Insulation testing device

Abstract

To provide a technique capable of reducing the number of times to replace a jig when a semiconductor device to be inspected is changed.SOLUTION: A semiconductor device includes an insulating substrate, a semiconductor element mounted on the insulating substrate, and a metal terminal electrically connected to the semiconductor element and integrated with a frame. An insulation inspection device includes an insulating transport rail for transporting the frame, and a measuring unit for inspecting the insulation of the semiconductor device based on the electrical characteristics between the frame and the insulating substrate after the frame has been transported.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present disclosure relates to an insulation inspection device.

Background Art

[0002] Regarding insulation inspection devices for inspecting the insulation of semiconductor devices, various techniques have been proposed. For example, Patent Document 1 proposes a technique for detecting the electrical characteristics between a plurality of metal terminals of a semiconductor device and a sealing resin, and inspecting the insulation of the sealing resin based on the electrical characteristics.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When inspecting the insulation of a semiconductor device, the electrical characteristics of the semiconductor device are detected by applying a voltage higher than the breakdown voltage of the semiconductor chip in the semiconductor device to the semiconductor device. In order to prevent the semiconductor chip from malfunctioning due to such a high voltage, the electrical characteristics of the semiconductor device are detected in a state where all the potentials of a plurality of metal terminals are at the same potential.

[0005] However, the number, arrangement, and shape of the metal terminals of a semiconductor device vary depending on the semiconductor device. Therefore, every time the inspected semiconductor device is changed, a jig for making a plurality of metal terminals have the same potential must be replaced, resulting in a problem of poor efficiency of the insulation inspection.

[0006] Therefore, the present disclosure has been made in view of the above problems, and an object thereof is to provide a technique capable of reducing the replacement of jigs when the inspected semiconductor device is changed.

Means for Solving the Problems

[0007] The insulation testing apparatus according to this disclosure is an insulation testing apparatus for testing the insulation properties of a semiconductor device, wherein the semiconductor device comprises an insulating substrate, a semiconductor element mounted on the insulating substrate, and a metal terminal electrically connected to the semiconductor element and integrated with a frame, and the insulation testing apparatus comprises an insulating transport rail for transporting the frame, and a measuring unit that, after transporting the frame, tests the insulation properties of the semiconductor device based on the electrical characteristics between the frame and the insulating substrate. [Effects of the Invention]

[0008] According to this disclosure, the transport rail is insulating, and the insulating properties of the semiconductor device are inspected based on the electrical characteristics between the frame and the insulating substrate. With such a configuration, the replacement of fixtures can be reduced when the semiconductor device being inspected is changed. [Brief explanation of the drawing]

[0009] [Figure 1] This is a top view showing the configuration of a semiconductor device according to Embodiment 1. [Figure 2] This is a cross-sectional view showing the configuration of a semiconductor device according to Embodiment 1. [Figure 3] This is a schematic perspective view showing the configuration of the insulation testing device according to Embodiment 1. [Figure 4] This is a cross-sectional view showing the operation of the insulation testing device according to Embodiment 1. [Figure 5] This is a schematic perspective view showing the configuration of the comparison device. [Figure 6] This is a schematic perspective view showing the configuration of the insulation testing device according to Embodiment 2. [Figure 7] This is a cross-sectional view showing the operation of the insulation testing device according to Embodiment 2. [Figure 8] This is a perspective view showing an example of the configuration of a contact electrode according to Embodiment 2. [Figure 9] This is a perspective view showing an example of the configuration of a contact electrode according to Embodiment 2. [Figure 10] It is a perspective view showing an example of the configuration of the contact electrode according to Embodiment 2. [Figure 11] It is a top view showing the configuration and operation of the insulation inspection device according to Embodiment 3. [Figure 12] There is a timing chart showing the operation of the insulation inspection device according to Embodiment 3. [Figure 13] It is a perspective view schematically showing the configuration of the insulation inspection device according to Embodiment 4. [Figure 14] It is a cross-sectional view showing the operation of the insulation inspection device according to Embodiment 4. [Figure 15] It is a perspective view schematically showing the configuration of the insulation inspection device according to Embodiment 5. [Figure 16] It is a perspective view showing the configuration of the heating unit according to Embodiment 5.

