Semiconductor manufacturing equipment and semiconductor manufacturing method

Abstract

To provide a technique capable of conveying a substrate without touching a product area by a conveying member even if a frame area becomes smaller.SOLUTION: A semiconductor manufacturing device includes a conveyance unit that conveys a substrate having a product area on which dies are mounted and a frame area that is located outside the product area, The conveyance unit includes a conveyance block that supports one end of both the upper and lower sides of the substrate and a conveyance block that supports the other end of both the upper and lower sides of the substrate when the substrate is conveyed. One end of the conveyance block is located in the frame area and the other end is provided to be located outside of the substrate. The conveyance block includes a conveyance roller or a conveyance belt.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present disclosure relates to a semiconductor manufacturing apparatus, and is applicable, for example, to a die bonder having a lane for transporting a substrate on which a die is mounted.

Background Art

[0002] A semiconductor manufacturing apparatus (mounting apparatus) such as a die bonder is an apparatus that attaches (mounts) an element, for example, onto a substrate or an element using a bonding material. The bonding material is, for example, a liquid or film-shaped resin, solder, or the like. The element is, for example, a die such as a semiconductor chip, MEMS (Micro Electro Mechanical System), or glass chip. The substrate is, for example, a wiring substrate, a lead frame formed of a thin metal plate, a glass substrate, or the like.

[0003] Some die bonders include a transport unit having a substrate transport claw that grips and transports the substrate and a transport lane (transport guide, chute) along which the substrate moves (for example, Patent Document 1). The substrate has a configuration in which the length in the transport direction is longer than the length in the direction orthogonal to the transport direction. This transport unit transports the substrate from the substrate supply unit along the transport lane to the bond position, and after bonding, transports the substrate to the substrate discharge unit and transfers the substrate to the substrate discharge unit.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the technique disclosed in Patent Document 1, since the substrate transport claw is provided inside the transport lane, when the distance between the end of the substrate and the product area (frame area) becomes small, the substrate transport claw (transport member) may touch the product area.

[0006] The objective of this disclosure is to provide a technology that enables the transport of substrates without the transport component touching the product area, even when the frame area is smaller. Other challenges and novel features will become apparent from the description herein and the accompanying drawings. [Means for solving the problem]

[0007] A brief overview of some of the representative disclosures is as follows: In other words, the semiconductor manufacturing apparatus includes a transport unit for transporting a substrate having a product area on which a die is mounted and a frame area located outside the product area. The transport unit includes a transport block that supports one end on both the upper and lower sides of the substrate when the substrate is being transported, and a transport block that supports the other end on both the upper and lower sides of the substrate. One end of the transport block is located in the frame area, and the other end is located outside the substrate. The transport block includes a transport roller or a transport belt. [Effects of the Invention]

[0008] According to this disclosure, even if the frame area becomes smaller, it is possible to transport the substrate without the transport member touching the product area. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a schematic top view of a die bonder in an embodiment. [Figure 2] Figure 2 is a schematic side view of the die bonder shown in Figure 1. [Figure 3] Figure 3 is a flowchart showing the manufacturing method of a semiconductor device using the die bonder shown in Figure 1. [Figure 4] Figure 4 is a top view of the substrate being transported by the transport unit. [Figure 5] Figure 5 shows a schematic configuration of the transport unit shown in Figure 1. [Figure 6] Figure 6 is a schematic cross-sectional view of the transport section along line AA shown in Figure 5. [Figure 7]FIG. 7 is a diagram showing a conveying unit in a comparative example and an embodiment. [Figure 8] FIG. 8 is a diagram showing a schematic configuration of a conveying unit in a first modification. [Figure 9] FIG. 9 is a schematic cross-sectional view taken along line A-A of the conveying unit shown in FIG. 8. [Figure 10] FIG. 10 is a diagram showing a schematic configuration of a conveying unit in a second modification. [Figure 11] FIG. 11 is a diagram showing a schematic configuration of a conveying unit in a third modification. [Figure 12] FIG. 12 is a schematic cross-sectional view taken along line A-A of the conveying unit shown in FIG. 11. [Figure 13] FIG. 13 is a diagram showing a schematic configuration of a conveying unit in a fourth modification. [Figure 14] FIG. 14 is a top view showing the configuration of a conveying unit in a fifth modification. [Figure 15] FIG. 15 is a schematic cross-sectional view taken along line A-A of the conveying unit shown in FIG. 14. [Figure 16] FIG. 16 is a top view showing the configuration of a conveying unit in a sixth modification. [Figure 17] FIG. 17 is a top view showing the configuration of a conveying unit in a seventh modification. [Figure 18] FIG. 18 is a diagram showing the configuration and operation of a conveying unit in an eighth modification. [Figure 19] FIG. 19 is a schematic top view showing the orientation of a substrate and the conveying direction of the substrate.

DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments and modifications will be described with reference to the drawings. However, in the following description, the same reference numerals may be assigned to the same components, and repeated descriptions may be omitted. The drawings may schematically represent the width, thickness, shape, etc. of each part compared to the actual aspect in order to make the description clearer. Also, the dimensional relationships and ratios of the elements are not necessarily consistent even among multiple drawings.

[0011] First, the configuration of the die bonder according to the embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is a schematic top view of the die bonder in the embodiment. FIG. 2 is a schematic side view of the die bonder shown in FIG. 1.

[0012] The die bonder 1 is roughly divided into a die supply unit 10, a pickup unit 20, an intermediate stage unit 30, a bonding unit 40, a transfer unit 50, a substrate supply unit 60, a substrate discharge unit 70, and a control unit (control device) 80 that monitors and controls the operations of each unit. The Y direction is the front-rear direction of the die bonder 1, the X direction is the left-right direction, and the Z direction is the up-down direction. The die supply unit 10 is arranged on the front side of the die bonder 1, and the bonding unit 40 is arranged on the rear side. The substrate supply unit 60 is arranged on the left side of the die bonder 1, and the substrate discharge unit 70 is arranged on the right side of the die bonder 1.

