Resin encapsulation apparatus and resin encapsulation method

Abstract

To provide a resin sealing device which uses a resin sealing metal mold with a cavity recess formed in a lower mold and for which it is not necessary to invert a supply magazine, and a resin sealing method.SOLUTION: A resin sealing device 1 comprises: a resin sealing metal mold 60 with a cavity recess 63 formed in a lower mold 61; a loader hand 88; a supply magazine 20; and inversion mechanisms 87, 23, ... for inverting a vertical direction of a workpiece W. The supply magazine 20 supplies the workpiece W in such a manner that a first face A, on which an electronic component E is mounted, is turned upward. The inversion mechanisms 87, 23, ... invert the workpiece W in such a manner that the first face A of a substrate S is turned downward. The loader hand 88 supplies the workpiece W, of which the first face A is turned downward, to the lower mold 61, such that a resin material R supplied to the cavity recess 63 is opposed with the electronic component E.SELECTED DRAWING: Figure 10

Description

【Technical Field】 【0001】 The present invention relates to a resin sealing device having a cavity recess formed in a lower mold and a resin sealing method using the device. 【Background Art】 【0002】 A resin sealing device supplies a workpiece including a base material and an electronic component to a space between an upper mold and a lower mold, and resin-seals the electronic component mounted on a first surface of the base material with a resin material supplied to a cavity recess. When a cavity recess is formed in the lower mold, a workpiece with the first surface facing downward is supplied to the space between the upper mold and the lower mold (see, for example, Patent Document 1). 【Prior Art Documents】 【Patent Documents】 【0003】 【Patent Document 1】 Japanese Patent Application Laid-Open No. 2003-133352 【Summary of the Invention】 【Problems to be Solved by the Invention】 【0004】 In a pre-process of the resin sealing device, a base material and an electronic component are wired and connected to manufacture a workpiece with the first surface facing upward. The supply magazine carried in from the pre-process stores the workpiece with the first surface facing upward. When attaching the supply magazine to a resin sealing device having a cavity recess formed in the lower mold, it was necessary to reverse the vertical orientation of the supply magazine so that the first surface faces downward. 【0005】 In a post-process of the resin sealing device, the resin-sealed product with the first surface facing upward is separated into individual pieces. The storage magazine carried into the post-process from a resin sealing device having a cavity recess formed in the lower mold stores the resin-sealed product with the first surface facing downward. In the post-process, it was necessary to reverse the vertical orientation of the supply magazine so that the first surface faces upward. 【0006】 Inverting the supply magazine or storage magazine can cause impact to the workpiece or resin-encapsulated parts. In particular, workpieces stored in the supply magazine are not yet protected by resin material, so even a slight impact can easily deform the wiring. 【0007】 Furthermore, if the supply magazine or storage magazine is inverted, dust adhering to the first surface of the workpiece or resin-encapsulated product will fall and adhere to the second surface opposite to the first surface. In resin encapsulation devices where a cavity recess is formed in the lower mold, when supplying a workpiece to the resin encapsulation mold, the workpiece is either lifted by the upper mold or placed on top of the resin material supplied to the lower mold. When the workpiece is placed on the lower mold, the upper mold can be made simpler by omitting components such as chucks that hold the workpiece. However, since the cleaner provided in the upper mold cannot remove dust adhering to the second surface of the base material, it becomes important to reduce dust on the second surface. 【0008】 The present invention has been made in view of the above problems, and aims to provide a resin sealing device and resin sealing method that does not require reversing the supply magazine by using a resin sealing mold in which a cavity recess is formed in the lower mold. Furthermore, it aims to provide a resin sealing device and resin sealing method that does not require reversing the storage magazine by using a resin sealing mold in which a cavity recess is formed in the lower mold. [Means for solving the problem] 【0009】 A resin encapsulation apparatus according to one aspect of the present invention manufactures a resin-encapsulated product in which an electronic component of a workpiece, including a substrate and an electronic component, is encapsulated in resin. The resin encapsulation apparatus comprises a resin encapsulation mold including an upper mold and a lower mold having a cavity recess formed on the side facing the upper mold; a loader hand configured to enter and retract from the space between the upper and lower molds; a supply magazine for supplying workpieces; and a reversing mechanism for reversing the orientation of the workpieces. The resin encapsulation mold encapsulates the electronic component with resin material supplied to the cavity recess. The supply magazine supplies the workpiece so that the first surface on which the electronic component is mounted faces upward. The reversing mechanism reverses the workpiece so that the first surface of the substrate faces downward. The loader hand supplies the workpiece with the first surface facing downward to the lower mold, thereby bringing the resin material supplied to the cavity recess and the electronic component into contact. 【0010】 A resin encapsulation method according to one aspect of the present invention is used to resin encapsulate an electronic component of a workpiece including a substrate and an electronic component. The resin encapsulation method includes supplying a resin material to the cavity recess of a resin encapsulation mold, which includes an upper mold and a lower mold having a cavity recess formed on the side facing the upper mold; supplying a workpiece so that the first surface on which the electronic component is mounted faces upward; inverting the workpiece so that the first surface of the substrate faces downward; supplying the workpiece with the first surface facing downward to a loader hand configured to be able to enter and retract from the space between the upper mold and the lower mold; bringing the resin material supplied to the cavity recess and the electronic component to face each other by the loader hand supplying the workpiece to the lower mold; and resin encapsulating the electronic component with the resin material. 