Embodiments for Carrying Out the Invention

[0010] Hereinafter, embodiments will be described with reference to the accompanying drawings. The features described in the following embodiments are examples, and not all features are necessarily essential. Also, in the descriptions shown below, the same or similar reference numerals are assigned to the same components in multiple embodiments, and different components will be mainly described. Further, in the descriptions described below, specific positions and directions such as "upper", "lower", "left" or "right" do not necessarily have to match the actual positions and directions during implementation.

[0011] <Embodiment 1> FIG. 1 is a top view showing the configuration of a semiconductor device whose insulation is inspected by the insulation inspection device according to Embodiment 1 of the present invention, and FIG. 2 is a cross-sectional view showing the configuration.

[0012] As shown in FIGS. 1 and 2, the semiconductor device includes a control terminal 2, a main terminal 3, a sealing resin 4, a semiconductor chip 5 which is a semiconductor element, a heat spreader 6, and an insulating substrate 7. Note that the semiconductor devices shown in FIGS. 1 and 2 are incomplete, and the metal terminals including the control terminal 2 and the main terminal 3 are integrated with a lead frame 1 which is a frame. The semiconductor device is completed through processes such as, for example, separating the control terminal 2 and the main terminal 3 from the lead frame 1, and bending the control terminal 2 and the main terminal 3 from the state shown in FIGS. 1 and 2.

[0013] Next, the components of the semiconductor device will be described. The insulating substrate 7 may be an insulating substrate having ceramic, may be an insulating resin member, or may be a part of the sealing resin 4.

[0014] The semiconductor chip 5 in FIG. 2 is mounted on the insulating substrate 7 via the heat spreader 6. The heat spreader 6 is, for example, a metal member having high heat conductivity. Note that the heat spreader 6 is not essential.

[0015] The control terminal 2 and the main terminal 3 are electrically connected to the semiconductor chip 5, and the semiconductor chip 5 controls the conduction between the main terminals 3 based on the voltage of the control terminal 2. Note that the description that A is electrically connected to B does not mean that each of A and B is conductive, but means that the portion between A and B is conductive.

[0016] The material of the semiconductor chip 5 may be, for example, silicon (Si), or a wide-bandgap semiconductor such as silicon carbide (SiC), gallium nitride (GaN), or diamond. When a wide-bandgap semiconductor is used as the material of the semiconductor chip 5, stable operation of the semiconductor device at high temperatures and high voltages, and faster switching speeds become possible. The semiconductor chip 5 may be, for example, a MOSFET (Metal Oxide Semiconductor Field Effect Transistor), an IGBT (Insulated Gate Bipolar Transistor), an RC-IGBT (Reverse Conducting - IGBT), an SBD (Schottky Barrier Diode), or a PND (PN junction diode).

[0017] The insulating sealing resin 4 seals the control terminal 2, the main terminal 3, the semiconductor chip 5, the heat spreader 6, and the insulating substrate 7, leaving a portion of each of the control terminal 2 and the main terminal 3, and the lower part of the insulating substrate 7 exposed.

[0018] In Figure 1, the control terminal 2 and main terminal 3 are integrated into the lead frame 1 and are short-circuited to each other. In the example in Figure 1, the control terminals 2 and main terminals 3 of multiple semiconductor devices are integrated into one lead frame 1, but the control terminals 2 and main terminals 3 of one semiconductor device may also be integrated into one lead frame 1. Also, in the example in Figure 1, there are four semiconductor devices, but any number of devices is acceptable.

[0019] Figure 3 is a schematic perspective view showing the configuration of the insulation testing device according to Embodiment 1. The insulation testing device in Figure 3 comprises an upper jig 8 consisting of probe pins 9 and a positioning block 10c, a measuring instrument 13 which is a measuring unit, a metal electrode 15, a transport rail 16, and a stopper 17. As will be explained in Embodiment 2 and later, the upper jig 8, probe pins 9, and stopper 17 are not essential.

