethylene (PTFE), perfluoroalkoxy alkane (PFA), or polyvinylidene difluoride (PVDF). 【0015】 The flow path 20 is connected to a supply pipe 21 and a discharge pipe 22. The supply pipe 21 and the discharge pipe 22 are made of PTFE or PFA. The liquid LQ supplied to the flow path 20 flows through the supply pipe 21 and is discharged to the discharge pipe 22. The supply pipe 21 is connected to the storage tank 2 via a first connecting pipe 6. The supply pipe 21 supplies the liquid LQ from the storage tank 2 to the flow path 20. The discharge pipe 22 is connected to the nozzle 5 via a second connecting pipe 8. The liquid LQ, whose temperature is controlled by the temperature control device 3, is supplied to the nozzle 5 via the discharge pipe 22. 【0016】 The heat transfer plate 11 exchanges heat with the liquid LQ flowing through the flow path 20 via the corrosion-resistant plate 11P. The heat transfer plate 11 is connected to the upper and lower surfaces of the main body 10 via the corrosion-resistant plate 11P. The heat transfer plate 11 includes one heat transfer plate 11 facing the upper surface of the main body 10 and the other heat transfer plate 11 facing the lower surface of the main body 10. The heat transfer plate 11 is made of, for example, aluminum. 【0017】 The corrosion-resistant plate 11P contains, for example, amorphous carbon. The corrosion-resistant plate 11P has corrosion resistance to acidic or alkaline liquids LQ. The corrosion-resistant plate 11P has thermal conductivity. 【0018】 The thermoelectric module board 12 absorbs or generates heat to regulate the temperature of the liquid LQ flowing through the flow path 20. The thermoelectric module board 12 is connected to one heat transfer plate 11 and the other heat transfer plate 11. The thermoelectric module board 12 includes one thermoelectric module board 12 connected to the upper surface of one heat transfer plate 11 and the other thermoelectric module board 12 connected to the lower surface of the other heat transfer plate 11. 【0019】 Figure 3 is an enlarged cross-sectional view of a portion of the thermoelectric module board 12 according to the first embodiment. As shown in Figure 3, the thermoelectric module board 12 has a plurality of thermoelectric modules 30 and a case 31. The case 31 houses the plurality of thermoelectric modules 30. The case 31 is formed of an insulating material. 【0020】 The thermoelectric module 30 absorbs or generates heat in response to the supply of power. The thermoelectric module 30 absorbs or generates heat due to the Peltier effect. The thermoelectric module 30 absorbs heat from the liquid LQ flowing through the channel 20 or transfers heat to the liquid LQ flowing through the channel 20 via the heat transfer plate 11. The thermoelectric module 30 adjusts the temperature of the liquid LQ flowing through the channel 20 by absorbing or generating heat. 【0021】 The thermoelectric module 30 includes a thermoelectric semiconductor element 32, a first electrode 33, and a second electrode 34. The thermoelectric semiconductor element 32 includes a p-type thermoelectric semiconductor element 32P and an n-type thermoelectric semiconductor element 32N. In the XY plane, the p-type thermoelectric semiconductor element 32P and the n-type thermoelectric semiconductor element 32N are arranged alternately. The first electrode 33 is connected to the p-type thermoelectric semiconductor element 32P and the n-type thermoelectric semiconductor element 32N, respectively. The second electrode 34 is connected to the p-type thermoelectric semiconductor element 32P and the n-type thermoelectric semiconductor element 32N, respectively. The first electrode 33 is adjacent to the heat transfer plate 11. The second electrode 34 is adjacent to the heat exchange plate 13. One end face of the p-type thermoelectric semiconductor element 32P and one end face of the n-type thermoelectric semiconductor element 32N are each connected to the first electrode 33. The other end face of the p-type thermoelectric semiconductor element 32P and the other end face of the n-type thermoelectric semiconductor element 32N are each connected to the second electrode 34. 【0022】 When a potential difference is applied between the first electrode 33 and the second electrode 34, electric charge moves within the thermoelectric semiconductor element 32. This movement of charge causes heat to transfer within the thermoelectric semiconductor element 32. As a result, the thermoelectric module 30 either absorbs or generates heat. For example, when a potential difference is applied between the first electrode 33 and the second electrode 34 such that the first electrode 33 generates heat and the second electrode 34 absorbs heat, the liquid LQ flowing through the channel 20 is heated. When a potential difference is applied between the first electrode 33 and the second electrode 34 such that the first electrode 33 absorbs heat and the second electrode 34 generates heat, the liquid LQ flowing through the channel 20 is cooled. 