[0013] The die supply unit 10 includes a wafer holding table (not shown) that holds the wafer W and a peeling unit 13 that peels the die D from the wafer W. The wafer holding table is moved in the XY direction by a driving means (not shown), and the die D to be picked up is moved to the position of the peeling unit 13. The peeling unit 13 is moved in the up-down direction by a driving means (not shown). The wafer W is adhered onto a dicing tape DT and is divided into a plurality of dies D. The dicing tape DT to which the wafer W is attached is held by a wafer ring (not shown). A film-like adhesive material called a die attach film (DAF) is pasted between the wafer W and the dicing tape DT. The die attach film cures by heating.

[0014] The pickup unit 20 includes a pickup head 21, a wafer recognition camera 24, and a lighting device 25. The pickup head 21 has a collet 22 that sucks and holds the peeled die D at its tip, picks up the die D from the die supply unit 10, and places it on the intermediate stage 31. The wafer recognition camera 24 grasps the pickup position of the die D picked up from the wafer W. Note that the pickup unit 20 has driving units (not shown) that move the pickup head 21 up and down, rotate it, and move it in the X and Y directions.

[0015] The intermediate stage section 30 includes an intermediate stage 31, a stage recognition camera 34, and a lighting device 35. The stage recognition camera 34 is installed above the intermediate stage 31 and photographs the die D on the intermediate stage 31.

[0016] The stage recognition camera 34 is installed, for example, directly above the intermediate stage 31, and its field of view is directed vertically downward so that the optical axis of the stage recognition camera 34 coincides with the central axis of the intermediate stage 31. The lighting device 35 illuminates the die D placed on the intermediate stage 31 with light to make it bright enough for the stage recognition camera 34 to photograph.

[0017] The stage recognition camera 34 captures the image of the subject reflected from the top surface of die D. The image captured by the stage recognition camera 34 is output to the control unit 80, processed, and can also be displayed on a display screen (not shown).

[0018] The bonding unit 40 includes a bond head 41, a substrate recognition camera 44, and a bond stage 46. The bond head 41 has a collet 42 that holds the die D at its tip by suction, similar to the pickup head 21. The substrate recognition camera 44 captures a position recognition mark (not shown) on the substrate S and recognizes the bond position. Here, the substrate S has multiple package areas P formed on it, which will ultimately become a single package. A position recognition mark is provided for each package area P. The bond stage 46 is moved upward when the die D is placed on the substrate S, supporting the substrate S from below. The bond stage 46 has a suction port (not shown) for vacuum adsorption of the substrate S, and can fix the substrate S in place. The bond stage 46 has a heating unit (not shown) for heating the substrate S. The bonding unit 40 also includes drive units (not shown) that move the bond head 41 up and down, rotate, and move it in the X and Y directions.

[0019] With this configuration, the bond head 41 corrects its pickup position and orientation based on the image data from the stage recognition camera 34 and picks up the die D from the intermediate stage 31. Then, the bond head 41 bonds the die D onto the package area P of the substrate S based on the image data from the substrate recognition camera 44, or bonds it by stacking it on top of a die that has already been bonded to the package area P of the substrate S.

[0020] The transport unit 50 has transport rollers 51 and 52 on both sides of the substrate S that grip and move the edges of the substrate S from above and below. The transport rollers 51 and 52 are provided between the substrate supply unit 60 and the substrate discharge unit 70 and transport the substrate S in the X-axis direction. With this configuration, the substrate S moves from the substrate supply unit 60 to the bonding position (mounting position), and after bonding, moves to the substrate discharge unit 70 or returns to the substrate supply unit 60.

[0021] The control unit 80 includes a memory for storing programs (software) and data for monitoring and controlling the operation of each part of the die bonder 1, a central processing unit (CPU) for executing the programs stored in the memory, and an input / output device. The input / output device includes an image acquisition device, a motor control device, and an I / O signal control device. The image acquisition device acquires image data from the wafer recognition camera 24, the stage recognition camera 34, and the substrate recognition camera 44. The motor control device controls the drive unit of the die supply unit 10, the drive unit of the pickup unit 20, the drive unit of the bonding unit 40, the drive unit of the transport unit 50, etc. The I / O signal control device acquires various sensor signals or controls signal units such as switches for lighting devices.

[0022] The bonding process (manufacturing method), which is one step in the manufacturing process of a semiconductor device using die bonder 1, will be explained with reference to Figure 3. Figure 3 is a flowchart showing the manufacturing method of a semiconductor device using die bonder as shown in Figure 1. In the following explanation, the operation of each part constituting die bonder 1 is controlled by control unit 80.

[0023] (Wafer loading process (process S1)) A wafer ring (not shown) is loaded into the die bonder 1. The loaded wafer ring is then supplied to the die supply unit 10. Here, the wafer ring holds a dicing tape DT to which dies D, separated from the wafer W, are attached.

[0024] (Substrate loading process (process S2)) The substrate transport jig containing the substrate S is supplied to the substrate supply unit and then loaded into the die bonder 1. In the substrate supply unit, the substrate S is removed from the substrate transport jig and fixed to the transport rollers 51 and 52.

[0025] (Pickup process (process S3)) After step S1, the wafer holder is moved so that the desired die D can be picked up from the dicing tape DT. The die D is photographed by the wafer recognition camera 24, and the die D is positioned and its surface inspected based on the image data acquired by the photograph.

[0026] The positioned die D is peeled from the dicing tape DT by the peeling unit 13 and the pickup head 21. The die D, peeled from the dicing tape DT, is attracted and held by the collet 22 provided on the pickup head 21, and is transported to and placed on the intermediate stage 31.

[0027] The die D on the intermediate stage 31 is photographed by the stage recognition camera 34, and the die D is positioned and its surface inspected based on the image data acquired by the camera. By processing the image data, the amount of displacement (in the X, Y, and θ directions) of the die D on the intermediate stage 31 from the die position reference point of the die bonder is calculated, and positioning is performed. The die position reference point is a predetermined position on the intermediate stage 31, which is held as the initial setting of the device. The surface inspection of the die D is performed by processing the image data.