【0011】 According to these embodiments, a resin sealing device and resin sealing method can be provided that does not require reversing the supply magazine, by using a resin sealing mold in which a cavity recess is formed in the lower mold in order to invert the workpiece so that the first surface faces downward. This reduces the number of steps that may shock the workpiece and prevents deformation of wiring, etc. This reduces dust that falls from the first surface and adheres to the second surface when the supply magazine is inverted, making it particularly suitable for a configuration in which the loader hand supplies the workpiece to the lower mold rather than the upper mold, and the upper mold can be made simpler in structure by omitting chucks and the like that which hold the workpiece. 【0012】 A resin encapsulation apparatus according to one aspect of the present invention manufactures resin-encapsulated products in which electronic components of a workpiece including a substrate and electronic components are encapsulated in resin. The resin encapsulation apparatus comprises a resin encapsulation mold including an upper mold and a lower mold having a cavity recess formed on the side facing the upper mold, a loader hand configured to enter and retract from the space between the upper and lower molds, a storage magazine for storing resin-encapsulated products, and a reversing mechanism for reversing the orientation of the workpiece. The resin encapsulation mold encapsulates the electronic components with resin material supplied to the cavity recess. The loader hand supplies a workpiece with the first surface on which the electronic components are mounted facing downwards to the lower mold and retrieves resin-encapsulated products with the first surface of the substrate facing downwards from the lower mold. The reversing mechanism reverses the resin-encapsulated products so that the first surface faces upwards. The storage magazine stores resin-encapsulated products with the first surface facing upwards. 【0013】 According to this embodiment, a resin sealing device and resin sealing method can be provided that does not require reversing the storage magazine, by using a resin sealing mold in which a cavity recess is formed in the lower mold in order to invert the resin-sealed product so that the first surface faces upward. Since the loader hand supplies the workpiece to the lower mold rather than the upper mold, the chuck and the like that which grip the workpiece can be omitted, and the upper mold can be made into a simple structure. [Effects of the Invention] 【0014】 According to the present invention, a resin sealing device and resin sealing method can be provided that does not require reversing the supply magazine by using a resin sealing mold in which a cavity recess is formed in the lower mold. Furthermore, a resin sealing device and resin sealing method can be provided that does not require reversing the storage magazine by using a resin sealing mold in which a cavity recess is formed in the lower mold. [Brief explanation of the drawing] 【0015】 [Figure 1] This is a plan view showing an example of a resin encapsulation device common to each embodiment of the present invention. [Figure 2] Figure 1 is a cross-sectional view showing an example of a resin encapsulation mold. [Figure 3] This flowchart shows a step included in an example of the resin encapsulation method of the present invention. [Figure 4] This flowchart shows a step included in another example of the resin encapsulation method of the present invention. [Figure 5-22] This is a cross-sectional view showing an example of a resin sealing method using a resin sealing apparatus according to the first embodiment of the present invention. [Figure 23-27] This is a cross-sectional view showing an example of a resin sealing method using a resin sealing apparatus according to a second embodiment of the present invention. [Figure 28-32] This is a cross-sectional view showing an example of a resin sealing method using a resin sealing apparatus according to the third embodiment of the present invention. [Modes for carrying out the invention] 【0016】 Preferred embodiments of the present invention will be described with reference to the attached drawings. In each figure, components with the same reference numerals have the same or similar configuration. Hereinafter, each configuration will be described in detail with reference to Figures 1 to 32. Figure 1 is a plan view showing an example of a resin sealing device 1 common to each embodiment of the present invention. For the convenience of describing the embodiments, "front," "rear," "left," and "right" are defined as shown in Figure 1, and "up" and "down" are defined based on gravity. 【0017】 The resin encapsulation device 1 is a compression molding machine that manufactures a resin-encapsulated product M by resin-encapsulating an electronic component E (see FIG. 2) of a workpiece W with a resin material R. The resin encapsulation device 1 includes, for example, a workpiece supply device 2, a resin supply device 3, a film supply device 4, a press device 6, a resin-encapsulated product storage device 7, a transfer device 8, and the like. 【0018】 The press device 6 sandwiches and presses the workpiece W, the resin material R, the release film F, etc. between resin encapsulation dies (compression molding dies) 60 to perform resin encapsulation. The film supply device 4 supplies the release film F into the resin encapsulation die 60 and recovers the used release film F from within the resin encapsulation die 60. 【0019】 The transfer device 8 loads the workpiece W, the resin material R, etc. into the resin encapsulation die 60 and unloads the resin-encapsulated product M from within the resin encapsulation die 60. The workpiece supply device 2 supplies the workpiece W to the transfer device 8. The resin supply device 3 supplies the resin material R to the transfer device 8. The resin-encapsulated product storage device 7 stores the resin-encapsulated product M recovered from the transfer device 8. 