Exposure apparatus, exposure method, and method for manufacturing articles

Abstract

To provide technology advantageous for preventing for a slit light to irradiate outside a shot area during scanning exposure of the shot area of a substrate.SOLUTION: An exposure apparatus that scans and exposes a shot area of a substrate while scanning the substrate with respect to the slit light includes a stage that holds and moves the substrate, a light shielding member that is inserted into and removed from an optical path of the slit light, and a control unit that controls driving of the stage according to a drive profile and controls insertion and removal of the light shielding member into the optical path of the slit light, the drive profile is configured so as to accelerate the stage at the beginning of the scanning exposure, and the controller accelerates and drives the light shielding member by following the acceleration of the stage in the drive profile so as to prevent the slit light from irradiating outside the shot area when the light shielding member is extracted from the optical path of the slit light at the beginning of the scanning exposure.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an exposure apparatus, an exposure method, and a method for manufacturing an article.

Background Art

[0002] As a lithography apparatus used in a manufacturing process of a semiconductor device or the like, an exposure apparatus that performs so-called scanning exposure for transferring a pattern of a reticle onto a substrate by scanning the substrate with respect to slit light that has passed through the reticle is known. In such an exposure apparatus, it is common to perform scanning exposure of the substrate while moving the substrate at a constant speed. However, in order to improve throughput (productivity), it is desirable to perform scanning exposure of the substrate while accelerating or decelerating the substrate. Patent Document 1 proposes a technique for exposing a substrate in a section where the speed and acceleration of the substrate change in a sine wave while driving the substrate according to a drive profile (speed profile, acceleration profile) composed of a sine wave. Such a technique is sometimes referred to as sine wave exposure.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In an exposure apparatus, it is necessary to prevent the slit light from being irradiated outside the shot area of the substrate during the scanning exposure of the shot area of the substrate. Even when performing scanning exposure on the shot area of the substrate while accelerating or decelerating the substrate, it is desirable to prevent the irradiation of the slit light outside the shot area.

[0005] Therefore, the present invention aims to provide a technique that is advantageous for preventing slit light from irradiating the area outside the shot region of a substrate during scanning exposure of the shot region. [Means for solving the problem]

[0006] To achieve the above objective, an exposure apparatus as one aspect of the present invention is an exposure apparatus that performs scanning exposure of a shot area of ​​a substrate while scanning the substrate with respect to a slit light, comprising: a stage that holds and moves the substrate; a light-shielding member that is inserted into and removed from the optical path of the slit light; and a control unit that controls the driving of the stage according to a drive profile that defines the driving of the stage, and also controls the insertion and removal of the light-shielding member from the optical path of the slit light, wherein the drive profile is configured to accelerate the stage at the start of the scanning exposure, and the control unit accelerates the light-shielding member in accordance with the acceleration of the stage in the drive profile so as to prevent the slit light from irradiating the area outside the shot area when removing the light-shielding member from the optical path of the slit light at the start of the scanning exposure.

[0007] To achieve the above objective, the exposure apparatus, as one aspect of the present invention, scans the substrate with respect to the slit light, and the substrate above of multiple Shot area to An exposure apparatus for performing scanning exposure, comprising a stage that holds and moves the substrate, and the optical path of the slit light to The light-shielding member that is inserted and removed, Drive The drive of the stage is controlled based on the dynamic profile, To the optical path of the slit light The drive profile includes a control unit that controls the insertion and removal of the light-shielding member, and the drive profile includes a profile that accelerates the stage at the start of the scanning exposure. The plurality of shot regions include a first shot region and a second shot region. When the control unit removes the light-shielding member from the optical path of the slit light at the start of the scanning exposure, it ensures that the slit light does not irradiate the area outside the shot region. In the aforementioned drive profile The light-shielding member is accelerated to follow the acceleration of the aforementioned stage. Furthermore, between the scanning exposure for the first shot area and the scanning exposure for the second shot area, the light-shielding member is accelerated at an acceleration greater than the tracking acceleration when the acceleration of the light-shielding member is made to track the acceleration of the stage. It is characterized by doing so. [Effects of the Invention]

[0008] According to the present invention, for example, it is possible to provide an advantageous technique for preventing slit light from irradiating areas outside the shot region of a substrate during scanning exposure of the shot region. [Brief explanation of the drawing]

[0009] [Figure 1] Schematic diagram showing an example of the configuration of an exposure apparatus. [Figure 2] Schematic diagram showing an example of the masking unit configuration. [Figure 3A] A schematic diagram showing the operation of the light-shielding blade in relation to the slit light, and the movement of the light-irradiated area on the shot area of ​​the substrate over time. [Figure 3B] A schematic diagram showing the operation of the light-shielding blade in relation to the slit light, and the movement of the light-irradiated area on the shot area of ​​the substrate over time. [Figure 4] This figure shows an example of drive control for the substrate stage and light-shielding blade in the first embodiment (Example 1). [Figure 5] This figure shows an example of drive control for the substrate stage and light-shielding blade in the first embodiment (Example 2). [Figure 6] This figure shows the acceleration profiles of the substrate stage and light-shielding blade in the first embodiment (Example 2). [Figure 7] Figure showing the acceleration profiles of the substrate stage and light-shielding blade in the second embodiment. [Figure 8] Flowchart illustrating the exposure operation in an exposure apparatus. [Figure 9] This figure shows an example of drive control for the substrate stage and light-shielding blade when performing constant-speed exposure. [Modes for carrying out the invention]

[0010] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiments, not all of these plurality of features are essential to the invention, and the plurality of features may be arbitrarily combined. Further, in the accompanying drawings, the same or similar configurations are given the same reference numerals, and duplicate explanations are omitted.

[0011] In this specification and the accompanying drawings, directions are indicated in an XYZ coordinate system in which the direction parallel to the surface (upper surface) of the substrate is the XY plane. The directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are the X-direction, Y-direction, and Z-direction, respectively, and the rotations around the X-axis, Y-axis, and Z-axis are θX, θY, and θZ, respectively. Control and drive (movement) regarding the X-axis, Y-axis, and Z-axis each mean control or drive (movement) regarding the direction parallel to the X-axis, the direction parallel to the Y-axis, and the direction parallel to the Z-axis. Also, control or drive regarding the θX-axis, θY-axis, and θZ-axis each mean control or drive regarding the rotation around the axis parallel to the X-axis, the rotation around the axis parallel to the Y-axis, and the rotation around the axis parallel to the Z-axis.

[0012] <First Embodiment> The first embodiment according to the present invention will be described. FIG. 1 is a schematic diagram showing a configuration example of an exposure apparatus 100 of this embodiment. The exposure apparatus 100 transfers the pattern of the mask 102 (original plate) to the substrate 104 while relatively scanning the mask 102 and the substrate 104 with respect to slit light (exposure light). The exposure apparatus 100 of this embodiment is a step-and-scan type exposure apparatus that forms a light irradiation region (exposure region) on the substrate 104 in a rectangular or arc-shaped slit shape and relatively scans the mask 102 and the substrate 104 at high speed to perform high-precision exposure over a large angle of view. Such an exposure apparatus 100 is also called a scanning exposure apparatus or a scanner.

