Cured resin products and electronic component devices

Abstract

To provide a resin cured product which is excellent in reflow resistance.SOLUTION: A resin cured product has storage elastic modulus at 260°C determined by dynamic viscoelasticity measurement of 1,500 MPa or less, wherein tanδ determined by dynamic viscoelasticity measurement has at least two peaks, and a peak temperature of a peak at the highest temperature side among the peaks of the tanδ is within the range of 190°C-300°C.SELECTED DRAWING: None

Claims

1. The storage modulus at 260°C, determined by dynamic viscoelasticity measurement, is 1500 MPa or less. The tanδ obtained by dynamic viscoelasticity measurement has at least two peaks, A resin cured product in which the peak temperature of the hottest peak among the tanδ peaks is in the range of 190°C to 300°C, The resin cured product is a cured product of a thermosetting resin composition comprising a copolymer epoxy resin of methoxynaphthalene and cresol and formaldehyde, a biphenyl-type epoxy resin, an aralkyl-type phenol resin, and at least one of an epoxy-based silane coupling agent and an amine-based silane coupling agent.

2. The resin cured product according to claim 1, wherein the peak temperature of the second peak from the high-temperature side among the tanδ peaks is in the range of 70°C or more and less than 200°C.

3. The resin cured product according to claim 1 or claim 2, wherein the difference between the peak temperature of the hottest peak among the tanδ peaks and the peak temperature of the second hottest peak is between 10°C and 230°C.

4. A resin cured product according to any one of claims 1 to 3, wherein the glass transition temperature Tg (TMA) determined by thermomechanical analysis is higher than the glass transition temperature Tg (DMA) determined by dynamic viscoelasticity measurement.

5. An electronic component device having an element and a resin cured product according to any one of claims 1 to 4 for sealing the element.

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