[0020] The transport rail 16 is a rail for transporting the lead frame 1 as described in Figures 1 and 2, and is insulating. The transport rail 16 has a mounting portion on which the lead frame 1 is placed, and a guide portion that restricts the movement of the lead frame 1 in the short direction. The lead frame 1, placed on the mounting portion and with its movement in the short direction restricted by the guide portion, is transported along the longitudinal direction of the lead frame 1. The drive source for transporting the lead frame 1 may be provided on the transport rail 16, or it may be provided separately from the transport rail 16.

[0021] In the following explanation, among the multiple semiconductor devices integrated into lead frame 1, they may be referred to as the first semiconductor device, the second semiconductor device, and so on, starting from the front in the transport direction (from left to right in the example in Figure 3).

[0022] The stopper 17 rises until the lead frame 1 is transported to a predetermined position, and stops the transport of the lead frame 1 by contacting the side of the lead frame 1 once it has reached the predetermined position. Although not shown, a plurality of stoppers 17 (e.g., first stopper 17, second stopper 17, ...) may be provided along the transport direction of the lead frame 1. For example, when the first stopper 17 contacts the lead frame 1, the first stopper 17 stops the transport of the lead frame 1 so that the first semiconductor device is positioned above the metal electrode 15. Similarly, when the second stopper 17 contacts the lead frame 1, the second stopper 17 stops the transport of the lead frame 1 so that the second semiconductor device is positioned above the metal electrode 15. The third stopper 17 and subsequent stoppers stop the transport of the lead frame 1 in the same manner.

[0023] After the transport of the lead frame 1 is stopped by the stopper 17, the upper jig 8 moves vertically by a drive source such as air or a servo motor (in the example of Figure 3, it moves downward). Then, as shown in Figure 4, the probe pin 9 is electrically connected to the lead frame 1 by making contact with it. The probe pin 9 may also make contact with the control terminal 2 or the main terminal 3, or with a part of the lead frame 1 other than the control terminal 2 and the main terminal 3.

[0024] After the transport of the lead frame 1 is stopped by the stopper 17, the metal electrode 15 is raised by a drive source such as air or a servo motor. Then, as shown in Figure 4, the metal electrode 15 is electrically connected to the insulating substrate 7 by coming into contact with it.

[0025] The measuring instrument 13 in Figure 3 includes a high-voltage power supply 12. The high-voltage power supply 12 is electrically connected to the probe pins 9 by wiring 11 and to the metal electrode 15 by wiring 11.

[0026] When the probe pins 9 are electrically connected to the lead frame 1 and the metal electrodes 15 are electrically connected to the insulating substrate 7, the measuring instrument 13 applies a high voltage from the high-voltage power supply 12 between the lead frame 1 and the insulating substrate 7 via the probe pins 9 and the metal electrodes 15. The measuring instrument 13 then detects the electrical characteristics (e.g., current) between the lead frame 1 and the insulating substrate 7 when the high voltage is applied via the probe pins 9 and the metal electrodes 15, and inspects the insulation of the semiconductor device based on the detected electrical characteristics. For example, the measuring instrument 13 calculates the resistance of the insulating substrate 7 based on the detected electrical characteristics, determines that the insulation of the insulating substrate 7 is normal if the resistance is above a threshold, and determines that the insulation of the insulating substrate 7 is abnormal if the resistance is below the threshold.

[0027] As described above, the stopping of transport by the stopper 17, the connection of the probe pins 9 and metal electrodes 15 to the semiconductor device, and the inspection by the measuring instrument 13 are performed for each of the multiple semiconductor devices integrated into the lead frame 1.

[0028] Figure 5 is a schematic perspective view showing the configuration of a comparison device compared to the insulation inspection device according to this embodiment 1. In Figure 5, the control terminal 2 and main terminal 3 of the semiconductor device are not integrated with the lead frame 1, but are separated from the lead frame 1.