【0020】 In the illustrated example, the resin encapsulation device 1 includes two press devices 6. The number of press devices 6 is not limited to the illustrated example and may be changed as appropriate. In the illustrated example, the workpiece supply device 2, the press device 6, and the resin-encapsulated product storage device 7 are arranged side by side in the left-right direction, and the resin supply device 3, the film supply device 4, and the functional member supply device 5 are arranged side by side in the front-rear direction. The arrangement of the resin encapsulation device 1 is not limited to the illustrated example and may be changed as appropriate. 【0021】 The resin encapsulation device 1 may include a functional member supply device 5 that supplies a functional member H to the transfer device 8. The resin-encapsulated product M may include functional members H such as a heat spreader for enhancing heat dissipation efficiency, a shield plate for shielding electromagnetic noise, and a resin material formed in a sheet shape. 【0022】 The conveying device 8 includes, for example, a first linear conveyor 81 extending in the left-right direction, a second linear conveyor 82 extending in the front-rear direction, a preheater 83 and pallet 84 movable along the first linear conveyor 81, a resin loader 85 movable along the second linear conveyor 82, and press loaders 86 positioned adjacent to each press device 6. A single press loader 86 may be configured to move between multiple press devices 6. 【0023】 The first linear conveyor 81 is laid to connect the workpiece supply device 2, the press device 6, and the resin-sealed product storage device 7. The second linear conveyor 82 intersects with the first linear conveyor 81 at a different level and is laid to connect the resin supply device 3, the film supply device 4, and the functional component supply device 5. The configuration of the conveying device 8 is not limited to the illustrated example and may be modified as appropriate. 【0024】 The press loader 86 uses a loader hand 88 that can move forward and backward into the resin encapsulation mold 60 to supply the workpiece W into the resin encapsulation mold 60 and to recover the resin-encapsulated product M from inside the resin encapsulation mold 60. In addition to the loader hand 88, the press loader 86 is further equipped with a pick-and-place device 87 (see Figure 9). 【0025】 The pick-and-place device 87 receives the workpiece W from the preheater 83 and hands it over to the loader hand 88, and receives the resin-encapsulated product M from the loader hand 88 and hands it over to the pallet 84. The pick-and-place device 87 may also have a function to reverse the orientation of the workpiece W. The case in which the pick-and-place device 87 is used as a reversal mechanism will be explained in detail in the first embodiment described later. 【0026】 The preheater 83 transports the workpiece W by reciprocating on the first linear conveyor 81 between the workpiece supply device 2 and the press loader 86. The preheater 83 may also have a function to heat the workpiece W. The pallet 84 transports the resin-encapsulated products M by reciprocating on the first linear conveyor 81 between the press loader 86 and the resin-encapsulated product storage device 7. The pallet 84 may also have a function to cool the resin-encapsulated products M. The pallet 84 may be omitted, and the preheater 83 may be configured to transport the resin-encapsulated products M by reciprocating on the first linear conveyor 81. 【0027】 The second linear conveyor 82 is equipped with an elevation mechanism that moves the resin loader 85 up and down along the hoistway and rotates the resin loader 85 horizontally around the hoistway. The resin loader 85 is equipped with a loader hand that can move in and out of the resin encapsulation mold 60, and when it rotates and moves to a position adjacent to the press device 6, it supplies the resin material R and the release film F before use to the resin encapsulation mold 60. 【0028】 The film supply device 4 transports the release film F seamlessly roll-to-roll between an unwinding roller and a take-up roller, which are positioned to sandwich the press device 6. The film supply device 4 supplies the unused release film F from the unwinding roller into the resin sealing mold 60 and collects the used release film F from the resin sealing mold 60 into the take-up roller. 【0029】 The release film F is made of a resin material such as polytetrafluoroethylene resin that is easily released from the resin encapsulation mold 60. The film supply device 4 may supply the release film F in sheet form, cut into single-use portions. In this case, the release film F may be supplied into the resin encapsulation mold 60 by a loader hand 88 that can move back and forth in the space between the upper mold 62 and the lower mold 61, and the used release film F may be recovered from inside the resin encapsulation mold 60. 【0030】 The resin supply device 3 supplies resin material R onto the resin loader 85. An example of resin material R is a thermosetting resin such as an epoxy-based thermosetting resin. The resin supply device 3 includes, for example, a hopper 30 for storing granular or powdered resin material R, and a vibration device 31 for leveling the resin material R dropped from the hopper 30 to a uniform height. The resin supply device 3 may also supply resin material R formed in sheet form. 【0031】 The workpiece supply device 2 includes, for example, a supply magazine 20 in which the workpieces W are stored, and a workpiece indexing device 21 that places the workpieces W, which are pushed out one by one from the supply magazine 20 by a pusher or the like, onto a preheater 83 and aligns them. The workpiece indexing device 21 includes a supply rail 22 (see Figure 6) that restricts the direction of movement of the workpieces W supplied from the supply magazine 20, and a supply pick-and-place device 23 (see Figure 7) that lifts the workpieces W on the supply rail 22 and places them onto the preheater 83. 【0032】 The supply pick-and-place device 23 may have a function to reverse the vertical orientation of the workpiece W. The case in which the supply pick-and-place device 23 is used as a reversal mechanism will be described in detail in the second embodiment described later. 