Wafer expansion equipment and component supply equipment
The wafer expansion apparatus addresses uneven expansion by incorporating a warp prevention mechanism to uniformly expand wafers, improving die supply reliability and efficiency through consistent spacing.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- FUJI CORP
- Filing Date
- 2022-03-30
- Publication Date
- 2026-06-16
Smart Images
Figure 0007874720000001 
Figure 0007874720000002 
Figure 0007874720000003
Abstract
Description
Technical Field
[0001] The technology disclosed in this specification relates to a wafer expansion device and a component supply device.
Background Art
[0002] There is known a component supply device that supplies dies separated from a wafer to a component mounter. This type of component supply device includes a wafer expansion device that expands a dicing sheet. The dicing sheet is held around its periphery by a wafer frame, and a diced wafer is adhered to its surface. The wafer expansion device expands the dicing sheet while fixing the wafer frame, and increases the distance between the dies. Generally, this type of wafer expansion device is composed of a base plate, an annular first plate, a substantially annular second plate, etc. The base plate has an expansion cylindrical portion for expanding the dicing sheet on its upper surface. The first plate surrounds the expansion cylindrical portion from its outer peripheral side. The second plate is disposed above the first plate, and presses and fixes a wafer frame disposed in the gap between itself and the first plate from above. When expanding the wafer, the wafer frame is set in the gap between the first plate and the second plate by being inserted, for example, through an insertion portion formed by cutting out a part of the outer peripheral edge of the second plate. In this state, when the first plate and the second plate descend, the dicing sheet is expanded by being pressed by the expansion cylindrical portion, and the distance between the dies is increased. Note that a prior art similar to this is disclosed in, for example, Japanese Patent Application Laid-Open No. 2012-109473.
Summary of the Invention
Problems to be Solved by the Invention
[0003] In conventional wafer expansion devices, the second plate is fixed to the upper side of the first plate on the front side where the insertion section is not formed. In contrast, on the rear side where the insertion section is formed, the second plate is not fixed to the upper side of the first plate in order to secure space for inserting the wafer frame. Therefore, when the first and second plates descend during wafer expansion, the reaction force received from the dicing sheet easily causes warping on the rear side of the second plate where the insertion section is formed. In this case, the wafer can be expanded to the set amount on the front side where the insertion section is not formed, while on the rear side where the insertion section is formed, the wafer cannot be expanded to the set amount due to insufficient tension. In other words, conventional devices had the problem of uneven wafer expansion.
[0004] Therefore, this specification provides a technology that can equalize the amount of wafer expansion. [Means for solving the problem]
[0005] The wafer expansion apparatus disclosed herein expands a dicing sheet while fixing a wafer frame that holds a dicing sheet to which a diced wafer is attached, thereby widening the spacing between dies separated from the wafer. The wafer expansion apparatus comprises a base plate, an annular first plate, a substantially annular second plate, an insertion portion, and a warp prevention mechanism. The base plate has an expansion cylindrical portion on its upper surface for expanding the dicing sheet. The first plate surrounds the expansion cylindrical portion from its outer circumference. The second plate is positioned above the first plate and holds and fixes the wafer frame inserted into the gap between itself and the first plate from above. The insertion portion is formed by cutting out a part of the outer edge of the second plate, and allows the wafer frame to be slid into the gap between the first plate and the second plate. The warp prevention mechanism is provided at least near the insertion portion formation area on the outer edge of the second plate to prevent warping of the second plate. According to the wafer expansion apparatus described above, the warping prevention mechanism prevents warping of the second plate, thereby enabling uniform wafer expansion.