【0023】 The heat exchange plate 13 exchanges heat with the thermoelectric module plate 12. The heat exchange plate 13 is connected to one thermoelectric module plate 12 and the other thermoelectric module plate 12. The heat exchange plate 13 includes one heat exchange plate 13 connected to the upper surface of one thermoelectric module plate 12 and the other heat exchange plate 13 connected to the lower surface of the other thermoelectric module plate 12. The heat exchange plate 13 has an internal flow path (not shown) through which a temperature-controlled fluid flows. The temperature-controlled fluid is temperature-controlled by a fluid temperature control device (not shown) and then flows into the internal flow path from the inlet. The temperature-controlled fluid flows through the internal flow path, removing heat from the heat exchange plate 13 and supplying heat to the heat exchange plate 13. The temperature-controlled fluid flows out from the outlet of the internal flow path and is returned to the fluid temperature control device. 【0024】 In this embodiment, the main body 10, the heat transfer plate 11, the thermoelectric module plate 12, and the heat exchange plate 13 are each substantially disc-shaped. In the following description, a virtual axis passing through the centers of each of the main body 10, the heat transfer plate 11, the thermoelectric module plate 12, and the heat exchange plate 13, and parallel to the Z-axis, will be appropriately referred to as the central axis AX. 【0025】 <Main body> Figure 4 is a perspective view showing an example of the main body 10 of the temperature control device 3 according to the first embodiment. Figure 5 is a plan view showing an example of the main body 10 of the temperature control device 3 according to the first embodiment. Figure 6 is a cross-sectional view showing an example of the main body 10 of the temperature control device 3 according to the first embodiment. In Figure 6, for illustrative purposes, the pair of flow path plates 40 and the heat transfer plate 11 are shown spaced apart. As shown in Figures 4, 5, and 6, the main body 10 includes a pair of flow path plates 40, a spacer member 41, and a sealing member 47. 【0026】 Each flow path plate 40 has a front surface 40A and a back surface 40B. One flow path plate 40 faces one heat transfer plate 11. The other flow path plate 40 faces the other heat transfer plate 11. The pair of heat transfer plates 11 and the pair of flow path plates 40 are fixed together by fastening members, which are bolts 60 and nuts 61 (see Figure 12). One flow path plate 40 and the other flow path plate 40 are constructed similarly. The following description will mainly focus on one flow path plate 40, and the description of the other flow path plate 40 will be simplified or omitted. 【0027】 The flow channel plate 40 has a flow channel groove 42 provided on at least a portion of its surface 40A. The flow channel groove 42 is provided on the surface 40A of the flow channel plate 40. The flow channel groove 42 is formed in the central part of the surface 40A. The flow channel groove 42 is defined by a partition wall 42W. The flow channel groove 42 is defined between a pair of partition walls 42W. In this embodiment, the partition walls 42W are arranged in a spiral shape. A recess 42D is provided in a portion of the partition wall 42W, connecting adjacent flow channel grooves 42. The recess 42D is formed by cutting out a portion of the end face of the partition wall 42W. The heat transfer plate 11 faces the flow channel groove 42. With the heat transfer plate 11 facing the flow channel groove 42, the end face of the partition wall 42W is in contact with the heat transfer plate 11. The flow channel groove 42 is covered by the heat transfer plate 11, and the end face of the partition wall 42W and the heat transfer plate 11 are in contact, forming a flow channel 20. 【0028】 The flow channel plate 40 is made of, for example, PTFE, PFA, or PVDF. 【0029】 The flow channel plate 40 has a fluid supply port 43 and a fluid outlet port 44. The fluid supply port 43 supplies liquid LQ to the flow channel groove 42. The fluid outlet port 44 discharges at least a portion of the liquid LQ in the flow channel groove 42. The fluid supply port 43 is positioned outside the fluid outlet port 44 in the radial direction of the central axis AX. At least a portion of the fluid outlet port 44 is positioned on the central axis AX of the flow channel plate 40. A spiral flow channel groove 42 is formed connecting the fluid supply port 43 and the fluid outlet port 44. 【0030】 The flow channel plate 40 has holes 46 that penetrate in the thickness direction. The holes 46 are located outside the seal grooves 48 in the radial direction of the flow channel plate 40. In this embodiment, eight holes 46 are arranged at equal intervals in the circumferential direction. Bolts 60 and nuts 61 are inserted through the holes 46. 【0031】 The main body 10 has a supply pipe 21 and a discharge pipe 22. Liquid LQ supplied to the flow channel groove 42 flows through the supply pipe 21. At least a portion of the supply pipe 21 is located in the space SP between one flow channel plate 40 and the other flow channel plate 40. The supply pipe 21 has a manifold pipe and branch pipes connected to the fluid supply port 43 of one flow channel plate 40 and the fluid supply port 43 of the other flow channel plate 40, respectively. The outlet of the branch pipe is connected to the fluid supply port 43. 