【0033】 The resin-encapsulated product storage device 7 includes a storage magazine 70 for storing resin-encapsulated products M, a resin-encapsulated product indexing device 71 for aligning resin-encapsulated products M received from a pallet 84 and transferring them to the storage magazine 70, and the like. The resin-encapsulated product indexing device 71 includes a storage rail 72 (see Figure 21) for restricting the direction of movement of resin-encapsulated products M stored in the storage magazine 70, and a storage pick-and-place device 73 (see Figure 20) for lifting resin-encapsulated products M from the pallet 84 and placing them on the storage rail 72. 【0034】 The storage pick-and-place device 73 may have a function to reverse the orientation of the resin-sealed product M. The case in which the storage pick-and-place device 73 is used as a reversal mechanism will be described in detail in the third embodiment described later. 【0035】 Figure 2 is a cross-sectional view showing an example of the resin encapsulation mold 60 shown in Figure 1. The workpiece W supplied to the resin encapsulation mold 60 is, for example, a lead frame to which semiconductor elements are mounted, an interposer substrate to which semiconductor elements are mounted, a carrier plate with an adhesive sheet to which semiconductor elements are temporarily attached, etc., and consists of a base material S and tiny electronic components E such as semiconductor elements, MEMS chips, and electronic devices attached to the base material S. 【0036】 The workpiece W may be a workpiece W in which multiple electronic components E of the same type are attached to a base material S, or it may be a workpiece W in which different types of electronic components E are mixed and attached to a base material S. The base material S has a first surface A on which electronic components B are mounted, and a second surface B on the opposite side of the first surface A, on which electronic components E are not mounted. 【0037】 As shown in Figure 2, the resin encapsulation mold 60 consists of an upper mold 62 and a lower mold 61 facing each other. A cavity recess 63 for shaping the resin material R is formed on the upper side of the lower mold 61, which faces the upper mold 62. The lower side of the upper mold 62, which faces the lower mold 61, is formed to be substantially flat. The resin encapsulation mold 60 encapsulates the electronic component E mounted on the first surface A of the workpiece W with the resin material R supplied to the cavity recess 63 (mold molding). After molding, the shape of the cavity recess 63 is transferred to the resin material R. 【0038】 The lower die 61 consists of a lower mounting plate 610, a cavity die 611, a clamper 612, etc. The lower mounting plate 610 is formed as a substantially flat plate and is attached to the fixed or movable plate of the press device 6. The cavity die 611 is formed as a substantially flat plate and is fixed to the lower mounting plate 610. The clamper 612 is fixed to the lower mounting plate 610 via a biasing member 613 and surrounds the cavity die 611. Each of the components constituting the lower die 61, such as the lower mounting plate 610, cavity die 611, and clamper 612, has an air vent 614 for discharging air. 【0039】 The upper die 62 is composed of an upper mounting plate 620, an upper die plate 621, etc. The upper mounting plate 620 is formed as a substantially flat plate and is attached to the movable or fixed plate of the press device 6. The upper die plate 621 is formed as a substantially flat plate and is fixed to the upper mounting plate 620. In the illustrated example, the upper die 62 is formed as a simple structure that omits features such as an air vent for discharging air and a chuck for gripping the workpiece W. 【0040】 In the illustrated example, guide pins 64 and 65 for positioning the workpiece W are provided in the resin encapsulation mold 60. The multiple guide pins 64 provided in the lower mold 61 guide the workpiece W to a predetermined position when the loader hand 88 places the workpiece W on the lower mold 61. The multiple guide pins 64 are arranged to surround the workpiece W placed in the predetermined position. Each guide pin 64 is tapered and inclined so that the gap between it and the workpiece W placed in the predetermined position decreases as it extends downwards. 【0041】 Each of the multiple guide pins 65 provided on the upper mold 62 protrudes downward. When the upper mold 62 and the lower mold 61 are closed and the resin sealing mold 60 is clamped, each guide pin 65 is inserted into a guide hole formed in the base material S of the workpiece W, thereby restricting the movement of the workpiece W. 【0042】 Figure 3 is a flowchart showing the steps included in one example of the resin encapsulation method of the present invention. Figure 4 is a flowchart showing the steps included in another example of the resin encapsulation method of the present invention. The resin encapsulation steps s110, 210 shown in Figure 3 and the resin encapsulation steps s110, 310 shown in Figure 4 may be consecutive. 【0043】 In steps s100 and s200 shown in Figure 3, the resin loader 85 shown in Figure 1 transports the resin material R from the resin supply device 3 to the press device 6, and supplies the resin material R to the cavity recess 63 using a loader hand that can move in and out of the resin sealing mold 60. Steps s101 to s118 will be described in detail in the first embodiment described later. Steps s201 to s210 will be described in detail in the second embodiment described later. Steps s310 to s318 will be described in detail in the third embodiment described later. 【0044】 [First Embodiment] An example of a resin sealing method using the resin sealing apparatus 1 of the first embodiment of the present invention will be described with reference to Figures 3 to 22. In the resin sealing apparatus 1 of the first embodiment, a pick-and-place device 87, which is combined with a loader hand 88 and the like to form a press loader 86, is used as a reversal mechanism to reverse the vertical orientation of the workpiece W and the resin sealing apparatus M. 【0045】 As shown in Figure 5, the supply magazine 20, which was brought in from the previous process, contains workpieces W with their first surface A facing upwards (process s101). As shown in Figure 6, the workpieces W are supplied from the supply magazine 20 with their first surface A facing upwards and placed on the supply rail 22 of the workpiece indexing device 21 (process s102). 