[0006] Furthermore, this specification discloses a novel component supply device. This component supply device comprises a wafer housing section that houses a plurality of wafer frames that hold dicing sheets to which diced wafers are attached, the wafer expansion device described above, and a moving mechanism for moving wafer frames between the wafer housing section and the wafer expansion device. With this component supply device, the dicing sheet is expanded evenly, and dies attached to the dicing sheet can be suitably supplied. [Brief explanation of the drawing]
[0007] [Figure 1] This is a schematic side view showing the configuration of the parts supply device of Example 1. [Figure 2] This is a schematic plan view of the component supply device of Example 1, before the wafer frame is moved from the wafer housing to the wafer expansion device. [Figure 3]This is a schematic plan view of the component supply device of Example 1 after the wafer frame has been moved from the wafer housing section to the wafer expansion device. [Figure 4] This is a perspective view of a wafer expansion device. [Figure 5] This is a cross-sectional view along line AA in Figure 4. [Figure 6] This is an enlarged cross-sectional view of the main part to explain the operation of the anti-warping mechanism. [Figure 7] This is an enlarged cross-sectional view of the main part to explain the operation of the anti-warping mechanism. [Figure 8] This is an enlarged cross-sectional view of the main part to explain the operation of the anti-warping mechanism. [Modes for carrying out the invention]
[0008] In embodiments of wafer expansion apparatus disclosed herein, the first plate and the second plate are configured to be movable relative to each other in the thickness direction of the base plate, and the dicing sheet may be expanded by the expansion cylindrical portion when the first plate and the second plate move relative to each other in a direction approaching the base plate. The warping prevention mechanism may include a warping prevention member that prevents warping of the second plate by pressing from above the portion of the outer edge of the second plate on which the insertion portion is formed when the dicing sheet is expanded by the expansion cylindrical portion. With such a configuration, the portion on which the insertion portion is formed is pressed from above by the warping prevention member, and warping of this portion can be suitably suppressed.
[0009] In embodiments of the wafer expansion apparatus disclosed herein, the warp prevention member may be configured to move between a first position in contact with the upper surface of the portion of the outer periphery of the second plate in which the insertion portion is formed, and a second position spaced apart from the upper surface of the portion of the outer periphery of the second plate in which the insertion portion is formed. The warp prevention mechanism may further include a motion conversion mechanism that converts the linear motion of the first plate and the second plate when they move relative to each other in a direction approaching the base plate into a movement motion of the warp prevention member from the second position to the first position. With such a configuration, there is no need to provide a dedicated actuator for driving the warp prevention member.
[0010] In embodiments of wafer expansion devices disclosed herein, the warp prevention member may be a retaining arm having a fixed end and a free end. The retaining arm may be configured such that the fixed end is pivotally supported on a pivot axis formed on the outer edge of the first plate, and the free end presses the second plate from above. When the retaining arm is in the first position, the free end engages with the upper surface of the second plate and presses the second plate from above, and when the retaining arm is in the second position, the free end may move away from the upper surface of the second plate and retract below the insertion portion. The motion conversion mechanism may include a support column and a return spring. The support column protrudes from the upper surface of the base plate and has a bearing at its tip that slides against the outer surface of the retaining arm, and when the first plate and the second plate move relative to the base plate in the direction of approaching the base plate, the bearing may slide against the outer surface of the retaining arm and rotate the retaining arm from the second position to the first position. The return spring may apply a biasing force to the retaining arm in the direction of returning the retaining arm from the first position to the second position. With this configuration, the movement of the retaining arm from the second position to the first position can be achieved with a simple mechanism. [Examples]
[0011] The component supply device 11 according to Embodiment 1 will be described below with reference to Figures 1 to 8. As shown in Figure 1, the component supply device 11 of this embodiment includes a wafer housing section 21, a moving mechanism 31, and a wafer expansion device 41. A component mounting machine (not shown) is set up in front of the component supply device 11 (to the right in the drawing). The component mounting machine mounts the dies 4 supplied from the component supply device 11 onto the circuit board inside the component mounting machine. A known component mounting machine can be used as the component mounting machine.
[0012] The wafer housing section 21 is positioned adjacent to the main body 12 of the component supply device 11 on the side opposite to the component mounting machine. The wafer housing section 21 houses multiple wafer frames 3 that hold dicing sheets 2 to which wafers 1 are attached. The wafer frame 3 is a ring-shaped frame for fixing the wafer 1 during dicing. A dicing sheet 2 is placed on the upper surface of the wafer frame 3. The dicing sheet 2 is a sheet made of an expandable material, and diced wafers 1 (i.e., multiple dies 4) are attached to its upper surface. The wafer housing section 21 includes a magazine 22 and a lifting mechanism 26. The magazine 22 includes multiple wafer frame housing sections 25 capable of housing wafer frames 3. The multiple wafer frame housing sections 25 are stacked in the height direction (Z direction in the drawing). The wafer housing section 21 supplies the wafer frames 3 housed in the wafer frame housing sections 25 to the wafer expansion device 41.
