Temporary fixed substrate

JP7874213B2Active Publication Date: 2026-06-15NGK CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
NGK CORP
Filing Date
2025-03-05
Publication Date
2026-06-15

AI Technical Summary

⚠Technical Problem

Conventional temporary fixing substrates used in semiconductor package manufacturing suffer from issues such as chipping and delamination, leading to decreased yield.

⚗Method used

A translucent alumina temporary fixing substrate with a chamfered region on its edges, featuring a two-stage configuration with specific inclination angles and surface roughness, is used to prevent chipping and delamination during the manufacturing process.

🎯Benefits of technology

The chamfered edges effectively suppress chipping and delamination, enhancing the yield of semiconductor packages by maintaining the integrity of the resin and adhesive layers.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

To suppress chipping in an outer peripheral section of a temporarily fixed substrate.SOLUTION: On a temporarily fixed substrate, on which a predetermined fixing target is temporarily fixed on one principal surface, the arithmetic average roughness of a side end is greater than the arithmetic average roughness of the one principal surface and is 5 μm or less.SELECTED DRAWING: Figure 2
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