[0013] As shown in Figure 1, the exposure apparatus 100 includes an exposure light source 113, an illumination optical system 106, a projection optical system 101, a mask stage 103, a substrate stage 105, a masking unit 112 (light-shielding section), and a control unit 111. The mask stage 103 and the substrate stage 105 can constitute a positioning device for positioning the mask 102 and the substrate 104 relative to each other. In this embodiment, the exposure light source 113 is provided as a component of the exposure apparatus 100, but it does not have to be a component of the exposure apparatus 100.

[0014] The illumination optical system 106 illuminates the mask 102 using light emitted from an exposure light source 113 that generates pulsed light, such as an excimer laser. The illumination optical system 106 includes, for example, a beam shaping optical system, an optical integrator, a collimator lens, and a mirror, and efficiently transmits or reflects pulsed light in the far ultraviolet region, emitting it as slit light (exposure light). The beam shaping optical system (generation unit) has a mechanism (e.g., a slit) that shapes the cross-sectional shape (dimensions) of the incident light into a predetermined shape (e.g., rectangular or arc-shaped), and generates slit light using light from the exposure light source 113. The slit light has a cross-sectional shape that defines the illumination area on the mask 102, that is, the light irradiation area on the substrate 104. In this embodiment, the beam shaping optical system is configured to generate slit light with a rectangular cross-sectional shape using light from the exposure light source 113. The optical integrator also makes the light distribution characteristics uniform to illuminate the mask 102 with uniform illuminance.

[0015] The slit light emitted from the illumination optical system 106 enters the masking unit 112. The masking unit 112 is a unit for defining an illumination region on the mask 102, that is, a light irradiation region on the substrate 104. In the case of the present embodiment, the masking unit 112 has at least two masking blades (light shielding members) arranged in the scanning direction with respect to the slit light. Then, under the control of the control unit 111, the masking unit 112 inserts and removes the light shielding blade into and from the optical path of the slit light so as to prevent the irradiation of the slit light outside the shot region where the scanning exposure is being performed. A specific configuration example of the masking unit 112 will be described later. Here, in the present embodiment, the masking unit 112 is arranged on the optical path between the illumination optical system 106 and the mask 102, but it may be arranged on a plane conjugate to the object plane and the image plane of the projection optical system 101. For example, the masking unit 112 may be arranged between the mask 102 and the projection optical system 101, or between the projection optical system 101 and the substrate 104. Also, the masking unit 112 may be provided inside the illumination optical system 106 as a component of the illumination optical system 106.

[0016] The projection optical system 101 projects an image of the pattern of the mask 102 illuminated by the illumination optical system 106 onto the substrate 104. In FIG. 1, the optical axis AX of the projection optical system 101 extends in the Z direction, and the image plane of the projection optical system 101 is a plane perpendicular to the Z direction (i.e., the XY plane). The slit light that has passed through the masking unit 112 irradiates the mask 102, and an image of the pattern of the mask 102 is formed on the image plane of the projection optical system 101 at the magnification of the projection optical system 101 (for example, 1 / 4, 1 / 2, 1 / 5).

[0017] The substrate 104 is, for example, a wafer on which a resist (photosensitive material) is coated. Multiple shot regions having the same pattern structure formed in the previous exposure process are arranged on the substrate 104. The substrate stage 105 is a stage that holds and moves the substrate 104 and has a chuck for holding (adsorbing, fixing) the substrate 104. The substrate stage 105 may also include an XY stage that can move horizontally in the X and Y directions, respectively, and a Z stage that can move in the Z direction (height direction of the substrate 104) parallel to the optical axis AX of the projection optical system 101. Furthermore, the substrate stage 105 may also include a leveling stage that can rotate (tilt) in the θX direction around the X axis and the θY direction around the Y axis, and a rotating stage that can rotate in the θZ direction around the Z axis. In this way, the substrate stage 105 can constitute a 6-axis drive system for matching the image of the pattern of the mask 102 with the shot regions of the substrate 104. The positions of the substrate stage 105 in the X, Y, and Z directions can be constantly measured by a bar mirror 108 and an interferometer 110 positioned on the substrate stage 105.

[0018] The mask 102 is held by the mask stage 103. The mask stage 103 is scanned in the Y direction (direction of arrow 103a) in a plane perpendicular to the optical axis AX of the projection optical system 101. During this scanning, the mask stage 103 is scanned (corrected drive) so that its position in the Y direction always maintains the target position. The positions of the mask stage 103 in the X and Y directions are constantly measured by a bar mirror 107 and an interferometer 109 positioned on the mask stage 103.

[0019] The control unit 111 is composed of a computer including, for example, a processor such as a CPU (Central Processing Unit) and a storage unit such as memory, and comprehensively controls each part of the exposure apparatus 100. The control unit 111 controls the mask stage 103 that holds the mask 102 and the substrate stage 105 that holds the substrate 104 in order to image the light from the pattern of the mask 102 onto a predetermined area (shot area) of the substrate 104. For example, the control unit 111 adjusts the position of the mask 102 and the substrate 104 in the XY plane (position in the XY direction and rotation in the θZ direction) and the position in the Z direction (rotation in the θX direction and θY direction, respectively) via the mask stage 103 and the substrate stage 105. The control unit 111 also scans the mask stage 103 and the substrate stage 105 in synchronization with the projection optical system 101. In this way, the control unit 111 controls the exposure process (scanning exposure) in which the substrate 104 is scanned with respect to the light irradiation area by the substrate stage 105, and each shot area of ​​the substrate 104 is exposed. For example, when scanning the mask stage 103 in the direction of arrow 103a, the substrate stage 105 scans in the direction of arrow 105a at a speed corrected by the magnification (reduction magnification) of the projection optical system 101.

[0020] The alignment of the pattern of the mask 102 in the XY plane can be performed based on the position of the mask stage 103, the position of the substrate stage 105, and the position of each shot area on the substrate 104 relative to the substrate stage 105. The positions of the mask stage 103 and the substrate stage 105 are measured by interferometers 109 and 110, respectively, as described above. The position of each shot area on the substrate 104 relative to the substrate stage 105 is obtained by detecting the position of marks provided on the substrate stage 105 and the position of alignment marks formed on the substrate 104 using an alignment scope (not shown).

[0021] [Masking unit configuration and control] In an exposure apparatus, it is necessary to prevent slit light from irradiating areas outside the shot region of the substrate 104 during scanning exposure of the shot region. For this reason, the exposure apparatus 100 of this embodiment is provided with a masking unit 112 having a light-shielding blade (light-shielding member). In the masking unit 112, under the control of the control unit 111, the light-shielding blade is scanned (driven) in synchronization with the mask stage 103 and the substrate stage 105 so as to prevent slit light from irradiating areas outside the shot region.