[0013] The lifting mechanism 26 raises and lowers the magazine 22 and stops the magazine 22 at any desired height. In this embodiment, the lifting mechanism 26 is composed of a ball screw 24 that supports the magazine 22 from below and a motor 23 that rotates the ball screw 24. However, the lifting mechanism 26 can be configured using a mechanism equipped in a known parts supply device. When the wafer frame housing section 25 is positioned at a preset removal position by the lifting mechanism 26, the wafer frame 3 can be discharged from the wafer frame housing section 25 through the discharge port 15 to the wafer expansion device 41 side.
[0014] The moving mechanism 31 is located above the wafer expansion device 41, which is installed on a wafer frame transport path 13 located in the internal space 14 of the main body 12. The moving mechanism 31 moves the wafer frame 3 between the wafer housing 21 and the wafer expansion device 41. As shown in Figures 2 and 3, the moving mechanism 31 comprises a clamper 33, a main body 32, and a pair of guide rails 34. The pair of guide rails 34 are arranged parallel to each other on the wafer frame transport path 13, sandwiching the wafer expansion device 41. Both guide rails 34 extend in the X direction. The main body 32 is supported so as to be movable on the pair of guide rails 34, allowing it to pass above the wafer expansion device 41. The clamper 33 is supported on the lower side of the main body 32 and moves in the X direction together with the main body 32. The tip of the clamper 33 is inserted into the wafer frame housing 25 through the discharge port 15 and grips the outer periphery of the wafer frame 3 from above and below.
[0015] As shown in Figures 1 to 3, the wafer expansion device 41 is provided on a wafer frame transport path 13 located in the internal space 14 of the main body 12. The wafer expansion device 41 is used to expand the dicing sheet 2 to which the diced wafers 1 are attached, and to widen the spacing between the dies 4. The wafer expansion device 41 is composed of a base plate 42, an annular first plate 51, a substantially annular second plate 61, and the like.
[0016] As shown in Figures 4 and 5, the base plate 42 is a rectangular plate-shaped member having through holes 43 that penetrate its upper and lower surfaces. The base plate 42 is provided with an expansion cylindrical portion 46 on its upper side. The expansion cylindrical portion 46 is a member for pressing and expanding the dicing sheet 2, and has a tapered tip portion 48 and a base portion 47 positioned below the tip portion 48 and fitted into the through holes 43.
[0017] As shown in Figures 2 to 4, the first plate 51 is an annular member having an inner diameter larger than the outer diameter of the expansion cylindrical portion 46, and is positioned to surround the expansion cylindrical portion 46 from its outer circumference. Multiple support portions 53 with through holes are provided at several locations on the outer circumference of the first plate 51. Actuators 57 are positioned on the lower surface of the base plate 42 at positions corresponding to each support portion 53 to enable relative movement of the first plate 51 and the second plate 61 in the thickness direction of the base plate 42. The actuator 57 includes an extendable rod 56 that protrudes upward. The tip of the rod 56 slides through the base plate 42 and is fitted into the through hole of the support portion 53. When the actuator 57 is driven, the rod 56 extends and retracts, causing the first plate 51 to move up and down in the Z direction together with the second plate 61. Then, as the first plate 51 and the second plate 61 move relative to each other in a direction that brings them closer to the base plate 42, the tip 48 of the expansion cylindrical portion 46 presses against the outer circumference of the dicing sheet 2 from below. As a result, the dicing sheet 2 is expanded.
[0018] As shown in FIGS. 2 to 4, the second plate 61 is a substantially annular member having an inner diameter larger than the outer diameter of the cylindrical portion 46 for expansion, and is disposed above the first plate 51. The second plate 61 of the present embodiment is configured by arranging two substantially C-shaped second plate pieces 61a in a circular shape. The front end portions 63a of the two second plate pieces 61a are disposed opposite to each other with the front slit 63 therebetween. The rear end portions 62a of the two second plate pieces 61a are disposed opposite to each other with the rear slit 62 therebetween. The front slit 63 and the rear slit 62 are portions that allow the clamp 33 holding the wafer frame 3 to pass through. A connecting portion 64 projects from the lower surface of the outer peripheral edge of the second plate piece 61a. The connecting portion 64 is supported and fixed above the first plate 51. However, the connecting portion 64 does not project from the lower surface of the outer peripheral edge of the rear end portion 62a of the second plate piece 61a, and a slit-shaped insertion portion 66 is formed by cutting out that portion. The insertion portion 66 is a portion for sliding and introducing the wafer frame 3 into the gap S1 between the first plate 51 and the second plate 61. The wafer frame 3 is inserted through the insertion portion 66 and is set in the gap S1 between the first plate 51 and the second plate 61. The second plate 61 presses and fixes the wafer frame 3 disposed in the gap S1 with the first plate 51 from above. In the present embodiment, since the rear end portion 62a of the second plate piece 61a is not supported and fixed to the first plate 51, it can be said that it is a portion where warping is likely to occur.