[0028] The pickup head 21, which has transported die D to the intermediate stage 31, is returned to the die supply unit 10. Following the procedure described above, the next die D is peeled off from the dicing tape DT, and thereafter, die D is peeled off one by one from the dicing tape DT following the same procedure.

[0029] (Bond process (process S4)) The transport unit 50 transports the substrate S to the bond stage 46. The substrate S placed on the bond stage 46 is imaged by the substrate recognition camera 44, and image data is acquired by the image capture. By processing the image data, the amount of displacement of the substrate S from the substrate position reference point of the die bonder 1 (in the X, Y, and θ directions) is calculated. The substrate position reference point is a predetermined position of the bonding unit 40, which is held as the initial setting of the device.

[0030] In step S3, the suction position of the bond head 41 is corrected based on the amount of displacement of the die D on the intermediate stage 31 calculated, and the die D is picked up by the collet 42. The bond head 41, which has picked up the die D from the intermediate stage 31, bonds the die D to a predetermined location on the substrate S supported by the bond stage 46. Here, the predetermined location on the substrate S is the package area P of the substrate S, or an area where elements are already placed and elements are to be bonded in addition to them, or the bond area of ​​elements to be laminated and bonded. The die D bonded to the substrate S is photographed by the substrate recognition camera 44, and an inspection is performed based on the image data acquired by the photograph to determine whether the die D is bonded to the desired location. If the inspected die D is found to be defective, the bond head 41 transports the die D to the discard area.

[0031] The bond head 41, having bonded die D to the substrate S, is returned to the intermediate stage 31. Following the procedure described above, the next die D is picked up from the intermediate stage 31 and bonded to the substrate S. This process is repeated until die D is bonded to all predetermined locations on the substrate S.

[0032] (Substrate unloading process (process S5)) The substrate S to which the die D has been bonded is transported to the substrate discharge section 70. In the substrate discharge section 70, the substrate S is removed from the transport rollers 51 and 52 and stored in the substrate transport jig. The substrate S stored in the substrate transport jig is discharged from the die bonder 1.

[0033] As described above, die D is bonded onto substrate S and discharged from die bonder 1. Subsequently, for example, the transport jig containing the substrate S to which die D is bonded is transported to the wire bonding process, where the electrodes of die D are electrically connected to the electrodes of substrate S via Au wire or the like. Then, substrate S is transported to the molding process, where die D and Au wire are sealed with molding resin (not shown) to complete the semiconductor package.

[0034] In the case of laminate bonding, following the wire bonding process, a transport jig containing a substrate S to which the die D has been bonded is transported to the die bonder, where the die D is laminated on top of the die D bonded on the substrate S. After being transported out of the die bonder, it is electrically connected to the electrodes of the substrate S via Au wire in the wire bonding process. The die D from the second stage upwards is peeled off from the dicing tape DT in the manner described above, then transported to the bonding section 40 and laminated on top of the die D. After the above process is repeated a predetermined number of times, the substrate S is transported to the molding process, where the multiple die Ds and Au wires are sealed with molding resin (not shown) to complete the laminated package.

[0035] The transport unit 50 will be explained using Figures 4 to 6. Figure 4 is a top view of the substrate being transported by the transport unit. Figure 5 is a diagram showing the schematic configuration of the transport unit shown in Figure 1. Figure 6 is a schematic cross-sectional view of the transport unit shown in Figure 5 along line AA.

[0036] As shown in Figure 4, multiple rectangular package areas P are arranged in an array on the substrate S. The area where multiple package areas P are arranged is called the product area PA. Figure 4 shows an example where 10 package areas P are arranged in the X direction and 4 in the Y direction within the product area PA. The product area PA does not extend to the edge of the substrate S, and there is a margin area between the edge (outer perimeter) of the product area PA and the edge (outer perimeter) of the substrate S. In this specification, this margin area is called the frame area FA.

[0037] A transport unit 50 is constructed by providing a plurality of transport blocks 50a between the substrate supply unit 60 and the substrate discharge unit 70. Each transport block 50a includes an upper transport roller 51, a lower transport roller 52, an upper drive unit 55, and a lower drive unit 56.

[0038] As shown in Figure 6, the transport roller 51 has a drive roller 51a and driven rollers 51b, 51c that rotate in accordance with the rotation of the other rollers it contacts. As shown in Figure 6, a portion of the drive roller 51a and the driven rollers 51b, 51c each contact the upper surface of the frame area FA of the substrate S. The transport roller 51 further has feed amount synchronizing rollers 51f, 51g that rotate in accordance with the rotation of the drive roller 51a or the driven rollers 51b, 51c that it contacts. The drive roller 51a and the driven rollers 51b, 51c are cylindrical and have the same diameter. The feed amount synchronizing rollers 51f, 51g are cylindrical and have the same diameter, but smaller than the diameters of the drive roller 51a and the driven rollers 51b, 51c. When rotational force is applied to the drive roller 51a by the drive unit 55, the rotational force is transmitted to the feed amount synchronizing rollers 51f, 51g and the driven rollers 51b, 51c.

[0039] As shown in Figure 6, the transport roller 52 has a drive roller 52a and driven rollers 52b, 52c that rotate in accordance with the rotation of the other rollers it contacts. As shown in Figure 6, a portion of the drive roller 52a and the driven rollers 52b, 52c each contact the lower surface of the substrate S. The transport roller 52 further has feed amount synchronizing rollers 52f, 52g that rotate in accordance with the rotation of the drive roller 52a or the driven rollers 52b, 52c that it contacts. The drive roller 52a and the driven rollers 52b, 52c are cylindrical and have the same diameter. The feed amount synchronizing rollers 52f, 52g are cylindrical and have the same diameter, which is smaller than the diameter of the drive roller 52a and the driven rollers 52b, 52c. When rotational force is applied to the drive roller 52a by the drive unit 56, the rotational force is transmitted to the feed amount synchronizing rollers 52f, 52g and the driven rollers 52b, 52c.