【0032】 As shown in Figure 6, the discharge pipe 22 is through which the liquid LQ discharged from the flow channel groove 42 flows. At least a portion of the discharge pipe 22 is located in the space SP between one flow channel plate 40 and the other flow channel plate 40. The discharge pipe 22 has branch pipes 22A connected to the fluid outlet 44 of one flow channel plate 40 and the fluid outlet 44 of the other flow channel plate 40, respectively, and a manifold pipe 22B connected to the pair of branch pipes 22A. The inlet 22C of the branch pipe 22A is connected to the fluid outlet 44. At least a portion of the inlet 22C of the branch pipe 22A is located on the central axis AX. 【0033】 A sealing groove 48 is provided around the flow channel groove 42 provided on the surface 40A, where a sealing member 47 is placed. The sealing groove 48 is provided on the surface 40A of the flow channel plate 40. The sealing member 47 includes, for example, an O-ring. When the sealing member 47 is placed in the sealing groove 48, it contacts the heat transfer plate 11 facing the flow channel groove 42. The sealing member 47 is pressed and crushed by the heat transfer plate 11 when the pair of heat transfer plates 11 and the pair of flow channel plates 40 are fastened together by bolts 60 and nuts 61. As a result, the sealing member 47 seals the boundary between the surface 40A of the flow channel plate 40 and the heat transfer plate 11. 【0034】 <Spacer material> The spacer member 41 is positioned between a pair of flow path plates 40. The support surface 41A of the spacer member 41 contacts the back surface 40B of one of the flow path plates 40. The spacer member 41 is positioned such that, for example, the back surface 40B of one flow path plate 40 and the back surface 40B of the other flow path plate 40 face each other with a space SP between them. The spacer member 41 may be the same length as, for example, the distance from the back surface 40B of one flow path plate 40 to the back surface 40B of the other flow path plate 40. The spacer member 41 may be shorter than, for example, the distance from the back surface 40B of one flow path plate 40 to the back surface 40B of the other flow path plate 40. The spacer member 41 may be provided along the entire circumference of the seal groove 48 in which the seal member 47 is positioned, or it may be provided to be located in a part of it. Multiple spacer members 41 may be provided along the seal groove 48 in which the seal member 47 is positioned. 【0035】 The spacer member 41 is made of a material different from that of the flow channel plate 40. The spacer member 41 is made of a material with a compressive strength greater than that of the flow channel plate 40. The spacer member 41 is made of a material with a creep deformation less than that of the flow channel plate 40. For example, the spacer member 41 is made of a material with a compressive strength greater than that of PTFE, PFA, or PVDF. For example, the spacer member 41 is made of a material with a creep deformation less than that of PTFE, PFA, or PVDF. The spacer member 41 is made of a resin such as polyvinyl chloride (PVC), polyether ether ketone (PEEK), polyphenylene sulfide (PPS), polyacetal (POM), polyethylene terephthalate (PET), polypropylene (PP), polycarbonate (PC), acrylonitrile butadiene styrene (ABS) resin, or polyethylene. The spacer member 41 is also made of a metal such as stainless steel or aluminum. 【0036】 At least a portion of the spacer member 41 is located in the region directly below the seal groove 48 where the seal member 47 is positioned. The spacer member 41 is positioned including at least a portion of the region directly below the seal groove 48. 【0037】 Figure 7 is a partially enlarged view of an example of a spacer member 41 according to the first embodiment. In the example shown in Figure 7, the spacer member 41 is formed in a columnar shape. The spacer member 41 has the same width as the seal groove 48. The spacer member 41 is located in a region with the same cross-section as the region directly below the seal groove 48. The spacer member 41 extends from directly below the seal groove 48 of one flow channel plate 40 to directly below the seal groove 48 of the other flow channel plate 40. One end face of the spacer member 41 contacts the region directly below the seal groove 48 on the back surface 40B of one flow channel plate 40. The other end face of the spacer member 41 contacts the region directly below the seal groove 48 on the back surface 40B of the other flow channel plate 40. 【0038】 <Assembly method> Next, the assembly method of the temperature control device 3 according to the first embodiment will be described using Figures 8 to 12. In this embodiment, the main body 10 has a connected first main body 10A and a second main body 10B. Figure 8 is a diagram illustrating the assembly method of the first main body 10A of the temperature control device 3 according to the first embodiment. As shown in Figure 8, a spacer member 41 is inserted between a pair of flow path plates 40 of the first main body 10A. The spacer member 41 comprises a main body 410, a spacer portion 411 formed integrally with the main body 410, and a spacer portion 412 separate from the main body 410. The spacer portion 411 and the spacer portion 412 are inserted so as to be located in the area directly below the seal groove 48. Therefore, the pair of flow path plates 40 contact the support surface 41A of the spacer member 41. The pair of flow path plates 40 are supported by the spacer member 41. 