[0019] As shown in FIGS. 4 and 5, the anti-warping mechanism 71 is a structure for preventing warping of the second plate 61, and is provided in the vicinity of the portion where the insertion portion 66 is formed on the outer peripheral edge of the second plate 61. In the present embodiment, the anti-warping mechanisms 71 are respectively disposed at the rear end portions 62a of the two second plate pieces 61a. The anti-warping mechanism 71 includes an anti-warping member 72 and a motion conversion mechanism 75.
[0020] As shown in FIG. 6, the warpage prevention member 72 is an L-shaped pressing arm 72 having a fixed end 72a and a free end 72b. When the dicing sheet 2 is expanded by the expansion cylindrical portion 46, the pressing arm 72 presses, from above, the portion of the outer peripheral edge of the second plate 61 where the insertion portion 66 is formed, thereby preventing warpage of the second plate 61. A recess 68 with which the free end 72b engages is formed along the circumferential direction on the upper surface of the portion of the outer peripheral edge of the second plate 61 where the insertion portion 66 is formed. A rotation shaft 76 is provided on the outer peripheral edge of the second plate 61. The fixed end 72a of the pressing arm 72 is pivotally supported on the rotation shaft 76 so as to be rotatable. The free end 72b of the pressing arm 72 is configured to press the second plate 61 from above. That is, the pressing arm 72 is configured to rotate between a first position P1 shown in FIG. 8 and a second position P2 shown in FIG. 6.
[0021] As shown in FIG. 6, the motion conversion mechanism 75 includes a support column 78 provided with a bearing 77 and a return spring 79. The base end of the support column 78 is fixed to the base plate 42, and the tip thereof protrudes above the base plate 42. A bearing 77 is provided at the tip of the support column 78. The bearing 77 is arranged to be slidably in contact with the outer surface 72c of the pressing arm 72. The motion conversion mechanism 75 converts the linear motion when the first plate 51 and the second plate 61 move relative to each other in a direction approaching the base plate 42 into a rotational movement of the warpage prevention member 72 from the second position P2 to the first position P1. The return spring 79 is, for example, a torsion coil spring, and the rotation shaft 76 is inserted through the central hole thereof. One end of the return spring 79 is fixed to the first plate 51 side, and the other end of the return spring 79 is fixed to the fixed end 72a side of the pressing arm 72. The return spring 79 applies a biasing force in a direction to return the pressing arm 72 from the first position P1 to the second position P2 to the pressing arm 72.
[0022] The component supply device 11 of this embodiment further includes a push-up mechanism (not shown) and a control device 16. The push-up mechanism is located at a lower position on the wafer frame transport path 13. The push-up mechanism pushes up from below a position corresponding to a predetermined die 4 on the expanded wafer 1 so that the suction nozzle of the component mounting machine can easily pick up the predetermined die 4. The control device 16 is provided, for example, in the main body 12 and is configured using a computer equipped with a CPU, ROM, and RAM. The control device 16 controls the operation of each part of the component supply device 11 (wafer storage unit 21, moving mechanism 31, wafer expansion device 41, and push-up mechanism) based on a predetermined component supply program. Specifically, the control device 16 is electrically connected to the motor 23 of the lifting mechanism 26 and drives the motor 23 at a predetermined timing to raise and lower the magazine 22. The control device 16 is also electrically connected to the main body 32 and the clamper 33 and drives them at a predetermined timing to move the main body 32 and cause the clamper 33 to perform gripping and releasing operations. The control device 16 is also electrically connected to the actuator 57 of the wafer expansion device 41, and by driving the actuator 57 at a predetermined timing, it causes the wafer expansion device 41 to expand the dicing sheet 2. The control device 16 is also electrically connected to the push-up mechanism, and by driving the push-up mechanism at a predetermined timing, it causes the push-up mechanism to perform a push-up operation.