[0040] Either the transport roller 51 or the transport roller 52 may be a fully driven roller of the other. In this case, the driven roller is rotated by the substrate S which is moved by the drive roller.

[0041] The drive unit 55 holds the rotation axis of each roller of the transport roller 51 and applies rotational force to the drive roller 51a. The drive unit 56 holds the rotation axis of each roller of the transport roller 52 and applies rotational force to the drive roller 52a. In Figure 6, the substrate S moves in the direction of the arrow (to the right) as the drive unit 55 rotates the drive roller 51a counterclockwise and the drive unit 56 rotates the drive roller 52a clockwise.

[0042] The drive units 55 and 56 are configured such that at least one of them can move in the vertical direction. This allows at least one of the conveyor rollers 51 and 52 to move in the vertical direction.

[0043] Furthermore, the drive units 55 and 56 may be configured so that at least one of the transport rollers 51 and 52 moves up and down in accordance with the thickness of the substrate S. The rotation axis of each roller of the transport rollers 51 and 52 is not restricted in the vertical direction and is configured to move up and down according to the thickness of the substrate S. This allows the substrate to be transported in the same positional relationship even if its thickness is different. In addition, the drive units 55 and 56 may be configured so that the gripping force of at least one of the transport rollers 51 and 52 on the substrate S can be adjusted. This allows the substrate to be gripped with the same tension (pressure) at all times and transported stably, even if its thickness is different.

[0044] It is not necessary to provide feed amount synchronization rollers 51f, 51g, 52f, and 52g. Instead, gears or the like may be provided on the rotating shafts of the drive rollers 51a and 52a in the drive units 55 and 56 to transmit rotational force to gears or the like provided on the rotating shafts of the driven rollers 51b, 51c, 52b, and 52c.

[0045] The effects of this embodiment will be explained with reference to Figure 7. Figure 7 shows the transport section in the comparative example and the embodiment.

[0046] In the comparative example, the transport unit 50 includes a substrate transport claw 501 that grips and transports the substrate S, and a transport lane (chute) 502 on which the substrate S moves. The substrate S moves in the X direction by driving a nut (not shown) of the substrate transport claw 501, which is provided on the transport lane 502, with a ball screw (not shown) provided along the transport lane 502. The substrate S rests on the chute 502 with a width of w1 (one side), and the substrate transport claw 501 with a width of w2 is positioned at a gap g from the chute 502. Therefore, the substrate S is transported using the space from the end of the chute 502 to a position w3 (=g+w2), that is, from the end of the substrate S to a position w4 (=w1+w3=w1+g+w2).

[0047] Basically, the product area PA is designed so that the substrate transport claws 501 and the clamps (described later) do not come into contact with it (the substrate transport claws 501 and clamps are located in the frame area FA). Therefore, it may not be possible to accommodate substrates with a narrow distance from the edge of the product area PA to the edge of the substrate S. As the number of package areas P on the substrate S is increased, the frame area FA is becoming narrower, which may make it impossible to accommodate. Generally, the short side edge of the substrate S in the frame area FA contains a barcode and product name to identify the substrate's identification number and manufacturing number.

[0048] Furthermore, if paste is applied to the substrate S or the substrate S is cleaned before transporting the substrate S to the bond stage 46, a preform stage is used to fix the substrate S in place. On the preform stage or bond stage, clamps may be used to press down on the substrate S from above. In this case, the clamps will touch the inside of the substrate S even further than the substrate transport claws 501 shown in Figure 7. The stage of the preform stage or bond stage 46 is in contact with the bottom of the substrate S, and the width of the stage is approximately the same as the width of the package area P.

[0049] In the transport unit 50 of this embodiment, the transport rollers 51 and 52 rest on the edge of the substrate S with a width of w1 (one side), eliminating the need for the space w3 for the substrate transport claws 501. This increased space (w3) allows for a larger area on the substrate S where the package area P can be placed. This makes it possible to accommodate the narrowing of the bezel area FA.

[0050] For example, in the comparative example, if w1=1mm, g=0.5mm, and w2=0.5mm, then w4=2mm. In this case, the embodiment has 1mm more space on one side than the comparative example. If w5 is the length in the Y direction between the edge of the substrate S and the edge of the product area PA (frame area FA), then in the comparative example, w5 can be reduced to w4 (=2mm), whereas in the embodiment, w5 can be reduced to w1 (=1mm). Depending on the size of the package area P, it may be possible to increase the number of package areas P, thereby increasing the density of the product area PA.

[0051] <Variation> The following are some representative examples of modifications of the embodiments. In the following descriptions of modifications, the same reference numerals as in the embodiments described above may be used for parts having the same configuration and function as those described in the embodiments described above. Furthermore, the descriptions of such parts may be appropriately referenced from the embodiments described above, to the extent that they do not contradict the technical standards. In addition, some of the embodiments described above, and all or some of the modifications, may be applied in combination as appropriate, to the extent that they do not contradict the technical standards.

[0052] (First torture) The configuration of the transport section in the first modified example will be explained using Figures 8 and 9. Figure 8 is a diagram showing the schematic configuration of the transport section in the first modified example. Figure 9 is a schematic cross-sectional view of the transport section shown in Figure 8 along line AA.

[0053] In the first modified example, the transport unit transports the substrate S by a transport belt instead of the transport rollers in the embodiment. The transport block 50a in the first modified example includes an upper transport belt 57, a lower transport belt 58, a drive unit 55 that drives the transport belt 57, and a drive unit 56 that drives the transport belt 58.

[0054] The conveyor belt 57 has a belt 57a that contacts the upper surface of the substrate S and pulleys 57b to 57d that apply rotational force to belt 57a. The conveyor belt 58 has a belt 58a that contacts the upper surface of the substrate S and pulleys 58b to 58d that apply rotational force to belt 58a.