[0029] In the comparison device, the probe pins 10a for the control terminals and the probe pins 10b for the main terminals, fixed by the positioning block 10c of the upper jig 8, are electrically connected to the control terminals 2 and main terminals 3 of the semiconductor device, respectively, and the metal electrode 15 provided on the lower jig 14 is electrically connected to the insulating substrate 7 of the semiconductor device. The measuring instrument 13 then detects the electrical characteristics between the lead frame 1 and the insulating substrate 7 when the high voltage of the high-voltage power supply 12 is applied between each of the control terminals 2 and main terminals 3 and the insulating substrate 7, and inspects the insulating properties of the insulating substrate 7 based on the detected electrical characteristics.

[0030] Here, the number, arrangement, and shape of the control terminals 2 and main terminals 3 of a semiconductor device vary depending on the semiconductor device. Therefore, in the comparison device, the upper jig 8 used to bring the control terminals 2 and main terminals 3 to the same potential had to be replaced each time the semiconductor device being inspected was changed, which resulted in poor insulation testing efficiency.

[0031] In contrast, the insulation inspection apparatus according to this embodiment 1 inspects the insulation properties of a semiconductor device based on the electrical characteristics between the lead frame 1, which integrates the semiconductor device, and the insulating substrate 7. Since the shape of the lead frame 1 can be kept constant even if the number, arrangement, and shape of the semiconductor devices differ, the configuration of this embodiment 1 reduces the need to replace the upper jig 8 when the semiconductor device to be inspected is changed. As a result, a reduction in the manufacturing cost of jigs due to the reduction in the number of jigs, as well as a reduction in the downtime and storage space required for the insulation inspection apparatus due to jig replacement, can be expected.

[0032] Furthermore, a configuration has been proposed (for example, the configuration in Japanese Patent Publication No. 2004-271245) that improves inspection efficiency by making the entire transport rail conductive instead of the lower jig 14. However, when the entire transport rail is conductive, there is a problem of high voltage ground faults. Also, if the semiconductor device has low insulation and fails during inspection, a large current (i.e., a large di / dt) may flow through the conductive transport rail to the surrounding equipment, causing surge voltage leakage. In such cases, there is a possibility that malfunctions may occur in the surrounding equipment. In contrast, in this embodiment 1, since the transport rail 16 is insulating, high voltage ground faults and malfunctions in the surrounding equipment can be suppressed.

[0033] In this embodiment 1, the probe pin 9 moves vertically after the transport of the lead frame 1 stops, and is electrically connected to the lead frame 1. With this configuration, contact can be stabilized regardless of the distortion in the thickness direction of the lead frame 1, so that insulation testing of semiconductor devices can be performed stably.

[0034] <Embodiment 2> Figure 6 is a schematic perspective view showing the configuration of the insulation testing apparatus according to this second embodiment. The configuration in Figure 6 is the same as that in Figure 3, except that contact electrodes 18 are provided instead of the upper jig 8 and probe pins 9.

[0035] As shown in Figure 6, the contact electrode 18 is provided on a portion of the transport rail 16 so as to be electrically connected to the lead frame 1 whose transport has been stopped by the stopper 17. The material of the contact electrode 18 is, for example, metal or carbon and is conductive. Figure 7 is a cross-sectional view showing the contact electrode 18 electrically connected to the lead frame 1 whose transport has been stopped.

[0036] Figures 6 and 7 schematically show the contact electrode 18, but the contact electrode 18 can be a hinge lever as shown in Figure 8, a bearing as shown in Figure 9, or a slip ring as shown in Figure 10. With the contact electrode 18 configured in this way, the frictional force generated when electrically connected to the lead frame 1 can be reduced, thereby mitigating wear on the lead frame 1 and the contact electrode 18. In Figures 6 and 7, the contact electrode 18 is provided on the guide portion of the transport rail 16, but it may also be provided on the mounting portion of the transport rail 16. Although not shown, if the transport rail 16 has an upper surface facing the upper part of the lead frame 1, the contact electrode 18 may be provided on the upper surface of the transport rail 16 so as to be connectable to the upper part of the lead frame 1.