[0023] Next, the operation of the component supply device 11 will be described. First, the control device 16 drives the lifting mechanism 26 to move the magazine 22 in the Z direction, aligning the designated wafer frame housing 25 with the height of the discharge port 15. Then, the wafer frame 3 inside the designated wafer frame housing 25 becomes ready for removal. Next, the control device 16 drives the moving mechanism 31 to move the main body 32 towards the rear of the wafer expansion device 41 (to the left in Figure 2). The main body 32 reaches a position close to the discharge port 15, and the tip of the clamper 33 is inserted into the wafer frame housing 25 through the discharge port 15. Next, the control device 16 drives the clamper 33 to grip the outer periphery of the wafer frame 3 from above and below. While maintaining this gripping state, the control device 16 drives the moving mechanism 31 again to move the main body 32 towards the front of the wafer expansion device 41 (to the right in Figure 3). The main body 32 passes over the wafer expansion device 41 and reaches the position shown in Figure 3. The clamper 33 moves together with the main body 32 while gripping the wafer frame 3. Then, the wafer frame 3 is discharged from the designated wafer frame housing section 25 through the discharge port 15. The discharged wafer frame 3 slides along the direction indicated by arrow A1 (see Figures 3, 4, and 6). The wafer frame 3 is then inserted into the gap S1 between the first plate 51 and the second plate 61 via the insertion section 66. At this time, the wafer expansion device 41 maintains the state shown in Figure 6. That is, the first plate 51 and the second plate 61 are positioned at the furthest point from the base plate 42 (upper end position). At this time, only the biasing force of the return spring 79 acts on the retaining arm 72, so the retaining arm 72 is held in the second position P2. That is, the free end 72b of the retaining arm 72 is separated from the upper surface of the second plate 61 and retracted to a position below the insertion section 66. Therefore, the retaining arm 72 is positioned so that it is completely off the movement path of the wafer frame 3, and does not interfere with the wafer frame 3 as it slides. Once the wafer frame 3 is set in the gap S1 between the first plate 51 and the second plate 61, the control device 16 then drives the actuator 57 of the wafer expansion device 41 to retract the rod 56.
[0024] Figure 7 shows the state in which the first plate 51 and the second plate 61 are positioned 5 mm lower from the upper end position. Figure 8 shows the state in which the first plate 51 and the second plate 61 are positioned 10 mm lower from the upper end position. In the process from the upper end position shown in Figure 6 to the 5 mm lower position shown in Figure 7, the tip 48 of the expansion cylindrical part 46 gradually approaches the dicing sheet 2, but the tip 48 is separated from the dicing sheet 2. Therefore, no tension is applied to the dicing sheet 2 to expand it. Also, in this process, as the first plate 51 and the second plate 61 descend, the bearing 77 slides against the outer surface 72c of the retaining arm 72, pressing the retaining arm 72. As a result, the retaining arm 72 begins to rotate from the second position P2 towards the first position P1.
[0025] During the process from the 5mm lowered position shown in Figure 7 to the 10mm lowered position shown in Figure 8, the tip 48 of the expansion cylindrical part 46 approaches the dicing sheet 2 further, and when it reaches the 10mm lowered position, it contacts the lower surface of the dicing sheet 2. At this point, tension for expanding the dicing sheet 2 begins to be applied to the dicing sheet 2. Also during this process, as the first plate 51 and the second plate 61 descend, the bearing 77 slides against the outer surface 72c of the retaining arm 72, pressing down on the retaining arm 72. As a result, the retaining arm 72 rotates to the first position P1. The free end 72b of the retaining arm 72 then engages with the recess 68 and presses down from above the part of the second plate 61 that is prone to warping. Furthermore, by lowering the first plate 51 and the second plate 61 further from the 10mm lowered position, the wafer expansion device 41 expands the dicing sheet 2.