[0055] The rotating shafts of pulleys 57b to 57d are held and rotated by the drive unit 55. The rotating shafts of pulleys 58b to 58d are held and rotated by the drive unit 56. In Figure 9, the drive unit 55 rotates belt 57a counterclockwise, and the drive unit 56 rotates belt 58a clockwise, causing the substrate S to move in the direction of the arrow (to the right).

[0056] The drive units 55 and 56 are configured such that at least one of them can move in the vertical direction. This allows at least one of the conveyor belts 57 and 58 to move in the vertical direction. At least one of the conveyor belts 57 and 58 may be configured to move up and down in accordance with the thickness of the substrate S. The drive units 55 and 56 may be configured so that the clamping force of at least one of the conveyor belts 57 and 58 on the substrate S can be adjusted.

[0057] (Second variation) The configuration of the transport unit in the second modified example will be explained using Figure 10. Figure 10 is a diagram showing the schematic configuration of the transport unit in the second modified example.

[0058] In the second modified example, the conveying block 50a is constructed by combining the conveying rollers in the embodiment and the conveying belt in the first modified example. The conveying block 50a in the second modified example is configured as shown in Figure 10, either BR or RB. In BR, the upper side uses a conveying belt 57, similar to the first modified example, and the lower side uses a conveying roller 52, similar to the embodiment. In RB, the upper side uses a conveying roller 51, similar to the embodiment, and the lower side uses a conveying belt 58, similar to the first modified example.

[0059] (Third variation) The configuration of the conveying unit in the third modified example will be explained using Figures 11 and 12. Figure 11 is a diagram showing the schematic configuration of the conveying unit in the third modified example. Figure 12 is a diagram showing the schematic configuration of the conveying rollers and drive unit shown in Figure 11.

[0060] In the third modified example, the transport rollers have a configuration that prevents substrate displacement. In the third modified example, the transport rollers 51 and 52 have the same configuration as the transport block in the embodiment, except for the shape of the drive rollers 51a and 52a, the driven rollers 51b, 51c, 52b, and 52c, and the feed amount synchronization rollers 51f, 51g, 52f, and 52g. In the embodiment, the rollers are cylindrical with a uniform diameter, but in the third modified example, the drive rollers 51a and 52a and the driven rollers 51b, 51c, 52b, and 52c are composed of two parts with different diameters, formed by a step in the middle of the cylinder. Along with the change in the shape of the drive rollers 51a and 52a and the driven rollers 51b, 51c, 52b, and 52c, the shape of the feed amount synchronization rollers 51f, 51g, 52f, and 52g that move with them has also been changed.

[0061] The upper drive roller 51a has a first portion 51a1 that contacts the upper surface of the substrate S and a second portion 51a2 that is located outside the substrate S and does not contact the upper surface of the substrate S. The first portion 51a1 is cylindrical. The second portion 51a2 is cylindrical and has a larger diameter than the first portion 51a1. That is, the drive roller 51a has a step. This allows the end of the substrate S on the width direction (Y direction) side to contact the second portion 51a2. The second portion 51a2 functions as a guide for the substrate S in the lateral direction (X direction). The width (length in the Y direction) of the second portion 51a2 is wider (longer) than the width (length in the Y direction) of the first portion 51a1. The driven rollers 51b and 51c have the same configuration as the drive roller 51a. The feed amount synchronization roller 51f is configured to contact the second portion 51a2. The driven rollers 51b and 51c have the same configuration as the drive roller 51a. The feed rate synchronization roller 51g has the same configuration as the feed rate synchronization roller 51f.

[0062] The lower drive roller 52a has a first portion 52a1 that contacts the lower surface of the substrate S and a second portion 52a2 that is located outside the substrate S and does not contact the lower surface of the substrate S. The first portion 52a1 is cylindrical. The second portion 52a2 is cylindrical and has a smaller diameter than the first portion 52a1. That is, the drive roller 52a has a step. The width (length in the Y direction) of the second portion 52a2 is wider (longer) than the width (length in the Y direction) of the first portion 52a1. The width of the first portion 52a1 of the drive roller 52a is slightly narrower than the first portion 51a1 of the drive roller 51a, so that the first portion 52a1 does not come into close contact with the second portion 51a2. The feed amount synchronizing roller 52f is configured to contact the second portion 52a2. The driven rollers 52b and 52c have the same configuration as the drive roller 52a. The feed rate synchronization roller 52g has the same configuration as the feed rate synchronization roller 52f.

[0063] The lower end of the second portion 51a2 of the drive roller 51a will be located below the lower surface of the substrate S, but the diameters of the second portions 51a2 and 52a2 are set so that there is a gap between the second portion 51a2 and the second portion 52a2 of the drive roller 52a so that the second portions 51a2 and 52a2 do not come into contact.

[0064] The first parts 51a1 and 52a1 are formed from an elastic material with a high friction rate. The second part 51a2 is formed from a hard material with a low friction rate. As a result, the part that transports the substrate S (first part) ensures sufficient frictional force to propel the substrate S, while the guide part (second part) can minimize damage caused by friction from contact with the substrate S.

[0065] In the embodiment, the transport unit may cause the substrate S to shift in the width direction (Y direction) during transport. In this modified example, when the substrate S attempts to shift in the width direction, the end face of the substrate S comes into contact with the side surface of the second portion 51a2 of the drive roller 51a and the second portion of the driven rollers 51b and 51c, preventing it from shifting further.

[0066] (Fourth variation) The configuration of the transport unit in the fourth modified example will be explained using Figure 13. Figure 13 is a diagram showing the schematic configuration of the transport unit in the fourth modified example.

[0067] In the fourth modified example, the conveyor belt has a configuration that prevents substrate displacement. In the fourth modified example, the conveyor block 50a has the same configuration as the conveyor block in the first modified example, except for the shape of the belts 57a and 58a of the conveyor belts 57 and 58. In the first modified example, the belt has a uniform thickness, but in the fourth modified example, the belts 57a and 58a of the conveyor belts 57 and 58 are composed of two parts with different thicknesses, with a step formed in the middle.