【0046】 As shown in Figure 7, the workpiece W with its first surface A facing upward, which is placed on the supply rail 22, is lifted by the supply pick-and-place device 23 of the workpiece indexing device 21 (step s103), and placed on the preheater 83 as shown in Figure 8 (step s104). The workpiece W with its first surface A facing upward, which is placed on the preheater 83, is heated by the heater from the flat second surface B rather than the uneven first surface A. 【0047】 As shown in Figure 9, the workpiece W is transported to the vicinity of the press loader 86 by a preheater 83 moving along the first linear conveyor 81, and the workpiece W with its first surface A facing upward is lifted using a pick-and-place device 87 attached to the press loader 86 (step s105). As shown in Figure 10, the pick-and-place device 87 reverses the orientation of the workpiece W (step s106). 【0048】 As shown in Figure 11, a workpiece W with its first surface A facing downwards is supplied to the loader hand 88, which is retracted from the space between the upper mold 62 and the lower mold 61 (step s107). As shown in Figure 12, the loader hand 88 is moved into the space between the upper mold 62 and the lower mold 61 and the workpiece W is loaded (step s108). As shown in Figure 13, the loader hand 88 places the workpiece W with its first surface A facing downwards on the lower mold 61, thereby bringing the resin material R supplied to the cavity recess 63 into contact with the electronic component E of the workpiece W (step s109). 【0049】 As shown in Figure 14, the upper mold 62 and the lower mold 61 are closed to clamp the resin sealing mold 60, and the resin material R supplied to the cavity recess 63 resin seals the electronic component E of the workpiece W (step s110). As shown in Figure 15, the upper mold 62 and the lower mold 61 are opened to open the resin sealing mold 60, and a resin-sealed product M is obtained with its first surface A facing downwards and placed on the lower mold 61 (step s111). 【0050】 As shown in Figure 16, the loader hand 88 is inserted into the space between the upper mold 62 and the lower mold 61 to unload the resin-encapsulated product M (step s112). As shown in Figure 17, the pick-and-place device 87 retrieves the resin-encapsulated product M with its first surface A facing downwards from the loader hand 88, which has been retracted from the space between the upper mold 62 and the lower mold 61 (step s113). As shown in Figure 18, the pick-and-place device 87 reverses the orientation of the resin-encapsulated product M (step s114). 【0051】 As shown in Figure 19, the resin-encapsulated product M with its first surface A facing upward is placed on the pallet 84 (step s115). As shown in Figure 20, the resin-encapsulated product M is transported to the resin-encapsulated product storage device 7 by the pallet 84 moving along the first linear conveyor 81, and the resin-encapsulated product M with its first surface A facing upward is picked up using the storage pick-and-place device 73 of the resin-encapsulated product indexing device 71 (step s116). As shown in Figure 21, the resin-encapsulated product M with its first surface A facing upward is placed on the storage rail 72 of the resin-encapsulated product indexing device 71 (step s117). As shown in Figure 22, the resin-encapsulated products M aligned on the storage rail 72 are stored in the storage magazine 70 with their first surface A facing upward (step s118). 【0052】 According to the resin sealing method s100~s110, s110~s118 using the resin sealing device 1 of the first embodiment, the workpiece W is inverted so that the first surface A faces downward, and the resin-sealed product M is inverted so that the first surface A faces upward. Therefore, even when using a resin sealing mold in which a cavity recess 63 is formed in the lower mold 61, it is not necessary to invert the supply magazine 20 or the storage magazine 70. This reduces the number of steps that may cause impact to the workpiece W or the resin-sealed product M. Since the loader hand 88 is suitable for supplying the workpiece W to the lower mold 61 rather than the upper mold 62, the chuck and the like that which grips the workpiece W can be omitted, and the upper mold 62 can be made into a simple structure. 【0053】 Since the preheater 83 heats the workpiece W from the flat second surface B rather than the uneven first surface A, the workpiece W can be supplied to the loader hand 88 with uniformly heated material. Because the pick-and-place device 87 is used to configure an inversion mechanism that reverses the orientation of the workpiece W and resin-encapsulated product M, there is no need to add a dedicated device to the resin encapsulation device 1 solely for the function of inverting the workpiece W and resin-encapsulated product M. This minimizes the increase in cost and occupied space associated with adding an inversion mechanism. 【0054】 Next, examples of resin encapsulation apparatus 1 according to the second and third embodiments of the present invention and examples of resin encapsulation methods using the apparatus will be described. In the second and third embodiments, descriptions of matters common to the first embodiment will be omitted, and only the differences will be described. 【0055】 [Second Embodiment] An example of a resin sealing method using the resin sealing apparatus 1 of the second embodiment of the present invention will be described with reference to Figures 3 and 23 to 27. The resin sealing apparatus 1 of the second embodiment differs from the first embodiment in that it uses a supply pick-and-place device 23, which is combined with a supply rail 22 and the like to form the work index device 21 shown in Figure 1, as a reversing mechanism to reverse the vertical orientation of the workpiece W, rather than a pick-and-place device 87 which is combined with a loader hand 88 and the like to form a press loader 86. 【0056】 As shown in Figure 24, in the resin sealing method using the resin sealing apparatus 1 of the second embodiment of the present invention, a workpiece W with its first surface A facing upward is stored in a supply magazine 20 that has been brought in from the previous process (step s201). As shown in Figure 25, the workpiece W is supplied from the supply magazine 20 with its first surface A facing upward and placed on the supply rail 22 of the workpiece indexing device 21 (step s202). 