[0026] Once the expansion is complete, the control device 16 drives the push-up mechanism to perform a series of push-up operations, and in conjunction with this, the suction nozzle of the component mounting machine picks up the die 4 and mounts it to a predetermined position on the circuit board. When this mounting process is completed, the control device 16 drives the actuator 57 of the wafer expansion device 41 to extend the rod 56. As a result, the first plate 51 and the second plate 61 rise and return to the raised end position shown in Figure 6. Accordingly, the retaining arm 72 rotates from the first position P1 to the second position P2, and the locking between the free end 72b of the retaining arm 72 and the recess 68 is released. After that, the control device 16 drives the moving mechanism 31 to remove the wafer frame 3 from the wafer expansion device 41 and move it to the wafer frame housing section 25. Next, the control device 16 drives the clamper 33 to release the wafer frame 3, and then drives the moving mechanism 31 to retract the main body 32 and the clamper 33, thus ending the series of operations.
[0027] As described above, the component supply device 11 of this embodiment prevents warping of the outer edge of the second plate 61 near the part where the insertion portion 66 is formed by the warping prevention mechanism 71. In other words, the warping prevention mechanism 71 prevents warping of the part of the second plate 61 that is prone to warping. As a result, it becomes possible to perform expansion according to the set value on both the front and rear sides of the wafer expansion device 41, and the amount of expansion of the wafer 1 can be made uniform. Therefore, the amount by which the gap between dies 4 is widened becomes uniform, making it easier for the suction nozzle of the component mounting machine to pick up the dies 4. This makes it possible to realize reliable and efficient component supply.
[0028] Furthermore, in the wafer expansion apparatus 41 of this embodiment, the linear motion when expanding the dicing sheet 2 is converted by the motion conversion mechanism 75 into motion to bring the anti-warping member 72 into contact with the upper surface of the portion where the insertion portion 66 is formed. Therefore, the expansion operation and the pressing operation by the anti-warping member 72 can be linked without providing a separate dedicated actuator or the like for operating the anti-warping member 72. Thus, without increasing the cost or complexity of the wafer expansion apparatus 41, the occurrence of warping can be reliably prevented and the amount of expansion of the wafer 1 can be made uniform.
[0029] Furthermore, in the wafer expansion apparatus 41 of this embodiment, the anti-warping mechanism 71 has a relatively simple structure consisting of components such as a retaining arm 72, a rotating shaft 76, a support column 78, a bearing 77, and a return spring 79. Therefore, it has the advantage of being inexpensive to construct and less prone to failure.
[0030] Although the wafer expansion apparatus 41 according to Embodiment 1 has been described above, the specific embodiment is not limited to Embodiment 1. In Embodiment 1, the first plate 51 and the second plate 61 are movable in the vertical direction, and the base plate 42 and the expansion cylindrical portion 46 are fixed, but the configuration is not limited to this. For example, in other embodiments, the base plate 42 and the expansion cylindrical portion 46 may be movable in the vertical direction, and the first plate 51 and the second plate 61 may be fixed.
[0031] In the above embodiment 1, two warp prevention mechanisms 71 were provided near the portion of the outer periphery of the second plate 61 where the insertion portion 66 was formed, but the configuration is not limited to this. For example, in other embodiments, three or more warp prevention mechanisms 71 may be provided. In that case, the warp prevention mechanisms 71 may be provided not only near the portion of the outer periphery of the second plate 61 where the insertion portion 66 was formed, but also at a position far from the portion where the insertion portion 66 was formed. Alternatively, the warp prevention mechanisms 71 may be provided around the entire circumference of the outer periphery of the second plate 61.
[0032] In the above embodiment 1, a bearing 77 is provided at the tip of the support column 78 in the motion conversion mechanism 75, but the configuration is not limited to this. For example, in other embodiments, the support column 78 itself may be formed from, for example, a high-sliding material, thereby omitting the bearing 77.
[0033] In the above embodiment 1, a return spring 79 was used as a means to return the retaining arm 72 from the first position P1 to the second position P2, but the configuration is not limited to this. For example, in other embodiments, a biasing means other than the return spring 79 may be used to return the retaining arm 72 to the second position P2.
[0034] In the above embodiment 1, the retaining arm 72 in the anti-warping mechanism 71 was L-shaped, but the configuration is not limited to this. For example, in other embodiments, the retaining arm 72 may be configured with a shape other than L-shape. Also, in the above embodiment 1, the retaining arm 72 moved between the first position P1 and the second position P2 by rotational movement, but the configuration is not limited to this. For example, in other embodiments, the retaining arm 72 may move between the first position P1 and the second position P2 by movement other than rotational movement.
