Composite materials and methods for manufacturing composite materials
By distributing void sizes with two or more peaks and arranging inorganic particles along void boundaries, the composite material enhances thermal conductivity and flexibility, addressing the limitations of existing foamed materials.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- NITTO DENKO CORP
- Filing Date
- 2022-09-27
- Publication Date
- 2026-06-18
AI Technical Summary
Existing composite materials with multiple voids, such as foamed materials, do not effectively consider the relationship between the distribution of void sizes and thermal conductivity, limiting their thermal conductivity improvement.
A composite material is designed with a specific distribution of void sizes having two or more peaks, where inorganic particles are arranged along the boundaries between voids and a skeletal structure, enhancing thermal conductivity and flexibility.
The material achieves high thermal conductivity and flexibility by optimizing void size distribution and particle arrangement, surpassing conventional foamed materials in thermal performance.
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