[0022] Here, scanning exposure can be defined as a state in which at least a portion of the slit light is irradiated onto the substrate 104 (shot area) and the substrate 104 is exposed. Also, the scanning direction (driving direction during scanning exposure) of the mask 102, the substrate 104, and the light-shielding blade of the masking unit 112 is the same. However, in the example in Figure 1, since the optical path is bent by the mirror MR between the masking unit 112 and the mask 102, the scanning direction of the mask 102 and the substrate 104 is the Y direction, and the scanning direction of the light-shielding blade of the masking unit 112 is the Z direction.

[0023] Figure 2 is a schematic diagram showing an example configuration of the masking unit 112. The masking unit 112 includes two light-shielding blades 205 and 206 for shielding the slit light 204 in the scanning direction (Z direction), and a drive mechanism 200 for driving the two light-shielding blades 205 and 206 in the scanning direction (Z direction). The drive mechanism 200 may be composed of, for example, a linear motor having a stator 201 extending in the scanning direction and movable elements 202 and 203 that can move along the stator 201 in the scanning direction. The masking unit 112 may further include two light-shielding blades for shielding the slit light 204 in a direction perpendicular to the scanning direction (X direction).

[0024] The light-shielding blade 205 (second light-shielding member) is mechanically held by the movable element 202, and the light-shielding blade 206 (first light-shielding member) is mechanically held by the movable element 203. The drive mechanism 200 can drive the light-shielding blade 205 in the scanning direction by moving the movable element 202 along the stator 201 in the scanning direction, and can drive the light-shielding blade 206 in the scanning direction by moving the movable element 203 along the stator 201 in the scanning direction. The drive mechanism 200 may be configured to drive the light-shielding blade 205 (movable element 202) and the light-shielding blade 206 (movable element 203) independently. The drive mechanism 200 is also controlled by the control unit 111 to insert and remove the light-shielding blades 205 and 206 into and out of the optical path of the slit light in synchronization with the mask stage 103 and the substrate stage 105.

[0025] Next, an example of controlling the masking unit 112 (driving the light-shielding blades 205 and 206) in scanning exposure will be explained with reference to Figures 3A and 3B. Figures 3A and 3B are schematic diagrams showing the operation of the light-shielding blades 205 and 206 with respect to the slit light 204 (illumination area on the mask 102), and the movement of the light-irradiated area 302 on the shot area 301 of the substrate 104 over time. In Figures 3A and 3B, the left figure shows the operation of the light-shielding blades 205 and 206 in scanning exposure, and the right figure shows the movement of the light-irradiated area 302 on the shot area 301. Also, in Figures 3A and 3B, the scanning direction of the light-shielding blades 205 and 206 and the shot area 301 is indicated by arrows. As described above, the light-shielding blades 205 and 206 are driven in synchronization with the mask stage 103 and the substrate stage 105 so as to prevent slit light from irradiating the area outside the shot region of the substrate 104 during scanning exposure of the shot region. In this embodiment, acceleration may be defined as increasing the absolute value of the velocity, and deceleration may be defined as decreasing the absolute value of the velocity.

[0026] Before the start of scanning exposure (exposure operation), as shown in (Phase 1) of Figure 3A, the light-shielding blade 205 completely blocks the slit light 204, so the slit light (exposure light) does not irradiate the shot area 301 on the substrate. When scanning exposure starts, as shown in (Phase 2) of Figure 3A, the light-shielding blade 205 and the substrate stage 105 are driven in synchronization with the scanning direction, and the light-shielding blade 205 is gradually withdrawn from the optical path of the slit light 204. Then, a portion of the slit light 204 gradually begins to pass through the masking unit 112. That is, irradiation of the shot area 301 with slit light begins, and the light-irradiated area 302 on the shot area 301 gradually expands. At this time, the drive of the light-shielding blade 205 is controlled to follow the movement of the scanning-direction side edge (front end) of the shot area 301 so that the slit light does not irradiate the outside of the shot area 301 in the scanning direction.

[0027] When the light-shielding blade 205 is completely withdrawn from the slit light 204, the entire slit light illuminates the shot area 301, as shown in (Phase 3) of Figure 3A, and the light-illuminated area 302 becomes maximum. At this time, the light-shielding blade 205 begins to decelerate and stop, and then the light-shielding blade 206 begins to accelerate. Then, as it approaches the end (rear end) of the shot area 301 in the opposite direction of scanning, the light-shielding blade 206 begins to shield the slit light 204, as shown in (Phase 4) of Figure 3B.

[0028] When the shielding of the slit light 204 by the light-shielding blade 206 begins, as shown in (Phase 5) of Figure 3B, the light-shielding blade 206 is gradually inserted into the optical path of the slit light 204, and the slit light 204 is gradually shielded. That is, the light-irradiated area 302 on the shot area 301 gradually narrows. At this time, the drive of the light-shielding blade 206 is controlled to follow the movement of the opposite end (rear end) of the shot area 301 so that the slit light is not irradiated outside the shot area 301 in the opposite direction. When the slit light 204 is completely shielded by the light-shielding blade 206, as shown in (Phase 6) of Figure 3B, the light-shielding blade 206 begins to decelerate and stops. Here, in the scanning exposure for the next shot area, the scanning direction is reversed, so it is performed in the order of (Phase 6) to (Phase 1). Such scanning exposure can be performed for each of the multiple shot areas on the substrate 104.

[0029] Next, an example of drive control for the light-shielding blades 205 and 206 when scanning exposure is performed on the substrate 104 while moving the substrate 104 at a constant speed (hereinafter sometimes referred to as constant-speed exposure) will be explained with reference to Figure 9. Figure 9 is a diagram showing an example of drive control for the substrate stage 105 and the light-shielding blades 205 and 206 when constant-speed exposure is performed on the Nth shot region and the (N+1)th shot region. The Nth shot region is one of the multiple shot regions on the substrate 104 (the first shot region), and is sometimes referred to as "Nshot" below. The (N+1)th shot region is the shot region on the substrate 104 where scanning exposure is performed after Nshot (the second shot region), and is sometimes referred to as "(N+1)shot" below.

[0030] Here, the drive of the substrate stage 105 and the light-shielding blades 205 and 206 is controlled by the control unit 111. The control unit 111 controls the drive of the substrate stage 105 according to a drive profile that defines the drive of the substrate stage 105, and in parallel controls the insertion and removal of the light-shielding blades 205 and 206 into the optical path of the slit light by the drive mechanism 200. The drive profile of the substrate stage 105 includes at least one of a position profile, a velocity profile, and an acceleration profile, but below we will describe an example in which a velocity profile is used as the drive profile.

[0031] The control unit 111 accelerates the substrate stage 105 to its maximum speed Vws before the N-shot scanning exposure begins, and once it reaches the maximum speed Vws, it drives the substrate stage 105 at a constant speed to maintain a constant speed. The exposure section 901 is the section in which slit light is irradiated onto the shot area and scanning exposure of that shot area is performed. In the exposure section 901 in the example in Figure 9, the substrate stage 105 is driven at a constant speed.