[0035] In the above embodiment 1, the warp prevention member 72 in the warp prevention mechanism 71 is driven without using a dedicated actuator, but the configuration is not limited to this. For example, in other embodiments, the warp prevention member 72 may be driven by a dedicated actuator. In this case, for example, the warp prevention mechanism 71 may be configured to prevent warping of the second plate 61 by using a clamping device that clamps the first plate 51 and the second plate 61 from above and below with a pair of gripping pieces. Alternatively, the warp prevention mechanism 71 may be configured to press down on the second plate 61 from above using an actuator such as a ball screw.
[0036] As described above, specific examples of the present invention have been described in detail, but these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples exemplified above. The technical elements described in this specification or the drawings exhibit technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Further, the technology exemplified in this specification or the drawings can achieve a plurality of objects simultaneously, and achieving one of those objects itself has technical utility.
Explanation of Reference Numerals
[0037] 1: Wafer 2: Dicing Sheet 3: Wafer Frame 4: Die 11: Component Supply Device 21: Wafer Storage Section 31: Moving Mechanism 41: Wafer Expansion Device 42: Base Plate 46: Expansion Cylindrical Portion 51: First Plate 61: Second Plate 66: Insertion Portion 71: Warpage Prevention Mechanism 72: Pressing Arm as Warpage Prevention Member 72a: Fixed End 72b: Free End 75: Motion Conversion Mechanism 76: Rotation Axis 77: Bearing 78: Support Column 79: Return Spring [[ID=5,1]]P1: First Position P2: Second Position S1: Gap
Claims
1. This wafer expansion device expands the dicing sheet, to which the diced wafer is attached, while the wafer frame holding the dicing sheet is fixed, thereby increasing the spacing between the dies separated from the wafer. A base plate having an expansion cylindrical portion on its upper surface for expanding the dicing sheet, The first annular plate surrounds the aforementioned expansion cylindrical portion from its outer circumference, A substantially annular second plate is positioned above the first plate and presses down on and secures the wafer frame, which is inserted into the gap between itself and the first plate, from above. An insertion portion is formed by cutting out a part of the outer edge of the second plate, and the wafer frame can be slid into the gap between the first plate and the second plate. A warp prevention mechanism is provided at least near the insertion portion formation area on the outer edge of the second plate to prevent warping of the second plate, Equipped with, The first plate and the second plate are configured to be movable relative to each other in the thickness direction of the base plate, and the dicing sheet is configured to expand by the expanding cylindrical portion when the first plate and the second plate move relative to each other in a direction approaching the base plate. The wafer expansion apparatus includes a warp prevention member that prevents warping of the second plate by pressing down on the portion of the outer edge of the second plate where the insertion portion is formed from above when the dicing sheet is expanded by the expansion cylindrical portion.
2. The anti-warping member is configured to be movable between a first position that abuts against the upper surface of the portion of the outer periphery of the second plate in which the insertion portion is formed, and a second position that is spaced apart from the upper surface of the portion of the outer periphery of the second plate in which the insertion portion is formed. The wafer expansion apparatus according to claim 1, wherein the warping prevention mechanism further comprises a motion conversion mechanism that converts the linear motion when the first plate and the second plate move relative to the base plate in a direction approaching the base plate into movement of the warping prevention member from the second position to the first position.
3. The aforementioned warping prevention member is a retaining arm having a fixed end and a free end, The retaining arm is configured such that its fixed end is pivotally supported on a pivot shaft formed on the outer edge of the first plate, and its free end presses against the second plate from above. When the retaining arm is in the first position, the free end engages with the upper surface of the second plate and presses the second plate from above. When the retaining arm reaches the second position, the free end moves away from the upper surface of the second plate and retracts below the insertion portion. The motion conversion mechanism is A support column is provided which protrudes from the upper surface of the base plate and has a bearing at its tip that slides against the outer surface of the retaining arm, and when the first plate and the second plate move relative to the base plate in the approach direction, the bearing slides against the outer surface of the retaining arm, causing the retaining arm to rotate from the second position to the first position, A return spring provides a biasing force to the retaining arm in a direction that returns the retaining arm from the first position to the second position, A wafer expansion apparatus according to claim 2, comprising:
4. A wafer housing section that houses multiple wafer frames that hold diced wafers attached to diced wafers, A wafer expansion apparatus as described in any one of claims 1 to 3, A moving mechanism for moving the wafer frame between the wafer housing section and the wafer expansion device, A parts supply device equipped with the following features.