【0039】 Figure 9 is a diagram illustrating the assembly method of the second body 10B of the temperature control device 3 according to the first embodiment. As shown in Figure 9, a spacer member 41 is inserted between a pair of flow path plates 40 of the second body 10B. The spacer member 41 comprises a body 410, a spacer portion 411 formed integrally with the body 410, and a spacer portion 412 separate from the spacer portion 411. The spacer portion 411 is inserted so as to be located in the area directly below the seal groove 48. Therefore, the pair of flow path plates 40 contact the support surface 41A of the spacer member 41. The pair of flow path plates 40 are supported by the spacer member 41. 【0040】 Figure 10 is a diagram illustrating the assembly method of the main body 10 of the temperature control device 3 according to the first embodiment. As shown in Figure 10, the first main body 10A and the second main body 10B are connected. In this embodiment, the first main body 10A is described as being located upstream of the liquid LQ flow, and the second main body 10B is described as being located downstream of the liquid LQ flow. The downstream end of the supply pipe 21 of the first main body 10A is connected to the upstream end of the supply pipe 21 of the second main body 10B. The upstream end of the discharge pipe 22 of the first main body 10A is connected to the downstream end of the discharge pipe 22 of the second main body 10B. 【0041】 Figure 11 is a diagram illustrating the assembly method of the main body 10 of the temperature control device 3 according to the first embodiment. As shown in Figure 11, a sealing member 47 is placed in a sealing groove 48 provided on the surface 40A of the flow path plate 40. A heat transfer plate 11 is placed so as to cover the connected first main body 10A and second main body 10B. The heat transfer plate 11 is placed so as to cover the flow path groove 42. The heat transfer plate 11 is also in contact with the sealing member 47. As a result, a flow path 20 is formed between the heat transfer plate 11 and the flow path plate 40. 【0042】 Figure 12 is a diagram illustrating the assembly method of the temperature control device 3 according to the first embodiment. As shown in Figure 12, a pair of heat transfer plates 11 and a pair of flow path plates 40 are fixed together by bolts 60 and nuts 61. 【0043】 <Operation> Next, the operation of the temperature control device 3 according to the first embodiment will be described. Liquid LQ is supplied to the flow channel groove 42, which is the flow path 20, via the supply pipe 21 and the fluid supply port 43. The liquid LQ is guided in the flow channel groove 42 and flows toward the fluid outlet 44. In this embodiment, the flow channel groove 42 is spiral-shaped. The liquid LQ supplied from the fluid supply port 43 to the flow channel groove 42 flows in the directions indicated by arrows a, b, c, d, e, f, and g in Figure 5, and is then discharged from the fluid outlet 44. 【0044】 When a potential difference is applied to the thermoelectric module 30, the temperature control device 3 starts adjusting the temperature of the liquid LQ flowing through the flow channel groove 42. The temperature of the liquid LQ flowing through the flow channel groove 42 is adjusted by the absorption or release of heat by the thermoelectric module 30. 【0045】 The sealing member 47 seals the boundary between the surface 40A and the heat transfer plate 11 on the outside of the flow channel groove 42. Therefore, leakage of liquid LQ from the main body 10 is suppressed. 【0046】 The liquid LQ that flows through the flow channel groove 42 is discharged through the fluid outlet 44. In this embodiment, at least a portion of the fluid outlet 44 is positioned on the central axis AX of the flow channel plate 40. At least a portion of the inlet 22C of the discharge pipe 22 is also positioned on the central axis AX. That is, in the XY plane, the position of the fluid outlet 44 provided on the flow channel plate 40 and the position of the inlet 22C provided on the discharge pipe 22 coincide. Therefore, the occurrence of stagnation when the liquid LQ is discharged from the flow channel groove 42 into the discharge pipe 22 is suppressed. 【0047】 <effect> Next, the operation of the spacer member 41 according to the embodiment will be described. The spacer member 41 is positioned between the pair of flow path plates 40, in at least a portion of the area directly below the seal groove 48. The pair of heat transfer plates 11 are supported by the support surface 41A of the spacer member 41. As a result, when a load is applied to the pair of heat transfer plates 11, the spacer member 41 bears the load. The compressive strength of the spacer member 41 in the Z-axis direction is greater than the compressive strength of the flow path plates 40. Also, the amount of creep deformation of the spacer member 41 in the Z-axis direction is smaller than the amount of creep deformation of the flow path plates 40. Even when a load is applied to the pair of heat transfer plates 11, the creep deformation of the spacer member 41 is suppressed. Therefore, the deformation of the flow path plates 40 in the area directly below the seal groove 48 where the seal member 47 is positioned is suppressed. As a result, the amount of deformation of the seal groove 48 and the amount of compression of the seal member 47 are maintained at a constant amount. Therefore, the sealing performance of the seal member 47 is maintained. Therefore, leakage of the liquid LQ flowing through the flow path groove 42 from the main body 10 is suppressed. 