Injection molding method
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- SEKISUI CHEMICAL CO LTD
- Filing Date
- 2022-03-31
- Publication Date
- 2026-06-17
Smart Images

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Abstract
Claims
1. A process of injecting thermoplastic resin A from a first injection unit to form a skin layer, The process includes a step of filling the inside of the skin layer with thermoplastic resin B from a second injection unit to form a core layer, An injection molding method comprising the step of molding the core layer, wherein the thermoplastic resin B is filled into the interior of the skin layer while the temperature of the thermoplastic resin B is lower than the temperature of the thermoplastic resin A, The thermoplastic resin A is a polyolefin-based resin, and the thermoplastic resin B is a polyolefin-based resin having the same main component as the thermoplastic resin A. The temperature of the thermoplastic resin A when it is injected into the mold is 180°C or higher and 240°C or lower. When the thermoplastic resin B is injected into the mold, its temperature is 40°C or more and 80°C or less lower than the temperature of the thermoplastic resin A. The proportion of the core layer to the total volume of the molded product is 20% by volume or more. The sum of the thickness of the skin layer and the core layer of the molded product is 8 mm or more. The aforementioned molded product is a pipe or fitting, and the method involves injection molding.
2. The injection molding method according to claim 1, wherein the melt flow rate (MFR) of the thermoplastic resin A is 0.01 g / 10 min or more and 25 g / 10 min or less.
3. The injection molding method according to claim 1 or 2, wherein the thermoplastic resin A and the thermoplastic resin B are the same resin.