Resin encapsulation device

JP7877674B2Active Publication Date: 2026-06-23I PEX INC

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
I PEX INC
Filing Date
2021-12-21
Publication Date
2026-06-23

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    Figure 0007877674000001
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    Figure 0007877674000003
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Abstract

To suppress an increase in size of a resin sealing device.SOLUTION: A resin sealing device of the invention includes a first moving body, a second moving body, and a movable pin. The first moving body moves in a first direction that intersects a mold clamping direction, which is a direction in which a mold clamping is performed between the upper mold and the lower mold. The second moving body moves in the second direction, which is the mold clamping direction and approaches one of the upper mold and the lower mold, as the first moving body moves in the first direction. The movable pin is attached to the second moving body and moves in the second direction as the second moving body moves.SELECTED DRAWING: Figure 2
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Claims

1. A first moving body moves in a first direction intersecting the clamping direction, which is the direction in which the upper mold and the lower mold are clamped together, A second moving body moves in a second direction that is in the clamping direction and approaches one of the upper mold and the lower mold as the first moving body moves in the first direction, It comprises a movable pin attached to the second moving body and moving in the second direction as the second moving body moves, The first mobile body is The camshaft has a cam groove formed in which a cavity extends in the first direction and is formed in a direction inclined with respect to the first direction, The second mobile body is A cam follower is inserted into the cam groove and moves within the cam groove as the camshaft moves in the first direction, thereby moving in the second direction. It comprises a first plate member that moves in the second direction in conjunction with the movement of the cam follower, The aforementioned camshaft has, Multiple cam grooves are formed along the extending direction of the camshaft, The cam follower is, Multiple cam grooves are provided corresponding to each of the aforementioned multiple cam grooves, The second mobile body is A plurality of rod members, the base end of which is attached to the first plate member, The system comprises a second plate member attached to the tip of the plurality of rod members, The aforementioned movable pin is Attached to the second plate member A resin encapsulation device characterized by the following features.

2. The cam follower is, It is attached to the first plate member, The aforementioned camshaft is The side of the first plate member to which the cam follower is attached faces the side and moves along the side. The resin encapsulation apparatus according to feature 1.

3. The first mobile body is The camshafts are provided in a pair, The pair of camshafts are They are positioned so that the first plate member is sandwiched between them. The resin encapsulation apparatus according to feature 2.

4. The system comprises multiple of the aforementioned movable pins. A resin encapsulation apparatus according to any one of claims 1 to 3.

5. The aforementioned movable pin is This is an extraction pin that supports the molded product placed in the cavity formed by the upper and lower molds, and is withdrawn from the cavity after resin has flowed into the cavity. A resin encapsulation apparatus according to any one of claims 1 to 4.

6. The aforementioned movable pin is An air vent pin moves in and out of the flow path of an air vent, which has a flow path for releasing air from the cavity formed by the upper mold and the lower mold to the outside, and switches the open and closed state of the air vent. A resin encapsulation apparatus according to any one of claims 1 to 4.

7. The moving mechanism, including the first moving body, the second moving body, and the movable pin, is provided corresponding to the upper mold and the lower mold, respectively. A resin encapsulation apparatus according to any one of claims 1 to 6.