【0048】 <Effects> As described above, in this embodiment, a spacer member 41 is placed between a pair of flow path plates 40, in at least a portion of the area directly below the seal groove 48. The compressive strength of the spacer member 41 in the Z-axis direction is greater than that of the flow path plate 40. Furthermore, in this embodiment, the amount of creep deformation of the spacer member 41 in the Z-axis direction is smaller than the amount of creep deformation of the flow path plate 40. Even when a load is applied to the pair of heat transfer plates 11, creep deformation of the spacer member 41 can be suppressed. Therefore, in this embodiment, deformation of the flow path plate 40 in the area directly below the seal groove 48 where the seal member 47 is placed can be suppressed. As a result, in this embodiment, the amount of compression of the seal member 47 can be maintained at a constant amount. In this embodiment, deformation due to load over time can be suppressed, and according to this embodiment, the sealing performance of the seal member 47 can be maintained. Therefore, in this embodiment, leakage of the liquid LQ flowing through the flow path groove 42 from the main body 10 can be appropriately suppressed over a long period of time. 【0049】 Figure 19 is a cross-sectional view showing an example of the main body of a conventional temperature control device. In the example shown in Figure 19, the spacer member 41 is arranged surrounding the nut 61. The spacer member 41 is located outside the area directly below the seal groove 48. The spacer member 41 is not located outside the area directly below the seal groove 48. 【0050】 In this embodiment, the corrosion-resistant plate 11P has corrosion resistance to acidic liquid LQ. According to this embodiment, corrosion is suppressed even when in contact with acidic liquid LQ, so the cleanliness of the cleaning system 1 can be maintained. 【0051】 In this embodiment, the spacer member 41 has a cross-sectional area equal to the cross-sectional area of ​​the region directly below the seal groove 48 where the seal member 47 is located. In this embodiment, deformation of the flow channel plate 40 in the region directly below the seal groove 48 can be appropriately suppressed. 【0052】 In this embodiment, the spacer member 41 is made of resin or metal. In this embodiment, the amount of creep deformation of the spacer member 41 due to the load acting on the pair of heat transfer plates 11 can be suppressed to less than the amount of creep deformation of the flow channel plate 40. 【0053】 In this embodiment, multiple spacer members 41 are provided along the seal groove 48 where the seal member 47 is located. According to this embodiment, deformation of the flow channel plate 40 in the area directly below the seal groove 48 can be suppressed more effectively. 【0054】 [Differentiation] A modified example of the columnar spacer member 41 will be explained using Figures 13 and 14. Figure 13 is a partially enlarged view of a modified example of the spacer member 41 according to the first embodiment. In the example shown in Figure 13, the spacer member 41 is formed in a columnar shape having a width narrower than the seal groove 48. The spacer member 41 is positioned including a portion of the area directly below the seal groove 48. The spacer member 41 is located in a region with a narrower cross-section than the area directly below the seal groove 48. In the example shown in Figure 13, the spacer member 41 is positioned towards the outside of the area directly below the seal groove 48, but is not limited to this. The spacer member 41 may be positioned towards the inside of the area directly below the seal groove 48, or in the middle. With such a configuration, the spacer member 41 can be miniaturized. 【0055】 Figure 14 is a partially enlarged view of a modified example of the spacer member 41 according to the first embodiment. In the example shown in Figure 14, the spacer member 41 is formed in a columnar shape having a width wider than the seal groove 48. The spacer member 41 is positioned to include the entire region directly below the seal groove 48. The spacer member 41 is located in a region with a wider cross-section than the region directly below the seal groove 48. With this configuration, deformation of the flow channel plate 40 in the region directly below the seal groove 48 where the seal member 47 is positioned can be further suppressed. 【0056】 Using Figures 15 to 18, we will explain modified examples in which the spacer member 41 is not columnar. Figure 15 is a partially enlarged view of a modified example of the spacer member 41 according to the first embodiment. In the example shown in Figure 15, the spacer member 41 is cylindrical in the XZ plane. This configuration makes it possible to reduce the weight of the spacer member 41. 【0057】 Figure 16 is a partially enlarged view of a modified example of the spacer member 41 according to the first embodiment. In the example shown in Figure 16, the spacer member 41 has a U-shaped cross-section that opens inward in the XZ plane. This configuration makes it possible to reduce the weight of the spacer member 41. 