[0037] The high-voltage power supply 12 is electrically connected to the contact electrode 18 by wiring 11 and to the metal electrode 15 by wiring 11. The measuring instrument 13 detects the electrical characteristics between the lead frame 1 and the insulating substrate 7 via the contact electrode 18 and the metal electrode 15, and inspects the insulating properties of the insulating substrate 7 based on the detected electrical characteristics.

[0038] Other components (for example, the metal electrode 15 and the stopper 17) are the same as those described in Embodiment 1.

[0039] In the insulation inspection apparatus according to this embodiment 2 described above, the contact electrode 18 is provided on a part of the transport rail 16 so as to be electrically connected to the lead frame 1 when transport has stopped. With this configuration, the upper jig 8 and probe pins 9 and the drive source for moving them are not required, so the insulation inspection apparatus can be simplified, and as a result, a cost reduction of the insulation inspection apparatus can be expected. In addition, since the contact electrode 18 includes a hinge lever, bearing or slip ring, wear of the lead frame 1 and the contact electrode 18 can be reduced.

[0040] <Embodiment 3> Figure 11 is a top view showing the configuration and operation of the insulation testing device according to this third embodiment. The configuration in Figure 11 is the same as that in Figure 6, except that a switch is provided instead of the stopper 17.

[0041] The switch unit according to this third embodiment has a hinge lever structure and includes a switch lever 22 made of a conductive material, a switch button 23 made of an insulating material, and an insulating housing 27. The switch lever 22 is rotatable in response to an external force, and the switch button 23 is turned on by the pressure of the rotated switch lever 22. The switch button 23 has the function of stopping the transport of the lead frame 1, and when the switch button 23 is switched from off to on, the transport of the lead frame 1 is stopped.

[0042] The switch lever 22 and switch button 23 are provided on a part of the transport rail 16 so that when the lead frame 1 is transported to a predetermined position, the switch button 23 is turned on via the switch lever 22 due to pressure from the lead frame 1. In the example in Figure 11, the switch lever 22 is positioned so that the transported lead frame 1 comes into contact with the pivot axis of the switch lever 22, and then comes into contact with the open portion of the switch lever 22.

[0043] The switch lever 22 is positioned to be electrically connected to the lead frame 1 when the transport of the lead frame 1 is stopped by the switch button 23 being turned on. The measuring instrument 13 detects the electrical characteristics between the lead frame 1 and the insulating substrate 7 via the switch lever 22 and the metal electrode 15, and inspects the insulating properties of the insulating substrate 7 based on the detected electrical characteristics.

[0044] In this third embodiment, the lead frame 1 is provided with a notch 24 for switching the switch button 23 from off to on. The notch 24 is provided for multiple semiconductor devices, excluding the semiconductor device located at the front of the lead frame 1 in the transport direction (the leftmost semiconductor device in the example of Figure 11).

[0045] Other than the above, the configuration is the same as that described in Embodiment 2.

[0046] Figure 12 is a timing chart showing the operation of the insulation testing device according to this third embodiment. Points A to D in Figure 12 correspond to timings A to D in Figure 11.

[0047] At timing A, the switch button 23 is off, and the lead frame 1 is being transported. Also, the measuring instrument 13 has stopped the insulation test.

[0048] At timing B, the switch button 23 switches from off to on, and the transport of the lead frame 1 stops. At the same time, the measuring instrument 13 starts the insulation test. Once the insulation test by the measuring instrument 13 is completed, the transport of the lead frame 1 resumes.

[0049] At timing C, the switch lever 22 engages with the notch 24, releasing the pressure from the lead frame 1 onto the switch lever 22. This switches the switch button 23 from on to off, and the lead frame 1 continues to be transported. The measuring instrument 13 also stops the insulation test.