[0068] The upper conveyor belt 57 has a first portion 57a1 that contacts the upper surface of the substrate S and a second portion 57a2 that is located outside the substrate S and does not contact the upper surface of the substrate S. The second portion 57a2 is formed to be thicker than the first portion 57a1. That is, the belt 57a has a step. This allows the end of the substrate S on the width direction (Y direction) side to contact the second portion 57a2. The second portion 57a2 functions as a guide for the substrate S in the lateral direction (X direction). The width (length in the Y direction) of the second portion 57a2 is wider (longer) than the width (length in the Y direction) of the first portion 57a1.

[0069] The lower conveyor belt 58 has a first portion 58a1 that contacts the lower surface of the substrate S and a second portion 58a2 that is located outside the substrate S and does not contact the lower surface of the substrate S. The second portion 58a2 has a smaller diameter than the first portion 58a1. In other words, the belt 58a has a step. The width (length in the Y direction) of the second portion 58a2 is wider (longer) than the width (length in the Y direction) of the first portion 58a1. The width of the first portion 58a1 of belt 58a is slightly narrower than the first portion 57a1 of belt 57a, so that the first portion 58a1 does not come into close contact with the second portion 57a2.

[0070] The lower end of the second portion 57a2 of belt 57a will be located below the lower surface of the substrate S, but the thickness of the second portions 57a2 and 58a2 is set so that there is a gap between the second portion 57a2 and the second portion 58a2 of belt 58a and that the second portions 57a2 and 58a2 do not come into contact with each other.

[0071] The first parts 57a1 and 58a1 are formed from an elastic material with a high friction rate. The second part 57a2 is formed from a hard material with a low friction rate. As a result, the part that transports the substrate S (first part) ensures sufficient frictional force to propel the substrate S, while the guide part (second part) can minimize damage caused by friction from contact with the substrate S.

[0072] In this modified example, when the substrate S attempts to shift in the width direction, the end face of the substrate S comes into contact with the side surface of the second portion 57a2 of the belt 57a, preventing it from shifting any further.

[0073] (Fifth variation) The configuration of the transport unit in the fifth modified example will be explained using Figures 14 and 15. Figure 14 is a top view showing the configuration of the transport unit in the fifth modified example. Figure 15 is a schematic cross-sectional view of the transport unit shown in Figure 14 along line AA.

[0074] In the fifth modified example, the transport unit is equipped with guides on both sides of the substrate S. Compared to the transport unit in the embodiment, the transport unit 50 in the fifth modified example adds guides 59 in the lateral direction (Y direction) of the substrate S, in addition to the locations where the transport rollers 51 and 52 are positioned. In other words, the guides 59 are provided intermittently along the X direction.

[0075] The length (thickness) of the guide 59 in the Z direction is such that it does not come into contact with the feed amount synchronization rollers 51f~51h and 52f~52h. The ends of the guide 59 in the X direction are formed at an angle to maximize the length in the X direction that comes into contact with the substrate S, and to prevent contact with the drive rollers 51a, 52a and the driven rollers 51b~51d and 52b~52d.

[0076] Furthermore, if both the conveying rollers 51 and 52 are configured to have a step similar to the lower conveying roller 52 in the third modified example, the guide 59 will not come into contact with the conveying rollers 51 and 52, and therefore may be provided continuously along the X direction.

[0077] Furthermore, Figure 14 shows an example in which the conveyor roller 51 in the embodiment is further equipped with a driven roller 51d and a feed amount synchronizing roller 51h. However, the number of driven rollers and feed amount synchronizing rollers is not limited to this example and may be the same as in the embodiment, for example.

[0078] (Sixth variation) The configuration of the transport unit in the sixth modified example will be explained using Figure 16. Figure 16 is a top view showing the configuration of the transport unit in the sixth modified example.

[0079] In the sixth modified example, the transport section 50 uses transport rollers 51 and 52, similar to the embodiment. However, the transport roller 51 is mounted at an angle, with the extension direction of the rotation axis of the transport roller 51 inclined in the transport direction relative to the width direction of the substrate S. The inclination angle is preferably greater than 0 degrees and 15 degrees or less when the diameter of the transport roller is 10 mm. The optimal value of the inclination angle is determined by the diameter of the transport roller and is not limited to this range. By mounting it at an angle, friction is generated, and tension is applied in a direction perpendicular to the transport direction. This makes it possible to reduce warping and bending of the substrate S. The lower transport roller 52 is not shown, but has the same configuration as the upper transport roller 51.

[0080] Figure 16 shows an example in which the conveyor roller 51 in the embodiment also has driven rollers 51d and 51e, and an example without feed amount synchronizing rollers 51f and 51g. However, the number of driven rollers is not limited to this example, and may be the same as in the embodiment, or the same as in the fifth modified example. In addition, a mechanism for synchronizing the feed amount is provided in the drive unit 56 instead of the feed amount synchronizing rollers 51f and 51g.

[0081] (Seventh variation) The configuration of the transport section in the seventh modified example will be explained using Figure 17. Figure 17 is a top view showing the configuration of the transport section in the seventh modified example.

[0082] The conveying section 50 in the seventh modification has the same configuration as the conveying section 50 in the sixth modification, except for the shape of the conveying roller 51. In the sixth modification, the conveying roller 51 is a cylindrical shape with a uniform diameter, but in the seventh modification, the conveying roller 51 is composed of two parts with different diameters, with a step formed in the middle of the cylinder, similar to the third modification.

[0083] For example, the drive roller 51a has a first portion 51a1 that contacts the upper surface of the substrate S, and a second portion 51a2 that is located outside the substrate S and does not contact the upper surface of the substrate S. The first portion 51a1 is cylindrical. The second portion 51a2 is cylindrical and has a larger diameter than the first portion 51a1. That is, the drive roller 51a has a step. This allows the end of the substrate S on the width direction (Y direction) side to contact the second portion 51a2. The second portion 51a2 functions as a guide for the substrate S in the lateral direction (X direction). The width (length in the Y direction) of the second portion 51a2 is wider (longer) than the width (length in the Y direction) of the first portion 51a1.