【0058】 Figure 17 is a partially enlarged view of a modified example of the spacer member 41 according to the first embodiment. In the example shown in Figure 17, the spacer member 41 has a Z-shaped cross-section in the XZ plane. This configuration makes it possible to reduce the weight of the spacer member 41. 【0059】 Figure 18 is a partially enlarged view of a modified example of the spacer member 41 according to the first embodiment. In the example shown in Figure 18, the spacer member 41 has an X-shaped cross-section in the XZ plane. This configuration makes it possible to reduce the weight of the spacer member 41. 【0060】 [Second Embodiment] A second embodiment will be described using Figure 20. Figure 20 is a cross-sectional view showing an example of the main body of a temperature control device according to the second embodiment. The second embodiment further includes a spring member 65 that restricts the loosening of fastening members compared to the first embodiment. The spring member 65 is positioned between the head of the bolt 60 or the nut 61 and the heat transfer plate 11. The spring member 65 restricts the loosening of the bolt 60 and the nut 61. The spring member 65 biases the pair of heat transfer plates 11 in a direction that shortens the distance between the pair of heat transfer plates 11. The spring member 65 is, for example, a compression spring or a disc spring. 【0061】 <Effects> As described above, in this embodiment, the spring member 65 biases the pair of heat transfer plates 11 in a direction that shortens the distance between them. In this embodiment, even if deformation occurs due to load over time, the sealing performance of the sealing member 47 can be maintained. Therefore, in this embodiment, leakage of the liquid LQ flowing through the flow channel groove 42 from the main body 10 can be appropriately suppressed over a long period of time. 【0062】 [Third Embodiment] A second embodiment will be described using Figures 21 to 23. Figure 21 is a perspective view showing an example of a temperature control device according to the third embodiment. Figure 22 is a schematic side view showing an example of a temperature control device according to the third embodiment. Figure 23 is a schematic cross-sectional view showing an example of the main body of a temperature control device according to the third embodiment. Figure 23 is a simplified diagram of the regulating member 70 for illustrative purposes and differs from an enlarged view of Figure 22. The same applies to Figures 24 and 25, which will be described later. The third embodiment further includes a regulating member 70 in addition to the first or second embodiment. 【0063】 The restricting member 70 is positioned on the opposite side of the heat transfer plate 40 from the heat transfer plate 11 and restricts the widening of the distance between the pair of heat transfer plates 11. The restricting member 70 is made of metal, such as stainless steel or aluminum. The restricting member 70 is positioned outside the sealing member 47. In this embodiment, four restricting members 70 are arranged corresponding to the four sides of the rectangular heat transfer plate 11 in a view along the Z-axis. The four restricting members 70 are similarly configured. The restricting member 70 comprises a base portion 71 positioned opposite the heat transfer plate 11 at a distance from it, and a pair of legs 72 extending from the base portion 71 toward the heat transfer plate 11. 【0064】 The base portion 71 is rod-shaped and extends along one side of the rectangular heat transfer plate 11 when viewed in the Z-axis direction. In this embodiment, the longitudinal length of the base portion 71 is longer than half the length of one side of the heat transfer plate 11 and shorter than the length of one side. 【0065】 In this embodiment, the leg portion 72 extends along the Z-axis direction. The length of the leg portion 72 in the Z-axis direction is such that it allows the distance between the pair of heat transfer plates 11 to widen without reducing the sealing effect of the sealing member 47. The tip portion 72 of the leg portion 72 contacts the surface 11 of the heat transfer plate 11 when the heat transfer plate 40 undergoes creep deformation. 【0066】 The spring member 65 expands and contracts along the direction in which the pair of flow path plates 40 and the pair of heat transfer plates 11 are stacked. The spring member 65 expands and contracts between the base 71 and the heat transfer plate 11 facing it. 【0067】 The fastening members, bolts 60 and nuts 61, fasten the base 71 of the restricting member 70 together with the pair of flow path plates 11 and the pair of heat transfer plates 40. In this embodiment, the fastening members, bolts 60 and nuts 61, are positioned towards the center of the leg portion 72 when viewed in the Z-axis direction. In this embodiment, one restricting member 70 has both longitudinal ends of the base 71 fastened by the fastening members. 【0068】 One or more spring members 65 are arranged for each regulating member 70. In this embodiment, three spring members 65 are arranged for each regulating member 70. The number of spring members 65 is not limited. The spring members 65 arranged in relation to one regulating member 70 are spaced apart in the longitudinal direction of the regulating member 70. The spring members 65 are arranged between the base 71 of the regulating member 70 and the heat transfer plate 11 which is positioned opposite the base 71. 