[0032] Meanwhile, the control unit 111 accelerates the light-shielding blade 205 so that it reaches its maximum speed Va by the start of the N-shot scanning exposure, that is, by the start of the exposure section 901. The maximum speed Va of the light-shielding blade 205 is the value obtained by multiplying the speed Vws of the substrate stage 105 by a constant optical magnification (for example, the magnification of the projection optical system 101).

[0033] As described above in Figures 3A to 3B, in scanning exposure of a shot region, it is necessary to prevent the slit light from irradiating areas outside the shot region (for example, adjacent shot regions). Therefore, in the expansion section 902, which is the start of scanning exposure of a shot region (exposure section 901), the control unit 111 drives the light-shielding blade 205 at a constant speed so as to follow (synchronize) with the constant speed drive of the substrate stage 105, that is, so as to follow the movement of the leading edge of the N shot. The expansion section 902 is a section in which the light-shielding blade (205 or 206) is gradually withdrawn from the optical path of the slit light to widen (expand) the light-irradiated area on the shot region. When the light-shielding blade 205 has withdrawn from the slit light and the expansion section 902 has ended, the control unit 111 drives the light-shielding blade 205 at a reduced speed to stop it.

[0034] Next, the control unit 111 accelerates the light-shielding blade 206 so that it reaches its maximum speed Vb by the time the slit light (light-irradiated area) reaches the trailing end of the Nshot. Then, in the reduction section 903, which is the end of the scanning exposure (exposure section 901) of the shot area, the control unit 111 drives the light-shielding blade 206 at a constant speed so as to follow (synchronize) with the constant speed drive of the substrate stage 105, that is, so as to follow the movement of the trailing end of the Nshot. The reduction section 903 is a section in which the light-shielding blade (205 or 206) is gradually inserted into the optical path of the slit light to narrow (reduce) the light-irradiated area on the shot area. When the light-shielding blade 206 completely blocks the slit light and the reduction section 903 ends, the control unit 111 decelerates the light-shielding blade 206 to stop it. In this way, scanning exposure of the Nshot is performed.

[0035] After the N-shot scanning exposure is completed, the (N+1)-shot scanning exposure is started. After the N-shot scanning exposure (exposure section 901) is completed, the control unit 111 decelerates the substrate stage 105 and starts accelerating it in the reverse direction. The control unit 111 then accelerates the substrate stage 105 to the maximum speed -Vws before the (N+1)-shot scanning exposure is started, and once it reaches the maximum speed -Vws, it drives the substrate stage 105 at a constant speed to maintain a constant speed.

[0036] Meanwhile, the control unit 111 accelerates the light-shielding blade 206 to reach its maximum speed -Va by the start of scanning exposure for (N+1) shots, that is, by the start of exposure section 901. Then, in the expansion section 902, the light-shielding blade 206 is driven at a constant speed to follow (synchronize) with the constant speed drive of the substrate stage 105, that is, to follow the movement of the leading edge of (N+1) shots. When the expansion section 902 ends, the light-shielding blade 206 is decelerated and stopped. Subsequently, the control unit 111 accelerates the light-shielding blade 205 to reach its maximum speed -Vb by the time the slit light (light-irradiated area) reaches the trailing edge of (N+1) shots. Then, in the reduction section 903, the light-shielding blade 205 is driven at a constant speed to follow (synchronize) with the constant speed drive of the substrate stage 105, that is, to follow the movement of the trailing edge of (N+1) shots. When the reduction section 903 ends, the light-shielding blade 205 is decelerated and stopped. In this way, (N+1) shot scanning exposure is performed. By repeatedly driving the substrate stage 105 and light-shielding blades 205 and 206 as described above, scanning exposure is performed on multiple shot regions of the substrate 104.

[0037] Incidentally, in the exposure apparatus 100, a method has been proposed in which scanning exposure of the substrate 104 is performed while accelerating or decelerating the substrate 104 in order to improve throughput (productivity). For example, a scanning exposure method called sinusoidal exposure is known. In sinusoidal exposure, while the substrate stage 105 is driven according to a sinusoidal drive profile (e.g., a speed profile), scanning exposure of each shot area is performed in a portion of the drive profile that includes acceleration and deceleration of the substrate stage 105. In other words, in sinusoidal exposure, in the exposure section in which scanning exposure of each shot area is performed, the substrate stage 105 is accelerated in the expansion section and decelerated in the reduction section. Furthermore, even when applying sinusoidal exposure to perform scanning exposure of a shot area, it is necessary to prevent the slit light from irradiating the area outside the shot area.

[0038] Therefore, in the exposure apparatus 100 of this embodiment, when withdrawing the light-shielding blade from the optical path of the slit light at the start of scanning exposure of the shot area (expansion section), the light-shielding blade is accelerated to follow the acceleration of the substrate stage 105. Also, when inserting the light-shielding blade into the optical path of the slit light at the end of scanning exposure of the shot area (decrease section), the light-shielding blade is decelerated to follow the deceleration of the substrate stage 105. The following describes an example of drive control of the substrate stage 105 and light-shielding blades 205 and 206 in sinusoidal exposure.

[0039] [Example 1] Figure 4 shows an example of drive control for the substrate stage 105 and the light-shielding blades 205 and 206 when performing N-shot and (N+1)-shot scanning exposure in sinusoidal exposure. The exposure section 401, expansion section 402, and reduction section 403 in Figure 4 correspond to the exposure section 901, expansion section 902, and reduction section 903 described above using Figure 9, respectively. Here, the control unit 111 pre-generates a drive profile (e.g., a speed profile) for driving the light-shielding blades 205 and 206 in accordance with (synchronized with) the drive of the substrate stage 105, based on the sinusoidal drive profile of the substrate stage 105. This drive profile is shown as a dashed line in Figure 4 and may be referred to as the blade drive profile below.

[0040] The control unit 111 drives the substrate stage 105 according to a sinusoidal drive profile (speed profile). This reduces the time required for scanning exposure of each shot area (exposure time) and improves throughput. The exposure section 401 is the section in which scanning exposure of the shot area is performed.

[0041] Meanwhile, the control unit 111 accelerates the light-shielding blade 205 so that it reaches the speed of the blade drive profile by the start of the Nshot scanning exposure, that is, by the start of the exposure section 401. At this time, using a drive profile calculated with a different formula than the blade drive profile, the light-shielding blade 205 is accelerated at an acceleration greater than the tracking acceleration (dashed line) when it is made to follow the acceleration of the substrate stage 105. Then, in the expanded section 402, the control unit switches to the blade drive profile and accelerates the light-shielding blade 205 according to the blade drive profile so as to follow (synchronize) with the acceleration of the substrate stage 105, that is, so as to follow the movement of the front end of the Nshot. When the expanded section 402 ends, the control unit switches to a drive profile calculated with a different formula than the blade drive profile and decelerates the light-shielding blade 205 to a stop at a deceleration greater than the tracking deceleration (dashed line) when it is made to follow the deceleration of the substrate stage 105. At this time, it is preferable to stop the light-shielding blade 205 before the Nshot scanning exposure (exposure section 401) is completed.