[0084] The first part 51a1 is made of an elastic material with a high friction rate. The edge portion of the second part 51a2 is made of a hard material with a low friction rate. With this configuration, the contact point of the roller, which acts as a guide, is constantly moving, minimizing damage caused by friction from contact with the substrate. The lower transport roller 52 is not shown in the figure, but it has the same shape as the third modified example.

[0085] (Eighth variation) The transport unit in the eighth modified example will be explained using Figure 18. Figure 18 is a diagram showing the configuration and operation of the transport unit in the eighth modified example.

[0086] Transport using transport rollers or transport belts tends to result in slower transport speeds than transport using substrate transport claws. Therefore, in certain areas, such as near the bond stage, the transport block 50a in the ninth modified example performs a movement (pitch feed operation) where the transport rollers or transport belt move while gripping the substrate S. The pitch feed operation will be explained below using an example in which the transport block 50a is composed of a transport belt.

[0087] A portion of the transport unit 50 is composed of, for example, transport block TB1, transport block TB2, and transport block TB3. Each of the transport blocks TB1, TB2, and TB3 is composed of an upper transport belt 57, a lower transport belt 58, a drive unit 55 that drives the transport belt 57, and a drive unit 56 that drives the transport belt 58, as in the first modified example. For example, transport blocks TB1 and TB3 are fixed in place in the transport direction of the substrate S, while transport block TB2 is positioned between transport block TB1 and transport block TB3 so as to be movable along the transport direction of the substrate S. The pitch feeding operation will be described below.

[0088] Step 0 (STP0) The substrate S is being transported by transport blocks TB1 and TB2. At this time, the upper transport belt 57 of transport block TB3 is moving upward to receive the transported substrate S.

[0089] Step 1 (STP1) As indicated by arrow (a), the transport block TB2 moves the upper transport belt 57 upward and the lower transport belt 58 downward, moving both the upper transport belt 57 and the lower transport belt 58 towards the transport block TB1.

[0090] Step 2 (STP2) As indicated by arrow (b), transport block TB2 moves its upper transport belt 57 downward and its lower transport belt 58 upward to contact the substrate S. Transport block TB1 moves its upper transport belt 57 upward as indicated by arrow (c).

[0091] Step 3 (STP3) The transfer block TB2 moves to the transfer block TB3 side while sandwiching the substrate S, as indicated by the arrow (d). That is, the transfer block TB2 pitch-feeds the substrate S. The transfer block TB3 moves the upper transfer belt 57 downward and contacts the substrate S, as indicated by the arrow (e).

[0092] According to this modified example, the substrate can be pitch-fed with high precision in a portion that requires precision, such as a bonding portion. Also, the number of transfer rollers or transfer belts to be arranged can be reduced. Further, the transfer speed of the substrate S can be improved.

[0093] (Ninth Modified Example) The substrate in the ninth modified example will be described with reference to FIG. 19. FIG. 19 is a schematic top view showing the orientation of the substrate and the substrate transfer direction.

[0094] The substrate S is rectangular in plan view and has a long side with a length of L1 and a short side with a length of L2 (<L1). As described above, on the short side end of the substrate S in the frame area FA, there is an area BC where a barcode or product name for grasping the discrimination number or manufacturing number of the substrate is entered.

[0095] In the embodiment and the first to ninth modified examples, as shown by H-S in FIG. 19, the long side of the substrate S is arranged to be transferred along the extending direction (X direction). Therefore, in order to transfer the substrate S, an area where the end of the long side of the substrate S contacts the transfer unit 50 is required, and that area is an area outside the package area P (frame area).

[0096] On the other hand, as shown by V-S in FIG. 19, the substrate S in the tenth modified example is arranged to be transferred along the direction in which the short side extends (X direction). The area where the end of the long side of the substrate S contacts the transfer unit 50 is unnecessary, and the package area P can be arranged up to the very end of the long side of the substrate S. Thereby, depending on the size of the package area P, it is possible to increase the number of package areas P.

[0097] Furthermore, in order to transport the substrate S, the short edge of the substrate S needs to have a contact area with the transport unit 50. This area is outside the package area P (frame area), and area BC is located there. Because area BC is located there, the package area P is not located there, making it possible to secure a wide area for contact with the transport unit 50. Therefore, it is possible to use the substrate transport claws 501 of the transport unit 50 in the comparative example shown in Figure 7. Of course, it is also possible to use the transport unit 50 of the embodiment, the first modified example to the ninth modified example.

[0098] Since both ends of the short side of the substrate S are supported by the transport section 50, bending or deformation may occur in the substrate S. In this case, it is preferable to use the transport section 50 of the sixth or seventh modified example.

[0099] The disclosures made by the Disclosers have been described in detail above based on embodiments and modifications, but it goes without saying that the disclosures are not limited to the embodiments and modifications described above and can be modified in various ways.

[0100] For example, in the embodiment, an example was described in which the diameter of the feed rate synchronization roller is smaller than that of the drive roller (driven roller). The diameter of the feed rate synchronization roller may be larger than that of the drive roller (driven roller).

[0101] In the embodiments and modifications described, an example was given in which the width (Wu) of the portion of the conveyor roller 51 or conveyor belt 57 on the upper side of the substrate S that contacts the substrate S is the same as the width (Wd) of the portion of the conveyor roller 52 or conveyor belt 58 on the lower side of the substrate S that contacts the substrate S. However, the invention is not limited to this, and Wu and Wd may be different. For example, in the conveyor rollers 51, 52 or conveyor belts 57, 58 that are placed in locations where there is a stage such as a bond stage 46, Wu may be greater than Wd. In the conveyor rollers 51, 52 or conveyor belts 57, 58 that are placed in locations where there is no stage such as a bond stage 46, Wd may be greater than Wu.