【0069】 In this embodiment, a bolt 60 is inserted through the spring members 65S located at both ends of the spring members 65 arranged in conjunction with one restricting member 70. In other words, the spring members 65S located at both ends are arranged coaxially with the bolt 60, surrounding the outer circumference of the bolt 60. In this embodiment, a bolt 60 is not inserted through the spring member 65C located in the center of the spring members 65 arranged in conjunction with one restricting member 70. In other words, the spring member 65C located in the center is positioned offset from the bolt 60 in a view along the Z-axis. The spring member 65C located in the center is positioned by a pin (not shown) that is shorter than the leg portion 72 formed on the base portion 71. 【0070】 <Effects> As described above, in this embodiment, even when the pressure caused by the liquid LQ flowing through the flow channel groove 42 increases, the regulating member 70 can restrict the widening of the gap between the pair of heat transfer plates 11. This embodiment can effectively suppress leakage of the liquid LQ flowing through the flow channel groove 42 from the main body 10 over a long period of time. 【0071】 [Differentiation] Figure 24 is a cross-sectional view showing a modified example of the body of the temperature control device according to the third embodiment. In the example shown in Figure 24, none of the spring members 65 have bolts 60 inserted through them. In other words, all of the spring members 65 are positioned offset from the bolts 60 in a view along the Z-axis. 【0072】 In this embodiment, the legs 72 of the restricting member 70 are inserted through the spring members 65S located at both ends of the spring members 65 arranged in conjunction with one restricting member 70. In other words, the spring members 65S located at both ends are arranged coaxially with the legs 72 of the restricting member 70, surrounding the outer circumference of the legs 72 of the restricting member 70. In this embodiment, the legs 72 of the restricting member 70 are not inserted through the spring member 65C located in the center of the spring members 65 arranged in conjunction with one restricting member 70. In other words, the spring member 65C located in the center is positioned offset from the legs 72 of the restricting member 70 in a view along the Z-axis. The spring member 65C located in the center is positioned by a pin (not shown) that is shorter than the legs 72 formed on the base 71. 【0073】 Figure 25 is a cross-sectional view showing a modified example of the main body of the temperature control device according to the third embodiment. In the example shown in Figure 25, the leg portion 72 is formed in a cylindrical shape surrounding the bolt 60. The bolt 60 is inserted through the hollow portion of the leg portion 72. 【0074】 All spring members 65 are positioned between a pair of legs 72 of the regulating member 70. None of the spring members 65 are inserted through the bolt 60 or the legs 72. In other words, all spring members 65 are positioned offset from the bolt 60 in a view along the Z-axis. All spring members 65 are positioned by pins (not shown) that are shorter than the legs 72 formed on the base 71. 【0075】 Figure 26 is a cross-sectional view showing a modified example of the body of the temperature control device according to the third embodiment. In the example shown in Figure 26, one regulating member 70 and one spring member 65 are arranged for each bolt 60. The regulating member 70 is fastened by one fastening member. The regulating member 70 comprises a base portion 71 and a cylindrical leg portion 72 that surrounds the bolt 60. The bolt 60 is inserted through the hollow portion of the leg portion 72. In the example shown in Figure 26, the length of the base portion 71 in the X-axis direction is shorter than half the length of one side of the heat transfer plate 11 and longer than the width of the spring member 65 in the X-axis direction. 【0076】 The spring member 65 is housed in the hollow portion of the leg portion 72. A bolt 60 is inserted through the spring member 65. 【0077】 Figure 27 is a perspective view showing a modified example of the temperature control device according to the third embodiment. In the example shown in Figure 27, the base 71 of the regulating member 70 is formed in an annular shape. The base 71 of the regulating member 70 is positioned on the outer circumference side of the sealing member 47 (not shown) when viewed in the Z-axis direction. The base 71 of the regulating member 70 is fastened together with a pair of flow path plates 11 and a pair of heat transfer plates 40 by fastening members, which are bolts 60 and nuts 61, which are arranged at intervals in the circumferential direction of the base 71 of the regulating member 70. 【0078】 The spring members 65 are arranged at intervals in the circumferential direction of the base 71 of the regulating member 70. In this embodiment, a spring member 65S through which a bolt 60 is inserted and a spring member 65C without a bolt 60 are arranged. The spring member 65C without a bolt 60 is positioned by a pin (not shown). 【0079】 Figure 28 is a cross-sectional view showing a modified example of the main body of the temperature control device according to the third embodiment. In the example shown in Figure 28, the regulating members 70 are arranged in pairs, flanking a pair of heat transfer plates 11. Each regulating member 70 is configured in the same way as in the third embodiment. 