[0042] Next, the control unit 111 accelerates the light-shielding blade 206 so that it reaches the speed of the blade drive profile before the slit light hits the trailing edge of N shot. At this time, using a drive profile calculated with a different formula than the blade drive profile, the light-shielding blade 206 is accelerated at an acceleration greater than the tracking acceleration (dashed line) when it is made to follow the acceleration of the substrate stage 105. Then, in the reduction section 403, the control unit switches to the blade drive profile and decelerates the light-shielding blade 206 according to the blade drive profile so as to follow (synchronize) with the deceleration of the substrate stage 105, that is, to follow the movement of the trailing edge of N shot. When the reduction section 403 ends, the control unit switches to a drive profile calculated with a different formula than the blade drive profile and decelerates the light-shielding blade 206 at a deceleration greater than the tracking deceleration (dashed line) when it is made to follow the deceleration of the substrate stage 105 to stop it. At this time, it is preferable to stop the light-shielding blade 206 before the scanning exposure of (N+1) shots (exposure section 401) begins. In this way, N-shot scanning exposure is performed.

[0043] After the scanning exposure of N shots is completed, the scanning exposure of (N+1) shots is started. The control unit 111 accelerates the light-shielding blade 206 so that it reaches the speed of the blade drive profile by the start of the scanning exposure of (N+1) shots, that is, by the start of exposure section 401. At this time, using a drive profile calculated with a different formula than the blade drive profile, the light-shielding blade 206 is accelerated at an acceleration greater than the tracking acceleration (dashed line) when it is made to follow the acceleration of the substrate stage 105. Then, in the expanded section 402, the control unit switches to the blade drive profile and accelerates the light-shielding blade 206 according to the blade drive profile so as to follow (synchronize) with the acceleration of the substrate stage 105, that is, so as to follow the movement of the leading edge of the (N+1) shots. When the expanded section 402 ends, the control unit switches to a drive profile calculated with a different formula than the blade drive profile and decelerates the light-shielding blade 206 to a stop at a deceleration greater than the tracking deceleration (dashed line) when it is made to follow the deceleration of the substrate stage 105. At this time, it is advisable to stop the light-shielding blade 206 before the (N+1)-shot scanning exposure (exposure section 401) is completed.

[0044] Next, the control unit 111 accelerates the light-shielding blade 205 so that it reaches the speed of the blade drive profile by the time the slit light hits the trailing end of the (N+1) shot. At this time, using a drive profile calculated with a different formula than the blade drive profile, the light-shielding blade 205 is accelerated at an acceleration greater than the tracking acceleration (dashed line) when it is made to follow the acceleration of the substrate stage 105. Then, in the reduction section 403, the control unit switches to the blade drive profile and decelerates the light-shielding blade 205 according to the blade drive profile so as to follow (synchronize) with the deceleration drive of the substrate stage 105, that is, to follow the movement of the trailing end of the (N+1) shot. When the reduction section 403 ends, the control unit switches to a drive profile calculated with a different formula than the blade drive profile and decelerates the light-shielding blade 205 at a deceleration greater than the tracking deceleration (dashed line) when it is made to follow the deceleration of the substrate stage 105 to stop it. At this time, it is preferable to stop the light-shielding blade 205 before the next scanning exposure starts. In this way, (N+1) shots of scanning exposure are performed.

[0045] In the example shown in Figure 4, focusing on the light-shielding blade 206, for example, the light-shielding blade 206 is controlled to have a stop period ts between N-shot scanning exposures and (N+1)-shot scanning exposures. The drive of the light-shielding blade 206 is controlled so that this stop period ts is longer than the stop period of the substrate stage 105. Furthermore, between N-shot scanning exposures and (N+1)-shot scanning exposures, the light-shielding blade 206 is decelerated and stopped at a deceleration greater than the tracking deceleration (dashed line) when it is made to follow the deceleration of the substrate stage 105. Subsequently, the light-shielding blade 206 is accelerated at an acceleration greater than the tracking acceleration (dashed line) when it is made to follow the acceleration of the substrate stage 105. By controlling the drive of the light-shielding blade 206 in this way, the drive stroke of the light-shielding blade 206 can be shortened, which can be advantageous in terms of reducing the equipment cost and avoiding an increase in size of the exposure apparatus 100. Furthermore, the same drive control as the light-shielding blade 206 can be applied to the light-shielding blade 205.

[0046] [Example 2] In the above Example 1, an example was described in which the light-shielding blades 205 and 206 are stopped between scanning exposures of shot regions (i.e., between N-shot scanning exposures and (N+1)-shot scanning exposures). In this Example 2, an example is described, with reference to Figure 5, in which one of the light-shielding blades 205 and 206 is driven in accordance with (synchronized with) the drive of the substrate stage 105 between scanning exposures of shot regions. Figure 5 is a diagram showing an example of drive control of the substrate stage 105 and the light-shielding blades 205 and 206 when performing N-shot and (N+1)-shot scanning exposures in sinusoidal exposure. Note that this Example 2 basically follows the above Example 1, and except for the matters mentioned below, it can follow Example 1.

[0047] In this embodiment 2, from the end of the N-shot scanning exposure until the start of the (N+1)-shot scanning exposure, the light-shielding blade 206 is driven in accordance with the blade drive profile, following (synchronizing) with the drive of the substrate stage 105. That is, from the start of the N-shot reduction section 403 to the end of the (N+1)-shot expansion section 402 (section 502), the control unit 111 drives the light-shielding blade 206 in accordance with the blade drive profile, following (synchronizing) with the drive of the substrate stage 105. Then, when the (N+1)-shot expansion section 402 ends, it switches to a drive profile calculated using a different formula than the blade drive profile. Then, the light-shielding blade 206 is decelerated and stopped at a deceleration greater than the tracking deceleration (dashed line) when tracking the deceleration of the substrate stage 105.

[0048] Similarly, with respect to the light-shielding blade 205, from the end of the (N+1) shot scanning exposure until the start of the (N+2) shot scanning exposure, the control unit 111 drives the light-shielding blade 205 in accordance with the blade drive profile, following the drive of the substrate stage 105. That is, from the start of the reduction section 403 in the (N+1) shot until the end of the expansion section 402 in the (N+2) shot, the control unit 111 drives the light-shielding blade 205 in accordance with the blade drive profile, following (synchronizing) with the drive of the substrate stage 105. Then, when the expansion section 402 of the (N+2) shot ends, it switches to a drive profile calculated using a different formula than the blade drive profile. Then, it decelerates and drives the light-shielding blade 205 at a deceleration greater than the tracking deceleration (dashed line) when it is made to follow the deceleration of the substrate stage 105, and stops it.