【0057】 As shown in Figure 26, the supply pick-and-place device 23 of the work indexing device 21 is used to lift the workpiece W with its first surface A facing upwards, which is placed on the supply rail 22 (step s203-1). As shown in Figure 27, the supply pick-and-place device 23 reverses the orientation of the workpiece W (step s203-2). As shown in Figure 28, the workpiece W with its first surface A facing downwards is placed on the preheater 83 (step s204). 【0058】 At least one of the supply rail 22 and the supply pick-and-place device 23 may function as a second preheater for heating the workpiece W. Although the preheater 83 heats the workpiece W from the uneven first surface A rather than the flat second surface B, the work index device 21, which functions as a second preheater, heats the workpiece W from the second surface B, so that uniformly heated workpieces W can be supplied to the loader hand 88. 【0059】 Subsequently, the workpiece W is resin-sealed using a resin sealing mold 60 in which a cavity recess 63 is formed in the lower mold 61, in the same manner as the resin sealing method using the resin sealing apparatus 1 of the first embodiment shown in Figures 11 to 14. 【0060】 More specifically, the pick-and-place device 87 receives the workpiece W with its first surface A facing downwards from above the preheater 83 and supplies it to the loader hand 88 (step s207). The loader hand 88 is advanced into the space between the upper mold 62 and the lower mold 61 (step s208), and the resin material R supplied to the cavity recess 63 is brought into contact with the electronic component E of the workpiece W (step s209). The electronic component E is resin-encapsulated by the resin material R (step s210). 【0061】 According to the resin sealing method s200~s210 using the resin sealing device 1 of the second embodiment, similar to the first embodiment, even when using a resin sealing mold 60 in which a cavity recess 63 is formed in the lower mold 61, it is not necessary to invert the supply magazine 20. This reduces the number of steps that may shock the workpiece W and prevents deformation of wiring, etc. 【0062】 [Third Embodiment] An example of a resin sealing method using the resin sealing apparatus 1 of the third embodiment of the present invention will be described with reference to Figures 4 and 28 to 32. The resin sealing apparatus 1 of the third embodiment differs from the first embodiment in that it uses a storage pick-and-place device 73, which is combined with a storage rail 72 and the like to form the resin-sealed product indexing device 71 shown in Figure 1, as a reversing mechanism to reverse the vertical orientation of the workpiece W, rather than a pick-and-place device 87 which is combined with a loader hand 88 and the like to form a press loader 86. 【0063】 The resin sealing method using the resin sealing apparatus 1 of the third embodiment of the present invention is carried out in the same manner as the resin sealing method using the resin sealing apparatus 1 of the first embodiment shown in Figures 14 to 17, in which a resin-sealed product M with its first surface A facing downward is discharged from a resin sealing mold 60 in which a cavity recess 63 is formed in the lower mold 61. 【0064】 More specifically, the resin material R supplied to the cavity recess 63 resin-encapsulates the electronic component E of the workpiece W (see Figure 14), obtaining a resin-encapsulated product M with its first surface A facing downwards and placed on the lower mold 61 (see Figure 15). The resin-encapsulated product M with its first surface A facing downwards is unloaded by the loader hand 88 (see Figure 16), and the resin-encapsulated product M with its first surface A facing downwards is recovered from the loader hand 88 by the pick-and-place device 87 (see Figure 17). 【0065】 Subsequently, as shown in Figure 28, the pick-and-place device 87 places the resin-encapsulated product M with its first surface A facing downwards onto the pallet 84 (step s315). As shown in Figure 29, the pallet 84 moves along the first linear conveyor 81 to the resin-encapsulated product storage device 7, where the storage pick-and-place device 73 of the resin-encapsulated product indexing device 71 is used to lift the resin-encapsulated product M with its first surface A facing downwards (step s316-1). 【0066】 As shown in Figure 30, the storage pick-and-place device 73 reverses the orientation of the resin-encapsulated product M (step s316-2), and places it on the storage rail 72 of the resin-encapsulated product indexing device 71 with its first surface A facing upwards (step s317). As shown in Figure 22, the resin-encapsulated products M aligned on the storage rail 72 are stored in the storage magazine 70 with their first surface A still facing upwards (step s318). 【0067】 According to the resin sealing method s310-s318 using the resin sealing device 1 of the third embodiment, similar to the first embodiment, even when using a resin sealing mold 60 in which a cavity recess 63 is formed in the lower mold 61, it is not necessary to invert the storage magazine 70. This reduces the number of steps that may cause impact to the resin-sealed product M. 【0068】 The embodiments described above are provided to facilitate understanding of the present invention and are not intended to limit its interpretation. The elements, arrangement, materials, conditions, shapes, and sizes of the embodiments are not limited to those exemplified and can be modified as appropriate. Furthermore, it is possible to partially substitute or combine the configurations shown in different embodiments. 【0069】 [Note 1] The resin encapsulation apparatus 1 manufactures a resin-encapsulated product M in which the electronic component E of a workpiece W, which includes a base material S and an electronic component E, is encapsulated in resin. The resin encapsulation apparatus 1 includes a resin encapsulation mold 60 including an upper mold 62 and a lower mold 61 having a cavity recess 63 formed on the side facing the upper mold 62, a loader hand 88 configured to enter and retract from the space between the upper mold 62 and the lower mold 61, a supply magazine 20 for supplying the workpiece W, and inversion mechanisms 87, 23, ... for reversing the orientation of the workpiece W. The resin encapsulation mold 60 encapsulates the electronic component E with resin material supplied to the cavity recess 63. The supply magazine 20 supplies the workpiece W so that the first surface A on which the electronic component E is mounted faces upward. The inversion mechanisms 87, 23, ... invert the workpiece W so that the first surface A faces downward. The loader hand 88 supplies a workpiece W with its first surface A facing downwards to the lower die 61, thereby bringing the resin material R supplied to the cavity recess 63 and the electronic component E facing each other. 