[0050] At timing D, the same operation as at timing B occurs. That is, the switch button 23 switches from off to on, and the transport of lead frame 1 stops. At the same time, the measuring instrument 13 starts the insulation test. Once the insulation test by the measuring instrument 13 is completed, the transport of lead frame 1 resumes. After that, the operations at timings C and D, that is, the operations that are essentially the same as timings A and B, are repeated until the insulation tests are performed on the remaining semiconductor devices.

[0051] In the insulation testing apparatus according to this embodiment 3 described above, the switch lever 22 and switch button 23 are provided on a part of the transport rail 16 so that when the lead frame 1 is transported to a predetermined position, the switch lever 22 rotates due to pressure from the lead frame 1 and turns on the switch button 23. The switch lever 22 has the same function as the contact electrode 18 described in embodiment 2. With this configuration, a positioning mechanism such as a stopper 17 is unnecessary, so the insulation testing apparatus can be simplified, and as a result, a cost reduction of the insulation testing apparatus can be expected.

[0052] In this embodiment 3, notches 24 are provided on the lead frame 1 to switch the switch button 23 from off to on, corresponding to multiple semiconductor devices excluding the semiconductor device located at the leading edge in the transport direction of the lead frame 1. With this configuration, the effort required to change the control program according to the number and shape of semiconductor devices integrated into the lead frame 1 can be reduced. As a result, an improvement in the efficiency of insulation testing can be expected.

[0053] <Embodiment 4> Figure 13 is a schematic perspective view showing the configuration of the insulation testing device according to this fourth embodiment. The configuration in Figure 13 is the same as that in Figure 6, except that a switch section 25, consisting of a metal electrode 15 and a housing 27, is provided instead of a stopper 17. The switch section 25 also includes a switch button 23, as shown in Figure 14.

[0054] The switch unit 25 in this embodiment 4 is generally the same as the switch unit in embodiment 3 and is a component for stopping the transport of the lead frame 1. The metal electrode 15 of the switch unit 25 is electrically connected to the lead frame 1 when its transport is stopped. When the lead frame 1 is transported to a predetermined position, the switch unit in embodiment 3 is turned on by pressure from the lead frame 1, but the switch unit 25 in this embodiment 4 is turned on by pressure from the insulating substrate 7, as shown in Figure 14. When the switch unit 25 is turned on by pressure from the insulating substrate 7, the metal electrode 15 is electrically connected to the insulating substrate 7.

[0055] The timing chart showing the operation of the insulation testing device according to this embodiment 4 is the same as that in Figure 12, and the operation is essentially the same as timing A and timing B until insulation testing is performed on multiple semiconductor devices.

[0056] In the insulation inspection device according to this embodiment 4 described above, a switch unit 25 is provided that is turned on by pressure from the insulating substrate 7 when the lead frame 1 is transported to a predetermined position. The metal electrode 15 is integrated with the switch unit 25. With this configuration, not only a positioning mechanism such as a stopper 17 but also a drive source for moving the metal electrode 15 is unnecessary, so the insulation inspection device can be simplified, and as a result, a cost reduction of the insulation inspection device can be expected.

[0057] Furthermore, the insulating properties of multiple semiconductor devices can be tested one by one without having to provide a notch 24 in the lead frame 1. Also, when the insulating substrate 7 is part of the sealing resin 4, the shape of the switch portion 25 integrated with the metal electrode 15 can be such that it can make uniform contact with the surface of the sealing resin 4, thereby stabilizing the contact.

[0058] <Embodiment 5> Figure 15 is a schematic perspective view showing the configuration of the insulation testing apparatus according to this fourth embodiment. The configuration of Figure 15 is the same as that of Figure 13, except that heating units 26a and 26b are provided.

[0059] The heating sections 26a and 26b are provided along the transport rail 16. Figure 16 is a schematic perspective view showing the configuration of the heating section 26. The heating section 26b in Figure 15 is provided below the metal electrode 15 and can be fitted into the hole 26c provided in the heating section 26a in Figure 16. Note that the size of the metal electrode 15 in plan view may be the same as the size of the insulating substrate 7 in plan view.