[0049] Note that (N+2) shot is the shot region where scanning exposure is performed after (N+1) shot. In Figure 5, the drive control for scanning exposure (exposure section 401) for (N+2) shot is not shown, but it should be understood as having the same drive control as scanning exposure (exposure section 401) for N shot. In this case, the section from the start of the reduction section 403 in (N+1) shot to the end of the expansion section 402 in (N+2) shot should be understood as the combined section of section 503 and section 501 in Figure 5.

[0050] When switching the drive profiles of the light-shielding blades 205 and 206, the speed and acceleration / deceleration of the light-shielding blades 205 and 206 change abruptly, making them prone to vibration. According to this embodiment 2, for example, focusing on the light-shielding blade 206, between N-shot scanning exposure and (N+1)-shot scanning exposure, the drive of the light-shielding blade 206 is controlled to follow the drive of the substrate stage 105, which follows a sinusoidal drive profile. This makes it possible to reduce vibrations that occur when switching drive profiles.

[0051] Figure 6 shows the acceleration profiles of the substrate stage 105 and the light-shielding blades 205 and 206. In the expansion section 402, the light-shielding blade 205 can be driven with an acceleration Aa which is the speed of the substrate stage multiplied by the optical magnification (e.g., the magnification of the projection optical system 101) multiplied by the acceleration Aws of the substrate stage, so as to follow (synchronize) with the drive of the substrate stage 105. Then, in order to minimize the drive stroke and drive time, after the end of the expansion section 402, it is preferable to decelerate and drive with the maximum acceleration Aa_max that the drive mechanism 200 can output in hardware. On the other hand, in order to follow (synchronize) with the substrate stage 105 in the contraction section 403, the light-shielding blade 206 starts driving after a certain amount of time has elapsed since the light-shielding blade 205 started driving. Because it starts driving after a certain amount of time has elapsed, the light-shielding blade 206 needs to reach a speed which is the speed of the substrate stage 105 multiplied by the optical magnification in order to follow (synchronize) with the drive of the substrate stage 105 before the slit light reaches the trailing edge of the shot area. Therefore, the light-shielding blade 206 is accelerated to reach the speed of the substrate stage 105 using the maximum hardware-outputtable acceleration Ab_max of the drive mechanism 200. After the light-shielding blade 206 reaches the speed of the substrate stage 105, it is driven with an acceleration Ab which is the acceleration Aws of the substrate stage 105 multiplied by the optical magnification. After the end of the reduction section 403, it continues to follow (synchronize) with the substrate stage 105 and is driven in sync with the substrate stage 105 until the end of the (N+1) Shot expansion section 402.

[0052] As described above, in this embodiment, when the light-shielding blade is withdrawn from the optical path of the slit light at the start of scanning exposure of the shot area (expansion section), the light-shielding blade is accelerated to follow the acceleration of the substrate stage 105. Furthermore, when the light-shielding blade is inserted into the optical path of the slit light at the end of scanning exposure of the shot area (decrease section), the light-shielding blade is decelerated to follow the deceleration of the substrate stage. This allows the light-shielding blades 205 and 206 to be appropriately driven when scanning exposure of the shot area of ​​the substrate 104 while accelerating or decelerating the substrate 104 (for example, sinusoidal exposure), thereby preventing the slit light from irradiating the area outside the shot area.

[0053] <Second Embodiment> A second embodiment of the present invention will now be described. In the first embodiment, an example was described in which the switching of the drive profiles of the light-shielding blades 205 and 206 is performed (determined) according to the start and / or end of the expansion section 402 and the contraction section 403. In the second embodiment, an example will be described in which the switching of the drive profiles of the light-shielding blades 205 and 206 is performed (determined) according to the position, speed, or acceleration of the light-shielding blades 205 and 206. This embodiment basically follows the first embodiment, and can be followed except for matters mentioned below.

[0054] Figure 7 shows the acceleration profiles of the substrate stage 105 and the light-shielding blades 205 and 206. In the first embodiment described above, the drive profile switching of the light-shielding blades 205 and 206 was performed at the start and / or end of the expansion section 402 and the contraction section 403. On the other hand, in this embodiment, as shown in Figure 7, the drive profile switching of the light-shielding blades 205 and 206 is performed at the timing when the acceleration of the light-shielding blades 205 and 206 becomes zero.

[0055] As mentioned above, when switching the drive profile of the light-shielding blades 205 and 206, the speed and acceleration of the light-shielding blades 205 and 206 change abruptly, making them prone to vibration. In particular, if the drive profile is changed while a constant acceleration is applied, the change in force on the light-shielding blades 205 and 206 becomes larger. Therefore, if the drive profile is switched at a time when the acceleration is large, there is a possibility that the light-shielding blades 205 and 206 will vibrate significantly. Furthermore, if the light-shielding blades 205 and 206 vibrate significantly in the enlarged section 402 or the reduced section 403, accurate light shielding at the edge of the shot area becomes difficult, raising concerns that the area outside the shot area (for example, an adjacent shot area) may be exposed, resulting in defects.

[0056] As in this embodiment, by switching the drive profile at the timing when the acceleration of the light-shielding blades 205 and 206 becomes zero, the change in force applied to the light-shielding blades 205 and 206 during the drive profile switching can be minimized. In other words, vibration of the light-shielding blades 205 and 206 can be reduced. However, since the drive of the light-shielding blades 205 and 206 (sine wave drive) continues to follow (synchronize) with the substrate stage 105 even after the end of the exposure section 401 (reduction section 403), the drive stroke of the light-shielding blades 205 and 206 becomes larger compared to the first embodiment. Therefore, even if the acceleration of the light-shielding blades 205 and 206 is not necessarily zero, the value of the acceleration at which the drive profile is switched can be arbitrarily determined so as to minimize vibration within the desired drive stroke range. Similarly, the timing for switching the drive profile can be indicated by any position or velocity.

[0057] <Third Embodiment> A third embodiment of the present invention will now be described. In this embodiment, the exposure operation in the exposure apparatus 100 described in the first embodiment will be described. This embodiment basically follows the first embodiment, and except for the matters mentioned below, it can follow the first embodiment. Furthermore, this embodiment may also follow the second embodiment.

[0058] Figure 8 is a flowchart showing the exposure operation in the exposure apparatus 100. Each step in the flowchart in Figure 8 can be performed by the control unit 111.

[0059] In step S801, the control unit 111 transports the substrate 104 onto the substrate stage 105 using a substrate transport mechanism (not shown). Next, in step S802, the control unit 111 performs alignment of the substrate 104 by detecting the positions of marks on the substrate 104 using an alignment scope (detection unit) (not shown). In step S802, global alignment may be performed to obtain arrangement information of multiple shot regions by detecting the positions of marks in several sample shot regions among multiple shot regions on the substrate 104 and statistically processing the detection results.