【0080】 In the above-described embodiment, the main body 10 may consist of one unit, or it may consist of three or more units connected together. 【0081】 In the above-described embodiment, the first body 10A and the second body 10B may be formed as a single unit. In this case, the body will have a shape in which the first body 10A and the second body 10B are connected. 【0082】 In the above-described embodiment, the temperature control device 3 adjusts the temperature of the liquid LQ. The temperature control device 3 may also adjust the temperature of a gas. By supplying gas to the flow channel groove 42, the temperature control device 3 can adjust the temperature of the gas flowing through the flow channel groove 42 using the thermoelectric semiconductor element 32. [Explanation of symbols] 【0083】 1...Washing system, 2...Storage tank, 3...Temperature control device, 4...Substrate holding member, 5...Nozzle, 6...First connecting pipe, 7...Pump, 8...Second connecting pipe, 10...Main body, 10A...First main body, 10B...Second main body, 11...Heat transfer plate, 11P...Corrosion-resistant plate, 12...Thermoelectric module board, 13...Heat exchange plate, 20...Flow path, 21...Supply pipe, 22...Discharge pipe, 22A...Branch pipe, 22B...Collection pipe, 22C...Inlet, 30...Thermoelectric module, 31...Case, 32...Thermoelectric semiconductor element, 32P...p-type thermoelectric semiconductor element 32N...n-type thermoelectric semiconductor element, 33...first electrode, 34...second electrode, 40...flow channel plate, 40A...front surface, 40B...back surface, 41...spacer member, 41A...support surface, 42...flow channel groove, 42D...recess, 42W...partition wall, 43...fluid supply port, 44...fluid outlet, 46...hole, 47...seal member, 48...seal groove, 60...bolt (fastening member), 61...nut (fastening member), 65...spring member, 70...regulating member, 71...base, 72...leg, AX...central axis, LQ...liquid, SP...space, W...substrate.

Claims

[Claim 1] A pair of flow channel plates, each having a surface and a flow channel groove provided on at least a portion of the surface, A pair of heat transfer plates facing the flow grooves provided on each of the pair of flow path plates, A sealing member that seals the boundary between the surface of the flow channel plate and the heat transfer plate, A spacer member is positioned opposite the back surface of the flow path plate and in at least a portion of the area directly below the sealing member, A fastening member for fastening the pair of flow path plates and the pair of heat transfer plates in an overlapping state, Equipped with, The spacer member has a compressive strength greater than that of the flow channel plate. Temperature control device. [Claim 2] A restricting member is positioned on the opposite side of the heat transfer plate from the flow path plate and restricts the widening of the distance between the pair of heat transfer plates. Equipped with, The fastening member fastens the restricting member together with the pair of flow path plates and the pair of heat transfer plates. The temperature control device according to claim 1. [Claim 3] A spring member that biases the pair of heat transfer plates in a direction that shortens the distance between them, A temperature control device according to claim 1 or 2, comprising: [Claim 4] The spacer member has a cross-sectional area that is the same as the cross-sectional area of ​​the region directly below the seal member. The temperature control device according to claim 1. [Claim 5] The spacer member has a cross-sectional area smaller than the cross-sectional area of ​​the region directly below the seal member. The temperature control device according to claim 1. [Claim 6] The spacer member has a cross-sectional area wider than the cross-sectional area of ​​the region directly below the seal member. The temperature control device according to claim 1. [Claim 7] The spacer member is formed in a columnar shape. The temperature control device according to claim 5 or 6. [Claim 8] The spacer member is formed in a cylindrical shape. The temperature control device according to claim 5 or 6. [Claim 9] The spacer member is made of resin or metal. The temperature control device according to claim 1. [Claim 10] The spacer members are provided in multiple locations along the sealing member. The temperature control device according to claim 1. [Claim 11] The regulating member comprises a base portion positioned opposite the heat transfer plate at a distance from it, and a leg portion extending from the base portion toward the heat transfer plate. The legs extend along the direction in which the pair of flow path plates and the pair of heat transfer plates are superimposed. The temperature control device according to claim 2. [Claim 12] The spring member through which the fastening member is inserted, The temperature control device according to claim 3. [Claim 13] A spring member that biases the pair of heat transfer plates in a direction that shortens the distance between them, Equipped with, The spring member is positioned between the base of the regulating member and the heat transfer plate which is positioned opposite the base. The temperature control device according to claim 11.

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