【0070】 [Note 6] The resin encapsulation methods s100~s110, s200~210 are resin encapsulation methods for resin encapsulating an electronic component E of a workpiece W including a base material S and an electronic component E, comprising: supplying a resin material R to the cavity recess 63 of a resin encapsulation mold 60 including an upper mold 62 and a lower mold 61 having a cavity recess 63 formed on the side facing the upper mold 62 (steps s100, s200); and inverting the workpiece W, which was supplied so that the first surface A on which the electronic component E is mounted faces upward, so that the first surface A of the base material S faces downward (steps 106, s200 3-2) The process includes supplying a workpiece W with its first surface A facing downward to a loader hand 88, which is configured to enter and retract from the space between the upper mold 62 and the lower mold 61 (steps s107, s207); the loader hand 88 supplying the workpiece W to the lower mold 61 so that the resin material R supplied to the cavity recess 63 faces the electronic component E (steps s109, s209); and resin-encapsulating the electronic component E with the resin material R (steps s110, s210). 【0071】 According to the above notes 1 and 6, a resin sealing device 1 and resin sealing method s100~s110,s200~210,... can be provided that does not require reversing the supply magazine 20, by using a resin sealing mold 60 in which a cavity recess 63 is formed in the lower mold 61 in order to invert the workpiece W so that the first surface A faces downward. This reduces the number of steps that may shock the workpiece W and prevents deformation of wiring, etc. This reduces the amount of dust that falls from the first surface A and adheres to the second surface B when the supply magazine 20 is inverted, making it particularly suitable for a configuration in which the loader hand 88 supplies the workpiece W to the lower mold 61 rather than the upper mold 62, and the upper mold 62 can be made into a simpler structure by omitting chucks, etc. that hold the workpiece W. 【0072】 [Note 2] In the above appendix 1, a preheater 83 may be further provided to heat the workpiece W, with its first surface A facing upward, from the second surface B of the base material on the opposite side of the first surface A. The inversion mechanism 87 may receive the workpiece W from the preheater 83, invert the workpiece W so that its first surface A faces downward, and then supply it to the loader hand 88. That's fine. 【0073】 According to the above note 2, since the preheater 83 heats the workpiece W from the flat second surface B rather than the uneven first surface A, the workpiece W can be supplied to the loader hand 88 with uniformly heated material. The pick-and-place device 87 that lifts the workpiece W from the preheater 83 and supplies it to the loader hand 88 can be configured as a reversing mechanism 87 that reverses the orientation of the workpiece W. There is no need to add a dedicated device to the resin sealing device solely for the function of reversing the workpiece W. The increase in cost and occupied space associated with adding reversing mechanisms 87, 23, ... can be minimized. 【0074】 [Note 3] In the above appendix 2, the system may further include a storage magazine 70 for storing the resin-encapsulated product M and a pallet 84 for transporting the resin-encapsulated product M to the storage magazine 70. The loader hand 88 retrieves the resin-encapsulated product M with its first surface A facing downwards from the lower mold 61, the inversion mechanism 87 inverts the resin-encapsulated product M so that its first surface A faces upwards, and then places the resin-encapsulated product M on the pallet 84, and the storage magazine 70 may store the resin-encapsulated product M with its first surface A facing upwards. 【0075】 According to the above appendix 3, in order to invert the resin-sealed product M so that the first surface A faces upward, a resin sealing mold 60 having a cavity recess 63 formed in the lower mold 61 can be used, and a resin sealing device 1 and resin sealing method s110~118,... can be provided that do not require inverting the storage magazine 70. 【0076】 [Note 4] In the above appendix 1, a preheater 83 may be further provided for transporting the workpiece W to the loader hand 88. The reversing mechanism 23 may receive the workpiece W from the supply magazine 20, reverse the workpiece W so that the first surface A faces downward, and then place it on the preheater 83. 【0077】 According to the above note 4, the work indexing device 21, which lifts the workpiece W supplied from the supply magazine 20 and places it on the preheater 83, can be configured as a reversal mechanism 23 that reverses the vertical orientation of the workpiece W. There is no need to add a dedicated device to the resin sealing device 1 solely for the function of reversing the workpiece W. The increase in cost and occupied space associated with the addition of reversal mechanisms 87, 23, ... can be minimized. 【0078】 [Note 5] In the above appendix 4, the reversal mechanism 23 may have the function of heating the workpiece W from the second surface B of the base material S, which is on the opposite side from the first surface A. 【0079】 According to the above note 5, although the preheater 83 heats the workpiece W from the uneven first surface A rather than the flat second surface B, the workpiece indexing device 21 functions as a second preheater and heats the workpiece W from the second surface B, so that a uniformly heated workpiece W can be supplied to the loader hand 88. 