[0060] The heating elements 26a and 26b can be, for example, high-frequency induction or electric heating wires, but any heating mechanism is acceptable. The temperature of the heating elements 26a and 26b corresponds to, for example, the operating temperature of the semiconductor device, and is between 100°C and 300°C.

[0061] As described above, the insulation testing apparatus according to this embodiment 5 allows the semiconductor device to be heated to a high temperature by the heating units 26a and 26b. This allows the heating unit 26a to preheat the semiconductor device before testing, and the heating unit 26b to heat the semiconductor device during testing via the metal electrode 15. With this configuration, the insulation properties of semiconductor devices intended for use at room temperature or in high-temperature environments can be tested.

[0062] Furthermore, it is possible to freely combine each embodiment and each variation, and to modify or omit each embodiment and each variation as appropriate.

[0063] The various aspects of this disclosure are summarized below as an appendix.

[0064] (Note 1) An insulation testing device for testing the insulation properties of semiconductor devices, The aforementioned semiconductor device is Insulating substrate and A semiconductor element mounted on the aforementioned insulating substrate, A metal terminal electrically connected to the aforementioned semiconductor element and integrated into the frame Equipped with, The insulation inspection device, An insulating transport rail for transporting the aforementioned frame, After the frame has been transported, a measuring unit inspects the insulation properties of the semiconductor device based on the electrical characteristics between the frame and the insulating substrate. An insulation testing device equipped with the following features.

[0065] (Note 2) A stopper is provided to stop the transport of the frame when the frame has been transported to a predetermined position. After the transport stops, the probe pins move vertically and are electrically connected to the frame. After the transport stops, the insulating substrate and the metal electrode that is electrically connected to it Furthermore, The aforementioned measuring unit is The insulation testing apparatus according to Appendix 1, which detects the electrical characteristics via the probe pin and the metal electrode.

[0066] (Note 3) A stopper is provided to stop the transport of the frame when the frame has been transported to a predetermined position. A contact electrode, including a hinge lever, bearing, or slip ring, is provided on a portion of the transport rail so as to be electrically connected to the frame when the transport is stopped. After the transport stops, the insulating substrate and the metal electrode that is electrically connected to it Furthermore, The aforementioned measuring unit is An insulation testing apparatus according to Appendix 1, which detects the electrical characteristics via the contact electrode and the metal electrode.

[0067] (Note 4) When the frame is transported to a predetermined position, a switch unit for stopping the transport of the frame is provided on a part of the transport rail so as to be turned on by pressure from the frame, After the transport stops, the insulating substrate and the metal electrode that is electrically connected to it Furthermore, The switch unit includes a switch lever that is electrically connected to the frame when the transport is stopped. The aforementioned measuring unit is The insulation testing apparatus described in Appendix 1, which detects the electrical characteristics via the switch lever and the metal electrode.

[0068] (Note 5) A switch unit for stopping the transport of the frame is activated by pressure from the insulating substrate when the frame is transported to a predetermined position, A contact electrode, including a hinge lever, bearing, or slip ring, is provided on a portion of the transport rail to be electrically connected to the frame when the transport is stopped. Furthermore, The switch section includes a metal electrode that is electrically connected to the frame from which the transport has been stopped. The aforementioned measuring unit is An insulation testing apparatus according to Appendix 1, which detects the electrical characteristics via the contact electrode and the metal electrode.

[0069] (Note 6) An insulation testing apparatus according to any one of the appendices 1 to 5, wherein the metal terminals of a plurality of semiconductor devices are integrated into a single frame.

[0070] (Note 7) The metal terminals of multiple semiconductor devices are integrated into a single frame. The insulation testing apparatus according to Appendix 4, wherein the frame is provided with notches for switching the switch from off to on, corresponding to the plurality of semiconductor devices, excluding the semiconductor device located at the leading edge of the frame in the transport direction.