[0060] In step S803, the control unit 111 generates (determines, calculates) the drive profile for the substrate stage 105 and the blade drive profiles for the light-shielding blades 205 and 206. The generation of each drive profile may be based on the alignment result (e.g., arrangement information) of the substrate 104 in step S802. Next, in step 804, the control unit 111 determines the switching timing of the drive profiles for the light-shielding blades 205 and 206. The determination of this switching timing may be carried out as described in the first and second embodiments.

[0061] In step S805, the control unit 111 performs scanning exposure of the substrate 104. Based on the drive profile determined in step S803 and the switching timing determined in step S804, the control unit 111 drives the substrate stage 105 and the light-shielding blades 205 and 206. This allows scanning exposure to be performed on each of the multiple shot areas on the substrate 104. Next, in step S806, the control unit 111 retrieves (removes) the substrate 104 from the substrate stage 105 using a substrate transport mechanism (not shown).

[0062] <Embodiment for manufacturing an article> The method for manufacturing articles according to the embodiment of the present invention is suitable for manufacturing articles such as microdevices such as semiconductor devices and elements having a microstructure. The method for manufacturing articles according to this embodiment includes the steps of forming a latent image pattern on a photosensitive agent coated on a substrate using the above-mentioned exposure apparatus (a step of exposing the substrate), processing (developing) the substrate on which the latent image pattern has been formed, and manufacturing an article from the processed substrate. Furthermore, such a manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The method for manufacturing articles according to this embodiment is advantageous over conventional methods in at least one of the performance, quality, productivity, and production cost of the article.

[0063] <Other examples> The present invention can also be realized by supplying a program that implements one or more of the functions of the above-described embodiments to a system or device via a network or storage medium, and by having one or more processors in the computer of that system or device read and execute the program. It can also be realized by a circuit (e.g., an ASIC) that implements one or more functions.

[0064] <Summary of Embodiments> The disclosures herein include the following exposure apparatus, exposure method, and method for manufacturing articles.

[0065] (Item 1) An exposure apparatus that performs scanning exposure of a shot area of ​​a substrate while scanning the substrate with respect to a slit light, A stage that holds and moves the substrate, A light-shielding member that is inserted into and removed from the optical path of the slit light, A control unit controls the driving of the stage according to a driving profile that defines the driving of the stage, and controls the insertion and removal of the light-shielding member into the optical path of the slit light, Equipped with, The drive profile is configured to accelerate the stage at the start of the scanning exposure, The exposure apparatus is characterized in that, when the control unit removes the light-shielding member from the optical path of the slit light at the start of the scanning exposure, it accelerates the light-shielding member in accordance with the acceleration of the stage in the drive profile so as to prevent the slit light from irradiating the area outside the shot region.

[0066] (Item 2) The drive profile is configured to decelerate the stage at the end of the scanning exposure, The exposure apparatus according to item 1, characterized in that when the control unit inserts the light-shielding member into the optical path of the slit light at the end of the scanning exposure, it decelerates the light-shielding member in accordance with the deceleration of the stage in the drive profile so as to prevent the slit light from irradiating the area outside the shot region.

[0067] (Item 3) The substrate includes a first shot region in which scanning exposure is performed, and a second shot region in which scanning exposure is performed after the first shot region. The exposure apparatus according to item 2, characterized in that the control unit controls the driving of the light-shielding member so as to insert the light-shielding member into the optical path of the slit light at the end of the scanning exposure for the first shot area, and to remove the light-shielding member from the optical path of the slit light at the start of the scanning exposure for the second shot area.

[0068] (Item 4) The exposure apparatus according to item 3, characterized in that the control unit controls the driving of the light-shielding member such that the stopping period of the light-shielding member is longer than the stopping period of the stage between the scanning exposure of the first shot area and the scanning exposure of the second shot area.

[0069] (Item 5) The exposure apparatus according to item 3 or 4, characterized in that the control unit decelerates the light-shielding member at a deceleration greater than the tracking deceleration when it is made to follow the deceleration of the stage, between the scanning exposure of the first shot area and the scanning exposure of the second shot area, to stop the light-shielding member, and then accelerates the light-shielding member at an acceleration greater than the tracking acceleration when it is made to follow the acceleration of the stage.

[0070] (Item 6) The exposure apparatus according to item 3, characterized in that the control unit controls the driving of the light-shielding member so that the driving of the light-shielding member follows the driving of the stage in the driving profile between the scanning exposure of the first shot area and the scanning exposure of the second shot area.

[0071] (Item 7) The exposure apparatus according to any one of items 3 to 6, characterized in that the control unit controls the driving of the light-shielding member so that, if the light-shielding member is stopped at the start of the scanning exposure for the first shot area, the light-shielding member can be driven to decelerate in accordance with the deceleration of the stage at the end of the scanning exposure.

[0072] (Item 8) The exposure apparatus according to any one of items 3 to 7, characterized in that, if the control unit removes the light-shielding member from the optical path of the slit light at the start of the scanning exposure of the second shot area, it stops the light-shielding member before the scanning exposure is completed.

[0073] (Item 9) The system further includes a second light-shielding member that is inserted into and removed from the optical path of the slit light, The exposure apparatus according to any one of items 3 to 8, characterized in that the control unit controls the driving of the second light-shielding member so as to withdraw the second light-shielding member from the optical path of the slit light at the start of the scanning exposure for the first shot region and insert the second light-shielding member into the optical path of the slit light at the end of the scanning exposure for the second shot region.

[0074] (Item 10) An exposure apparatus that performs scanning exposure of a shot area of ​​a substrate while scanning the substrate with respect to a slit light, A stage that holds and moves the substrate, A light-shielding member that is inserted into and removed from the optical path of the slit light, A control unit controls the driving of the stage according to a driving profile that defines the driving of the stage, and controls the insertion and removal of the light-shielding member into the optical path of the slit light, Equipped with, The drive profile is configured to decelerate the stage at the end of the scanning exposure, The exposure apparatus is characterized in that, when the control unit inserts the light-shielding member into the optical path of the slit light at the end of the scanning exposure, it decelerates the light-shielding member in accordance with the deceleration of the stage in the drive profile so as to prevent the slit light from irradiating the area outside the shot region.

[0075] (Item 11) The exposure apparatus according to any one of items 1 to 10, characterized in that at least the section of the drive profile during scanning exposure is configured as a sinusoidal profile.

[0076] (Item 12) The exposure apparatus according to any one of items 1 to 11, further comprising a generation unit that generates the slit light using light from a light source.

[0077] (Item 13) An exposure method in which scanning exposure of a shot area of ​​a substrate is performed while scanning the substrate with respect to a slit light, A drive step of driving the stage that holds the substrate according to a drive profile that defines the drive of the stage, In parallel with the aforementioned driving process, a control process is performed to control the insertion and removal of the light-shielding member from the optical path of the slit light, Includes, The drive profile is configured to accelerate the stage at the start of the scanning exposure, The exposure method is characterized in that, in the control step, when the light-shielding member is removed from the optical path of the slit light at the start of the scanning exposure, the light-shielding member is accelerated to follow the acceleration of the stage in the drive profile so as to prevent the slit light from irradiating the area outside the shot region.

