Chip manufacturing method
The chip manufacturing method uses laser beam irradiation with aberrations to form ablation marks and modified regions within the wafer, enhancing productivity by reliably dividing film-coated wafers into individual chips.
JP7876353B2Active Publication Date: 2026-06-19DISCO CORP
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- DISCO CORP
- Filing Date
- 2022-06-30
- Publication Date
- 2026-06-19
AI Technical Summary
Technical Problem
Existing methods for dividing film-coated wafers face challenges with increased film thickness leading to division defects and chipping, requiring improvements in productivity.
Method used
A chip manufacturing method involving laser beam irradiation along planned division lines to form ablation marks and modified regions inside the wafer, followed by an external force to split the wafer, utilizing laser beams transparent to the wafer and absorbent to the film, with aberrations to enhance division efficiency.
Benefits of technology
The method improves productivity by reliably dividing film-coated wafers into individual chips while minimizing meandering and chipping, reducing the need for pre-removal of films on division lines.
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Smart Images
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Abstract
To provide a chip manufacturing method capable of improving productivity while reliably dividing a wafer with a film.SOLUTION: A manufacturing method of a chip by dividing a wafer with a film formed on the back side along a planned dividing line includes a laser beam irradiation step 101 of irradiating a wafer with a laser beam along a dividing line set on the wafer to form an ablation mark on the film formed on the back surface and forming a modified region inside the wafer, and a dividing step 102 of applying external force to the wafer and dividing the wafer along the ablation mark formed in the laser beam irradiation step 101 after performing the laser beam irradiation step 101.SELECTED DRAWING: Figure 3
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