[0071] (Note 8) An insulation testing apparatus according to any one of the appendices 1 to 7, further comprising a heating section provided along the aforementioned transport rail. [Explanation of symbols]

[0072] 1 Lead frame, 2 Control terminal, 3 Main terminal, 4 Sealing resin, 5 Semiconductor chip, 6 Heat spreader, 7 Insulating substrate, 8 Upper jig, 9 Probe pins, 10a Probe pins for control terminal, 10b Probe pins for main terminal, 10c Positioning block, 11 Wiring, 12 High voltage power supply, 13 Measuring instrument, 14 Lower jig, 15 Metal electrode, 16 Transport rail, 17 Stopper, 18 Contact electrode, 22 Switch lever, 23 Switch button, 24 Notch, 25 Switch section, 26a, 26b Heating section, 26c Hole, 27 Housing.

Claims

1. An insulation testing device for testing the insulation properties of semiconductor devices, The aforementioned semiconductor device is Insulating substrate and A semiconductor element mounted on the aforementioned insulating substrate, A metal terminal electrically connected to the aforementioned semiconductor element and integrated into the frame Equipped with, The insulation inspection device, An insulating transport rail for transporting the aforementioned frame, After the frame has been transported, a measuring unit inspects the insulation properties of the semiconductor device based on the electrical characteristics between the frame and the insulating substrate. An insulation testing device equipped with the following features.

2. An insulation testing apparatus according to claim 1, A stopper is provided to stop the transport of the frame when the frame has been transported to a predetermined position. After the transport stops, the probe pins move vertically and are electrically connected to the frame. After the transport stops, the insulating substrate and the metal electrode that is electrically connected to it Furthermore, The aforementioned measuring unit is An insulation testing device that detects the electrical characteristics via the probe pin and the metal electrode.

3. An insulation testing apparatus according to claim 1, A stopper is provided to stop the transport of the frame when the frame has been transported to a predetermined position. A contact electrode, including a hinge lever, bearing, or slip ring, is provided on a portion of the transport rail so as to be electrically connected to the frame when the transport is stopped. After the transport stops, the insulating substrate and the metal electrode that is electrically connected to it Furthermore, The aforementioned measuring unit is An insulation testing device that detects the electrical characteristics via the contact electrode and the metal electrode.

4. An insulation testing apparatus according to claim 1, When the frame is transported to a predetermined position, a switch unit for stopping the transport of the frame is provided on a part of the transport rail so as to be turned on by pressure from the frame, After the transport stops, the insulating substrate and the metal electrode that is electrically connected to it Furthermore, The switch unit includes a switch lever that is electrically connected to the frame when the transport is stopped. The aforementioned measuring unit is An insulation testing device that detects the electrical characteristics via the switch lever and the metal electrode.

5. An insulation testing apparatus according to claim 1, A switch unit for stopping the transport of the frame is activated by pressure from the insulating substrate when the frame is transported to a predetermined position, A contact electrode, including a hinge lever, bearing, or slip ring, is provided on a portion of the transport rail to be electrically connected to the frame when the transport is stopped. Furthermore, The switch section includes a metal electrode that is electrically connected to the frame from which the transport has been stopped. The aforementioned measuring unit is An insulation testing device that detects the electrical characteristics via the contact electrode and the metal electrode.

6. An insulation testing apparatus according to any one of claims 1 to 5, An insulation testing device in which the metal terminals of multiple semiconductor devices are integrated into a single frame.

7. An insulation testing apparatus according to claim 4, The metal terminals of multiple semiconductor devices are integrated into a single frame. An insulation testing device, wherein the frame is provided with notches for switching the switch from off to on, corresponding to the plurality of semiconductor devices, excluding the semiconductor device located at the leading edge of the frame in the transport direction.

8. An insulation testing apparatus according to any one of claims 1 to 5, An insulation testing device further comprising a heating section provided along the aforementioned transport rail.

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