Joining method and joining system

Abstract

This bonding method includes: a first hydrophilization treatment step for hydrophilizing a temporary bonding surface of a temporary substrate (WTD), to said temporary bonding surface a chip (CP) being to be temporarily bonded; a second hydrophilization treatment step for hydrophilizing a surface of the chip (CP), the surface being on the reverse side of a bonding surface (CPf) that is to be bonded to a substrate (W1); a first temporary bonding step for temporarily bonding the surface on the reverse side of the bonding surface (CPf) of the chip (CP) to the temporary bonding surface (WTDf) of the temporary substrate (WTD) after the first hydrophilization treatment step and the second hydrophilization treatment step; a first bonding step for bonding the chip (CP) to the substrate (W1) by bringing the temporary substrate (WTD) close to the substrate (W1) and bringing the bonding surface (CPf) of the chip (CP) into contact with the bonding surface of the substrate (W1) in a state in which the temporary bonding surface (WTDf) side of the temporary substrate (WTD) faces the substrate (W1) after the first temporary bonding step; and a first temporary substrate separation step for separating the temporary substrate (WTD) from the chip (CP) while maintaining the state in which the chip (CP) is bonded to the substrate (W1).

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