Resin composition, sheet composition, sheet cured product, laminate, laminated component, wafer holder, and semiconductor manufacturing equipment

A resin composition combining polyimide and polyamic acid with a thermosetting resin addresses the heat resistance and thermal expansion issues in wafer holders, providing durable adhesion and flexibility at high temperatures.

JP7877684B2Active Publication Date: 2026-06-23TORAY INDUSTRIES INC
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
TORAY INDUSTRIES INC
Filing Date
2021-12-08
Publication Date
2026-06-23

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Abstract

The purpose of the present invention is to provide a resin composition which enables manufacturing an adhesive sheet for a electrostatic chuck which has excellent heat resistance, low elastic modulus, mitigates the substrate thermal expansion difference with a single layer, and is capable of adhesion and following. The resin composition contains a polymer (A) selected from polyimide and polyamic acid that have a diamine residue of a specific structure (below, the diamine residue (1)) and an acid anhydride residue of a specific structure (below, the acid anhydride residue (2)), and a thermosetting resin (B).
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