【0080】 [Note 7] The resin encapsulation apparatus 1 manufactures a resin-encapsulated product M in which the electronic component E of a workpiece W, which includes a base material S and an electronic component E, is encapsulated in resin. The resin encapsulation apparatus 1 includes a resin encapsulation mold 60 which includes an upper mold 62 and a lower mold 61 having a cavity recess 63 formed on the side facing the upper mold 62, a loader hand 88 configured to enter the space between the upper mold 62 and the lower mold 61 and to be retractable from the space, a storage magazine 70 for storing the resin-encapsulated product M, and reversal mechanisms 87, 73, ... for reversing the up and down orientation of the resin-encapsulated product M. The resin encapsulation mold 60 encapsulates the electronic component E with resin material R supplied to the cavity recess 63. The loader hand 88 supplies the workpiece W with the first surface A on which the electronic component E is mounted facing downwards to the lower mold 61, and retrieves the resin-encapsulated product M with the first surface A of the base material S facing downwards from the lower mold 61. The reversing mechanisms 87, 73, ... invert the resin-sealed product M so that the first surface A faces upward. The storage magazine 70 stores the resin-sealed product M with the first surface A facing upward. 【0081】 According to the above appendix 7, in order to invert the resin-sealed product M so that the first surface A faces upward, a resin sealing mold 60 in which a cavity recess 63 is formed in the lower mold 61 can be used, and a resin sealing device 1 and resin sealing method s110~118, s310~318 can be provided without inverting the storage magazine 70. Since the loader hand 88 supplies the workpiece W to the lower mold 61 instead of the upper mold 62, the chuck and the like that which grip the workpiece W can be omitted, and the upper mold 62 can be made into a simple structure. [Explanation of symbols] 【0082】 1... Resin sealing device, 2... Workpiece supply device, 3... Resin supply device, 4... Film supply device, 5... Functional component supply device, 6... Press device, 7... Resin-sealed product storage device, 8... Conveying device, 20... Supply magazine, 21... Workpiece indexing device, 22... Supply rail, 23... Supply pick and place device (example of reversal mechanism), 30... Hopper, 31... Vibration device, 60... Resin sealing mold, 61... Lower mold, 62... Upper mold, 63... Cavity recess, 64, 65... Guide pins, 70... Storage magazine, 71... Resin-sealed product indexing device, 72... Storage rail, 73... Storage pick and place device (example of reversal mechanism), 81... First linear 82...Conveyor, 83...Second linear conveyor, 84...Preheater, 85...Pallet, 86...Resin loader, 87...Pick and place device (example of reversing mechanism), 88...Loader hand, 610...Lower mounting plate, 611...Cavity piece, 612...Clamper, 613...Biasing member, 614...Air vent, 620...Upper mounting plate, 621...Upper mold plate, E...Electronic component, F...Release film, H...Functional member, M...Resin-encapsulated product, R...Resin material, S...Substrate, A...First surface, B...Second surface, s100~s110, s110~s118, s200~s210, s310~s318...Resin encapsulation method, W...Workpiece.

Claims

[Claim 1] A resin encapsulation apparatus for manufacturing a resin-encapsulated product in which the electronic components of a workpiece including a base material and electronic components are resin-encapsulated, A resin encapsulation mold comprising an upper mold and a lower mold having a cavity recess formed on the side facing the upper mold, wherein the resin encapsulation mold encapsulates the electronic component with a resin material supplied to the cavity recess, A loader hand configured to be able to enter the space between the upper mold and the lower mold, and to be able to retract from said space, A supply magazine for supplying the aforementioned workpiece, A reversal mechanism for reversing the vertical orientation of the workpiece, The system includes a preheater that heats the workpiece, with the first surface on which the electronic components are mounted facing upward, from the second surface of the substrate opposite to the first surface, The supply magazine supplies the workpiece so that the first surface faces upward. The loader hand supplies the workpiece with the first surface facing downward to the lower mold, thereby bringing the resin material supplied to the cavity recess and the electronic component into contact. The reversing mechanism receives the workpiece from the preheater, reverses the workpiece so that the first surface faces downward, and then supplies it to the loader hand. Resin encapsulation device. [Claim 2] A storage magazine for storing the aforementioned resin-sealed product, The system further comprises a pallet for transporting the resin-sealed product to the storage magazine, The loader hand retrieves the resin-encapsulated product with the first surface facing downward from the lower mold. The inversion mechanism inverts the resin-sealed product so that the first surface faces upward, and then places the resin-sealed product on the pallet. The aforementioned storage magazine stores the resin-sealed product with the first surface facing upwards. The resin encapsulation apparatus according to claim 1. [Claim 3] Further comprising a storage magazine for storing the resin-sealed product, The loader hand retrieves the resin-encapsulated product with the first surface of the substrate facing downward from the lower mold. The inversion mechanism inverts the resin-sealed product so that the first surface faces upward. The aforementioned storage magazine stores the resin-sealed product with the first surface facing upwards. The resin encapsulation apparatus according to claim 1. [Claim 4] A resin sealing method for a workpiece including a substrate and electronic components, wherein the electronic components are sealed in resin, A resin sealing mold comprising an upper mold and a lower mold having a cavity recess formed on the side facing the upper mold, wherein resin material is supplied to the cavity recess. The workpiece, supplied so that the first surface on which the electronic components are mounted faces upward, is placed on the preheater, and the workpiece is heated from the second surface of the substrate opposite to the first surface. The loader hand, which is configured to be able to enter the space between the upper mold and the lower mold and to be able to retract from the space, is used to supply the workpiece received from the preheater after inverting it so that the first surface faces downward. The loader hand supplies the workpiece to the lower mold, thereby bringing the resin material supplied to the cavity recess and the electronic component into contact, This includes resin-encapsulating the electronic component with the aforementioned resin material. Resin encapsulation method.

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