[0102] In this embodiment, a die bonder was described in which a die is picked up from a die supply unit by a pickup head and placed on an intermediate stage, and the die placed on the intermediate stage is picked up by a bonding head and bonded to a substrate. Alternatively, there may be no pickup head, and the die from the die supply unit is picked up by a bonding head and placed on an intermediate stage, and the die placed on the intermediate stage is picked up by a bonding head and bonded to a substrate.

[0103] In this embodiment, a DAF is attached to the back surface of the wafer, but the DAF is not required.

[0104] In this embodiment, bonding is performed with the die's surface facing upwards, but after picking up the die, the die may be flipped over and bonded with the die's back surface facing upwards. This device is called a flip-chip bonder.

[0105] In this embodiment, an example of picking up a die from a wafer in the die supply unit was described, but the die may also be picked up from a tray. [Explanation of Symbols]

[0106] 1. Die bonder (semiconductor manufacturing equipment) 40. Bonding section 50... Conveyor section 50a... Conveyor Block 51, 52... Conveyor rollers 57, 58... Conveyor belt

Claims

1. The system includes a transport unit for transporting a substrate having a product area on which a die is mounted and a frame area located outside the product area. The transport unit includes a transport block that supports one end on both the upper and lower sides of the substrate and a transport block that supports the other end on both the upper and lower sides of the substrate when the substrate is being transported. One end of the transport block is located in the frame area, and the other end is located outside the substrate. The aforementioned conveying block includes a conveying roller or a conveying belt. The transport roller includes a roller that contacts the substrate, The roller is composed of a first portion that contacts the upper or lower surface of the substrate and a second portion that has a different diameter from the first portion and does not contact the upper or lower surface of the substrate. A semiconductor manufacturing apparatus in which, of the transport rollers located above and below the substrate, the diameter of the second portion of the roller is formed to be larger than the diameter of the first portion, and the diameter of the second portion of the roller is formed to be smaller than the diameter of the first portion.

2. In the semiconductor manufacturing apparatus according to claim 1, The second portion of the roller in one of the conveying rollers and the second portion of the roller in the other conveying roller are configured not to come into contact with each other. A semiconductor manufacturing apparatus in which the roller on one of the transport rollers or the roller on the other transport roller is configured to be able to move up and down.

3. In the semiconductor manufacturing apparatus according to claim 2, The transport block has a drive unit that supports and drives the roller located on the substrate, The drive unit is configured such that the roller, located on the substrate, moves up and down according to the thickness of the substrate.

4. In the semiconductor manufacturing apparatus of claim 3, The drive unit is configured such that the tension between the rollers and the substrate can be adjusted in a semiconductor manufacturing apparatus.

5. In the semiconductor manufacturing apparatus according to claim 1, A semiconductor manufacturing apparatus in which the first part is formed of an elastic material with a high coefficient of friction, and the second part is formed of a hard material with a low coefficient of friction.

6. A transport unit for transporting a substrate having a product area on which a die is mounted and a frame area located outside the product area, The transport unit includes a transport block that supports one end on both the upper and lower sides of the substrate and a transport block that supports the other end on both the upper and lower sides of the substrate when the substrate is being transported. One end of the transport block is located in the frame area, and the other end is located outside the substrate. The aforementioned conveying block includes conveying rollers or a conveying belt. Furthermore, it is equipped with a set of guides provided near both outer edges of the substrate, The transport roller includes a roller that contacts the substrate and a roller that does not contact the substrate. The guide is positioned in a semiconductor manufacturing apparatus where a roller that does not contact the substrate is placed.

7. A transport unit for transporting a substrate having a product area on which a die is mounted and a frame area located outside the product area, The transport unit includes a transport block that supports one end on both the upper and lower sides of the substrate and a transport block that supports the other end on both the upper and lower sides of the substrate when the substrate is being transported. One end of the transport block is located in the frame area, and the other end is located outside the substrate. The aforementioned conveying block includes conveying rollers or a conveying belt. The transport roller includes a roller that contacts the substrate, The roller is positioned diagonally so as to open in the direction of transport of the substrate. The roller has a step on the outside of the widthwise side of the substrate and has a contact portion that abuts the substrate and an edge portion with a larger diameter than the contact portion, the contact portion is made of an elastic material with a high friction rate and the edge portion is made of a hard material with a low friction rate, in a semiconductor manufacturing apparatus.

8. A transport unit for transporting a substrate having a product area on which a die is mounted and a frame area located outside the product area, The transport unit includes a transport block that supports one end on both the upper and lower sides of the substrate and a transport block that supports the other end on both the upper and lower sides of the substrate when the substrate is being transported. One end of the transport block is located in the frame area, and the other end is located outside the substrate. The aforementioned conveying block includes conveying rollers or a conveying belt. The transport block comprises an upper block positioned above the substrate and a lower block positioned below the substrate. The upper block and the lower block are each configured to be able to move up and down independently. The transport unit includes a first transport block, a second transport block, and a third transport block arranged along the transport direction of the substrate, each of which is composed of the transport block, and the second transport block is positioned between the first transport block and the third transport block. The second transport block is configured to be movable back and forth in the transport direction of the substrate, Furthermore, it includes a control device for controlling the second transport block, The control device is The upper block of the second transport block is moved upward, and the lower block is moved downward. Move the second transport block toward the first transport block, The upper block of the second transport block is moved downward, and the lower block is moved upward to sandwich and fix the substrate. A semiconductor manufacturing apparatus configured to move the second transport block toward the third transport block.

9. In a semiconductor manufacturing apparatus according to any one of claims 1 to 8, A semiconductor manufacturing apparatus in which the length in the transport direction of the substrate is longer than the length in the width direction of the substrate.

10. In a semiconductor manufacturing apparatus according to any one of claims 1 to 8, A semiconductor manufacturing apparatus in which the length in the transport direction of the substrate is shorter than the length in the width direction of the substrate.

11. A step of loading a substrate into a semiconductor manufacturing apparatus according to any one of claims 1, 6 to 8, A step of bonding a die to the substrate being transported by the transport unit, A method for manufacturing a semiconductor device containing [a specific component].

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