[0078] (Item 14) An exposure step in which the substrate is exposed using the exposure method described in item 13, A processing step for processing the substrate exposed in the exposure step, A manufacturing process for producing an article from the substrate processed in the above-mentioned processing step, A method for manufacturing an article, characterized by including the following:

[0079] The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to disclose the scope of the invention. [Explanation of Symbols]

[0080] 100: Exposure apparatus, 101: Projection optical system, 102: Mask (master plate), 103: Mask stage, 104: Substrate, 105: Substrate stage, 106: Illumination optical system, 112: Masking unit, 200: Drive mechanism, 205, 206: Shading blades

Claims

1. An exposure apparatus that performs scanning exposure on multiple shot regions on a substrate while scanning the substrate with respect to a slit light, A stage that holds and moves the substrate, A light-shielding member that is inserted into and removed from the optical path of the slit light, A control unit controls the driving of the stage based on the driving profile and controls the insertion and removal of the light-shielding member into the optical path of the slit light, Equipped with, The drive profile includes a profile that accelerates the stage at the start of the scanning exposure, The plurality of shot regions include a first shot region and a second shot region. The control unit, When removing the light-shielding member from the optical path of the slit light at the start of the scanning exposure, the light-shielding member is accelerated to follow the acceleration of the stage in the drive profile so as to prevent the slit light from irradiating the area outside the shot region. An exposure apparatus characterized in that, between the scanning exposure of the first shot area and the scanning exposure of the second shot area, the light-shielding member is accelerated at an acceleration greater than the tracking acceleration when the acceleration of the light-shielding member is made to track the acceleration of the stage.

2. The drive profile includes a profile that slows down the stage at the end of the scanning exposure, The exposure apparatus according to claim 1, characterized in that when the control unit inserts the light-shielding member into the optical path of the slit light at the end of the scanning exposure, it decelerates the light-shielding member in accordance with the deceleration of the stage in the drive profile so as to prevent the slit light from irradiating the area outside the shot region.

3. The exposure apparatus according to claim 2, characterized in that the control unit controls the driving of the light-shielding member so as to insert the light-shielding member into the optical path of the slit light at the end of the scanning exposure for the first shot area and to withdraw the light-shielding member from the optical path of the slit light at the start of the scanning exposure for the second shot area.

4. The exposure apparatus according to claim 1, characterized in that the control unit controls the driving of the light-shielding member such that the stopping period of the light-shielding member is longer than the stopping period of the stage between the scanning exposure of the first shot area and the scanning exposure of the second shot area.

5. The exposure apparatus according to claim 1, characterized in that the control unit decelerates the light-shielding member at a deceleration greater than the tracking deceleration when the light-shielding member is made to follow the deceleration of the stage, between the scanning exposure of the first shot area and the scanning exposure of the second shot area, thereby stopping the light-shielding member, and then accelerates the light-shielding member at an acceleration greater than the tracking acceleration when the acceleration of the light-shielding member is made to follow the acceleration of the stage.

6. The exposure apparatus according to claim 3, characterized in that the control unit controls the driving of the light-shielding member so that, if the light-shielding member is stopped at the start of the scanning exposure for the first shot area, the light-shielding member can be driven to decelerate in accordance with the deceleration of the stage at the end of the scanning exposure.

7. The exposure apparatus according to claim 3, characterized in that, if the control unit removes the light-shielding member from the optical path of the slit light at the start of the scanning exposure of the second shot region, it stops the light-shielding member before the scanning exposure is completed.

8. The system further includes a second light-shielding member that is inserted into and removed from the optical path of the slit light, The exposure apparatus according to claim 3, characterized in that the control unit controls the driving of the second light-shielding member so as to withdraw the second light-shielding member from the optical path of the slit light at the start of the scanning exposure for the first shot region, and insert the second light-shielding member into the optical path of the slit light at the end of the scanning exposure for the second shot region.

9. An exposure apparatus that performs scanning exposure on multiple shot regions on a substrate while scanning the substrate with respect to a slit light, A stage that holds and moves the substrate, A light-shielding member that is inserted into and removed from the optical path of the slit light, A control unit controls the driving of the stage based on the driving profile and controls the insertion and removal of the light-shielding member into the optical path of the slit light, Equipped with, The drive profile includes a profile that slows down the stage at the end of the scanning exposure, The plurality of shot regions include a first shot region and a second shot region. The control unit, When inserting the light-shielding member into the optical path of the slit light at the end of the scanning exposure, the light-shielding member is driven to decelerate in accordance with the deceleration of the stage in the drive profile so as to prevent the slit light from irradiating the area outside the shot region. An exposure apparatus characterized in that, between the scanning exposure of the first shot area and the scanning exposure of the second shot area, the light-shielding member is accelerated at an acceleration greater than the tracking acceleration when the acceleration of the light-shielding member is made to track the acceleration of the stage.

10. The exposure apparatus according to claim 9, wherein the control unit decelerates the light-shielding member at a deceleration greater than the tracking deceleration when the light-shielding member is made to follow the deceleration of the stage, between the scanning exposure of the first shot area and the scanning exposure of the second shot area, thereby stopping the light-shielding member, and then accelerates the light-shielding member at an acceleration greater than the tracking acceleration when the acceleration of the light-shielding member is made to follow the acceleration of the stage.

11. The exposure apparatus according to any one of claims 1 to 10, characterized in that at least the section of the drive profile during scanning exposure includes a sinusoidal profile.

12. The exposure apparatus according to any one of claims 1 to 10, further comprising a generation unit that generates the slit light using light from a light source.

13. An exposure method in which scanning exposure is performed on a substrate while scanning the substrate with respect to a slit light, A drive step of driving a stage that holds the substrate based on a drive profile, In parallel with the aforementioned driving process, a control process is performed to control the insertion and removal of the light-shielding member from the optical path of the slit light, Includes, The drive profile includes a profile that accelerates the stage at the start of the scanning exposure, The plurality of shot regions include a first shot region and a second shot region. In the control process described above, When removing the light-shielding member from the optical path of the slit light at the start of the scanning exposure, the light-shielding member is accelerated to follow the acceleration of the stage in the drive profile so as to prevent the slit light from irradiating the area outside the shot region. An exposure method characterized in that, between the scanning exposure of the first shot area and the scanning exposure of the second shot area, the light-shielding member is accelerated at an acceleration greater than the tracking acceleration when the acceleration of the light-shielding member is made to track the acceleration of the stage.

14. An exposure step of exposing a substrate using the exposure method described in claim 13, A processing step for processing the substrate exposed in the exposure step, A manufacturing process for producing an article from the substrate processed in the above-mentioned processing step, A method for manufacturing an article, characterized by including the following:

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